Power semiconductor package cooling device

Abstract

The present invention provides a packaging cooling device for power semiconductors, which belongs to the field of semiconductor cooling technology, and includes a bottom shell, a retarding component, a heat conducting plate, and a stirring component. The heat conducting plate is fixedly installed inside the bottom shell to provide support for the power semiconductor device. A cooling chamber is formed below the heat conducting plate. A water inlet pipe connected to the cooling chamber is provided on one side of the bottom shell, and a drain pipe connected to the cooling chamber is provided on the other side. The retarding component and the stirring component are both provided inside the cooling chamber, and the retarding component is used to perform retarding treatment on the cooling water flowing through the cooling chamber. Compared with the prior art, the embodiment of the present invention can perform retarding and stirring treatment on the cooling water flowing through the cooling chamber, so that the cooling water can be in contact with the heat conducting plate for a longer time and more fully, thereby improving the cooling effect of the power semiconductor device.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor cooling, in particular to a packaging cooling device for a power semiconductor. Background Art

[0002] Most existing power semiconductor devices are packaged inside a housing. In order to achieve timely cooling and heat dissipation of the power semiconductor devices, a cooling medium such as water or oil needs to flow along the inside of the housing to take away the working heat of the power semiconductor devices and achieve cooling and heat dissipation.

[0003] However, existing cooling media such as water or oil often flow along the inside of the shell at a high speed, resulting in the cooling medium being discharged from the shell before it has time to fully exchange heat with the power semiconductor device, resulting in poor utilization of the cooling medium and poor cooling effect of the power semiconductor device. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the embodiments of the present invention is to provide a packaging cooling device for a power semiconductor.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] A power semiconductor packaging cooling device comprises a bottom shell, a retarding component, a heat conducting plate and a stirring component.

[0007] The heat conducting plate is fixedly mounted inside the bottom shell to provide support for the power semiconductor device.

[0008] A cooling chamber is formed below the heat conducting plate, a water inlet pipe communicating with the cooling chamber is arranged on one side of the bottom shell, and a drain pipe communicating with the cooling chamber is arranged on the other side.

[0009] The deceleration component and the stirring component are both arranged inside the cooling chamber.

[0010] The deceleration component is used to decelerate the cooling water flowing through the cooling chamber.

[0011] The stirring assembly is used to stir the cooling water flowing through the cooling chamber.

[0012] As a further improvement of the present invention: a support plate is fixedly provided at one end of the bottom shell.

[0013] The deceleration assembly includes a piston plate, a guide shaft and a first elastic member.

[0014] The piston plate is movably arranged inside the cooling chamber, the end of the guide shaft is connected to the inner wall of the bottom shell, the guide shaft passes through the piston plate and movably cooperates with the piston plate, one end of the first elastic member is connected to the support plate, and the other end is connected to the piston plate, so as to provide elastic support for the piston plate.

[0015] The piston plate is provided with a through hole and a slide groove, and sealing baffles are provided on opposite sides of the piston plate. The two sets of sealing baffles are connected by a connecting rod, and the connecting rod passes through the slide groove and can slide inside the slide groove. A triangular plate is fixedly provided on the side away from each other of the two sets of sealing baffles.

[0016] A first column rod and a second column rod are fixedly arranged at the bottom of the inner side of the bottom shell, and the first column rod and the second column rod are respectively located at two sides of the piston plate.

[0017] As a further improvement of the present invention: the stirring assembly includes a ring sleeve, a stirring rod and a third elastic member,

[0018] The ring sleeves are provided in a plurality of groups, and a plurality of the ring sleeves are arranged on the side of the piston plate facing the water inlet pipe, and a plurality of the ring sleeves are sequentially sleeved outside the guide shaft at intervals, and a plurality of the stirring rods are fixedly provided on the outer wall of each group of the ring sleeves, and two adjacent groups of the ring sleeves are connected by a group of the third elastic member, wherein the group of the ring sleeves closest to the water inlet pipe is fixedly connected to the guide shaft, and the remaining ring sleeves are slidably matched with the guide shaft,

[0019] The guide shaft is rotatably matched with the inner wall of the bottom shell, and the side wall of the guide shaft is provided with a strip groove and a spiral groove, the strip groove is arranged along the length direction of the guide shaft, and one end of the spiral groove is connected with the strip groove.

[0020] A sleeve is fixedly provided on the side wall of the piston plate, and the sleeve is sleeved on the outside of the guide shaft. An inclined shift block is hingedly provided on the inner wall of the sleeve, and one side of the shift block is connected to the inner wall of the sleeve through a second elastic member. The shift block extends to the inside of the strip groove, and the side wall of the guide shaft is also connected to the heat conduction plate through an elastic rope.

[0021] As a further improvement of the present invention: an annular groove is provided on the outside of the guide shaft, the annular groove is located at one end of the spiral groove away from the strip groove and is connected to the spiral groove.

[0022] As a further improvement of the present invention: the first elastic member, the second elastic member and the third elastic member are springs or metal springs.

[0023] As a further improvement of the present invention: the elastic rope is a rubber rope or a silicone rope.

[0024] As a further improvement of the present invention: the drain pipe passes through the side wall of the bottom shell and the support plate.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] In an embodiment of the present invention, when cooling a power semiconductor device, an external pump group can be used to pump cooling water from a water inlet pipe to the inside of a cooling chamber, so that the cooling water flows along the inside of the cooling chamber, and the circulated cooling water is then discharged from a drain pipe. In this process, the cooling water takes away the heat transferred from the power semiconductor device to the heat transfer plate, thereby achieving cooling and heat dissipation of the power semiconductor device. When the above-mentioned cooling water flows along the inside of the cooling chamber, on the one hand, the cooling water is slowed down by a deceleration component, thereby extending the flow time of the cooling water along the inside of the cooling chamber, thereby improving the heat exchange effect between the cooling water and the heat transfer plate, and improving the cooling effect of the power semiconductor device. On the other hand, the cooling water is stirred by a stirring component, so that the cooling water can more fully contact the heat transfer plate, so as to further improve the cooling effect of the power semiconductor device. Compared with the prior art, the cooling water flowing through the inside of the cooling chamber can be slowed down and stirred, so that the cooling water can contact the heat transfer plate for a longer time and more fully, thereby improving the cooling effect of the power semiconductor device and improving the utilization effect of the cooling water. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of the structure of a power semiconductor packaging cooling device Figure 1 ;

[0028] Figure 2 A schematic diagram of the structure of a power semiconductor packaging cooling device Figure 2 ;

[0029] Figure 3 It is a schematic diagram of the structure inside a sleeve in a packaging cooling device for a power semiconductor;

[0030] Figure 4 for Figure 1 A magnified schematic diagram of the middle A area;

[0031] Figure 5 for Figure 1 A magnified schematic diagram of the middle B area;

[0032] Figure 6 for Figure 2 Enlarged schematic diagram of the middle C area;

[0033] In the figure: 10-bottom shell, 101-water inlet pipe, 102-drain pipe, 103-support plate, 104-first column rod, 105-second column rod, 20-deceleration component, 201-piston plate, 2011-through hole, 2012-slide groove, 202-guide shaft, 2021-strip groove, 2022-spiral groove, 2023-ring groove, 203-first elastic member, 204-elastic rope, 205-sealing baffle, 206-triangular plate, 207-sleeve, 2071-shift block, 2072-second elastic member, 208-connecting rod, 30-heat conduction plate, 40-stirring component, 401-ring sleeve, 402-stirring rod, 403-third elastic member. DETAILED DESCRIPTION

[0034] The technical solution of the present invention is further described in detail below in conjunction with specific implementation methods.

[0035] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0036] See also Figure 1 as well as Figure 2 The present embodiment provides a packaging cooling device for a power semiconductor, including a bottom shell 10, a retarding component 20, a heat conducting plate 30 and a stirring component 40. The heat conducting plate 30 is fixedly installed inside the bottom shell 10 to provide support for the power semiconductor device. A cooling chamber is formed below the heat conducting plate 30. A water inlet pipe 101 connected to the cooling chamber is provided on one side of the bottom shell 10, and a drain pipe 102 connected to the cooling chamber is provided on the other side. The retarding component 20 and the stirring component 40 are both arranged inside the cooling chamber. The retarding component 20 is used to retarder the cooling water flowing through the cooling chamber, and the stirring component 40 is used to stir the cooling water flowing through the cooling chamber.

[0037] When cooling the power semiconductor device, an external pump group (not shown in the figure) can be used to pump cooling water from the water inlet pipe 101 to the inside of the cooling chamber, so that the cooling water flows along the inside of the cooling chamber, and the circulated cooling water is then discharged from the drain pipe 102. In this process, the cooling water takes away the heat transferred from the power semiconductor device to the heat conducting plate 30, thereby realizing cooling and heat dissipation of the power semiconductor device; when the above-mentioned cooling water flows along the inside of the cooling chamber, on the one hand, the cooling water is slowed down by the deceleration component 20, thereby extending the flow time of the cooling water along the inside of the cooling chamber, thereby improving the heat exchange effect between the cooling water and the heat conducting plate 30, and improving the cooling effect of the power semiconductor device; on the other hand, the cooling water is stirred by the stirring component 40, so that the cooling water can be more fully in contact with the heat conducting plate 30, so as to further improve the cooling effect of the power semiconductor device.

[0038] See also Figure 1 , Figure 4 as well as Figure 6 In one embodiment, a support plate 103 is fixedly provided at one end inside the bottom shell 10, and the deceleration assembly 20 includes a piston plate 201, a guide shaft 202 and a first elastic member 203. The piston plate 201 is movably arranged inside the cooling chamber, and the end of the guide shaft 202 is connected to the inner wall of the bottom shell 10. The guide shaft 202 passes through the piston plate 201 and movably cooperates with the piston plate 201. One end of the first elastic member 203 is connected to the support plate 103, and the other end is connected to the piston plate 201, so as to provide elastic support to the piston plate 201. The piston plate 201 is provided with a through hole 2011 and a slide groove 2012, and sealing baffles 205 are arranged on opposite sides of the piston plate 201. The two groups of sealing baffles 205 are connected by a connecting rod 208, and the connecting rod 208 passes through the slide groove 2012 and can slide inside the slide groove 2012. A triangular plate 206 is fixedly arranged on the side away from each other of the two groups of sealing baffles 205, and a first column rod 104 and a second column rod 105 are fixedly arranged on the bottom of the inner side of the bottom shell 10, and the first column rod 104 and the second column rod 105 are respectively located on both sides of the piston plate 201.

[0039] Initially, the piston plate 201 is located at one end of the cooling chamber away from the support plate 103 under the elastic support of the first elastic member 203, the piston plate 201 is close to the water inlet pipe 101, and the two sets of sealing baffles 205 are in a sealed state with respect to the through hole 2011. When the external pump group pumps cooling water from the water inlet pipe 101 to the cooling chamber, the cooling water can push the piston plate 201 to move along the cooling chamber, and the piston plate 201 gradually approaches the support plate 103, and the first elastic member 203 The piston plate 201 is gradually compressed. When the piston plate 201 moves a certain distance, the triangular plate 206 on the sealing baffle 205 on one side of the piston plate 201 can act on the first column rod 104. The first column rod 104 can push the triangular plate 206 and then drive the two sets of sealing baffles 205 to slide synchronously along the side wall of the piston plate 201. When the two sets of sealing baffles 205 slide, the sealing state of the through hole 2011 is released, so that the cooling water in the cooling chamber can pass through the through hole 2011 and then be discharged from the drain pipe 102. The through hole 201 After the seal is released, the first elastic member 203 pushes the piston plate 201 so that the piston plate 201 moves in the reverse direction along the interior of the cooling chamber, and the piston plate 201 gradually moves away from the support plate 103 and gradually approaches the water inlet pipe 101. When the triangular plate 206 on the sealing baffle 205 on the other side of the piston plate 201 acts on the second column 105, the second column 105 can push the triangular plate 206 and then drive the two sets of sealing baffles 205 to slide synchronously in the reverse direction along the side wall of the piston plate 201. The two sets of sealing baffles 205 are aligned with the through hole 201. 011 is sealed, and the cooling water subsequently pumped into the cooling chamber from the water inlet pipe 101 can push the piston plate 201 again so that the piston plate 201 is close to the support plate 103 again. This reciprocating cycle can realize the reciprocating movement of the piston plate 201 inside the cooling chamber. The cooling water can be blocked to a certain extent during the reciprocating movement of the piston plate 201, thereby slowing down the flow speed of the cooling water along the inside of the cooling chamber, thereby prolonging the contact time between the cooling water and the heat conducting plate 30, and improving the cooling effect of the power semiconductor device.

[0040] See also Figure 3 , Figure 4 as well as Figure 5In one embodiment, the stirring assembly 40 includes a ring sleeve 401, a stirring rod 402 and a third elastic member 403. The ring sleeve 401 is provided with a plurality of groups. The plurality of ring sleeves 401 are arranged on the side of the piston plate 201 facing the water inlet pipe 101. The plurality of ring sleeves 401 are sequentially sleeved on the outside of the guide shaft 202 at intervals. The outer wall of each group of the ring sleeves 401 is fixedly provided with a plurality of stirring rods 402. Two adjacent groups of the ring sleeves 401 are connected by a group of the third elastic member 403. The group of the ring sleeves 401 closest to the water inlet pipe 101 is fixedly connected to the guide shaft 202, and the remaining ring sleeves 401 are slidably matched with the guide shaft 202. The guide shaft 202 is slidably matched with the third elastic member 403. The inner wall of the bottom shell 10 is rotatably matched, and the side wall of the guide shaft 202 is provided with a strip groove 2021 and a spiral groove 2022. The strip groove 2021 is arranged along the length direction of the guide shaft 202, and one end of the spiral groove 2022 is connected to the strip groove 2021. The side wall of the piston plate 201 is fixedly provided with a sleeve 207, and the sleeve 207 is sleeved on the outside of the guide shaft 202. The inner wall of the sleeve 207 is hingedly provided with an inclined shift block 2071, and one side of the shift block 2071 is connected to the inner wall of the sleeve 207 through a second elastic member 2072. The shift block 2071 extends to the inside of the strip groove 2021, and the side wall of the guide shaft 202 is also connected to the heat conducting plate 30 through an elastic rope 204.

[0041] Initially, the piston plate 201 is located at one end of the cooling chamber away from the support plate 103, and the piston plate 201 is close to the water inlet pipe 101. At this time, the plurality of ring sleeves 401 are squeezed by the piston plate 201 and are close to each other, and the plurality of third elastic members 403 are in a compressed state. When the external pump group pumps the cooling water into the cooling chamber and pushes the piston plate 201 to move along the cooling chamber, the piston plate 201 drives the sleeve 207 to slide along the outside of the guide shaft 202, and the shifting block 2071 on the inner wall of the sleeve 207 slides along the inside of the strip groove 2021. At the same time, the third elastic member 403 pushes the ring sleeve 401 so that the plurality of ring sleeves 401 slide along the outside of the guide shaft 202 and move toward each other. When the shift block 2071 slides from the inside of the strip groove 2021 to the inside of the spiral groove 2022, the shift block 2071 can push the guide shaft 202 and drive the guide shaft 202 to rotate. When the guide shaft 202 rotates, the elastic rope 204 is stretched and wound around the outside of the guide shaft 202. When the triangular plate 206 on the sealing baffle 205 on one side of the piston plate 201 acts on the first column rod 104, the two sets of sealing baffles 205 slide synchronously along the side wall of the piston plate 201, thereby opening the through hole 2011. At the same time, the shift block 2071 slides out from the inside of the spiral groove 2022, and the restrictive effect of the shift block 2071 on the guide shaft 202 is released. Under the rebound and contraction effect of the elastic rope 204 When the guide shaft 202 rotates, the other several ring sleeves 401 are driven to rotate synchronously through a group of ring sleeves 401 fixedly connected thereto and the corresponding third elastic member 403, thereby driving several stirring rods 402 to rotate synchronously. At this time, several ring sleeves 401 are evenly spread out outside the guide shaft 202 under the support of the third elastic member 403. Therefore, when several stirring rods 402 rotate, the cooling water inside the cooling chamber can be stirred, so that the cooling water is fully in contact with the heat conducting plate 30, so as to improve the cooling effect of the power semiconductor device; when the through hole 2011 is opened, the first elastic member 203 pushes the piston plate 201 so that the piston plate 201 moves in the opposite direction along the inside of the cooling chamber, and the sleeve 207 slides in the opposite direction along the outside of the guide shaft 202, thereby driving the plurality of ring sleeves 401 to approach each other. When the sleeve 207 slides in the opposite direction along the outside of the guide shaft 202, the shift block 2071 whose inner wall is inclined is squeezed by the side wall of the guide shaft 202 and deflected toward the inner wall of the sleeve 207, and the second elastic member 2072 is compressed accordingly until the shift block 2071 passes over the spiral groove 2022 and moves above the strip groove 2021, at which time the second elastic member 2072 pushes the shift block 2071 to deflect in the opposite direction, and then re-extends into the inside of the strip groove 2021 and slides in the opposite direction along the inside of the strip groove 2021.

[0042] See also Figure 5In one embodiment, an annular groove 2023 is formed on the outside of the guide shaft 202 . The annular groove 2023 is located at one end of the spiral groove 2022 away from the strip groove 2021 and is connected to the spiral groove 2022 .

[0043] When the first column rod 104 acts on the triangular plate 206 and then pushes the two sets of sealing baffles 205 to slide along the piston plate 201 to open the through hole 2011, the shift block 2071 slides out from one end of the spiral groove 2022 and enters the annular groove 2023. At this time, the restricting effect of the shift block 2071 on the guide shaft 202 is released, and the guide shaft 202 rotates under the pulling action of the elastic rope 204, thereby driving the plurality of ring sleeves 401 and the plurality of stirring rods 402 to rotate synchronously to fully stir the cooling water; after the shift block 2071 enters the annular groove 2023, the first elastic member 203 can push the piston plate 201 and then drive the sleeve 207 to slide in the opposite direction along the outside of the guide shaft 202, and the tilted shift block 2071 is squeezed by the side wall of the annular groove 2023 and can be smoothly deflected toward the inner wall direction of the sleeve 207, so that the shift block 2071 can be smoothly disengaged from the spiral groove 2022.

[0044] In one embodiment, the first elastic member 203, the second elastic member 2072 and the third elastic member 403 may be springs or metal springs, which are not limited here.

[0045] In one embodiment, the elastic rope 204 can be a rubber rope or a silicone rope, which is not limited here.

[0046] See also Figure 1 In one embodiment, the drain pipe 102 passes through the side wall of the bottom shell 10 and the support plate 103, so that after the through hole 2011 on the piston plate 201 is opened, the cooling water located on the side of the piston plate 201 facing the water inlet pipe 101 can be smoothly discharged from the drain pipe 102 after passing through the through hole 2011.

[0047] In the embodiment of the present invention, when cooling the power semiconductor device, an external pump group (not shown in the figure) can be used to pump cooling water from the water inlet pipe 101 to the inside of the cooling chamber, so that the cooling water flows along the inside of the cooling chamber, and the circulated cooling water is then discharged from the drain pipe 102. In this process, the cooling water takes away the heat transferred from the power semiconductor device to the heat conducting plate 30, thereby realizing cooling and heat dissipation of the power semiconductor device; when the above-mentioned cooling water flows along the inside of the cooling chamber, on the one hand, the cooling water is slowed down by the deceleration component 20, thereby extending the flow time of the cooling water along the inside of the cooling chamber, thereby improving the heat exchange effect between the cooling water and the heat conducting plate 30, and improving the cooling effect of the power semiconductor device; on the other hand, the cooling water is stirred by the stirring component 40, so that the cooling water can be more fully in contact with the heat conducting plate 30, so as to further improve the cooling effect of the power semiconductor device. Compared with the prior art, the cooling water flowing through the inside of the cooling chamber can be slowed down and stirred, so that the cooling water can be in contact with the heat conducting plate 30 for a longer time and more fully, thereby improving the cooling effect of the power semiconductor device.

[0048] The preferred embodiments of the present invention are described in detail above, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in this field without departing from the purpose of the present invention.

Claims

1. A power semiconductor packaging cooling device, characterized in that: Including bottom shell, retarder assembly, heat conduction plate and stirring assembly, The heat conducting plate is fixedly mounted inside the bottom shell to provide support for the power semiconductor device. A cooling chamber is formed below the heat conducting plate, a water inlet pipe communicating with the cooling chamber is arranged on one side of the bottom shell, and a drain pipe communicating with the cooling chamber is arranged on the other side. The deceleration component and the stirring component are both arranged inside the cooling chamber. The deceleration component is used to decelerate the cooling water flowing through the cooling chamber. The stirring assembly is used to stir the cooling water flowing through the cooling chamber. A support plate is fixedly arranged at one end of the bottom shell. The deceleration assembly includes a piston plate, a guide shaft and a first elastic member. The piston plate is movably arranged inside the cooling chamber, the end of the guide shaft is connected to the inner wall of the bottom shell, the guide shaft passes through the piston plate and movably cooperates with the piston plate, one end of the first elastic member is connected to the support plate, and the other end is connected to the piston plate, so as to provide elastic support for the piston plate. The piston plate is provided with a through hole and a slide groove, and sealing baffles are provided on opposite sides of the piston plate. The two sets of sealing baffles are connected by a connecting rod, and the connecting rod passes through the slide groove and can slide inside the slide groove. A triangular plate is fixedly provided on the side away from each other of the two sets of sealing baffles. A first column and a second column are fixedly arranged at the bottom of the inner side of the bottom shell, and the first column and the second column are respectively located on both sides of the piston plate. The stirring assembly includes a ring sleeve, a stirring rod and a third elastic member. The ring sleeves are provided in a plurality of groups, and a plurality of the ring sleeves are arranged on the side of the piston plate facing the water inlet pipe, and a plurality of the ring sleeves are sequentially sleeved outside the guide shaft at intervals, and a plurality of the stirring rods are fixedly provided on the outer wall of each group of the ring sleeves, and two adjacent groups of the ring sleeves are connected by a group of the third elastic member, wherein the group of the ring sleeves closest to the water inlet pipe is fixedly connected to the guide shaft, and the remaining ring sleeves are slidably matched with the guide shaft, The guide shaft is rotatably matched with the inner wall of the bottom shell, and the side wall of the guide shaft is provided with a strip groove and a spiral groove, the strip groove is arranged along the length direction of the guide shaft, and one end of the spiral groove is connected with the strip groove. A sleeve is fixedly provided on the side wall of the piston plate, and the sleeve is sleeved on the outside of the guide shaft. An inclined shift block is hingedly provided on the inner wall of the sleeve, and one side of the shift block is connected to the inner wall of the sleeve through a second elastic member. The shift block extends to the inside of the strip groove, and the side wall of the guide shaft is also connected to the heat conduction plate through an elastic rope.

2. A power semiconductor packaging cooling device according to claim 1, characterized in that: An annular groove is provided on the outside of the guide shaft. The annular groove is located at one end of the spiral groove away from the strip groove and is communicated with the spiral groove.

3. A power semiconductor packaging cooling device according to claim 1, characterized in that: The first elastic member, the second elastic member and the third elastic member are springs or metal springs.

4. The power semiconductor packaging cooling device according to claim 1, characterized in that: The elastic rope is a rubber rope or a silicone rope.

5. The power semiconductor packaging cooling device according to claim 1, characterized in that: The drain pipe passes through the side wall of the bottom shell and the support plate.

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