Substrate transmission platform and semiconductor processing equipment comprising same

Abstract

The present invention provides a substrate transfer platform and a semiconductor processing apparatus including the same, the substrate transfer platform comprising: a main body part having a transfer space formed therein, a bonding surface formed on a side surface, and a first transfer port formed on the bonding surface and penetrating to the transfer space; the first side surface of the adaptation part is combined with the combination surface, a specified number of connection surfaces used for being connected with processing cavities are formed on the second side surface located on the opposite side of the first side surface, and a second transmission port penetrating to the first side surface is formed in each connection surface. The semiconductor processing equipment comprises the substrate transmission platform; and the processing chamber is connected to the connecting surface of the adaptive part in a manner of communicating with the second transmission port of the adaptive part of the substrate transmission platform.

Description

Technical Field

[0001] The present invention relates to a substrate transfer platform and semiconductor processing equipment comprising the same, and in particular to a substrate transfer platform capable of selecting and adjusting the connection quantity and connection position of a processing chamber and semiconductor processing equipment comprising the same. Background Art

[0002] Generally, the manufacturing process of semiconductor products includes multiple processing steps, wherein different processing steps need to be performed in different processing chambers. Therefore, semiconductor processing equipment used to manufacture semiconductor products often includes multiple processing chambers. In order to transfer substrates to these processing chambers respectively, the semiconductor processing equipment also includes a special substrate transfer platform.

[0003] Usually, the substrate transfer platform is in the form of a cavity, and a transfer space is formed inside to transfer and temporarily store the substrate. In addition, a plurality of openings are formed on the side wall of the substrate transfer platform as film transfer ports, and these openings are connected to different processing chambers one-to-one, so that the substrate in the transfer space can be transferred to the corresponding processing chamber through the corresponding opening according to the processing steps to be performed. After completing a processing step, the substrate is taken back to the transfer space and then enters the next processing chamber through the next opening to perform the next processing step. This is repeated, and finally, the substrate that has completed all the processing steps is output to the outside of the semiconductor processing equipment through the transfer space.

[0004] Figure 1 It is a schematic diagram of semiconductor processing equipment in the prior art.

[0005] In order to improve the substrate transfer efficiency, such as Figure 1 As shown, those skilled in the art usually arrange the semiconductor processing equipment 1 with the substrate transfer platform 2 as the center and the processing chambers 3 arranged around it. Specifically, according to the number of processing chambers 3 to be connected, the substrate transfer platform 2 is manufactured into a specified polygonal column shape, so that a predetermined number of flat surfaces with openings are formed on the side surface of the substrate transfer platform 2, and the processing chambers 3 are arranged on these flat surfaces.

[0006] However, the disadvantage of this substrate transfer platform 2 is that the number and position of the processing chambers 3 are predetermined and cannot be changed later. Therefore, it can only be applied to a specific semiconductor processing technology, and is difficult to be applied to other semiconductor processing technologies with different numbers of processing chambers 3. In other words, the existing substrate transfer platform 2 has low compatibility in different semiconductor processing technologies. When the ready-made substrate transfer platform 2 is directly used, the following problems may occur: Figure 1As shown, because the number of flat surfaces of the substrate transfer platform 2 with film transfer ports is greater than the number of processing chambers 3 to be connected, redundant film transfer ports and idle space are generated, resulting in unreasonable distribution of processing chambers 3 and low space utilization. Alternatively, there is a problem that not all processing chambers 3 can be configured because the number of film transfer ports of the substrate transfer platform 2 is less than the number of processing chambers 3 to be connected.

[0007] On the other hand, with the rapid development of semiconductor technology, various new semiconductor processing technologies emerge in an endless stream. At this time, if the substrate transfer platform 2 cannot adjust the number and connection positions of the processing chambers 3 at will, it is very likely that the substrate transfer platform 2 will have to be replaced as a whole. This will not only increase the cost, but also require all the processing chambers 3 to be disassembled and reassembled, which is a very cumbersome process.

[0008] Therefore, there is a need for a substrate transfer platform that can select and adjust the number and position of connections of processing chambers to be compatible with different semiconductor processing technologies and to improve the uniformity of distribution of processing chambers. Summary of the invention

[0009] Technical issues

[0010] An object of the present invention is to provide a substrate transfer platform capable of selecting and adjusting the connection quantity and connection position of a processing chamber.

[0011] Another object of the present invention is to provide a semiconductor processing equipment, which includes the substrate transfer platform of the present invention.

[0012] Technical Solution

[0013] The present invention provides a substrate transfer platform, which includes: a main body, in which a transfer space is formed, a bonding surface is formed on the side surface, and a first transfer port that passes through the transfer space is formed on the bonding surface; and an adapter, whose first side surface is combined with the bonding surface, and a specified number of connection surfaces for connecting to a processing chamber are formed on the second side surface located on the opposite side of the first side surface, and a second transfer port that passes through the first side surface is formed on each of the connection surfaces.

[0014] As an embodiment, the main body may be formed with one or more of the bonding surfaces. When the main body is formed with a plurality of the bonding surfaces, the numbers of the second transmission ports of the adapter respectively bonded to the respective bonding surfaces may be the same or different.

[0015] As an implementation manner, the specified number may include one or more.

[0016] As an embodiment, the adapter portion is detachably coupled to the main body portion.

[0017] As an embodiment, the first side surface and the bonding surface may be bonded in a sealed manner.

[0018] As an embodiment, a first sealing portion surrounding the first transmission port may be configured on the bonding surface, and a second sealing portion matching the first sealing portion may be configured on the first side surface, and the first sealing portion and the second sealing portion may be in close contact with each other.

[0019] As an embodiment, a third sealing portion surrounding the second transmission port may be arranged on each of the connection surfaces.

[0020] As an embodiment, the adapter portion may include an isolation portion, and the isolation portion is used to selectively open and close the second transmission port.

[0021] As an embodiment, the adapter may include a centering sensor, and the centering sensor is used to sense whether the substrate passing through the second transfer port is located at a specified center position.

[0022] The present invention provides a semiconductor processing device, which comprises: the above-mentioned substrate transfer platform; and a processing chamber connected to the connection surface of the adapter part in a manner of communicating with the second transfer port of the adapter part of the substrate transfer platform.

[0023] Beneficial Effects

[0024] The substrate transfer platform of the present invention can select and adjust the connection quantity and connection position of the processing chamber, and therefore has high compatibility in different semiconductor processing technologies.

[0025] The semiconductor processing equipment of the present invention includes the substrate transfer platform of the present invention, and therefore, the connection quantity and connection position of the processing chamber can be selected and adjusted, thereby having high compatibility in different semiconductor processing techniques. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of semiconductor processing equipment in the prior art.

[0027] Figure 2 It is a top view of a semiconductor processing equipment according to one embodiment of the present invention.

[0028] Figure 3 is an exploded view of a substrate transfer platform according to one embodiment of the present invention.

[0029] Figure 4 This is a right side view of the main body of one embodiment of the present invention.

[0030] Figure 5It is a right side view of the adapter part of one embodiment of the present invention.

[0031] Figure 6 is based on Figure 5 The cross-sectional view is shown along the cutting line AA.

[0032] Figure 7 (a) and (b) are detailed views respectively showing the bonding surface and the first side surface of one embodiment of the present invention unfolded along a plane.

[0033] Figure 8 This is a detailed view showing an enlarged connection surface of one embodiment of the present invention.

[0034] Fig. 9 This is a perspective view of a separator according to one embodiment of the present invention.

[0035] Reference numerals

[0036] 1: Semiconductor processing equipment

[0037] 2: Substrate transfer platform

[0038] 3: Processing chamber

[0039] 100: Semiconductor processing equipment

[0040] 200: Substrate transfer platform

[0041] 210: Main body

[0042] 211: Bonding Surface

[0043] 212: First transmission port

[0044] 220: Adaptation Department

[0045] 221: First side surface

[0046] 222: Second side surface

[0047] 223: Connecting Surfaces

[0048] 224: Second transmission port

[0049] 230: threaded hole

[0050] 241: First sealing part

[0051] 242: Second sealing part

[0052] 243: Third sealing part

[0053] 250: Isolation Department

[0054] 251: Drive unit

[0055] 252: Blocking Department

[0056] 300: Processing chamber DETAILED DESCRIPTION

[0057] Below, one or more embodiments of the present invention are described in detail in conjunction with the drawings of one or more embodiments of the present invention. Obviously, this or these embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative labor and deformation also fall within the scope of protection of the present invention.

[0058] The terms used in the following embodiments are only for the purpose of illustrating or explaining specific embodiments, and are not intended to limit the scope of protection of the present invention. In addition, the singular expressions used in the present invention, such as "one", "a kind of", "said", "above", "the" and "this", are intended to include plural forms such as "one or more", unless the context clearly indicates otherwise. It should also be understood that in the embodiments of the present invention, when using terms such as "one or more", "at least one", "more than one", etc., it is intended to include one, two and at least three situations.

[0059] In addition, when the terms "in one embodiment", "in some embodiments", "in one or more embodiments" and the like are used in the specification of the present invention for description, it is intended that the specific technical features described in conjunction with the embodiments may be included in one or more embodiments of the present invention. Therefore, "in one embodiment", "in some embodiments", "in one or more embodiments" appearing in different places in the specification do not necessarily refer to the same embodiment, but may refer to the same embodiment or different embodiments, unless the specific technical features described in these embodiments cannot be used alone or in combination.

[0060] In addition, in the present invention, when an element is described as "including", "containing", or "having" another element, it is intended to be an open-ended limitation, that is, the one element may include other elements in addition to the other element. When an element is described as "only including", "only containing", "only having" another element or "consisting of another element", it is intended to be a closed-ended limitation, that is, the one element does not include other elements except the other element. However, it should be noted that when the term "formed by another element" is used to illustrate the formation relationship between multiple elements, the term is not intended to be a closed-ended limitation, and it should be considered that the other element forms a part of the one element, and the one element may contain other elements except the other element.

[0061] It should be understood that when sequential terms such as "first" and "second" are used to describe various elements in this document, these sequential terms are only used to distinguish one element from another element, and the terms such as "first" and "second" should not have the meaning of indicating a primary and secondary relationship, a sequential relationship, etc. Without departing from the scope of the present invention, the first element can be marked as the second element, and the second element can also be marked as the first element.

[0062] In the present invention, when describing the positional relationship of two or more elements, if terms such as "on", "below", "between", etc. are used, it means that one or more other elements may be arranged between the two or more elements, unless terms such as "just", "closely", etc. are used.

[0063] Hereinafter, one or more embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can clearly and completely understand the present invention. When the description of known structures or features will unnecessarily obscure the subject matter of the present invention, the description of these known structures or features will be omitted.

[0064] The invention provides a substrate transmission platform and semiconductor processing equipment comprising the substrate transmission platform.

[0065] Figure 2 It is a top view of a semiconductor processing equipment according to one embodiment of the present invention.

[0066] like Figure 2 As shown, the semiconductor processing equipment 100 may include the substrate transfer platform 200 and a processing chamber 300 connected to the substrate transfer platform 200. The substrate transfer platform 200 can select the connection quantity and connection position of the processing chamber 300. The substrate transfer platform 200 is first described in detail below.

[0067] Figure 3 is an exploded view of a substrate transfer platform according to one embodiment of the present invention.

[0068] like Figure 3 As shown, the substrate transfer platform 200 may include a main body 210 and an adapter 220. The main body 210 is used to transfer the substrate, and the adapter 220 is used to connect the processing chamber on the main body 210. Different adapters 220 can connect different numbers and positions of processing chambers. By selectively combining the appropriate adapter 220 on the main body 210, the number and position of the connection of the processing chamber can be selected, thereby obtaining higher compatibility.

[0069] Specifically, the main body 210 has a transmission space (not shown) formed therein, and the substrate to be processed received from the outside is temporarily stored in the transmission space and transmitted to the corresponding processing chamber. Among them, the entrance and exit for receiving the substrate to be processed from the outside or outputting the processed substrate to the outside and the transmission device (for example, a robot, a robot arm, an end effector, etc.) for transmitting the substrate in the transmission space can adopt the commonly used structure in the art, and the present invention is not limited thereto.

[0070] As an embodiment of the present invention, the main body 210 may be formed with a bonding surface 211 on its side surface, and the bonding surface 211 is used to bond with the adapter 220. Through the adapter 220, the main body 210 can be indirectly connected to the processing chamber. Therefore, the main body 210 itself does not need to be like the substrate transfer platform 2 in the prior art (refer to Figure 1 ) is formed into a prescribed polygonal column shape. Considering that a transmission device such as a robotic arm (not shown) is usually in the substrate transmission platform, one end is fixed and the other end rotates with the fixed end as an axis to transmit the substrate, therefore, the portion of the transmission space configured with the transmission device can be formed into a cylindrical shape rather than a polygonal column shape as in the prior art. At the same time, the portion of the side surface of the main body 210 corresponding to the cylindrical space can be formed into an arc surface, and the bonding surface 211 is formed in this portion. At this time, the bonding surface 211 is also formed into an arc surface. When the main body 210 is in this shape, the portion of the transmission space in the prior art that cannot be used to transmit the substrate because it is located at the corner can be eliminated, thereby saving space and improving space utilization. In addition, the arc-shaped bonding surface 211 is more conducive to cooperating with the surface of the adapter 220 to guide the adapter 220 during the operation of bonding the adapter 220, thereby more conveniently and firmly bonding the adapter 220.

[0071] In addition, the main body 210 may be formed with one or more bonding surfaces 211, for example, Figure 3 As shown, three said bonding surfaces 211 may be formed. When the main body 210 is formed with a plurality of said bonding surfaces 211, each said bonding surface 211 may be formed on different side surfaces of the main body 210, so as to respectively bond the said adapting part 220 at a plurality of appropriate positions of the main body 210, and each said bonding surface 211 may be formed into an appropriate size according to the area of ​​the part of each said side surface that can form the said bonding surface 211, and these sizes may be the same or different from each other, and subsequently, different said adapting parts 220 may be bonded according to different sizes, so as to flexibly select the connection number of the processing chamber.

[0072] Figure 4This is a right side view of the main body of one embodiment of the present invention.

[0073] like Figure 4 As shown, the bonding surface 211 may be formed into a strip extending from one end of the side surface where it is located to the other end, and a first transfer port 212 that passes through the transfer space may be formed on the bonding surface 211. Through the first transfer port 212, the substrate in the transfer space can be transferred to the processing chamber, and the substrate in the processing chamber can be retrieved to the transfer space. The first transfer port 212 may be formed into a slit shape extending from one end of the bonding surface 211 to the other end, so as to transfer the substrate to the processing chamber located in multiple directions. On the other hand, based on the thickness direction and the length direction of the bonding surface 211, the first transfer port 212 may be formed at a central position of the bonding surface 211, so that a sealing component, a connecting component, etc., such as a sealing component, can be arranged around the first transfer port 212 to combine with the adapter 220.

[0074] Refer again Figure 3 As an embodiment of the present invention, the adapting portion 220 may include a first side surface 221 and a second side surface 222 located on the opposite side of the first side surface 221. The first side surface 221 may be combined with the bonding surface 211, so as to combine the adapting portion 220 with the main body 210. In order to facilitate the combination of the first side surface 221 and the bonding surface 211, the first side surface 221 may be formed into a shape matching the bonding surface 211. For example, when the bonding surface 211 is a protruding arc surface, the first side surface 221 may be a concave arc surface with the same curvature as the bonding surface 211.

[0075] A connection surface 223 for connecting to a processing chamber may be formed on the second side surface 222. The connection surface 223 may be formed as a flat surface, or may protrude from the second side surface 222 to a specified height, so as to position and connect the processing chamber. In addition, other parts of the second side surface 222 except for the part formed with the connection surface 223 may be formed into a shape matching the first side surface 221. For example, when the first side surface 221 is a concave arc surface, these parts may be protruding arc surfaces with the same curvature as the first side surface 221. Thus, the adapter 220 has a uniform thickness in these parts to ensure uniform strength of the adapter 220 at various locations, and it is also convenient to penetrate fixing components in these parts to firmly combine the adapter 220 with the main body 210.

[0076] Figure 5 It is a right side view of the adapter part of one embodiment of the present invention. Figure 6 is based on Figure 5 The cross-sectional view is shown along the cutting line AA. Figure 5 and Figure 6 Specifically shows Figure 3 The lower right adapter portion 220 among the three adapter portions 220 illustrated in FIG.

[0077] like Figure 5 and Figure 6 As shown, a second transfer port 224 penetrating to the first side surface 221 may be formed on the connection surface 223, and the second transfer port 224 is used to connect the first transfer port 212 of the main body 210 with the processing chamber to transfer the substrate from the main body 210 to the processing chamber, or to retrieve the substrate in the processing chamber back to the main body 210. The second transfer port 224 may be formed in a slit shape extending from one end of the connection surface 223 to the other end, so that the substrate passes through. On the other hand, based on the thickness direction and the length direction of the connection surface 223, the second transfer port 224 may be formed at a central position of the connection surface 223, so that a sealing component, a connection component, etc., such as a sealing component, is provided around the second transfer port 224 to connect to the processing chamber.

[0078] exist Figure 5 and Figure 6 In the figure, it is shown that one connection surface 223 is formed on the second side surface 222 as an example, but the present invention is not limited thereto. The second side surface 222 may be formed with a specified number of connection surfaces 223 within the range that its size can accommodate. The specified number may include one or more. Figure 3As shown, the specified number may also be two or five. When one connection surface 223 is formed on the second side surface 222, the connection surface 223 may be formed at the center of the second side surface 222 based on the length direction of the second side surface 222, so as not to be too biased to any one of the two sides of the second side surface 222, so as to reasonably utilize the space. When a plurality of connection surfaces 223 are formed on the second side surface 222, a second transmission port 224 may be formed on each of the connection surfaces 223, and the plurality of connection surfaces 223 may be evenly distributed within the length range of the second side surface 222, so as to evenly form a plurality of second transmission ports 224 within the length range of the second side surface 222 (that is, when the adapter 220 is combined with the main body 210, the plurality of second transmission ports 224 are evenly arranged within the length range of the connected first transmission port 212), so as to reasonably utilize the space. When the main body 210 is formed with a plurality of the coupling surfaces 211 , the numbers of the second transfer ports 224 of the adapter 220 coupled to the respective coupling surfaces 211 may be the same or different to reasonably select the connection number and connection position of the processing chamber.

[0079] As such, the present invention can easily select the number and position of processing chambers that the substrate transfer platform 200 can connect to by combining different adapter parts 220 on the same main body part 210, thereby realizing a substrate transfer platform 200 with high compatibility in different semiconductor processing processes.

[0080] On the other hand, although not shown, when the first transfer port 212 of a certain bonding surface 211 does not need to transfer a substrate in the semiconductor processing technology actually applied, a sealing cover can be combined with the bonding surface 211 instead of the adapter 220 to seal the first transfer port 212 of the bonding surface 211 in a sealed manner. At this time, the surface of the sealing cover that is combined with the bonding surface 211 can be formed into a shape that matches the bonding surface 211 like the first side surface 221, so as to be tightly combined with the bonding surface 211. In addition, the sealing cover can be detachably combined with the bonding surface 211, so that when the first transfer port 212 of the bonding surface 211 needs to be used again later, the sealing cover can be replaced with an appropriate adapter 220 to connect the processing chamber.

[0081] Furthermore, the substrate transfer platform 200 of the present invention can also adjust the number and position of the originally connected processing chambers. As an embodiment of the present invention, the adapter portion 220 can be detachably coupled to the main body portion 210. For example, the first side surface 221 can be detachably coupled to the coupling surface 211 by threaded connection.

[0082] Figure 7 (a) and (b) are detailed views respectively showing the bonding surface and the first side surface of one embodiment of the present invention unfolded along a plane.

[0083] like Figure 7 As shown in (a) and (b), the coupling surface 211 and the first side surface 221 may be respectively formed with a plurality of threaded holes 230 on their four edges, and the threaded holes 230 of the two are formed to correspond to each other. Among them, the threaded holes 230 on the coupling surface 211 may not penetrate into the transmission space, and the threaded holes 230 on the first side surface 221 penetrate into the second side surface 222. At this time, the first side surface 221 only needs to be abutted against the coupling surface 211 in a manner that the threaded holes 230 on the coupling surface 211 and the first side surface 221 are aligned with each other, and bolts (not shown) are inserted into each of the threaded holes 230 from the side of the second side surface 222, so that the first side surface 221 can be detachably coupled with the coupling surface 211, that is, the adapter 220 can be detachably coupled to the main body 210. When it is necessary to adjust the number of connections and / or the connection position of the processing chamber, the original adapter 220 can be removed and the required adapter 220 can be reinstalled.

[0084] In addition, the substrate has extremely high requirements for the cleanliness of the environment in which it is located, and the steps of substrate transmission, storage, processing, etc. are all performed in a vacuum environment. Therefore, the first side surface 221 can be combined with the combination surface 211 in a sealed manner to avoid forming a gap between the main body 210 and the adapter 220 to destroy the vacuum environment.

[0085] Refer again Figure 7 (a) and (b), as an embodiment of the present invention, a first sealing portion 241 surrounding the first transmission port 212 may be configured on the bonding surface 211, and a second sealing portion 242 matching the first sealing portion 241 may be configured on the first side surface 221. When the first side surface 221 is bonded to the bonding surface 211, the first sealing portion 241 and the second sealing portion 242 are in close contact with each other, thereby avoiding the formation of the above-mentioned gap.

[0086] As an implementation manner, one of the first sealing portion 241 and the second sealing portion 242 may be a sealing ring, and the other may be a sealing surface.

[0087] The material and shape of the sealing ring can be appropriately selected according to actual needs. For example, according to the shape, the sealing ring can use an O-ring, an X-ring, a D-ring, a Y-ring, a V-ring, a T-ring, a triangle ring, a square ring, a spiral ring, etc. For another example, according to the material, the sealing ring can use a sealing ring formed by any one or more materials of silicone rubber, EPDM (Ethylene Propylene Diene Monomer), NBR (Nitrile Butadiene Rubber), PTFE (Polytetrafluoroethylene), FKM (Fluorocarbon), HNBR (Hydrogenated Nitrile Butadiene Rubber), etc.

[0088] The sealing surface can be a surface that is in close contact with the sealing ring when the first side surface 221 is combined with the bonding surface 211. The surface can be the original surface of the first side surface 221 (when the second sealing portion 242 is a sealing surface) or the bonding surface 211 (when the first sealing portion 241 is a sealing surface), or it can be a surface that is processed according to the shape, material, etc. of the sealing ring to be able to further be in close contact with the sealing ring. For example, the roughness, hardness, elasticity and other characteristics of the surface can be changed by adding other materials to the surface or performing processes such as polishing the surface, so that it can cooperate with the sealing ring to achieve a better sealing effect.

[0089] Likewise, the adapter portion 220 may also be connected to the processing chamber in a detachable and sealed manner.

[0090] Figure 8 This is a detailed view showing an enlarged connection surface of one embodiment of the present invention.

[0091] like Figure 8As shown, a plurality of threaded holes 230 may be formed on the edges of the connection surface 223, and these threaded holes 230 may be used to detachably connect the processing chamber. Although not shown, as another embodiment, a boss protruding outward may be formed on the edges of the connection surface 223 to form a flange structure, and a plurality of threaded holes 230 may be formed on the boss. By aligning the threaded holes 230 on the connection surface 223 with the threaded holes on the processing chamber to be connected and inserting bolts, the processing chamber may be detachably connected to the adapter 220.

[0092] In addition, a third sealing portion 243 surrounding the second transfer port 224 may be provided on each of the connection surfaces 223 so as to connect the processing chamber in a sealed manner on the connection surface 223. The third sealing portion 243 may be a sealing ring. The material and shape of the sealing ring may be appropriately selected according to actual needs. For example, according to the shape, the sealing ring may be an O-ring, an X-ring, a D-ring, a Y-ring, a V-ring, a T-ring, a Triangle ring, a Square ring, a Spiral ring, etc. For another example, depending on the material, the sealing ring can be a sealing ring formed by any one or more materials including silicone rubber (Silicone), EPDM (Ethylene Propylene Diene Monomer), NBR (Nitrile Butadiene Rubber), PTFE (Polytetrafluoroethylene), FKM (Fluorocarbon), and HNBR (Hdrogenated Nitrile Butadiene Rubber).

[0093] In addition, the processing conditions (e.g., material, temperature, vacuum degree, magnetic field strength, etc.) of each processing step performed in each processing chamber are different from each other. Therefore, when the processing chamber is in operation, it should be ensured to be in a sealed state to avoid interference or contamination between multiple processing chambers and the transmission space. To this end, the adapter 220 may include an isolation portion to selectively open and close the second transmission port 224 using the isolation portion.

[0094] Refer again Figure 5As an embodiment, the isolation part 250 may be disposed below the second transmission port 224 and coupled to the lower surface of the adapter part 220 corresponding to the second transmission port 224. Further, when the adapter part 220 is formed with a plurality of second transmission ports 224, the isolation part 250 may be disposed below each of the second transmission ports 224.

[0095] Fig. 9 This is a perspective view of a separator according to one embodiment of the present invention.

[0096] like Fig. 9 As shown, specifically, the isolation part 250 may include a driving part 251 and a blocking part 252. The driving part 251 may be formed with a storage space (not shown) extending downward from the upper surface of the driving part 251, and the blocking part 252 may be stored in the storage space. The driving part 251 may be configured with a lifting mechanism such as a piston cylinder to drive the blocking part 252 in the up and down directions. The blocking part 252 may be formed in the form of a gate. In addition, a through hole (not shown) penetrating downward may be formed in the second transfer port 224. When the driving part 251 drives the blocking part 252 to rise, the blocking part 252 enters the second transfer port 224 through the through hole and closes the second transfer port 224. At this time, the blocking part 252 may be in close contact with the inner wall of the second transfer port 224, thereby isolating the processing chamber from the main body 210 in a sealed manner. When the driving part 251 drives the blocking part 252 to descend, the blocking part 252 leaves the second transfer port 224 through the through hole and opens the second transfer port 224 , so that the processing chamber is connected to the main body 210 .

[0097] The driving portion 251 may be in close contact with the lower surface of the adapter portion 220 corresponding to the second transfer port 224 , and the blocking portion 252 may be in close contact with the through hole to avoid a gap between the adapter portion 220 and the isolation portion 250 and thus avoid destroying the vacuum environment within the substrate transfer platform 200 .

[0098] In addition, during the transfer of the substrate, it is necessary to ensure that the substrate is stably placed in a specified position on the transfer device (for example, a placement slot on the end effector, etc.) and transferred along a specified path. When the substrate deviates from the specified position and / or the specified path, it may fall from the transfer device or collide with other components during the transfer process. Even if it is safely transferred to the processing chamber, it may be processed into a defective product due to the deviation of the loading position in the processing chamber. Therefore, it is necessary to confirm the position of the substrate when transferring the substrate to the processing chamber and retrieving the substrate from the processing chamber.

[0099] To this end, as an embodiment, the adapter 220 may include a centering sensor (not shown), which is used to sense whether the substrate passing through the second transfer port 224 is located at a specified center position. Specifically, the centering sensor may be configured in the second transfer port 224 to sense the position of the substrate when transferring the substrate to the processing chamber and retrieving the substrate from the processing chamber, so as to determine whether the substrate is located at the center position of the second transfer port 224 (i.e., the specified center position) based on the length direction of the second side surface 222. At this time, the centering sensor can determine whether the substrate is located at the specified center position based on whether the position of the substrate is within a preset error allowable range based on the center position.

[0100] When the centering sensor senses that the substrate passing through the second transfer port 224 is located at a specified center position, the substrate can continue to be transferred. When the centering sensor senses that the substrate passing through the second transfer port 224 deviates from the specified center position, the transfer device can be prompted to adjust the position of the substrate. The method and device for adjusting the position of the substrate can use the commonly used methods and devices in the art, and the present invention is not limited thereto.

[0101] The substrate transfer platform 200 of the present invention is described in detail above. The semiconductor processing equipment 100 of the present invention is described in detail below.

[0102] Refer again Figure 2 The semiconductor processing equipment 100 includes a substrate transfer platform 200 and a processing chamber 300 of the present invention.

[0103] The processing chamber 300 is connected to the connection surface 223 of the adapter part 220 in a manner of being communicated with the second transfer port 224 of the adapter part 220 of the substrate transfer platform 200 .

[0104] The processing chamber 300 can be a processing chamber commonly used in the art, for example, it can be a chemical vapor deposition chamber, a physical vapor deposition chamber, etc., as long as it can be connected to the substrate transfer platform 200 and receive the substrate to be processed for processing and provide the processed substrate to the substrate transfer platform 200. The present invention is not limited to this.

[0105] The above describes the embodiments of the present invention, but this is only used to help fully understand the present invention. The present invention is not limited to this, and those skilled in the art can make various modifications and variations based on these descriptions. Therefore, the technical idea of ​​the present invention is not limited to the above-mentioned embodiments, and the attached claims and their equivalent or equivalent variations all belong to the scope of the present invention.

Claims

1. A substrate transmission platform, characterized in that: include: A main body portion, wherein a transmission space is formed inside, a bonding surface is formed on a side surface, and a first transmission port penetrating to the transmission space is formed on the bonding surface; as well as The adapter part has a first side surface combined with the combining surface, and a specified number of connecting surfaces for connecting to the processing chamber are formed on the second side surface located on the opposite side of the first side surface, and a second transmission port penetrating to the first side surface is formed on each of the connecting surfaces.

2. The substrate transfer platform according to claim 1, characterized in that: The main body is formed with one or more of the bonding surfaces, When the main body is formed with a plurality of the coupling surfaces, the numbers of the second transmission ports of the adapter that are respectively coupled to the respective coupling surfaces are the same as or different from each other.

3. The substrate transfer platform according to claim 1, characterized in that: The specified number includes one and more.

4. The substrate transfer platform according to claim 1, characterized in that: The adapter portion is detachably coupled to the main body portion.

5. The substrate transfer platform according to claim 1, characterized in that: The first side surface is bonded to the bonding surface in a sealed manner.

6. The substrate transfer platform according to claim 5, characterized in that: A first sealing portion surrounding the first transmission port is arranged on the bonding surface, A second sealing portion matching the first sealing portion is disposed on the first side surface, The first sealing portion and the second sealing portion are in close contact with each other.

7. The substrate transfer platform according to claim 1, characterized in that: A third sealing portion surrounding the second transmission port is disposed on each of the connection surfaces.

8. The substrate transfer platform according to claim 1, characterized in that: The adapting portion includes an isolating portion, The isolation portion is used to selectively open and close the second transmission port.

9. The substrate transfer platform according to claim 1, characterized in that: The adapter portion includes a centering sensor, The centering sensor is used to sense whether the substrate passing through the second transfer port is located at a specified center position.

10. A semiconductor processing equipment, characterized in that: include: The substrate transfer platform according to any one of claims 1 to 9; as well as The processing chamber is connected to the connection surface of the adapter part in a manner of being communicated with the second transfer port of the adapter part of the substrate transfer platform.

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