A method for preparing a buried copper communication circuit board based on 5G communication

Abstract

The present invention relates to the technical field of circuit board preparation, and in particular to a preparation method of a copper-buried communication circuit board based on 5G communication, comprising: grooving a circuit board, milling a copper block; browning the surface of the copper block, embedding copper, performing secondary browning on the circuit board after the copper block is embedded, and drying; filling a gap between the copper block and the circuit board with a filling glue, baking the circuit board to solidify the glue; removing the glue on the surface of the circuit board by ceramic grinding; and circuit testing, performing quality inspection on the prepared circuit board to obtain an output electrical signal, signal transmission completion and circuit board flatness, and automatically adjusting processing parameters for the circuit board according to the specific situation of the prepared circuit board, thereby improving the preparation efficiency of the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board preparation, and in particular to a method for preparing a buried copper communication circuit board based on 5G communication. Background Art

[0002] With the rapid development of 5G communication technology, the performance requirements for communication circuit boards are getting higher and higher. The application of buried copper technology in circuit boards can effectively improve the heat dissipation performance, signal transmission performance and reliability of circuit boards. However, the current preparation method of buried copper communication circuit boards has problems such as complex process, high cost and unstable quality.

[0003] Chinese Patent Publication No.: CN116847556A discloses a method for making a stepped groove for metallization of the side wall of a 5G communication power amplifier board. The method uses an embedded PTFE film as a resist, and then controls the depth of milling and copper electroplating to complete the production of the metallization groove. It can be seen that the above technical solution has the following problems: it is impossible to automatically adjust the processing parameters for the circuit board according to the specific situation of the prepared circuit board, which affects the preparation efficiency of the circuit board. Summary of the invention

[0004] To this end, the present invention provides a method for preparing a buried copper communication circuit board based on 5G communication, so as to overcome the problem in the prior art that it is impossible to automatically adjust the processing parameters for the circuit board according to the specific conditions of the circuit board to be prepared, thereby affecting the preparation efficiency of the circuit board.

[0005] To achieve the above object, the present invention provides a method for preparing a buried copper communication circuit board based on 5G communication, comprising: S1, circuit board slotting, opening a groove on the circuit board for loading the copper block; S2, milling the copper block, so that the milled copper block and the groove form a mortise and tenon structure for stabilizing the copper block; S3, browning the surface of the copper block, and treating the surface of the copper block after milling to increase the roughness of the surface of the copper block; S4, embedding copper, embedding the copper block after browning treatment into the groove; S5, performing secondary browning treatment on the circuit board after the copper block is embedded, and drying; S6, filling the gap between the copper block and the circuit board with a filling glue, and baking the circuit board to cure the glue; S7, removing glue from the circuit board surface by ceramic grinding; S8, circuit testing, obtaining image information of the side of the circuit board, continuously inputting electrical signals into the circuit board and detecting output electrical signals to obtain average voltage, output electrical signals and temperature of the circuit board, determining the flatness of the circuit board based on the image information, and calculating the signal transmission completion degree based on the input electrical signals and the output electrical signals; S9, determining whether the processing of the circuit board is qualified based on the average voltage of the output electrical signal and the temperature of the circuit board, and when it is determined that the processing of the circuit board is unqualified, adjusting the processing parameters of the circuit board based on the flatness of the circuit board, including adjusting the mesh size of the grinding material used in the ceramic grinding process to a corresponding value based on the flatness of the circuit board, adjusting the filling amount of the filling glue to a corresponding value based on the depth of the groove, and adjusting the size of the copper block to a corresponding value based on the average voltage.

[0006] Further, in S9, determining whether the processing of the circuit board is qualified based on the average voltage of the output electrical signal includes: If the average voltage is greater than the second preset voltage, it is determined that the processing of the circuit board is qualified, and the current processing parameters are continuously used to complete the processing of the circuit board; If the average voltage is less than or equal to the second preset voltage and greater than the first preset voltage, determining whether the treatment of the circuit board is qualified based on the temperature of the circuit board; If the average voltage is less than or equal to the first preset voltage, it is determined that the processing of the circuit board is unqualified, and the processing parameters of the circuit board are adjusted based on the flatness of the circuit board.

[0007] Furthermore, in S9, determining whether the treatment of the circuit board is qualified in combination with the temperature of the circuit board includes: If the temperature is less than or equal to the preset temperature, it is determined that the processing of the circuit board is qualified, and the first preset voltage and the second preset voltage are adjusted to corresponding values ​​based on the signal transmission completion degree; If the temperature is greater than the preset temperature, it is determined that the processing of the circuit board is unqualified, and the processing parameters of the circuit board are adjusted based on the flatness of the circuit board.

[0008] Further, adjusting the first preset voltage and the second preset voltage to corresponding values ​​based on the signal transmission completion degree includes: Determine the signal transmission completion, calculate the ratio of the energy of the output electrical signal to the energy of the input electrical signal, and obtain the transmission completion; The process of obtaining the energy of the output electrical signal is to obtain the time domain curve of the input voltage and calculate the integral of the square of the input voltage within the signal period; The process of obtaining the energy of the output electrical signal is to obtain the time domain curve of the output voltage and calculate the integral of the square of the output voltage within the signal period; The reduction range of the first preset voltage and the second preset voltage determined based on the signal transmission completion degree is proportional to the signal transmission completion degree.

[0009] Furthermore, adjusting processing parameters for the circuit board based on the flatness of the circuit board includes: Determine the flatness of the circuit board and obtain the contour curve of the circuit board in the image information; The contour curve is overlapped and compared with the preset contour curve; Obtain the ratio of the length of the overlapped area to the total length of the preset contour curve to obtain the flatness of the circuit board; If the flatness of the circuit board is less than or equal to the first preset flatness, the mesh size of the grinding material used in the ceramic grinding process is adjusted to a corresponding value based on the flatness of the circuit board; If the flatness of the circuit board is less than or equal to the second preset flatness and greater than the first preset flatness, adjusting the filling amount of the filling glue to a corresponding value based on the depth of the groove; If the flatness of the circuit board is greater than a second preset flatness, the size of the copper block is adjusted to a corresponding value based on the average voltage.

[0010] Further, the mesh size of the grinding material used in the ceramic grinding process is adjusted to a corresponding value based on the flatness of the circuit board, wherein: The increase in the grit of the abrasive material based on the flatness of the board is inversely proportional to the flatness of the board.

[0011] Further, the filling amount of the filling glue is adjusted to a corresponding value based on the depth of the groove, wherein: The amount of fill determined based on depth increases in direct proportion to the depth.

[0012] Furthermore, the filling amount of the adjusted filling glue is compared with the preset maximum filling amount. If the filling amount of the adjusted filling glue is less than or equal to the preset maximum filling amount, the adjusted filling amount is used as the processing parameter for the circuit board; if the filling amount of the adjusted filling glue is greater than the preset maximum filling amount, the preset maximum filling amount is used as the processing parameter for the circuit board, and the size of the copper block is adjusted to the corresponding value based on the average voltage.

[0013] Further, the size of the copper block is adjusted to a corresponding value based on the average voltage, wherein: The reduction in size of the copper block determined based on the average voltage is inversely proportional to the average voltage.

[0014] Compared with the prior art, the beneficial effect of the present invention lies in that the quality of the completed circuit board is inspected, the output electrical signal, signal transmission completion and circuit board flatness are obtained, and the processing parameters for the circuit board are automatically adjusted according to the specific conditions of the completed circuit board, thereby improving the preparation efficiency of the circuit board.

[0015] Furthermore, in order to improve the detection efficiency of the circuit board, whether the processing parameters of the circuit board are qualified is determined only based on the average voltage of the output electrical signal. When the average voltage is less than or equal to the first preset voltage, the processing parameters of the circuit board are adjusted in time to ensure the reliability and stability of the circuit board; when the average voltage is less than or equal to the second preset voltage and greater than the first preset voltage, in order to ensure the accurate determination of the specific situation of the completed circuit board, the specific situation of the circuit board is comprehensively determined in combination with the temperature of the circuit board under the continuous working state, and when it is determined that the temperature is greater than the preset temperature, the processing parameters of the circuit board are adjusted based on the flatness of the circuit board; when the temperature is less than or equal to the preset temperature, it is determined that the processing of the circuit board is qualified, and the signal transmission completion degree is obtained. In order to ensure the detection accuracy of the circuit board, the transmission accuracy of the circuit board is comprehensively determined in combination with the input electrical signal. When the transmission accuracy is high, the judgment standard of the average voltage is adjusted to adaptively determine the judgment standard for the circuit board, thereby improving the detection efficiency of the circuit board and further improving the preparation efficiency of the circuit board.

[0016] Furthermore, the flatness of the circuit board characterizes the flatness of the side image of the circuit board. When the flatness of the circuit board is less than or equal to the first preset flatness, the flatness is low. At this time, due to the abnormal glue removal, there is residual filling glue, which affects the operation of the circuit board. In this case, the mesh size of the grinding material used in the ceramic grinding process is adjusted to improve the flatness of the circuit board; when the flatness of the circuit board is less than or equal to the second preset flatness and greater than the first preset flatness, in this case, due to the abnormal filling glue, the copper block is unstable in fixation. At this time, the filling amount of the filling glue is adjusted to ensure that the copper block is stably fixed; when the flatness of the circuit board is greater than the second preset flatness, the side contour of the circuit board in the image information is smooth, and only a small area of ​​contour abnormality exists. At this time, due to the unqualified copper block size, the size of the copper block is adjusted to improve the bonding strength between the buried copper block and the circuit board substrate; while ensuring the reliability and stability of the circuit board, the preparation efficiency of the circuit board is further improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a flowchart of the steps of a method for preparing a buried copper communication circuit board based on 5G communication according to an embodiment of the present invention; Figure 2 This is a logic decision diagram for determining whether a circuit board is qualified based on the average voltage according to an embodiment of the present invention. DETAILED DESCRIPTION

[0018] In order to make the objects and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0019] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0020] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0021] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] See also Figure 1 as well as Figure 2 As shown, they are respectively a step flow chart of a method for preparing a buried copper communication circuit board based on 5G communication according to an embodiment of the present invention, and a logic determination diagram for determining whether the treatment of the circuit board is qualified based on the average voltage; a method for preparing a buried copper communication circuit board based on 5G communication according to an embodiment of the present invention, comprising: S1, circuit board slotting, opening a groove on the circuit board for loading the copper block; S2, milling the copper block, so that the milled copper block and the groove form a mortise and tenon structure for stabilizing the copper block; S3, browning the surface of the copper block, and treating the surface of the copper block after milling to increase the roughness of the surface of the copper block; S4, embedding copper, embedding the copper block after browning treatment into the groove; S5, performing secondary browning treatment on the circuit board after the copper block is embedded, and drying; S6, filling the gap between the copper block and the circuit board with a filling glue, and baking the circuit board to cure the glue; S7, removing glue from the circuit board surface by ceramic grinding; S8, circuit testing, obtaining image information of the side of the circuit board, continuously inputting electrical signals into the circuit board and detecting output electrical signals to obtain average voltage, output electrical signals and temperature of the circuit board, determining the flatness of the circuit board based on the image information, and calculating the signal transmission completion degree based on the input electrical signals and the output electrical signals; S9, determining whether the processing of the circuit board is qualified based on the average voltage of the output electrical signal and the temperature of the circuit board, and when it is determined that the processing of the circuit board is unqualified, adjusting the processing parameters of the circuit board based on the flatness of the circuit board, including adjusting the mesh size of the grinding material used in the ceramic grinding process to a corresponding value based on the flatness of the circuit board, adjusting the filling amount of the filling glue to a corresponding value based on the depth of the groove, and adjusting the size of the copper block to a corresponding value based on the average voltage.

[0023] Specifically, there is no limitation on the specific shape of the mortise and tenon structure, and it may be a trapezoidal mortise and tenon structure, a convex-concave mortise and tenon structure, or a latch-type mortise and tenon structure, which will not be described in detail.

[0024] Specifically, the quality of the completed circuit boards is inspected to obtain the output electrical signals, signal transmission completion and circuit board flatness. According to the specific conditions of the completed circuit boards, the processing parameters for the circuit boards are automatically adjusted to improve the preparation efficiency of the circuit boards.

[0025] It should be pointed out that the data in this embodiment are obtained by comprehensive analysis and evaluation of the historical detection data and the corresponding historical detection results of the three months before this detection by the method described in the present invention. Before this detection, the method described in the present invention determines the values ​​of various preset parameter standards for this detection based on the 45,523 circuit boards detected cumulatively in the first three months and the image information corresponding to each circuit board, the operating temperature of each circuit board, and the electrical signal transmission data of each circuit board. It can be understood by those skilled in the art that the method described in the present invention can determine the single parameter mentioned above by selecting the value with the highest proportion as the preset standard parameter according to the data distribution, using weighted summation to use the obtained value as the preset standard parameter or other selection methods, as long as the method described in the present invention can clearly define the different specific situations in the single determination process through the obtained values.

[0026] Specifically, in S9, determining whether the processing of the circuit board is qualified based on the average voltage of the output electrical signal includes: If the average voltage is greater than the second preset voltage, it is determined that the processing of the circuit board is qualified, and the current processing parameters are continuously used to complete the processing of the circuit board; If the average voltage is less than or equal to the second preset voltage and greater than the first preset voltage, determining whether the treatment of the circuit board is qualified based on the temperature of the circuit board; If the average voltage is less than or equal to the first preset voltage, it is determined that the processing of the circuit board is unqualified, and the processing parameters of the circuit board are adjusted based on the flatness of the circuit board.

[0027] Specifically, the first preset voltage D1 is 0.8Vin, the second preset voltage D2 is 0.95Vin, and Vin is the input voltage.

[0028] Specifically, in S9, determining whether the treatment of the circuit board is qualified in combination with the temperature of the circuit board includes: If the temperature is less than or equal to the preset temperature, it is determined that the processing of the circuit board is qualified, and the first preset voltage and the second preset voltage are adjusted to corresponding values ​​based on the signal transmission completion degree; If the temperature is greater than the preset temperature, it is determined that the processing of the circuit board is unqualified, and the processing parameters of the circuit board are adjusted based on the flatness of the circuit board.

[0029] Specifically, the first preset voltage is 55°C.

[0030] Specifically, in order to improve the detection efficiency of circuit boards, whether the processing parameters of the circuit board are qualified is determined only based on the average voltage of the output electrical signal. When the average voltage is less than or equal to the first preset voltage, the processing parameters of the circuit board are adjusted in time to ensure the reliability and stability of the circuit board; when the average voltage is less than or equal to the second preset voltage and greater than the first preset voltage, in order to ensure the accurate determination of the specific situation of the completed circuit board, the specific situation of the circuit board is comprehensively determined in combination with the temperature of the circuit board under the continuous working state, and when it is determined that the temperature is greater than the preset temperature, the processing parameters of the circuit board are adjusted based on the flatness of the circuit board; when the temperature is less than or equal to the preset temperature, it is determined that the processing of the circuit board is qualified, and the signal transmission completion degree is obtained. In order to ensure the detection accuracy of the circuit board, the transmission accuracy of the circuit board is comprehensively determined in combination with the input electrical signal. When the transmission accuracy is high, the judgment standard of the average voltage is adjusted to adaptively determine the judgment standard for the circuit board, thereby improving the detection efficiency of the circuit board and further improving the preparation efficiency of the circuit board.

[0031] Specifically, adjusting the first preset voltage and the second preset voltage to corresponding values ​​based on the signal transmission completion degree includes: Determine the signal transmission completion, calculate the ratio of the energy of the output electrical signal to the energy of the input electrical signal, and obtain the transmission completion; The process of obtaining the energy of the output electrical signal is to obtain the time domain curve of the input voltage and calculate the integral of the square of the input voltage within the signal period; The process of obtaining the energy of the output electrical signal is to obtain the time domain curve of the output voltage and calculate the integral of the square of the output voltage within the signal period; The reduction range of the first preset voltage and the second preset voltage determined based on the signal transmission completion degree is proportional to the signal transmission completion degree.

[0032] In this embodiment, optionally, Comparing the transmission completion degree with a first preset transmission completeness and a second preset transmission completeness; If the transmission completion degree is less than or equal to the first preset transmission completeness, the first preset transmission completeness is adjusted to 0.99 times the initial first preset transmission completeness, and the second preset transmission completeness is adjusted to 0.99 times the initial second preset transmission completeness; If the transmission completion degree is less than or equal to the second preset transmission completeness and greater than the first preset transmission completeness, the first preset transmission completeness is adjusted to 0.85 times the initial first preset transmission completeness, and the second preset transmission completeness is adjusted to 0.83 times the initial second preset transmission completeness; If the transmission completion degree is greater than the second preset transmission completeness, the first preset transmission completeness is adjusted to 0.72 times of the initial first preset transmission completeness, and the second preset transmission completeness is adjusted to 0.75 times of the initial second preset transmission completeness.

[0033] The first preset transmission integrity is 0.83, and the second preset transmission integrity is 0.92.

[0034] Specifically, the average voltage is re-determined after the adjustment of the first preset transmission integrity and the second preset transmission integrity is completed. If the average voltage is less than or equal to the second preset voltage, the processing of the circuit board is determined to be unqualified, and the processing parameters of the circuit board are adjusted based on the flatness of the circuit board.

[0035] Specifically, the processing parameters for the circuit board are adjusted based on the flatness of the circuit board, including: Determine the flatness of the circuit board and obtain the contour curve of the circuit board in the image information; The contour curve is overlapped and compared with the preset contour curve; Obtain the ratio of the length of the overlapped area to the total length of the preset contour curve to obtain the flatness of the circuit board; If the flatness of the circuit board is less than or equal to the first preset flatness, the mesh size of the grinding material used in the ceramic grinding process is adjusted to a corresponding value based on the flatness of the circuit board; If the flatness of the circuit board is less than or equal to the second preset flatness and greater than the first preset flatness, adjusting the filling amount of the filling glue to a corresponding value based on the depth of the groove; If the flatness of the circuit board is greater than a second preset flatness, the size of the copper block is adjusted to a corresponding value based on the average voltage.

[0036] Specifically, the first preset flatness z1 is 0.72, and the second preset flatness z2 is 0.93.

[0037] Specifically, the flatness of the circuit board characterizes the flatness of the side image of the circuit board. When the flatness of the circuit board is less than or equal to the first preset flatness, the flatness is low. At this time, due to the abnormal glue removal, there is residual filling glue, which affects the operation of the circuit board. In this case, the mesh size of the grinding material used in the ceramic grinding process is adjusted to improve the flatness of the circuit board; when the flatness of the circuit board is less than or equal to the second preset flatness and greater than the first preset flatness, in this case, due to the abnormal filling glue, the copper block is unstable in fixation. At this time, the filling amount of the filling glue is adjusted to ensure that the copper block is stably fixed; when the flatness of the circuit board is greater than the second preset flatness, the side contour of the circuit board in the image information is smooth, and only a small area of ​​contour abnormality exists. At this time, due to the unqualified copper block size, the size of the copper block is adjusted to improve the bonding strength between the buried copper block and the circuit board substrate; while ensuring the reliability and stability of the circuit board, the preparation efficiency of the circuit board is further improved.

[0038] Specifically, the mesh size of the abrasive material used in the ceramic grinding process is adjusted to a corresponding value based on the flatness of the circuit board, wherein: The increase in the grit of the abrasive material based on the flatness of the board is inversely proportional to the flatness of the board.

[0039] In this embodiment, optionally, Comparing the flatness of the circuit board with a first preset flatness comparison value and a second preset flatness comparison value; If the flatness of the circuit board is less than or equal to the first preset flatness comparison value, the mesh size of the grinding material is adjusted to 1.29 times the initial mesh size; If the flatness of the circuit board is less than or equal to the second preset flatness comparison value and greater than the first preset flatness comparison value, the mesh size of the grinding material is adjusted to 1.22 times the initial mesh size; If the flatness of the circuit board is greater than the second preset flatness comparison value, the mesh size of the grinding material is adjusted to 1.12 times the initial mesh size; The first preset flatness comparison value is 0.64z1, and the second preset flatness comparison value is 0.82z1.

[0040] Specifically, the filling amount of the filling glue is adjusted to a corresponding value based on the depth of the groove, wherein: The amount of fill determined based on depth increases in direct proportion to the depth.

[0041] In this embodiment, optionally, comparing the depth to a first preset depth and a second preset depth; If the depth is less than or equal to the first preset depth, the filling amount of the filling glue is adjusted to 1.11 times the initial filling amount; If the depth is less than or equal to the second preset depth and greater than the first preset depth, the filling amount of the filling glue is adjusted to 1.18 times the initial filling amount; If the depth is greater than the second preset depth, the filling amount of the filling glue is adjusted to 1.24 times the initial filling amount; The first preset depth is 1 mm, and the second preset depth is 1.5 mm.

[0042] Specifically, the filling amount of the adjusted filling glue is compared with the preset maximum filling amount. If the filling amount of the adjusted filling glue is less than or equal to the preset maximum filling amount, the adjusted filling amount is used as the processing parameter for the circuit board; if the filling amount of the adjusted filling glue is greater than the preset maximum filling amount, the preset maximum filling amount is used as the processing parameter for the circuit board, and the size of the copper block is adjusted to the corresponding value based on the average voltage.

[0043] Specifically, the preset maximum filling volume is 9.5 mm3.

[0044] Specifically, the size of the copper block is adjusted to a corresponding value based on the average voltage, wherein: The reduction in size of the copper block determined based on the average voltage is inversely proportional to the average voltage.

[0045] In this embodiment, optionally, Comparing the average voltage with a first preset voltage comparison value and a second preset voltage comparison value; If the average voltage is less than or equal to the first preset voltage comparison value, the copper block is proportionally reduced to 0.77 times of the initial copper block by milling; If the average voltage is less than or equal to the second preset voltage comparison value and greater than the first preset voltage comparison value, the copper block is proportionally reduced to 0.81 times of the initial copper block by milling; If the average voltage is greater than the second preset voltage comparison value, the copper block is reduced proportionally to 0.97 times of the initial copper block by milling; The first preset voltage comparison value is 0.3D1, and the second preset voltage comparison value is 0.5D1.

[0046] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

[0047] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for preparing a buried copper communication circuit board based on 5G communication, characterized in that: include: S1, circuit board slotting, opening a groove on the circuit board for loading the copper block; S2, milling the copper block, so that the milled copper block and the groove form a mortise and tenon structure for stabilizing the copper block; S3, browning the surface of the copper block, and treating the surface of the copper block after milling to increase the roughness of the surface of the copper block; S4, embedding copper, embedding the copper block after browning treatment into the groove; S5, performing secondary browning treatment on the circuit board after the copper block is embedded, and drying; S6, filling the gap between the copper block and the circuit board with a filling glue, and baking the circuit board to cure the glue; S7, removing glue from the circuit board surface by ceramic grinding; S8, circuit testing, obtaining image information of the side of the circuit board, continuously inputting electrical signals into the circuit board and detecting output electrical signals to obtain average voltage, output electrical signals and temperature of the circuit board, determining the flatness of the circuit board based on the image information, and calculating the signal transmission completion degree based on the input electrical signals and the output electrical signals; S9, determining whether the processing of the circuit board is qualified based on the average voltage of the output electrical signal and the temperature of the circuit board, and when it is determined that the processing of the circuit board is unqualified, adjusting the processing parameters of the circuit board based on the flatness of the circuit board, including adjusting the mesh size of the grinding material used in the ceramic grinding process to a corresponding value based on the flatness of the circuit board, adjusting the filling amount of the filling glue to a corresponding value based on the depth of the groove, and adjusting the size of the copper block to a corresponding value based on the average voltage.

2. The method for preparing a buried copper communication circuit board based on 5G communication according to claim 1, characterized in that: In S9, determining whether the processing of the circuit board is qualified based on the average voltage of the output electrical signal includes: If the average voltage is greater than the second preset voltage, it is determined that the processing of the circuit board is qualified, and the current processing parameters are continuously used to complete the processing of the circuit board; If the average voltage is less than or equal to the second preset voltage and greater than the first preset voltage, determining whether the treatment of the circuit board is qualified based on the temperature of the circuit board; If the average voltage is less than or equal to the first preset voltage, it is determined that the processing of the circuit board is unqualified, and the processing parameters of the circuit board are adjusted based on the flatness of the circuit board.

3. The method for preparing a buried copper communication circuit board based on 5G communication according to claim 2, characterized in that: In S9, determining whether the treatment of the circuit board is qualified in combination with the temperature of the circuit board includes: If the temperature is less than or equal to the preset temperature, it is determined that the processing of the circuit board is qualified, and the first preset voltage and the second preset voltage are adjusted to corresponding values ​​based on the signal transmission completion degree; If the temperature is greater than the preset temperature, it is determined that the processing of the circuit board is unqualified, and the processing parameters of the circuit board are adjusted based on the flatness of the circuit board.

4. The method for preparing a buried copper communication circuit board based on 5G communication according to claim 3, characterized in that: Adjusting the first preset voltage and the second preset voltage to corresponding values ​​based on the signal transmission completion degree includes: Determine the signal transmission completion, calculate the ratio of the energy of the output electrical signal to the energy of the input electrical signal, and obtain the transmission completion; The process of obtaining the energy of the output electrical signal is to obtain the time domain curve of the input voltage and calculate the integral of the square of the input voltage within the signal period; The process of obtaining the energy of the output electrical signal is to obtain the time domain curve of the output voltage and calculate the integral of the square of the output voltage within the signal period; The reduction range of the first preset voltage and the second preset voltage determined based on the signal transmission completion degree is proportional to the signal transmission completion degree.

5. The method for preparing a buried copper communication circuit board based on 5G communication according to claim 4, characterized in that: Adjust processing parameters for the board based on board flatness, including: Determine the flatness of the circuit board and obtain the contour curve of the circuit board in the image information; The contour curve is overlapped and compared with the preset contour curve; Obtain the ratio of the length of the overlapped area to the total length of the preset contour curve to obtain the flatness of the circuit board; If the flatness of the circuit board is less than or equal to the first preset flatness, the mesh size of the grinding material used in the ceramic grinding process is adjusted to a corresponding value based on the flatness of the circuit board; If the flatness of the circuit board is less than or equal to the second preset flatness and greater than the first preset flatness, adjusting the filling amount of the filling glue to a corresponding value based on the depth of the groove; If the flatness of the circuit board is greater than a second preset flatness, the size of the copper block is adjusted to a corresponding value based on the average voltage.

6. The method for preparing a buried copper communication circuit board based on 5G communication according to claim 5, characterized in that: The mesh size of the abrasive material used in the ceramic grinding process is adjusted to the corresponding value based on the flatness of the circuit board, where: The increase in the grit of the abrasive material based on the flatness of the board is inversely proportional to the flatness of the board.

7. The method for preparing a buried copper communication circuit board based on 5G communication according to claim 6, characterized in that: The filling amount of the filling glue is adjusted to a corresponding value based on the depth of the groove, wherein: The amount of fill determined based on depth increases in direct proportion to the depth.

8. The method for preparing a buried copper communication circuit board based on 5G communication according to claim 7, characterized in that: Comparing the adjusted filling amount of the filling glue with the preset maximum filling amount, if the adjusted filling amount of the filling glue is less than or equal to the preset maximum filling amount, using the adjusted filling amount as a processing parameter for the circuit board; If the adjusted filling amount of the filling glue is greater than the preset maximum filling amount, the preset maximum filling amount is used as a processing parameter for the circuit board, and the size of the copper block is adjusted to a corresponding value based on the average voltage.

9. The method for preparing a buried copper communication circuit board based on 5G communication according to claim 8, characterized in that: The size of the copper block is adjusted to a corresponding value based on the average voltage, wherein: The reduction in size of the copper block determined based on the average voltage is inversely proportional to the average voltage.

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