Signal transmission apparatus, method and system between waveguide and integrated module

Abstract

The application provides a signal transmission device, method and system between waveguides and integrated modules, which connects two laminated plates together through a spherical network array, configures a perforated metalized cavity on a first laminated plate, configures a signal transmitter, a transmission line, a dielectric waveguide back cavity, a matching structure and an integrated circuit on a second laminated plate, and realizes signal transmission between waveguides and integrated modules. The signal is input by the waveguide, coupled to the signal transmitter through the perforated metalized cavity and the waveguide-like structure, and then transmitted to the integrated circuit through the transmission line. Meanwhile, the signal transmission device is a passive structure, so the reverse transmission of the signal can also be realized, that is, the signal is transmitted from the integrated circuit to the waveguide through the signal transmission path. Furthermore, the signal transmission device and method can be extended to an integrated antenna system to realize system-level application. Compared with the prior art, the application can effectively reduce signal transmission loss and realize high-density integration of the system.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of millimeter wave radio frequency integrated circuit technology, in particular to a low-loss signal transmission device between a waveguide and an integrated module, a signal transmission method and a signal transmission system extended therefrom. BACKGROUND

[0002] Compared with microwaves, millimeter wave electromagnetic waves have shorter wavelengths and more abundant spectrum resources, and are increasingly widely used in the fields of high-speed wireless communication, high-resolution radar and high-resolution imaging. Microstrip lines, strip lines, grounded coplanar waveguides and other transmission lines play an extremely important role in the signal transmission of millimeter wave high-integration systems. However, due to the high frequency of millimeter waves, the loss tangent of the medium increases, and the transmission lines such as microstrip lines, strip lines and grounded coplanar waveguides will produce large transmission loss, especially in the application of W-band and above, the large loss often affects the overall performance of the system. The waveguide with low transmission loss is favored, and the high-frequency electromagnetic wave signal is coupled to the transmission line through the waveguide, and then transmitted to the planar high-integration system, which is a commonly used signal transmission method for high-frequency high-integration systems.

[0003] The coupling conversion of the waveguide to the transmission line has two structures: the transmission line parallel to the waveguide signal transmission direction and the transmission line perpendicular to the waveguide signal transmission direction. The structure of the transmission line parallel to the waveguide signal transmission direction often requires a longer path transition and higher assembly precision, and will introduce a larger system aperture. The structure of the transmission line perpendicular to the waveguide signal transmission direction is similar to the coupling of a probe at the end of the waveguide, and often has a narrow working bandwidth. To obtain a wider working bandwidth, a metal waveguide back cavity structure can be introduced, but this will increase the complexity and assembly difficulty of the system, which is not conducive to the high-density integration of the system and even affects the performance of the system, such as affecting the radiation performance of the side-firing antenna system. And in higher frequency bands, such as W-band and above, the size of the waveguide flange has approached the overall size of the high-integration system module, and the high-integration system module also has other functional interfaces. The assembly and cooperation of the waveguide and other functional interfaces are also a great challenge.

[0004] Therefore, an effective signal transmission device and signal transmission method for high-frequency waveguide to high-integration system are needed, which need to meet the requirements of lower transmission loss, wider working bandwidth, friendly assembly method, and easy high-density integration of the system, etc. SUMMARY

[0005] The waveguide and integrated module signal transmission device and signal transmission method of the present application, through the implementation of effective system integration architecture and waveguide-transmission line vertical transmission transition structure, achieves the requirements of low transmission loss, wide operating bandwidth and high-density integration, has strong engineering practicability, and is easy to expand into a signal transmission system, such as an integrated antenna system.

[0006] According to an aspect of the embodiment of the present application, a waveguide and integrated module signal transmission device is provided. It comprises a waveguide, a first laminated board, a second laminated board and a spherical network array. The waveguide is a standard waveguide or a waveguide structure member processed according to requirements, which works at a frequency corresponding to the required frequency of the system. The first laminated board is provided with a through-hole metallized cavity consistent with the cross-sectional size of the waveguide perpendicular to the signal transmission direction. The second laminated board is provided with an integrated circuit, a transmission line and a signal transmitter on the surface of the second laminated board. The spherical network array is attached between the first laminated board and the second laminated board to play a role of assembly and connection and contains a group of configured ground solder balls, which form a fence or a boundary around the through-hole metallized cavity and the signal transmitter to form a waveguide-like structure to transmit signals between the through-hole metallized cavity and the signal transmitter.

[0007] Further, the first laminated board of the implementation device has a waveguide interface side, a waveguide-like interface side opposite to the waveguide interface side, and a through-hole metallized cavity perpendicular to the plane of the first laminated board and extending from the waveguide interface side to the waveguide-like interface side. The second laminated board has an integrated circuit containing a signal transmission interface, a signal transmitter configured on the surface of the second laminated board to transmit or receive signals, a transmission line having one end connected to the signal transmitter and the other end connected to the corresponding signal transmission interface of the integrated circuit, a dielectric waveguide back cavity composed of a configured first group of metal vias and a layer of metal short-circuit surface on the second laminated board, and a matching structure composed of a configured second group of metal vias connected to the layer of metal short-circuit surface and a group of metal straps connecting the second group of metal vias on layers other than the layer occupied by the metal short-circuit surface. The spherical network array contains a group of configured ground solder balls to form a waveguide-like structure to couple the through-hole metallized cavity to the signal transmitter.

[0008] Further, the waveguide, the through-hole metallized cavity, the waveguide-like structure and the dielectric waveguide back cavity are substantially aligned.

[0009] Further, the spherical network array contains solder balls for power supply, ground, digital signal and control signal transmission between the first laminated board and the second laminated board.

[0010] Further, the signal transmission interface of the integrated circuit comprises at least a set of configured solder balls, the set of configured solder balls at least comprises one ground solder ball and one non-ground solder ball.

[0011] Further, the non-ground solder ball is connected to the transmission line, and the ground solder ball is connected to the reference ground plane of the transmission line.

[0012] According to another aspect of the embodiments of the present application, a signal transmission method between a waveguide and an integrated module is provided. The method comprises any of the signal transmission devices between the waveguide and the integrated module. Signals are received by the waveguide and transmitted to the perforated metallized cavity, and then transmitted to the waveguide-like structure through the perforated metallized cavity, and then transmitted to the signal transmitter through the waveguide-like structure, and then transmitted to the transmission line through the signal transmitter, and then transmitted to the integrated circuit through the transmission line; or signals are collected by the integrated circuit and transmitted to the transmission line, and then transmitted to the signal transmitter through the transmission line, and then transmitted to the waveguide-like structure through the signal transmitter, and then transmitted to the perforated metallized cavity through the waveguide-like structure, and then transmitted to the waveguide through the perforated metallized cavity.

[0013] According to another aspect of the embodiments of the present application, a signal transmission system between a waveguide and an integrated module is further provided. The integrated antenna system comprises a signal transmitter or a signal receiver, an antenna, and all or part of the structures of the signal transmission device between the waveguide and the integrated module. The signal transmitter or the signal receiver is connected to the waveguide. The integrated circuit further comprises an antenna connection interface, and the antenna is arranged on the surface of the second layer board and connected to the antenna connection interface. When the signal transmitter is connected to the waveguide, the integrated circuit is configured to have a transmitting function, the integrated antenna system is an integrated transmitting antenna system, and the signal transmitter radiates signals through the system antenna. When the signal receiver is connected to the waveguide, the integrated circuit is configured to have a receiving function, the integrated antenna system is an integrated receiving antenna system, and the signal receiver receives and processes signals received by the system antenna.

[0014] In the embodiment of the present application, two laminated plates are connected and fixed together by the spherical network array, and the signal transmission between the waveguide and the integrated module is realized by configuring the perforated metal cavity in the first laminated plate and configuring the signal transmitter, the transmission line, the dielectric waveguide back cavity, the matching structure and the integrated circuit in the second laminated plate. The signal is input by the waveguide, coupled to the signal transmitter through the perforated metal cavity and the waveguide-like structure, and then transmitted to the integrated circuit through the transmission line. At the same time, the signal transmission path involved in the embodiment is a passive structure, so the reverse transmission of the signal can also be realized, that is, the signal is transmitted from the integrated circuit to the waveguide through the signal transmission path. Further, the signal transmission device and method can be extended to the integrated antenna system to realize the system-level application. Compared with the prior art, the present application can effectively reduce the signal transmission loss and realize high-density integration of the system. BRIEF DESCRIPTION OF DRAWINGS

[0015] For the detailed description of the embodiments, reference will be made to the accompanying drawings, which are provided to provide further understanding of the present application, and in which:

[0016] Figure 1 The overall schematic front view of the signal transmission device between the waveguide and the integrated module in the embodiment of the present application is illustrated.

[0017] Figures 2a to 2b The overall schematic side view and top view of the signal transmission device between the waveguide and the integrated module in the embodiment of the present application are illustrated.

[0018] Figures 3a to 3b The specific schematic front view and side view of the first laminated plate in the embodiment of the present application are illustrated.

[0019] Figures 4a to 4c The specific schematic front view, top view and side view of the second laminated plate in the embodiment of the present application are illustrated.

[0020] Figure 5 The specific schematic front view of the spherical network array in the embodiment of the present application is illustrated.

[0021] Figures 6a to 6b The simulation schematic diagram of the signal transmission path from the W-band rectangular waveguide to the grounded coplanar waveguide transmission line in the embodiment of the present application is illustrated, and the graph of the return loss and the insertion loss from the W-band rectangular waveguide port to the grounded coplanar waveguide transmission line port is illustrated.

[0022] Figures 7a to 7b The flowchart of the signal transmission method between the waveguide and the integrated module in the embodiment of the present application is illustrated.

[0023] Figures 8a to 8c The block diagram and the overall schematic diagram of the integrated antenna system provided by the embodiment of the present application are illustrated. DETAILED DESCRIPTION

[0024] The embodiments disclose a signal transmission device between a waveguide and an integrated module, a signal transmission method and a signal transmission system. The embodiments are further explained below with reference to the drawings and examples. The described embodiments are only some of the embodiments of the present application, not all.

[0025] According to an aspect of the embodiments of the present application, the disclosed signal transmission device provides an interface with robustness to manufacturing and assembly tolerances and low insertion loss to an external signal transmitter or signal receiver. The disclosed device includes a waveguide, a first laminate, a ball grid array and a second laminate. The waveguide is a standard waveguide or a custom waveguide structure operating at a desired frequency. The first laminate includes a through-hole metallized cavity having a cross-sectional dimension perpendicular to a signal transmission direction that is the same as a cross-sectional dimension of the waveguide perpendicular to the signal transmission direction. The second laminate includes an integrated circuit and a signal transmitter configured on a surface of the second laminate and a transmission line connected to the signal transmitter, the other end of the transmission line being connected to a signal transmission interface of the integrated circuit. The ball grid array is attached between the first laminate and the second laminate for assembly and signal transmission between the two laminates, and includes a set of ground balls configured to form a waveguide-like structure around the through-hole metallized cavity and a fence or a boundary of the signal transmitter and receiver.

[0026] In some examples, the laminates of the disclosed device include printed circuit boards. As shown in Figure 1 and Figures 2a to 2b The disclosed signal transmission method can include a waveguide 1, a first printed circuit board 2, a ball grid array 3 and a second printed circuit board 4.

[0027] The waveguide 1 is an external signal transmission interface of the disclosed device, and can be connected to a signal transmitter or a signal receiver to achieve signal input or output of the signal transmission device. The waveguide 1 is configured as a standard waveguide or a custom waveguide structure operating at a desired frequency.

[0028] The first printed circuit board 2 is configured as shown in Figures 3a to 3b The first printed circuit board 2 has first and second surfaces opposite to each other and a waveguide interface side 22 and a waveguide-like interface side 23 configured on the two surfaces. The first printed circuit board 2 includes a through-hole metallized cavity 21 perpendicular to the first and second surfaces and extending from the waveguide interface side 22 to the waveguide-like interface side 23. The through-hole metallized cavity 21 has a cross-sectional dimension parallel to the first and second surfaces of the first printed circuit board 2 that is the same as a cross-sectional dimension of the waveguide.

[0029] The second printed circuit board 4 is configured as shown in Figures 4a to 4cAs shown, it includes integrated circuit 41, signal transferer 42, matching structure 43, transmission line 44 and dielectric waveguide back cavity 45. Its integrated circuit 41 contains signal transfer interface 411 which is a set of configured solder balls including one non-ground solder ball and a plurality of ground solder balls surrounding the non-ground solder ball; integrated circuit 41 also contains other solder balls 412 defined as power, ground, signal transfer and signal control interface functions. Its signal transferer 42 is configured on the surface of second printed circuit board 4 and connected to one end of transmission line 44, signal transferer 42 is configured to perform the function of converting waveguide 1 transmission signal mode to transmission line 44 transmission signal mode. Its dielectric waveguide back cavity 45 is composed of a first set of configured metal vias 451 and a metal shorting plane 452, one end of first set of metal vias 451 is connected to metal shorting plane 452, on each layer occupied by other than metal shorting plane 452, corresponding to first set of metal vias 451, rectangular metal slots 453 are configured to avoid, in order to cooperate with first set of metal vias 451 and metal shorting plane 452 to form dielectric waveguide back cavity 45. Its matching structure 43 is composed of a second set of configured metal vias 431 connected to metal shorting plane 452 and metal straps 432 connecting the set of metal vias on layers other than the layer occupied by the metal shorting plane. Signal transferer 42 and matching structure 43 are respectively placed on both sides of the center line of the short side of dielectric waveguide back cavity 45. Dielectric waveguide back cavity 45 and matching structure 43 cooperate with signal transferer 42 to improve the insertion loss and return loss of the signal converted from waveguide 1 to transmission line 44, and achieve a wider operating bandwidth, etc.

[0030] Where the spherical network array 3 is configured as Figure 5 As shown, spherical network array 3 is attached between first printed circuit board 2 and second printed circuit board 4 as a printed circuit board assembly connection structure and performs power, ground and signal connection transmission between each other, spherical network array 3 contains a set of configured ground solder balls consisting of waveguide-like structure 31, which is configured as a fence or boundary formed around perforated metalized cavity 21, and its boundary size is slightly larger than the cross-sectional size of perforated metalized cavity.

[0031] As an optional embodiment, the waveguide 1 can be configured as a rectangular waveguide, and can also be configured as a circular waveguide, and the shapes of the perforated metalized cavity 21, the waveguide-like structure 31, and the dielectric waveguide back cavity 45 are also configured as circular or other shapes that optimize the overall structure signal transmission. Similarly, as an optional embodiment, the transmission line 44 can be configured as a grounded coplanar waveguide, and can also be configured as a substrate integrated coaxial line, a strip line, a microstrip line, and other transmission line forms as needed. Similarly, as an optional embodiment, the signal transmitter 42 and the matching structure 43 can be placed on both sides of the center line of the short side of the dielectric waveguide back cavity, and the matching structure 43 can also be configured at other positions as needed, for example, divided into two parts and placed on both sides of the center line of the long side of the dielectric waveguide back cavity, with the purpose of optimizing the signal transmission performance.

[0032] In some specific implementation cases, a rectangular waveguide to high-density integrated module signal transmission device working in the W frequency band can be configured. Figures 6a to 6b An analog schematic diagram of the rectangular waveguide to grounded coplanar waveguide transmission line part in the W frequency band transmission device is described, and a diagram illustrating the insertion loss and return loss of the direct interface is described. The waveguide 1 is configured as a standard rectangular waveguide WR-10 working in the W waveband, and the cross-sectional size is 2.54 mm x 1.27 mm. The cross-sectional size of the perforated metalized cavity is consistent with the rectangular waveguide, and is also 2.54 mm x 1.27 mm. The waveguide-like structure 31 is composed of 16 grounded solder balls with a diameter of 0.4 mm, and the 16 grounded solder balls are arranged in a rectangular arrangement to form an air boundary for signal transmission. The signal transmitter 42 is configured as a "T" shaped patch and is connected to the metal strip 441 in the middle of the grounded coplanar waveguide transmission line 44. The dielectric waveguide back cavity 45 is composed of a first group of metal vias 451 arranged in a rectangular shape and a metal short circuit surface 452, and the dielectric waveguide back cavity 45 involves 4 layers of dielectric plates and 5 layers of metal. Except for the 5th metal layer where the metal short circuit surface 452 is located, the remaining 4 layers of metal layers have rectangular metal slots 453 opened between the rectangular boundaries formed by the first group of metal vias 451, and the first group of metal vias 451 are connected by the metal outside the slots in the above 4 layers of metal layers. The matching structure 43 is composed of 8 second group of metal vias 431 connected to the metal short circuit surface 452 and the rounded rectangular metal strips 432 on the remaining 4 layers of metal layers, and the rounded rectangular metal strips 432 connect the second group of metal vias 431 on the remaining 4 layers.

[0033] Figure 6b The insertion loss 51, the return loss 52 of the rectangular waveguide side, and the return loss 53 of the grounded coplanar waveguide transmission line side across the frequency range of 75 GHz to 110 GHz in decibels (dB) are described. It can be seen that the -10 dB port return loss can cover the entire W waveband frequency (75-110 GHz), and the relative impedance bandwidth reaches 37.84%, and the insertion loss is less than 0.5 dB throughout the W frequency band.

[0034] According to another aspect of the embodiments of the present application, a signal transmission method between a waveguide and an integrated module is provided. Figures 7a to 7b The flow chart of the signal transmission method between the waveguide and the integrated module provided by the embodiments of the present application is illustrated. Figure 7a The signal transmission method from the waveguide 1 to the integrated circuit 41 is illustrated: the waveguide 1 receives signals and transmits the signals to the perforated metalized cavity 21, and then transmits the signals to the waveguide-like structure 31, and then transmits the signals to the signal transmitter 42, and then transmits the signals to the transmission line 44, and then transmits the signals to the integrated circuit 41. Figure 7b The signal transmission method from the integrated circuit 41 to the waveguide 1 is illustrated: the integrated circuit 41 collects signals and transmits the signals to the transmission line 44, and then transmits the signals to the signal transmitter 42, and then transmits the signals to the waveguide-like structure 31, and then transmits the signals to the perforated metalized cavity 21, and then transmits the signals to the waveguide 1, and then transmits the signals out of the waveguide 1.

[0035] According to another aspect of the embodiments of the present application, a signal transmission system between a waveguide and an integrated module is further provided: an integrated antenna system. Figures 8a to 8c The schematic diagram of the integrated antenna system provided by the embodiments of the present application and a specific example are illustrated. Figure 8a The schematic diagram of the integrated transmitting antenna is illustrated, and the system includes a signal transmitter, an antenna and all structures of the signal transmission device between the waveguide and the integrated module. Figure 8b The schematic diagram of the integrated receiving antenna is illustrated, and the system includes a signal receiver, an antenna and all structures of the signal transmission device between the waveguide and the integrated module. Figure 8c The integrated antenna system model is further provided based on the signal transmission device and the transmission method between the waveguide and the integrated module. The waveguide 1 is the interface of the system, and can be connected with a signal transmitter or a signal receiver. The antenna 46 is arranged on the surface of the second printed circuit board 4, which is located on the other side of the surface of the integrated circuit 41. The antenna 46 is connected with the antenna connection interface 413 of the integrated circuit 41, so as to realize the transmission between the antenna transmitting or receiving signals and the integrated circuit 41.

[0036] It should be noted that the above-mentioned method embodiments are only the preferred embodiments of the present application, and it should be pointed out that the ordinary skilled in the art can make some improvements and refinements without departing from the principles of the present application, and these improvements and refinements should be considered as the protection scope of the present application.

[0037] The term "coupled" can encompass a connection, communication, or signal path, etc. that enables a functional relationship between the descriptions of the present disclosure. In addition, the use of the words "first", "second", etc. to qualify components is merely for the convenience of distinguishing the respective components, and the words have no special meaning unless otherwise declared. Meanwhile, unless otherwise declared, "aligned" or "substantially aligned" means that both are 90% aligned or aligned more than 90% in the description herein.

Claims

1. A signal transmission device between a waveguide and an integrated module, characterized in that: It includes a waveguide, a first stacked plate, a spherical network array and a second stacked plate arranged in sequence; The waveguide is the external signal transmission interface of the device; The first stacked plate is provided with a perforated metalized cavity, and the perforated metalized cavity plays a role in signal transmission between the waveguide and the spherical network array; The second laminated board includes a signal transmitter, a transmission line, and an integrated circuit, one end of the transmission line is connected to the signal transmitter, and the other end is connected to the signal transmission interface of the integrated circuit, and the signal transmitter is configured on the surface of the second laminated board to transmit or receive signals; The ball network array is assembled between the first stacked plate and the second stacked plate and includes a waveguide-like structure composed of a group of grounded solder balls surrounding the perforated metallized cavity, and the waveguide-like structure plays a role in transmitting signals between the signal transmitter and the perforated metallized cavity; The second stacked board also includes a dielectric waveguide back cavity and a matching structure. The dielectric waveguide back cavity is composed of a configured first group of metal vias and a layer of metal short-circuit surface on the second stacked board; the matching structure is composed of a configured second group of metal vias connected to the layer of metal short-circuit surface and a group of metal conducting strips located in other layers occupied by the second group of metal vias except the layer occupied by the metal short-circuit surface, connecting the second group of metal vias.

2. The device according to claim 1, characterized in that: The ball grid array includes solder balls for transmitting power, ground, digital signals and control signals between the first stacked board and the second stacked board.

3. The device according to claim 1, characterized in that: The waveguide-like structure is arranged as a fence or boundary surrounding the signal transmitter and the through-hole metallized cavity.

4. The device according to claim 1, characterized in that: The integrated circuit includes: a signal transmission interface, which includes a group of configured solder balls, wherein the group of configured solder balls includes at least one solder ball connected to the reference ground plane of the transmission line and at least one solder ball connected to the transmission line.

5. The device according to claim 1, characterized in that: The number of metal layers and dielectric substrate layers occupied by the dielectric waveguide back cavity in the second stacked plate is greater than the number of metal layers and dielectric substrate layers occupied by the transmission line, wherein the configured first group of metal vias is interconnected with each occupied metal layer, wherein each occupied metal layer except the one metal short-circuit surface is grooved between the areas surrounded by the first group of metal vias to cooperate with the first group of metal vias to form the dielectric waveguide back cavity.

6. The device according to claim 1, characterized in that: The waveguide, the perforated metallized cavity, the waveguide-like structure and the dielectric waveguide back cavity are aligned.

7. A method for signal transmission between a waveguide and an integrated module, characterized in that: Based on the device described in any one of claims 1 to 6 and implemented as needed in the following manner: A signal is received through the waveguide and transmitted to the perforated metallized cavity, the signal is transmitted to the waveguide-like structure through the perforated metallized cavity, the signal is transmitted to the signal transmitter through the waveguide-like structure, the signal is transmitted to the transmission line through the signal transmitter, and the signal is transmitted to the integrated circuit through the transmission line.

8. A method for signal transmission between a waveguide and an integrated module, characterized in that: Based on the device described in any one of claims 1 to 6 and implemented as needed in the following manner: The integrated circuit collects the signal and transmits the signal to the transmission line, the transmission line transmits the signal to the signal transmitter, the signal transmitter transmits the signal to the waveguide-like structure, the waveguide-like structure transmits the signal to the perforated metallized cavity, and the metallized cavity transmits the signal to the waveguide.

9. A signal transmission system between a waveguide and an integrated module, characterized in that: It comprises a signal transmitter or a signal receiver, an antenna and the device according to any one of claims 1 to 6, wherein the signal transmitter or the signal receiver is connected to the waveguide; wherein the integrated circuit further comprises an antenna connection interface, and the antenna connection interface is connected to the antenna configured on the surface of the second laminate.

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