Method for manufacturing ultra-thin multi-layer circuit board and ultra-thin multi-layer circuit board

Abstract

The present invention is applicable to the technical field of multi-layer circuit board production, and provides a method for producing an ultra-thin multi-layer circuit board and an ultra-thin multi-layer circuit board, the method comprising: ion implanting a metal layer on the surface of one or more substrate boards; processing circuits on the surface of the metal layer; using one or more substrate boards to produce a multi-layer circuit board; the production of the multi-layer circuit board comprises: producing a double-layer circuit board or a three-layer circuit board; insulating the surface of the multi-layer circuit board; the use of ion implanting a metal layer on the surface of the substrate board and then processing the circuit greatly reduces the thickness of the circuit board, has a low cost, and improves user experience.

Description

Technical Field

[0001] The invention belongs to the technical field of multi-layer circuit board manufacturing, and in particular relates to a manufacturing method of an ultra-thin multi-layer circuit board and the ultra-thin multi-layer circuit board. Background Art

[0002] In order to reduce the thickness of existing multi-layer circuit boards, ultra-thin soft copper foil substrates, pure glue and surface insulation materials are usually purchased, and semi-additive processes and lamination hot pressing processes are used to achieve the thinning. However, the cost is about ten times that of conventional materials. Alternatively, flexible adhesive-backed copper foil is purchased and directly laminated and hot pressed. This method has a relatively simple process flow, but the cost of flexible adhesive-backed copper foil is about thirteen to fifteen times that of conventional materials. In addition, the thickness of the circuit boards made by the above two methods is still relatively thick and can no longer meet people's usage needs. Summary of the invention

[0003] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a method for manufacturing an ultra-thin multi-layer circuit board and an ultra-thin multi-layer circuit board, aiming to solve the problem that the prior art cannot provide an effective method for manufacturing an ultra-thin multi-layer circuit board, resulting in high manufacturing cost, thick thickness and poor user experience of the ultra-thin multi-layer circuit board.

[0004] In one aspect, the present invention provides a method for manufacturing an ultra-thin multi-layer circuit board, the method comprising the following steps:

[0005] ion implanting a metal layer on the surface of one or more of the substrate plates;

[0006] Processing circuits on the surface of the metal layer;

[0007] Using one or more of the substrate boards to make a multilayer circuit board; the making of the multilayer circuit board includes: making a double-layer circuit board or making a three-layer circuit board;

[0008] The surface of the multilayer circuit board is subjected to insulation treatment.

[0009] The method of the present invention, wherein the manufacturing of the double-layer circuit board comprises:

[0010] Opening a first through hole on the first substrate plate;

[0011] Ion-implanting the metal layer into the top and bottom surfaces of the first substrate plate and the inner wall of the first through hole;

[0012] Processing the circuits on the metal layers on the top and bottom surfaces of the first substrate plate, and copper plating the inner wall of the first through hole to connect the circuits on the top and bottom surfaces of the first substrate plate;

[0013] The double-layer circuit board is generated.

[0014] The method of the present invention, wherein the manufacturing of the double-layer circuit board comprises:

[0015] Bonding the first substrate board and the second substrate board to form a double-sided board;

[0016] Opening the first through hole on the double-sided board;

[0017] Ion-implanting the metal layer into the top surface and the bottom surface of the double-sided board and the inner wall of the first through hole;

[0018] Processing the circuits on the metal layers on the top and bottom surfaces of the double-sided board, and copper-plating the inner wall of the first through hole to connect the circuits on the top and bottom surfaces of the double-sided board;

[0019] The double-layer circuit board is generated.

[0020] The method of the present invention, wherein the manufacturing of the three-layer circuit board comprises:

[0021] Ion implanting the metal layer into the top and bottom surfaces of the first substrate plate;

[0022] Processing the circuits on the metal layers on the top and bottom surfaces of the first substrate plate;

[0023] Laminating an insulating substrate plate on the top or bottom surface of the first substrate plate to form a quasi-three-layer plate;

[0024] Opening a first through hole on the quasi-three-layer board;

[0025] Ion implantation of the metal layer is performed on a surface of the insulating substrate plate facing away from the first substrate plate and an inner wall of the first through hole;

[0026] Processing the circuit on the metal layer on the side of the insulating substrate board facing away from the first substrate board, and copper plating the inner wall of the first through hole to connect the circuit on the side of the insulating substrate board facing away from the first substrate board, and the circuit on the top and bottom surfaces of the first substrate board;

[0027] Generate the three-layer circuit board.

[0028] The method of the present invention, wherein the manufacturing of the three-layer circuit board comprises:

[0029] After ion implantation of the metal layer on the top surface of the first substrate plate, the circuit is processed on the metal layer;

[0030] Laminating a first substrate film sheet on the top surface of the first substrate sheet;

[0031] A second substrate plate is bonded to the top surface of the first substrate film plate, and a third substrate plate is bonded to the bottom surface of the first substrate plate to form a three-layer plate;

[0032] Opening a first through hole on the three-layer board;

[0033] Ion-implanting the metal layer into the top surface of the second substrate plate, the bottom surface of the third substrate plate, and the inner wall of the first through hole;

[0034] Processing the circuits on the metal layers on the top surface of the second substrate board and the bottom surface of the third substrate board, and copper-plating the inner wall of the first through hole to connect the circuits on the top surface of the second substrate board and the bottom surface of the third substrate board, as well as the circuit on the top surface of the first substrate board;

[0035] Generate the three-layer circuit board.

[0036] The method of the present invention, wherein the insulating treatment of the surface of the multi-layer circuit board comprises: insulating treatment of the surface of the double-layer circuit board or the three-layer circuit board;

[0037] The insulation treatment comprises: laminating the second substrate film or insulation ink on the surface of the double-layer circuit board or the three-layer circuit board;

[0038] The substrate film plate includes any one of a photosensitive insulating film, a photosensitive oil film and an insulating covering film.

[0039] The method of the present invention, wherein the bonding is performed by using glue;

[0040] The insulating substrate plate and the substrate film plate are both provided with adhesive backing.

[0041] The method of the present invention further comprises:

[0042] Before or after the top or bottom surface of the first substrate board is bonded to the insulating substrate board to form a quasi-three-layer board: a second through hole is opened on the insulating substrate board;

[0043] The metal layer is ion-implanted into the side of the insulating substrate plate facing away from the first substrate plate and the inner wall of the first through hole, and the metal layer is ion-implanted into the inner wall of the second through hole;

[0044] While the inner wall of the first through hole is copper-plated and connected to the circuit on the side of the insulating substrate board facing away from the first substrate board, as well as the circuit on the top and bottom surfaces of the first substrate board: the inner wall of the second through hole is copper-plated and connected to the circuit on the side of the insulating substrate board facing away from the first substrate board, as well as the circuit on the side of the first substrate board close to the insulating substrate board.

[0045] The method of the present invention further comprises:

[0046] Before bonding the first substrate film sheet to the top surface of the first substrate sheet: opening a second through hole on the first substrate film sheet;

[0047] Before bonding the second substrate plate to the top surface of the first substrate film plate: opening a third through hole on the second substrate plate;

[0048] The second through hole is directly opposite to the third through hole;

[0049] While ion-implanting the metal layer into the top surface of the second substrate plate, the bottom surface of the third substrate plate and the inner wall of the first through hole: ion-implanting the metal layer into the inner wall of the second through hole and the inner wall of the third through hole;

[0050] While the inner wall of the first through hole is copper-plated and the circuits on the top surface of the second substrate board and the bottom surface of the third substrate board, as well as the circuits on the top surface of the first substrate board, are connected: the inner walls of the second through hole and the third through hole are copper-plated and the circuits on the top surface of the second substrate board and the circuits on the top surface of the first substrate board are connected.

[0051] On the other hand, the present invention provides an ultra-thin multi-layer circuit board, which is made by the above-mentioned method for making an ultra-thin multi-layer circuit board.

[0052] The beneficial effects of the present invention are: ion implanting a metal layer on the surface of one or more substrate boards; processing circuits on the surface of the metal layer; using one or more substrate boards to make a multi-layer circuit board; making a multi-layer circuit board includes: making a double-layer circuit board or making a three-layer circuit board; insulating the surface of the multi-layer circuit board; ion implanting a metal layer on the surface of the substrate board and then processing the circuit greatly reduces the thickness of the circuit board, has a low cost, and improves the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 It is a flowchart of the method for manufacturing an ultra-thin multi-layer circuit board provided by Embodiments 1 to 4 of the present invention;

[0054] Figure 2is a cross-sectional view of a double-layer circuit board in the method for manufacturing an ultra-thin multi-layer circuit board provided in Embodiment 1 of the present invention;

[0055] Figure 3 is a cross-sectional view of a double-layer circuit board in the method for manufacturing an ultra-thin multi-layer circuit board provided in the second embodiment of the present invention;

[0056] Figure 4 is a cross-sectional view of a three-layer circuit board according to a method for manufacturing an ultra-thin multi-layer circuit board provided in Embodiment 3 of the present invention;

[0057] Figure 5 is a cross-sectional view of a three-layer circuit board according to a method for manufacturing an ultra-thin multi-layer circuit board provided in a fourth embodiment of the present invention;

[0058] Figure 6 It is a further implementation flow chart of the method for manufacturing an ultra-thin multi-layer circuit board provided in the second embodiment of the present invention. DETAILED DESCRIPTION

[0059] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0060] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments:

[0061] Embodiment 1:

[0062] Figure 1 The implementation process of the method for manufacturing an ultra-thin multilayer circuit board provided in the first embodiment of the present invention is shown. For the convenience of explanation, only the part related to the embodiment of the present invention is shown. Figure 2 , as detailed below:

[0063] Making a double-layer circuit board includes:

[0064] In step S101, a metal layer is ion-implanted on the surface of one or more substrate plates;

[0065] In an embodiment of the present invention, before step S101 , a first through hole 111 is opened on the first substrate plate 110 ;

[0066] Furthermore, step S101 includes: ion implanting a metal layer into the top surface and the bottom surface of the first substrate plate 110 and the inner wall of the first through hole 111 .

[0067] In step S102, a circuit is processed on the surface of the metal layer;

[0068] In an embodiment of the present invention, the circuit 112 is processed on the metal layer on the top and bottom surfaces of the first substrate plate 110, and the inner wall of the first through hole 111 is copper plated to connect the circuit 112 on the top and bottom surfaces of the first substrate plate 110. The processing of the circuit 112 can be realized by a semi-additive process or an etching process.

[0069] In step S103, a multilayer circuit board is manufactured using one or more substrate boards;

[0070] In an embodiment of the present invention, manufacturing a multilayer circuit board includes: manufacturing a double-layer circuit board; wherein, in this embodiment 1, a first substrate board 110 is used to manufacture a double-layer circuit board to generate a double-layer circuit board; the substrate board is made of polyimide material or LCP or PET material.

[0071] In step S104, the surface of the multilayer wiring board is insulated.

[0072] In an embodiment of the present invention, performing insulation treatment on the surface of the multi-layer circuit board includes: performing insulation treatment on the surface of the double-layer circuit board;

[0073] The insulation treatment includes: laminating a second substrate film 120 or insulating ink on the surface of the double-layer circuit board; wherein the substrate film has a backing adhesive, and the lamination is performed by hot pressing;

[0074] The substrate film plate includes any one of: a photosensitive insulating film, a photosensitive oil film, and an insulating covering film.

[0075] In an embodiment of the present invention, a metal layer is ion-implanted on the surface of one or more substrate boards; a circuit 112 is processed on the surface of the metal layer; a multi-layer circuit board is manufactured using one or more substrate boards; the manufacturing of the multi-layer circuit board includes: manufacturing a double-layer circuit board or a triple-layer circuit board; the surface of the multi-layer circuit board is insulated; and the processing of the circuit 112 after ion-implanting a metal layer on the surface of the substrate board greatly reduces the thickness of the circuit board, reduces the cost, and improves the user experience.

[0076] Embodiment 2:

[0077] Figure 1 The implementation process of the method for manufacturing an ultra-thin multilayer circuit board provided by the second embodiment of the present invention is shown. For the sake of convenience, only the part related to the embodiment of the present invention is shown. Figure 3 and Figure 6 , as detailed below:

[0078] Making a double-layer circuit board (single+single+Airgap hole) includes:

[0079] In step S101, a metal layer is ion-implanted on the surface of one or more substrate plates;

[0080] In an embodiment of the present invention, before step S101, the first substrate plate 210 and the second substrate plate 220 are bonded to form a double-sided board 230; a first through hole 240 is opened on the double-sided board 230; wherein the bonding is bonding using an adhesive layer 211 made of glue, and hot pressing bonding is performed; preferably, a plurality of air gap holes (Airgap holes) 212 are opened on the adhesive layer 211 to reduce the bonding surface of the first substrate plate 210 and the second substrate plate 220, so that the double-sided board 230 becomes very soft, and the formed double-layer circuit board can be bent arbitrarily to meet different usage requirements, and achieve a layered effect after hot pressing bonding; further, the first substrate plate 210 or the second substrate plate 220 can be provided with adhesive backing, which is convenient for more options;

[0081] Furthermore, step S101 includes: ion implanting a metal layer into the top surface and the bottom surface of the double-sided board 230 and the inner wall of the first through hole 240 .

[0082] In step S102, a circuit is processed on the surface of the metal layer;

[0083] In an embodiment of the present invention, circuits 250 are processed on the metal layers on the top and bottom surfaces of the double-sided board 230, and the inner wall of the first through hole 240 is copper-plated to connect the circuits 250 on the top and bottom surfaces of the double-sided board 230; wherein, processing the circuits 250 can be achieved by a semi-additive process or an etching process.

[0084] In step S103, a multilayer circuit board is manufactured using one or more substrate boards;

[0085] In an embodiment of the present invention, manufacturing a multilayer circuit board includes: manufacturing a double-layer circuit board; wherein, in this embodiment 2, a first substrate board 210 and a second substrate board 220 are used to manufacture a double-layer circuit board to generate a double-layer circuit board; further, the substrate board is made of polyimide material or LCP or PET material.

[0086] In step S104, the surface of the multilayer wiring board is insulated.

[0087] In an embodiment of the present invention, performing insulation treatment on the surface of the multi-layer circuit board includes: performing insulation treatment on the surface of the double-layer circuit board;

[0088] The insulation treatment includes: laminating a second substrate film 260 or insulating ink on the surface of the double-layer circuit board; wherein the substrate film has a backing adhesive, and the lamination is performed by hot pressing;

[0089] The substrate film plate includes any one of: a photosensitive insulating film, a photosensitive oil film, and an insulating covering film.

[0090] In an embodiment of the present invention, a metal layer is ion-implanted on the surface of one or more substrate boards; a circuit 250 is processed on the surface of the metal layer; a multi-layer circuit board is manufactured using one or more substrate boards; the manufacturing of the multi-layer circuit board includes: manufacturing a double-layer circuit board or a triple-layer circuit board; the surface of the multi-layer circuit board is insulated; and the processing of the circuit 250 after ion-implanting a metal layer on the surface of the substrate board greatly reduces the thickness of the circuit board, reduces the cost, and improves the user experience.

[0091] In this embodiment 2, the implementation process of step S101 to step S104 can be further summarized as follows. Figure 6 :

[0092] In step S201, a plurality of air gap holes are opened on the adhesive layer;

[0093] In step S202, a first substrate plate and a second substrate plate are bonded together using an adhesive layer to form a double-sided board;

[0094] In step S203, a first through hole is opened on the double-sided board;

[0095] In step S204, ion implantation of a metal layer is performed on the top and bottom surfaces of the double-sided board and the inner wall of the first through hole;

[0096] In step S205, a semi-additive process or an etching process is used to process circuits on the metal layers on the top and bottom surfaces of the double-sided board, and the inner wall of the first through hole is copper plated to connect the circuits on the top and bottom surfaces of the double-sided board, thereby generating a double-layer circuit board;

[0097] In step S206, the surface of the double-layer circuit board is insulated.

[0098] Embodiment three:

[0099] Figure 1 The implementation process of the method for manufacturing an ultra-thin multilayer circuit board provided in the third embodiment of the present invention is shown. For the sake of convenience, only the part related to the embodiment of the present invention is shown. Figure 4 , as detailed below:

[0100] Making a three-layer circuit board (single + double) includes:

[0101] In step S101, a metal layer is ion-implanted on the surface of one or more substrate plates;

[0102] In an embodiment of the present invention, the metal layer is ion-implanted into both the top and bottom surfaces of the first substrate plate 310 .

[0103] In step S102, a circuit is processed on the surface of the metal layer;

[0104] In an embodiment of the present invention, circuits 311 are processed on the metal layers on the top and bottom surfaces of the first substrate plate 310 ; wherein, processing the circuits 311 can be achieved by using a semi-additive process or an etching process.

[0105] In step S103, a multilayer circuit board is manufactured using one or more substrate boards;

[0106] In an embodiment of the present invention, manufacturing a multi-layer circuit board includes: manufacturing a three-layer circuit board;

[0107] The method further includes: laminating an insulating substrate plate 320 on the top or bottom surface of the first substrate plate 310 to form a quasi-three-layer plate 330; wherein the insulating substrate plate 320 has a backing adhesive, and the lamination is performed by hot pressing. The insulating substrate plate 320 with a backing adhesive is convenient for laminating with the circuit 311 and forming a solid film on the surface after curing, which can be bonded and provided with through holes;

[0108] A first through hole 331 is formed on the quasi-three-layer board 330;

[0109] Ion implantation of a metal layer is performed on the surface of the insulating substrate 320 that is away from the first substrate 310 and the inner wall of the first through hole 331;

[0110] The circuit 311 is processed on the metal layer on the side of the insulating substrate plate 320 facing away from the first substrate plate 310, and the inner wall of the first through hole 331 is copper-plated to connect the circuit 311 on the side of the insulating substrate plate 320 facing away from the first substrate plate 310, as well as the circuit 311 on the top and bottom surfaces of the first substrate plate 310; wherein the processing of the circuit 311 can be achieved by a semi-additive process or an etching process.

[0111] In this embodiment 3, a three-layer circuit board is manufactured using a first substrate plate 310 and an insulating substrate plate 320 to generate a three-layer circuit board.

[0112] In step S104, the surface of the multilayer wiring board is insulated.

[0113] In an embodiment of the present invention, performing insulation treatment on the surface of the multi-layer circuit board includes: performing insulation treatment on the surface of the three-layer circuit board;

[0114] The insulation treatment includes: laminating a second substrate film 340 or insulating ink on the surface of the three-layer circuit board; wherein the substrate film has a backing adhesive, and the lamination is performed by hot pressing;

[0115] The substrate film plate includes any one of: a photosensitive insulating film, a photosensitive oil film, and an insulating covering film.

[0116] In an embodiment of the present invention, the method further includes:

[0117] Before or after the top or bottom surface of the first substrate plate 310 is bonded to the insulating substrate plate 320 to form the quasi-three-layer plate 330: a second through hole 321 is opened on the insulating substrate plate 320, wherein the second through hole 321 can be opened when the first through hole 331 is opened;

[0118] The metal layer is ion-implanted into the surface of the insulating substrate 320 away from the first substrate 310 and the inner wall of the first through hole 331, and the metal layer is ion-implanted into the inner wall of the second through hole 321;

[0119] The inner wall of the first through hole 331 is copper-plated and connected to the circuit 311 on the side of the insulating substrate plate 320 facing away from the first substrate plate 310, as well as the circuit 311 on the top and bottom surfaces of the first substrate plate 310. At the same time, the inner wall of the second through hole 321 is copper-plated and connected to the circuit 311 on the side of the insulating substrate plate 320 facing away from the first substrate plate 310, as well as the circuit 311 on the side of the first substrate plate 310 close to the insulating substrate plate 320, so as to realize the processing of blind holes and meet different usage requirements.

[0120] In an embodiment of the present invention, a metal layer is ion-implanted on the surface of one or more substrate boards; a circuit 311 is processed on the surface of the metal layer; a multi-layer circuit board is manufactured using one or more substrate boards; the manufacturing of the multi-layer circuit board includes: manufacturing a double-layer circuit board or a three-layer circuit board; the surface of the multi-layer circuit board is insulated; further, the substrate board is made of polyimide material or LCP or PET material; the thickness of the circuit board is greatly reduced by ion-implanting a metal layer on the surface of the substrate board and then processing the circuit 311, which can save a layer of substrate board, and has a low cost and improves the user experience. Ion-implant metallization is directly performed on the substrate board, and the holes and surfaces are copper-plated as a whole, and there is no need to make a separate conductive layer, which simplifies the process; the holes and surfaces are copper-plated as a whole, and the copper thickness of the inner wall of the hole and the copper thickness of the surface are highly close to 1:1, and the reliability is higher.

[0121] Embodiment 4:

[0122] Figure 1 The implementation process of the method for manufacturing an ultra-thin multilayer circuit board provided by the fourth embodiment of the present invention is shown. For the convenience of explanation, only the part related to the embodiment of the present invention is shown. Figure 5 , as detailed below:

[0123] Making a three-layer circuit board (single+single+single+Airgap hole) includes:

[0124] In step S101, a metal layer is ion-implanted on the surface of one or more substrate plates;

[0125] In an embodiment of the present invention, a metal layer is ion-implanted onto the top surface of the first substrate plate 410 .

[0126] In step S102, a circuit 411 is processed on the surface of the metal layer;

[0127] In an embodiment of the present invention, after ion implantation of a metal layer on the top surface of the first substrate plate 410 , a circuit 411 is processed on the metal layer; wherein, processing the circuit 411 can be achieved by a semi-additive process or an etching process.

[0128] In step S103, a multilayer circuit board is manufactured using one or more substrate boards;

[0129] In an embodiment of the present invention, manufacturing a multi-layer circuit board includes: manufacturing a three-layer circuit board;

[0130] The method further includes: laminating the first substrate film plate 420 on the top surface of the first substrate plate 410; wherein the substrate film plate has a backing adhesive, and the lamination is performed by hot pressing;

[0131] The second substrate plate 430 is bonded to the top surface of the first substrate film plate 420, and the third substrate plate 440 is bonded to the bottom surface of the first substrate plate 410 to form a three-layer plate 450; wherein the bonding is performed by bonding with an adhesive layer 441 made of glue, and hot pressing bonding is performed; preferably, a plurality of air gap holes (Airgap holes) 442 are provided on the adhesive layer 441 to reduce the bonding surface between the first substrate film plate 420 and the second substrate plate 430, and the bonding surface between the first substrate plate 410 and the third substrate plate 440, so that the three-layer plate 450 becomes soft, and the formed three-layer circuit board can be bent arbitrarily to meet different usage requirements, and achieve a layered effect after hot pressing bonding; further, the second substrate film plate 430 or the third substrate plate 440 can be provided with adhesive backing, so as to facilitate more options;

[0132] A first through hole 460 is formed on the three-layer board 450;

[0133] Ion-implanting a metal layer into the top surface of the second substrate plate 430, the bottom surface of the third substrate plate 440, and the inner wall of the first through hole 460;

[0134] Circuit 411 is processed on the metal layer on the top surface of the second substrate plate 430 and the bottom surface of the third substrate plate 440, and the inner wall of the first through hole 460 is copper-plated to connect the circuit 411 on the top surface of the second substrate plate 430 and the bottom surface of the third substrate plate 440, as well as the circuit 411 on the top surface of the first substrate plate 410; wherein, processing circuit 411 can be achieved by a semi-additive process or an etching process.

[0135] In this embodiment 4, a three-layer circuit board is manufactured by using a first substrate plate 410 and a first substrate film plate 420 , a second substrate plate 430 and a third substrate plate 440 to generate a three-layer circuit board.

[0136] In step S104, the surface of the multilayer wiring board is insulated.

[0137] In an embodiment of the present invention, performing insulation treatment on the surface of the multi-layer circuit board includes: performing insulation treatment on the surface of the three-layer circuit board;

[0138] The insulation treatment includes: laminating a second substrate film 470 or insulating ink on the surface of the three-layer circuit board; wherein the substrate film has a backing adhesive, and the lamination is performed by hot pressing;

[0139] The substrate film plate includes: any one of a photosensitive insulating film, a photosensitive oil film, and an insulating cover film; preferably, the photosensitive insulating film or the insulating cover film is used.

[0140] In an embodiment of the present invention, the method further includes:

[0141] Before bonding the first substrate film 420 on the top surface of the first substrate plate 410: a second through hole 480 is opened on the first substrate film 420;

[0142] Before bonding the second substrate plate 430 to the top surface of the first substrate film plate 420: a third through hole 490 is opened on the second substrate plate 430;

[0143] The second through hole 480 is directly opposite to the third through hole 490, wherein the third through hole 490 and the second through hole 480 can be opened when the first through hole 460 is opened, and the third through hole 490 and the second through hole 480 are opened and formed at the same time;

[0144] The top surface of the second substrate plate 430, the bottom surface of the third substrate plate 440 and the inner wall of the first through hole 460 are ion-implanted with a metal layer, and the inner wall of the second through hole 480 and the inner wall of the third through hole 490 are ion-implanted with a metal layer;

[0145] The inner wall of the first through hole 460 is copper-plated and connected to the circuit 411 on the top surface of the second substrate plate 430 and the bottom surface of the third substrate plate 440, as well as the circuit 411 on the top surface of the first substrate plate 410. At the same time, the inner walls of the second through hole 480 and the third through hole 490 are copper-plated and connected to the circuit 411 on the top surface of the second substrate plate 430 and the circuit 411 on the top surface of the first substrate plate 410, so as to realize the processing of blind holes and meet different usage requirements.

[0146] In an embodiment of the present invention, a metal layer is ion-implanted on the surface of one or more substrate boards; a circuit 411 is processed on the surface of the metal layer; a multi-layer circuit board is made using one or more substrate boards; the making of a multi-layer circuit board includes: making a double-layer circuit board or making a three-layer circuit board; insulating the surface of the multi-layer circuit board; the thickness of the circuit board is greatly reduced by ion-implanting a metal layer on the surface of the substrate board and then processing the circuit 411, which has a low cost and improves the user experience; and ion-implanting metallization is directly performed on the substrate board to perform integrated copper plating of the holes and the surface, without the need for a separate conductive layer, which simplifies the process; the integrated copper plating of the holes and the surface, the ratio of the copper thickness of the inner wall of the hole to the copper thickness of the surface is highly close to 1:1, and the reliability is higher.

[0147] Embodiment five:

[0148] The fifth embodiment of the present invention provides an ultra-thin multi-layer circuit board, which is manufactured by the method provided by any one of the first to fourth embodiments.

[0149] It should be noted that the above-mentioned substrate plate, substrate film plate, and insulating substrate plate can be a flexible plate or a rigid plate; wherein the substrate plate and the substrate film plate are both made of insulating materials.

[0150] The content described in this specification and the accompanying drawings herein includes the example of the method for making ultra-thin multilayer circuit boards and ultra-thin multilayer circuit boards that can be provided. Of course, it is not possible to describe every conceivable combination of components and / or methods for the purpose of describing the various features of the present disclosure, but it can be recognized that many other combinations and permutations of the disclosed features are possible. Therefore, it is obvious that various modifications can be made to the present disclosure without departing from the scope or spirit of the present disclosure. In addition, or in an alternative, other embodiments of the present disclosure may be obvious from consideration of the present specification and the accompanying drawings and the practice of the present disclosure as presented herein. It is intended that the examples proposed in the present specification and the accompanying drawings are considered to be illustrative and not restrictive in all respects. Although specific terms are used in this article, they are used in a general and descriptive sense and are not used for the purpose of limitation.

Claims

1. A method for manufacturing an ultra-thin multi-layer circuit board, characterized in that: The method comprises the following steps: ion implanting a metal layer on the surface of one or more of the substrate plates; Processing circuits on the surface of the metal layer; Using one or more of the substrate boards to make a multilayer circuit board; The manufacturing of the multi-layer circuit board includes: manufacturing a double-layer circuit board or manufacturing a three-layer circuit board; The surface of the multilayer circuit board is subjected to insulation treatment.

2. The method according to claim 1, characterized in that The manufacturing of the double-layer circuit board comprises: Opening a first through hole on the first substrate plate; Ion-implanting the metal layer into the top and bottom surfaces of the first substrate plate and the inner wall of the first through hole; Processing the circuits on the metal layers on the top and bottom surfaces of the first substrate plate, and copper plating the inner wall of the first through hole to connect the circuits on the top and bottom surfaces of the first substrate plate; The double-layer circuit board is generated.

3. The method according to claim 1, characterized in that The manufacturing of the double-layer circuit board comprises: Bonding the first substrate board and the second substrate board to form a double-sided board; Opening the first through hole on the double-sided board; Ion-implanting the metal layer into the top surface and the bottom surface of the double-sided board and the inner wall of the first through hole; Processing the circuits on the metal layers on the top and bottom surfaces of the double-sided board, and copper-plating the inner wall of the first through hole to connect the circuits on the top and bottom surfaces of the double-sided board; The double-layer circuit board is generated.

4. The method according to claim 1, characterized in that The manufacturing of the three-layer circuit board comprises: Ion implanting the metal layer into the top and bottom surfaces of the first substrate plate; Processing the circuits on the metal layers on the top and bottom surfaces of the first substrate plate; Laminating an insulating substrate plate on the top or bottom surface of the first substrate plate to form a quasi-three-layer plate; Opening a first through hole on the quasi-three-layer board; Ion implantation of the metal layer is performed on a surface of the insulating substrate plate facing away from the first substrate plate and an inner wall of the first through hole; Processing the circuit on the metal layer on the side of the insulating substrate board facing away from the first substrate board, and copper plating the inner wall of the first through hole to connect the circuit on the side of the insulating substrate board facing away from the first substrate board, and the circuit on the top and bottom surfaces of the first substrate board; Generate the three-layer circuit board.

5. The method according to claim 1, characterized in that The manufacturing of the three-layer circuit board comprises: After ion implantation of the metal layer on the top surface of the first substrate plate, the circuit is processed on the metal layer; Laminating a first substrate film sheet on the top surface of the first substrate sheet; A second substrate plate is bonded to the top surface of the first substrate film plate, and a third substrate plate is bonded to the bottom surface of the first substrate plate to form a three-layer plate; Opening a first through hole on the three-layer board; Ion-implanting the metal layer into the top surface of the second substrate plate, the bottom surface of the third substrate plate, and the inner wall of the first through hole; Processing the circuits on the metal layers on the top surface of the second substrate board and the bottom surface of the third substrate board, and copper-plating the inner wall of the first through hole to connect the circuits on the top surface of the second substrate board and the bottom surface of the third substrate board, as well as the circuit on the top surface of the first substrate board; Generate the three-layer circuit board.

6. The method according to any one of claims 1 to 5, characterized in that: The insulating treatment of the surface of the multi-layer circuit board includes: insulating treatment of the surface of the double-layer circuit board or the three-layer circuit board; The insulation treatment comprises: laminating the second substrate film or insulation ink on the surface of the double-layer circuit board or the three-layer circuit board; The substrate film plate includes any one of a photosensitive insulating film, a photosensitive oil film and an insulating covering film.

7. The method according to claim 6, characterized in that The bonding is performed by using glue; The insulating substrate plate and the substrate film plate are both provided with adhesive backing.

8. The method according to claim 4, characterized in that The method further comprises: Before or after the top or bottom surface of the first substrate board is bonded to the insulating substrate board to form a quasi-three-layer board: a second through hole is opened on the insulating substrate board; The metal layer is ion-implanted into the side of the insulating substrate plate facing away from the first substrate plate and the inner wall of the first through hole, and the metal layer is ion-implanted into the inner wall of the second through hole; While the inner wall of the first through hole is copper-plated and connected to the circuit on the side of the insulating substrate board facing away from the first substrate board, as well as the circuit on the top and bottom surfaces of the first substrate board: the inner wall of the second through hole is copper-plated and connected to the circuit on the side of the insulating substrate board facing away from the first substrate board, as well as the circuit on the side of the first substrate board close to the insulating substrate board.

9. The method according to claim 5, characterized in that The method further comprises: Before bonding the first substrate film sheet to the top surface of the first substrate sheet: opening a second through hole on the first substrate film sheet; Before bonding the second substrate plate to the top surface of the first substrate film plate: opening a third through hole on the second substrate plate; The second through hole is directly opposite to the third through hole; While ion-implanting the metal layer into the top surface of the second substrate plate, the bottom surface of the third substrate plate and the inner wall of the first through hole: ion-implanting the metal layer into the inner wall of the second through hole and the inner wall of the third through hole; While the inner wall of the first through hole is copper-plated and the circuits on the top surface of the second substrate board and the bottom surface of the third substrate board, as well as the circuits on the top surface of the first substrate board, are connected: the inner walls of the second through hole and the third through hole are copper-plated and the circuits on the top surface of the second substrate board and the circuits on the top surface of the first substrate board are connected.

10. An ultra-thin multi-layer circuit board, characterized in that: Made by the method according to any one of claims 1 to 9.

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