Electronic device including heat pipe surrounding plurality of integrated circuits

Abstract

An electronic device is provided. The electronic device may include a printed circuit board (PCB) including a first surface and a second surface opposite the first surface. The electronic device may include a processor on the second surface. The electronic device may include a heat sink on the second surface in partial contact with the processor. The electronic device may include a first integrated circuit (IC) on the first surface. The electronic device may include a second IC on the first surface spaced apart from the first IC. The electronic device may include a heat pipe including: a first portion surrounding the first IC and the second IC when the first surface is viewed in a second direction opposite to a first direction to which the first surface faces; and a second portion extending from the first portion to the heat sink.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including a heat pipe surrounding a plurality of integrated circuits (ICs). Background Art

[0002] The electronic device may include a plurality of components. When providing services through the electronic device, a portion of the plurality of components may have a higher temperature than other portions of the plurality of components. For example, the electronic device may include a radiating structure to reduce the temperature of a portion of the plurality of components.

[0003] The above information is presented as background information only to assist with understanding the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above may be applicable as prior art with respect to the present disclosure. Summary of the invention

[0004] Technical Solution

[0005] An electronic device is provided. The electronic device may include a printed circuit board (PCB), the printed circuit board (PCB) including a first surface and a second surface opposite to the first surface. The electronic device may include a processor on the second surface. The electronic device may include a heat sink on the second surface that partially contacts the processor. The electronic device may include a first integrated circuit (IC) on the first surface. The electronic device may include a second IC on the first surface that is spaced apart from the first IC. The electronic device may include a heat pipe, the heat pipe including: a first portion on the first surface, connected to the first IC and the second IC, respectively, when the first surface is viewed in a second direction opposite to the first direction faced by the first surface, the first portion surrounds the first IC and the second IC; and a second portion extending from the first portion to the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0007] Figure 1 An environment including exemplary electronic devices is shown.

[0008] Figure 2a is a perspective view of an exemplary electronic device.

[0009] Figure 2b is an exploded perspective view of an exemplary electronic device.

[0010] Figure 3 An example of a relative positional relationship between each of the ICs and the heat pipe on a first surface of a printed circuit board (PCB) is shown.

[0011] Figure 4 An example of controlling a fan in an exemplary electronic device is shown.

[0012] Figure 5 An example of an interposed metal plate between an IC and a mesh plate on a PCB is shown.

[0013] Figure 6 and Figure 7 An example of a heat pipe including portions surrounding a first IC, a second IC, and a third IC is shown.

[0014] Figure 8 An example of a plurality of mesh panels spaced apart from one another is shown.

[0015] Fig. 9 is a block diagram of an electronic device in a network environment according to various embodiments.

[0016] Throughout the drawings, it should be noted that like reference numbers are used to depict the same or similar elements, features, and structures. DETAILED DESCRIPTION

[0017] Figure 1 An environment including exemplary electronic devices is shown.

[0018] Reference Figure 1 , the environment 150 may include the electronic device 100. For example, the electronic device 100 may be used to provide virtual reality, augmented reality, mixed reality, extended reality, or alternative reality. For example, the electronic device 100 worn on a part of the body (e.g., the head) of the user 110 may be a means or interface for applying the activities of the user 110 in the environment 150 to the virtual environment provided by the electronic device 100 or the environment 150 displayed by the electronic device 100. For example, the electronic device 100 may display an image 130 corresponding to the environment 150 displayed by the electronic device 100 through the display of the electronic device 100. For example, the image 130 may include a visual object 135 corresponding to a real object 120 in the environment 150. For example, the image 130 may be acquired by a camera of the electronic device 100. For example, the electronic device 100 may display an image 140 for a virtual environment that is different from the environment 150 and is acquired by a processor of the electronic device 100. The electronic device 100 wearable on a part of the body of the user 110 may be displayed by Figure 2a and Figure 2b Shown.

[0019] Figure 2a is a perspective view of an exemplary electronic device.

[0020] Figure 2b is an exploded perspective view of an exemplary electronic device.

[0021] Reference Figure 2a and Figure 2b The electronic device 100 may include a housing 210, a shell 230 (or a lens barrel 230) arranged relative to the housing 210, at least one display 240 arranged relative to the shell 230, a printed circuit board (PCB) 250 and / or a bracket 260 arranged relative to the PCB 250.

[0022] The housing 210 may form or define at least a portion of an outer surface of the electronic device 100. For example, the housing 210 may include various components of the electronic device 100.

[0023] For example, the housing 210 may include a first surface 210a, a second surface 210b, and a third surface 210c between the first surface 210a and the second surface 210b. For example, when the electronic device 100 is worn, the first surface 210a may face a part of the body. For example, the second surface 210b opposite to the first surface 210a may be spaced apart from the first surface 210a. For example, the direction facing the second surface 210b (e.g., +z direction) may be opposite to the direction facing the first surface 210a (e.g., -z direction). For example, the direction facing the second surface 210b may correspond to the direction of gaze of the user 110 when wearing the electronic device 100. For example, the third surface 210c may extend from the first surface 210a to the second surface 210b.

[0024] For example, the housing 210 may include a first housing 211 and a second housing 212. For example, the first housing 211 may define or form a first surface 210a. For example, the first housing 211 may include a first hole 211a and a second hole 211b spaced apart from the first hole 211a. For example, the first hole 211a and the second hole 211b may be components for the housing 230. For example, the second housing 212 may define or form a second surface 210b. For example, a third surface 210c may be formed or defined by a connection between the first housing 211 and the second housing 212.

[0025] For example, the housing 210 may include a nose pad 213. For example, when the electronic device 100 is worn, the nose pad 213 may contact a part of the body (eg, the nose of the user 110). For example, the nose pad 213 may support the electronic device 100 in contact with a part of the body.

[0026] For example, the housing 210 may include at least one first inlet 214, at least one second inlet 215, and at least one outlet 216. For example, air from the outside of the electronic device 100 may flow into the inside of the electronic device 100 through the first inlet 214 and the second inlet 215. For example, air from the inside of the electronic device 100 may flow out of the electronic device 100 through the outlet 216. For example, the air flowing through the first inlet 214 and the second inlet 215 may flow out through the outlet 216. Examples of the path of air will be described later. Figure 5 Described in.

[0027] The housing 230 may be movably connected to the housing 210. For example, a portion 230a of the housing 230 may be disposed in the housing 210. For example, a portion 230a of the housing 230 may be connected to the display 240. For example, another portion 230b of the housing 230 may be exposed to the outside of the housing 210. For example, another portion 230b of the housing 230 may protrude. For example, another portion 230b of the housing 230 may protrude through the first hole 211a and the second hole 211b.

[0028] For example, the housing 230 may include a first flange 231 and a second flange 232. For example, the first flange 231 may be at least partially surrounded by the first hole 211a. For example, the second flange 232 may be at least partially surrounded by the second hole 211b.

[0029] For example, the housing 230 may include a lens 233. For example, the lens 233 may be used to refract light emitted from at least one display 240 to be described below. For example, the lens 233 may be connected to another portion 230b of the housing 230. For example, when the electronic device 100 is worn, the lens 233 may face a portion of the user's body (e.g., eyes). For example, the lens 233 may be included in each of the first flange 231 and the second flange 232.

[0030] For example, the housing 230 may include a pinion gear 222 having a plurality of teeth and a rack gear 234 having a plurality of teeth. For example, the rack gear 234 may be interlocked with the pinion gear 222. For example, the rack gear 234 may be disposed in a portion 230a of the housing 230. For example, the rack gear 234 may include a first rack gear 234a and a second rack gear 234b. For example, the first rack gear 234a may be connected to the first flange 231. For example, the second rack gear 234b may be connected to the second flange 232.

[0031] At least one display 240 may be used to display an image. For example, at least one display 240 may be connected to the PCB 250 via a flexible printed circuit board (FPCB) (not shown). For example, at least one display 240 may include a first display 241 and a second display 242. For example, the first display 241 may be fastened to the first flange 231 or disposed in the first flange 231. For example, the second display 242 may be fastened to the second flange 232 or disposed in the second flange 232. For example, the first display 241 and the second display 242 may be movable. For example, the distance between the first display 241 and the second display 242 may be changed according to the movement of the rack gear 234 interlocked to the pinion 222. For example, the distance between the first display 241 and the second display 242 may be set to a distance corresponding to the interpupillary distance of the user by the pinion 222 and the rack gear 234.

[0032] The PCB 250 may include a first surface 250a facing the bracket 260 and a second surface 250b opposite to the first surface 250a. For example, at least a portion of the first surface 250a and at least a portion of the second surface 250b may contact at least a portion of the bracket 260. For example, the second surface 250b may include an area 251 facing a heat sink 280 in the bracket 260 to be described below. For example, the area 251 of the second surface 250b may include a processor and a memory. However, the present disclosure is not limited thereto.

[0033] For example, the PCB 250 may include a plurality of circuits for functions executable within the electronic device 100. Figure 2a and Figure 2b ). For example, the multiple circuits may include multiple heat sources. For example, the temperature of each of the multiple heat sources may rise above a specific temperature while performing at least a portion of the function. For example, the multiple heat sources may include multiple integrated circuits (ICs) to be described below. For example, the multiple heat sources may include a processor and a memory. Examples of multiple heat sources will be described in detail below.

[0034] The bracket 260 may include a heat dissipation structure for reducing the temperature of multiple heat sources. For example, the heat dissipation structure may include a fan 270, a heat pipe 275, and a heat sink 280 connected to the heat pipe 275 and including a plurality of pins 281. For example, the heat dissipation structure including the fan 270, the heat pipe 275, and the heat sink 280 may be arranged relative to the PCB 250. The relative positional relationship between each of the multiple circuits in the PCB 250 and the fan 270, the relative positional relationship between each of the multiple circuits in the PCB 250 and the heat pipe 275, and the relative positional relationship between each of the multiple circuits in the PCB 250 and the heat sink 280 may be achieved by adjusting the heat dissipation structure of the PCB 250 to reduce the temperature of the multiple heat sources. Figure 3 The description is shown.

[0035] Figure 3 An example of a relative positional relationship between each of the ICs and the heat pipe on a first surface of a printed circuit board (PCB) is shown.

[0036] Reference Figure 3 , the first IC 351 among the plurality of ICs may be located on the first surface 250a of the PCB 250. For example, the first IC 351 may be included in the electronic device 100 to provide power to at least one display 240 located in front of the user's eyes when the electronic device 100 is worn by the user. However, the present disclosure is not limited thereto.

[0037] For example, the second IC 352 among the plurality of ICs may be located on the first surface 250a of the PCB 250. For example, the second IC 352 may be spaced apart from the first IC 351. For example, the second IC 352 may be included in the electronic device 100 to charge a rechargeable battery in the electronic device 100. For example, the second IC 352 may be included in the electronic device 100 to control a light emitting element included in the at least one display 240. However, the present disclosure is not limited thereto.

[0038] For example, processor 353 (e.g., Fig. 9 The processor 920 of the PCB 250 may be located on the second surface 250b of the PCB 250. For example, the heat sink 280 may be connected to the processor 353 to transfer heat from the processor 353. For example, the heat sink 280 may be at least partially located on the processor 353. For example, the heat sink 280 may be partially in contact with the processor 353. For example, the heat sink 280 may be located on the second surface 250b of the PCB 250. For example, another portion of the heat sink 280 (the portion is different from the portion of the heat sink 280 that contacts the processor 353) may be located on the second surface 250b of the PCB 250.

[0039] Figure 3 An example in which the processor 353 is disposed or in contact with the second surface 250b is shown, but this is for ease of explanation. The processor 353 may be in contact with the first surface 250a. When the processor 353 is in contact with the first surface 250a, the heat sink 280 may be partially in contact with the processor 353 and may be in contact with the first surface 250a. However, the present disclosure is not limited thereto.

[0040] For example, the heat pipe 275 may include a first portion 301 and a second portion 302. For example, the heat pipe 275 may further include a third portion 303.

[0041] For example, when the first surface 250a is viewed in a second direction (e.g., −z-axis direction) opposite to the first direction facing the first surface 250a, the heat pipe 275 may include a first portion 301 on the first surface 250a surrounding the first IC 351 and the second IC 352. For example, the first portion 301 may form a closed ring.

[0042] For example, the first portion 301 may be connected to each of the first IC 351 and the second IC 352. Figure 3 Unlike the illustration of FIG. 3 , the connection of the first portion 301 to each of the first IC 351 and the second IC 352 may include the first portion 301 being directly connected to each of the first IC 351 and the second IC 352. For example, the connection between the first portion 301 and each of the first IC 351 and the second IC 352 may include an indirect connection between the first portion 301 and each of the first IC 351 and the second IC 352 through another component (e.g., a heat transfer member). For example, Figure 3 As shown in , the connection between the first part 301 and each of the first IC 351 and the second IC 352 can be a connection between the first part 301 and each of the first IC 351 and the second IC 352 through the mesh plate 311 to be described below. However, the present disclosure is not limited to this. For example, when the mesh plate 311 is not included in the electronic device 100, each of the first IC 351 and the second IC 352 can be directly connected to the first part 301, or can be connected to the first part 301 by replacing another member of the mesh plate 311.

[0043] For example, since the first portion 301 forms a closed loop, the first portion 301 can provide a plurality of paths for transferring heat from each of the first IC 351 and the second IC 352 respectively connected to the first portion 301. For example, since the first portion 301 forms a closed loop, heat from each of the first IC 351 and the second IC 352 can be transferred not only along a path leading to the heat sink 280 but also along another path different from the path leading to the heat sink 280. For example, heat from each of the first IC 351 and the second IC 352 can be dissipated through the first portion 301.

[0044] For example, the heat pipe 275 may include a second portion 302 extending from the first portion 301 to the heat sink 280. For example, a portion of the second portion 302 may be located on the first surface 250a, and another portion of the second portion 302 may be located on the second surface 250b. However, the present disclosure is not limited thereto.

[0045] Figure 3An example is shown in which the first portion 301 extends to the second portion 302 through the third portion 303 to be described below, but this is for convenience of explanation. For example, when the third IC 363 on the first surface 250a is not included in the electronic device 100, the first portion 301 may be directly connected to the second portion 302. For example, the first portion 301 may be connected to the heat sink 280 through the second portion 302. However, the present disclosure is not limited thereto.

[0046] For example, the mesh plate 311 may be connected to the first portion 301. For example, the mesh plate 311 may be connected to the first portion 301 through a support member 367. For example, when the mesh plate 311 is viewed in the z-axis direction, the support member 367 may surround the mesh plate 311. However, the present disclosure is not limited thereto.

[0047] For example, the mesh plate 311 may contact on the first IC 351 spaced apart from the first portion 301. For example, a portion of the mesh plate 311 may contact on the first IC 351. For example, the first IC 351 spaced apart from the first portion 301 may be connected to the first portion 301 through the mesh plate 311.

[0048] For example, the mesh plate 311 may contact on the second IC 352 spaced apart from the first portion 301. For example, a portion of the mesh plate 311 may contact on the second IC 352. For example, the second IC 352 spaced apart from the first portion 301 may be connected to the first portion 301 through the mesh plate 311.

[0049] For example, when the blades ( Figure 3 When the first IC 351 and the second IC 352 are rotated, the mesh plate 311 contacting the first IC 351 and the second IC 352 may be located on or within the path of the air leading to the inlet 371 of the fan 270. Figure 3 Unlike the illustration shown in FIG. 2 , the fan 270 may be located on the first surface 250 a. For example, air may pass through the first surface 250 a based on the rotation of the blades. Figure 2a The first inlet 214 and / or the second inlet 215 flow from the outside of the electronic device 100 into the inside of the inlet 371. For example, the air flowing into the inside of the inlet 371 through the opening 350 in the PCB 250 can be blown through the outlet ( Figure 3 For example, the outlet of the fan 270 may face the heat sink 280. For example, the air may flow out of the electronic device 100 from the outlet of the fan 270 through the outlet 216. The path of the air will be through Figure 4 Shown.

[0050] For example, the first IC 351 and the second IC 352 in contact with the mesh plate 311 may be located on the air path. For example, since at least a portion of the first IC 351 and at least a portion of the second IC 352 are exposed to the air flowing into the inlet 371 along the path through the mesh plate 311, the first IC 351 and the second IC 352 may be cooled by the air contacted through the mesh plate 311 and the heat pipe 275. For example, the mesh plate 311 may help reduce the temperature of the first IC 351 and the second IC 352 through the air.

[0051] For example, the processor 353 may control the fan 270. For example, the processor 353 may control the fan 270 to rotate the blades. For example, the processor 353 may control the fan 270 according to the operating state of the electronic device 100. For example, the processor 353 may control the fan 270 according to the temperature inside the electronic device 100, the temperature of the first IC 351, and / or the temperature of the second IC 352. The fan 270 may be controlled by Figure 4 Shown.

[0052] Figure 4 An example of controlling a fan in an exemplary electronic device is shown.

[0053] Reference Figure 4 , the processor 353 can identify the operating status of the electronic device 100 related to the temperature inside the electronic device 100.

[0054] For example, the processor 353 may identify whether the operating state is a first operating state indicating that the temperature remains below the reference temperature or a second operating state indicating that the temperature can rise above the reference temperature. For example, the processor 353 may disable the fan 270 based on the first operating state, such as in state 400. For example, the processor 353 may enable the fan 270 based on the second operating state, such as in state 450. For example, according to the activation of the fan 270, air from outside the electronic device 100 may flow into the inlet 371 ( FIG. 3 ) through the opening 350 along the path 451 based on the rotation of the blades. Figure 4 For example, since air moves across the first IC 351 and the second IC 352 according to the rotation of the blades, the first IC 351 and the second IC 352 can be cooled by activation of the fan 270. For example, air moves across the first IC 351 and the second IC 352 to the inlet 371 ( Figure 4 Air (not shown) can flow out of the outlet of fan 270. For example, the air can move along path 452.

[0055] For example, the second operating state may include a first sub-operating state and a second sub-operating state. For example, the first sub-operating state may indicate that the temperature is maintained between a reference temperature and another reference temperature above the reference temperature. For example, the second sub-operating state may indicate that the temperature can rise above another reference temperature. For example, the processor 353 may change the rotation speed of the blades according to whether the operating state is the first sub-operating state or the second sub-operating state. For example, the processor 353 may control the fan 270 based on the first sub-operating state to rotate the blades at a first rotation speed. For example, the processor 353 may control the fan 270 based on the second sub-operating state to rotate the blades at a second rotation speed higher than the first rotation speed.

[0056] For example, a heat dissipation scheme for reducing the temperature of the first IC 351 and / or the second IC 352 based on a first operating state and a heat dissipation scheme for reducing the temperature of the first IC 351 and / or the second IC 352 based on a second operating state including a first sub-operating state and a second sub-operating state can be illustrated as shown in Table 1 below.

[0057] Table 1

[0058]

[0059] For example, the processor 353 may control the fan 270 based on data indicating a temperature inside the electronic device 100. For example, the data may be recognized by at least one temperature sensor included in the electronic device 100. For example, at least one temperature sensor may be arranged in the electronic device 100 for the first IC 351 and the second IC 352. For example, the processor 353 may disable the fan 270 based on data indicating that the temperature is below a reference temperature, as in state 400. For example, the processor 353 may enable the fan 270 based on data indicating that the temperature is above a reference temperature, as in state 450. For example, when another reference temperature is configured or set in the electronic device 100, the processor 353 may control the fan 270 to rotate the blades at a first speed based on data indicating that the temperature is greater than or equal to the reference temperature and less than another reference temperature, and control the fan 270 to rotate the blades at a second speed based on data indicating that the temperature is greater than or equal to another reference temperature.

[0060] Return to reference Figure 3 , the first IC 351 and the second IC 352 may be connected to the mesh plate 311 through another member or another plate. The other plate may be Figure 5 Shown in.

[0061] Figure 5 An example of an interposed metal plate between an IC and a mesh plate on a PCB is shown.

[0062] Reference Figure 5, the first metal plate 501 may be inserted between the first IC 351 and the mesh plate 311. For example, the first metal plate 501 may be located on the first IC 351, and the mesh plate 311 may be located on the first metal plate 501. For example, the direction from the first metal plate 501 to the first IC 351 and the direction from the first metal plate 501 to the mesh plate 311 may correspond to the -z axis direction. For example, the first metal plate 501 and the first IC 351 may be connected by another member. For example, a heat-conducting member may be inserted between the first metal plate 501 and the first IC 351. For example, the first metal plate 501 and the mesh plate 311 may be connected by another member. For example, a heat-conducting member may be inserted between the first metal plate 501 and the mesh plate 311. For example, the second metal plate 502 may be inserted between the second IC 352 and the mesh plate 311. For example, the second metal plate 502 may be located on the second IC 352, and the mesh plate 311 may be located on the second metal plate 502. For example, the second metal plate 502 and the second IC 352 may be connected by another member. For example, a thermally conductive member may be inserted between the second metal plate 502 and the second IC 352. For example, the second metal plate 502 and the mesh plate 311 may be connected by another member. For example, a thermally conductive member may be inserted between the second metal plate 502 and the mesh plate 311.

[0063] For example, the area where the first metal plate 501 contacts the first IC 351 may be greater than the area where the mesh plate 311 directly contacts the first IC 351. For example, the first metal plate 501 may be interposed between the first IC 351 and the mesh plate 311 to improve thermal conductivity from the first IC 351. However, the present disclosure is not limited thereto.

[0064] For example, the area where the second metal plate 502 contacts the second IC 352 may be larger than that in the case where the second metal plate 502 is not present (eg, Figure 3 ) The mesh plate 311 directly contacts the area on the second IC 352. For example, the second metal plate 502 may be interposed between the second IC 352 and the mesh plate 311 to improve the thermal conductivity from the second IC 352. However, the present disclosure is not limited thereto.

[0065] Return to reference Figure 3 , a third IC 363 among the plurality of ICs may be located on the first surface 250a of the PCB 250. For example, the third IC 363 may be spaced apart from the first IC 351 and the second IC 352. For example, the third IC 363 may be closer to the processor 353 than the first IC 351 and the second IC 352. For example, the third IC 363 may be included in the electronic device 100 to provide power to the processor 353. However, the present disclosure is not limited thereto.

[0066] For example, the third IC 363 may be located outside a closed ring formed by the first portion 301 surrounding the first IC 351 and the second IC 352. For example, the third IC 363 may be connected to the third portion 303 between the first portion 301 and the second portion 302.

[0067] For example, when the third IC 363 is spaced apart from the third portion 303 (or the heat pipe 275), the third IC 363 may be connected to another mesh plate 312. For example, the third IC 363 may be connected to the third portion 303 through another mesh plate 312. For example, another mesh plate 312 may contact on the third IC 363.

[0068] For example, another mesh plate 312 contacting the third IC 363 may be located in the path of air to the inlet 371 when the blades rotate (eg, Figure 4 on or in the path 451).

[0069] For example, the third IC 363 may be located in a closed ring formed by the first portion 301. The third IC 363 located in a closed ring together with the first IC 351 and the second IC 352 may be located by Figure 6 and Figure 7 Shown.

[0070] Figure 6 and Figure 7 An example of a heat pipe including portions surrounding a first IC, a second IC, and a third IC is shown.

[0071] Reference Figure 6 , when the first surface 250a is viewed in the second direction (e.g., the +z-axis direction), the heat pipe 275 may include a first portion 601 surrounding the first IC 351, the second IC 352, and the third IC 363. For example, the first portion 601 may be connected to each of the first IC 351, the second IC 352, and the third IC 363. For example, the heat pipe 275 may include a first portion 601 extending from the first portion 601 to the heat sink 280 ( Figure 6 The second part 602 is not shown in FIG.

[0072] For example, since the first portion 601 forms a ratio Figure 3 The closed loop formed by the first portion 301 is wider than the closed loop, and thus the first portion 601 may provide improved cooling performance compared to the first portion 301. However, the present disclosure is not limited thereto.

[0073] For example, each of the first IC 351, the second IC 352, and the third IC 363 may be connected to the first portion 601 through the mesh plate 611. For example, the mesh plate 611 may contact each of the first IC 351, the second IC 352, and the third IC 363 spaced apart from the first portion 601.

[0074] For example, the shape of the first portion 601 surrounding the first IC 351, the second IC 352, and the third IC 363 may be replaced with another shape. Figure 7 The heat pipe 275 may include a first portion 701 having a shape different from that of the first portion 601 and a heat sink 280 ( Figure 6 For example, since the first portion 701 forms a Figure 6 The closed loop formed by the first portion 601 is wider and includes a region 702 spaced apart from the first IC 351, the second IC 352, and the third IC 363, so the first portion 701 may provide improved performance compared to the first portion 601. However, the present disclosure is not limited thereto.

[0075] Return to reference Figure 3 , the PCB 250 may include a first region 391, a second region 392 spaced apart from the first region 391, and a third region 393 between the first region 391 and the second region 392 extending from the first region 391 to the second region 392. For example, the first IC 351 and the second IC 352 may be disposed on the first region 391 of the first surface 250a. For example, the processor 353 may be disposed on the third region 393 of the second surface 250b.

[0076] For example, among the plurality of ICs, a fourth IC 384 spaced apart from the first IC 351 and the second IC 352 and a fifth IC 385 spaced apart from the first IC 351, the second IC 352, and the fourth IC 384 may be disposed on the second region 392 of the first surface 250a. For example, when the first surface 250a is viewed in the second direction (e.g., the +z-axis direction), another heat pipe 380 connected to the heat sink 280 may include a fourth portion 381 on the first surface 250a surrounding the fourth IC 384 and the fifth IC 385. For example, another heat pipe 380 may include a fifth portion 382 extending from the fourth portion 381 to the heat sink 280.

[0077] For example, the fourth portion 381 may be connected to the fourth IC 384 and the fifth IC 385 spaced apart from the fourth portion 381 through the mesh plate 386. For example, the mesh plate 386 may partially contact the fourth IC 384 and the fifth IC 385. For example, when the blade rotates, the mesh plate 386 may be located in the path of the air leading to the inlet 371 (for example, Figure 4 on or within the path 451).

[0078] although Figure 3 353, but is interlocked with the processor 353 (e.g., Fig. 9 The memory 930 of the embodiment may be located on the second surface 250b. For example, the heat sink 280 may be partially in contact with the memory (eg, Fig. 9 For example, the processor 353 and the memory (e.g., Fig. 9 The memory 930) may be located at Figure 2b However, the present disclosure is not limited thereto.

[0079] For example, the mesh plate 311 may be replaced with a plurality of mesh plates spaced apart from each other. Figure 8 Shown in.

[0080] Figure 8 An example of a plurality of mesh panels spaced apart from one another is shown.

[0081] Reference Figure 8 , the mesh plate 311 may be replaced by a first mesh plate 801 and a second mesh plate 802 spaced apart from the first mesh plate 801. For example, the first mesh plate 801 may contact the first IC 351 spaced apart from the first portion 301. For example, the first IC 351 may be connected to the first portion 301 through the first mesh plate 801. For example, the second mesh plate 802 may contact the second IC 352 spaced apart from the first portion 301. For example, the second IC 352 may be connected to the first portion 301 through the second mesh plate 802.

[0082] The above example describes that the electronic device 100 is a wearable device on a part of the body of the user 110, but this is for ease of explanation. The electronic device 100 may be a portable device such as a smart phone, a tablet computer, or a notebook computer. For example, the electronic device 100 may include the electronic device 901 or the electronic device 902 shown in the following description.

[0083] Fig. 9 is a block diagram illustrating an electronic device 901 in a network environment 900 according to various embodiments. Fig. 9, the electronic device 901 in the network environment 900 may communicate with the electronic device 902 via a first network 998 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 904 or the server 908 via a second network 999 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 901 may communicate with the electronic device 904 via the server 908. According to an embodiment, the electronic device 901 may include a processor 920, a memory 930, an input module 950, a sound output module 955, a display module 960, an audio module 970, a sensor module 976, an interface 977, a connection terminal 978, a haptic module 979, a camera module 980, a power management module 988, a battery 989, a communication module 990, a user identification module (SIM) 996, or an antenna module 997. In some embodiments, at least one of the above components (e.g., the connection terminal 978) may be omitted from the electronic device 901, or one or more other components may be added to the electronic device 901. In some embodiments, some of the above-described components (eg, sensor module 976, camera module 980, or antenna module 997) may be implemented as a single integrated component (eg, display module 960).

[0084] The processor 920 may run, for example, software (e.g., program 940) to control at least one other component (e.g., hardware component or software component) of the electronic device 901 connected to the processor 920, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 920 may store commands or data received from another component (e.g., sensor module 976 or communication module 990) in the volatile memory 932, process the commands or data stored in the volatile memory 932, and store the resultant data in the non-volatile memory 934. According to an embodiment, the processor 920 may include a main processor 921 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 923 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 921 in operation. For example, when the electronic device 901 includes a main processor 921 and an auxiliary processor 923, the auxiliary processor 923 may be adapted to consume less power than the main processor 921, or adapted to be dedicated to a specific function. The auxiliary processor 923 may be implemented to be separate from the main processor 921, or to be implemented as part of the main processor 921.

[0085] When the main processor 921 is in an inactive (e.g., sleep) state, the auxiliary processor 923 (rather than the main processor 921) may control at least some of the functions or states related to at least one component among the components of the electronic device 901 (e.g., display module 960, sensor module 976, or communication module 990), or when the main processor 921 is in an active state (e.g., running an application), the auxiliary processor 923 may control at least some of the functions or states related to at least one component among the components of the electronic device 901 (e.g., display module 960, sensor module 976, or communication module 990) together with the main processor 921. According to an embodiment, the auxiliary processor 923 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 980 or a communication module 990) that is functionally related to the auxiliary processor 923. According to an embodiment, the auxiliary processor 923 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 901 where the artificial intelligence is executed or via a separate server (e.g., server 908). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0086] The memory 930 may store various data used by at least one component of the electronic device 901 (e.g., the processor 920 or the sensor module 976). The various data may include, for example, software (e.g., the program 940) and input data or output data for commands related thereto. The memory 930 may include a volatile memory 932 or a nonvolatile memory 934.

[0087] The program 940 may be stored as software in the memory 930 , and may include, for example, an operating system (OS) 942 , middleware 944 , or an application 946 .

[0088] The input module 950 may receive commands or data to be used by other components (e.g., the processor 920) of the electronic device 901 from outside (e.g., a user) of the electronic device 901. The input module 950 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0089] The sound output module 955 can output a sound signal to the outside of the electronic device 901. The sound output module 955 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive an incoming call. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0090] The display module 960 may visually provide information to the outside of the electronic device 901 (e.g., a user). The display module 960 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 960 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0091] The audio module 970 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 970 may obtain sound via the input module 950, or output sound via the sound output module 955 or an earphone of an external electronic device (e.g., electronic device 902) directly (e.g., wired) connected to the electronic device 901 or wirelessly connected thereto.

[0092] The sensor module 976 may detect an operating state (e.g., power or temperature) of the electronic device 901 or an environmental state (e.g., a state of a user) outside the electronic device 901, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 976 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0093] The interface 977 may support one or more specific protocols to be used to connect the electronic device 901 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 902). According to an embodiment, the interface 977 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0094] The connection end 978 may include a connector, wherein the electronic device 901 can be physically connected to an external electronic device (e.g., the electronic device 902) via the connector. According to an embodiment, the connection end 978 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0095] The haptic module 979 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 979 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0096] The camera module 980 may capture a still image or a moving image. According to an embodiment, the camera module 980 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0097] The power management module 988 may manage power supply to the electronic device 901. According to an embodiment, the power management module 988 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0098] The battery 989 may power at least one component of the electronic device 901. According to an embodiment, the battery 989 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0099] The communication module 990 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 901 and an external electronic device (e.g., electronic device 902, electronic device 904, or server 908), and perform communication via the established communication channel. The communication module 990 may include one or more communication processors capable of operating independently from the processor 920 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 990 may include a wireless communication module 992 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 994 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 998 (e.g., a short-range communication network such as Bluetooth TM The wireless communication module 992 may communicate with an external electronic device through a wireless communication network (e.g., a wireless fidelity (Wi-Fi) direct connection, or an infrared data association (IrDA)) or a second network 999 (e.g., a long-distance communication network such as a traditional cellular network, a fifth-generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 992 may identify and authenticate the electronic device 901 in a communication network (such as a first network 998 or a second network 999) using user information (e.g., an international mobile subscriber identity (IMSI)) stored in the user identification module 996.

[0100] The wireless communication module 992 can support 5G networks after the fourth generation (4G) network and next generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low latency communication (URLLC). The wireless communication module 992 can support high frequency bands (e.g., millimeter wave (mm wave) bands) to achieve, for example, high data transmission rates. The wireless communication module 992 can support various technologies for ensuring performance on high frequency bands, such as, for example, beamforming, massive multiple input multiple output (massive MIMO), full dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 992 can support various requirements specified in the electronic device 901, an external electronic device (e.g., electronic device 904), or a network system (e.g., a second network 999). According to an embodiment, the wireless communication module 992 may support a peak data rate for implementing eMBB (e.g., 20 gigabits per second (Gbps) or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0101] The antenna module 997 may transmit a signal or power to the outside of the electronic device 901 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 901 (e.g., an external electronic device). According to an embodiment, the antenna module 997 may include an antenna including a radiating element, and the radiating element is formed of a conductive material or a conductive pattern formed in a substrate (e.g., a printed circuit board (PCB)) or formed on a substrate. According to an embodiment, the antenna module 997 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 998 or the second network 999) may be selected from the plurality of antennas by, for example, the communication module 990 (e.g., the wireless communication module 992). Subsequently, a signal or power may be transmitted or received between the communication module 990 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as a part of the antenna module 997.

[0102] According to various embodiments, the antenna module 997 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0103] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0104] According to an embodiment, a command or data may be sent or received between the electronic device 901 and the external electronic device 904 via the server 908 connected to the second network 999. Each of the electronic device 902 or the electronic device 904 may be a device of the same type as the electronic device 901, or a device of a different type from the electronic device 901. According to an embodiment, all or some operations to be executed in the electronic device 901 may be executed in one or more of the external electronic device 902 or 904, or the server 908. For example, if the electronic device 901 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 901 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 901 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 901. The electronic device 901 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 901 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 904 may include an Internet of Things (IoT) device. The server 908 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 904 or the server 908 may be included in the second network 999. The electronic device 901 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0105] As described above, the electronic device 100 may include a printed circuit board (PCB) 250, the printed circuit board 250 including a first surface 250a and a second surface 250b opposite to the first surface 250a. The electronic device 100 may include a processor 353 on the second surface 250b. The electronic device 100 may include a heat sink 280 on the second surface 250b that partially contacts the processor 353. The electronic device 100 may include a first integrated circuit (IC) 351 on the first surface 250a. The electronic device 100 may include a second IC 352 on the first surface 250a that is spaced apart from the first IC 351. The electronic device 100 may include a heat pipe 275, which includes a first portion 301 and a second portion 302, wherein the first portion 301 is located on the first surface 250a and is connected to each of the first IC 351 and the second IC 352, and when the first surface 250a is observed in a second direction opposite to the first direction facing the first surface 250a, the first portion 301 surrounds the first IC 351 and the second IC 352, and the second portion 302 extends from the first portion 301 to the heat sink 280.

[0106] According to an embodiment, the electronic device 100 may include a mesh plate 311 respectively located on a first IC 351 and a second IC 352 spaced apart from the first portion 301. According to an embodiment, each of the first IC 351 and the second IC 352 may be connected to the first portion 301 through the mesh plate 311.

[0107] According to an embodiment, the electronic device 100 may include a fan 270 on the second surface, the fan 270 including an inlet 371, blades, and an outlet. According to an embodiment, the PCB 250 may include an opening 350 corresponding to the inlet 371. According to an embodiment, the fan 270 may be configured to make air from the outside of the electronic device 100 that flows into the inlet 371 through the opening 350 flow out through the outlet when the blade rotates. According to an embodiment, the first IC 351 and the second IC 352 on which the mesh plate 311 contacts may be located in the path of air that leads from the outside of the electronic device 100 to the inlet 371.

[0108] According to an embodiment, the outlet may face the heat sink 280 that is partially in contact with the processor 353 .

[0109] According to an embodiment, the processor 353 may be configured to disable the fan 270 based on an operating state of the electronic device 100 indicating that the temperature inside the electronic device 100 remains below a reference temperature. According to an embodiment, the processor 353 may be configured to enable the fan 270 based on an operating state indicating that the temperature can rise above the reference temperature.

[0110] According to an embodiment, the processor 353 may be configured to control the enabled fan 270 to rotate the blade at a first speed based on an operating state indicating that the temperature is maintained between a reference temperature and another reference temperature higher than the reference temperature. According to an embodiment, the processor 353 may be configured to control the enabled fan 270 to rotate the blade at a second speed higher than the first speed based on an operating state indicating that the temperature can rise above another reference temperature.

[0111] According to an embodiment, the processor 353 may be configured to disable the fan 270 based on the temperature inside the electronic device being less than a reference temperature. According to an embodiment, the processor 353 may be configured to enable the fan 270 based on the temperature being greater than or equal to a reference temperature.

[0112] According to an embodiment, the processor 353 may be configured to control the enabled fan 270 to rotate the blades at a first speed based on the temperature being greater than or equal to the reference temperature and less than another reference temperature that is higher than the reference temperature. According to an embodiment, the processor 353 may be configured to control the enabled fan 270 to rotate the blades at a second speed higher than the first speed based on the temperature being greater than or equal to another reference temperature.

[0113] According to an embodiment, the electronic device 100 may include a first metal plate 501 interposed between a portion of the mesh plate 311 on the first IC 351 and the first IC 351. According to an embodiment, the electronic device 100 may include a second metal plate 502 interposed between another portion of the mesh plate 311 on the second IC 352 and the second IC 352.

[0114] According to an embodiment, the electronic device 100 may include a memory on the second surface 250b spaced apart from the processor 353. According to an embodiment, the heat sink 280 may partially contact on the memory.

[0115] According to an embodiment, the electronic device 100 may include at least one display 240, the at least one display 240 is provided on the first surface 250a, and when the electronic device 100 is worn on a part of the user's body, the at least one display 240 is located in front of the user's eyes. According to an embodiment, the electronic device 100 may include a rechargeable battery. According to an embodiment, the first IC 351 may include an IC for providing power to the at least one display 240. According to an embodiment, the second IC 352 may include an IC for charging the rechargeable battery.

[0116] According to an embodiment, the electronic device 100 may include a third IC 363, which is on the first surface 250a, is spaced apart from the processor 353, the first IC 351, and the second IC 352, and is used to provide power to the processor 353. According to an embodiment, the heat pipe 275 may include a first portion 601, which is connected to each of the first IC 351, the second IC 352, and the third IC 363, and when the first surface 250a is viewed in the second direction, the first portion 601 surrounds the first IC 351, the second IC 352, and the third IC 363.

[0117] According to an embodiment, the electronic device 100 may include a mesh plate 611 contacting each of a first IC 351 spaced apart from the first portion 301, a second IC 352 spaced apart from the first portion 301, and a third IC 363 spaced apart from the first portion 301. According to an embodiment, each of the first IC 351, the second IC 352, and the third IC 363 may be connected to the first portion 601 through the mesh plate 611.

[0118] According to an embodiment, the electronic device 100 may include a first mesh plate in contact with each of a first IC 351 spaced apart from the first portion and a second IC 352 spaced apart from the first portion. According to an embodiment, the electronic device 100 may include a second mesh plate in contact with a third IC 363 spaced apart from the first portion. According to an embodiment, each of the first IC 351 and the second IC 352 may be connected to the first portion through the first mesh plate. According to an embodiment, the third IC 363 may be connected to the first portion through the second mesh plate.

[0119] According to an embodiment, the electronic device 100 may include a third IC 363, which is on the first surface, spaced apart from the first IC and the second IC, and is used to provide power to the processor. According to an embodiment, the third IC 363 may be located outside the closed ring formed by the first part 301 surrounding the first IC 351 and the second IC 352, and may be connected to the third part 303 between the first part 301 and the second part 302 of the heat pipe 275.

[0120] According to an embodiment, the electronic device 100 may include another mesh plate 312 contacting on the third IC 363 spaced apart from the third portion 303. According to an embodiment, the third IC 363 may be connected to the third portion 303 through the another mesh plate 312.

[0121] According to an embodiment, the electronic device 100 may include at least one display 240, the at least one display 240 is disposed on the first surface 250a, when the electronic device 100 is worn on a part of the user's body, the at least one display 240 is located in front of the user's eyes, and the at least one display 240 includes a plurality of light emitting elements. According to an embodiment, the first IC 351 may include an IC for providing power to the at least one display. According to an embodiment, the second IC 352 may include an IC for controlling the plurality of light emitting elements.

[0122] According to an embodiment, the electronic device 100 may include a first mesh plate 801 in contact with a first IC 351 spaced apart from the first portion 301. According to an embodiment, the electronic device 100 may include a second mesh plate 802 in contact with a second IC 352 spaced apart from the first portion 301. According to an embodiment, the first IC 351 may be connected to the first portion 301 through the first mesh plate 801. According to an embodiment, the second IC 352 may be connected to the first portion 301 through the second mesh plate 802.

[0123] According to an embodiment, the electronic device 100 may include a third IC 384, which is on the first surface 250a and is spaced apart from the first IC 351 and the second IC 352. According to an embodiment, the electronic device 100 may include a fourth IC 385, which is on the first surface 250a and is spaced apart from the first IC 351, the second IC 352, and the third IC 363. According to an embodiment, the electronic device 100 may include another heat pipe 380, which includes a fourth portion 381 and a fifth portion 382, ​​the fourth portion 381 being on the first surface 250a, the fourth portion 381 surrounding the third IC 384 and the fourth IC 385 when the first surface 250a is viewed in the second direction, and the fourth portion 381 is connected to each of the third IC 384 and the fourth IC 385, and the fifth portion 382 extending from the fourth portion 381 to the heat sink 280. According to an embodiment, the PCB 250 may include a first region 391, a second region 392 spaced apart from the first region 391, and a third region 393 between the first region 391 and the second region 392 extending from the first region 391 to the second region 392. According to an embodiment, the first IC 351 and the second IC 352 may be disposed on the first region 391 of the first surface 250a. According to an embodiment, the processor 353 may be disposed on the third region 393 of the second surface 250b. According to an embodiment, the third IC 384 and the fourth IC 385 may be disposed on the second region 392 of the first surface 250a.

[0124] According to an embodiment, the electronic device 100 may include a first mesh plate 311 in contact with each of a first IC 351 spaced apart from the first portion 301 and a second IC 352 spaced apart from the first portion 301. According to an embodiment, the electronic device 100 may include a second mesh plate 386 in contact with each of a third IC 384 spaced apart from the fourth portion 381 and a fourth IC 385 spaced apart from the fourth portion 381. According to an embodiment, the electronic device 100 may include a fan 270, which is located on a third region 393 of the second surface 250b and includes an inlet 371, blades, and an outlet. According to an embodiment, the PCB 250 may include an opening 350 at least partially overlapping the inlet 371. According to an embodiment, the fan 270 may be configured to cause air flowing into the inlet 371 through the opening 350 from the outside of the electronic device to flow out through the outlet when the blades rotate. According to an embodiment, a first IC 351 on which the first mesh plate 311 contacts, a second IC 352 on which the first mesh plate 311 contacts, a third IC 384 on which the second mesh plate 386 contacts, and a fourth IC 385 on which the second mesh plate 386 contacts may be located on a path of air from outside the electronic device 100 to the inlet 371.

[0125] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0126] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents, or alternative forms for the corresponding embodiments. As used herein, each of the phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish a corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0127] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0128] The various embodiments described herein may be implemented as software (e.g., program 940) including one or more instructions stored in a storage medium (e.g., internal memory 936 or external memory 938) that can be read by a machine (e.g., electronic device 901). For example, under the control of a processor, a processor (e.g., processor 920) of the machine (e.g., electronic device 901) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0129] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0130] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be separately arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as the corresponding one component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

Claims

1. An electronic device (100), comprising: A printed circuit board PCB (250) comprising a first surface (250a) and a second surface (250b) opposite to the first surface; A processor (353) located on the second surface (250b); a heat sink (280) located on the second surface and partially in contact with the processor (353); A first integrated circuit IC (351) located on the first surface (250a); A second IC (352) located on the first surface (250a) and spaced apart from the first IC (351); as well as A heat pipe (275) comprising: a first portion (301) on the first surface (250a) connected to each of the first IC (351) and the second IC (352), and when the first surface (250a) is viewed in a second direction opposite to the first direction faced by the first surface (250a), the first portion (301) surrounds the first IC (351) and the second IC (352), and The second portion (302) extends from the first portion (301) to the heat sink (280).

2. The electronic device according to claim 1, further comprising: a mesh plate (311) respectively located on the first IC (351) spaced apart from the first part (301) and the second IC (352) spaced apart from the first part (301), Each of the first IC (351) and the second IC (352) is connected to the first part (301) through the mesh plate (311).

3. The electronic device according to claim 2, further comprising: A fan (270) is disposed on the second surface and comprises: Entrance (371); blades; and exit, wherein the PCB (250) comprises an opening (350) corresponding to the inlet (371), and wherein the fan (270) is configured to make the air from the outside of the electronic device (100) flow into the inlet (371) through the opening (350) flow out through the outlet when the blades rotate, and The first IC (351) and the second IC (352) on which the mesh plate (311) contacts are located in a path of the air from the outside of the electronic device (100) toward the inlet (371).

4. The electronic device according to claim 3, wherein: The outlet faces the heat sink (280) partially in contact with the processor (353).

5. The electronic device according to claim 3, wherein: The processor (353) is configured to: disabling the fan (270) based on an operating state of the electronic device (100) indicating that the temperature inside the electronic device (100) remains below a reference temperature, and The fan (270) is enabled based on an operating status indicating that the temperature can rise above the reference temperature.

6. The electronic device according to claim 5, wherein: The processor (353) is further configured to: Based on an operating state indicating that the temperature is maintained between the reference temperature and another reference temperature higher than the reference temperature, controlling the enabled fan (270) to rotate the blade at a first speed, and Based on the operating status indicating that the temperature can rise above the other reference temperature, the enabled fan (270) is controlled to rotate the blade at a second speed higher than the first speed.

7. The electronic device according to claim 3, wherein: The processor (353) is configured to: disabling the fan (270) based on the temperature inside the electronic device being less than a reference temperature, and Based on the temperature being greater than or equal to the reference temperature, the fan is enabled (270).

8. The electronic device according to claim 7, wherein: The processor (353) is further configured to: Based on the temperature being greater than or equal to the reference temperature and less than another reference temperature higher than the reference temperature, controlling the enabled fan (270) to rotate the blade at a first speed, and Based on the temperature being greater than or equal to the other reference temperature, the enabled fan (270) is controlled to rotate the blade at a second speed higher than the first speed.

9. The electronic device according to claim 2, further comprising: A first metal plate (501) inserted between a portion of the mesh plate (311) located on the first IC (351) and the first IC (351); as well as A second metal plate (502) is interposed between another portion of the mesh plate (311) located on the second IC (352) and the second IC (352).

10. The electronic device according to claim 1, further comprising: a memory located on the second surface (250b) and spaced apart from the processor (353), The heat sink (280) is partially in contact with the memory.

11. The electronic device according to claim 1, further comprising: at least one display (240) disposed on the first surface (250a), and when the electronic device (100) is worn on a part of a user's body, the at least one display (240) is located in front of the user's eyes; as well as Rechargeable battery, wherein the first IC (351) includes an IC for providing power to the at least one display (240), and The second IC (352) includes an IC for charging the rechargeable battery.

12. The electronic device according to claim 1, further comprising: a third IC (363) located on the first surface (250a), spaced apart from the processor (353), the first IC (351) and the second IC (352), and configured to provide power to the processor (353), wherein the first portion (601) is connected to each of the first IC (351), the second IC (352) and the third IC (363), and when the first surface (250a) is observed in the second direction, the first portion (601) surrounds the first IC (351), the second IC (352) and the third IC (363).

13. The electronic device according to claim 12, further comprising: a mesh plate (611) in contact with each of a first IC (351) spaced apart from the first portion (301), a second IC (352) spaced apart from the first portion (301), and a third IC (363) spaced apart from the first portion (301), Each of the first IC (351), the second IC (352) and the third IC (363) is connected to the first part (601) through the mesh plate (611).

14. The electronic device according to claim 12, further comprising: a first mesh plate in contact with each of a first IC (351) spaced apart from the first portion and a second IC (352) spaced apart from the first portion; as well as a second mesh plate in contact with a third IC (363) spaced apart from the first portion, wherein each of the first IC (351) and the second IC (352) is connected to the first portion via the first mesh plate, and Wherein, the third IC (363) is connected to the first part through the second mesh plate.

15. The electronic device according to claim 1, further comprising: a third IC (363) located on the first surface (351), spaced apart from the first IC (351) and the second IC (352), and configured to provide power to the processor (353), The third IC (363) is located outside the closed ring formed by the first part (301) surrounding the first IC (351) and the second IC (352), and is connected to the third part (303) between the first part (301) and the second part (302) of the heat pipe (275).

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