Light-emitting device

Abstract

The invention discloses a light-emitting device, which comprises a light-emitting panel, a flexible circuit board, a light-emitting electrode, a light-emitting electrode, a light-emitting electrode and a light-emitting electrode, the second circuit structure layer comprises a fixed area and a suspended area, and the flexible circuit board comprises a first circuit structure layer; the fixed area of the second circuit structure layer is fixedly arranged on the non-light-emitting area of the light-emitting panel through the bonding layer, the suspended area does not make contact with the light-emitting panel, and the electrostatic protection unit is arranged on the surface, away from the light-emitting panel, of the suspended area; or, the fixed area of the second circuit structure layer is fixedly arranged on the first circuit structure layer through the bonding layer, the suspended area is arranged opposite to the first circuit structure layer and does not make contact with the first circuit structure layer, and the electrostatic protection unit is arranged on the surface, away from the first circuit structure layer, of the suspended area. The bending performance of the light-emitting device is not affected while it is guaranteed that good electrostatic protection is conducted on the display panel.

Description

Technical Field

[0001] The present invention relates to the field of organic light emitting technology, and in particular to a light emitting device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is a new type of display and lighting technology that is gradually being widely used. OLED has the risk of failure under the action of static electricity, so a stable anti-static method is needed. Summary of the invention

[0003] The present invention provides a light-emitting device, which provides an electrostatic protection unit in a non-light-emitting area of ​​a flexible circuit board or a light-emitting panel, thereby ensuring better electrostatic protection for the display panel without affecting the bending performance of the flexible circuit board and the light-emitting panel, and thus without affecting the bending performance of the light-emitting device.

[0004] According to one aspect of the present invention, there is provided a light emitting device, comprising:

[0005] A light-emitting panel, a flexible circuit board, a second circuit structure layer and an electrostatic protection unit;

[0006] The light-emitting panel includes a light-emitting area and a non-light-emitting area, and the light-emitting area includes a plurality of light-emitting units; the flexible circuit board is bonded to the non-light-emitting area; the second circuit structure layer includes a fixed area and a suspended area, and the flexible circuit board includes a first circuit structure layer; the electrostatic protection unit is used to provide electrostatic protection for the light-emitting unit;

[0007] The fixed area of ​​the second circuit structure layer is fixedly arranged on the non-luminous area of ​​the light-emitting panel through an adhesive layer, the suspended area is not in contact with the light-emitting panel, the electrostatic protection unit is arranged on the surface of the suspended area away from the light-emitting panel, and the electrostatic protection unit is electrically connected to the light-emitting unit through the second circuit structure layer; or, the fixed area of ​​the second circuit structure layer is fixedly arranged on the first circuit structure layer through an adhesive layer, the suspended area is arranged opposite to the first circuit structure layer, and the suspended area is not in contact with the first circuit structure layer, the electrostatic protection unit is arranged on the surface of the suspended area away from the first circuit structure layer, and the electrostatic protection unit is electrically connected to the light-emitting unit through the first circuit structure layer and the second circuit structure layer.

[0008] Optionally, the second circuit structure layer and the electrostatic protection unit are arranged on a side of the first circuit structure layer away from the light-emitting panel, or the second circuit structure layer and the electrostatic protection unit are arranged on a side of the first circuit structure layer adjacent to the light-emitting panel.

[0009] Optionally, the first circuit structure layer includes a first routing layer, a first flexible area, and a second flexible area, and the second circuit structure layer includes a second routing layer; a surface of the first flexible area has a first bonding pin, the first bonding pin is electrically connected to the first routing layer, and the first bonding pin is used for bonding connection with the light-emitting panel;

[0010] When the fixed area of ​​the second circuit structure layer is fixedly arranged on the first flexible area through the adhesive layer, the electrostatic protection unit is electrically connected to the first wiring layer through the second wiring layer, and the electrostatic protection unit is electrically connected to the light-emitting unit in the light-emitting panel through the first bonding pin;

[0011] When the second circuit structure layer is disposed in the non-luminous area, the electrostatic protection unit is electrically connected to the light-emitting unit in the light-emitting panel through the second wiring layer and the through holes in the bonding layer.

[0012] Optionally, the first circuit structure layer includes at least one sub-circuit layer, and each sub-circuit layer includes a first support layer and a first routing layer arranged on both sides of the first support layer;

[0013] The second circuit structure layer further includes a second supporting layer, and the second wiring layer is arranged on a surface of the second supporting layer.

[0014] Optionally, when the second circuit structure layer is arranged on the first circuit structure layer, the vertical projection of the suspended area on the first circuit structure layer is located within the second flexible area, and the distance between the edge of the suspended area away from the fixed area and the edge of the second flexible area away from the first flexible area is greater than zero.

[0015] Optionally, when the second circuit structure layer is disposed on the first circuit structure layer, the first bonding pin is disposed on an edge area of ​​the first flexible area away from the second flexible area;

[0016] An angle between a length direction of the electrostatic protection unit and a side of the second flexible region away from the first flexible region is smaller than a preset angle, wherein the preset angle is smaller than 90 degrees.

[0017] Optionally, the electrostatic protection unit includes at least one of a varistor, a capacitor, an ESD diode, a TVS diode and a fuse.

[0018] Optionally, in the suspended area, a reinforcement structure is provided on the surface of the second circuit structure layer, and the reinforcement structure and the electrostatic protection unit are provided on two surfaces opposite to the second circuit structure layer;

[0019] A first protective film is provided on the surface of the first circuit structure layer;

[0020] The second circuit structure layer is provided with a second protective film on its surface

[0021] Optionally, each light-emitting unit is correspondingly provided with at least one electrostatic protection unit, and the first electrode and the second electrode of the light-emitting unit are electrically connected to the first end and the second end of the corresponding electrostatic protection unit respectively.

[0022] Optionally, when the electrostatic protection unit includes a capacitor, the capacitance of the capacitor is greater than the equivalent capacitance of the light-emitting unit corresponding to the electrostatic protection unit;

[0023] The breakdown voltage of the capacitor is greater than a preset voltage;

[0024] The preset voltage V=a*100pf / (100pf+b), wherein a is the preset electrostatic voltage and b is the equivalent capacitance value of the light-emitting unit.

[0025] In the embodiment of the present invention, the electrostatic protection unit is arranged in the suspended area of ​​the second circuit structure layer, and the second circuit structure layer is arranged in the non-luminous area of ​​the light-emitting panel, and the suspended area is not in contact with the light-emitting panel, so that the suspended area and the electrostatic protection unit have no effect on the bending of the light-emitting panel and the bending of the light-emitting device. Alternatively, the second circuit structure layer is arranged in the first circuit structure layer, and the suspended area is not in contact with the first circuit structure layer, so that the suspended area has no effect on the bending of the first circuit structure layer, and the electrostatic protection unit has no effect on the bending performance of the flexible circuit board. Therefore, the electrostatic protection unit of the embodiment of the present invention does not affect the bending performance of the flexible circuit board and the bending performance of the light-emitting panel, and does not affect the bending performance of the light-emitting device while ensuring better electrostatic protection for the light-emitting panel.

[0026] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 is a schematic diagram of a light emitting device provided by an embodiment of the present invention.

[0029] Figure 2 yes Figure 1 Schematic diagram of a flexible circuit board.

[0030] Figure 3 is a schematic diagram of another light-emitting device provided by an embodiment of the present invention.

[0031] Figure 4 yes Figure 3 Side view of the light emitting device.

[0032] Figure 5 It is a side view of another light emitting device provided by an embodiment of the present invention.

[0033] Figure 6 It is a top view of a flexible circuit board provided by an embodiment of the present invention.

[0034] Figure 7 It is a schematic diagram of another flexible circuit board provided by an embodiment of the present invention.

[0035] Figure 8 It is a side view of another light emitting device provided by an embodiment of the present invention.

[0036] Fig. 9 It is a connection diagram of an electrostatic protection unit and a light-emitting unit provided in an embodiment of the present invention.

[0037] Fig.10 This is another schematic diagram of the connection between an electrostatic protection unit and a light-emitting unit provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0039] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0040] An embodiment of the present invention provides a light emitting device, including:

[0041] A light-emitting panel, a flexible circuit board, a second circuit structure layer and an electrostatic protection unit;

[0042] The light-emitting panel includes a light-emitting area and a non-light-emitting area, and the light-emitting area includes a plurality of light-emitting units; the flexible circuit board is bonded to the non-light-emitting area; the second circuit structure layer includes a fixed area and a suspended area, and the flexible circuit board includes a first circuit structure layer; the electrostatic protection unit is used to provide electrostatic protection for the light-emitting unit;

[0043] The fixed area of ​​the second circuit structure layer is fixedly arranged on the non-luminous area of ​​the light-emitting panel through an adhesive layer, the suspended area is not in contact with the light-emitting panel, the electrostatic protection unit is arranged on the surface of the suspended area away from the light-emitting panel, and the electrostatic protection unit is electrically connected to the light-emitting unit through the second circuit structure layer; or, the fixed area of ​​the second circuit structure layer is fixedly arranged on the first circuit structure layer through an adhesive layer, the suspended area is arranged opposite to the first circuit structure layer, and the suspended area is not in contact with the first circuit structure layer, the electrostatic protection unit is arranged on the surface of the suspended area away from the first circuit structure layer, and the electrostatic protection unit is electrically connected to the light-emitting unit through the first circuit structure layer and the second circuit structure layer.

[0044] In the embodiment of the present invention, the electrostatic protection unit is arranged in the suspended area of ​​the second circuit structure layer, and the second circuit structure layer is arranged in the non-luminous area of ​​the light-emitting panel, and the suspended area is not in contact with the light-emitting panel, so that the suspended area and the electrostatic protection unit have no effect on the bending of the light-emitting panel and the bending of the light-emitting device. Alternatively, the second circuit structure layer is arranged in the first circuit structure layer, and the suspended area is not in contact with the first circuit structure layer, so that the suspended area has no effect on the bending of the first circuit structure layer, and the electrostatic protection unit has no effect on the bending performance of the flexible circuit board. Therefore, the electrostatic protection unit of the embodiment of the present invention does not affect the bending performance of the flexible circuit board and the bending performance of the light-emitting panel, and does not affect the bending performance of the light-emitting device while ensuring better electrostatic protection for the light-emitting panel.

[0045] The present invention will be described below in conjunction with the specific drawings. Figure 1 is a schematic diagram of a light emitting device provided by an embodiment of the present invention, Figure 2 yes Figure 1 Schematic diagram of flexible circuit board, Figure 3 is a schematic diagram of another light emitting device provided by an embodiment of the present invention, Figure 4 yes Figure 3 Side view of the light emitting device, see Figure 1-Figure 4 , the light emitting device comprises:

[0046] A light emitting panel 200, a flexible circuit board 100, a second circuit structure layer 20 and an electrostatic protection unit 30;

[0047] The light-emitting panel 200 includes a light-emitting area 210 and a non-light-emitting area 220, and the light-emitting area 210 includes a plurality of light-emitting units 110; the flexible circuit board 200 is bonded to the non-light-emitting area 220; the second circuit structure layer 20 includes a fixed area 201 and a suspended area 202, and the flexible circuit board 200 includes a first circuit structure layer 10; the electrostatic protection unit 30 is used to perform electrostatic protection on the light-emitting unit 110;

[0048] refer to Figure 3 and Figure 4 , the fixed area 201 of the second circuit structure layer 20 is fixedly arranged on the non-luminous area 220 of the light-emitting panel 200 through the adhesive layer 40, the suspended area 201 is not in contact with the light-emitting panel 200, the electrostatic protection unit 30 is arranged on the surface of the suspended area 201 away from the light-emitting panel 200, and the electrostatic protection unit 30 is electrically connected to the light-emitting unit 110 through the second circuit structure layer 20; or, refer to Figure 1 and Figure 2 The first circuit structure layer 10 includes a first flexible area 101 and a second flexible area 102. The fixed area 201 of the second circuit structure layer 20 is fixedly arranged on the first flexible area 101 through an adhesive layer 40. The suspended area 202 is arranged opposite to the second flexible area 102, and the suspended area 202 is not in contact with the second flexible area 102. The electrostatic protection unit 30 is arranged on the surface of the suspended area 202 away from the first circuit structure layer 10. The electrostatic protection unit 30 is electrically connected to the light-emitting unit 110 through the first circuit structure layer 10 and the second circuit structure layer 20.

[0049] The electrostatic protection unit 30 is used to provide electrostatic protection to the light-emitting unit 110 on the light-emitting panel 200 to prevent electrostatic damage to the light-emitting unit 110. The electrostatic protection unit 30 can be provided on the surface of the second circuit structure layer 20 in the form of a patch. The electrostatic protection unit 30 can include at least one of a varistor, a capacitor, an ESD diode, a TVS diode, and a fuse.

[0050] The adhesive layer 40 may be a film layer such as a prepreg that can bond the first circuit structure layer 10 and the second circuit structure layer 20 together or bond the second circuit structure layer 20 to the surface of the light-emitting panel 200. The size of the second circuit structure layer 20 is the same as that of the first circuit structure layer 10, or the size of the second circuit structure layer 20 is smaller than that of the first circuit structure layer 10. Exemplarily, along the direction from the first flexible area 101 to the second flexible area 102, the length of the second circuit structure layer 20 is smaller than the length of the first circuit structure layer 10.

[0051] Since the electrostatic protection unit 30 with stable protection performance has a certain hardness, by setting the electrostatic protection unit 30 in the suspended area 202, the suspended area 202 does not contact the second flexible area 102, so that the suspended area 202 does not affect the bending of the second flexible area 102, and the electrostatic protection unit 30 does not affect the bending of the flexible circuit board. Alternatively, by setting the suspended area 202 not to contact the light-emitting panel 200, the suspended area 202 does not affect the bending of the light-emitting panel 200.

[0052] In the embodiment of the present invention, the electrostatic protection unit 30 is arranged in the suspended area 202 of the second circuit structure layer 20, and the second circuit structure layer 20 is arranged in the non-luminous area 220 of the light-emitting panel 200, and the suspended area 202 is not in contact with the light-emitting panel 200, so that the suspended area 202 and the electrostatic protection unit 30 do not affect the bending of the light-emitting panel 200, and do not affect the bending of the light-emitting device. Alternatively, the second circuit structure layer 20 is arranged in the first flexible area 102 of the first circuit structure layer 10, and the suspended area 202 is not in contact with the second flexible area 102, so that the suspended area 202 does not affect the bending of the second flexible area 102, and the electrostatic protection unit 30 does not affect the bending performance of the flexible circuit board. Therefore, the electrostatic protection unit 30 of the embodiment of the present invention does not affect the bending performance of the flexible circuit board and the bending performance of the light-emitting panel 200, and does not affect the bending performance of the light-emitting device while ensuring better electrostatic protection for the light-emitting panel 200.

[0053] Figure 5 is a side view of another light emitting device provided by an embodiment of the present invention. Based on the above embodiment, optionally, refer to Figure 1 , the second circuit structure layer 20 and the electrostatic protection unit 30 are arranged on a side of the first circuit structure layer 10 away from the light emitting panel 200, or, referring to Figure 5 The second circuit structure layer 20 and the electrostatic protection unit 30 are arranged on a side of the first circuit structure layer 10 adjacent to the light emitting panel 200 .

[0054] Specifically, the specific positions of the second circuit structure layer 20 and the electrostatic protection unit 30 can be set according to the bending requirements of the flexible circuit board 100 .

[0055] Based on the above embodiment, optionally, refer to Figure 2 and Figure 4 The first circuit structure layer 10 includes a first wiring layer 11, and the second circuit structure layer 20 includes a second wiring layer 21; the surface of the first flexible area 101 has a first bonding pin 50, the first bonding pin 50 is electrically connected to the first wiring layer 11, and the first bonding pin 50 is used for bonding with the light-emitting panel;

[0056] refer to Figure 1 and Figure 2 When the second circuit structure layer 20 is disposed in the first flexible area 101 , the electrostatic protection unit 30 is electrically connected to the first wiring layer 11 through the second wiring layer 21 ; the electrostatic protection unit 30 is electrically connected to the light-emitting unit 110 in the light-emitting panel 200 through the first bonding pin 50 .

[0057] refer to Figure 3 and Figure 4 When the second circuit structure layer 20 is disposed in the non-luminous area 220 , the electrostatic protection unit 30 is electrically connected to the light-emitting unit 110 in the light-emitting panel 200 through the second wiring layer 21 and the through hole 41 in the adhesive layer 40 .

[0058] The first circuit structure layer 10 may include one, two or more first wiring layers 11. The second circuit layer 20 may include one, two or more second wiring layers 21. The second circuit structure layer 20 is used to set the electrostatic protection unit 30, and the electrostatic protection unit 30 is electrically connected to the wiring in the second wiring layer 21.

[0059] refer to Figure 1 and Figure 2 When the second circuit structure layer 20 is disposed in the first flexible area 101, the second wiring layer 21 is electrically connected to the wiring in the first wiring layer 11, the electrostatic protection unit 30 is electrically connected to the first bonding pin 50 through the second wiring layer 21 and the first wiring layer 11, the first bonding pin 50 is electrically connected to the second bonding pin 120 on the surface of the light-emitting panel 200, and the second bonding pin 120 is electrically connected to the light-emitting unit 110. The first wiring layer 11 is also used to connect the driving circuit, receive the driving signal sent by the driving circuit, and transmit the driving signal to the light-emitting panel 200 to drive the light-emitting unit 110 in the light-emitting panel 200 to emit light.

[0060] refer to Figure 3 and Figure 4 When the second circuit structure layer 20 is arranged in the non-luminous area 220, the through hole 41 in the adhesive layer 40 can be filled with a conductive material, and the second wiring layer 21 and the conductive material in the through hole 41 are electrically connected to the pins on the surface of the light-emitting panel 200, thereby realizing the electrical connection between the electrostatic protection unit 30 and the light-emitting unit 110.

[0061] In addition, the traces on different layers can be electrically connected through vias. The first bonding pin 50 can be disposed on the surface of the first flexible region 101 away from the second circuit structure layer 20 , or on the surface of the first flexible region 101 adjacent to the second circuit structure layer 20 .

[0062] On the basis of the above embodiment, optionally, the first circuit structure layer 10 includes at least one sub-circuit layer 60, each sub-circuit layer 60 includes a first support layer 61, and a first routing layer 11 arranged on both sides of the first support layer 61;

[0063] The second circuit structure layer 20 further includes a second supporting layer 22 , and the second wiring layer 21 is disposed on the surface of the second supporting layer 22 .

[0064] Specifically, the first support layer 61 and the second support layer 22 are both flexible layers. The first circuit structure layer 10 may include one, two or more sub-circuit layers 60, each sub-circuit layer 60 includes a first support layer 61 and one or two first wiring layers 11, the first wiring layer 11 is arranged on the surface of the first support layer 61, and when the sub-circuit layer 60 includes two first wiring layers 11, the two first wiring layers 11 are arranged on two opposite surfaces of the first support layer 60.

[0065] The second wiring layer 21 is used to connect the electrostatic protection unit 30 and the first wiring layer 11, or to connect the electrostatic protection unit 30 and the light-emitting panel 200. The second circuit structure layer 20 may include one, two or more second wiring layers 21. When the second circuit structure layer 20 includes two second wiring layers 21, the two second wiring layers 21 are arranged on two opposite surfaces of the second support layer 22.

[0066] Based on the above embodiment, optionally, refer to Figure 2 , when the second circuit structure layer 20 is disposed on the first flexible area 101, the vertical projection of the suspended area 202 on the first circuit structure layer 10 is located in the second flexible area 102, and the distance between the edge of the suspended area 202 away from the fixed area 201 and the edge of the second flexible area 102 away from the first flexible area 101 is greater than zero. That is, along the direction from the first flexible area 101 to the second flexible area 102, the size of the suspended area 202 is smaller than the size of the second flexible area 102.

[0067] Specifically, the size of the suspended area 202 can be adjusted according to the space required for setting the electrostatic protection unit 30. The vertical projection of the suspended area 202 on the first circuit structure layer 10 is located in the second flexible area 102, and the distance between the edge of the suspended area 202 away from the fixed area 201 and the edge of the second flexible area 102 away from the first flexible area 101 is greater than zero, so that when the second flexible area 101 bends toward the side adjacent to the suspended area 202 and toward the side away from the suspended area 202, the suspended area 202 will not affect the bending performance of the second flexible area 101, and the suspended area 202 is small in size and is not prone to large deformation, which can avoid large deformation and cause the electrostatic protection unit 30 to fall off.

[0068] Figure 6 is a top view of a flexible circuit board provided by an embodiment of the present invention. Figure 2 , Figure 5 and Figure 6Optionally, when the second circuit structure layer 20 is arranged in the first flexible area 101, the first bonding pin 50 is arranged in the edge area of ​​the first flexible area 101 away from the second flexible area 102; the angle between the length direction of the electrostatic protection unit 30 and the edge 203 of the second flexible area 102 away from the first flexible area 101 is less than a preset angle, wherein the preset angle is less than 90 degrees.

[0069] Specifically, the first bonding pin 50 is arranged at the edge area of ​​the first flexible area 101 away from the second flexible area 102. After the first bonding pin 50 is bonded to the light-emitting panel, the end of the second flexible area 102 away from the first flexible area 101 is a bent free end. When the second flexible area 102 is bent, the second flexible area 102 is bent around an axis parallel to the side 203 of the second flexible area 102 away from the first flexible area 101, and the side 203 of the second flexible area 102 away from the first flexible area 101 moves as a whole without deformation. The length direction of the electrostatic protection unit 30 is relatively large. When the second flexible area 102 is bent, the suspended area 202 will also bend to a certain extent under the drive of the second flexible area 102. If the suspended area 202 is bent, the long side of the electrostatic protection unit 30 is subjected to a large bending stress, and the electrostatic protection unit 30 is easily separated from the second circuit structure layer 20, affecting the electrostatic protection performance of the electrostatic protection unit 30.

[0070] By setting the angle between the length direction of the electrostatic protection unit 30 and the side 203 of the second flexible area 102 away from the first flexible area 101 to be smaller than the preset angle, when the flexible circuit board is bent, the long side of the electrostatic protection unit 30 is subjected to a smaller bending force, thereby improving the connection stability between the electrostatic protection unit 30 and the second circuit structure layer 20. For example, refer to Figure 2 When the angle between the length direction of the electrostatic protection unit 30 and the side 203 of the second flexible area 102 away from the first flexible area 101 is 0, when the flexible circuit board is bent, the short side of the electrostatic protection unit 30 is subjected to bending force, and the bending force on the long side is 0.

[0071] On the basis of the above embodiment, optionally, the electrostatic protection unit 30 includes at least one of a varistor, a capacitor, an ESD diode, a TVS diode and a fuse.

[0072] Specifically, the varistor, capacitor, ESD diode, TVS diode and fuse can all withstand large electrostatic voltage. By setting the electrostatic protection unit 30 to include at least one of the varistor, capacitor, ESD diode, TVS diode and fuse, when the light-emitting panel is subjected to large static electricity, the electrostatic protection unit 30 can consume and release the static electricity to prevent static electricity from damaging the light-emitting unit.

[0073] Figure 7is a schematic diagram of another flexible circuit board provided by an embodiment of the present invention, Figure 8 FIG. 1 is a side view of another light emitting device provided by an embodiment of the present invention. Figure 7 and Figure 8 In the suspended area 202 , a reinforcement structure 70 is disposed on the surface of the second circuit structure layer 202 , and the reinforcement structure 70 and the electrostatic protection unit 30 are disposed on two surfaces opposite to the second circuit structure layer 20 .

[0074] Specifically, the reinforcement structure 70 is used to enhance the strength of the structure of the suspended area 202 to prevent the suspended area 202 from being greatly deformed, thereby preventing the ESD protection unit 30 from warping or falling off.

[0075] On the basis of the above embodiment, optionally, a first protective film 81 is disposed on the surface of the first circuit structure layer 10 ; and a second protective film 82 is disposed on the surface of the second circuit structure layer 20 .

[0076] Among them, the first protective film 81 is used to protect the first circuit structure layer 10, and the second protective film 82 is used to protect the second circuit structure layer 20. The first protective film 81 and the second protective film 82 can both be flexible films. The first protective film 81 and the second protective film 82 can be made of organic materials, and PI and other organic materials can be used as examples.

[0077] Fig. 9 is a schematic diagram of a connection between an electrostatic protection unit and a light-emitting unit provided by an embodiment of the present invention, Fig.10 is a schematic diagram of another connection between an electrostatic protection unit and a light emitting unit provided by an embodiment of the present invention. Fig. 9 and Fig.10 Each light-emitting unit 110 is correspondingly provided with at least one electrostatic protection unit 30, and the first electrode and the second electrode of the light-emitting unit 110 are electrically connected to the first end and the second end of the corresponding electrostatic protection unit respectively.

[0078] Specifically, the light-emitting unit 110 is connected in parallel with the electrostatic protection unit 30. When static electricity acts on the light-emitting panel, the static electricity is absorbed by the electrostatic protection unit 30 and will not damage the light-emitting unit 110. Exemplarily, when the electrostatic protection unit 30 is a TVS diode 31, when there is large static electricity, the static electricity is preferentially absorbed by the TVS diode 31 and will not affect the light-emitting unit 110. When the electrostatic protection unit 30 is a capacitor 32, when there is large static electricity, the static electricity is preferentially absorbed by the capacitor 32 and will not affect the light-emitting unit 110.

[0079] Optionally, when the electrostatic protection unit 30 includes a capacitor 32, the capacitance of the capacitor 32 is greater than the equivalent capacitance of the light-emitting unit 110 corresponding to the electrostatic protection unit 30;

[0080] The breakdown voltage of capacitor 32 is greater than the preset voltage;

[0081] The preset voltage V=a*100pf / (100pf+b), wherein a is the preset electrostatic voltage, and b is the equivalent capacitance value of the light emitting unit 110 .

[0082] Among them, the preset voltage V is the minimum breakdown voltage that the equivalent capacitance of the light-emitting unit 110 needs to meet when the preset electrostatic voltage a acts on the light-emitting unit 110. The capacitance of the capacitor 32 is set to be greater than the equivalent capacitance of the light-emitting unit 110 corresponding to the electrostatic protection unit 30. The breakdown voltage of the capacitor 32 is greater than the preset voltage, ensuring that the capacitor 32 can withstand the preset electrostatic voltage without being broken down, so that the capacitor 32 can better protect the light-emitting unit 110. The preset electrostatic voltage can be the voltage required by JESD22-A114. Exemplarily, a is 10kv and b is 4.7nF, then the breakdown voltage of the capacitor 32 is greater than the required 208.33V.

[0083] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0084] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A light emitting device, characterized in that: include: A light-emitting panel, a flexible circuit board, a second circuit structure layer and an electrostatic protection unit; The light-emitting panel includes a light-emitting area and a non-light-emitting area, and the light-emitting area includes a plurality of light-emitting units; the flexible circuit board is bonded to the non-light-emitting area; the second circuit structure layer includes a fixed area and a suspended area, and the flexible circuit board includes a first circuit structure layer; the electrostatic protection unit is used to provide electrostatic protection for the light-emitting unit; The fixed area of ​​the second circuit structure layer is fixedly arranged on the non-luminous area of ​​the light-emitting panel through an adhesive layer, the suspended area is not in contact with the light-emitting panel, the electrostatic protection unit is arranged on the surface of the suspended area away from the light-emitting panel, and the electrostatic protection unit is electrically connected to the light-emitting unit through the second circuit structure layer; or, the fixed area of ​​the second circuit structure layer is fixedly arranged on the first circuit structure layer through an adhesive layer, the suspended area is arranged opposite to the first circuit structure layer, and the suspended area is not in contact with the first circuit structure layer, the electrostatic protection unit is arranged on the surface of the suspended area away from the first circuit structure layer, and the electrostatic protection unit is electrically connected to the light-emitting unit through the first circuit structure layer and the second circuit structure layer.

2. The light emitting device according to claim 1, characterized in that: The second circuit structure layer and the electrostatic protection unit are arranged on a side of the first circuit structure layer away from the light-emitting panel, or the second circuit structure layer and the electrostatic protection unit are arranged on a side of the first circuit structure layer adjacent to the light-emitting panel.

3. The light emitting device according to claim 1, characterized in that: The first circuit structure layer includes a first routing layer, a first flexible area and a second flexible area, and the second circuit structure layer includes a second routing layer; a surface of the first flexible area has a first bonding pin, the first bonding pin is electrically connected to the first routing layer, and the first bonding pin is used for bonding connection with the light-emitting panel; When the fixed area of ​​the second circuit structure layer is fixedly arranged on the first flexible area through the adhesive layer, the electrostatic protection unit is electrically connected to the first wiring layer through the second wiring layer, and the electrostatic protection unit is electrically connected to the light-emitting unit in the light-emitting panel through the first bonding pin; When the second circuit structure layer is disposed in the non-luminous area, the electrostatic protection unit is electrically connected to the light-emitting unit in the light-emitting panel through the second wiring layer and the through holes in the bonding layer.

4. The light emitting device according to claim 3, characterized in that: The first circuit structure layer includes at least one sub-circuit layer, each sub-circuit layer includes a first support layer and a first routing layer arranged on both sides of the first support layer; The second circuit structure layer further includes a second supporting layer, and the second wiring layer is arranged on a surface of the second supporting layer.

5. The light emitting device according to claim 3, characterized in that: When the second circuit structure layer is arranged on the first circuit structure layer, the vertical projection of the suspended area on the first circuit structure layer is located in the second flexible area, and the distance between the edge of the suspended area away from the fixed area and the edge of the second flexible area away from the first flexible area is greater than zero.

6. The light emitting device according to claim 3, characterized in that: When the second circuit structure layer is disposed on the first circuit structure layer, the first bonding pin is disposed at an edge area of ​​the first flexible area away from the second flexible area; An angle between a length direction of the electrostatic protection unit and a side of the second flexible region away from the first flexible region is smaller than a preset angle, wherein the preset angle is smaller than 90 degrees.

7. The light emitting device according to claim 1, characterized in that: The electrostatic protection unit includes at least one of a varistor, a capacitor, an ESD diode, a TVS diode and a fuse.

8. The light emitting device according to claim 1, characterized in that: In the suspended area, a reinforcement structure is disposed on the surface of the second circuit structure layer, and the reinforcement structure and the electrostatic protection unit are disposed on two surfaces opposite to the second circuit structure layer; A first protective film is provided on the surface of the first circuit structure layer; A second protective film is disposed on the surface of the second circuit structure layer.

9. The light emitting device according to claim 1, characterized in that: Each light-emitting unit is correspondingly provided with at least one electrostatic protection unit, and the first electrode and the second electrode of the light-emitting unit are electrically connected to the first end and the second end of the corresponding electrostatic protection unit respectively.

10. The light emitting device according to claim 1, characterized in that: When the electrostatic protection unit includes a capacitor, the capacitance of the capacitor is greater than the equivalent capacitance of the light-emitting unit corresponding to the electrostatic protection unit; The breakdown voltage of the capacitor is greater than a preset voltage; The preset voltage V=a*100pf / (100pf+b), wherein a is the preset electrostatic voltage and b is the equivalent capacitance value of the light-emitting unit.

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