Temperature control switch

Abstract

The temperature-controlled switch includes: a switch housing having a lower portion and a cover portion closing the lower portion; a contact carrier element arranged in the switch housing and comprising a contact surface wherein at least one section of the contact carrier element is fixed in place by interaction of the lower portion and the cover portion; and a temperature-controlled switching mechanism disposed in the switch housing and including a movable contact portion that interacts with the contact surface, in which the switching mechanism is configured to switch in a temperature-controlled manner between a low-temperature state in which it presses the movable contact portion against the contact surface and a high-temperature state in which it presses the movable contact portion against the contact surface. In a high-temperature state, it holds the movable contact portion spaced apart from the contact surface and thus establishes an electrical connection between the first electrical terminal of the switch and the second electrical terminal of the switch, in a high-temperature state, it holds the movable contact portion spaced apart from the contact surface and thus interrupts the electrical connection between the first electrical terminal and the second electrical terminal.

Description

Technical Field

[0001] The invention relates to a temperature control switch. Background Art

[0002] In principle, a large number of temperature-dependent switches are already known. Exemplary temperature-dependent switches are disclosed in DE 10 2018 100 890 B3, DE 10 2009 030353 B3, DE 197 27 383 A1 and DE 197 27 197 A1.

[0003] Such temperature-dependent switches are used to monitor the temperature of a device in a manner known in principle. For this purpose, the switch makes thermal contact with the device to be protected, for example via one of its outer surfaces, so that the temperature of the device to be protected affects the temperature of a switching mechanism arranged inside the switch.

[0004] The switch is usually electrically connected in series to the supply circuit of the device to be protected via a connecting cable, so that below the response temperature of the switch, the supply current of the device to be protected flows through the switch.

[0005] In the switch disclosed in DE 10 2018 100 890 B3, the switching mechanism is arranged inside the switch housing. The switch housing is a closed housing in which the switching mechanism is sealed against the outside. The switch housing is formed in two parts. It comprises a lower part which is enclosed by a cover part. The cover part is fixed to the lower part. For this purpose, the lower part comprises a raised circumferential edge whose free upper edge is bent or flanged onto the cover part.

[0006] The temperature-controlled switching mechanism arranged in the switch housing comprises a spring element to which a movable contact part is fixed and a bimetallic element interacting with the movable contact part. The spring element presses the movable contact part against a stationary counter contact arranged on the inner side of the switch housing on the cover part. The outer edge of the spring element, which is configured as a snap-action spring disk, is supported in the lower part of the switch housing so that the current flows from the lower part through the snap-action spring disk and the movable contact part into the stationary counter contact and from there into the cover part.

[0007] The temperature-controlled bimetallic element in the switch disclosed in DE 10 2018 100 890 B3 has a disk-shaped design and is generally referred to as a bimetallic snap-action disk, which is essentially responsible for the temperature-controlled switching behavior of the switching mechanism. The bimetallic element is generally constructed as a multilayer, active, sheet-like device consisting of two, three or four interconnected components with different thermal expansion coefficients. The connection of the independent metal or metal alloy layers in a bimetallic element of this type is generally material locking or positive locking and is achieved, for example, by rolling.

[0008] Such a bimetallic element has a first stable geometric configuration (low temperature configuration) at a low temperature below the response temperature of the bimetallic element, and has a second stable geometric configuration (high temperature configuration) at a high temperature above the response temperature of the bimetallic element. The bimetallic element moves quickly from its low temperature configuration to its high temperature configuration in a hysteresis-controlled manner.

[0009] Therefore, if the temperature of the bimetallic element increases due to the temperature rise in the device to be protected, exceeding the response temperature of the bimetallic element, the bimetallic element snaps from its low temperature configuration to its high temperature configuration. As a result, the bimetallic element works against the spring element so that it lifts the movable contact part from the stationary counter contact, so that the switch opens and the device to be protected is closed and cannot be heated further.

[0010] Unless a reset lock is provided, the bimetallic element snaps back into its cold configuration so that the switch closes again as soon as the temperature of the bimetallic element drops below the so-called reset temperature of the bimetallic element due to cooling of the device to be protected.

[0011] In its low temperature configuration, the bimetallic element is preferably mounted in a mechanically force-free manner in the switch housing, wherein the bimetallic element is also not used to carry current. This has the following advantages: the bimetallic element has a longer service life and the switching point (i.e. the response or switching temperature of the bimetallic element) does not change even after many switching cycles.

[0012] In order for such a temperature-dependent switch to function properly, it is extremely important that the individual components of the temperature-dependent switching mechanism and the switch housing are matched to one another very accurately. In particular, it is important in this respect that the level of the interior of the switch housing matches the level of the switching mechanism in the low-temperature state very accurately, so that, for example, the contact pressure between the moving contact part and the stationary counter contact is correctly set. This also has an impact on the contact resistance that occurs at the transition between the individual components of the switching mechanism and therefore also on the performance of the switch.

[0013] For these reasons, the individual components of such temperature-dependent switches must be manufactured with very tight tolerances and must match each other very accurately in terms of dimensions. Therefore, a very precise preliminary inspection of the individual switch components is necessary. In some cases, it is also necessary to manually rework individual components or to manually select suitable component pairs depending on the manufacturing tolerances in order to comply with the overall tolerances. This makes the automated assembly of such temperature-dependent switches more difficult.

[0014] In the switch disclosed in DE 10 2018 100 890 B3, the level of the interior of the switch housing is determined in particular by using a spacer ring, which is arranged inside the switch housing between the lower part and the cover part and keeps the two parts at a certain distance. By using spacer rings of different heights, the level of the housing interior and thus the contact pressure can be adjusted accordingly according to customer requirements. This can also be used to compensate for manufacturing tolerances of the switching mechanism components. However, the level of the spacer ring then usually has to be adjusted manually to the manufacturing tolerances of the switching mechanism components.

[0015] Therefore, there is still room for further improvement. In particular, the manufacturability of the switch can be improved, its assembly can be simplified and a higher degree of automation can be achieved. Summary of the invention

[0016] The object of the invention is therefore to provide a temperature-dependent switch in which in particular the above-mentioned points are further improved. In particular, this is intended to simplify the assembly process and to enable variable adaptation to certain customer requirements, for example with regard to the setting of the contact resistance between the switching mechanism components.

[0017] According to the present invention, this object is solved by a temperature-controlled switch, which comprises the following components: - a switch housing having a lower part and a cover part closing the lower part; a contact carrier element arranged in the switch housing and comprising a contact surface, wherein at least a section of the contact carrier element is fixed in place by the interaction of the lower part and the cover part; and A temperature-controlled switching mechanism, which is arranged in the switch housing and includes a movable contact portion, which interacts with the contact surface arranged at the contact carrier element, wherein the switching mechanism is configured to switch between a low-temperature state and a high-temperature state in a temperature-controlled manner. In the low-temperature state, it presses the movable contact portion against the contact surface and thereby establishes an electrical connection between a first electrical terminal of the switch and a second electrical terminal of the switch, and in the high-temperature state, it keeps the movable contact portion spaced apart from the contact surface and thereby interrupts the electrical connection between the first electrical terminal and the second electrical terminal.

[0018] In the switch according to the invention, unlike most switches known to date, the stationary contact surface (herein referred to as "contact surface") which interacts with the movable contact part in the low-temperature state of the switching mechanism is not arranged at the cover part, but is arranged on an additional contact carrier element which is arranged in the switch housing and is fixed in place by the interaction of the lower part and the cover part.

[0019] "Fixed in position by the interaction of the lower part and the cover part" means that the contact carrier element is fixed in position by the interaction of the two switch housing parts (cover part and lower part). The contact carrier element is thus only fixed in position when the two switch housing parts are connected to each other. Only then do the two switch housing parts together exert a force on the contact carrier element, thereby fixing it in its position.

[0020] The additional contact carrier element provided according to the invention has various advantages. On the one hand, the mechanical stability of the switch structure is improved by providing an additional contact carrier element. On the other hand, the contact pressure with which the movable contact part is pressed against the contact surface in the low-temperature state of the switching mechanism can be determined or adjusted very easily by a corresponding adjustable shaping of the contact carrier element. In particular, it is advantageous that this type of contact pressure adjustment can be carried out almost independently of the shape of the lower part and the covering part of the switch housing. By selecting contact carrier elements of different shapes, it is possible, for example, to achieve different contact pressures and thereby also different contact resistances in the same switch housing, depending on customer requirements, without having to change the shape of the lower part and the covering part of the switch housing.

[0021] The contact carrier element also makes it relatively easy to compensate for manufacturing tolerances on the switching mechanism components, for example by adapting the shape of the contact carrier element or making it elastic or resilient. Thus, the initial check mentioned at the beginning regarding manufacturing tolerances of individual housing parts or switching mechanism components can be omitted or at least reduced to a minimum.

[0022] Furthermore, the provision of the contact carrier element has the additional advantage that one or both external terminals can be soldered to the cover part, which is otherwise not possible or only possible with difficulty, since the stationary counter contact usually becomes detached from the cover part due to the heat generated thereby. However, since the contact surface is now arranged at the contact carrier element instead of at the cover part, this problem is also solved at the same time.

[0023] The switch according to the invention can be manufactured both manually and fully automatically. For the reasons mentioned above, fully automatic production is also simplified by the contact carrier element.

[0024] Therefore, the above mentioned objects are fully achieved.

[0025] In a refinement, the switching mechanism is either (i) arranged between the contact carrier element and the lower part, and the contact carrier element is connected to the cover part in an electrically conductive manner, or (ii) the switching mechanism is arranged between the contact carrier element and the cover part, and the contact carrier element is connected to the lower part in an electrically conductive manner.

[0026] In other words, the switching mechanism is arranged between one of the two housing parts (cover part or lower part) and the contact carrier element. The contact carrier element thus acts as a kind of additional cover or additional lower part interacting with the switching mechanism.

[0027] If the switching mechanism is arranged between the contact carrier element and the lower part according to alternative (i), the electrically conductive connection between the contact carrier element and the cover part is preferably achieved by the contact carrier element resting against the cover part. On the other hand, if the switching mechanism is arranged between the contact carrier element and the cover part according to alternative (ii), the electrically conductive connection between the contact carrier element and the lower part is preferably achieved by the contact carrier element resting against the lower part.

[0028] Viewed in reverse, the contact carrier element is arranged according to alternative (i) between the switching mechanism and the cover part and according to alternative (ii) between the switching mechanism and the lower part.

[0029] In a further refinement, the at least one section of the contact carrier element secured in place by the interaction of the lower portion and the cover portion comprises an outer edge of the contact carrier element and a central region of the contact carrier element is spaced apart from both the lower portion and the cover portion.

[0030] In other words, the contact-carrier element is preferably fixed in position on its edge side by the interaction of the lower part and the cover part. Particularly preferably, the at least one section of the contact-carrier element comprises the radially outer edge of the contact-carrier element. This has the advantage that the edge side of the contact-carrier element is mounted in a manner that saves as much space as possible, while the central area of ​​the contact-carrier element is freely accessible to the switching mechanism and can be relatively freely shaped to correspond to the desired customer specifications with regard to contact pressure and contact resistance. Due to the fact that the central area of ​​the contact-carrier element is spaced apart from both the lower part and the cover part, this central area is flexible or resilient, which ensures optimal tolerance compensation.

[0031] In a further development, the contact-carrier element, in particular an outer edge of the contact-carrier element, is clamped directly or indirectly between the lower part and the cover part.

[0032] Such a clamping arrangement between the lower part and the cover part is a particularly easy way to fix the position of the contact carrier element. Thus, during assembly of the switch, the contact carrier element can be easily inserted into the interior of the switch housing at the desired position, so that the switch housing can then be closed by fixing the cover part to the lower part, or vice versa. No additional effort is required during the assembly of the contact carrier element. On the contrary, due to the aforementioned advantages brought about by the contact carrier element, this assembly effort can be reduced.

[0033] "Indirectly clamped" in the present case means that the contact carrier element is clamped together by the cover part and the lower part, but it does not necessarily have to be in direct contact with the two switch housing parts. In addition, housing parts or elements can be arranged between them.

[0034] In an improvement, the temperature controlled switching mechanism includes a first spring element interacting with the movable contact portion and a bimetallic element interacting with the movable contact portion.

[0035] The first spring element is preferably configured as a temperature-independent disk-shaped spring disk. The bimetallic element is preferably configured as a temperature-controlled disk-shaped bimetallic disk. In a top plan view, the contact contact element is also preferably circular.

[0036] In a development, the contact carrier element is designed in a cap-like manner and has a thinner wall thickness than the cover part.

[0037] According to this refinement, the contact carrier element thus acts as a kind of sub-cover, which is arranged inside the switch housing between the cover part and the lower part, and on which the (stationary) contact surface is arranged. A thinner wall thickness compared to the cover part has the advantage that the contact carrier element can be constructed to be more flexible or elastic than the cover part. In other words, the cover part still serves as the primary protection and mechanical stability carrier, while the contact carrier element can be relatively thin-walled in order to be variably adaptable to the shape of the switching mechanism.

[0038] In a further improvement, the switching mechanism comprises the above-mentioned first spring element, which in the low-temperature state of the switching mechanism applies a first spring force by which the movable contact portion is pressed against the contact surface.

[0039] The first spring element is preferably a snap-action spring disk, as is usually inserted in the switching mechanism of such a temperature-dependent switch. In the low-temperature state of the switching mechanism, the first spring element preferably serves as a current-carrying component.

[0040] In a further development, the contact carrier element comprises a second spring element which, in the low-temperature state of the switching mechanism, applies a second spring force by which the contact surface is pressed against the movable contact part.

[0041] The first spring force exerted by the first spring element is preferably opposite to the second spring force exerted by the second spring element.

[0042] According to this refinement, the contact carrier element can include the second spring element or be formed entirely therefrom. In other words, the contact carrier element can also be configured as a (second) spring element in its entirety. Regardless of whether the contact carrier element includes the second spring element or is formed entirely therefrom, such a resilient configuration of the contact carrier element has the advantage that in the low temperature state of the switching mechanism, the contact pressure with which the movable contact part is pressed against the contact surface can thereby be significantly increased.

[0043] Compared to conventional temperature-dependent switches, two reaction springs are used in the switch according to this configuration, both of which ensure that in the low-temperature state of the switch the movable contact part is pressed against the contact surface arranged at the contact carrier element. By means of this increased contact pressure, the contact resistance between the movable contact part and the contact surface can be reduced, thereby increasing the performance of the switch.

[0044] The suspended or resilient configuration of the contact carrier element also improves the already mentioned compensation of mechanical tolerances which is achieved by the contact carrier element.

[0045] The second spring force exerted by the second spring element in the contact carrier element is preferably greater in magnitude than the first spring force exerted by the first spring element belonging to the switching mechanism.

[0046] This has the advantage that the contact pressure is mainly caused by the second spring element. This is in turn advantageous, in particular because the disconnection force required to disconnect the switching mechanism (i.e. to move the switching mechanism from its low temperature state to its high temperature state) can be lower than the usual disconnection force. In order to disconnect the switching mechanism, the first spring force caused by the first spring element must be overcome. This is usually done by a bimetallic element belonging to the switching mechanism.

[0047] With regard to the spring travel, the first spring element preferably has a greater spring travel than the second spring element.

[0048] This has the advantage that when the switching mechanism is disconnected, i.e. when shifting from the low temperature state to the high temperature state, the second spring element does not bend too much and does not follow the movement of the movable contact part. Thus, although the two spring elements work against each other, effective disconnection of the switching mechanism can be achieved when the response temperature is reached.

[0049] Preferably, in the high temperature state of the switching mechanism, the bimetallic element applies a disconnection force to the movable contact portion, the disconnection force being opposite to and greater in magnitude than the first spring force.

[0050] When the response temperature is reached, the bimetallic element therefore snaps into its high-temperature configuration and thereby lifts the movable contact part away from the contact surface arranged at the contact carrier element counter to the spring force exerted by the first spring element.

[0051] In a further refinement, the first electrical terminal of the switch is arranged on an outer side of the cover portion, and the second electrical terminal of the switch is arranged on an outer side of the lower portion.

[0052] This ensures that the temperature-dependent switch can be easily electrically connected.

[0053] In a further development, the switch further comprises an insulating foil arranged between the lower part and the contact carrier element.

[0054] The contact carrier element is thus effectively electrically insulated from the lower part.

[0055] Preferably, the contact carrier element and the lower portion are each made of an electrically conductive material.

[0056] In a further development, the lower part comprises a free upper edge which is flange-mounted to the cover part or is bent onto the cover part.

[0057] This results in the simplest and most stable type of fixation possible between the lower part and the covering part, as is known, for example, from DE 10 2018 100 890 B3.

[0058] It is understood that the features mentioned above and those yet to be explained below can be used not only in the combination indicated in each case but also in other combinations or alone, without departing from the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] An embodiment of the invention is shown in the drawings and explained in more detail in the following description. It shows: Figure 1 is a schematic cross-sectional view of a temperature-controlled switch according to a first embodiment, wherein the switch is in its low temperature state; Figure 2 yes Figure 1 A schematic cross-sectional view of a temperature controlled switch shown in , wherein the switch is in its high temperature state; Figure 3 is a schematic cross-sectional view of a temperature controlled switch according to a second embodiment, wherein the switch is in its low temperature state; Figure 4 is a schematic cross-sectional view of a temperature controlled switch according to a third embodiment, wherein the switch is in its low temperature state; and Figure 5 is a schematic cross-sectional view of a temperature controlled switch according to a fourth embodiment, wherein the switch is in its low temperature state. DETAILED DESCRIPTION

[0060] Figures 1 to 5 Four different embodiments of a switch according to the invention are shown in each case in a schematic sectional view. The switch is denoted in its entirety by the reference numeral 10 in each case.

[0061] Regarding the switch according to the first embodiment, Figure 1 shows the low temperature state of the switch 10, and Figure 2 A high temperature state of the switch 10 is shown.

[0062] The switch 10 is constructed rotationally symmetrically and has a circular shape when viewed from above. The switch 10 comprises a switch housing 12 in which a temperature-dependent switching mechanism 14 is arranged. The switch housing 12 comprises a pot-shaped lower part 16 and a cover part 18, which is held on the lower part 16 by a free upper edge 20 that is bent or flanged.

[0063] The lower part 16 and the cover part 18 are made of an electrically conductive material, preferably a metal. In the embodiment shown here, the lower part 16 is a deep-drawn steel housing, which results in a relatively high pressure resistance. An insulating foil 22 is arranged between the lower part 16 and the cover part 18, which serves to electrically insulate the two switch housing parts 16, 18.

[0064] The upper edge 20 of the lower part 16 is bent radially inwards so that it presses the cover part 18 in the direction of a circumferential shoulder 24 provided in the lower part 16. The cover part 18 thus completely encloses the lower part 16. In addition to electrical insulation, the insulating foil 22 also provides a sufficient mechanical seal between the lower part 16 and the cover part 18 so that the interior of the switch housing 12 is sealed from the outside. This prevents liquids or impurities from entering the interior of the housing from the outside.

[0065] The switching mechanism 14 arranged inside the switch housing 12 comprises a temperature-independent spring element 26 and a temperature-controlled bimetallic element 28. The spring element 26 is preferably designed as a disk-shaped spring disk. Particularly preferably, the spring element 26 is designed as a bistable spring disk, which comprises two temperature-independent stable geometric structures. Figure 1 A first geometric configuration is shown in FIG. Figure 2 A second geometric configuration is shown in .

[0066] The temperature control bimetallic element 28 is preferably designed as a bimetallic disk, which includes two temperature control structures, a geometric low temperature structure (see Figure 1 ) and geometric high temperature configuration (see Figure 2 ).

[0067] exist Figure 1In the low temperature state of the switching mechanism 14 shown in FIG, the spring element 26 rests with its edge 30 on a contact surface 34 protruding upward from the inner bottom surface 32 of the lower part. The inner bottom surface 32 is substantially concave in shape and is slightly raised relative to the central area of ​​the inner bottom surface 32 at the point where the edge 30 of the spring element rests in the low temperature state of the switching mechanism 14. Figure 1 In the low temperature state of the switching mechanism 14 shown in FIG, the edge 36 of the bimetallic element 28 rests on the spring element 26 .

[0068] The spring element 26 is fixed by its center 38 to a movable contact part 40 of the switching mechanism 14. The movable contact part 40 is preferably connected to the spring element 26 in a material-locked and / or positively locked manner. For example, the contact part 40 is welded or soldered to the spring element 26.

[0069] The bimetallic element 28 can also be fixed to the movable contact part 40 by means of its center 42. However, the bimetallic element 28 can also be loosely connected to the contact part 40, in that its centrally arranged opening slides over the contact part 40 and its center or the inner edge surrounding the opening rests from above on a supporting shoulder 44 provided on the contact part 40.

[0070] exist Figure 1 In the low temperature state of the switching mechanism 14 shown in , the movable contact part 40 interacts with the contact surface 46 provided on the lower side of the contact part 48. In this low temperature state of the switching mechanism 14, the spring element 26 presses the movable contact part 40 against the contact surface 46 of the contact part 48 from below.

[0071] The contact portion 48 is arranged on the contact carrier element 50, at Figure 1 and Figure 2 In the embodiment shown in , the contact carrier element 50 has a cover-like configuration. The cover-like contact carrier element 50 is also made of an electrically conductive material and preferably comprises a thinner wall thickness than the cover part 18 of the switch housing 12 arranged above it.

[0072] In the region of its outer edge 52, the contact carrier element 50 rests on a shoulder 24 arranged inside the lower part 16 by means of the inserted insulating foil 22. The contact carrier element 16 rests with its top side in the region of its outer edge 52 on the bottom side of the cover part 18. The outer edge 52 of the contact carrier element 50 is thus fixed in place by the interaction of the lower part 16 and the top part 18, since it is clamped between the lower part 16 and the cover part 18.

[0073] The central region 54 of the contact carrier element 50 is spaced apart from both the lower portion 16 and the upper portion 18 inside the switch housing 12. Thus, the central region 54 of the contact carrier element 50 has limited movement within the switch housing 12 depending on the elasticity of the contact carrier element 50.

[0074] exist Figure 1 and Figure 2 In the first embodiment shown in FIG. 1 , the contact carrier element 50 forms a kind of lower cover arranged between the cover part 18 and the switching mechanism 14. In the low temperature state of the switch 10 (see Figure 1 ), the movable contact part 40 of the switching mechanism 14 is supported on the contact carrier element 50. In this switching position of the switching mechanism 14, the contact carrier element 50 accordingly exerts a force on the movable contact part 40, which is opposite to the force exerted on the movable contact part 40 by the spring element 26.

[0075] Depending on the shape of the contact carrier element 50, the contact pressure between the movable contact part 40 and the contact surface 46 can be adjusted. For example, if a contact carrier element is used which is more upwardly curved in its central region 54, the contact pressure can be reduced compared to a contact carrier element 50 which is relatively flatter in its central region 54. This can also compensate for corresponding manufacturing tolerances of the switching mechanism components 26, 28, 40 and the housing components 16, 18.

[0076] exist Figure 1 In the low temperature state shown in , the switching mechanism 14 establishes an electrically conductive connection between the first electrical terminal 56 and the second electrical terminal 58. In the present embodiment, the upper side of the cover part 18 serves as the first electrical terminal 56. In the present embodiment, a welding connection ring that is welded or soldered to the lower part 16 of the switch housing 12 serves as the second electrical terminal 58. Thus, in the low temperature state of the switch 10, the current can flow from the first terminal 56 through the cover part 18 into the contact carrier element 50, and from there via the contact part 48 into the contact part 40, and via the spring element 26 into the lower part 16, and thus finally to the second terminal 58 (or vice versa).

[0077] from Figure 1 Starting from the condition shown in FIG. 1 , if the temperature of the device to be monitored by the switch 10 and therefore the temperature of the switch 10 and the switching mechanism 14 used therein rises above the response temperature of the bimetallic element 28, the bimetallic element 28 changes from Figure 1 Its low temperature structure shown in the fast motion to Figure 2. The upper side of the bimetallic element 28 thus snaps from a convex curvature to a concave curvature. The bimetallic element 28 is then supported from below on the contact carrier element 50 by means of its outer edge 36, with the insulating foil 22 in the middle. At the same time, the bimetallic element 28 presses the movable contact part 40 downwards by means of its center 42 and lifts it off the contact surface 46. During this switching movement, the bimetallic element 28 exerts a force that acts against the force exerted by the spring element 26 on the contact part 40 in the low temperature state. As a result, the spring element 26 also moves from the contact carrier element 50 in the low temperature state. Figure 1 Its first convex shape shown on the upper side of the quick move into Figure 2 Its concave shape on the upper side is shown in .

[0078] This interrupts the flow of current through the switch 10. The switch 10 is thus opened.

[0079] Figure 3 A further embodiment of a switch 10 according to the invention is shown. Figure 3 The second embodiment shown in Figure 1 and Figure 2 The first embodiment shown in FIG. 1 differs in particular in that the contact surface 46 is arranged directly on the contact carrier element 50, i.e. no additional contact portion 48 is attached to the contact carrier element 50. Therefore, the contact carrier element 50 is here slightly flatter than in the first embodiment. In particular, the central region 54 of the contact carrier element 50 is therefore relatively further away from the bottom side of the cover part 18.

[0080] Figure 4 A third embodiment of a switch 10 according to the invention is shown, in which the contact carrier element 50 comprises a spring element 60. The spring element 60 is preferably arranged in the central region 54 of the contact carrier element 50, wherein the contact portion 58 on which the contact surface 46 is arranged is arranged at the spring element 60. In principle, however, it is also possible for the contact carrier element 50 to be configured as a spring element 60 in its entirety.

[0081] In the following, the spring element 60 is referred to as a “second spring element” in order to better distinguish it from the spring element 26. In the following, the spring element 26 is referred to as a “first spring element”.

[0082] The contact carrier element 50 is designed as a kind of counter-spring which counteracts the spring element 26 in the cold state of the switching mechanism 14. This allows an increased contact force which presses the movable contact part 40 against the contact surface 46 in the cold state of the switching mechanism 14. This has the advantage that the contact resistance can be reduced and thus the performance of the switch 10 can be improved. In addition, the second spring element 60 enables further tolerance compensation.

[0083] The spring force applied by the first spring element 26 is opposite to the spring force applied by the second spring element 60. Preferably, the spring force applied by the second spring element 60 to the movable contact portion 40 via the contact portion 48 is greater in magnitude than the spring force applied by the first spring element 26 to the contact portion 40. However, the second spring element 60 preferably has a smaller spring travel than the first spring element 26.

[0084] Figure 5 A fourth embodiment of a switch 10 according to the invention is shown, in which a contact carrier element 50 is arranged below the switching mechanism 14, i.e. between the switching mechanism 14 and the lower part 16. The contact carrier element 50 is inserted into the lower part 16 and is clamped by means of its outer edge 52 between the lower part 16 and a spacer ring 62 acting as a hold-down. The spacer ring 62 can be made of an electrically conductive material or an electrically insulating material. The cover part 18 rests on this spacer ring 62 from above by means of an interposed insulating foil 22. Thus, also according to this embodiment, the contact carrier element 50 is clamped indirectly between the lower part 16 and the cover part 18 and is fixed in its position by the interaction of the lower part 16 and the cover part 18.

[0085] and Figures 1 to 4 Compared to the embodiment shown in , the switching mechanism 14 is inverted by 180°. In the low temperature state of the switch 10, the first spring element 26 is supported by its outer edge 30 on the underside of the cover part 18 and presses the contact part 40 upward against the contact surface 46 arranged on the contact carrier element 50. In this switching state, the outer edge 36 of the bimetallic element 28 hangs freely below it.

[0086] However, in Figure 5 In the high temperature state of the switch 10 shown in FIG. 1 (the high temperature state is not shown separately), the bimetallic element 28 is supported on the spacer ring 62 by means of its outer edge 36 and thereby lifts the movable contact part 40 away from the contact surface 46, so that the switch 10 is opened.

[0087] In the fourth embodiment, the contact portion 40 is formed in two parts. Both the spring element 26 and the bimetallic element 28 remain captured on the contact portion 40 by means of their respective centers 38, 42, the contact portion 40 being configured as a rivet.

[0088] It will be appreciated that various further modifications of the embodiments shown are possible without departing from the scope of the present invention.

Claims

1. A temperature control switch (10), comprising: A switch housing (12), the switch housing having a lower portion (16) and a cover portion (18) enclosing the lower portion (16); a contact carrier element (50) arranged in the switch housing (12) and comprising a contact surface (46), wherein at least a section of the contact carrier element (50) is fixed in place by interaction of the lower part (16) and the cover part (18); and A temperature-controlled switching mechanism (14) is arranged in the switch housing (12) and comprises a movable contact part (40), the movable contact part (40) interacting with the contact surface (46) arranged at the contact carrier element (50), wherein the switching mechanism (14) is configured to switch between a low temperature state and a high temperature state in a temperature-controlled manner, in which the switching mechanism (14) presses the movable contact part (40) into contact with the contact surface (46) and thereby establishes an electrical connection between a first electrical terminal (56) of the switch (10) and a second electrical terminal (58) of the switch (10), and in which the switching mechanism (14) keeps the movable contact part (40) spaced apart from the contact surface (46) and thereby interrupts the electrical connection between the first electrical terminal (56) and the second electrical terminal (58).

2. The temperature control switch according to claim 1, (i) Of which, The switching mechanism (14) is arranged between the contact carrier element (50) and the lower part (16), and wherein the contact carrier element (50) is connected to the cover part (18) in an electrically conductive manner, or (ii) wherein the switching mechanism (14) is arranged between the contact carrier element (50) and the cover part (18), and wherein the contact carrier element (50) is connected to the lower part (16) in an electrically conductive manner.

3. The temperature controlled switch according to claim 1, wherein: The at least one section of the contact carrier element (50) that is secured in place by the interaction of the lower portion (16) and the cover portion (18) comprises an outer edge (52) of the contact carrier element (50), and wherein a central region (54) of the contact carrier element (50) is spaced apart from both the lower portion (16) and the cover portion (18).

4. The temperature controlled switch according to claim 1, wherein: The contact carrier element (50) is clamped directly or indirectly between the lower part (16) and the cover part (18).

5. The temperature controlled switch according to claim 1, wherein: The contact carrier element (50) is designed in a cap-like manner and has a thinner wall thickness than the cover part (18).

6. The temperature controlled switch according to claim 1, wherein: The switching mechanism (14) comprises a first spring element (26), and in the low temperature state of the switching mechanism (14), the first spring element (26) applies a first spring force, by which the movable contact part (40) is pressed against the contact surface (46).

7. The temperature controlled switch according to claim 6, wherein: The contact carrier element (50) comprises a second spring element (60) which, in the low temperature state of the switching mechanism (14), applies a second spring force by which the contact surface (46) is pressed against the movable contact part (40).

8. The temperature controlled switch according to claim 7, wherein: The first spring force is opposite to the second spring force.

9. The temperature controlled switch according to claim 8, wherein: The second spring force is greater than the first spring force.

10. The temperature controlled switch according to claim 7, wherein: The first spring element (26) has a greater spring travel than the second spring element (60).

11. The temperature controlled switch according to claim 1, wherein: The switching mechanism (14) comprises a bimetallic element (28).

12. The temperature controlled switch according to claim 11, wherein: In the high temperature state of the switching mechanism (14), the bimetallic element (28) exerts a disconnection force on the movable contact portion (40), the disconnection force being opposite to and greater than the first spring force.

13. The temperature controlled switch according to claim 1, wherein: The first electrical terminal (56) is arranged on an outer side of the cover portion (18), and the second electrical terminal (58) is arranged on an outer side of the lower portion (16).

14. The temperature controlled switch according to claim 1, wherein: The switch (10) further comprises an insulating foil (22) arranged between the lower part (16) and the contact carrier element (50).

15. The temperature controlled switch according to claim 1, wherein: The lower part (16) comprises a free upper edge (20) which is flange-mounted to the cover part (18) or which is bent onto the cover part (18).

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