Lead-free welding device of circuit board

Abstract

The invention relates to a lead-free welding device for a circuit board, and relates to the technical field of electronic manufacturing, the lead-free welding device comprises a workbench, the circuit board is placed on the workbench for welding, and the workbench is provided with a heating mechanism for heating the surface space of the workbench and a temperature control mechanism for controlling the heating temperature of the heating mechanism. The temperature control cover is installed on the workbench, and the heating mechanism heats the internal space of the temperature control cover in the temperature control cover, so that the temperature of the part, in the temperature control cover, of the workbench is the temperature suitable for welding of the circuit board; the temperature between the temperature control cover and the workbench and the temperature between the temperature control cover and the heating mechanism are isolated through the first heat insulation assembly and the second heat insulation assembly, so that the influence of the outside of the temperature control cover and the whole workbench on the temperature in the temperature control cover is reduced, and the heating temperature of the heating mechanism in the temperature control cover is more stable and uniform; therefore, the welding work of the circuit board is in a stable temperature environment, and the welding effect is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of electronic manufacturing, and in particular to a lead-free soldering device for a circuit board. Background Art

[0002] Printed Circuit Board (PCB) is a substrate used to connect and support electronic components in electronic devices. It uses printing technology to print conductive circuit patterns on an insulating substrate to achieve electrical connections between electronic components. Circuit boards are the core components of modern electronic devices and are widely used in computers, communication equipment, consumer electronics, automotive electronics, medical equipment and other fields.

[0003] Due to environmental protection and health considerations, lead-free soldering technology has gradually replaced traditional lead-containing soldering technology, especially driven by the EU RoHS Directive (Restriction of Hazardous Substances Directive), lead-free soldering has become the mainstream of the electronics manufacturing industry.

[0004] However, the process window (temperature and time range) of lead-free soldering is narrow, making the process control of lead-free soldering more difficult. Any slight deviation in the soldering temperature or time may lead to poor soldering. Summary of the invention

[0005] In order to ensure the welding effect of lead-free welding on a circuit board, the present application provides a lead-free welding device for a circuit board.

[0006] The present application provides a lead-free soldering device for a circuit board, which adopts the following technical solution:

[0007] A lead-free soldering device for a circuit board comprises a workbench, on which the circuit board is placed for soldering, and the workbench is provided with a heating mechanism for heating the surface space of the workbench and a temperature control mechanism for controlling the heating temperature of the heating mechanism, wherein the temperature control mechanism comprises:

[0008] A temperature control cover, wherein the temperature control cover is arranged on a workbench, the circuit board is located in the temperature control cover, and the heating mechanism is arranged on the temperature control cover;

[0009] A first heat insulation component, which is disposed between the temperature control cover and the workbench and is used to insulate the temperature between the temperature control cover and the workbench;

[0010] The second heat insulation component is arranged between the heating mechanism and the temperature control cover and is used to insulate the temperature between the heating mechanism and the temperature control cover.

[0011] By adopting the above technical solution, a temperature control hood is installed on the workbench, and the heating mechanism heats the internal space of the temperature control hood inside the temperature control hood, so that the temperature of the part of the workbench inside the temperature control hood is at a temperature suitable for welding the circuit board, and the temperature of the temperature control hood is isolated from the workbench and the heating mechanism by the first heat insulation component and the second heat insulation component, thereby reducing the influence of the outside of the temperature control hood and the workbench as a whole on the temperature inside the temperature control hood, making the temperature heated by the heating mechanism in the temperature control hood more stable and uniform, so that the welding work of the circuit board is in a stable temperature environment, ensuring the welding effect.

[0012] Optionally, the heating mechanism includes:

[0013] A heating cylinder, wherein the heating cylinder is arranged on the inner wall of the temperature control cover;

[0014] A heating element, wherein the heating element is disposed in the heating cylinder and heats the interior of the heating cylinder;

[0015] An air inlet pipe and a first air outlet pipe, both of which are arranged on the heating tube and are connected to the inside of the heating tube, one end of the air inlet pipe away from the heating tube extends out of the temperature control cover, and one end of the first air outlet pipe away from the heating tube is arranged toward the workbench surface.

[0016] By adopting the above technical solution, a heating cylinder is installed inside the temperature control hood, air is ventilated into the heating cylinder through the air inlet pipe, the heating element heats the gas entering the heating cylinder, and the heated gas is discharged into the temperature control hood through the first air outlet pipe, thereby completing the heating work of the ambient temperature in the temperature control hood.

[0017] Optionally, a conveyor belt is rotatably arranged on the workbench, a plate inlet and a plate outlet are respectively provided at both ends of the temperature control hood, two partitions are provided in the temperature control hood, and the two partitions divide the temperature control hood into three working spaces: a first space, a second space and a third space. The first space is located at one end of the temperature control hood where the plate inlet is provided, the third space is located at one end of the temperature control hood where the plate outlet is provided, the second space is located between the first space and the third space, the heating tube is located in the second space, a second air outlet pipe is provided at one end of the heating tube close to the first space, and an end of the second air outlet pipe extends into the first space away from the heating tube, a guide plate is provided in the heating tube, one end of the guide plate is connected to the second air outlet pipe, and the other end of the guide plate is connected to the heating element.

[0018] By adopting the above technical solution, two partitions are used to divide the interior of the temperature control cover into three working spaces, namely the first space, the second space and the third space, and a second air outlet pipe and a guide plate are installed on the heating cylinder. The second air outlet pipe passes part of the hot air in the heating cylinder into the first space, so that the temperature in the first space rises. Therefore, when the circuit board enters the first space through the conveyor belt, the first space can preheat the circuit board first, thereby reducing the probability of damage to the circuit board due to excessive temperature difference between the inside and outside of the temperature control cover, and ensuring the welding effect of the circuit board.

[0019] Optionally, a plurality of heating elements are provided, and the plurality of heating elements are vertically evenly arranged in the heating tube, the end of the guide plate connected to the second air outlet pipe is rotatably provided, the end of the guide plate away from the second air outlet pipe is in contact with the heating element, and a rotating mechanism is provided on the heating tube, and the rotating mechanism is used to control the rotation of the guide plate.

[0020] By adopting the above technical solution, multiple heating elements are set up, and the rotation of the guide plate is controlled by the rotating mechanism to contact the heating elements at different heights, so that the temperature of the gas discharged from the second outlet pipe can be changed and adjusted, so that the temperature in the first space can be flexibly adjusted according to the working conditions of the circuit board.

[0021] Optionally, the rotating mechanism includes:

[0022] A rotating shaft, wherein the rotating shaft is rotatably arranged on the heating cylinder, and the guide plate is arranged on the rotating shaft;

[0023] A rotating motor, wherein the rotating motor is arranged on the temperature control cover, and the output shaft of the rotating motor extends into the heating cylinder;

[0024] a first bevel gear, the first bevel gear being disposed on the rotating shaft;

[0025] A second bevel gear is disposed on the output shaft of the rotating motor and meshes with the first bevel gear.

[0026] By adopting the above technical solution, the rotating motor is started to drive the second bevel gear to rotate, the rotation of the second bevel gear drives the first bevel gear to rotate, the rotation of the first bevel gear drives the rotating shaft to rotate, and the rotation of the rotating shaft drives the guide plate to rotate, thereby realizing the rotation of the guide plate by controlling the rotating motor.

[0027] Optionally, a first temperature sensor is provided on the outer wall of the temperature control cover, a second temperature sensor is provided on the inner wall of the first space, a third temperature sensor is provided on the inner wall of the second space, and a controller is provided on the temperature control cover, and the controller is electrically connected to the rotating motor, the first temperature sensor and the second temperature sensor.

[0028] By adopting the above technical solution, a first temperature sensor is installed on the outer wall of the temperature control cover, the first temperature sensor senses the ambient temperature outside the temperature control cover, and the second temperature sensor senses the temperature in the first space. The controller can compare the temperature in the first space and the external temperature through the first temperature sensor and the second temperature sensor, so as to control the rotating motor to keep the temperature in the first space and the external temperature within a reasonable temperature difference range, which is convenient for the circuit board to perform temperature transition work and reduces the adverse effects of external temperature changes on the circuit board when entering the first space.

[0029] Optionally, the first thermal insulation component includes:

[0030] A heat-insulating pad, which is laid on a workbench;

[0031] An installation frame, the installation frame is arranged on the heat insulation pad, a vertical installation groove is opened on the installation frame, and the bottom of the temperature control cover is snap-fitted with the installation groove;

[0032] A thermal insulation cotton layer is coated on the outer side wall of the temperature control cover.

[0033] By adopting the above technical solution, a thermal insulation pad is installed on the workbench, and then a mounting frame is installed on the thermal insulation pad. The temperature control cover is snapped into the mounting groove on the mounting frame, so that the temperature between the temperature control cover and the workbench is isolated by the thermal insulation pad and the mounting frame, thereby reducing the temperature transfer between the workbench and the thermal insulation cover, and the thermal insulation cotton layer reduces the influence of the external space temperature on the temperature control cover, making the temperature inside the temperature control cover more stable.

[0034] Optionally, the second thermal insulation component includes:

[0035] Insulation columns, a plurality of which are provided, the insulation columns are arranged on the inner wall of the temperature control cover, and the heating cylinder is arranged on the insulation columns;

[0036] A heat-insulating fan is arranged on the temperature-control cover and fans the gap between the heating cylinder and the temperature-control cover.

[0037] By adopting the above technical solution, a heat-insulating column is installed on the inner wall of the temperature-control hood to isolate the heating tube from the temperature-control hood, and a heat-insulating fan is installed between the heating tube and the temperature-control hood, thereby greatly reducing the direct heat transfer between the heating tube and the temperature-control hood, and reducing the influence of the temperature-control hood on the heating effect of the heating tube, so that the heating tube can heat the internal space of the temperature-control hood more fully and stably.

[0038] Optionally, a plurality of air pipes are provided on the partition separating the second space and the third space, and the plurality of air pipes are used to blow air onto the surface of the conveyor belt.

[0039] By adopting the above technical solution, an air pipe for blowing air in and out of the surface of the conveyor belt is installed on the partition, thereby generating an air wall at the connection point of the first space, the second space and the third space, thereby isolating the temperatures of the first space, the second space and the third space, ensuring that the temperature in each space is stable and independent.

[0040] In summary, the present application includes at least one of the following beneficial technical effects:

[0041] 1. By installing a temperature control cover on the workbench, the heating mechanism heats the internal space of the temperature control cover in the temperature control cover, so that the temperature of the part of the workbench in the temperature control cover is at a temperature suitable for welding the circuit board, and the temperature of the temperature control cover, the workbench and the heating mechanism are isolated by the first heat insulation component and the second heat insulation component, thereby reducing the influence of the outside of the temperature control cover and the workbench as a whole on the temperature inside the temperature control cover, making the temperature heated by the heating mechanism in the temperature control cover more stable and uniform, so that the welding work of the circuit board is in a stable temperature environment, ensuring the welding effect;

[0042] 2. By using two partitions to divide the interior of the temperature control cover into three working spaces, namely the first space, the second space and the third space, and installing a second air outlet pipe and a guide plate on the heating cylinder, the second air outlet pipe passes part of the hot air in the heating cylinder into the first space, so that the temperature in the first space rises. When the circuit board enters the first space through the conveyor belt, the first space can preheat the circuit board first, thereby reducing the probability of damage to the circuit board due to the large temperature difference between the inside and outside of the temperature control cover, and ensuring the welding effect of the circuit board;

[0043] 3. By installing an air pipe on the partition to blow air in and out of the conveyor belt surface, an air wall is generated at the connection point of the first space, the second space and the third space, thereby isolating the temperatures of the first space, the second space and the third space, ensuring that the temperature in each space is stable and independent. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is a three-dimensional structural schematic diagram of the present application;

[0045] Figure 2 It is a schematic diagram of the structure of the heating mechanism and the temperature control mechanism in the present application, in which the side wall of the temperature control cover is cut away.

[0046] 1. The heat exchanger includes the following components: 1. a heat exchanger, a heat exchanger, a heat exchanger for the heat exchanger, and a heat exchanger for the heat exchanger. 2. The heat exchanger includes the following components: 1. a heat exchanger, a heat exchanger for the heat exchanger, and a heat exchanger for the heat exchanger. 3. a heat exchanger for the heat exchanger, and a heat exchanger for the heat exchanger. 4. a heat exchanger for the heat exchanger. 5. a heat exchanger for the heat exchanger, and a heat exchanger for the heat exchanger. DETAILED DESCRIPTION

[0047] The following is combined with Figure 1 -Attached Figure 2 This application is described in further detail.

[0048] The embodiment of the present application discloses a lead-free soldering device for a circuit board.

[0049] Reference Figure 1 The lead-free soldering device for a circuit board includes a workbench 11, on which the circuit board is placed for soldering. The workbench 11 is provided with a heating mechanism 2 for heating the surface space of the workbench 11 and a temperature control mechanism 3 for controlling the heating temperature of the heating mechanism 2.

[0050] Reference Figure 1 and Figure 2 The temperature control mechanism 3 includes a temperature control cover 31, a first insulation component 32 and a second insulation component 33. The temperature control cover 31 is arranged on the workbench 11 through the first insulation component 32. The first insulation component 32 isolates the temperature between the temperature control cover 31 and the workbench 11. The first insulation component 32 includes an insulation pad 41, a mounting frame 42 and an insulation cotton layer 43. The insulation pad 41 is fixedly laid on the upper surface of the workbench 11. The mounting frame 42 is fixedly mounted on the upper surface of the insulation pad 41. A vertical mounting groove 44 is opened on the upper surface of the mounting frame 42. The bottom of the temperature control cover 31 is clamped in the mounting groove 44. The insulation cotton layer 43 is covered on the outer wall of the temperature control cover 31.

[0051] Reference Figure 1 and Figure 2The heating mechanism 2 includes a heating cylinder 21, a heating element 22, an air inlet pipe 23 and a first air outlet pipe 24. The heating cylinder 21 is installed in the temperature control cover 31 through a second thermal insulation component 33. The second thermal insulation component 33 is used to isolate the temperature between the heating mechanism 2 and the temperature control cover 31. The second thermal insulation component 33 includes a thermal insulation column 45 and a thermal insulation fan 46. The thermal insulation column 45 is fixedly installed on the inner wall of the temperature control cover 31. The heating cylinder 21 is fixedly installed on one end of the thermal insulation column 45 away from the temperature control cover 31. The thermal insulation fan 46 is fixedly installed on the inner wall of the temperature control cover 31 and fans the gap between the heating cylinder 21 and the temperature control cover 31.

[0052] Reference Figure 2 A plurality of heating elements 22 are provided, and the plurality of heating elements 22 are evenly arranged and installed in a vertical manner in the heating cylinder 21. The heating elements 22 heat the interior of the heating cylinder 21. The air inlet pipe 23 and the first air outlet pipe 24 are both fixedly installed on the heating cylinder 21 and communicated with the interior of the heating cylinder 21. The end of the air inlet pipe 23 away from the heating cylinder 21 extends out of the temperature control cover 31, and the end of the first air outlet pipe 24 away from the heating cylinder 21 is arranged toward the surface of the workbench 11.

[0053] Reference Figure 2 , a temperature control cover 31 is installed on the workbench 11, a heating cylinder 21 is installed inside the temperature control cover 31, air is ventilated into the heating cylinder 21 through the air inlet pipe 23, the heating element 22 heats the gas entering the heating cylinder 21, and the heated gas is discharged into the temperature control cover 31 through the first air outlet pipe 24, so that the temperature of the part of the workbench 11 inside the temperature control cover 31 is at a temperature suitable for welding the circuit board. The temperature control cover 31 is isolated from the temperature between the workbench 11 and the heating mechanism 2 by the heat insulation pad 41 and the heat insulation column 45, thereby reducing the influence of the outside of the temperature control cover 31 and the workbench 11 as a whole on the temperature inside the temperature control cover 31, so that the temperature heated by the heating mechanism 2 in the temperature control cover 31 is more stable and uniform, so that the welding work of the circuit board is in a stable temperature environment, ensuring the welding effect.

[0054] Reference Figure 1 and Figure 2A conveyor belt 12 is rotatably mounted on the workbench 11, and the circuit board is placed on the surface of the conveyor belt 12. A board inlet 14 and a board outlet 15 are respectively provided at both ends of the temperature control cover 31, and two partitions 13 are fixedly installed inside the temperature control cover 31. The two partitions 13 divide the interior of the temperature control cover 31 into three working spaces, namely, a first space 17, a second space 18 and a third space 19. The first space 17 is located at one end of the temperature control cover 31 where the board inlet 14 is provided, and the third space 19 is located at one end of the temperature control cover 31 where the board outlet 15 is provided. The second space 18 is located between the first space 17 and the third space 19. The heating tube 21 is located in the second space 18, and a second air outlet pipe 25 is fixedly installed at one end of the heating tube 21 close to the first space 17, and an end of the second air outlet pipe 25 away from the heating tube 21 extends into the first space 17. A guide plate 26 is rotatably installed in the heating tube 21 . One end of the guide plate 26 is rotatably connected to the second air outlet pipe 25 , and the other end of the guide plate 26 is connected to the heating element 22 .

[0055] Reference Figure 1 and Figure 2 , a rotating mechanism 5 is provided on the heating tube 21, and the rotating mechanism 5 is used to control the rotation of the guide plate 26. The rotating mechanism 5 includes a rotating shaft 51, a rotating motor 52, a first bevel gear 53 and a second bevel gear 54. The rotating shaft 51 is rotatably mounted on the inner wall of the heating tube 21 and is located at one end where the second air outlet pipe 25 is connected to the heating tube 21. The guide plate 26 is fixedly mounted on the rotating shaft 51. The rotating motor 52 is fixedly mounted on the outer wall of the temperature control cover 31. The output shaft of the rotating motor 52 extends into the heating tube 21. The first bevel gear 53 is fixedly mounted on the rotating shaft 51. The second bevel gear 54 is fixedly mounted on the output shaft of the rotating motor 52 and meshes with the first bevel gear 53.

[0056] Reference Figure 2 The rotation motor 52 is started to drive the second bevel gear 54 to rotate, the second bevel gear 54 rotates to drive the first bevel gear 53 to rotate, the first bevel gear 53 rotates to drive the rotating shaft 51 to rotate, the rotating shaft 51 rotates to drive the guide plate 26 to rotate, so that the rotation of the guide plate 26 is achieved by controlling the rotation motor 52. The rotating guide plate 26 contacts the heating element 22 at different positions, so that the temperature of the gas discharged from the second outlet pipe 25 can be controlled.

[0057] Reference Figure 2 A first temperature sensor 55 is fixedly mounted on the outer wall of the temperature control cover 31. A second temperature sensor 56 is fixedly mounted on the inner wall of the first space 17. A third temperature sensor 57 is arranged on the inner wall of the second space 18. A controller 58 is fixedly mounted on the temperature control cover 31. The controller 58 is electrically connected to the rotating motor 52, the first temperature sensor 55 and the second temperature sensor 56.

[0058] Reference Figure 2 The first temperature sensor 55 senses the ambient temperature outside the temperature control cover 31, and the second temperature sensor 56 senses the temperature inside the first space 17. The controller 58 can compare the temperature inside the first space 17 and the external temperature through the first temperature sensor 55 and the second temperature sensor 56, so as to control the rotating motor 52 to keep the temperature inside the first space 17 and the external temperature within a reasonable temperature difference range, so as to facilitate the temperature transition work of the circuit board and reduce the adverse effect of the external temperature change on the circuit board when entering the first space 17.

[0059] Reference Figure 2 A plurality of air pipes 16 are fixedly mounted on the partition 13 at the separation between the second space 18 and the third space 19, and the plurality of air pipes 16 blow air to the surface of the conveyor belt 12. Thus, an air wall is generated at the connection between the first space 17, the second space 18 and the third space 19, thereby isolating the temperatures of the first space 17, the second space 18 and the third space 19, and ensuring that the temperatures in each space are stable and independent.

[0060] The working principle of the embodiment of the present application is as follows:

[0061] A temperature control cover 31 is installed on the workbench 11, and a heating tube 21 is installed inside the temperature control cover 31. Air is ventilated into the heating tube 21 through the air inlet pipe 23. The heating element 22 heats the gas entering the heating tube 21. The heated gas is discharged into the temperature control cover 31 through the first air outlet pipe 24, so that the temperature of the part of the workbench 11 inside the temperature control cover 31 is at a temperature suitable for welding the circuit board. The temperature control cover 31 is isolated from the temperature between the workbench 11 and the heating tube 21 by the heat insulation pad 41 and the heat insulation column 45, thereby reducing the influence of the outside of the temperature control cover 31 and the workbench 11 as a whole on the temperature inside the temperature control cover 31, so that the temperature of the heating tube 21 heated inside the temperature control cover 31 is more stable and uniform, so that the welding work of the circuit board is in a stable temperature environment, and the welding effect is guaranteed.

[0062] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A lead-free soldering device for a circuit board, characterized in that: The invention comprises a workbench (11), on which a circuit board is placed for welding, and the workbench (11) is provided with a heating mechanism (2) for heating the surface space of the workbench (11) and a temperature control mechanism (3) for controlling the heating temperature of the heating mechanism (2), wherein the temperature control mechanism (3) comprises: A temperature control cover (31), wherein the temperature control cover (31) is arranged on the workbench (11), the circuit board is located in the temperature control cover (31), and the heating mechanism is arranged on the temperature control cover (31); A first heat insulation component (32), the first heat insulation component (32) being arranged between the temperature control cover (31) and the workbench (11) and used to insulate the temperature between the temperature control cover (31) and the workbench (11); A second heat insulation component (33), wherein the second heat insulation component (33) is arranged between the heating mechanism (2) and the temperature control cover (31) and is used to insulate the temperature between the heating mechanism (2) and the temperature control cover (31).

2. A lead-free soldering device for a circuit board according to claim 1, characterized in that: The heating mechanism (2) comprises: A heating tube (21), wherein the heating tube (21) is arranged on the inner wall of the temperature control cover (31); A heating element (22), wherein the heating element (22) is disposed in the heating cylinder (21), and the heating element (22) heats the interior of the heating cylinder (21); An air inlet pipe (23) and a first air outlet pipe (24), wherein the air inlet pipe (23) and the first air outlet pipe (24) are both arranged on the heating tube (21) and are in communication with the interior of the heating tube (21); an end of the air inlet pipe (23) away from the heating tube (21) extends out of the temperature control cover (31); and an end of the first air outlet pipe (24) away from the heating tube (21) is arranged toward the surface of the workbench (11).

3. A lead-free soldering device for a circuit board according to claim 2, characterized in that: A conveyor belt (12) is rotatably arranged on the workbench (11); a plate inlet (14) and a plate outlet (15) are respectively provided at both ends of the temperature control cover (31); two partitions (13) are arranged inside the temperature control cover (31); the two partitions (13) divide the temperature control cover (31) into three working spaces, namely a first space (17), a second space (18) and a third space (19); the first space (17) is located at one end of the temperature control cover (31) where the plate inlet (14) is provided, and the third space (19) is located at one end of the temperature control cover (31) where the plate outlet (15) is provided. The second space (18) is located between the first space (17) and the third space (19), the heating tube (21) is located in the second space (18), a second air outlet pipe (25) is provided at one end of the heating tube (21) close to the first space (17), and an end of the second air outlet pipe (25) away from the heating tube (21) extends into the first space (17), a guide plate (26) is provided in the heating tube (21), one end of the guide plate (26) is connected to the second air outlet pipe (25), and the other end of the guide plate (26) is connected to the heating element (22).

4. A lead-free soldering device for a circuit board according to claim 3, characterized in that: A plurality of heating elements (22) are provided, and the plurality of heating elements (22) are arranged vertically and evenly in the heating tube (21); one end of the guide plate (26) connected to the second air outlet pipe (25) is rotatably provided, and one end of the guide plate (26) away from the second air outlet pipe (25) contacts the heating element (22); a rotating mechanism (5) is provided on the heating tube (21), and the rotating mechanism (5) is used to control the rotation of the guide plate (26).

5. A lead-free soldering device for a circuit board according to claim 4, characterized in that: The rotating mechanism (5) comprises: A rotating shaft (51), wherein the rotating shaft (51) is rotatably disposed on the heating cylinder (21), and the guide plate (26) is disposed on the rotating shaft (51); A rotating motor (52), wherein the rotating motor (52) is arranged on the temperature control cover (31), and an output shaft of the rotating motor (52) extends into the heating cylinder (21); A first bevel gear (53), wherein the first bevel gear (53) is arranged on the rotating shaft (51); A second bevel gear (54), wherein the second bevel gear (54) is arranged on the output shaft of the rotary motor (52) and meshes with the first bevel gear (53).

6. A lead-free soldering device for a circuit board according to claim 5, characterized in that: A first temperature sensor (55) is arranged on the outer wall of the temperature control cover (31), a second temperature sensor (56) is arranged on the inner wall of the first space (17), and a third temperature sensor (57) is arranged on the inner wall of the second space (18). A controller (58) is arranged on the temperature control cover (31), and the controller (58) is electrically connected to the rotating motor (52), the first temperature sensor (55) and the second temperature sensor (56).

7. A lead-free soldering device for a circuit board according to claim 1, characterized in that: The first thermal insulation component (32) comprises: A heat insulation pad (41), wherein the heat insulation pad (41) is laid on the workbench (11); An installation frame (42), the installation frame (42) being arranged on the heat insulation pad (41), the installation frame (42) being provided with a vertical installation groove (44), the bottom of the temperature control cover (31) being snap-fitted with the installation groove (44); A thermal insulation cotton layer (43), wherein the thermal insulation cotton layer (43) is coated on the outer side wall of the temperature control cover (31).

8. A lead-free soldering device for a circuit board according to claim 2, characterized in that: The second thermal insulation component (33) comprises: A plurality of heat-insulating columns (45) are provided, wherein the heat-insulating columns (45) are arranged on the inner wall of the temperature-control cover (31), and the heating cylinder (21) is arranged on the heat-insulating columns (45); A heat-insulating fan (46) is disposed on the temperature-control cover (31) and fans the gap between the heating cylinder (21) and the temperature-control cover (31).

9. A lead-free soldering device for a circuit board according to claim 3, characterized in that: A plurality of air pipes (16) are arranged on the partition (13) separating the second space (18) and the third space (19), and the plurality of air pipes (16) blow air onto the surface of the conveyor belt (12).

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