Vibration driving integrated driver for flexible electrode implantation and driving method of vibration driving integrated driver

Abstract

The invention provides a driving and vibration integrated driver for flexible electrode implantation and a driving method thereof, and belongs to the technical field of piezoelectric driving. Comprising a driving block, the driving block comprises a first clamping part and a second clamping part, a piezoelectric stacking part is arranged between the first clamping part and the second clamping part, and the first clamping part and the second clamping part are provided with a position fixed clamping mechanism and a position movable clamping mechanism respectively. The position of the first clamping part is fixed to the driving block, and the second clamping part is driven by the piezoelectric stacking part in the driving block to move in the direction away from or close to the first clamping part. And compared with a mode of implanting the flexible electrode by using an auxiliary tool, the implantation volume is greatly reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of piezoelectric driving, and relates to a driver, and in particular to an integrated vibration-driving driver for flexible electrode implantation. Background Art

[0002] The core technology of brain science research, brain-computer interface, refers to the technology that establishes a connection channel between the brain and external devices to achieve information exchange. In recent years, various fields at home and abroad have made breakthrough research progress in this technology. Based on the different locations and methods of collecting bioelectric signals, brain-computer interfaces can be divided into two categories: implantable and non-implantable. Implantable flexible electrodes have the following characteristics: Low trauma: Flexible electrodes are usually ultra-thin and highly flexible, which can reduce damage to brain tissue and lower surgical risks; High signal quality: Flexible electrodes can stably collect high-throughput neuronal signals from deep brain regions, providing more accurate diagnosis and treatment basis; Versatility: Some flexible electrodes are not only used for signal acquisition, but can also perform stimulation functions, further expanding their medical applications. Because of the ultra-thin and highly flexible characteristics of flexible electrodes, flexible electrodes do not have implantation rigidity, and face the risk of buckling and rupture during implantation, which can easily cause secondary damage to the implantation. It is urgent to use other means to help the flexible electrodes to be successfully implanted. At present, the implantation of flexible electrodes usually adopts the tool-assisted method, which uses the rigidity of the auxiliary tool to effectively implant the flexible electrode to ensure that the path of the flexible electrode during the implantation process meets the implantation expectations. For example, a Chinese patent discloses a flexible wire electrode implantation device [CN116898541A], a base, a placement module, a motion module, an observation module and an implantation needle. The base can be fixedly connected to an external motion mechanism; the placement module includes a placement adjustment platform and an electrode wire placement table, the placement adjustment platform is fixedly connected to the base, and the placement adjustment platform can drive the electrode wire placement table to move; the motion module includes a two-dimensional moving platform and a linear drive, the two-dimensional moving platform is fixedly connected to the base, the two-dimensional moving platform can drive the linear drive to move in a predetermined plane, and the implantation needle is connected to the linear drive, and the linear drive can drive the implantation needle to move in a direction perpendicular to the predetermined plane.

[0003] However, in the above technical solution, the flexible electrode is implanted by an auxiliary tool, the implantation needle, which greatly increases the implantation volume and reduces the advantage of low trauma of implanting the flexible electrode. Therefore, it is necessary to provide a new driving mechanism and driving method to solve the technical problem that the flexible electrode has implantation rigidity without the help of auxiliary tools. Summary of the invention

[0004] The object of the present invention is to solve the above-mentioned problems and to provide an integrated vibration-driving driver for flexible electrode implantation which has implantation rigidity without the aid of auxiliary tools.

[0005] Another object of the present invention is to provide a control method for driving and vibrating the above-mentioned driver.

[0006] To achieve the above-mentioned purpose, the present invention adopts the following technical solutions: a vibration-driven integrated driver for flexible electrode implantation, comprising a driving block, wherein the driving block comprises a first clamping portion and a second clamping portion, a piezoelectric stack portion is arranged between the first clamping portion and the second clamping portion, the first clamping portion and the second clamping portion are respectively provided with a position-fixed clamping mechanism and a position-movable clamping mechanism, the position of the first clamping portion is fixed to the driving block, and the second clamping portion is driven by the piezoelectric stack portion in the driving block to move away from or towards the first clamping portion.

[0007] In the above-mentioned integrated vibration driver for flexible electrode implantation, the first clamping portion is fixed to the driving block, and the second clamping portion is driven by the piezoelectric stack in the driving block to move away from or towards the first clamping portion.

[0008] In the above-mentioned integrated vibration driver for flexible electrode implantation, the driving block further comprises a fixed block, one end of the piezoelectric stack is fixedly disposed on the fixed block, and the other end is directly or indirectly connected to the second clamping portion.

[0009] In the above-mentioned integrated drive-vibration driver for flexible electrode implantation, a displacement amplification structure is provided between the piezoelectric stack and the second clamping part. The displacement amplification structure includes a driving plate, and at least one displacement amplification plate is provided on the side of the driving plate away from the piezoelectric stack. One end of the displacement amplification plate, the driving plate and the fixed block are connected through a limit connection point. The limit ends of the displacement amplification plate and the driving plate are not on the same side, and the displacement amplification plate is connected to the piezoelectric stack through a driving fulcrum.

[0010] In the above-mentioned integrated vibration-driving driver for flexible electrode implantation, a primary amplifier board and a secondary amplifier board are arranged at the same time on the side of the driving plate away from the piezoelectric stack part, and the driving plate, the primary amplifier board and the secondary amplifier board are connected by a driving fulcrum, and one end of the driving plate, the primary amplifier board and the secondary amplifier board is fixedly connected to the fixed block through a limit connection point, and the driving fulcrum is staggered on the side of the midpoint of the primary amplifier board and the secondary amplifier board close to its upper limit connection point. The driving fulcrum is staggered at one end of the primary amplifier board and the secondary amplifier board.

[0011] In the above-mentioned integrated vibration driver for flexible electrode implantation, a limit plate is provided at one end of the driving plate, the primary amplifying plate, and the secondary amplifying plate close to the driving fulcrum, a limit connection point is provided between the limit plate and the driving plate, the primary amplifying plate, and the secondary amplifying plate, the limit connection point is provided on the outside of the driving fulcrum, the end of the limit plate away from the driving plate, the primary amplifying plate, and the secondary amplifying plate is fixedly connected to the fixed block, and the second clamping portion is provided at one end of the secondary amplifying plate away from the limit connection point.

[0012] In the above-mentioned integrated vibration driver for flexible electrode implantation, the first piezoelectric sheet and the second piezoelectric sheet are respectively arranged on one side of the position fixed clamping mechanism and the position movable clamping mechanism close to the piezoelectric stack part, a second clamping block is arranged at the end of the displacement amplification structure, a first clamping block is arranged above or below the second clamping block, the first clamping block is fixedly connected to the fixed block, and the first clamping block and the second clamping block correspond to the first piezoelectric sheet and the second piezoelectric sheet respectively.

[0013] In the integrated vibration-driving driver for flexible electrode implantation, a first support plate and a second support plate are respectively arranged on the outer sides of the first clamping block and the second clamping block, and the first support plate and the second support plate are extended in a direction away from the driving block. One end of the first piezoelectric sheet and the second piezoelectric sheet are respectively fixed on the first support plate and the second support plate away from the driving block, and the other ends are respectively close to the first clamping block and the second clamping block and are bent toward the first clamping block and the second clamping block through electrical signals to clamp the flexible electrode, and clamping grooves are respectively formed between the first clamping block, the second clamping block and the first piezoelectric sheet and the second piezoelectric sheet.

[0014] A driving method of the above-mentioned integrated vibration-driving driver for flexible electrode implantation, S1: In the initial state t0, the second piezoelectric sheet is bent, the second clamping part is in a movable position and the clamping mechanism is clamped tightly, the first clamping part is in a fixed position and the clamping mechanism is released, and the piezoelectric stack and the displacement amplification structure are in the initial state; S2: From t0 to t1, the linear signal is superimposed on the sinusoidal signal, the piezoelectric stack vibrates and stretches, the piezoelectric stack drives the driving block to amplify the displacement and vibration through the primary amplifier board and the secondary amplifier board to move the second clamping part, and the second clamping part drives the flexible electrode a to vibrate and displace x in the implantation direction; S3: the signal changes from t1 to t2, the first piezoelectric sheet bends, and the first clamping part is clamped; S4: the signal changes from t2 to t3, the second piezoelectric sheet recovers, and the second clamping part is released; S5: The signal changes from t3 to t4, the piezoelectric stack becomes shorter, the driving board, the primary amplifier board, and the secondary amplifier board are reset, the second clamping part moves away from the implantation direction to the initial state, the flexible electrode is clamped and fixed by the first clamping part and the position remains unchanged, and the second clamping part exposes the flexible electrode force-bearing implantation section; S6: the signal changes from t4 to t5, the second piezoelectric piece bends, and the second clamping part is clamped; S7: The signal changes from t5 to t6, the first piezoelectric sheet recovers, the second clamping part releases, and the driver returns to the initial state, preparing to enter the second stage of flexible electrode implantation.

[0015] Compared with the prior art, the advantages of the present invention are: 1. Compared with the method of implanting flexible electrodes using auxiliary tools, the implant volume is greatly reduced. At the same time, during the implantation and advancement process of the flexible electrode, vibration is assisted to effectively prevent the flexible electrode from buckling during the implantation process, maintain linear implantation, and avoid instability in the implantation position, direction, and depth caused by buckling; 2. During the implantation process, the first clamping part and the second clamping part are clamped alternately, and the flexible electrode is advanced when the second clamping part is clamped, thereby reducing the force-bearing section of the flexible electrode, ensuring the stiffness of the force-bearing section of the flexible electrode, ensuring the advancement direction of the flexible electrode, and further preventing it from bending during the implantation process. The implantation length and speed of the flexible electrode can be accurately controlled, thereby improving the controllability and accuracy of the implantation operation; 3. By utilizing the controllable elongation and vibration performance in the elongation direction of the piezoelectric stack, it is different from the combination of a linear motor and a vibrator. The vibration of the motor itself and the vibration of the vibrator and their combination are difficult to ensure the vibration direction and vibration amount. The present invention greatly improves the precision of flexible electrode implantation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram provided by the present invention.

[0017] Figure 2 It is a structural schematic diagram from another angle provided by the present invention.

[0018] Figure 3 It is a schematic diagram of the displacement amplification structure provided by the present invention.

[0019] Figure 4 It is a driving principle diagram provided by the present invention.

[0020] Figure 5 This is a driving effect diagram provided by the present invention.

[0021] In the figure, the driving block 2, the fixed block 21, the first clamping part 3, the position fixing clamping mechanism 31, the first piezoelectric sheet 32, the first clamping block 33, the first support plate 34, the second clamping part 4, the position movable clamping mechanism 41, the second piezoelectric sheet 42, the second clamping block 43, the second support plate 44, the piezoelectric stack part 5, the displacement amplification structure 6, the driving plate 61, the primary amplification plate 62, the secondary amplification plate 63, the limit plate 64, the limit connection point 65, and the driving fulcrum 66. DETAILED DESCRIPTION

[0022] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] like Figure 1-Figure 3 As shown, a vibration-driven integrated driver for flexible electrode implantation includes a driving block 2, wherein the driving block 2 includes a first clamping portion 3 and a second clamping portion 4, a piezoelectric stack portion 5 is arranged between the first clamping portion 3 and the second clamping portion 4, and the first clamping portion 3 and the second clamping portion 4 are respectively provided with a position-fixed clamping mechanism 31 and a position-movable clamping mechanism 41.

[0024] In this embodiment, the position-fixed clamping mechanism 31 and the position-movable clamping mechanism 41 can clamp or release the flexible electrode respectively. When the flexible electrode is implanted, the position-movable clamping mechanism 41 is clamped, and the position-fixed clamping mechanism 31 is released. The piezoelectric stack 5 extends after receiving the signal, driving the position-movable clamping mechanism 41 to move in the direction of the flexible electrode implantation. At the same time, the piezoelectric stack 5 vibrates. This integrated drive-vibration design effectively prevents the flexible electrode from buckling during the implantation process, maintains a straight implantation, avoids the uncertainty of the implantation position, direction, and depth caused by the buckling, and greatly improves the accuracy of the implantation. Moreover, the vibration can reduce the friction between the flexible electrode and the surrounding tissue, making the implantation process smoother and reducing the risk of damage to the surrounding tissue.

[0025] Among them, after the piezoelectric stack part 5 is powered on, due to the voltage effect, the elongation deformation is achieved through the combination of multiple piezoelectric sheets. Those skilled in the art should be aware of the technical principle of piezoelectric stack deformation, which will not be described in detail here. When the piezoelectric stack part 5 is powered on, a linear signal is sent to the power module and a sinusoidal signal is superimposed at the same time. When the piezoelectric stack part 5 is extended, a vibration in the extension direction is superimposed, such as Figure 4 shown.

[0026] Compared with linear motors, even if linear motor signals are given, it is difficult to achieve vibration output. A vibration device needs to be added to achieve the purpose of feeding and vibrating at the same time. However, the vibration direction of the external vibration device is difficult to control. When superimposed with the linear motor, it will cause the linear motor to vibrate, in addition to the vibration in the implantation direction causing implantation uncertainty. The structure of this embodiment is simpler and the integrated architecture is more compact. The size and complexity of the equipment are reduced, the cost is reduced, and the stability and reliability of the equipment are improved.

[0027] Furthermore, the first clamping part 3 is fixed to the driving block 2, and the second clamping part 4 is driven by the piezoelectric stack 5 in the driving block 2 to move away from or towards the first clamping part 3. During the implantation process, the first clamping part 3 and the second clamping part 4 are clamped alternately.

[0028] When the second clamping part 4 clamps the flexible electrode a, the piezoelectric stack part 5 electrically stretches, and the second clamping part 4 moves with the piezoelectric stack part 5 in the implantation direction, driving the flexible electrode a to vibrate and push toward the implantation site. When the second clamping part 4 approaches the implantation area with the flexible electrode a and is about to contact it, the first clamping part 3 clamps the flexible electrode a, and the second clamping part 4 releases the flexible electrode a. Then the electric field of the piezoelectric stack part 5 changes and shortens, driving the second clamping part 4 to move in the direction close to the first clamping part 3. At this time, the position of the flexible electrode a remains unchanged, and the length of the flexible electrode a exposed between the second clamping part 4 and the implantation area is implanted again. Then, the second clamping part 4 clamps, and the first clamping part 3 releases the flexible electrode a. The piezoelectric stack part 5 stretches again and drives the second clamping part 4 to push the exposed flexible electrode a into the implantation area.

[0029] In this embodiment, the second clamping portion 4 clamps and propels the force-bearing section of the flexible electrode a to control its length only for the exposed section between the second clamping portion 4 and the implantation area. After the exposed section is implanted, another exposed section is released. Compared with the method of clamping the tail end of the flexible electrode a once for implantation, the length of the force-bearing section of the flexible electrode a is reduced, the stiffness of the force-bearing section of the flexible electrode a is ensured, the direction of advancement of the flexible electrode is ensured, and bending during the implantation process is further prevented, thereby improving the success rate and stability of the implantation.

[0030] Furthermore, the driving block 2 further includes a fixing block 21, and one end of the piezoelectric stack portion 5 is fixedly disposed on the fixing block 21, and the other end is directly or indirectly connected to the second clamping portion 4. One end of the piezoelectric stack portion 5 is fixed, and the other end drives the second clamping portion 4 to move as the piezoelectric stack portion 5 is extended or shortened, thereby realizing the implantation and advancement of the flexible electrode.

[0031] Preferably, a displacement amplification structure 6 is provided between the piezoelectric stack portion 5 and the second clamping portion 4. The displacement amplification structure 6 comprises a driving plate 61, and at least one displacement amplification plate is provided on a side of the driving plate 61 away from the piezoelectric stack portion 5, one end of the displacement amplification plate is fixedly connected to the fixed block 21, and the limiting ends of the displacement amplification plate and the driving plate 61 are not on the same side, and the displacement amplification plate is connected to the piezoelectric stack portion 5 through a driving fulcrum 66.

[0032] Since the piezoelectric stack 5 is composed of a plurality of piezoelectric sheets stacked together, the displacement of a single piezoelectric sheet is in the micron level, and the piezoelectric stack 5 needs to be amplified by the displacement amplification structure 6. In this embodiment, after the piezoelectric stack 5 is extended, the driving plate 61 is pushed to move in the implantation direction. Since one end is connected to the fixed block by the limit connection point and is limited, the driving plate 61 rotates, and when the driving plate 61 is pushed by the piezoelectric stack 5, the end away from the limit connection point is greatly displaced. Further, the end of the driving plate 61 with a larger displacement pushes the displacement amplification plate, and similarly, the end of the displacement amplification plate away from the limit connection point is greatly displaced, so as to realize the amplification of the elongation of the piezoelectric stack 5. Preferably, the driving fulcrum 66 is located in the middle of the displacement amplification plate. Those skilled in the art may also adopt a lever-type displacement amplification structure, one end of the lever is connected to the piezoelectric stack 5, and the other end is connected to the second clamping portion 4, and the displacement of the piezoelectric stack 5 is amplified by reasonably setting the fulcrum position and length ratio of the lever.

[0033] In this embodiment, the displacement amplification structure 6 adopts a three-stage amplification form, and the driving plate 61 is provided with a primary amplification plate 62 and a secondary amplification plate 63 in sequence on the side away from the piezoelectric stack portion 5, and the driving plate 61, the primary amplification plate 62, and the secondary amplification plate 63 are connected by a driving fulcrum 66, and one end of the driving plate 61, the primary amplification plate 62, and the secondary amplification plate 63 is fixedly connected to the fixed block 21 through a limit connection point, and the driving fulcrum 66 is staggered on the side of the midpoint of the primary amplification plate 62 and the secondary amplification plate 63 close to its upper limit connection point.

[0034] Furthermore, a limiting plate 64 is provided at one end of the driving plate 61, the primary amplifying plate 62, and the secondary amplifying plate 63 near the driving fulcrum 66, and a limiting connection point 65 is provided between the limiting plate 64 and the driving plate 61, the primary amplifying plate 62, and the secondary amplifying plate 63. The limiting connection point 65 is arranged outside the driving fulcrum, and the end of the limiting plate 64 away from the driving plate 61, the primary amplifying plate 62, and the secondary amplifying plate 63 is fixedly connected to the fixed block 21, and the second clamping portion 4 is arranged at the end of the secondary amplifying plate 63 away from the limiting connection point. The driving plate 61 is driven by the piezoelectric stack 5 to cause a large displacement at one end, thereby amplifying the elongation of the piezoelectric stack 5. Similarly, the primary amplifying plate 62 and the secondary amplifying plate 63 obtain a large displacement, thereby further realizing the amplification of the elongation of the piezoelectric stack 5. In this embodiment, the limiting connection point, the driving fulcrum 66, the driving plate 61, the primary amplifying plate 62, and the secondary amplifying plate 63 are integrally formed.

[0035] Technicians in the field can also increase the number of displacement amplification plates according to actual calculation requirements to meet the implantation length requirements of the flexible electrode a.

[0036] Preferably, a movable plate is provided between the second clamping part 4 and the secondary amplifying plate 63, the movable plate can be slidably connected to the driving block, the end of the secondary amplifying plate 63 away from the limit connection point is slidably connected to the movable plate, and a positioning guide groove is provided between the movable plate and the driving block, so that the movable plate and the second clamping part 4 can only be displaced in the implantation direction.

[0037] Preferably, the position fixed clamping mechanism 31 and the position movable clamping mechanism 41 are respectively provided with a first piezoelectric sheet 32 ​​and a second piezoelectric sheet 42 on one side close to the piezoelectric stack part 5, a second clamping block 43 is provided at the end of the displacement amplification structure 6, a first clamping block 33 is provided above or below the second clamping block 43, the first clamping block 33 is fixedly connected to the fixed block 21, and the first clamping block 33 and the second clamping block 43 correspond to the first piezoelectric sheet 32 ​​and the second piezoelectric sheet 42 respectively.

[0038] When the fixed position clamping mechanism 31 and the movable position clamping mechanism 41 need to clamp the flexible electrode, the first piezoelectric sheet 32 ​​and the second piezoelectric sheet 42 receive the signal and bend toward the first clamping block 33 and the second clamping block 43 to reduce the distance to achieve the purpose of clamping the flexible electrode a.

[0039] Furthermore, the first support plate 34 and the second support plate 44 are respectively arranged outside the first clamping block 33 and the second clamping block 43, and the first support plate 34 and the second support plate 44 are extended in the direction away from the driving block 2. One end of the first piezoelectric sheet 32 ​​and the second piezoelectric sheet 42 are respectively fixed to the end of the first support plate 34 and the second support plate 44 away from the substrate, and the other end is respectively close to the first clamping block 33 and the second clamping block 43 and bent to the first clamping block 33 and the second clamping block 43 through electrical signals to clamp the flexible electrode a. The first clamping block 33, the second clamping block 43 and the first piezoelectric sheet 32 ​​and the second piezoelectric sheet 42 form clamping grooves 35 respectively. The flexible electrode a is clamped in the clamping groove 35, and after being clamped by the position movable clamping mechanism 41, the implantation displacement is obtained as the piezoelectric stack portion 5 is extended. The piezoelectric sheet has a fast response time and high stability.

[0040] Those skilled in the art may also use other clamping mechanisms, such as relays and electromagnetic clamps.

[0041] A driving method for a drive-vibration integrated actuator for flexible electrode implantation, such as Figure 4 , 5 As shown, the following steps are included: S1: In the initial state t0, the second piezoelectric sheet 42 is bent, the movable clamping mechanism 41 of the second clamping portion 4 is clamped and tightened, the fixed clamping mechanism 31 of the first clamping portion 3 is clamped and released, and the piezoelectric stack 5 and the displacement amplification structure 6 are in the initial state; S2: From t0 to t1, the linear signal is superimposed on the sinusoidal signal, the piezoelectric stack 5 vibrates and stretches, the piezoelectric stack 5 drives the driving block 2 to amplify the displacement and vibration through the primary amplifier board 62 and the secondary amplifier board 63 to move the second clamping part, and the second clamping part drives the flexible electrode a to vibrate and displace x in the implantation direction; S3: the signal changes from t1 to t2, the first piezoelectric sheet 32 ​​bends, and the first clamping portion 3 is clamped; S4: the signal changes from t2 to t3, the second piezoelectric sheet 42 recovers, and the second clamping part 4 is released; S5: the signal changes from t3 to t4, the piezoelectric stack 5 becomes shorter, the driving board 61, the primary amplifier board 62, and the secondary amplifier board 63 are reset, the second clamping part 4 moves away from the implantation direction to the initial state, the flexible electrode a is clamped and fixed by the first clamping part 3 and remains in the same position, and the second clamping part 4 exposes the flexible electrode force implantation section; S6: the signal changes from t4 to t5, the second piezoelectric sheet 42 bends, and the second clamping portion 4 is clamped; S7: the signal changes from t5 to t6, the first piezoelectric sheet 32 ​​is restored, the second clamping part 4 is released, and the driver returns to the initial state, preparing to enter the second stage of implantation of the flexible electrode a.

[0042] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

[0043] Although the driving block 2, the fixed block 21, the first clamping part 3, the position fixing clamping mechanism 31, the first piezoelectric sheet 32, the first clamping block 33, the first support plate 34, the second clamping part 4, the position movable clamping mechanism 41, the second piezoelectric sheet 42, the second clamping block 43, the second support plate 44, the piezoelectric stack part 5, the displacement amplification structure 6, the driving plate 61, the primary amplification plate 62, the secondary amplification plate 63, the limit plate 64, the limit connection point 65, the driving fulcrum 66, and other terms are used more frequently in this article, the possibility of using other terms is not excluded. The use of these terms is only to more conveniently describe and explain the essence of the present invention; interpreting them as any additional restrictions is contrary to the spirit of the present invention.

Claims

1. A vibration-driven integrated driver for flexible electrode implantation, comprising a driver block (2), characterized in that: The driving block (2) comprises a first clamping portion (3) and a second clamping portion (4), a piezoelectric stack portion (5) is arranged between the first clamping portion (3) and the second clamping portion (4), and the first clamping portion (3) and the second clamping portion (4) are respectively provided with a position-fixing clamping mechanism (31) and a position-movable clamping mechanism (41), the position of the first clamping portion (3) is fixed to the driving block (2), and the second clamping portion (4) is driven by the piezoelectric stack portion (5) in the driving block (2) to move away from or towards the first clamping portion (3).

2. The integrated vibration driver for flexible electrode implantation according to claim 1, characterized in that: The driving block (2) further comprises a fixed block (21), one end of the piezoelectric stack portion (5) being fixedly arranged on the fixed block (21), and the other end being directly or indirectly connected to the second clamping portion (4).

3. The integrated vibration driver for flexible electrode implantation according to claim 1, characterized in that: A displacement amplification structure (6) is provided between the piezoelectric stack portion (5) and the second clamping portion (4).

4. The integrated vibration driver for flexible electrode implantation according to claim 3, characterized in that: The displacement amplification structure (6) comprises a driving plate (61), at least one displacement amplification plate is arranged on a side of the driving plate (61) away from the piezoelectric stack portion (5), one end of the displacement amplification plate and one end of the driving plate (61) are connected to the fixed block (21) via a limit fulcrum, the limit ends of the displacement amplification plate and the driving plate (61) are not on the same side, and the displacement amplification plate is connected to the piezoelectric stack portion (5) via a driving fulcrum (66).

5. The integrated vibration driver for flexible electrode implantation according to claim 4, characterized in that: A primary amplifier plate (62) and a secondary amplifier plate (63) are sequentially arranged on one side of the driving plate (61) away from the piezoelectric stack portion (5); the driving plate (61), the primary amplifier plate (62), and the secondary amplifier plate (63) are connected via a driving fulcrum (66); one end of the driving plate (61), the primary amplifier plate (62), and the secondary amplifier plate (63) are fixedly connected to a fixed block (21) via a limit fulcrum; the driving fulcrum (66) is staggeredly arranged on one side of the midpoint of the primary amplifier plate (62) and the secondary amplifier plate (63) close to their upper limit fulcrum.

6. The integrated vibration driver for flexible electrode implantation according to claim 5, characterized in that: A limit plate (64) is provided at one end of the driving plate (61), the primary amplifying plate (62) and the secondary amplifying plate (63) close to the driving fulcrum (66); a limit connection point (65) is provided between the limit plate (64) and the driving plate (61), the primary amplifying plate (62) and the secondary amplifying plate (63); the limit connection point (65) is provided on the outside of the driving fulcrum (66); one end of the limit plate (64) away from the driving plate (61), the primary amplifying plate (62) and the secondary amplifying plate (63) is fixedly connected to the fixed block (21); and the second clamping portion (4) is provided at one end of the secondary amplifying plate (63) away from the limit fulcrum.

7. The integrated vibration driver for flexible electrode implantation according to claim 6, characterized in that: The first piezoelectric sheet (32) and the second piezoelectric sheet (42) are respectively arranged on one side of the position fixing clamping mechanism (31) and the position movable clamping mechanism (41) close to the piezoelectric stacking part (5); the second clamping block (43) is arranged at the end of the displacement amplifying structure (6); the first clamping block (33) is arranged above or below the second clamping block (43); the first clamping block (33) is fixedly connected to the fixed block (21); the first clamping block (33) and the second clamping block (43) correspond to the first piezoelectric sheet (32) and the second piezoelectric sheet (42), respectively.

8. The integrated vibration driver for flexible electrode implantation according to claim 7, characterized in that: A first support plate (34) and a second support plate (44) are respectively arranged outside the first clamping block (33) and the second clamping block (43), and the first support plate (34) and the second support plate (44) are extended in a direction away from the driving block (2).

9. The integrated vibration driver for flexible electrode implantation according to claim 8, characterized in that: One end of the first piezoelectric sheet (32) and the second piezoelectric sheet (42) are respectively fixed to the first support plate (34) and the second support plate (44) at one end away from the driving block (2), and the other end is respectively close to the first clamping block (33) and the second clamping block (43) and is bent toward the first clamping block (33) and the second clamping block (43) through an electrical signal to clamp the flexible electrode (a), and clamping grooves (35) are respectively formed between the first clamping block (33), the second clamping block (43) and the first piezoelectric sheet (32) and the second piezoelectric sheet (42).

10. A driving method for the integrated vibration driver for flexible electrode implantation according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: In the initial state t0, the second piezoelectric sheet (42) is bent, the second clamping portion (4) is clamped by the movable clamping mechanism (41), the first clamping portion (3) is clamped by the fixed clamping mechanism (31), and the piezoelectric stack portion (5) and the displacement amplification structure (6) are in the initial state; S2: From t0 to t1, the linear signal is superimposed on the sinusoidal signal, the piezoelectric stack (5) vibrates and stretches, the piezoelectric stack (5) drives the driving block (2) to amplify the displacement and vibration through the primary amplifying plate (62) and the secondary amplifying plate (63) to move the second clamping part, and the second clamping part (4) drives the flexible electrode (a) to vibrate and displace x in the implantation direction; S3: the signal changes from t1 to t2, the first piezoelectric sheet (32) bends, and the first clamping portion (3) is clamped; S4: the signal changes from t2 to t3, the second piezoelectric sheet (42) recovers, and the second clamping portion (4) is released; S5: the signal changes from t3 to t4, the piezoelectric stack (5) shortens, the driving plate (61), the primary amplifier plate (62), and the secondary amplifier plate (63) are reset, the second clamping portion (4) moves away from the implantation direction to an initial state, the flexible electrode (a) is clamped and fixed by the first clamping portion (3) in an unchanged position, and the second clamping portion (4) exposes the implantation section of the flexible electrode under force; S6: the signal changes from t4 to t5, the second piezoelectric sheet (42) bends, and the second clamping portion (4) is clamped; S7: The signal changes from t5 to t6, the first piezoelectric sheet (32) recovers, the second clamping portion (4) is released from clamping, and the driver returns to the initial state, preparing to enter the second stage of implantation of the flexible electrode (a).

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