Independent anode bin, electroplating bath device and electroplating liquid supply method

Abstract

The invention provides an independent anode bin, an electroplating bath device and an electroplating liquid supply method. The independent anode bin comprises an anode bin body and an anode plate assembly, the anode bin body is of a flat structure, a flat inner cavity used for containing the anode plate assembly and containing anode electroplating liquid is formed in the anode bin body, and an ionic membrane is installed at a lateral opening of the anode bin body; the anode plate assembly comprises an anode plate, a bottom plate and a conducting strip, the bottom plate is vertically mounted in the flat inner cavity of the anode bin body, and the anode plate faces one side of the ionic membrane. Compared with an integrated electroplating bath in the prior art, the volume of an inner cavity of the anode bin is obviously reduced, and the usage amount of anode electroplating liquid can be reduced. And the anode bin adopts an independent structure and is detachably arranged with the electroplating bath, so that the maintenance operation of the anode bin is facilitated, and non-stop maintenance can be realized when an anode bin spare part is adopted.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging wet process, in particular to an independent anode bin, an electroplating tank device and an electroplating liquid supply method. Background Art

[0002] Existing wafer electroplating tanks are generally one-piece structures, including an anode chamber and a cathode chamber. An ion membrane is installed between the anode chamber and the cathode chamber to prevent direct mixing of the electroplating solution. The anode assembly usually includes a circulation pipe connected to the anode chamber and an anode plate inserted in the anode chamber and connected to the positive pole of the power supply to ensure a stable supply of metal ions. The anode assembly of the electroplating tank is susceptible to oxidation and requires regular maintenance. Each chamber of the electroplating tank must have a large enough space to be disassembled and cleaned. The existing one-piece electroplating tank structure is large in size, consumes a large amount of electroplating solution, takes a long time to disassemble and maintain, and is inconvenient to maintain. Summary of the invention

[0003] In order to overcome the above-mentioned deficiencies of the prior art, the object of the present invention is to provide an independent anode bin, an electroplating tank device and an electroplating liquid supply method.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention to solve the technical problem is: an independent anode bin, comprising:

[0005] The anode bin body is a flat structure, the upper end of the anode bin body is open, the anode bin body is provided with a flat inner cavity for placing the anode plate assembly and containing the anode plating solution, and a lateral opening is provided on one side of the anode bin body, and an ion membrane is installed at the lateral opening;

[0006] The anode plate assembly comprises an anode plate, a bottom plate and a conductive sheet. The anode plate and the conductive sheet are fixedly mounted on the bottom plate. The anode plate and the conductive sheet are in contact and conduction with each other. The bottom plate is vertically mounted in the flat inner cavity of the anode bin body. The anode plate faces the ion membrane side.

[0007] The flat inner cavity volume of the anode bin body of the present invention is significantly smaller than that of the anode cavity of the prior art integrated electroplating tank, which can save the use of anode plating solution. The anode bin adopts an independent structure and can be detachably arranged with the electroplating tank, which facilitates the maintenance operation of the anode bin. When the anode bin spare parts are used, maintenance can be achieved without stopping the machine.

[0008] Furthermore, the bottom plate of the anode plate assembly is installed in the flat inner cavity of the anode bin body by vertical plug-in.

[0009] The adoption of the above preferred solution facilitates the rapid installation of the anode plate assembly on the anode bin body.

[0010] Furthermore, a lower circulation port communicating with the flat inner cavity is provided at the bottom of the anode bin body, and an upper circulation port communicating with the flat inner cavity is provided at the upper portion of the anode bin body.

[0011] The above preferred solution is adopted to promote the circulation of the anode plating solution in the inner cavity of the anode chamber, thereby improving the fluidity and uniformity of the cations.

[0012] Furthermore, the lower circulation port extends downward from the bottom surface of the anode bin body, a sealing ring is sleeved on the outer periphery of the lower circulation port, and a socket matching the lower circulation port is provided at the bottom of the electroplating tank.

[0013] By adopting the above preferred solution, it is convenient to connect the lower circulation port of the anode bin below the electroplating tank to prevent the cathode plating solution in the electroplating tank from overflowing from the lower circulation port.

[0014] Furthermore, an annular sealing gasket and a titanium ring are sequentially installed above the ion membrane at the lateral opening of the anode compartment body.

[0015] The above preferred solution is adopted to improve the sealing effect at the ion membrane.

[0016] Furthermore, a circle of concave mounting surface is provided at the lateral opening of the anode chamber body, and a plurality of convex positioning posts are provided on the mounting surface. Positioning holes matching the outer circumference of the positioning posts are provided on the ion membrane, the annular sealing gasket and the titanium ring, and the locking screws pass through the positioning holes on the titanium ring, the annular sealing gasket and the ion membrane in turn and are connected with the center hole of the positioning post.

[0017] By adopting the above preferred solution, the stability of the installation position of the ion membrane is improved.

[0018] Furthermore, an annular shielding plate is provided above the titanium ring.

[0019] Furthermore, the conductive sheet of the anode plate assembly includes an annular connecting portion connected to the edge of the anode plate and an upward extending portion extending upward from the annular connecting portion.

[0020] By adopting the above preferred solution, the electrical conductivity between the anode plate and the power supply anode is improved.

[0021] Furthermore, the thickness of the anode bin body is less than 80 mm.

[0022] An electroplating tank device, comprising:

[0023] An electroplating tank, which is used to hold the cathode plating solution;

[0024] A hanger, which is used to load the substrate to be electroplated, and the hanger is vertically inserted into the electroplating tank;

[0025] The above-mentioned independent anode bin is vertically inserted into the electroplating tank, and the independent anode bin is arranged parallel to the hanger.

[0026] The above technical solution has a compact structure, reduces the usage of anode plating solution, saves electroplating costs, and reduces the space occupied by the electroplating tank.

[0027] A method for supplying electroplating liquid comprises: placing cathode electroplating liquid in an electroplating tank, placing anode electroplating liquid in a flat inner cavity of an independent anode bin, and connecting a circulation pump between a lower circulation port and a lower circulation port of the independent anode bin via a pipeline to promote the circulation of the anode electroplating liquid in the independent anode bin. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 It is a structural schematic diagram of the independent anode bin of the present invention.

[0030] Figure 2 It is a cross-sectional view of the independent anode bin of the present invention.

[0031] Figure 3 It is a schematic diagram of the ion membrane installation structure on the anode tank body.

[0032] Figure 4 It is a schematic diagram of the ion membrane installation surface of the side opening of the anode tank body.

[0033] Figure 5 It is a schematic diagram of the structure of the anode plate assembly.

[0034] Figure 6 It is a schematic diagram of the back structure of the anode plate assembly.

[0035] Figure 7 It is a schematic structural diagram of the electroplating tank device of the present invention.

[0036] Figure 8 It is a cross-sectional view of the electroplating tank device of the present invention.

[0037] The numbers and letters in the figure represent the names of the corresponding parts:

[0038] 10-independent anode bin; 11-anode bin body; 111-flat inner cavity; 112-lower circulation port; 1121-sealing ring; 113-upper circulation port; 114-mounting surface; 1141-positioning column; 12-ion membrane; 121-annular sealing gasket; 122-titanium ring; 123-annular shielding plate; 13-anode plate assembly, 131-anode plate; 132-bottom plate; 133-conductive sheet; 1331-annular connecting portion; 1332-upper extension portion; 20-electroplating tank; 30-hanger. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] like Figure 1-6 As shown, one embodiment of the present invention is that the independent anode bin 10 comprises:

[0041] The anode bin body 11 is a flat structure, the upper end of the anode bin body 11 is open, and a flat inner cavity 111 for placing an anode plate assembly 13 and containing an anode plating solution is provided in the anode bin body 11. A lateral opening is provided on one side of the anode bin body 11, and an ion membrane 12 is installed at the lateral opening;

[0042] The anode plate assembly 13 includes an anode plate 131, a bottom plate 132 and a conductive sheet 133. The anode plate 131 and the conductive sheet 133 are fixedly mounted on the bottom plate 132. The anode plate 131 and the conductive sheet 133 are in contact and conductive with each other. The bottom plate 132 is vertically mounted in the flat inner cavity 111 of the anode bin body 11, and the anode plate 131 faces the side of the ion membrane 12.

[0043] The beneficial effect of adopting the above technical solution is that the volume of the flat inner cavity of the anode bin body is significantly reduced compared with the anode cavity volume of the prior art integrated electroplating tank, which can save the use of anode plating solution. The anode bin adopts an independent structure and can be detached from the electroplating tank, which facilitates the maintenance operation of the anode bin, and can achieve non-stop maintenance when using anode bin spare parts.

[0044] In other embodiments of the present invention, the bottom plate 132 of the anode plate assembly is installed in the flat inner cavity 111 of the anode bin body by vertical plug-in. Here, the specific plug-in matching structure between the bottom plate and the anode bin body is not limited and can be selected from the prior art. For example, guide ribs are provided on both sides of the bottom plate, and slots vertically arranged up and down are opened in the flat inner cavity of the anode bin body, and the guide ribs of the bottom plate are plugged into the slots. The beneficial effect of adopting the above technical solution is that it facilitates the rapid installation of the anode plate assembly on the anode bin body.

[0045] In other embodiments of the present invention, the bottom of the anode bin body 11 is provided with a lower circulation port 112 connected to the flat inner cavity 111, and the upper part of the anode bin body 11 is provided with an upper circulation port 113 connected to the flat inner cavity 111. The lower circulation port 112 extends downward from the bottom surface of the anode bin body 11, and a sealing ring 1121 is sleeved on the outer periphery of the lower circulation port 112, and a jack matching the outer periphery of the lower circulation port 112 is provided at the bottom of the electroplating tank 20. The beneficial effect of adopting the above technical solution is: it is convenient to connect the lower circulation port of the anode bin below the electroplating tank to prevent the cathode plating solution in the electroplating tank from overflowing from the lower circulation port.

[0046] In other embodiments of the present invention, an annular sealing gasket 121 and a titanium ring 122 are sequentially installed above the ion membrane 12 at the lateral opening of the anode chamber body 11. An annular shielding plate 123 is also provided above the titanium ring 122. The beneficial effect of adopting the above technical solution is: improving the sealing effect at the ion membrane.

[0047] In other embodiments of the present invention, a circle of concave mounting surface 114 is provided at the lateral opening of the anode chamber body 11, a plurality of convex positioning posts 1141 are provided on the mounting surface 114, and positioning holes matching the periphery of the positioning posts 1141 are provided on the ion membrane 12, the annular sealing gasket 121 and the titanium ring 122, and the locking screws pass through the positioning holes on the titanium ring 122, the annular sealing gasket 121 and the ion membrane 12 in sequence and are connected with the center hole of the positioning post 1141. The beneficial effect of adopting the above technical solution is: improving the stability of the installation position of the ion membrane.

[0048] In other embodiments of the present invention, the conductive sheet 133 of the anode plate assembly 13 includes an annular connecting portion 1331 connected to the edge of the anode plate and an upper extending portion 1332 extending upward from the annular connecting portion. The beneficial effect of the above technical solution is to improve the electrical conductivity between the anode plate and the power supply anode.

[0049] In other embodiments of the present invention, the thickness of the anode bin body 11 is less than 80 mm.

[0050] like Figure 7 , 8 As shown, an electroplating tank device comprises:

[0051] The electroplating tank 20 is used to contain the cathode electroplating solution;

[0052] A hanger 30 is used to load the substrate to be electroplated, and the hanger 30 is vertically inserted into the electroplating tank 20;

[0053] An independent anode bin 10 is vertically inserted into the electroplating tank 20 , and the independent anode bin 10 is arranged in parallel with the hanger 30 .

[0054] The beneficial effects of adopting the above technical solution are: compact structure, reduced usage of anode plating solution, saved electroplating cost, and reduced space occupied by the electroplating tank.

[0055] A method for supplying electroplating liquid comprises: placing cathode electroplating liquid in an electroplating tank, placing anode electroplating liquid in a flat inner cavity of an independent anode bin, and connecting a circulation pump between a lower circulation port and a lower circulation port of the independent anode bin via a pipeline to promote the circulation of the anode electroplating liquid in the independent anode bin.

[0056] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable ordinary technicians in the field to understand the content of the present invention and implement it. They cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. An independent anode bin, characterized in that: include: The anode bin body is a flat structure, the upper end of the anode bin body is open, the anode bin body is provided with a flat inner cavity for placing the anode plate assembly and containing the anode plating solution, and a lateral opening is provided on one side of the anode bin body, and an ion membrane is installed at the lateral opening; The anode plate assembly comprises an anode plate, a base plate and a conductive sheet. The anode plate and the conductive sheet are fixedly mounted on the base plate, the anode plate and the conductive sheet are conductively connected, and the anode plate assembly is vertically mounted in the flat inner cavity of the anode bin body, and the anode plate faces the ion membrane side.

2. The independent anode bin according to claim 1, characterized in that: The bottom plate of the anode plate assembly is installed in the flat inner cavity of the anode bin body by vertical plug-in.

3. The independent anode bin according to claim 1, characterized in that: The bottom of the anode bin body is provided with a lower circulation port communicating with the flat inner cavity, and the upper part of the anode bin body is provided with an upper circulation port communicating with the flat inner cavity.

4. The independent anode bin according to claim 3, characterized in that: The lower circulation port extends downward from the bottom surface of the anode bin body, a sealing ring is sleeved on the outer periphery of the lower circulation port, and a socket matching the lower circulation port is provided at the bottom of the electroplating tank.

5. The independent anode bin according to claim 1, characterized in that: An annular sealing gasket and a titanium ring are sequentially installed above the ion membrane at the lateral opening of the anode compartment body.

6. The independent anode bin according to claim 5, characterized in that: A circle of concave mounting surface is provided at the lateral opening of the anode chamber body, and a plurality of convex positioning posts are provided on the mounting surface. Positioning holes matching the outer circumference of the positioning posts are provided on the ion membrane, the annular sealing gasket and the titanium ring, and the locking screws pass through the positioning holes on the titanium ring, the annular sealing gasket and the ion membrane in turn and are connected with the center hole of the positioning post.

7. The independent anode bin according to claim 5, characterized in that: An annular shielding plate is also provided above the titanium ring.

8. The independent anode bin according to claim 1, characterized in that: The conductive sheet of the anode plate assembly comprises an annular connecting portion connected to the edge of the anode plate and an upper extending portion extending upward from the annular connecting portion.

9. An electroplating tank device, characterized in that: include: An electroplating tank, which is used to hold the cathode plating solution; A hanger, which is used to load the substrate to be electroplated, and the hanger is vertically inserted into the electroplating tank; The independent anode bin as described in any one of claims 1-9, wherein the independent anode bin is vertically inserted into the electroplating tank, and the independent anode bin is arranged parallel to the hanger.

10. A method for supplying electroplating solution, characterized in that: The electroplating tank device as described in claim 9 is used, cathode plating solution is contained in the electroplating tank, anode plating solution is contained in the flat inner cavity of the independent anode bin, and a circulation pump is connected between the upper circulation port and the lower circulation port of the independent anode bin via a pipeline to promote the circulation of the anode plating solution in the independent anode bin.

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