Circuit board welding method and related device

Abstract

The embodiment of the invention discloses a circuit board welding method and a related device, which are used for improving the welding precision. The method is applied to an industrial personal computer in the welding system, the welding system further comprises a welding assembly, an industrial camera and a motion platform controller, the method comprises the steps that carrier in-place information sent by the motion platform controller is received, and the carrier in-place information shows that a target circuit board is located in the shooting range of the industrial camera; controlling an industrial camera to shoot a target circuit board according to the carrier in-place information so as to obtain a target image corresponding to the target circuit board; determining a central point pixel coordinate of a bonding pad area corresponding to a bonding pad on the target circuit board on the target image; and the central point pixel coordinates are converted into central point world coordinates under a world coordinate system, and the central point world coordinates are sent to a motion platform controller, so that the motion platform controller controls a welding assembly to weld the target circuit board at the central point world coordinates.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of welding, and in particular to a circuit board welding method and related devices. Background Art

[0002] In industrial production, circuit boards often need to be welded. Welding requires the coordinates of the corresponding pads to facilitate the control of the welding components to move to the coordinate position of the pads and weld the circuit boards. In existing solutions, welding design data is involved. The design data contains information describing the pad coordinates. The design data corresponding to the circuit board is directly parsed to obtain the corresponding pad coordinates.

[0003] However, in the existing solutions, due to the actual situation of the welding system, the pad coordinates in the design data often deviate, which leads to low welding accuracy and failure to meet the process requirements. Each batch of workpieces requires manual debugging to correct the coordinate deviation. Summary of the invention

[0004] The embodiments of the present application provide a circuit board welding method and related devices for improving welding accuracy.

[0005] A first aspect of an embodiment of the present application provides a circuit board welding method, which is applied to an industrial computer in a welding system, wherein the welding system further includes a welding component, an industrial camera, and a motion platform controller, including:

[0006] Receiving carrier positioning information sent by the motion platform controller, wherein the carrier positioning information indicates that the target circuit board is within the shooting range of the industrial camera;

[0007] Controlling the industrial camera to photograph the target circuit board according to the carrier positioning information to obtain a target image corresponding to the target circuit board;

[0008] Determining, on the target image, the pixel coordinates of the center point of a pad area corresponding to a pad on the target circuit board;

[0009] The center point pixel coordinates are converted into the center point world coordinates in the world coordinate system, and the center point world coordinates are sent to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the center point world coordinates.

[0010] Optionally, determining the center pixel coordinates of a pad area corresponding to a pad on the target circuit board on the target image includes:

[0011] Determine, from the target image, the pad area whose features meet the first preset condition;

[0012] Calculating based on the pixel coordinate information of the pad area in a pixel coordinate system to obtain the pixel coordinates of the center point of the pad area, wherein the pixel coordinate system is a coordinate system in pixels;

[0013] Optionally, if the feature is a shape, determining the pad region whose feature meets the first preset condition from the target image includes:

[0014] Determine an area in the target image having a preset shape as the pad area;

[0015] or,

[0016] If the feature is an area value, determining the pad area whose feature meets the first preset condition from the target image includes:

[0017] A region in the target image whose area value is the same as the preset area value is determined as the pad region.

[0018] Optionally, if the target circuit board is marked with an identification mark, determining the pixel coordinates of the center point of a pad area corresponding to the pad on the target circuit board on the target image includes:

[0019] Determine, from the target image, a marking area corresponding to the marking whose features meet a second preset condition;

[0020] Calculate based on the pixel coordinate information of the marked area in the pixel coordinate system to obtain the pixel coordinates of the center point of the marked area;

[0021] On the target image, the coordinates at a preset distance from the center point pixel coordinates of the identification area in a preset direction are determined as the center point pixel coordinates of the pad area.

[0022] Optionally, before converting the center point pixel coordinates into the center point world coordinates in a world coordinate system and sending the center point world coordinates to the motion platform controller, the method further includes:

[0023] Determining the number of shots of the pad area on the target image;

[0024] Determining whether the captured number is the same as the actual number of pads on the target circuit board;

[0025] If the number of shots is the same as the actual number of pads on the target circuit board, the target step is executed, which is to convert the center point pixel coordinates into the center point world coordinates in the world coordinate system and send the center point world coordinates to the motion platform controller.

[0026] Optionally, after converting the center point pixel coordinates into the center point world coordinates in a world coordinate system and sending the center point world coordinates to the motion platform controller, the method further includes:

[0027] Determining whether the number of the obtained feedback signals is the same as the actual number of pads on the target circuit board, the feedback signal indicating that a pad on the target circuit board has been soldered;

[0028] If they are different, return to execute the target step until the number of the feedback signals is the same as the number of the preset target segment pads. The target step is to convert the center point pixel coordinates into the center point world coordinates in the world coordinate system and send the center point world coordinates to the motion platform controller.

[0029] Optionally, if the circuit board is divided into multiple sections, the target circuit board is one of the sections to be photographed, and the welding system further includes a conveyor belt, then after determining whether the number of the acquired feedback signals is the same as the actual number of pads of the target circuit board, the method further includes:

[0030] If they are the same, determining whether the accumulated number of the acquired carrier placement information is the same as the number of segments of the circuit board;

[0031] If yes, sending welding completion notification information to the motion platform controller;

[0032] If not, a welding continuation notification message is sent to the motion platform controller, so that the motion platform controller drives the conveyor belt to move, thereby driving the main circuit board on the conveyor belt until the next carrier in place message sent by the motion platform controller is received.

[0033] A second aspect of an embodiment of the present application provides a circuit board welding device, wherein a welding system involved in the circuit board welding device further includes a welding assembly, an industrial camera, and a motion platform controller, including:

[0034] A receiving unit, configured to receive carrier position information sent by the motion platform controller, wherein the carrier position information indicates that the target circuit board is within the shooting range of the industrial camera;

[0035] A control unit, configured to control the industrial camera to photograph the target circuit board according to the carrier positioning information, so as to obtain a target image corresponding to the target circuit board;

[0036] A determination unit, configured to determine, on the target image, the pixel coordinates of a center point of a pad area corresponding to a pad on the target circuit board;

[0037] A conversion unit is used to convert the center point pixel coordinates into the center point world coordinates in the world coordinate system, and send the center point world coordinates to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the center point world coordinates.

[0038] A third aspect of an embodiment of the present application provides a circuit board welding device, comprising:

[0039] CPU, memory and input / output interface;

[0040] The memory is a short-term storage memory or a persistent storage memory;

[0041] The central processing unit is configured to communicate with the memory and execute instructions in the memory to perform the aforementioned method.

[0042] A fourth aspect of an embodiment of the present application provides a computer-readable storage medium, comprising instructions, which, when executed on a computer, enable the computer to execute the aforementioned method.

[0043] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

[0044] First, the carrier positioning information sent by the motion platform controller is received, and then the industrial camera is controlled to shoot the target circuit board according to the carrier positioning information to obtain the target image corresponding to the target circuit board, and then the center point pixel coordinates of the pad area corresponding to the pad on the target circuit board are determined on the target image, and finally the center point pixel coordinates are converted into the center point world coordinates in the world coordinate system, and the center point world coordinates are sent to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the center point world coordinates. Obtaining the center point world coordinates of the pad based on the industrial camera instead of using the corresponding design data can adapt to the actual situation, has high welding accuracy, can meet the process requirements, and does not require manual debugging to correct coordinate deviations. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A schematic diagram of a welding system disclosed in this application;

[0046] Figure 2 A schematic diagram of an embodiment of a circuit board welding method disclosed in the present application;

[0047] Figure 3 A schematic diagram of another embodiment of a circuit board welding method disclosed in the present application;

[0048] Figure 4 A schematic diagram of a circuit board with a marking area disclosed in this application;

[0049] Figure 5 A schematic diagram of an embodiment of a welding system disclosed in the present application;

[0050] Figure 6 A schematic diagram of an embodiment of a circuit board welding device disclosed in the present application;

[0051] Figure 7 This is a schematic diagram of another embodiment of a circuit board welding device disclosed in the present application. DETAILED DESCRIPTION

[0052] The present application is further described in detail below in conjunction with the accompanying drawings.

[0053] The embodiments of the present application provide a circuit board welding method and related devices for improving welding accuracy.

[0054] Industrial production requires welding of circuit boards. In existing solutions, the design data corresponding to the circuit board will be parsed to obtain the corresponding pad coordinates in the design data. However, in existing solutions, the pad coordinates of the design data are often biased, resulting in low welding accuracy, and the design data is written by welding personnel based on experience, and the reliability is not high. Parsing the design data requires compatibility with different circuit design software file formats, which is a huge workload. In order to solve the above problems, the present application provides a circuit board welding method and a circuit board welding device, which obtains the world coordinates of the center point of the pad through an industrial camera, thereby ensuring the accuracy of welding, with strong reliability, small workload, and can meet the process requirements, without the need for manual debugging to correct coordinate deviations.

[0055] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0056] The terms "first", "second", "third", "fourth", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0057] A circuit board welding method of the present application is described below. Figure 1 The welding system involved in one embodiment of a circuit board welding method of the present application includes an industrial computer, a welding assembly, an industrial camera and a motion platform controller. The industrial computer is used to obtain the world coordinates of the center point of the welding pad, the welding assembly is used for welding, the industrial camera is used for shooting, and the motion platform controller is used to control the welding assembly to work and drive the target circuit board to move. Please refer to Figure 2 The method of this embodiment is applied to an industrial computer, including:

[0058] 201. Receive vehicle positioning information sent by the motion platform controller;

[0059] Receive the carrier position information sent by the motion platform controller, wherein the carrier position information indicates that the target circuit board is within the shooting range of the industrial camera. Specifically, when the sensor detects that the main circuit board has arrived, the motion platform controller controls the conveyor belt to stop moving. At the same time, the motion platform controller sends the carrier position information to the industrial computer, and the industrial computer receives the carrier position information, which indicates that the target circuit board has stopped moving.

[0060] 202. Controlling an industrial camera to photograph a target circuit board according to the carrier positioning information to obtain a target image corresponding to the target circuit board;

[0061] According to the carrier position information, the industrial camera is controlled to shoot the target circuit board to obtain a target image corresponding to the target circuit board. Specifically, after receiving the carrier position information, the industrial computer will control the industrial camera to shoot the target circuit board to obtain the corresponding image to be processed. The image to be processed can be preprocessed to obtain the target image, or no preprocessing is performed.

[0062] 203. Determine the pixel coordinates of the center point of the pad area corresponding to the pad on the target circuit board on the target image;

[0063] Determine the center pixel coordinates of the pad area corresponding to the pad on the target circuit board on the target image. Specifically, if there is no mark on the target circuit board, the pad features on the target image can be identified first, the pad area can be found, and then the center pixel coordinates of the pad area can be calculated based on the coordinate information. If there is a mark on the target circuit board, the mark area corresponding to the mark can be found first, and then the center pixel coordinates of the mark area can be determined, and finally the center pixel coordinates of the pad area can be found based on the preset rules.

[0064] 204. Convert the center point pixel coordinates into the center point world coordinates in the world coordinate system, and send the center point world coordinates to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the center point world coordinates.

[0065] The pixel coordinates of the center point are converted into the world coordinates of the center point in the world coordinate system, and the world coordinates of the center point are sent to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the world coordinates of the center point. Among them, the industrial computer is pre-set with camera intrinsic parameters and camera extrinsic parameters. Specifically, the pixel coordinates of the center point in the pixel coordinate system are first converted by the camera intrinsic parameters to obtain the corresponding coordinates in the camera coordinate system, and then the coordinates are converted based on the camera extrinsic parameters to obtain the world coordinates of the center point in the world coordinate system. Then the world coordinates of the center point are sent to the motion platform controller, and the motion platform controller controls the movement of the welding assembly and performs welding according to the world coordinates of the center point.

[0066] In the embodiment of the present application, the carrier position information sent by the motion platform controller is first received, and then the industrial camera is controlled to shoot the target circuit board according to the carrier position information to obtain the target image corresponding to the target circuit board, and then the center point pixel coordinates of the pad area corresponding to the pad on the target circuit board are determined on the target image, and finally the center point pixel coordinates are converted into the center point world coordinates in the world coordinate system, and the center point world coordinates are sent to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the center point world coordinates. Obtaining the center point world coordinates of the pad based on the industrial camera instead of using the corresponding design data can adapt to the actual situation, has high welding accuracy, can meet the process requirements, and does not require manual debugging to correct coordinate deviations.

[0067] See also Figure 3Another embodiment of a circuit board welding method of the present application is applied to an industrial computer in a welding system, wherein the welding system also includes a welding assembly, a conveyor belt, an industrial camera and a motion platform controller, wherein the industrial computer is used to obtain the world coordinates of the center point of the welding pad, the welding assembly is used for welding, the industrial camera is used for shooting, and the motion platform controller is used to control the operation of the welding assembly and the movement of the conveyor belt, thereby driving the movement of the target circuit board. The circuit board involved is divided into multiple sections, and the target circuit board is one of the sections to be photographed. The method includes:

[0068] 301. Receive vehicle positioning information sent by the motion platform controller;

[0069] Receive the carrier position information sent by the motion platform controller, wherein the carrier position information indicates that the target circuit board is within the shooting range of the industrial camera. Specifically, the circuit board is marked with multiple segmentation marks to distinguish multiple segments. The movement of the conveyor belt drives the circuit board to move. When the sensor detects the segmentation mark on the circuit board, the motion platform controller controls the conveyor belt to stop moving. At the same time, the motion platform controller sends the carrier position information to the industrial computer, and the industrial computer receives the carrier position information. The carrier position information indicates that the target circuit board stops moving, and the current segment to be photographed is the target circuit board. The circuit board can be a flexible printed circuit (FPC) or a printed circuit board (PCB), etc., which is not limited here.

[0070] 302. Controlling an industrial camera to photograph a target circuit board according to the carrier positioning information to obtain a target image corresponding to the target circuit board;

[0071] According to the carrier position information, the industrial camera is controlled to shoot the target circuit board to obtain the target image corresponding to the target circuit board. Specifically, after the industrial computer receives the carrier position information, it will control the industrial camera to work, shoot the target circuit board, and obtain the corresponding image to be processed. The image to be processed can be preprocessed to obtain the target image, or the image to be processed can be directly used as the target image without preprocessing, which is not limited here. In the preprocessing step, in one embodiment, the region of interest (ROI) can be defined based on preset rules. The region of interest can be limited to the part of the image to be processed related to the target circuit board, while others such as the ground in the image to be processed, other machinery, etc. are discarded, and then the region of interest is denoised and converted into a grayscale image to obtain the target image.

[0072] 303. Determine the pixel coordinates of the center point of the pad area corresponding to the pad on the target circuit board on the target image;

[0073] Determine the center pixel coordinates of the pad area corresponding to the pad on the target circuit board on the target image. Specifically, if there is no mark on the target circuit board, the pad features on the target image can be identified first, the pad area can be found, and then the center pixel coordinates of the pad area can be calculated based on the coordinate information. If there is a mark on the target circuit board, the mark area corresponding to the mark can be found first, and then the center pixel coordinates of the mark area can be determined, and finally the center pixel coordinates of the pad area can be found based on the preset rules.

[0074] In one embodiment, a pad area whose features meet the first preset condition is first determined from the target image, and then the pixel coordinate information of the pad area in the pixel coordinate system is calculated to obtain the pixel coordinates of the center point of the pad area, wherein the pixel coordinate system is a coordinate system in pixels. Specifically, the feature may be a shape, an area value, or a color, etc., which is not specifically limited here. If the feature is a shape, the area in the target image whose shape is a preset shape is determined as the pad area. For example, if the preset shape is a circle, the circular area is determined as the pad area. If the feature is an area value, the area in the target image whose area value is the same as the preset area value is determined as the pad area. For example, if the preset area value is 3, the area with an area value of 3 is determined as the pad area.

[0075] In another embodiment, if the target circuit board is marked with a logo, the logo area corresponding to the logo whose features meet the second preset condition is first determined from the target image, and then the pixel coordinate information of the logo area in the pixel coordinate system is calculated to obtain the pixel coordinates of the center point of the logo area. Finally, on the target image, the coordinates at a preset distance from the pixel coordinates of the center point of the logo area in a preset direction are determined as the pixel coordinates of the center point of the pad area. Specifically, the logo area is first determined. The features may be shape, area value, etc. The content of determining the area based on the features can refer to the above-mentioned related content and will not be repeated here. The center point pixel coordinates are calculated. The center point pixel coordinates can be calculated based on the shape of the logo area, that is, the coordinate information. For example, for a circular logo area, the midpoint is the center point pixel coordinate. The preset direction and preset distance are preset parameters. For example, the center point pixel coordinates of the pad area are determined to be 1 cm away from the center point pixel coordinates of the logo area directly below. Please refer to Figure 4 , the marking area 11 on the target circuit board 2 is directly above the pad area 3, and the distance is a preset distance.

[0076] 304. Determine the number of shots of the pad area on the target image;

[0077] Determine the number of shots of the pad area on the target image. Specifically, based on machine vision technology, first find the pad area that meets the conditions on the target image, and then count the pad area, that is, obtain the number of shots. The number of shots is not necessarily equal to the actual number of pads, so it needs to be checked.

[0078] 305. Determine whether the photographed number is the same as the actual number of pads on the target circuit board. If so, execute step 306. If not, return to execute step 302.

[0079] Specifically, if the number of shots is the same as the actual number of pads on the target circuit board, it means that the image recognition is relatively accurate and subsequent coordinate conversion can be performed. If the number of shots is different from the actual number of pads on the target circuit board, it means that the image recognition is relatively inaccurate and the industrial camera needs to be re-controlled to shoot the target circuit board.

[0080] 306. Convert the center point pixel coordinates into the center point world coordinates in the world coordinate system, and send the center point world coordinates to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the center point world coordinates;

[0081] The pixel coordinates of the center point are converted into the world coordinates of the center point in the world coordinate system, and the world coordinates of the center point are sent to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the world coordinates of the center point. Among them, the industrial computer is pre-set with camera intrinsic parameters and camera extrinsic parameters. The camera intrinsic parameters are also called intrinsic parameter matrices, which describe the transformation relationship between the camera coordinate system and the pixel coordinate system coordinates, while the camera extrinsic parameters are also called extrinsic parameter matrices, which describe the transformation relationship between the world coordinate system and the camera coordinate system coordinates. The pixel coordinate system is the number of rows and columns of a point in the camera corresponding to the imaging point, with only two dimensions, XY, and the unit is pixel. The camera coordinate system is a coordinate system with the optical center of the camera as the origin, with three dimensions, XYZ, and the unit is meter. The world coordinate system is the position of a point on an object in the real world, with three dimensions, XYZ, and the unit is meter. Specifically, the pixel coordinates of the center point in the pixel coordinate system are first converted by the camera intrinsic parameters to obtain the corresponding coordinates in the camera coordinate system, and then the coordinates are converted based on the camera extrinsic parameters to obtain the world coordinates of the center point in the world coordinate system. Then the world coordinates of the center point are sent to the motion platform controller, and the motion platform controller controls the movement of the welding assembly and performs welding according to the world coordinates of the center point.

[0082] 307. Determine whether the number of the obtained feedback signals is the same as the actual number of pads of the target circuit board. If so, execute step 308; if not, return to execute step 306;

[0083] The feedback signal indicates that a pad on the target circuit board has been soldered. When each pad is soldered, the corresponding sensor will send information to the industrial computer. The industrial computer receives the feedback signal, indicating that a pad has been soldered. The number of soldering completed is the number of feedback signals. If the number of feedback signals is the same as the actual number of pads on the target circuit board, it means that all pads have been soldered. If they are different, it means that there are still pads that have not been soldered and need to be soldered.

[0084] 308. Determine whether the accumulated number of the acquired carrier placement information is the same as the number of segments of the circuit board. If so, execute step 309; if not, execute step 310.

[0085] After all the pads of the target circuit board are soldered, it is necessary to determine whether all the circuit boards have been soldered. Since one segment of the circuit board corresponds to one carrier in place information, the cumulative number of carrier in place information obtained by the industrial computer represents the number of segments that have been soldered. Therefore, if the cumulative number of carrier in place information obtained by the industrial computer is the same as the number of segments of the circuit board, it means that all segments of the circuit board have been soldered. If they are different, it means that there are still segments that have not been photographed and soldered. One of the multiple segments that have not been photographed and soldered is determined as a new target circuit board for a new round of processing.

[0086] 309. Send welding completion notification information to the motion platform controller;

[0087] If the accumulated number of the acquired carrier positioning information is the same as the number of segments of the main circuit board, it means that the main circuit board has been completely welded, and a welding completion notification message is sent to the motion platform controller.

[0088] 310. Send a welding continuation notification message to the motion platform controller, so that the motion platform controller drives the conveyor belt to move, thereby driving the main circuit board on the conveyor belt, until the next carrier in place message sent by the motion platform controller is received.

[0089] If the accumulated number of carrier placement information obtained is different from the number of segments of the circuit board, it means that some segments of the circuit board have not been welded, and a welding continuation notification message is sent to the motion platform controller, so that the motion platform controller drives the conveyor belt to move, and then drives the circuit board on the conveyor belt until the next carrier placement information sent by the motion platform controller is received. Specifically, after receiving the welding continuation notification message, the motion platform controller drives the conveyor belt to move, and drives the circuit board to move, until a new segment mark is detected, then stops the movement of the conveyor belt, and sends new carrier placement information to the industrial computer for a new round of processing.

[0090] The present embodiment is now described by taking an example. Figure 5When the welding system is started, the motion platform controller 9 is started to control the movement of the conveyor belt 1, and the circuit board 2 is placed on the conveyor belt 1, so it is also driven. When the segmented identification of the circuit board 2 is recognized by the sensor, the motion platform controller 9 stops the conveyor belt 1 and sends the carrier in position information to the industrial computer 8. The industrial computer 8 turns on the fill light 6 and the industrial camera 7, controls the industrial camera 7 to shoot the target circuit board of the circuit board 2, and returns the corresponding image to the industrial computer 8. The industrial computer 8 analyzes and processes the image to obtain the world coordinates of the center point corresponding to the pad 3 on the target circuit board (calculated according to the coordinates of the reference point 10). The industrial computer 8 sends the world coordinates of the center point to the motion platform controller 9. The welding assembly includes a welding motor 5 and a laser 4. The motion platform controller 9 controls the action of the welding motor 5 according to the world coordinates of the center points of multiple pads 3, and then brings the laser 4 to the position of the pad 3 for welding. After welding is completed, it moves to the position of the next pad 3 for welding until the welding of the target circuit board is completed. The industrial computer 8 sends a continuous welding notification message to the motion platform controller 9. The motion platform controller 9 controls the conveyor belt 1 to continue moving and performs a new round of processing until the welding of the circuit board 2 is completed.

[0091] In this embodiment, the carrier position information sent by the motion platform controller is first received, and then the industrial camera is controlled to shoot the target circuit board according to the carrier position information to obtain the target image corresponding to the target circuit board, and then the center point pixel coordinates of the pad area corresponding to the pad on the target circuit board are determined on the target image, and finally the center point pixel coordinates are converted into the center point world coordinates in the world coordinate system, and the center point world coordinates are sent to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the center point world coordinates. Obtaining the center point world coordinates of the pad based on the industrial camera instead of using the corresponding design data can adapt to the actual situation, has high welding accuracy, can meet the process requirements, and does not require manual debugging to correct coordinate deviations.

[0092] A circuit board welding method in an embodiment of the present application is described above, and a circuit board welding device in an embodiment of the present application is described below. Figure 6 In one embodiment of a circuit board welding device in the present application, the welding system involved in the circuit board welding device further includes a welding component, an industrial camera and a motion platform controller, and the device includes:

[0093] The receiving unit 601 is used to receive the carrier position information sent by the motion platform controller, wherein the carrier position information indicates that the target circuit board is within the shooting range of the industrial camera;

[0094] A control unit 602 is used to control the industrial camera to photograph the target circuit board according to the carrier positioning information, so as to obtain a target image corresponding to the target circuit board;

[0095] A determination unit 603 is used to determine the pixel coordinates of the center point of the pad area corresponding to the pad on the target circuit board on the target image;

[0096] The conversion unit 604 is used to convert the center point pixel coordinates into the center point world coordinates in the world coordinate system, and send the center point world coordinates to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the center point world coordinates.

[0097] In the embodiment of the present application, the receiving unit 601 first receives the carrier position information sent by the motion platform controller, and then the control unit 602 controls the industrial camera to shoot the target circuit board according to the carrier position information to obtain the target image corresponding to the target circuit board, and the determination unit 603 then determines the center point pixel coordinates of the pad area corresponding to the pad on the target circuit board on the target image, and finally the conversion unit 604 converts the center point pixel coordinates into the center point world coordinates in the world coordinate system, and sends the center point world coordinates to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the center point world coordinates. Obtaining the center point world coordinates of the pad based on the industrial camera instead of using the corresponding design data can adapt to the actual situation, with high welding accuracy, and bring a better experience to the welder.

[0098] A circuit board welding device in an embodiment of the present application is described in detail below. A circuit board welding device in an embodiment of the present application Another embodiment of the circuit board welding device described in the welding system further includes a welding component, an industrial camera and a motion platform controller, and the device includes:

[0099] A receiving unit, configured to receive carrier position information sent by the motion platform controller, wherein the carrier position information indicates that the target circuit board is within the shooting range of the industrial camera;

[0100] A control unit, configured to control the industrial camera to photograph the target circuit board according to the carrier positioning information, so as to obtain a target image corresponding to the target circuit board;

[0101] A determination unit, configured to determine, on the target image, the pixel coordinates of a center point of a pad area corresponding to a pad on the target circuit board;

[0102] A conversion unit is used to convert the center point pixel coordinates into the center point world coordinates in the world coordinate system, and send the center point world coordinates to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the center point world coordinates.

[0103] Determine the unit, specifically for:

[0104] Determine, from the target image, the pad area whose features meet the first preset condition;

[0105] Calculating based on the pixel coordinate information of the pad area in a pixel coordinate system to obtain the pixel coordinates of the center point of the pad area, wherein the pixel coordinate system is a coordinate system in pixels;

[0106] Determine the unit, specifically for:

[0107] Determine an area in the target image having a preset shape as the pad area;

[0108] or,

[0109] If the feature is an area value, determining the pad area whose feature meets the first preset condition from the target image includes:

[0110] A region in the target image whose area value is the same as the preset area value is determined as the pad region.

[0111] Determine the unit, specifically for:

[0112] Determine, from the target image, a marking area corresponding to the marking whose features meet a second preset condition;

[0113] Calculate based on the pixel coordinate information of the marked area in the pixel coordinate system to obtain the pixel coordinates of the center point of the marked area;

[0114] On the target image, the coordinates at a preset distance from the center point pixel coordinates of the identification area in a preset direction are determined as the center point pixel coordinates of the pad area.

[0115] The circuit board welding device also includes a judging unit, which is used to:

[0116] Determining the number of shots of the pad area on the target image;

[0117] Determining whether the captured number is the same as the actual number of pads on the target circuit board;

[0118] If the number of shots is the same as the actual number of pads on the target circuit board, the target step is executed, which is to convert the center point pixel coordinates into the center point world coordinates in the world coordinate system and send the center point world coordinates to the motion platform controller.

[0119] The judgment unit is also used for:

[0120] Determining whether the number of the obtained feedback signals is the same as the actual number of pads on the target circuit board, the feedback signal indicating that a pad on the target circuit board has been soldered;

[0121] If they are different, return to execute the target step until the number of the feedback signals is the same as the number of the preset target segment pads. The target step is to convert the center point pixel coordinates into the center point world coordinates in the world coordinate system and send the center point world coordinates to the motion platform controller.

[0122] The judgment unit is also used for:

[0123] If they are the same, determining whether the accumulated number of the acquired carrier placement information is the same as the number of segments of the circuit board;

[0124] If yes, sending welding completion notification information to the motion platform controller;

[0125] If not, a welding continuation notification message is sent to the motion platform controller, so that the motion platform controller drives the conveyor belt to move, thereby driving the main circuit board on the conveyor belt until the next carrier in place message sent by the motion platform controller is received.

[0126] The functions and processes performed by each unit in the circuit board welding device of this embodiment are similar to those of the aforementioned Figures 1 to 5 The functions and processes performed by the circuit board welding device are similar and will not be repeated here.

[0127] Figure 7 It is a schematic diagram of the structure of a circuit board welding device provided in an embodiment of the present application. The circuit board welding device 700 may include one or more central processing units (CPU) 701 and a memory 705. The memory 705 stores one or more application programs or data.

[0128] The memory 705 may be a volatile storage or a persistent storage. The program stored in the memory 705 may include one or more modules, each of which may include a series of instruction operations in the circuit board welding device 700. Furthermore, the central processor 701 may be configured to communicate with the memory 705 and execute a series of instruction operations in the memory 705 on the circuit board welding device 700.

[0129] The circuit board welding device 700 may also include one or more power supplies 702, one or more wired or wireless network interfaces 703, one or more input and output interfaces 704, and / or one or more operating systems, such as Windows ServerTM, Mac OS XTM, UnixTM, LinuxTM, FreeBSDTM, etc.

[0130] The CPU 701 can execute the aforementioned Figures 1 to 5 The operations performed by the circuit board welding device in the illustrated embodiment will not be described in detail herein.

[0131] An embodiment of the present application also provides a computer-readable storage medium, including instructions, which, when executed on a computer, enable the computer to execute the method in the aforementioned embodiment.

[0132] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0133] It should be noted that, although the steps in the flowcharts involved in the embodiments are drawn in sequence according to the instructions of the arrows, unless otherwise clearly stated in this document, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the embodiments may include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0134] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0135] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0136] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0137] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, read-only memory), random access memory (RAM, random access memory), disk or optical disk and other media that can store program code.

Claims

1. A circuit board welding method, characterized in that: An industrial computer used in a welding system, wherein the welding system also includes a welding component, an industrial camera and a motion platform controller, including: Receiving carrier positioning information sent by the motion platform controller, wherein the carrier positioning information indicates that the target circuit board is within the shooting range of the industrial camera; Controlling the industrial camera to photograph the target circuit board according to the carrier positioning information to obtain a target image corresponding to the target circuit board; Determining, on the target image, the pixel coordinates of the center point of a pad area corresponding to a pad on the target circuit board; The center point pixel coordinates are converted into the center point world coordinates in the world coordinate system, and the center point world coordinates are sent to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the center point world coordinates.

2. The circuit board welding method according to claim 1, characterized in that: The step of determining the center pixel coordinates of a pad area corresponding to a pad on the target circuit board on the target image includes: Determine, from the target image, the pad area whose features meet the first preset condition; The pixel coordinates of the center point of the pad area are obtained by performing calculation based on the pixel coordinate information of the pad area in a pixel coordinate system, where the pixel coordinate system is a coordinate system with pixels as units.

3. The circuit board welding method according to claim 2, characterized in that: If the feature is a shape, determining the pad area whose feature meets the first preset condition from the target image includes: Determine an area in the target image having a preset shape as the pad area; or, If the feature is an area value, determining the pad area whose feature meets the first preset condition from the target image includes: A region in the target image whose area value is the same as the preset area value is determined as the pad region.

4. The circuit board welding method according to claim 1, characterized in that: If the target circuit board is marked with an identifier, determining the center pixel coordinates of a pad area corresponding to the pad on the target circuit board on the target image includes: Determine, from the target image, a marking area corresponding to the marking whose features meet a second preset condition; Calculate based on the pixel coordinate information of the marked area in the pixel coordinate system to obtain the pixel coordinates of the center point of the marked area; On the target image, the coordinates at a preset distance from the center point pixel coordinates of the identification area in a preset direction are determined as the center point pixel coordinates of the pad area.

5. The circuit board welding method according to claim 1, characterized in that: Before converting the center point pixel coordinates into the center point world coordinates in the world coordinate system and sending the center point world coordinates to the motion platform controller, the method further includes: Determining the number of shots of the pad area on the target image; Determining whether the captured number is the same as the actual number of pads on the target circuit board; If the number of shots is the same as the actual number of pads on the target circuit board, the target step is executed, which is to convert the center point pixel coordinates into the center point world coordinates in the world coordinate system and send the center point world coordinates to the motion platform controller.

6. The circuit board welding method according to claim 1, characterized in that: After converting the center point pixel coordinates into the center point world coordinates in the world coordinate system and sending the center point world coordinates to the motion platform controller, the method further includes: Determining whether the number of the obtained feedback signals is the same as the actual number of pads on the target circuit board, the feedback signal indicating that a pad on the target circuit board has been soldered; If they are different, return to execute the target step until the number of the feedback signals is the same as the number of the preset target segment pads. The target step is to convert the center point pixel coordinates into the center point world coordinates in the world coordinate system and send the center point world coordinates to the motion platform controller.

7. The circuit board welding method according to claim 6, characterized in that: If the circuit board is divided into a plurality of sections, the target circuit board is one of the sections to be photographed, and the welding system further includes a conveyor belt, then after determining whether the number of the obtained feedback signals is the same as the actual number of pads of the target circuit board, the method further includes: If they are the same, determining whether the accumulated number of the acquired carrier placement information is the same as the number of segments of the circuit board; If yes, sending welding completion notification information to the motion platform controller; If not, a welding continuation notification message is sent to the motion platform controller, so that the motion platform controller drives the conveyor belt to move, thereby driving the main circuit board on the conveyor belt until the next carrier in place message sent by the motion platform controller is received.

8. A circuit board welding device, characterized in that: The welding system involved in the circuit board welding device also includes a welding component, an industrial camera and a motion platform controller, including: A receiving unit, configured to receive carrier position information sent by the motion platform controller, wherein the carrier position information indicates that the target circuit board is within the shooting range of the industrial camera; A control unit, configured to control the industrial camera to photograph the target circuit board according to the carrier positioning information, so as to obtain a target image corresponding to the target circuit board; A determination unit, configured to determine, on the target image, the pixel coordinates of a center point of a pad area corresponding to a pad on the target circuit board; A conversion unit is used to convert the center point pixel coordinates into the center point world coordinates in the world coordinate system, and send the center point world coordinates to the motion platform controller, so that the motion platform controller controls the welding assembly to weld the target circuit board at the center point world coordinates.

9. A circuit board welding device, characterized in that: include: CPU, memory and input / output interface; The memory is a short-term storage memory or a persistent storage memory; The central processing unit is configured to communicate with the memory and execute instructions in the memory to perform the method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The method comprises instructions, which, when executed on a computer, cause the computer to execute the method according to any one of claims 1 to 7.

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