Optical communication module

Abstract

The invention provides an optical communication module which comprises a temperature control circuit, a temperature control assembly, an optical chip and a main control chip, after starting operation, the temperature control circuit enables the temperature control assembly to be at an initially set target temperature, and the main control chip continuously detects the temperature and current intensity and direction of the temperature control assembly through the temperature control circuit; the main control chip calculates the peripheral environment temperature of the optical chip according to the stored environment temperature and current corresponding table and the detected current intensity and direction, determines whether the target temperature of the temperature control assembly needs to be adjusted according to the environment temperature in combination with the stored environment temperature and temperature adjusting value corresponding table and determines the adjusting value; adjustment is completed through an output signal of temperature setting, so that temperature distribution in the optical chip is changed, and the influence of external environment temperature change on the performance of the optical chip is made up.

Description

Technical Field

[0001] The invention relates to an optical communication module, and in particular to a temperature control design of an optical communication module. Background Art

[0002] In the current optical communication field, optical chips such as arrayed waveguide gratings (AWG) and variable optical attenuators (VOA) are widely used. These devices often have temperature-dependent losses (TDL), that is, their optical performance will change with the device temperature. Usually, temperature control is adopted for such devices, and they are always at a certain target temperature during operation to ensure the stability of the optical indicators of the optical chip. However, in actual applications, the temperature of the position where the optical chip is close to the temperature control component can be kept constant. However, since the optical chip has a certain thickness, the temperature of the external environment will still affect the internal temperature distribution of the optical chip, especially when the external environment temperature is greatly different from the target temperature, the effect will become obvious. The other side of the optical chip often has an optical path or an optoelectronic connection, which is not suitable for placing temperature sensors. Placing temperature sensors at other positions of the module cannot accurately obtain the ambient temperature of the optical chip position. Summary of the invention

[0003] The purpose of the present invention is to provide a temperature control solution for an optical communication module in view of the shortcomings of the above-mentioned fixed-point temperature control of the optical chip, so as to solve the problem that the optical communication module cannot accurately obtain the ambient temperature of the optical chip position, and can fine-tune the target temperature of the temperature control, change the temperature distribution inside the optical chip, and reduce the influence of the external ambient temperature on the optical chip.

[0004] To this end, the present invention adopts the following technical solutions:

[0005] An optical communication module comprises a temperature control circuit, a temperature control component, an optical chip and a main control chip, wherein the temperature control component is connected to the temperature control circuit through a wire, the wire is used to transmit the temperature control current and transmit the temperature signal of the contact surface of the temperature control component and the optical chip to the temperature control circuit, the main control chip is connected to the temperature control circuit, obtains the current current intensity and direction, and the temperature of the temperature control component, and has an output signal for setting the target temperature of the temperature control component; one side of the optical chip is tightly packaged on the temperature control component, after starting the operation, the temperature control circuit makes the temperature control component at the initially set target temperature, the main control chip continuously detects the temperature and current intensity and direction of the temperature control component through the temperature control circuit, the main control chip calculates the peripheral environment temperature of the optical chip according to the stored environment temperature and current correspondence table, and the detected current intensity and direction, and determines whether it is necessary to adjust the target temperature of the temperature control component and the adjustment value according to the environment temperature and the stored environment temperature and temperature adjustment value correspondence table, and completes the adjustment through the output signal of the temperature setting, thereby changing the temperature distribution in the optical chip and compensating for the influence of the external environment temperature change on the performance of the optical chip.

[0006] On the basis of adopting the above technical solutions, the present invention may also adopt the following further technical solutions, or combine and apply these further technical solutions:

[0007] The temperature control component includes a heating and cooling component and a temperature sensor, or the temperature control component includes a heating component and a temperature sensor, and the temperature sensor is located on the contact surface between the temperature control component and the optical chip.

[0008] The ambient temperature and current correspondence table is a table in which the optical communication module is placed during the production process. The corresponding high and low temperature environment is generated by the equipment. The optical communication module is placed in this environment, and the current and ambient temperature correspondence table is formed through detection and interpolation algorithm, and stored in the memory of the main control chip or the memory of the optical communication module.

[0009] The correspondence table between ambient temperature and temperature adjustment value is formed during the production process of the optical communication module. The corresponding high and low temperature environment is generated by the equipment. The optical communication module is placed in this environment, and the adjustment value of the target temperature is confirmed by adjusting the temperature of the temperature control component and the index data of the test optical chip. The correspondence table between ambient temperature and target temperature adjustment value is stored in the memory of the main control chip or the memory of the optical communication module.

[0010] During use, if the external environment temperature is detected to be too low, the target temperature of the temperature control component is slightly adjusted higher; if the external environment temperature is detected to be too high, the target temperature of the temperature control component is slightly adjusted lower.

[0011] The target temperature of the temperature control component is determined based on the specific optical property test of the packaged optical chip.

[0012] The present invention has the following beneficial effects: by increasing the detection of the temperature control current to infer the external ambient temperature, the problem that the optical communication module cannot accurately obtain the ambient temperature of the optical chip position is solved, and the target temperature of the temperature control can be fine-tuned to change the temperature distribution in the optical chip, so that the influence of the external ambient temperature on the optical chip is reduced, and the optical indicators of the optical chip at different ambient temperatures are improved to keep them stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of the present invention;

[0014] Figure 2 It is a schematic diagram of the combination of temperature control components and optical chips;

[0015] Figure 3 This is a schematic diagram of the temperature control component and optical chip. DETAILED DESCRIPTION

[0016] The present invention will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms fall within the scope limited by the appended claims of the application equally.

[0017] Reference Figure 1 The optical communication module provided by the present invention includes a temperature control circuit 2, a temperature control component 3, an optical chip 5, and a main control chip 1. The temperature control component 3 is connected to the temperature control circuit 2 through a wire. The temperature control component 3 includes a heating and cooling component and a temperature sensor 4. The heating and cooling component can be a TEC. The heating and cooling component is connected to the temperature control circuit 2 through a wire to transmit the temperature control current. The temperature sensor 4 is located on the contact surface between the temperature control component 3 and the optical chip 2, and is connected to the temperature control circuit 2 through a wire to transmit the temperature signal of the contact surface between the temperature control component and the optical chip to the temperature control circuit 2.

[0018] The main control chip 1 is connected to the temperature control circuit 2, obtains the current intensity and direction currently transmitted to the temperature control component 3, and the temperature of the temperature control component 3, and has an output signal for setting the target temperature of the temperature control component 3; one side of the optical chip 5 is tightly packaged on the heating component and the cooling component of the temperature control component 3, and the optical chip 5 has a certain thickness. The temperature of the side of the optical chip 5 tightly packaged on the temperature control component 3 is consistent with the heating and cooling components of the temperature control component. Affected by the ambient temperature, a temperature gradient is formed inside the optical chip 5; after starting the operation, the temperature control circuit 2 makes the temperature control component 3 at the initially set target temperature, and the main control chip 1 continuously detects the temperature, current intensity and direction of the temperature control component through the temperature control circuit 2. The main control chip 1 calculates the peripheral ambient temperature of the optical chip 5 according to the stored ambient temperature and current correspondence table, and the detected current intensity and direction. According to the ambient temperature, combined with the stored ambient temperature and temperature adjustment value correspondence table, it is determined whether it is necessary to adjust the target temperature of the temperature control component 3, and the adjustment value, and the adjustment is completed through the output signal of the temperature setting, thereby changing the temperature distribution in the optical chip and compensating for the influence of the external ambient temperature change on the performance of the optical chip.

[0019] The ambient temperature and current correspondence table is generated by a high and low temperature environment box during the production process of the optical communication module. The optical communication module is placed in this environment, and the current and ambient temperature correspondence table is formed through detection and interpolation algorithm, and stored in the memory of the main control chip 1.

[0020] The correspondence table between ambient temperature and temperature adjustment value is formed during the production process of the optical communication module. The high and low temperature environment is generated by the high and low temperature environment box equipment. The optical communication module is placed in this environment, and the temperature of the temperature control component is adjusted and the index data of the test optical chip is tested to confirm the adjustment value of the target temperature. The corresponding table between ambient temperature and target temperature adjustment value is stored in the memory of the main control chip 1.

[0021] During use, if it is detected that the external environment temperature is too low, the target temperature of the temperature control component 3 is slightly adjusted higher; if it is detected that the external environment temperature is too high, the target temperature of the temperature control component 3 is slightly adjusted lower.

[0022] The target temperature of the temperature control component 3 is determined according to a specific optical characteristic test of the packaged optical chip 5 .

[0023] This embodiment uses a hardware precision temperature control chip as the main control chip 1 of the temperature control circuit. The output temperature control current of the temperature control chip passes through the temperature control component 3 to make the optical chip 5 at the target temperature. The temperature control temperature is fed back to the temperature control chip through the temperature sensor 4 integrated on the temperature control component 3 via the temperature control circuit to form a closed-loop control. The hardware precision temperature control chip will output a signal according to the current temperature and the target temperature, and automatically adjust the temperature control current to stabilize the temperature control temperature to the target operating temperature of the optical chip 5; the main control chip obtains the current temperature of the optical chip through the temperature feedback 6 output by the precision temperature control circuit, and obtains the temperature control current through the current feedback 7. The main control chip 1 uses a 32-bit MCU to run a program on it.

[0024] After the module is powered on, the main control chip sets the temperature control temperature as the target temperature. After the temperature control reaches the target, the temperature control current is detected. According to the pre-calibrated and stored data, the external temperature conditions are determined, and the fine-tuning value of the target temperature is determined. The fine-tuned target temperature is then set to the temperature control circuit.

[0025] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the protection scope of the present invention.

Claims

1. An optical communication module, comprising a temperature control circuit, a temperature control component, an optical chip, and a main control chip, characterized in that: The temperature control component is connected to the temperature control circuit through a wire, and the wire is used to transmit the temperature control current and transmit the temperature signal of the contact surface of the temperature control component and the optical chip to the temperature control circuit. The main control chip is connected to the temperature control circuit to obtain the current current intensity and direction, as well as the temperature of the temperature control component, and has an output signal for setting the target temperature of the temperature control component; one side of the optical chip is tightly packaged on the temperature control component. After starting the operation, the temperature control circuit makes the temperature control component at the initially set target temperature. The main control chip continuously detects the temperature and current intensity and direction of the temperature control component through the temperature control circuit. The main control chip calculates the peripheral ambient temperature of the optical chip based on the saved ambient temperature and current correspondence table, and the detected current intensity and direction. Based on the ambient temperature, combined with the saved ambient temperature and temperature adjustment value correspondence table, it is determined whether the target temperature of the temperature control component needs to be adjusted, and the adjustment value, and the adjustment is completed through the output signal of the temperature setting, thereby changing the temperature distribution in the optical chip and compensating for the impact of the external ambient temperature change on the performance of the optical chip.

2. An optical communication module according to claim 1, characterized in that: The temperature control component includes a heating and cooling component and a temperature sensor, or the temperature control component includes a heating component and a temperature sensor, and the temperature sensor is located on the contact surface between the temperature control component and the optical chip.

3. An optical communication module according to claim 1, characterized in that: The ambient temperature and current correspondence table is a table in which the optical communication module is placed during the production process. The corresponding high and low temperature environment is generated by the equipment. The optical communication module is placed in this environment, and the current and ambient temperature correspondence table is formed through detection and interpolation algorithm, and stored in the memory of the main control chip or the memory of the optical communication module.

4. An optical communication module according to claim 1, characterized in that: The correspondence table between ambient temperature and temperature adjustment value is formed during the production process of the optical communication module. The corresponding high and low temperature environment is generated by the equipment. The optical communication module is placed in this environment, and the adjustment value of the target temperature is confirmed by adjusting the temperature of the temperature control component and the index data of the test optical chip. The correspondence table between ambient temperature and target temperature adjustment value is stored in the memory of the main control chip or the memory of the optical communication module.

5. An optical communication module according to claim 1, characterized in that: During use, if the external environment temperature is detected to be too low, the target temperature of the temperature control component is slightly adjusted higher; if the external environment temperature is detected to be too high, the target temperature of the temperature control component is slightly adjusted lower.

6. An optical communication module according to claim 1, characterized in that: The target temperature of the temperature control component is determined based on the specific optical property test of the packaged optical chip.

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