Gold finger manufacturing method of circuit board and circuit board

Abstract

The present application relates to the technical field of circuit board manufacturing, and discloses a method for manufacturing gold fingers of a circuit board and a circuit board. The method for manufacturing gold fingers of a circuit board includes: providing a substrate, the substrate includes a base material and a circuit layer arranged on the base material, the circuit layer includes a first conductive part and a second conductive part arranged and adjacent along a first direction, and the end of the first conductive part facing the first direction is a grinding end; removing the second conductive part; grinding the side of the grinding end away from the base material so that the grinding end forms a slope; removing part of the first conductive part so that the remaining first conductive part forms a plurality of gold fingers, and the slope is formed at the end of the gold finger facing the first direction. The method for manufacturing gold fingers of a circuit board and the circuit board provided in the present application can ensure the consistency of the slopes at the front ends of all gold fingers, and can make the length of the slope meet the use requirements.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board manufacturing, and in particular to a method for manufacturing gold fingers of a circuit board and a circuit board. Background Art

[0002] In order to achieve the connection with the external connector, a plug needs to be set on the edge of the circuit board to be inserted into the card slot of the connector. Because the row of plugs on the edge of the circuit board are finger-shaped and gold-plated, they are called gold fingers. Generally, the sum of the thickness of the copper and the electroplated nickel-gold of the gold finger is greater than 40μm, and the maximum can be greater than 70μm. There is a step between the gold finger and the substrate, which will affect the insertion and removal of the reed in the connector.

[0003] In the related art, one method is to design the gold finger lead at the front end and adopt the beveled lead method, but this method will cause copper exposure after the beveled front end lead, and the reliability is not high; the other method is to reduce the copper layer used to make the front end of the gold finger through a primary circuit etching to form a slope, and then use a secondary circuit etching to make the unit graphics of the circuit board. This solution has a positioning tolerance between the copper reduction position and the secondary circuit etching. After the secondary circuit etching, the slope of the front end of the gold finger will be inconsistent, and when the tail end of the slope is too long, there will be a risk of warping, and when the tail end of the slope is too short, it cannot meet the plugging and unplugging requirements of the gold finger. Summary of the invention

[0004] The present application provides a method for manufacturing gold fingers of a circuit board and a circuit board, which can ensure the consistency of the slopes at the front ends of all gold fingers and make the length of the slope meet the use requirements.

[0005] In a first aspect, an embodiment of the present application provides a method for manufacturing a gold finger of a circuit board, comprising:

[0006] Providing a substrate, the substrate comprising a base material and a circuit layer disposed on the base material, the circuit layer comprising a first conductive portion and a second conductive portion arranged and adjacent to each other along a first direction, and one end of the first conductive portion facing the first direction is a grinding end;

[0007] removing the second conductive portion;

[0008] Grinding the side of the grinding end facing away from the substrate so that the grinding end forms a slope;

[0009] Part of the first conductive part is removed so that the remaining first conductive part forms a plurality of gold fingers, and the slope is formed at one end of the gold fingers facing the first direction.

[0010] In some embodiments, removing the second conductive portion includes:

[0011] A first film is attached to a side of the circuit layer facing away from the substrate, wherein the first film is provided with a first window, and the first window exposes the second conductive portion;

[0012] The second conductive portion is removed by etching.

[0013] In some embodiments, the first conductive part includes a plurality of first parts and a plurality of second parts, and the plurality of first parts and the plurality of second parts are staggered along a second direction, and the second direction is perpendicular to the first direction; the removal of part of the first conductive part so that the remaining first conductive part forms a plurality of gold fingers, and the slope is formed at one end of the gold finger close to the first conductive part, including: removing the first part between any two adjacent second parts so that one second part forms one gold finger.

[0014] In some embodiments, removing the first portion between any two adjacent second portions so that one second portion forms one gold finger includes:

[0015] A second film is attached to a side of the circuit layer facing away from the substrate, wherein the second film is provided with a plurality of second openings, and one of the second openings exposes one of the first portions between two adjacent second portions;

[0016] The first portion between any two adjacent second portions is removed by etching.

[0017] In some embodiments, the thickness of the circuit layer is T, the inclination angle of the slope is θ, the dimension of the grinding end along the first direction is H, and H=T / tanθ.

[0018] In some embodiments, grinding the side of the grinding end facing away from the substrate so that the grinding end forms a slope comprises:

[0019] Providing abrasive parts;

[0020] The substrate is brought close to the grinding piece along the first direction, and the grinding piece is used to grind the side of the grinding end facing away from the substrate, so that the grinding end forms the slope.

[0021] In some embodiments, the circuit layer also includes a third conductive part; when removing the second conductive part, a portion of the third conductive part is removed to form an alignment point; after grinding the side of the grinding end away from the substrate, a portion of the first conductive part is removed based on the alignment point.

[0022] In some embodiments, when a portion of the first conductive portion is removed based on the alignment point, a portion of the third conductive portion is removed based on the alignment point, and the remaining third conductive portion forms a conductive circuit.

[0023] In some embodiments, providing a substrate includes:

[0024] A panel is provided, wherein the panel comprises a plurality of substrates, the plurality of substrates are arranged at intervals, and any two of the substrates are oriented in the same direction.

[0025] In a second aspect, an embodiment of the present application provides a circuit board, which is processed by the gold finger manufacturing method of the circuit board as described in the first aspect.

[0026] The method for manufacturing gold fingers of a circuit board provided in an embodiment of the present application has the beneficial effect that: since the substrate includes a base material and a circuit layer arranged on the base material, the circuit layer includes a first conductive part and a second conductive part arranged and adjacent to each other along a first direction, the end of the first conductive part facing the first direction is a grinding end, and the second conductive part is first removed, and then the side of the grinding end away from the base material is ground so that the grinding end forms a slope, and finally part of the first conductive part is removed so that the remaining first conductive part forms a plurality of gold fingers, so that the consistency of the slopes at the front ends of all the gold fingers can be ensured, and the length of the slope can meet the use requirements.

[0027] The beneficial effects of the circuit board provided in the present application compared with the prior art can be referred to the description of the beneficial effects of the gold finger manufacturing method of the circuit board provided in the present application compared with the prior art, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0029] Figure 1 It is a structural schematic diagram of a circuit board in the prior art;

[0030] Figure 2 Yes Figure 1 The schematic diagram of copper reduction in the circuit board shown;

[0031] Figure 3 Yes Figure 2 The schematic diagram of the slope tail of the gold finger of the circuit board shown in the figure is too long after the secondary circuit etching;

[0032] Figure 43 is a schematic diagram showing that the tail end of the slope of the gold finger shown in FIG. 3 is warped;

[0033] Figure 5 Yes Figure 2 The schematic diagram of the circuit board shown in the figure shows that the slope tail of the gold finger is too short after the circuit is etched twice;

[0034] Figure 6 Yes Figure 1 The top view of the circuit board shown is subjected to copper reduction;

[0035] Figure 7 Yes Figure 6 The schematic diagram of the circuit board shown is after secondary circuit etching;

[0036] Figure 8 This is a flow chart of a method for making a gold finger of a circuit board in one of the embodiments of the present application;

[0037] Fig. 9 This is a schematic diagram of the structure of a substrate in one of the embodiments of the present application;

[0038] Fig.10 Yes Figure 7 A schematic diagram of a second conductive portion of the substrate shown;

[0039] Fig.11 yes Fig.10 A schematic diagram of the structure of a panel composed of substrates shown;

[0040] Fig.12 yes Fig.10 A partial top view of the substrate shown;

[0041] Fig.13 Yes Fig.10 A schematic diagram showing a first conductive portion in a substrate being ground with the grinding end facing away from the substrate;

[0042] Fig.14 It is to remove part Fig.13 A schematic diagram of the first conductive portion shown;

[0043] Fig.15 It is to remove part Fig.13 A schematic diagram of the first conductive portion shown;

[0044] Fig.16 yes Fig.15 Schematic diagram of the structure of the panel composed of the substrate shown.

[0045] The meanings of the marks in the figure are:

[0046] 1. Dielectric layer; 2. Copper layer; 3. Window; 4. Gold finger; 5. Lead wire residual gold;

[0047] 100. Substrate;

[0048] 10. Base material;

[0049] 20, circuit layer; 21, first conductive part; 210, polishing end; 211, first part; 212, second part; 22, second conductive part; 23, third conductive part;

[0050] 30. Second membrane;

[0051] 40. Grinding parts;

[0052] 200. Counterpoint. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0054] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0055] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0056] References to "one embodiment", "some embodiments" or "an embodiment" described in the specification of this application mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some other embodiments", "in some other embodiments", etc., which appear at different places in this specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. In addition, in one or more embodiments, particular features, structures or characteristics may be combined in any suitable manner.

[0057] In order to illustrate the technical solution of the present application, a description is given below with reference to specific drawings and embodiments.

[0058] Please refer to Figures 1 to 5In the related art, the circuit board includes a dielectric layer 1 and a copper layer 2. During production, the copper layer 2 used to make the front end of the gold finger 4 is generally reduced in copper through a primary circuit etching to form a slope, and then the unit graphics of the circuit board are produced through film stripping and secondary circuit etching. This solution has a positioning tolerance between the copper reduction position and the secondary circuit etching. After the secondary circuit etching, the slope of the front end of the gold finger 4 will be inconsistent. When the slope and the tail end of the slope are too long, there will be a risk of warping. When the tail end of the slope is too short, it cannot meet the plugging and unplugging requirements of the gold finger 4. The performance of the gold finger 4 with the two slopes is inconsistent, which may cause deviations in plugging and unplugging, affecting the effect after plugging and unplugging. When the tail end of the slope is long, there may be a risk of short circuit in the circuit board due to warping of the thin bottom copper after plugging and unplugging.

[0059] Please refer to Figure 6 and Figure 7 In addition, when the copper is reduced by etching the first circuit, a plurality of windows 3 are formed on the copper layer 2, and there is copper between the windows 3. Due to the alignment tolerance between the second circuit etching and the first circuit etching ( Figure 7 The dotted box indicates an ideal situation where there is no alignment deviation between the secondary circuit etching and the primary circuit etching). During the secondary circuit etching, the dry film may cover the copper between the windows 3 formed by the primary circuit etching. After subsequent development, etching, and film stripping, residual lead gold 5 may be generated at the front end of the gold finger 4, affecting the normal use of the gold finger 4.

[0060] In view of this, the present application provides a method for manufacturing gold fingers of a circuit board and a circuit board. Since the substrate includes a base material and a circuit layer arranged on the base material, the circuit layer includes a first conductive part and a second conductive part arranged and adjacent to each other in a first direction, and the end of the first conductive part facing the first direction is a grinding end, and the second conductive part is first removed, and then the side of the grinding end away from the base material is ground so that the grinding end forms a slope, and finally part of the first conductive part is removed so that the remaining first conductive part forms a plurality of gold fingers, so that the consistency of the slopes at the front ends of all the gold fingers can be ensured, and the length of the slope can meet the use requirements.

[0061] At the same time, the method for manufacturing the gold finger of the circuit board and the circuit board provided in the embodiment of the present application will not produce lead gold residue at the front end of the gold finger, thereby ensuring the normal use of the gold finger.

[0062] Please refer to Figures 8 to 16 In a first aspect, an embodiment of the present application provides a method for manufacturing a gold finger of a circuit board, comprising:

[0063] S100: Provide a substrate 100, the substrate 100 includes a base material 10 and a circuit layer 20 disposed on the base material 10, the circuit layer 20 includes a first conductive portion 21 and a second conductive portion 22 arranged along a first direction and adjacent to each other, and an end of the first conductive portion 21 facing the first direction is a grinding end 210.

[0064] Specifically, the substrate 100 may have gone through processes such as cutting, inner layer circuits, AOI (Automated Optical Inspection), lamination, drilling, milling, drilling and filling. The circuit layer 20 may be a copper layer or a silver layer, etc., and the first direction may be Fig. 9 In this embodiment, the circuit layer 20 is a copper layer.

[0065] S200 : removing the second conductive portion 22 .

[0066] Specifically, the second conductive part 22 can be removed by etching or laser burning. After the second conductive part 22 is removed, a window is formed on the circuit layer 20 to expose the substrate 10. At this time, the side of the gold finger and the pattern circuit in the unit are not made, which avoids the offset of the secondary circuit etching, the residual gold of the gold finger lead wire, and the influence of the signal transmission quality.

[0067] S300 : grinding the side of the grinding end 210 facing away from the substrate 10 , so that the grinding end 210 forms a slope.

[0068] Specifically, the side of the grinding end 210 facing away from the substrate 10 may be ground by ceramics, a grinding wheel, a grinding belt, or the like.

[0069] S400: removing a portion of the first conductive portion 21 so that the remaining first conductive portion 21 forms a plurality of gold fingers, and a slope is formed at one end of the gold finger facing the first direction.

[0070] Specifically, part of the first conductive part 21 can be removed by etching or laser burning, and the remaining first conductive part 21 forms a plurality of gold fingers, the plurality of gold fingers are arranged at intervals, and each of the gold fingers is provided with a slope.

[0071] It can be understood that the slope of each gold finger is formed by grinding in the previous process, so its consistency is better and the length of the slope meets the use requirements.

[0072] From the above, it can be seen that the method for making gold fingers of a circuit board provided in an embodiment of the present application is that since the substrate 100 includes a base material 10 and a circuit layer 20 arranged on the base material 10, the circuit layer 20 includes a first conductive portion 21 and a second conductive portion 22 arranged and adjacent to each other along a first direction, and the end of the first conductive portion 21 facing the first direction is a grinding end 210, and the second conductive portion 22 is first removed, and then the side of the grinding end 210 away from the base material 10 is ground so that the grinding end 210 forms a slope, and finally a part of the first conductive portion 21 is removed so that the remaining first conductive portion 21 forms a plurality of gold fingers, so that the consistency of the slope at the front end of all the gold fingers can be ensured, the length of the slope can meet the use requirements, and the problem of warping at the tail end of the slope is avoided.

[0073] The method for manufacturing the gold finger of the circuit board provided in the embodiment of the present application realizes the manufacturing of the gold finger with a slope through data design and process design, which can solve the problem that the step between the gold finger and the substrate 10 in the gold finger manufacturing scheme affects the abnormal plugging and unplugging of the connector spring.

[0074] In this embodiment, the second conductive portion 22 is removed, including:

[0075] First, a first film is attached to a side of the circuit layer 20 facing away from the substrate 10 . The first film is provided with a first window, and the first window exposes the second conductive portion 22 .

[0076] Specifically, the first film can be a dry film or a wet film, etc. A photosensitive dry film is covered on the side of the circuit layer 20 away from the substrate 10, and the circuit data is used for alignment exposure, and then the unexposed photosensitive dry film is developed to form a circuit pattern to obtain the first window.

[0077] Next, the second conductive portion 22 is removed by etching.

[0078] Specifically, the first window is opened to expose the second conductive portion 22 , and etching is performed using an acid solution to remove the second conductive portion 22 .

[0079] By adopting the above solution, the second conductive portion 22 can be removed more conveniently by one-time circuit etching, and damage to the first conductive portion 21 can be avoided.

[0080] Among them, the first conductive part 21 includes multiple first parts 211 and multiple second parts 212, and the multiple first parts 211 and the multiple second parts 212 are staggered along the second direction, and the second direction is perpendicular to the first direction; part of the first conductive part 21 is removed so that the remaining first conductive part 21 forms multiple gold fingers, and the slope is formed at one end of the gold finger close to the first conductive part 21, including: removing the first part 211 between any two adjacent second parts 212, so that one second part 212 forms a gold finger.

[0081] By adopting the above solution, the remaining second portion 212 can be conveniently formed into a plurality of gold fingers.

[0082] Please refer to Fig.14 and Fig.15 Optionally, the first portion 211 between any two adjacent second portions 212 is removed so that one second portion 212 forms a golden finger, including:

[0083] First, the second film 30 is attached to the side of the circuit layer 20 facing away from the substrate 10 . The second film 30 is provided with a plurality of second openings. One second opening exposes a first portion 211 between two adjacent second portions 212 .

[0084] Specifically, the second film 30 may be a dry film, etc. Next, the first portion 211 between any two adjacent second portions 212 is removed by etching.

[0085] With such a configuration, the first portion 211 can be removed more conveniently without damaging the second portion 212 .

[0086] It should be noted that the second film 30 covers the slope to protect the slope.

[0087] Please refer to Fig.13 Optionally, the thickness of the circuit layer 20 is T, the inclination angle of the slope is θ, the size of the grinding end 210 along the first direction is H, and H=T / tanθ.

[0088] By configuring in this way, the size of the second portion 212 along the first direction can be compensated in advance to ensure that the size of the portion of the gold finger except the slope along the first direction meets the requirement, and H is the grinding compensation amount.

[0089] θ is the angle between the top surface of the grinding end and the bottom surface of the end of the slope along the first direction. For example, T is 40 um, the inclination angle θ is designed to be 15°, and the grinding compensation amount H1 = 149.25 um.

[0090] Optionally, grinding the side of the grinding end 210 facing away from the substrate 10 so that the grinding end 210 forms a slope, including:

[0091] First, the grinding member 40 is provided.

[0092] Specifically, the grinding member 40 may be ceramic, a grinding wheel or a grinding belt. The grinding member 40 is rotatable.

[0093] For example, the parameters of (800-1200)#+(1500-2000)#ceramic (sand belt) and speed (2-2.5) m / min can be used for grinding. Among them, # is the mesh number, that is, the number of mesh holes per square centimeter, which is used to indicate the fineness of the abrasive. For example, 800 mesh means there are 800 holes per square centimeter. The larger the mesh number, the finer the abrasive, and the cutting ability decreases, but the copper surface after treatment will be smoother.

[0094] During grinding, the grinding end 210 faces the grinding piece 40 toward the forward plate, ensuring that the grinding end 210 and the grinding brush of the grinding piece 40 are subjected to force throughout the process. A regular slope can be obtained through the external force of the grinding brush, and the first piece can be confirmed by slicing. The slope angle θ and the grinding depth after grinding can be adjusted within the specification range until the required inclination angle θ is met, and the required depth = grinding compensation amount H. Since only the second conductive part 22 is removed during the first circuit etching, and the rest of the positions are large copper surfaces, the impact of the grinding process on the pads and circuits can be avoided.

[0095] Next, the substrate 100 is brought close to the grinding piece 40 along the first direction, and the grinding piece 40 is used to grind the side of the grinding end 210 facing away from the substrate 10 , so that the grinding end 210 forms a slope.

[0096] By adopting the above solution, the side of the grinding end 210 facing away from the substrate 10 can be grinded more conveniently, so that the grinding end 210 forms a slope.

[0097] It should be noted that if the substrate 100 is brought close to the grinding piece 40 in a direction opposite to the first direction, the grinding brush of the grinding piece 40 will first act on the copper surface. When it moves from the copper surface to the interface with the substrate 10, only the corners of the copper surface are subjected to force, and the corners are rounded after grinding, which cannot meet the requirement of a slope at the front end, that is, the grinding end 210 cannot form a slope.

[0098] Please refer to Figures 8 to 16 In this embodiment, the circuit layer 20 also includes a third conductive portion 23; when the second conductive portion 22 is removed, part of the third conductive portion 23 is removed to form an alignment point 200; after grinding the side of the grinding end 210 away from the substrate 10, part of the first conductive portion 21 is removed based on the alignment point 200, so that the remaining first conductive portion 21 forms a plurality of gold fingers, and a slope is formed at one end of the gold finger facing the first direction.

[0099] By adopting the above solution, the alignment accuracy of the gold finger can be made higher.

[0100] For example, the alignment points 200 may be disposed at four corners of the board edge of the substrate 100 .

[0101] Optionally, when a portion of the first conductive portion 21 is removed based on the alignment point 200 , a portion of the third conductive portion 23 is removed based on the alignment point 200 to form a conductive circuit.

[0102] Such an arrangement can achieve a higher alignment accuracy between the conductive circuit and the gold finger.

[0103] It is understandable that when the second film 30 is attached to the side of the circuit layer 20 facing away from the substrate 10 , the second film 30 is provided with a third opening, and the third opening exposes a portion of the third conductive portion 23 , so that a conductive circuit can be manufactured more conveniently.

[0104] It should be noted that when the third conductive part 23 exposed by the third window is etched away and the remaining third conductive part 23 forms a conductive circuit, an inner pull-out lead for a gold-plated finger can be manufactured at the same time, and the inner pull-out lead is removed in the third circuit etching.

[0105] Optionally, after the third conductive part 23 is partially removed based on the alignment point 200 and the conductive circuit is formed, the gold-plated finger (anti-plating wet film, electroplated gold finger, anti-plating wet film removal, three-way circuit, three-way etching and lead removal), solder mask, character, other surface treatment, molding, electrical testing, FQC (Final Quality Control), FQA (Factory Quality Assurance) and packaging processes can be continued. The electroplated gold finger can be made by pulling the lead inside the board, and the window formed on the circuit layer 20 after removing the second conductive part 22 will not affect the electroplated gold finger. When the gold finger is gold-plated, the main part and slope of the gold finger will be covered with a gold layer.

[0106] Please continue to refer to Figures 8 to 16 In this embodiment, a substrate 100 is provided, including:

[0107] A panel is provided, which includes a plurality of substrates 100 , wherein the plurality of substrates 100 are arranged at intervals, and any two substrates 100 are oriented in the same direction.

[0108] By adopting the above solution, the grinding ends 210 on multiple substrates 100 can be ground along one direction, the operation is simple and convenient, and the consistency of the slopes of the front ends of all the gold fingers can be ensured.

[0109] It should be noted that the multiple substrates 100 can be assembled in a straight-up manner with the same orientation.

[0110] In a second aspect, an embodiment of the present application provides a circuit board, which is processed by the gold finger manufacturing method of the circuit board of the first aspect.

[0111] The circuit board provided in the embodiment of the present application has a substrate 100 including a base material 10 and a circuit layer 20 arranged on the base material 10, and the circuit layer 20 includes a first conductive portion 21 and a second conductive portion 22 arranged along a first direction and adjacent to each other, and one end of the first conductive portion 21 facing the first direction is a grinding end 210, and the second conductive portion 22 is first removed, and then the side of the grinding end 210 away from the base material 10 is ground so that the grinding end 210 forms a slope, and finally a part of the first conductive portion 21 is removed so that the remaining first conductive portion 21 forms a plurality of gold fingers, so that the consistency of the slopes at the front ends of all the gold fingers can be ensured, and the length of the slope can meet the use requirements.

[0112] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for manufacturing a gold finger of a circuit board, characterized in that: include: Providing a substrate, the substrate comprising a base material and a circuit layer disposed on the base material, the circuit layer comprising a first conductive portion and a second conductive portion arranged and adjacent to each other along a first direction, and one end of the first conductive portion facing the first direction is a grinding end; removing the second conductive portion; Grinding the side of the grinding end facing away from the substrate so that the grinding end forms a slope; Part of the first conductive part is removed so that the remaining first conductive part forms a plurality of gold fingers, and the slope is formed at one end of the gold fingers facing the first direction.

2. The method for manufacturing a gold finger of a circuit board according to claim 1, characterized in that: The removing the second conductive portion comprises: A first film is attached to a side of the circuit layer facing away from the substrate, wherein the first film is provided with a first window, and the first window exposes the second conductive portion; The second conductive portion is removed by etching.

3. The method for manufacturing gold fingers of a circuit board according to claim 1, characterized in that: The first conductive portion includes a plurality of first portions and a plurality of second portions, wherein the plurality of first portions and the plurality of second portions are staggered along a second direction, and the second direction is perpendicular to the first direction; The removing of part of the first conductive part so that the remaining first conductive part forms a plurality of gold fingers, wherein the slope is formed at one end of the gold finger close to the first conductive part, comprises: removing the first part between any two adjacent second parts so that one second part forms one gold finger.

4. The method for manufacturing gold fingers of a circuit board according to claim 3, characterized in that: The removing the first part between any two adjacent second parts so that one second part forms one golden finger includes: A second film is attached to a side of the circuit layer facing away from the substrate, wherein the second film is provided with a plurality of second openings, and one of the second openings exposes one of the first portions between two adjacent second portions; The first portion between any two adjacent second portions is removed by etching.

5. The method for manufacturing gold fingers of a circuit board according to claim 1, characterized in that: The thickness of the circuit layer is T, the inclination angle of the slope is θ, the dimension of the grinding end along the first direction is H, and H=T / tanθ.

6. The method for manufacturing gold fingers of a circuit board according to claim 1, characterized in that: The step of grinding the side of the grinding end facing away from the substrate so that the grinding end forms a slope comprises: Providing abrasive parts; The substrate is brought close to the grinding piece along the first direction, and the grinding piece is used to grind the side of the grinding end facing away from the substrate, so that the grinding end forms the slope.

7. The method for manufacturing gold fingers of a circuit board according to claim 1, characterized in that: The circuit layer also includes a third conductive part; when removing the second conductive part, part of the third conductive part is removed to form an alignment point; after grinding the side of the grinding end away from the substrate, part of the first conductive part is removed based on the alignment point.

8. The method for manufacturing gold fingers of a circuit board according to claim 7, characterized in that: When a portion of the first conductive portion is removed based on the alignment point, a portion of the third conductive portion is removed based on the alignment point, and the remaining third conductive portion forms a conductive circuit.

9. The method for manufacturing a gold finger of a circuit board according to any one of claims 1 to 8, characterized in that: The providing of the substrate comprises: A panel is provided, wherein the panel comprises a plurality of substrates, the plurality of substrates are arranged at intervals, and any two of the substrates are oriented in the same direction.

10. A circuit board, characterized in that: The circuit board is manufactured by the method for manufacturing gold fingers of a circuit board as claimed in any one of claims 1 to 9.

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