Component with electronic component and production process thereof

Abstract

The invention discloses an assembly with an electronic component and a production process thereof. The assembly comprises a coiled material belt, a plurality of reinforcing plates arranged at intervals are arranged on the material belt in the belt-shaped extension direction of the assembly, a circuit structure is fixed to each reinforcing plate, and electronic components are welded to the circuit structures. The assembly is in a strip shape with a plurality of circuit structures and can be conveniently and directly input into an injection molding machine for injection molding, bases can be respectively formed below the circuit structures and the reinforcing plates only through one-time injection molding, the injection molding frequency is low, and the production efficiency can be effectively improved. And then the injection-molded component is divided to form independent electronic components, and the reinforcing plate is arranged in the plastic base of each electronic component, so that the structural strength is high. The base in the electronic component can be used as the base of the voice coil motor, and the electronic component can be a Hall element and the like and is used for realizing the closed loop function of the voice coil motor in the camera module.

Description

Technical Field

[0001] The invention relates to the technical field of electronic components, in particular to an assembly with electronic components and a production process thereof. Background Art

[0002] The base of the closed-loop voice coil motor in the camera module of a mobile terminal device usually needs to be equipped with electronic components such as Hall elements, capacitors, coils and driver chips to achieve the corresponding closed-loop function. Due to the continuous miniaturization of mobile terminal devices, the size of the base of the corresponding voice coil motor is also smaller, and the current production process is relatively complicated for the production process of the base with various electronic components, and the production process efficiency is low.

[0003] Existing related technologies, such as Chinese patent CN 109287074 A, disclose a production process for a base with electronic components, in which a metal circuit is formed and the entire base is integrally formed by two injection molding processes and one SMT process, thereby avoiding the additional assembly process between the electronic components and the plastic parts. However, this process has the defect of requiring multiple injection molding processes.

[0004] Moreover, the mass industrial production of the above-mentioned camera module base usually requires the coordinated cooperation of different upstream and downstream manufacturers such as circuit manufacturers and injection molding manufacturers. How to improve the efficiency of coordination between different manufacturers is also crucial to improving product production efficiency. Summary of the invention

[0005] The object of the present invention is to provide an assembly with electronic components and a production process thereof, which has the advantage of improving production efficiency.

[0006] In order to achieve the above object, the solution of the present invention is: An assembly with electronic components, the assembly is a strip-shaped structure and can be rolled up; The assembly includes a rolled material strip, on which a plurality of reinforcing plates are arranged at intervals along the strip extension direction of the assembly, each reinforcing plate is fixed with a circuit structure, and electronic components are welded on the circuit structure; The circuit structure is a circuit structure made of liquid metal, a circuit structure made of conductive silver paste or an FPC circuit structure.

[0007] Furthermore, the material strip also includes two connecting strips, and both sides of each reinforcement plate are connected and arranged between the two connecting strips through a plurality of connecting pieces.

[0008] Furthermore, the material strip is a metal material strip, and the structure of the connecting strip and the connecting sheet can be formed by stamping or etching.

[0009] Furthermore, at least one protruding structure is provided on the reinforcing plate, and a concave hole structure is provided on the circuit structure to be aligned and fixed to the protruding structure.

[0010] Furthermore, the circuit structure is fixed to the reinforcing plate by bonding or riveting.

[0011] The present invention also provides a production process of an assembly with electronic components, comprising the following steps: Step 1: batch printing a plurality of mutually spaced circuit lines on a substrate to form a circuit structure with a plurality of circuit structures; Step 2: Weld and fix the electronic components on each circuit structure to finally obtain a circuit structure with electronic components; Step 3: Divide the circuit structure with electronic components into independent circuit structures with electronic components; Step 4: providing a long strip of material with a plurality of spaced reinforcing plates, and fixing each independent circuit structure with electronic components to the reinforcing plates of the strip one by one to form an assembly with electronic components; Step 5: Roll up the component and save it.

[0012] Furthermore, in step 1, the substrate is a hard board or a flexible board; the circuit line is a liquid metal circuit, a conductive silver paste circuit or an FPC circuit; In the step 4, the circuit structure is fixed to the reinforcing plate by gluing or riveting.

[0013] Furthermore, in the step 3, before the circuit structure is divided, at least one concave hole structure is formed on each circuit structure by punching; In step 4, the material strip is formed by stamping or etching a metal strip, and a convex structure is formed on each reinforcement plate to be aligned and fixed with the concave hole structure of the circuit structure; the circuit structure is fixed by the engagement between the concave hole structure and the convex structure of the reinforcement plate.

[0014] Furthermore, in step 4, the material strip is first formed by stamping or etching a metal strip, and the material strip also forms two connecting strips, and each reinforcement plate is connected between the two connecting strips on both sides by a number of connecting pieces; secondly, an insulating layer is covered on the reinforcement plate and the connecting piece, and then a connecting circuit is printed on the insulating layer, and the connecting circuit has connecting pins located on the connecting piece; finally, when the circuit structure is fixed to the reinforcement plate, it is also conductively connected to the connecting pins on the connecting piece; the connecting piece is used to serve as a pin support portion extending outward from the circuit structure.

[0015] Furthermore, in step 2, the circuit structure is produced by SMT process to solder and fix the electronic components on each circuit structure; first, the circuit structure is covered with a silk screen plate, and then the silk screen plate and the circuit structure are sent to a silk screen machine to print solder paste, and then the silk screen plate is removed and sent to a patch machine for patch production and fixed by reflow soldering, and finally the circuit structure with electronic components is obtained.

[0016] After adopting the above technical solution, the component is in the shape of a strip with several circuit structures, which can be directly input into the injection molding machine for injection molding. Only one injection molding is needed to form a base under each circuit structure and the reinforcement plate. The number of injection molding times is small, which can effectively improve production efficiency. After that, the components after injection molding are divided to form independent electronic components, and the plastic base of each electronic component has a reinforcement plate, which has high structural strength. The base in the electronic component can be used as the base of the voice coil motor, and the electronic component can be a Hall element, which is used to realize the closed-loop function of the voice coil motor in the camera module.

[0017] Moreover, the component can be rolled up to reduce the volume, which is convenient for logistics turnover. After being manufactured by the upstream circuit manufacturer, it can be transported to the downstream injection molding manufacturer for injection molding production. This can greatly improve the coordination efficiency of upstream and downstream manufacturers. By having professional manufacturers take charge of the corresponding process steps, production efficiency can be improved, production costs can be reduced, and product quality can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of components of an embodiment of the present invention; Figure 2 It is a cross-sectional schematic diagram of a component reinforcement plate and a circuit structure of an embodiment of the present invention; Figure 3 It is a schematic diagram of the processing technology of an embodiment of the present invention; Figure 4 It is a schematic diagram of a connection circuit provided on the reinforcing plate and the connecting sheet in an embodiment of the present invention.

[0019] Explanation of reference numerals: component 10, material strip 1, reinforcing plate 11, protruding structure 111, connecting strip 12, connecting sheet 13, circuit structure 2, recessed hole structure 21, electronic component 3, substrate 4, circuit structure 5, silk-screen board 6, insulating layer 7, connecting circuit 8. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] like Figure 1 and Figure 2 As shown, an assembly 10 with electronic components in this embodiment is in a strip-shaped structure and can be rolled up to facilitate product transportation and storage.

[0022] The assembly 10 includes a rolled material strip 1, on which a plurality of reinforcing plates 11 are arranged at intervals along the strip extension direction of the assembly 10, a circuit structure 2 is fixed on each reinforcing plate 11, and electronic components 3 are welded on the circuit structure 2, and the electronic components 3 may be Hall elements, capacitors, coils or drive chips, etc.; The circuit structure 2 may be a circuit structure made of liquid metal, a circuit structure made of conductive silver paste, or an FPC circuit structure.

[0023] Thus, the component 10 can be directly and conveniently input into an injection molding machine (not shown) for injection molding. Only one injection molding is required to form a base (not shown) under each circuit structure 2 and the reinforcement plate 11. The number of injection molding times is small, and then the component 10 after injection molding is divided to form independent electronic components. In addition, each electronic component has a reinforcement plate 11 in the plastic base, and the structural strength is high.

[0024] In this embodiment, the base can be used as the base of the voice coil motor, and the electronic component 3 can be a Hall element, etc., which is used to realize the closed-loop function of the voice coil motor in the camera module.

[0025] In this embodiment, the material strip 1 further includes two connecting strips 12, and the two sides of each reinforcement plate 11 are connected and arranged between the two connecting strips 12 through a plurality of connecting pieces 13. Therefore, when the injection-molded component 10 is divided, the connecting pieces 13 can be conveniently broken to separate the base with the reinforcement plate 11 and the circuit structure 2 from the connecting strips 12 on both sides; or some connecting pieces 13 can be retained as needed, and the connecting pieces 13 and the circuit structure 2 are conductively connected to form pins extending out of the base, so as to facilitate connection with an external circuit.

[0026] Therefore, the material strip 1 may be a metal material strip 1, and the connecting strip 12, the reinforcing plate 11 and the connecting piece 13 structure may be formed by stamping, so that the connecting piece 13 can be used as a pin.

[0027] In this embodiment, the circuit structure 2 can be fixed on the reinforcing plate 11 by bonding or riveting. A clamping method can also be adopted to further facilitate the production of the product and improve production efficiency.

[0028] Specifically, at least one protruding structure 111 may be provided on the reinforcing plate 11, and a concave hole structure 21 may be provided on the circuit structure 2 for being aligned and fixed to the protruding structure 111. The concave hole structure 21 may be a through hole through which the protruding structure 111 passes in a tight fit, so as to firmly fix the circuit structure 2 on the reinforcing plate 11.

[0029] See also Figure 3 The above-mentioned assembly 10 with electronic components 3 can adopt the following production process, which can specifically include the following steps: Step 1: Print a number of mutually spaced circuit lines in batches in an array on a substrate 4, wherein the substrate 4 may be a flexible board made of materials such as PI (polyimide) or a hard board; the circuit lines may be liquid metal circuits, conductive silver paste circuits or FPC circuits; thereby, a circuit structure 5 with a number of circuit structures 2 may be formed.

[0030] Through batch printing, the molding efficiency of the circuit structure 2 can be greatly improved, and the use of liquid metal circuits, conductive silver paste circuits or FPC circuits can reduce product size and weight.

[0031] Step 2: The circuit structure 5 can be produced by SMT process or other processes, so as to weld and fix the electronic components 3 on each circuit structure 2, and finally obtain the circuit structure 5 with the electronic components 3; Specifically, it is necessary to pre-cover the circuit structure 5 with a silk-screen plate 6, and an opening is provided on the silk-screen plate 6 to make way for the circuit structure 2, and the opening is for mounting the chip-type electronic components 3. The silk-screen plate 6 and the circuit structure 5 are then sent to a silk-screen machine together for printing solder paste, and then the silk-screen plate 6 is removed and sent to a chip mounter for chip production and fixed by reflow soldering, and finally the circuit structure 5 with electronic components 3 is obtained.

[0032] Therefore, by adopting SMT technology to carry out batch production, the welding efficiency of electronic components is greatly improved.

[0033] Step 3: Divide the circuit structure 5 with electronic components 3 into independent circuit structures 2 with electronic components 3 .

[0034] Step 4: providing a strip of material 1 with a plurality of reinforcing plates 11 spaced apart by stamping or etching, and fixing each independent circuit structure 2 with electronic components 3 to the reinforcing plates 11 of the strip 1 one by one, so as to form an assembly 10 with electronic components 3; Step 5: Roll up the component 10 and store it.

[0035] Thus, each circuit structure 2 is fixed to the material strip 1 and combined into one body, which can be conveniently input into the injection molding machine for injection molding production of the base.

[0036] Furthermore, the material strip 1 is formed by stamping or etching a metal strip, and can directly form the structure of the connecting strip 12, the reinforcing plate 11 and the connecting pieces 13, so as to facilitate the subsequent disassembly of the electronic components of the base by injection molding.

[0037] At the same time, in step 4, the circuit structure 2 can be fixed to the reinforcing plate 11 by adhesive fixation or riveting, or by clamping; if the clamping method is adopted, then in step 3, before the circuit structure 5 is divided, at least one recessed hole structure 21 can be formed on each circuit structure 2 by stamping; and in step 4, a protruding structure 111 for aligning and clamping the recessed hole structure 21 of the circuit structure 2 can be stamped on each reinforcing plate 11, and then the recessed hole structure 21 of the circuit structure 2 is aligned with the protruding structure 111 of the reinforcing plate 11, and then pressed down to clamp and fix.

[0038] Furthermore, in step 4, the reinforcing plate 11 may be further processed, see Figure 4 , an insulating layer 7 can be covered on the reinforcing plate 11 and the connecting piece 13, and then a connecting circuit 8 is printed on the insulating layer 7, and the connecting circuit 8 has a connecting pin 81 located on the connecting piece 13; finally, when the circuit structure 2 is fixed to the reinforcing plate 11, it is also conductively connected to the connecting pin 81 on the connecting piece 13; then, the connecting piece 13 can be used as a pin support portion extending outward from the circuit structure 2, which is convenient for assembling the formed base, and the connecting piece 13 can also be bent, etc., to facilitate the plug-in assembly of the base.

[0039] The circuit structure 2 and the connecting circuit 8 can be connected by welding using existing technology.

[0040] The production process of the present invention can also be directly integrated into the production process of the camera module. For example, in step 5, there is no need to roll up the component 10, and the component 10 can be directly input into the injection molding machine for injection molding of the base.

[0041] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, equivalent changes and modifications without departing from the principle of the present invention should still belong to the protection scope of the present invention.

[0042] In the description of the embodiments of the present application, it should be understood that the indicated orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the product of the application is usually placed when in use, or is the orientation or position relationship commonly understood by technical personnel in this field. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

Claims

1. An assembly with electronic components, characterized in that: The component is a belt-shaped structure and can be rolled up; The assembly includes a rolled material strip, on which a plurality of reinforcing plates are arranged at intervals along the strip extension direction of the assembly, each reinforcing plate is fixed with a circuit structure, and electronic components are welded on the circuit structure; The circuit structure is a circuit structure made of liquid metal, a circuit structure made of conductive silver paste or an FPC circuit structure.

2. An assembly with electronic components according to claim 1, characterized in that: The material strip also includes two connecting strips, and both sides of each reinforcement plate are connected and arranged between the two connecting strips through a plurality of connecting pieces.

3. An assembly with electronic components according to claim 1 or 2, characterized in that: The material strip is a metal material strip.

4. An assembly with electronic components according to claim 1, characterized in that: The reinforcing plate is provided with at least one protruding structure, and the circuit structure is provided with a concave hole structure that is aligned and clamped and fixed to the protruding structure.

5. An assembly with electronic components according to claim 1, characterized in that: The circuit structure is fixed on the reinforcing plate by bonding or riveting.

6. A production process for an assembly with electronic components, characterized in that: The steps include: Step 1: batch printing a plurality of mutually spaced circuit lines on a substrate to form a circuit structure with a plurality of circuit structures; Step 2: Weld and fix the electronic components on each circuit structure to finally obtain a circuit structure with electronic components; Step 3: Divide the circuit structure with electronic components into independent circuit structures with electronic components; Step 4: providing a long strip of material with a plurality of spaced reinforcing plates, and fixing each independent circuit structure with electronic components to the reinforcing plates of the strip one by one to form an assembly with electronic components; Step 5: Roll up the component and save it.

7. A production process for an assembly with electronic components according to claim 6, characterized in that: In the step 1, the substrate is a hard board or a flexible board; the circuit line is a liquid metal circuit, a conductive silver paste circuit or an FPC circuit; In the step 4, the circuit structure is fixed to the reinforcing plate by gluing or riveting.

8. The production process of an assembly with electronic components according to claim 6, characterized in that: In the step 3, before the circuit structure is divided, at least one concave hole structure is formed on each circuit structure by punching; In step 4, the material strip is formed by stamping or etching a metal strip, and a convex structure is formed on each reinforcement plate to be aligned and fixed with the concave hole structure of the circuit structure; the circuit structure is fixed by the engagement between the concave hole structure and the convex structure of the reinforcement plate.

9. A production process for an assembly with electronic components according to claim 6, characterized in that: In step 4, the material strip is first formed by stamping or etching a metal strip, and the material strip also forms two connecting strips, and the two sides of each reinforcement plate are connected and arranged between the two connecting strips through a plurality of connecting pieces; secondly, an insulating layer is covered on the reinforcement plate and the connecting piece, and then a connecting circuit is printed on the insulating layer, and the connecting circuit has connecting pins located on the connecting piece; finally, when the circuit structure is fixed to the reinforcement plate, it is also conductively connected to the connecting pins on the connecting piece; the connecting piece is used to serve as a pin support portion extending outward from the circuit structure.

10. The production process of an assembly with electronic components according to claim 6, characterized in that: In the step 2, the circuit structure is produced by SMT process to solder and fix the electronic components on each circuit structure; first, the circuit structure is covered with a silk screen, and then the silk screen and the circuit structure are sent to a silk screen machine to print solder paste, and then the silk screen is removed and sent to a patch machine for patch production and fixed by reflow soldering, and finally the circuit structure with electronic components is obtained.

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