Wafer batch transfer method and system

Abstract

The present application relates to the technical field of semiconductor, in particular to a wafer batch transfer method and system, comprising a rack, a first placement position and a second placement position arranged on the rack and used for placing two wafer boxes respectively, a first bearing seat and a second bearing seat used for holding wafers, a lifting mechanism used for driving the rack to move up and down, and a translation mechanism used for driving the first bearing seat and the second bearing seat to move close to or away from each other, wherein the first bearing seat and the second bearing seat correspond to the first placement position and the second placement position respectively; the present application can make wafers parallel, automatically realize wafer batch transfer, avoid the occurrence of low efficiency, strong subjectivity and high error rate and other conditions existing in manual operation, and improve wafer transmission efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer batch transmission method and system. Background Art

[0002] In the semiconductor industry, the wafer transfer process is a key step in semiconductor manufacturing. According to international standards, there are 25 wafers in each box. In order to improve wafer transfer efficiency, the 25 wafers in two boxes need to be merged into 50 pieces. Mechanical methods are used to transfer the wafers from one box to another to meet the needs of subsequent processing or testing.

[0003] However, traditional wafer transmission uses manual transfer, which leads to disadvantages such as low efficiency, strong subjectivity and high error rate in manual operation, affecting the efficiency of wafer transmission. Summary of the Invention

[0004] In response to the deficiencies in the prior art, the present invention provides a wafer batch transfer method and system, which can parallelize wafers and automatically transfer wafers in batches, avoiding the low efficiency, strong subjectivity and high error rate of manual operation, and improving wafer transfer efficiency.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] The present invention provides a wafer batch transmission method, comprising a rack, a first placement position and a second placement position provided on the rack and used to place a wafer box respectively, a first support seat and a second support seat for holding wafers, a lifting mechanism for driving the rack to move up and down, and a translation mechanism for driving the first support seat and the second support seat to move closer to or away from each other, wherein the first support seat and the second support seat correspond to the first placement position and the second placement position respectively; the wafer batch transmission method comprises the following steps:

[0007] S01. When wafers in two wafer cassettes need to be taken out and merged, the lifting mechanism is used to drive the frame to move so that the first supporting base and the second supporting base are both located below the frame;

[0008] S02. Using a robot, place wafer cassettes each containing wafers at a first placement position and a second placement position, respectively. The lifting mechanism drives the frame to descend relative to the first supporting seat and the second supporting seat, so that the first supporting seat and the second supporting seat extend into the wafer cassette along the bottom opening of the wafer cassette, so that the wafers in the wafer cassette are respectively held by the first supporting seat and the second supporting seat.

[0009] S03, continue to drive the gantry down relative to the first bearing seat and the second bearing seat, so that the first bearing seat and the second bearing seat are higher than the top opening of the wafer box, and the first bearing seat and the second bearing seat are brought together by the translation mechanism, so that the wafers on the first bearing seat and the second bearing seat are parallel, so as to facilitate the mechanical hand to transfer the whole of the combined wafers in batches;

[0010] S04, when it is needed to put the whole of the combined wafers into two wafer boxes, the gantry is driven to descend relative to the first bearing seat and the second bearing seat by the lifting mechanism, so that the first bearing seat and the second bearing seat are higher than the top opening of the wafer box, and the first bearing seat and the second bearing seat are brought together by the translation mechanism;

[0011] S05, the combined wafers are loaded into the first bearing seat and the second bearing seat by the mechanical hand, so that the first bearing seat and the second bearing seat respectively hold half the number of wafers, the mechanical hand is moved away from the first bearing seat and the second bearing seat, and the first bearing seat and the second bearing seat are driven away from each other by the translation mechanism, so that the first bearing seat and the second bearing seat are respectively located at the opening end of the wafer box;

[0012] S06, the gantry is driven to ascend relative to the first bearing seat and the second bearing seat by the lifting mechanism, so that the wafers on the first bearing seat and the second bearing seat are respectively supported by two wafer boxes, so that two twenty-five wafers are combined into fifty.

[0013] The wafer batch transmission method further comprises a box feeding mechanism, the output end of the lifting mechanism is connected with a box pushing mechanism, the box pushing mechanism is drivingly connected with the gantry, and the gantry is provided with a first taking and placing opening and a second taking and placing opening corresponding to the first placing position and the second placing position respectively;

[0014] When it is needed to place the wafer box on the gantry, the gantry is moved above the first bearing seat and the second bearing seat by the lifting mechanism, the output end of the box feeding mechanism bears the wafer box, the gantry is driven away from the first bearing seat by the box pushing mechanism, so that the top end of the box feeding mechanism is arranged in the first taking and placing opening or the second taking and placing opening, and the box feeding mechanism places the wafer box on the first placing position or the second placing position.

[0015] The box feeding mechanism comprises a box feeding horizontal module and a box feeding longitudinal module drivingly connected with the box feeding horizontal module, and the output end of the box feeding longitudinal module is connected with a box feeding bearing table.

[0016] When the wafer box needs to be placed in the rack, the lifting mechanism drives the rack to move above the first bearing seat and the second bearing seat, the wafer box is placed on the box feeding bearing table, the box pushing mechanism drives the rack to move away from the first bearing seat, so that the box feeding bearing table extends into the rack along the first taking and placing opening or the second taking and placing opening, the box feeding longitudinal module drives the box feeding bearing table and the wafer box to approach the first bearing seat or the second bearing seat, so that the wafer box is placed in the first placing position or the second placing position, so that the wafer box is placed in the rack.

[0017] The box pushing mechanism comprises a box pushing platform and a box pushing horizontal module installed on the box pushing platform, the box pushing platform is drivingly connected with the lifting mechanism, and the output end of the box pushing horizontal module is drivingly connected with the rack.

[0018] When the wafer box needs to be placed in the rack, the lifting mechanism drives the rack to move above the first bearing seat and the second bearing seat, the output end of the box feeding mechanism bears the wafer box, the box pushing horizontal module drives the rack to move away from the first bearing seat, so that the top end of the box feeding mechanism is arranged in the first taking and placing opening or the second taking and placing opening, and the box feeding mechanism places the wafer box in the first placing position or the second placing position.

[0019] The translation mechanism adopts a reverse synchronous double-sliding seat module, the two output ends of the translation mechanism are respectively connected with the first supporting rod and the second supporting rod, and the first supporting rod and the second supporting rod are respectively connected with the first bearing seat and the second bearing seat.

[0020] The first bearing seat and the first supporting rod are provided with a first containing space therebetween, and the second bearing seat and the second supporting rod are provided with a second containing space therebetween.

[0021] When the first bearing seat and the second bearing seat are higher than the top opening of the wafer box, the translation mechanism drives the first bearing seat and the second bearing seat to approach each other, so that one end of one wafer box extends into the first containing space, and one end of the other wafer box extends into the second containing space.

[0022] The first supporting rod is connected with one of the output ends of the translation mechanism through a first rotating unit, and the second supporting rod is connected with the other output end of the translation mechanism through a second rotating unit.

[0023] When the wafer on the first bearing seat needs to be turned over, the lifting mechanism drives the rack to descend relative to the first bearing seat, the first bearing seat is exposed at the opening end of the corresponding wafer box, the first rotating unit drives the first supporting rod to rotate, so that the wafer on the first bearing seat is rotated by 180°.

[0024] When the wafer on the second carrier needs to be flipped, the lifting mechanism drives the frame to descend relative to the second carrier, the second carrier exposes the opening end corresponding to the wafer box, and the second rotating unit drives the second supporting rod to rotate, so that the wafer on the second carrier is rotated by 180°.

[0025] The top of the first carrier is symmetrically provided with at least two first supporting parts, and a plurality of first clamping grooves which are adapted to the shape of the wafer and have notches upward are arranged on the first supporting parts in intervals.

[0026] The top of the second carrier is symmetrically provided with at least two second supporting parts, and a plurality of second clamping grooves which are adapted to the shape of the wafer and have notches upward are arranged on the second supporting parts in intervals.

[0027] The first clamping grooves are in arc structures, and the centers of every two first clamping grooves which adapt to the same wafer coincide; and the second clamping grooves are in arc structures, and the centers of every two second clamping grooves which adapt to the same wafer coincide.

[0028] The distance between adjacent two first clamping grooves is L1, the distance between adjacent two second clamping grooves is L2, the minimum distance between adjacent first clamping grooves and second clamping grooves is L3 when the first carrier and the second carrier are close to each other, and L1, L2 and L3 satisfy L1=L2=L3.

[0029] The application further provides a wafer batch transmission system for implementing the wafer batch transmission method, which comprises a frame, a first placing position and a second placing position arranged on the frame and used for placing two wafer boxes respectively, a first carrier and a second carrier used for holding wafers, a lifting mechanism used for driving the frame to move up and down, and a translation mechanism used for driving the first carrier and the second carrier to move close to or away from each other, wherein the first carrier and the second carrier correspond to the first placing position and the second placing position respectively.

[0030] The application has the following beneficial effects:

[0031] The wafer can be arranged side by side, and the wafer batch transmission can be automatically realized, so that the low efficiency, strong subjectivity and high error rate of manual operation are avoided, and the wafer transmission efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 It is a schematic diagram of the three-dimensional structure of the wafer batch transmission system.

[0033] Figure 2 It is a perspective view of the wafer box being pushed out by the box pushing mechanism.

[0034] Figure 3 It is a schematic diagram of the three-dimensional structure of the box pushing mechanism and the frame.

[0035] Figure 4 Fig. 7 is a perspective view of the wafer box and the box conveying support platform.

[0036] Figure 5 Fig. 8 is a perspective view of the translation mechanism, the first support seat, the second support seat and the rack.

[0037] Figure 6 Fig. 9 is a perspective view of the first support seat and the second support seat.

[0038] Figure 7 Fig. 10 is a perspective view of the first support seat and the second support seat.

[0039] 1. the rack;

[0040] 101. the first placement position; 102. the second placement position;

[0041] 103. the first pickup port; 104. the second pickup port;

[0042] 2. the first support seat; 21. the first support part; 22. the first clamping slot;

[0043] 3. the second support seat; 31. the second support part; 32. the second clamping slot;

[0044] 4. the lifting mechanism;

[0045] 5. the translation mechanism; 51. the first support rod; 52. the second support rod;

[0046] 511. the first accommodating space; 521. the second accommodating space;

[0047] 53. the first rotating unit; 54. the second rotating unit;

[0048] 6. the box conveying mechanism;

[0049] 61. the box conveying horizontal module; 62. the box conveying longitudinal module; 63. the box conveying support platform;

[0050] 7. the box pushing mechanism;

[0051] 71. the box pushing platform; 72. the box pushing horizontal module. DETAILED DESCRIPTION

[0052] For the convenience of the person skilled in the art, the present application will be further described below in conjunction with the embodiments and the drawings. The specific embodiments of the present application will be described below, and it should be noted that, in the specific description of these embodiments, the present specification cannot describe all the features of the actual embodiments in detail for the sake of brevity and conciseness.

[0053] REFERENCE Figures 1 to 7As shown, the present application provides a wafer batch transfer method, comprising a rack 1, a first placement position 101 and a second placement position 102 arranged on the rack 1 and used for respectively placing a wafer box, a first carrier 2 and a second carrier 3 used for holding wafers, a lifting mechanism 4 used for driving the rack 1 to move up and down, and a translation mechanism 5 used for driving the first carrier 2 and the second carrier 3 to approach or move away from each other, wherein the first carrier 2 and the second carrier 3 correspond to the first placement position 101 and the second placement position 102 respectively; the wafer batch transfer method comprises the following steps:

[0054] S01, when it is needed to take out and merge the wafers in the two wafer boxes, the lifting mechanism 4 is used to drive the rack 1 to move, so that the first carrier 2 and the second carrier 3 are both located below the rack 1.

[0055] S02, the wafer boxes both containing wafers are placed in the first placement position 101 and the second placement position 102 respectively by using a mechanical hand, the lifting mechanism 4 is used to drive the rack 1 to descend relative to the first carrier 2 and the second carrier 3, the first carrier 2 and the second carrier 3 are inserted into the wafer boxes along the bottom openings of the wafer boxes, so that the wafers in the wafer boxes are held by the first carrier 2 and the second carrier 3 respectively.

[0056] S03, the lifting mechanism 4 is used to continue to drive the rack 1 to descend relative to the first carrier 2 and the second carrier 3, so that the first carrier 2 and the second carrier 3 are higher than the top openings of the wafer boxes, and the translation mechanism 5 is used to drive the first carrier 2 and the second carrier 3 to approach, so that the wafers on the first carrier 2 and the second carrier 3 are arranged side by side, thereby facilitating the mechanical hand to transfer the whole of the merged wafers.

[0057] S04, when it is needed to put the whole of the merged wafers into two wafer boxes, the lifting mechanism 4 is used to drive the rack 1 to descend relative to the first carrier 2 and the second carrier 3, so that the first carrier 2 and the second carrier 3 are higher than the top openings of the wafer boxes, and the translation mechanism 5 is used to drive the first carrier 2 and the second carrier 3 to approach.

[0058] S05, the mechanical hand is used to put the merged wafers into the first carrier 2 and the second carrier 3, so that the first carrier 2 and the second carrier 3 respectively hold half of the wafers, the mechanical hand is moved away from the first carrier 2 and the second carrier 3, the translation mechanism 5 is used to drive the first carrier 2 and the second carrier 3 to move away from each other, so that the first carrier 2 and the second carrier 3 are respectively located at the opening ends of the wafer boxes.

[0059] S06, the lifting mechanism 4 drives the rack 1 to ascend relative to the first bearing seat 2 and the second bearing seat 3, the inner side wall of the wafer box is usually provided with a plurality of recessed grooves matched with the shape of the wafer, so that a plurality of wafers can be clamped and limited in the wafer box, during the ascending process of the rack 1 relative to the first bearing seat 2 and the second bearing seat 3, the wafer bottom is supported by the wafer box and then separated from the first bearing seat 2 or the second bearing seat 3, so that the wafers on the first bearing seat 2 and the second bearing seat 3 are respectively supported by the two wafer boxes, and the two wafers of 25 pieces are combined into 50 pieces.

[0060] Therefore, by the present application, the wafers on the first bearing seat 2 and the second bearing seat 3 can be arranged side by side, the combined wafers can be quickly batched and placed by the mechanical hand, and the wafer transfer efficiency is improved; the wafer batch transfer can be automatically realized, the low efficiency, strong subjectivity and high error rate of manual operation are avoided, and the wafer transmission efficiency is improved.

[0061] Reference Figure 2 , 3 As shown in FIG. 6, in the embodiment, the wafer batch transmission method further comprises a box feeding mechanism 6, the output end of the lifting mechanism 4 is connected with a box pushing mechanism 7, the box pushing mechanism 7 is drivingly connected with the rack 1, and the rack 1 is provided with a first taking and placing opening 103 and a second taking and placing opening 104 corresponding to the first placing position 101 and the second placing position 102 respectively; in actual application, when it is needed to place the wafer box on the rack 1, the lifting mechanism 4 drives the rack 1 to move above the first bearing seat 2 and the second bearing seat 3, the output end of the box feeding mechanism 6 bears the wafer box, the box pushing mechanism 7 drives the rack 1 to move away from the first bearing seat 2, so that the top end of the box feeding mechanism 6 is arranged in the first taking and placing opening 103 or the second taking and placing opening 104, and the box feeding mechanism 6 places the wafer box on the first placing position 101 or the second placing position 102, so as to smoothly realize the placement of the wafer box; similarly, the operation steps of placing the wafer box on the rack 1 are reversely executed, so that the rack 1 can be smoothly placed on the wafer box, and the wafer box can be quickly taken and placed.

[0062] Reference Figure 2 , 3 As shown in FIG. 6, in the embodiment, the wafer batch transmission method further comprises a box feeding mechanism 6, the output end of the lifting mechanism 4 is connected with a box pushing mechanism 7, the box pushing mechanism 7 is drivingly connected with the rack 1, and the rack 1 is provided with a first taking and placing opening 103 and a second taking and placing opening 104 corresponding to the first placing position 101 and the second placing position 102 respectively; in actual application, when it is needed to place the wafer box on the rack 1, the lifting mechanism 4 drives the rack 1 to move above the first bearing seat 2 and the second bearing seat 3, the output end of the box feeding mechanism 6 bears the wafer box, the box pushing mechanism 7 drives the rack 1 to move away from the first bearing seat 2, so that the top end of the box feeding mechanism 6 is arranged in the first taking and placing opening 103 or the second taking and placing opening 104, and the box feeding mechanism 6 places the wafer box on the first placing position 101 or the second placing position 102, so as to smoothly realize the placement of the wafer box; similarly, the operation steps of placing the wafer box on the rack 1 are reversely executed, so that the rack 1 can be smoothly placed on the wafer box, and the wafer box can be quickly taken and placed. Figure 4As shown, in actual application, when it is needed to place the wafer box on the rack 1, the lifting mechanism 4 drives the rack 1 to move above the first bearing seat 2 and the second bearing seat 3, the wafer box is placed on the box feeding bearing table 63, the box pushing mechanism 7 drives the rack 1 to move away from the first bearing seat 2, so that the box feeding bearing table 63 extends into the rack 1 along the first taking and placing opening 103 or the second taking and placing opening 104, the box feeding longitudinal module 62 drives the box feeding bearing table 63 and the wafer box to approach the first bearing seat 2 or the second bearing seat 3, so that the wafer box is placed on the first placing position 101 or the second placing position 102, so as to place the wafer box on the rack 1, and the wafer box is placed on the rack 1 smoothly, specifically, the first placing position 101 and the second placing position 102 are both installed with four positioning blocks corresponding to the four periphery of the bottom of the wafer box, when the bottom of the wafer box is inserted into the positioning blocks, the wafer box is accurately placed on the first placing position 101 or the second placing position 102, and the first placing position 101 and the second placing position 102 are both provided with a position sensor, the position sensor detects whether the wafer box is accurately placed on the first placing position 101 or the second placing position 102, so as to facilitate to determine the loading condition of the wafer box and the rack 1.

[0063] Reference Figure 2 , 3 As shown, in the embodiment, the box pushing mechanism 7 includes a box pushing platform 71 and a box pushing horizontal module 72 installed on the box pushing platform 71, the box pushing platform 71 is drivingly connected with the lifting mechanism 4, the output end of the box pushing horizontal module 72 is drivingly connected with the rack 1, and the rack 1 is slidingly connected with the box pushing platform 71; in actual application, when it is needed to place the wafer box on the rack 1, the lifting mechanism 4 drives the rack 1 to move above the first bearing seat 2 and the second bearing seat 3, the output end of the box feeding mechanism 6 bears the wafer box, the box pushing horizontal module 72 drives the rack 1 to move away from the first bearing seat 2, so that the top end of the box feeding mechanism 6 is arranged in the first taking and placing opening 103 or the second taking and placing opening 104, the box feeding mechanism 6 places the wafer box on the first placing position 101 or the second placing position 102, and the wafer box is placed on the first placing position 101 or the second placing position 102 smoothly.

[0064] Reference Figure 5As shown, in the embodiment, the translation mechanism 5 adopts a reverse synchronous double slide module, two output ends of the translation mechanism 5 are respectively connected with the first support rod 51 and the second support rod 52, and the first support rod 51 and the second support rod 52 are respectively connected with the first bearing seat 2 and the second bearing seat 3; in actual application, the translation mechanism 5 drives the first support rod 51 and the second support rod 52 to move reversely synchronously, so that the first bearing seat 2 and the second bearing seat 3 move reversely synchronously, therefore, when the two wafer boxes are both loaded with wafers and the rack 1 is lowered relative to the first bearing seat 2 and the second bearing seat 3, the wafers in the two wafer boxes can be simultaneously separated from the wafer boxes, and the wafers are simultaneously held by the corresponding first bearing seat 2 and second bearing seat 3, so that the wafer transfer from the wafer box to the first bearing seat 2 or the second bearing seat 3 is quickly realized, and the wafer transfer efficiency is improved; when the first bearing seat 2 and the second bearing seat 3 are close to each other, the contact surface of the first bearing seat 2 and the second bearing seat 3 is the center of the combined fifty wafers, so that the wafer loading center is determined, and the wafer transfer efficiency is improved.

[0065] Reference Figure 2 、 7 As shown, in the embodiment, the first bearing seat 2 and the first support rod 51 are provided with a first accommodating space 511, and the second bearing seat 3 and the second support rod 52 are provided with a second accommodating space 521; in actual application, when the first bearing seat 2 and the second bearing seat 3 are higher than the top opening of the wafer box, the translation mechanism 5 drives the first bearing seat 2 and the second bearing seat 3 to close, so that one end of one wafer box extends into the first accommodating space 511, and one end of the other wafer box extends into the second accommodating space 521, the structure arrangement is compact, the space occupation is saved, and when the first bearing seat 2 and the second bearing seat 3 respectively hold twenty-five wafers, the first bearing seat 2 and the second bearing seat 3 can be close to each other to meet the batch transfer demand of the wafer by the mechanical hand, the structure design is ingenious, and the wafer transfer time is effectively shortened.

[0066] Reference Figure 5 、 6, 7, in the embodiment, the first support rod 51 is connected with one output end of the translation mechanism 5 through the first rotating unit 53, and the second support rod 52 is connected with the other output end of the translation mechanism 5 through the second rotating unit 54; in actual application, the first rotating unit 53 and the second rotating unit 54 adopt a gear set, a belt / chain transmission set or a worm gear transmission set to realize the rotating requirement of the first support rod 51 and the second support rod 52; when it is required to turn over the wafer on the first bearing seat 2, the lifting mechanism 4 drives the rack 1 to descend relative to the first bearing seat 2, the first bearing seat 2 is exposed at the opening end corresponding to the wafer box, the first rotating unit 53 drives the first support rod 51 to rotate, so that the wafer on the first bearing seat 2 is rotated by 180°, and the turning over requirement of the wafer is met; when it is required to turn over the wafer on the second bearing seat 3, the lifting mechanism 4 drives the rack 1 to descend relative to the second bearing seat 3, the second bearing seat 3 is exposed at the opening end corresponding to the wafer box, the second rotating unit 54 drives the second support rod 52 to rotate, so that the wafer on the second bearing seat 3 is rotated by 180°, and the turning over requirement of the wafer is met.

[0067] Reference Figure 6 In the embodiment, the top of the first bearing seat 2 is symmetrically provided with at least two first support parts 21, and a plurality of first clamping grooves 22 which are adapted to the shape of the wafer and have notches upward are arranged on the first support parts 21 in an interval, so as to facilitate accurate positioning of the wafer; the top of the second bearing seat 3 is symmetrically provided with at least two second support parts 31, and a plurality of second clamping grooves 32 which are adapted to the shape of the wafer and have notches upward are arranged on the second support parts 31 in an interval, so as to facilitate accurate positioning of the wafer.

[0068] Reference Figure 6 In the embodiment, the first clamping groove 22 is in an arc structure, the centers of every two first clamping grooves 22 which are adapted to the same wafer coincide, the wafer can be smoothly attached to the inner side of the first clamping groove 22, when both ends of the wafer are inserted into the first clamping groove 22, the center of the wafer coincides with the center of the first clamping groove 22, so as to facilitate improvement of the insertion stability of the wafer; the second clamping groove 32 is in an arc structure, the centers of every two second clamping grooves 32 which are adapted to the same wafer coincide, the wafer can be smoothly attached to the inner side of the second clamping groove 32, when both ends of the wafer are inserted into the second clamping groove 32, the center of the wafer coincides with the center of the second clamping groove 32, so as to facilitate improvement of the insertion stability of the wafer.

[0069] Reference Figure 7As shown, in the embodiment, the distance between two adjacent first clamping grooves 22 is L1, the distance between two adjacent second clamping grooves 32 is L2, and the minimum distance between adjacent first clamping grooves 22 and second clamping grooves 32 when the first carrier 2 and the second carrier 3 are close to each other is L3; L1, L2 and L3 satisfy L1=L2=L3, so that the interval between every two adjacent wafers is the same when the first carrier 2 and the second carrier 3 are close to each other, which is convenient for stable wafer transfer and rapid positioning and grabbing of the wafer by the mechanical hand, and improves wafer transfer efficiency.

[0070] Reference Figure 1 , 2 As shown, the application also provides a wafer batch transfer system, which comprises a rack 1, a first placement position 101 and a second placement position 102 arranged on the rack 1 and used for placing two wafer boxes respectively, a first carrier 2 and a second carrier 3 used for holding wafers, a lifting mechanism 4 used for driving the rack 1 to move up and down, and a translation mechanism 5 used for driving the first carrier 2 and the second carrier 3 to move close to or away from each other, wherein the first carrier 2 and the second carrier 3 correspond to the first placement position 101 and the second placement position 102 respectively.

[0071] In actual application, when it is needed to combine wafers in two wafer boxes, the rack 1 is moved by the lifting mechanism 4, the lifting mechanism 4 adopts a lead screw motor module, an oil cylinder or an electric cylinder, so that the first carrier 2 and the second carrier 3 are both located below the rack 1, and the wafer boxes each loaded with wafers are placed in the first placement position 101 and the second placement position 102 respectively, and each wafer box loaded with wafers has twenty-five wafers, so that after the wafers in the two wafer boxes are combined, fifty wafers can be provided for batch transfer; the rack 1 is lowered relative to the first carrier 2 and the second carrier 3 by the lifting mechanism 4, the first carrier 2 and the second carrier 3 are inserted into the wafer boxes along the bottom openings of the wafer boxes, so that the wafers in the wafer boxes are held by the first carrier 2 and the second carrier 3 respectively, the rack 1 is continuously lowered relative to the first carrier 2 and the second carrier 3 by the lifting mechanism 4, so that the first carrier 2 and the second carrier 3 are higher than the top openings of the wafer boxes, and the first carrier 2 and the second carrier 3 are close to each other by the translation mechanism 5, so that the wafers on the first carrier 2 and the second carrier 3 are arranged side by side, and the combined fifty wafers are placed in the corresponding processing procedure by the mechanical hand, so as to automatically realize wafer batch transfer, avoid the occurrence of low efficiency, strong subjectivity and high error rate of manual operation, and improve wafer transfer efficiency.

[0072] When it is needed to load the combined wafers into two wafer boxes respectively, the mechanical arm is used to grab the combined fifty wafers, the lifting mechanism 4 drives the rack 1 to descend relative to the first bearing seat 2 and the second bearing seat 3, so that the first bearing seat 2 and the second bearing seat 3 are higher than the top opening of the wafer box, the translation mechanism 5 drives the first bearing seat 2 and the second bearing seat 3 to approach, the mechanical arm drives the combined fifty wafers to descend, so that the fifty wafers are loaded into the first bearing seat 2 and the second bearing seat 3 respectively, and twenty-five wafers are placed on the first bearing seat 2 and the second bearing seat 3 respectively, which meets the loading requirement of the wafer box, the translation mechanism 5 drives the first bearing seat 2 and the second bearing seat 3 to move away from each other, so that the first bearing seat 2 and the second bearing seat 3 are located at the opening end of the wafer box respectively, the lifting mechanism 4 drives the rack 1 to ascend relative to the first bearing seat 2 and the second bearing seat 3, and the inner side wall of the wafer box is usually provided with a plurality of recessed grooves matched with the shape of the wafer, so as to clamp and limit a plurality of wafers in the wafer box, in the process of ascending of the rack 1 relative to the first bearing seat 2 and the second bearing seat 3, the bottom of the wafer is supported by the wafer box and then separated from the first bearing seat 2 or the second bearing seat 3, so that the wafers on the first bearing seat 2 and the second bearing seat 3 are supported by the two wafer boxes respectively, and each wafer box is successfully loaded with corresponding twenty-five wafers.

[0073] The above is only the preferred embodiment of the present application, and does not limit the present application in any form. Although the present application is disclosed as above with the preferred embodiment, it is not intended to limit the present application. Any skilled person in the art can make some changes or modifications to the above disclosed technical content without departing from the technical solution of the present application, and any simple modification, equivalent change and modification of the above embodiment within the scope of the present application are all within the scope of the present application.

Claims

1. A wafer batch transmission method, characterized in that: The application relates to a wafer batch conveying device and method, which comprises a rack (1), a first placing position (101) and a second placing position (102) arranged on the rack (1) and used for placing a wafer box respectively, a first bearing seat (2) and a second bearing seat (3) used for holding wafers, a lifting mechanism (4) used for driving the rack (1) to move up and down, and a translation mechanism (5) used for driving the first bearing seat (2) and the second bearing seat (3) to approach or move away from each other, wherein the first bearing seat (2) and the second bearing seat (3) correspond to the first placing position (101) and the second placing position (102) respectively. S01, when wafers in two wafer boxes need to be taken out and combined, the lifting mechanism (4) is used to drive the rack (1) to move, so that the first bearing seat (2) and the second bearing seat (3) are located below the rack (1); S02, a mechanical arm is used to place the wafer boxes containing wafers in the first placing position (101) and the second placing position (102) respectively, the lifting mechanism (4) is used to drive the rack (1) to descend relative to the first bearing seat (2) and the second bearing seat (3), the first bearing seat (2) and the second bearing seat (3) are inserted into the wafer boxes along the bottom openings of the wafer boxes, and the wafers in the wafer boxes are held by the first bearing seat (2) and the second bearing seat (3) respectively; S03, the lifting mechanism (4) is used to continue to drive the rack (1) to descend relative to the first bearing seat (2) and the second bearing seat (3), so that the first bearing seat (2) and the second bearing seat (3) are higher than the top openings of the wafer boxes, and the translation mechanism (5) is used to drive the first bearing seat (2) and the second bearing seat (3) to approach, so that the wafers on the first bearing seat (2) and the second bearing seat (3) are arranged side by side, and the mechanical arm is used to batch transfer the combined wafers as a whole; S04, when the combined wafers as a whole need to be loaded into two wafer boxes, the lifting mechanism (4) is used to drive the rack (1) to descend relative to the first bearing seat (2) and the second bearing seat (3), so that the first bearing seat (2) and the second bearing seat (3) are higher than the top openings of the wafer boxes, and the translation mechanism (5) is used to drive the first bearing seat (2) and the second bearing seat (3) to approach; S05, the mechanical arm is used to load the combined wafers into the first bearing seat (2) and the second bearing seat (3), so that the first bearing seat (2) and the second bearing seat (3) hold half of the wafers respectively, the mechanical arm is moved away from the first bearing seat (2) and the second bearing seat (3), the translation mechanism (5) is used to drive the first bearing seat (2) and the second bearing seat (3) to move away from each other, and the first bearing seat (2) and the second bearing seat (3) are located at the opening ends of the wafer boxes respectively; S06, the lifting mechanism (4) is used to drive the rack (1) to ascend relative to the first bearing seat (2) and the second bearing seat (3), so that the wafers on the first bearing seat (2) and the second bearing seat (3) are supported by the two wafer boxes, and the two wafer boxes are combined into one wafer box containing fifty wafers. The translation mechanism (5) adopts a reverse synchronous double slide module, two output ends of the translation mechanism (5) are connected with a first support rod (51) and a second support rod (52) respectively, the first support rod (51) and the second support rod (52) are connected with the first bearing seat (2) and the second bearing seat (3) respectively; The first bearing seat (2) and the first support rod (51) are provided with a first accommodating space (511), and the second bearing seat (3) and the second support rod (52) are provided with a second accommodating space (521); When the first bearing seat (2) and the second bearing seat (3) are higher than the top opening of the wafer box, the translation mechanism (5) drives the first bearing seat (2) and the second bearing seat (3) to close, so that one end of one wafer box extends into the first accommodating space (511), and one end of the other wafer box extends into the second accommodating space (521); The first support rod (51) is connected with one of the output ends of the translation mechanism (5) through a first rotating unit (53), and the second support rod (52) is connected with the other output end of the translation mechanism (5) through a second rotating unit (54); When it is needed to turn over the wafer on the first bearing seat (2), the lifting mechanism (4) drives the rack (1) to descend relative to the first bearing seat (2), the first bearing seat (2) exposes the opening end corresponding to the wafer box, the first rotating unit (53) drives the first support rod (51) to rotate, so that the wafer on the first bearing seat (2) rotates by 180° angle; When it is needed to turn over the wafer on the second bearing seat (3), the lifting mechanism (4) drives the rack (1) to descend relative to the second bearing seat (3), the second bearing seat (3) exposes the opening end corresponding to the wafer box, the second rotating unit (54) drives the second support rod (52) to rotate, so that the wafer on the second bearing seat (3) rotates by 180° angle.

2. The wafer batch transfer method of claim 1, wherein, The wafer batch conveying method is also provided with a box feeding mechanism (6), an output end of the lifting mechanism (4) is connected with a box pushing mechanism (7), the box pushing mechanism (7) is drivingly connected with the rack (1), the rack (1) is provided with a first taking and placing opening (103) and a second taking and placing opening (104) corresponding to the first placing position (101) and the second placing position (102) respectively; When it is needed to place the wafer box on the rack (1), the lifting mechanism (4) drives the rack (1) to move above the first bearing seat (2) and the second bearing seat (3), an output end of the box feeding mechanism (6) bears the wafer box, the box pushing mechanism (7) drives the rack (1) to move away from the first bearing seat (2), so that the top end of the box feeding mechanism (6) penetrates into the first taking and placing opening (103) or the second taking and placing opening (104), and the box feeding mechanism (6) places the wafer box on the first placing position (101) or the second placing position (102).

3. The wafer batch transfer method according to claim 2, wherein, The box feeding mechanism (6) comprises a box feeding horizontal module (61) and a box feeding longitudinal module (62) in driving connection with the box feeding horizontal module (61), and the output end of the box feeding longitudinal module (62) is connected with a box feeding bearing table (63); the box feeding horizontal module (61) drives the box feeding longitudinal module (62) and the box feeding bearing table (63) to move, so that the box feeding bearing table (63) corresponds to the first taking and placing opening (103) or the second taking and placing opening (104); When it is needed to place the wafer box on the rack (1), the lifting mechanism (4) drives the rack (1) to move above the first bearing seat (2) and the second bearing seat (3), the wafer box is placed on the box feeding bearing table (63), the box pushing mechanism (7) drives the rack (1) to move away from the first bearing seat (2), so that the box feeding bearing table (63) extends into the rack (1) along the first taking and placing opening (103) or the second taking and placing opening (104), the box feeding longitudinal module (62) drives the box feeding bearing table (63) and the wafer box to move close to the first bearing seat (2) or the second bearing seat (3), so that the wafer box is placed on the first placing position (101) or the second placing position (102), so that the wafer box is placed on the rack (1).

4. The wafer batch transfer method of claim 2, wherein, The box pushing mechanism (7) comprises a box pushing platform (71) and a box pushing horizontal module (72) mounted on the box pushing platform (71); the box pushing platform (71) is in driving connection with the lifting mechanism (4); the output end of the box pushing horizontal module (72) is in driving connection with the rack (1); and the rack (1) is in sliding connection with the box pushing platform (71); When it is needed to place the wafer box on the rack (1), the lifting mechanism (4) drives the rack (1) to move above the first bearing seat (2) and the second bearing seat (3), the output end of the box feeding mechanism (6) bears the wafer box, the box pushing horizontal module (72) drives the rack (1) to move away from the first bearing seat (2), so that the top end of the box feeding mechanism (6) penetrates into the first taking and placing opening (103) or the second taking and placing opening (104), and the box feeding mechanism (6) places the wafer box on the first placing position (101) or the second placing position (102).

5. The wafer batch transfer method of claim 1, wherein, The top of the first bearing seat (2) is symmetrically provided with at least two first supporting portions (21), and a plurality of first clamping grooves (22) which are adapted to the shape of the wafer and have a notch upward are arranged on the first supporting portions (21) in an interval; The top of the second bearing seat (3) is symmetrically provided with at least two second supporting portions (31), and a plurality of second clamping grooves (32) which are adapted to the shape of the wafer and have a notch upward are arranged on the second supporting portions (31) in an interval; The first clamping grooves (22) are in an arc structure, and the centers of every two first clamping grooves (22) which are adapted to the same wafer coincide; and the second clamping grooves (32) are in an arc structure, and the centers of every two second clamping grooves (32) which are adapted to the same wafer coincide.

6. The wafer batch transfer method of claim 5, wherein, The distance between two adjacent first clamping grooves (22) is L1, the distance between two adjacent second clamping grooves (32) is L2, and the minimum distance between adjacent first clamping grooves (22) and second clamping grooves (32) when the first carrier (2) and the second carrier (3) are close to each other is L3; L1, L2 and L3 satisfy L1=L2=L3.

7. A wafer batch transport system, characterized by, The wafer batch transfer method according to any one of claims 1-6, comprising a rack (1), a first placement position (101) and a second placement position (102) arranged on the rack (1) and used for placing a wafer box respectively, a first carrier (2) and a second carrier (3) used for holding wafers, a lifting mechanism (4) used for driving the rack (1) to move up and down, and a translation mechanism (5) used for driving the first carrier (2) and the second carrier (3) to move close to or away from each other, wherein the first carrier (2) and the second carrier (3) correspond to the first placement position (101) and the second placement position (102) respectively.

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