Electronic element group, photosensitive element module, camera module and electronic device

Abstract

The invention discloses an electronic component group, a photosensitive component module, a camera module and an electronic device. The electronic component group comprises a first electronic component, an electronic component board and a flexible circuit. The first electronic component is arranged on the electronic component board, the electronic component board comprises a first circuit and a second circuit, and the first circuit and the second circuit are respectively arranged on opposite sides of the first electronic component. The flexible circuit is arranged on the electronic component board, and the flexible circuit comprises a connecting part, a bending part and an electric path. The connecting part is connected with the electronic component board. The bending part is arranged on the side, away from the first electronic element, of the connecting part. The electrical path comprises a first end and a second end, at least one part of the electrical path is arranged on the bending part, and the first end and the second end are electrically connected with the first circuit and the second circuit respectively. Therefore, the design density of the electronic component group can be improved.

Description

Technical Field

[0001] The present disclosure relates to an electronic component set, a photosensitive component module and a camera module, and more particularly to an electronic component set, a photosensitive component module and a camera module applied to a portable electronic device. Background Art

[0002] In recent years, portable electronic devices have developed rapidly, such as smart electronic devices and tablet computers, which have been prevalent in modern people's lives. Camera modules, photosensitive element modules and electronic component groups installed on portable electronic devices have also developed rapidly. However, as technology becomes more and more advanced, users have higher and higher requirements for the quality of electronic component groups. Therefore, developing an electronic component group that can achieve a circuit structure of extreme size to improve design density has become an important and urgent problem in the industry. Summary of the invention

[0003] The present disclosure provides an electronic component set, a photosensitive component module, a camera module and an electronic device. By using a solution of bending a flexible circuit and cooperating with an electronic component board, a circuit structure of a limit size is realized, thereby improving the design density of the electronic component set.

[0004] According to one embodiment of the present disclosure, an electronic component group is provided, comprising a first electronic component, an electronic component board and a flexible circuit. The first electronic component is arranged on the electronic component board, and the electronic component board comprises a first circuit and a second circuit, wherein the first circuit and the second circuit are respectively arranged on opposite sides of the first electronic component, and the first circuit is electrically connected to the first electronic component. The flexible circuit is arranged on the electronic component board, and the flexible circuit comprises a connecting portion, a bending portion and an electrical path. The connecting portion connects the electronic component board. The bending portion is arranged on a side of the connecting portion away from the first electronic component, and is bent along a thickness direction of the electronic component board. The electrical path comprises a first end and a second end, and at least a portion of the electrical path is arranged on the bending portion, wherein the first end and the second end are respectively electrically connected to the first circuit and the second circuit, and the first end and the second end are arranged on the connecting portion.

[0005] According to the electronic component assembly of the embodiment described in the previous paragraph, the bent portion can be fixed relative to the electronic component board.

[0006] The electronic component assembly according to the embodiment described in the previous paragraph may further include a hardness reinforcement plate, wherein the hardness reinforcement plate is disposed at the bending portion, and the hardness reinforcement plate and the electronic component board are relatively fixed.

[0007] According to the electronic component assembly of the embodiment described in the previous paragraph, the electronic component board may further include a bending guide structure, the bending guide structure is arranged corresponding to a side of the bending portion connected to the connecting portion, and the bending portion bends along the bending guide structure.

[0008] According to the electronic component assembly of the embodiment described in the previous paragraph, the dimension of the bending portion in the thickness direction of the electronic component board may be less than or equal to the dimension of the bending portion in a thickness direction perpendicular to the thickness direction of the electronic component board and perpendicular to the bending portion.

[0009] According to the electronic component set of the embodiment described in the previous paragraph, the bending portion may include a bending auxiliary hole, wherein the bending auxiliary hole is arranged on a side of the bending portion close to the electronic component board, and the electrical path is arranged around the bending auxiliary hole. The dimension of the bending auxiliary hole in the thickness direction of the electronic component board may be less than or equal to the dimension of the bending auxiliary hole in a thickness direction perpendicular to the thickness direction of the electronic component board and perpendicular to the bending portion.

[0010] The electronic component set according to the embodiment described in the previous paragraph may further include a shape maintaining element, wherein the shape maintaining element is disposed corresponding to a side of the connecting portion connected to the bending portion, and the shape maintaining element is relatively fixed to the electronic component board.

[0011] According to the electronic component set of the embodiment described in the previous paragraph, the connection portion of the flexible circuit may include a window, and the window is disposed opposite to the first electronic component.

[0012] The electronic component set according to the embodiment described in the previous paragraph may further include a multi-layer circuit board, wherein the multi-layer circuit board may include an electronic component board and a flexible circuit, and the flexible circuit extends from the electronic component board in a direction away from the first electronic component.

[0013] According to the electronic component set of the embodiment described in the previous paragraph, the electronic component board may further include a component corresponding hole, and the first electronic component is disposed in the component corresponding hole.

[0014] The electronic component set according to the above embodiment may further include a second electronic component, wherein the second electronic component is disposed on the electronic component board and is electrically connected to the second circuit. The electronic component board may further include a third circuit, and the third circuit is electrically connected to the first electronic component and the second electronic component.

[0015] According to the electronic component set of the embodiment described in the previous paragraph, the electronic component board may further include a contact. The electrical path may include a first sub-pathway and a second sub-pathway, the first sub-pathway and the second sub-pathway are electrically connected to the first circuit and the second circuit respectively, and the first sub-pathway and the second sub-pathway are electrically connected through the contact.

[0016] According to the electronic component set of the embodiment described in the previous paragraph, the bent portion does not include other electronic components.

[0017] According to an embodiment of the present disclosure, a photosensitive element module is provided, comprising an electronic element assembly as described in the above embodiment. The first electronic element is a photosensitive element.

[0018] The photosensitive element module according to the embodiment described in the previous paragraph may further include a bracket, wherein the bracket includes a through hole, the through hole is arranged corresponding to the photosensitive element, and the bending portion is arranged on the bracket.

[0019] According to the photosensitive element module of the embodiment described in the previous paragraph, the electronic component assembly may further include a hardness reinforcement plate, which is disposed at the bending portion and is relatively fixed to the bracket.

[0020] According to the photosensitive element module of the embodiment described in the previous paragraph, the bracket may further include a bending guide structure, the bending guide structure is arranged corresponding to a side of the bending portion connected to the connecting portion, and the bending portion bends along the bending guide structure.

[0021] According to the photosensitive element module of the embodiment described in the previous paragraph, the connection portion of the flexible circuit may include a window, and the window is arranged opposite to a photosensitive surface of the photosensitive element. The flexible circuit is opaque, and the window may include a plurality of protrusions, which gradually shrink toward the direction close to the photosensitive surface, and the length of the protrusion along the direction close to the photosensitive element may be between 0.08 mm and 0.43 mm.

[0022] According to an embodiment of the present disclosure, a camera module is provided, comprising the photosensitive element module as described in the above embodiment and an imaging lens, wherein the imaging lens and the photosensitive element are disposed opposite to each other.

[0023] According to the camera module of the embodiment described in the previous paragraph, the imaging lens defines an imaging lens height in the thickness direction from the photosensitive element to the electronic component board, and the bending portion of the flexible circuit defines a bending portion height in the thickness direction from the photosensitive element to the electronic component board. The imaging lens height can be greater than or equal to the bending portion height.

[0024] According to the camera module of the embodiment described in the previous paragraph, the electronic component assembly may further include a hardness reinforcement plate, which is disposed at the bending portion and is relatively fixed to the imaging lens.

[0025] According to the camera module of the embodiment described in the previous paragraph, the imaging lens may include a bending guide structure, the bending guide structure is arranged corresponding to a side of the bending portion connected to the connecting portion, and the bending portion bends along the bending guide structure.

[0026] According to the camera module of the embodiment described in the previous paragraph, the bending portion of the flexible circuit is opaque and may include a shielding area. The shielding area is arranged on a side of the bending portion away from the connecting portion, and the shielding area is arranged corresponding to the image height of the imaging lens.

[0027] According to an embodiment of the present disclosure, an electronic device is provided, including a camera module as described in the above embodiment.

[0028] According to one embodiment of the present disclosure, an electronic component group is provided, comprising a first electronic component, a second electronic component, an electronic component board and a flexible circuit. The second electronic component is spaced apart from the first electronic component. The first electronic component and the second electronic component are arranged on the electronic component board. The flexible circuit is arranged on the electronic component board, and the flexible circuit comprises a connecting portion, a bending portion and an electrical path. The connecting portion connects the electronic component board. The bending portion is arranged on a side of the connecting portion away from the first electronic component and the second electronic component, and the bending portion is bent along a thickness direction of the electronic component board. The electrical path comprises a first end and a second end, and at least a portion of the electrical path is arranged on the bending portion, wherein the first end and the second end are electrically connected to the first electronic component and the second electronic component respectively, and the first end and the second end are arranged on the connecting portion.

[0029] The electronic component assembly according to the embodiment described in the previous paragraph may further include a hardness reinforcement plate, wherein the hardness reinforcement plate is disposed at the bending portion, and the hardness reinforcement plate and the electronic component board are relatively fixed.

[0030] According to the electronic component assembly of the embodiment described in the previous paragraph, the dimension of the bending portion in the thickness direction of the electronic component board may be less than or equal to the dimension of the bending portion in a thickness direction perpendicular to the thickness direction of the electronic component board and perpendicular to the bending portion.

[0031] According to the electronic component assembly of the embodiment described in the previous paragraph, the bending portion may include a bending auxiliary hole, the bending auxiliary hole is arranged on a side of the bending portion close to the electronic component board, and the electrical path is arranged around the bending auxiliary hole. The dimension of the bending auxiliary hole in the thickness direction of the electronic component board may be less than or equal to the dimension of the bending auxiliary hole in a thickness direction perpendicular to the thickness direction of the electronic component board and perpendicular to the bending portion.

[0032] The electronic component set according to the embodiment described in the previous paragraph may further include a multi-layer circuit board, wherein the multi-layer circuit board may include an electronic component board and a flexible circuit, and the flexible circuit extends from the electronic component board in a direction away from the first electronic component.

[0033] According to the electronic component set of the embodiment described in the previous paragraph, the electronic component board may further include a component corresponding hole, and the first electronic component is disposed in the component corresponding hole.

[0034] According to an embodiment of the present disclosure, a photosensitive element module is provided, comprising an electronic element assembly as described in the above embodiment. The first electronic element is a photosensitive element.

[0035] According to the photosensitive element module of the embodiment described in the previous paragraph, the connection portion of the flexible circuit may include a window, and the window is arranged opposite to a photosensitive surface of the photosensitive element. The flexible circuit is opaque, and the window may include a plurality of protrusions, which gradually shrink toward the direction close to the photosensitive surface, and the length of the protrusion along the direction close to the photosensitive element may be between 0.08 mm and 0.43 mm.

[0036] According to an embodiment of the present disclosure, a camera module is provided, comprising the photosensitive element module as described in the above embodiment and an imaging lens, wherein the imaging lens and the photosensitive element are disposed opposite to each other.

[0037] According to the camera module of the embodiment described in the previous paragraph, the imaging lens defines an imaging lens height in the thickness direction from the photosensitive element to the electronic component board, and the bending portion of the flexible circuit defines a bending portion height in the thickness direction from the photosensitive element to the electronic component board. The imaging lens height can be greater than or equal to the bending portion height.

[0038] According to an embodiment of the present disclosure, an electronic device is provided, including a camera module as described in the above embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1A A three-dimensional diagram of a camera module according to a first embodiment of the present disclosure is shown;

[0040] Figure 1B Draw according to Figure 1A An exploded view of the camera module in the first embodiment;

[0041] Figure 1C Draw according to Figure 1A A cross-sectional view of a camera module in a first embodiment;

[0042] Figure 1D Draw according to Figure 1A An exploded view of the photosensitive element module in the first embodiment;

[0043] Figure 1E Draw according to Figure 1A A top view of the camera module in the first embodiment of the first implementation mode;

[0044] Figure 1F Draw according to Figure 1A A top view of the camera module in the second embodiment of the first embodiment;

[0045] Figure 1G Draw according to Figure 1A A top view of the camera module in the third embodiment of the first implementation mode;

[0046] Figure 1H Draw according to Figure 1A A top view of a camera module in a fourth embodiment of the first embodiment;

[0047] Fig. 1I Draw according to Figure 1A A top view of a camera module in a fifth embodiment of the first implementation mode;

[0048] Figure 1JDraw according to Figure 1A A top view of a camera module in a sixth embodiment of the first implementation mode;

[0049] Figure 2A A perspective view of a camera module according to a second embodiment of the present disclosure is shown;

[0050] Figure 2B Draw according to Figure 2A An exploded view of the camera module in the second embodiment;

[0051] Figure 2C Draw according to Figure 2A A schematic diagram of the imaging optical path range of the camera module in the second embodiment;

[0052] Figure 2D Draw according to Figure 2A A cross-sectional view of the camera module in the first embodiment of the second implementation mode;

[0053] Figure 2E Draw according to Figure 2A A schematic diagram of a photosensitive element module in the first embodiment of the second implementation mode;

[0054] Figure 2F Draw according to Figure 2A A perspective view of a camera module in a second embodiment of the second implementation mode;

[0055] Figure 3A A three-dimensional diagram of a camera module according to a third embodiment of the present disclosure is shown;

[0056] Figure 3B Draw according to Figure 3A A partial cross-sectional view of a camera module in a third embodiment;

[0057] Figure 3C Draw according to Figure 3A An exploded view of a camera module in a third embodiment;

[0058] Figure 3D Draw according to Figure 3A An exploded view of a photosensitive element module in a third embodiment;

[0059] Figure 3E Draw according to Figure 3A A partial enlarged view of the camera module in the third embodiment;

[0060] Figure 4A A three-dimensional diagram of a camera module according to a fourth embodiment of the present disclosure is shown;

[0061] Figure 4B Draw according to Figure 4A An exploded view of a camera module in a fourth embodiment;

[0062] Figure 4C Draw according to Figure 4B A partial enlarged view of the camera module in the fourth embodiment;

[0063] Figure 4D Draw according to Figure 4A An exploded view of the photosensitive element module in the fourth embodiment;

[0064] Figure 4E Draw according to Figure 4A Partial exploded view of the photosensitive element module in the fourth embodiment;

[0065] Figure 4F Draw according to Figure 4A A top view of a photosensitive element module in a fourth embodiment;

[0066] Figure 4G Draw according to Figure 4F A partial enlarged view of the photosensitive element module in the fourth embodiment;

[0067] Figure 5A A perspective view of a camera module according to a fifth embodiment of the present disclosure is shown;

[0068] Figure 5B Draw according to Figure 5A A schematic diagram of a camera module in a fifth embodiment;

[0069] Figure 5C Draw according to Figure 5A A cross-sectional view of a camera module in a fifth embodiment;

[0070] Figure 5D Draw according to Figure 5C A partial enlarged view of the camera module in the fifth embodiment;

[0071] Figure 5E Draw according to Figure 5A Another schematic diagram of the camera module in the fifth embodiment;

[0072] Fig. 5F Draw according to Figure 5A An exploded view of a camera module in a fifth embodiment;

[0073] Figure 5G Draw according to Figure 5A A top view of a photosensitive element module in a fifth embodiment;

[0074] Figure 5H Draw according to Figure 5A A partial enlarged view of the photosensitive element module in the fifth embodiment;

[0075] Fig. 6A A three-dimensional diagram of an electronic device according to a sixth embodiment of the present disclosure is shown;

[0076] Figure 6B Draw according to Fig. 6A A schematic diagram of an electronic device in a sixth embodiment;

[0077] Figure 7 A schematic diagram illustrating an electronic device applied to a drone according to a seventh embodiment of the present disclosure;

[0078] Figure 8 A schematic diagram illustrating an electronic device applied to a car according to an eighth embodiment of the present disclosure;

[0079] Fig. 9 A schematic diagram illustrating an electronic device applied to a computer according to a ninth embodiment of the present disclosure; and

[0080] Fig.10 A schematic diagram illustrating an electronic device applied to a wearable device according to a tenth embodiment of the present disclosure is shown.

[0081]

Explanation of symbols

[0082] 10,20,30,40,50: Camera module

[0083] 11,21,31,41,51: Photosensitive element module

[0084] 12,22,32,42,52: Imaging lenses

[0085] 111,211,311,411,511:First electronic components

[0086] 112,212,312,412,512: Second electronic component

[0087] 120,220,320,420,520,64: Electronic component boards

[0088] 121,221,321,421,521: First Circuit

[0089] 122,222,322,422,522: Second Circuit

[0090] 124,224,524: Component corresponding holes

[0091] 125,225,325: Third Circuit

[0092] 130,230,330,430,530:Flexible circuits

[0093] 131,231,331,431,531:Connection

[0094] 132,232,332,432: bending part

[0095] 133,233,333,433,533: Electrical pathways

[0096] 141,241,541: Bending auxiliary hole

[0097] 142,342: Open window

[0098] 144,244: Shielded area

[0099] 145,245,345,445,545: First end

[0100] 146,246,346,446,546: Second end

[0101] 151,551: Hardness reinforcement plate

[0102] 152,352: Shape maintaining element

[0103] 154,254,554:Substrate

[0104] 155,255: Circuit layer

[0105] 160,260,460,560: Bracket

[0106] 161,261,357,461:Through hole

[0107] 23,43: Filter element

[0108] 234: Secondary bending part

[0109] 253,553:Multilayer circuit board

[0110] 323,423,523: Bending guide structure

[0111] 326:Contact

[0112] 327: First sub-pathway

[0113] 328: Second sub-pathway

[0114] 356: Heat dissipation structure

[0115] 442a,542a: First window

[0116] 442b,542b: Second window

[0117] 447: Anti-glare structure

[0118] 447a: protrusion

[0119] 530a: first flexible circuit

[0120] 530b: second flexible circuit

[0121] 532a: first bending portion

[0122] 532b: second bending portion

[0123] 571: Upper circuit

[0124] 572: Hard layer

[0125] 573: Lower circuit

[0126] 574: Connecting wire

[0127] 60: Electronic devices

[0128] 610: Image acquisition control interface

[0129] 611: Video playback button

[0130] 612: Camera module switch button

[0131] 613: Focus and photo button

[0132] 614: Integrated menu button

[0133] 615: Zoom control key

[0134] 621: Front camera module

[0135] 622: Wide-angle camera module

[0136] 623: Telephoto camera module

[0137] 624:Ultra-wide-angle camera module

[0138] 625: Macro camera module

[0139] 626:TOF module

[0140] 63: Tip light

[0141] 641: Connector

[0142] 642: Electronic components

[0143] 65: Single chip system

[0144] 66: Auxiliary focusing element

[0145] 661: Light-emitting element

[0146] 70: Drone

[0147] 71a, 81a: Front camera module

[0148] 71b, 81b: Side camera module

[0149] 81c: Rear camera module

[0150] 80: Car

[0151] 90: Computer

[0152] 91a,1010: Video camera module

[0153] 91b: Infrared camera module

[0154] 1000: Wearable Devices

[0155] AI: Avoid Interference Zone

[0156] WD: Bending direction

[0157] RL: Imaging optical path range

[0158] IMG: Photosensitive surface

[0159] I1, I2, I3, I4: External space information

[0160] H1: Imaging lens height

[0161] H2: Height of bending part

[0162] H: Image height

[0163] L: Length DETAILED DESCRIPTION

[0164] The present disclosure provides an electronic component group, which includes a first electronic component, an electronic component board and a flexible circuit, wherein the first electronic component is arranged on the electronic component board, and the flexible circuit is arranged on the electronic component board. The flexible circuit includes a connecting portion, a bending portion and an electrical path, wherein the connecting portion is connected to the electronic component board, the bending portion is arranged on a side of the connecting portion away from the first electronic component, the bending portion is bent along a thickness direction of the electronic component board, and at least a portion of the electrical path is arranged on the bending portion. The electrical path includes a first end and a second end, wherein the first end and the second end are arranged on the connecting portion. By bending the flexible circuit in conjunction with the solution of the electronic component board to achieve a circuit structure of an extreme size, the design density of the electronic component group is improved, which is conducive to realizing the structure of a multi-function module or a multi-lens module.

[0165] Specifically, the electronic component board is used to support the first electronic component, and may further have at least one function such as mechanical strength support, circuit configuration, anti-electromagnetic interference or grounding, but is not limited thereto. By bending the bypass design of the flexible circuit, the wiring freedom of the electronic component board can be improved, thereby compressing the volume of the electronic component group. Furthermore, the flexible circuit extends from the electronic component board and returns to the electronic component board to complete the design of the electrical path.

[0166] Furthermore, the flexible circuit can be obtained by a flexible circuit board (FPC) or a multilayer circuit board, but is not limited thereto. The electronic component board can be a printed electronic component board or a ceramic electronic component board, and the electronic component board can be further integrated with the flexible circuit by injection molding.

[0167] The electronic component board may include a first circuit and a second circuit, wherein the first circuit and the second circuit are respectively arranged on opposite sides of the first electronic component, the first circuit is electrically connected to the first electronic component, and the first end and the second end are electrically connected to the first circuit and the second circuit respectively. The flexible circuit can keep the electrical path away from the first electronic component, and can prevent the current magnetic effect generated by the circuit from affecting the electronic component, thereby maintaining the working state of the electronic component while miniaturizing the volume, and the flexible circuit can simplify the design of the electronic component board, thereby shortening the design process and improving production efficiency.

[0168] The electronic component group may further include a second electronic component, wherein the second electronic component is spaced apart from the first electronic component, the second electronic component is disposed on the electronic component board, the bending portion is disposed on the side of the connecting portion away from the second electronic component, the first end and the second end are electrically connected to the first electronic component and the second electronic component respectively, and the second electronic component is electrically connected to the second circuit. Furthermore, the electronic component board may further include a third circuit, wherein the third circuit is electrically connected to the first electronic component and the second electronic component. Specifically, the first electronic component and the second electronic component are connected through a plurality of communication modes to avoid concentrated loads and reduce the overall size.

[0169] The bent portion can be fixed relative to the electronic component board. By fixing the bent portion, signal interference caused by shaking can be avoided.

[0170] The electronic component assembly may further include a hardness reinforcement plate, wherein the hardness reinforcement plate is disposed at the bending portion, and the hardness reinforcement plate and the electronic component board are relatively fixed. The hardness reinforcement plate can improve the rigidity of the bending portion to avoid damage. Furthermore, the hardness reinforcement plate can be a metal part to shield signal interference (EMI Shielding), and the hardness reinforcement plate can be further combined with the bending portion to form a composite plate.

[0171] The electronic component board may further include a bending guide structure, wherein the bending guide structure is arranged corresponding to a side of the bending portion connected to the connecting portion, and the bending portion bends along the bending guide structure, thereby reducing the degree of the bending portion floating out of the surface to improve the assembly quality.

[0172] The dimension of the bending portion in the thickness direction of the electronic component board can be smaller than or equal to the dimension of the bending portion in a thickness direction perpendicular to the thickness direction of the electronic component board and perpendicular to the bending portion, thereby ensuring the mechanical strength after bending.

[0173] The bending portion may include a bending auxiliary hole, wherein the bending auxiliary hole is arranged on a side of the bending portion close to the electronic component board, and the electrical path is arranged around the bending auxiliary hole. The dimension of the bending auxiliary hole in the thickness direction of the electronic component board may be less than or equal to the dimension of the bending auxiliary hole in a thickness direction perpendicular to the thickness direction of the electronic component board and perpendicular to the bending portion. In this way, unexpected deformation of the electrical path during bending can be avoided to protect the electrical path.

[0174] The electronic component assembly may further include a shape maintaining element, wherein the shape maintaining element is disposed corresponding to one side of the bending portion connected to the connecting portion, and the shape maintaining element is relatively fixed to the electronic component board. This can avoid damage caused by collision during assembly, thereby improving the assembly process. Specifically, the shape maintaining element may be a bracket.

[0175] The connection portion of the flexible circuit may include a window, wherein the window is arranged opposite to the first electronic component, thereby the first electronic component is not shielded by the flexible circuit, so that the first electronic component can have functions such as photosensitivity and heat dissipation.

[0176] The electronic component set may further include a multi-layer circuit board, wherein the multi-layer circuit board includes an electronic component board and a flexible circuit, and the flexible circuit extends from the electronic component board in a direction away from the first electronic component.

[0177] The electronic component board may further include a component corresponding hole, wherein the first electronic component is disposed in the component corresponding hole. Thus, the height difference between the first electronic component and the electronic component board can be reduced to avoid interference between the flexible circuit and the gold wire on the first electronic component. Furthermore, the electronic component board may further include a substrate and a circuit layer, wherein the first electronic component is disposed on the substrate, and the first electronic component and the circuit layer are electrically connected.

[0178] The electronic component board may further include a contact, and the electrical path may include a first sub-path and a second sub-path, wherein the first sub-path and the second sub-path are electrically connected to the first circuit and the second circuit respectively, and the first sub-path and the second sub-path are electrically connected through the contact. In this way, the stability of the flexible circuit can be further improved. Specifically, the first sub-path and the second sub-path can further be gold wires, so that they can be completed at one time during the wire bonding process.

[0179] The bending portion may not include other electronic components. Specifically, the first electronic component may include a passive component, a sensing component, a coil, etc., so as to avoid signal interference.

[0180] The various technical features of the electronic component assembly disclosed above can be configured in combination to achieve corresponding effects.

[0181] The present disclosure provides a photosensitive element module, comprising the aforementioned electronic element group, wherein the first electronic element is a photosensitive element.

[0182] The photosensitive element module may further include a bracket, wherein the bracket includes a through hole, the through hole is arranged corresponding to the photosensitive element, and the bending portion is arranged on the bracket.

[0183] The electronic component assembly may further include a hardness reinforcement plate, wherein the hardness reinforcement plate is disposed at the bending portion, and the hardness reinforcement plate is relatively fixed to the bracket.

[0184] The bracket may further include a bending guide structure, wherein the bending guide structure is arranged corresponding to a side of the bending portion connected to the connecting portion, and the bending portion bends along the bending guide structure.

[0185] The window can be arranged opposite to a photosensitive surface of the photosensitive element, wherein the flexible circuit is opaque, and the window can include a plurality of protrusions, wherein the protrusions gradually shrink in the direction close to the photosensitive surface, and the length of the protrusions along the direction close to the photosensitive element can be between 0.08 mm and 0.43 mm. In this way, the flexible circuit can block the glare generated by the circuit contacts, and the protrusions can further avoid the glare generated by the reflection from the window to the photosensitive surface. Furthermore, the protrusions gradually shrink in the direction parallel to the photosensitive surface, and can also further shrink in the direction perpendicular to the photosensitive surface. The anti-glare structure can include a plurality of protrusions, wherein the protrusions are continuously arranged along the window.

[0186] The various technical features of the photosensitive element module disclosed above can be configured in combination to achieve corresponding effects.

[0187] The present disclosure provides a camera module, including the aforementioned photosensitive element module and an imaging lens, wherein the imaging lens and the photosensitive element are arranged opposite to each other. Specifically, the camera module may further have functions such as focus, zoom, and image stabilization, and the aforementioned driving functions may be achieved through the imaging lens bracket, the imaging lens, or the cooperation with each other, but is not limited thereto.

[0188] The imaging lens defines an imaging lens height in the thickness direction from the photosensitive element to the electronic component board, and the bending portion of the flexible circuit defines a bending portion height in the thickness direction from the photosensitive element to the electronic component board, wherein the imaging lens height can be greater than or equal to the bending portion height.

[0189] The electronic component assembly may further include a hardness reinforcement plate, wherein the hardness reinforcement plate is disposed at the bending portion, and the hardness reinforcement plate is relatively fixed to the imaging lens.

[0190] The imaging lens may include a bending guide structure, wherein the bending guide structure is arranged corresponding to a side of the bending portion connected to the connecting portion, and the bending portion bends along the bending guide structure.

[0191] The bending portion of the flexible circuit may be opaque, and the bending portion may include a shielding area, wherein the shielding area is arranged on a side of the bending portion away from the connecting portion, and the shielding area is arranged corresponding to the image height of the imaging lens. In this way, non-imaging light can be shielded from entering the imaging lens to form glare, thereby improving the optical quality.

[0192] The various technical features of the camera module disclosed above can be configured in combination to achieve corresponding effects.

[0193] The present disclosure provides an electronic device, which includes the aforementioned camera module.

[0194] According to the above-mentioned implementation modes, specific implementation modes and examples are proposed below and described in detail with reference to the accompanying drawings.

[0195] <First embodiment>

[0196] Please refer to Figures 1A to 1D ,in Figure 1A A three-dimensional diagram of a camera module 10 according to a first embodiment of the present disclosure is shown. Figure 1B Draw according to Figure 1A An exploded view of the camera module 10 in the first embodiment, Figure 1C Draw according to Figure 1A A cross-sectional view of the camera module 10 in the first embodiment, Figure 1D Draw according to Figure 1A An exploded view of the photosensitive element module 11 in the first embodiment. Figures 1A to 1D It can be seen that the camera module 10 includes a photosensitive element module 11 and an imaging lens 12, wherein the imaging lens 12 is disposed opposite to the photosensitive element module 11. Specifically, the camera module 10 may further have functions such as focusing, zooming, and image stabilization, and may achieve the above-mentioned driving functions through the imaging lens bracket, the imaging lens, or cooperation with each other, but is not limited thereto.

[0197] The photosensitive element module 11 includes an electronic element group (not shown), and the electronic element group includes a first electronic element 111, a second electronic element 112, an electronic element board 120 and a flexible circuit 130, wherein the second electronic element 112 is spaced apart from the first electronic element 111, the first electronic element 111 and the second electronic element 112 are disposed on the electronic element board 120, and the flexible circuit 130 is disposed on the electronic element board 120. In detail, the first electronic element 111 can be a photosensitive element, and the second electronic element 112 can be an image processing element.

[0198] The electronic component board 120 includes a first circuit 121 and a second circuit 122 , wherein the first circuit 121 and the second circuit 122 are respectively disposed on opposite sides of the first electronic component 111 , and the first circuit 121 is electrically connected to the first electronic component 111 .

[0199] The flexible circuit 130 includes a connecting portion 131, a bending portion 132, and an electrical path 133. The connecting portion 131 is connected to the electronic component board 120. The bending portion 132 is disposed on a side of the connecting portion 131 away from the first electronic component 111 and the second electronic component 112, and the bending portion 132 is bent along a thickness direction of the electronic component board 120. The electrical path 133 includes a first end 145 and a second end 146, and at least a portion of the electrical path 133 is disposed at the bending portion 132.

[0200] The first end 145 and the second end 146 are electrically connected to the first circuit 121 and the second circuit 122 , respectively. The first end 145 and the second end 146 are electrically connected to the first electronic element 111 and the second electronic element 112 , respectively. The first end 145 and the second end 146 are disposed at the connection portion 131 .

[0201] Specifically, the electronic component board 120 is used to support the first electronic component 111 and the second electronic component 112, and may further have at least one function such as mechanical strength support, circuit configuration, anti-electromagnetic interference or grounding, wherein the electronic component board 120 may be a printed electronic component board, a ceramic electronic component board, and the electronic component board 120 may be further integrated with the flexible circuit 130 through injection molding, but is not limited to this.

[0202] By bending the bypass design of the flexible circuit 130, the wiring freedom of the electronic component board 120 can be improved, thereby compressing the volume of the electronic component group. On the other hand, the flexible circuit 130 can keep the circuit away from the electronic components (i.e., the first electronic component 111 and the second electronic component 112), thereby preventing the current magnetic effect generated by the circuit from affecting the electronic components, thereby maintaining the working state of the electronic components while miniaturizing the volume, and the flexible circuit 130 can simplify the design of the electronic component board 120, thereby shortening the design process and improving production efficiency.

[0203] Furthermore, the flexible circuit 130 can be obtained by a flexible printed circuit board (FPC) or a multi-layer printed circuit board, but is not limited thereto. Furthermore, the flexible circuit 130 extends from the electronic component board 120 and returns to the electronic component board 120 to complete the design of the electrical path 133 .

[0204] The bending portion 132 can be fixed relative to the electronic component board 120. By fixing the bending portion 132, signal interference caused by shaking can be avoided.

[0205] Depend on Figure 1A It can be seen that the dimension of the bending portion 132 in the thickness direction of the electronic component board 120 can be less than or equal to the dimension of the bending portion 132 in the thickness direction perpendicular to the electronic component board 120 and perpendicular to the thickness direction of the bending portion 132. In this way, the mechanical strength of the bending portion 132 after bending can be guaranteed.

[0206] The photosensitive element module 11 may further include a bracket 160 , wherein the bracket 160 includes a through hole 161 , the through hole 161 is disposed corresponding to the first electronic element 111 , and the bending portion 132 is disposed on the bracket 160 .

[0207] Depend on Figure 1C It can be seen that the imaging lens 12 defines an imaging lens height H1 in the thickness direction from the first electronic component 111 to the electronic component board 120, and the bending portion 132 of the flexible circuit 130 defines a bending portion height H2 in the thickness direction from the first electronic component 111 to the electronic component board 120, wherein the imaging lens height H1 is greater than the bending portion height H2.

[0208] Depend on Figure 1A It can be seen that the electronic component assembly may further include a shape maintaining element 152, wherein the shape maintaining element 152 is disposed corresponding to the side of the bending portion 132 connected to the connecting portion 131, and the shape maintaining element 152 is relatively fixed to the electronic component board 120. In this way, damage caused by collision during assembly can be avoided, thereby improving the assembly process.

[0209] Depend on Figures 1B to 1D It can be seen that the electronic component board 120 may further include a component corresponding hole 124, a substrate 154 and a circuit layer 155, wherein the first electronic component 111 is disposed in the component corresponding hole 124 and the substrate 154, and the first electronic component 111 is electrically connected to the circuit layer 155. In this way, the height difference between the first electronic component 111 and the electronic component board 120 can be reduced to avoid interference between the flexible circuit 130 and the gold wire on the first electronic component 111.

[0210] The electronic component board 120 may further include a third circuit 125, wherein the second electronic component 112 may be electrically connected to the second circuit 122, and the third circuit 125 electrically connects the first electronic component 111 and the second electronic component 112. Specifically, the first electronic component 111 and the second electronic component 112 are connected through a variety of communication methods to avoid concentrated loads and reduce the overall size.

[0211] Depend on Figure 1B and Figure 1D It can be seen that the connection portion 131 of the flexible circuit 130 may include a window 142, wherein the window 142 is disposed opposite to the first electronic component 111. Thus, the first electronic component 111 is not shielded by the flexible circuit 130, so that the first electronic component 111 can have functions such as light sensing and heat dissipation.

[0212] The bending portion 132 may not include other electronic components. Specifically, the electronic components include passive components, sensing components, coils, etc., so as to avoid signal interference.

[0213] Please refer to Figure 1E , which is drawn according to Figure 1A A top view of the camera module 10 in the first example of the first embodiment. Figure 1E It can be seen that the flexible circuit 130 is disposed on both sides of the imaging lens 12, and the bending portion 132 of the flexible circuit 130 may include a bending auxiliary hole 141, wherein the bending auxiliary hole 141 is disposed on one side of the bending portion 132 close to the electronic component board 120, and the electrical path 133 is disposed around the bending auxiliary hole 141. In the first example of the first embodiment, the number of the bending auxiliary holes 141 is four, but it is not limited thereto.

[0214] Please refer to Figure 1F , which is drawn according to Figure 1A A top view of the camera module 10 in the second embodiment of the first embodiment. Figure 1F It can be seen that the flexible circuit 130 is disposed on a single side of the imaging lens 12 .

[0215] Please refer to Figure 1G , which is drawn according to Figure 1A A top view of the camera module 10 in the third example of the first embodiment. Figure 1G It can be seen that the flexible circuit 130 is disposed on both sides of the imaging lens 12 , and the electronic component assembly may further include a hardness reinforcement plate 151 , wherein the hardness reinforcement plate 151 is disposed on the bending portion 132 , and the hardness reinforcement plate 151 is relatively fixed to the electronic component board 120 , the bracket 160 and the imaging lens 12 .

[0216] The rigidity of the bending portion 132 can be improved by the rigidity reinforcing plate 151 to prevent damage. Furthermore, the rigidity reinforcing plate 151 can be a metal piece to shield signal interference (EMI Shielding), and the rigidity reinforcing plate 151 can be further combined with the bending portion 132 to form a composite plate.

[0217] Please refer to Figure 1H , which is drawn according to Figure 1A A top view of the camera module 10 in the fourth example of the first embodiment. Figure 1H It can be seen that the flexible circuit 130 is disposed on both sides of the imaging lens 12, and the flexible circuit 130 presents an irregular shape, wherein the bending portion 132 of the flexible circuit 130 may include a bending auxiliary hole 141, the bending auxiliary hole 141 is disposed on one side of the bending portion 132 close to the electronic component board 120, and the electrical path 133 is disposed around the bending auxiliary hole 141.

[0218] Please refer to Fig. 1I , which is drawn according to Figure 1A A top view of the camera module 10 in the fifth embodiment of the first embodiment. Fig. 1I It can be seen that the flexible circuit 130 is disposed on both sides of the imaging lens 12, the bending portion 132 of the flexible circuit 130 is opaque, and the bending portion 132 may include a shielding area 144, wherein the shielding area 144 is disposed on a side of the bending portion 132 away from the connecting portion 131, and the shielding area 144 is disposed corresponding to the image height of the imaging lens 12. In this way, non-imaging light can be shielded from entering the imaging lens 12 to form glare, thereby improving the optical quality.

[0219] Specifically, the shielding area 144 can be used to shield the non-imaging light from the flexible circuit 130, and avoid the area that interferes with the imaging lens 12. Fig. 1I Avoid interference zone AI in .

[0220] Please refer to Figure 1J , which is drawn according to Figure 1A A top view of the camera module 10 in the sixth embodiment of the first embodiment. Figure 1J It can be seen that the flexible circuit 130 is disposed on a single side of the imaging lens 12 , and the electronic component assembly may further include a hardness reinforcement plate 151 , wherein the hardness reinforcement plate 151 is disposed on the bending portion 132 , and the hardness reinforcement plate 151 is relatively fixed to the electronic component board 120 , the bracket 160 and the imaging lens 12 .

[0221] <Second embodiment>

[0222] Please refer to FIG. 2A to FIG. 2C ,in Figure 2A A three-dimensional diagram of a camera module 20 according to a second embodiment of the present disclosure is shown. Figure 2B Draw according to Figure 2AAn exploded view of the camera module 20 in the second embodiment, Figure 2C Draw according to Figure 2A A schematic diagram of the imaging optical path range RL of the camera module 20 in the second embodiment. FIG. 2A to FIG. 2C It can be seen that the camera module 20 includes a photosensitive element module 21 (indicated at Figure 2E ) and an imaging lens 22, wherein the imaging lens 22 and the photosensitive element module 21 are arranged opposite to each other.

[0223] The photosensitive element module 21 includes an electronic element group (not shown), and the electronic element group includes a first electronic element 211, a second electronic element 212, an electronic element board 220 and a flexible circuit 230, wherein the second electronic element 212 is spaced apart from the first electronic element 211, the first electronic element 211 and the second electronic element 212 are disposed on the electronic element board 220, and the flexible circuit 230 is disposed on the electronic element board 220. In detail, the first electronic element 211 can be a photosensitive element, and the second electronic element 212 can be an image processing element.

[0224] Depend on Figure 2C It can be known that the camera module 20 may further include a filter element 23 , wherein the imaging light passes through the filter element 23 and is imaged on a photosensitive surface IMG of the first electronic element 211 .

[0225] Please refer to Figure 2D and Figure 2E ,in Figure 2D Draw according to Figure 2A A cross-sectional view of the camera module 20 in the first embodiment of the second embodiment, Figure 2E Draw according to Figure 2A A schematic diagram of the photosensitive element module 21 in the first embodiment of the second embodiment. Figure 2D and Figure 2E It can be known that the electronic component board 220 includes a first circuit 221 and a second circuit 222 , wherein the first circuit 221 and the second circuit 222 are respectively disposed on opposite sides of the first electronic component 211 , and the first circuit 221 is electrically connected to the first electronic component 211 .

[0226] Depend on FIG. 2C to FIG. 2E As can be seen, the flexible circuit 230 includes a connecting portion 231, a bending portion 232, and an electrical path 233. The connecting portion 231 is connected to the electronic component board 220. The bending portion 232 is disposed on a side of the connecting portion 231 away from the first electronic component 211 and the second electronic component 212, and the bending portion 232 is bent along a thickness direction of the electronic component board 220. The electrical path 233 includes a first end 245 and a second end 246, and at least a portion of the electrical path 233 is disposed at the bending portion 232.

[0227] The first end 245 and the second end 246 are electrically connected to the first circuit 221 and the second circuit 222 , respectively. The first end 245 and the second end 246 are electrically connected to the first electronic element 211 and the second electronic element 212 , respectively. The first end 245 and the second end 246 are disposed at the connection portion 231 .

[0228] Depend on Figure 2A and Figure 2B It can be known that the photosensitive element module 21 may further include a bracket 260, wherein the bracket 260 includes a through hole 261, the through hole 261 is arranged corresponding to the first electronic element 211, and the bending portion 232 is arranged on the bracket 260. Further, the bracket 260 may be an imaging lens base.

[0229] Depend on Figure 2B and Figure 2D It can be known that the electronic component board 220 may further include a component corresponding hole 224 , a substrate 254 and a circuit layer 255 , wherein the first electronic component 211 is disposed in the component corresponding hole 224 and the substrate 254 , and the first electronic component 211 is electrically connected to the circuit layer 255 .

[0230] Depend on Figure 2D and Figure 2E It can be known that the electronic component board 220 may further include a third circuit 225 , wherein the second electronic component 212 may be electrically connected to the second circuit 222 , and the third circuit 225 is electrically connected to the first electronic component 211 and the second electronic component 212 .

[0231] Depend on Figure 2A , Figure 2D and Figure 2E It can be seen that the bending portion 232 of the flexible circuit 230 may include a bending auxiliary hole 241, wherein the bending auxiliary hole 241 is disposed on a side of the bending portion 232 close to the electronic component board 220, and the electrical path 233 is disposed around the bending auxiliary hole 241. Further, the dimension of the bending auxiliary hole 241 in the thickness direction of the electronic component board 220 may be less than or equal to the dimension of the bending auxiliary hole 241 in a thickness direction perpendicular to the thickness direction of the electronic component board 220 and perpendicular to the bending portion 232. In this way, the electrical path 233 can be prevented from being deformed unexpectedly when being bent, so as to protect the electrical path 233.

[0232] Depend on Figure 2B and Figure 2E It can be known that the electronic component assembly may further include a multi-layer circuit board 253 , wherein the multi-layer circuit board 253 may include an electronic component board 220 and a flexible circuit 230 , and the flexible circuit 230 extends from the electronic component board 220 in a direction away from the first electronic component 211 .

[0233] Depend on Figure 2C and Figure 2DIt can be seen that the bending portion 232 of the flexible circuit 230 is opaque and may include a shielding area 244 , wherein the shielding area 244 is disposed on a side of the bending portion 232 away from the connecting portion 231 , and the shielding area 244 is disposed corresponding to the image height H of the imaging lens 22 .

[0234] Specifically, the shielding area 244 can be used to shield the non-imaging light of the flexible circuit 230 to form a Figure 2C The imaging optical path range RL in the image sensor can avoid the area interfering with the imaging lens 22, that is, Figure 2D Avoid interference zone AI in .

[0235] Please refer to Figure 2F , which is drawn according to Figure 2A A perspective view of the camera module 20 in the second example of the second embodiment. Figure 2F It can be known that the flexible circuit 230 may further include a plurality of secondary bending portions 234 , wherein the secondary bending portions 234 are further disposed on the bending portion 232 , and the secondary bending portions 234 may further strengthen and fix the bending portion 232 .

[0236] <Third Embodiment>

[0237] Please refer to FIG. 3A to FIG. 3C ,in Figure 3A A three-dimensional diagram of a camera module 30 according to a third embodiment of the present disclosure is shown. Figure 3B Draw according to Figure 3A A partial cross-sectional view of a camera module 30 in a third embodiment, Figure 3C Draw according to Figure 3A An exploded view of the camera module 30 in the third embodiment. FIG. 3A to FIG. 3C It can be seen that the camera module 30 includes a photosensitive element module 31 (indicated at Figure 3D ) and an imaging lens 32, wherein the imaging lens 32 and the photosensitive element module 31 are arranged opposite to each other.

[0238] Please refer to Figure 3D , which is drawn according to Figure 3A An exploded view of the photosensitive element module 31 in the third embodiment. FIG. 3B to FIG. 3D It can be seen that the photosensitive element module 31 includes an electronic element group (not shown), and the electronic element group includes a first electronic element 311, a second electronic element 312, an electronic element board 320 and a flexible circuit 330, wherein the second electronic element 312 is spaced apart from the first electronic element 311, the first electronic element 311 and the second electronic element 312 are disposed on the electronic element board 320, and the flexible circuit 330 is disposed on the electronic element board 320. In detail, the first electronic element 311 can be a photosensitive element, and the second electronic element 312 can be an image processing element.

[0239] Depend on Figure 3D It can be known that the electronic component board 320 includes a first circuit 321 and a second circuit 322 , wherein the first circuit 321 and the second circuit 322 are respectively disposed on opposite sides of the first electronic component 311 , and the first circuit 321 is electrically connected to the first electronic component 311 .

[0240] Please refer to Figure 3E , which is drawn according to Figure 3A A partial enlarged view of the camera module 30 in the third embodiment. Figure 3B , Figure 3D and Figure 3E As can be seen, the flexible circuit 330 includes a connecting portion 331, a bending portion 332, and an electrical path 333. The connecting portion 331 is connected to the electronic component board 320. The bending portion 332 is disposed on a side of the connecting portion 331 away from the first electronic component 311 and the second electronic component 312, and the bending portion 332 is bent along a thickness direction of the electronic component board 320. The electrical path 333 includes a first end 345 and a second end 346, and at least a portion of the electrical path 333 is disposed at the bending portion 332.

[0241] The first end 345 and the second end 346 are electrically connected to the first circuit 321 and the second circuit 322 , respectively. The first end 345 and the second end 346 are electrically connected to the first electronic element 311 and the second electronic element 312 , respectively. The first end 345 and the second end 346 are disposed at the connection portion 331 .

[0242] Depend on FIG. 3A to FIG. 3C and Figure 3E It can be known that the electronic component assembly may further include a shape maintaining element 352 , wherein the shape maintaining element 352 is disposed corresponding to a side of the bending portion 332 connected to the connecting portion 331 , and the shape maintaining element 352 is relatively fixed to the electronic component board 320 .

[0243] In detail, the shape maintaining element 352 may be a bracket, and the shape maintaining element 352 may include a heat dissipation structure 356 and a through hole 357 , wherein the heat dissipation structure 356 is disposed corresponding to the second electronic element 312 , and the through hole 357 is disposed corresponding to the imaging lens 32 .

[0244] Depend on Figure 3D It can be known that the electronic component board 320 may further include a third circuit 325 , wherein the second electronic component 312 may be electrically connected to the second circuit 322 , and the third circuit 325 is electrically connected to the first electronic component 311 and the second electronic component 312 .

[0245] The connection portion 331 of the flexible circuit 330 may include a window 342 , wherein the window 342 is disposed opposite to the first electronic component 311 and the second electronic component 312 .

[0246] Depend on Figure 3E It can be seen that the electronic component board 320 may further include a bending guide structure 323, wherein the bending guide structure 323 is disposed corresponding to a side of the bending portion 332 connected to the connecting portion 331, and the bending portion 332 is bent along the bending guide structure 323. Thereby, the degree of the bending portion 332 floating out of the surface can be reduced to improve the assembly quality.

[0247] Depend on Figure 3D It can be seen that the electronic component board 320 may further include a contact 326, and the electrical path 333 may include a first sub-path 327 and a second sub-path 328, wherein the first sub-path 327 and the second sub-path 328 are electrically connected to the first circuit 321 and the second circuit 322 respectively, and the first sub-path 327 and the second sub-path 328 are electrically connected through the contact 326. Thereby, the stability of the flexible circuit 330 can be further improved. Specifically, the first sub-path 327 and the second sub-path 328 can be further gold wires, so as to be completed at one time during the wire bonding process.

[0248] <Fourth embodiment>

[0249] Please refer to Figure 4A and Figure 4B ,in Figure 4A A three-dimensional diagram of a camera module 40 according to a fourth embodiment of the present disclosure is shown. Figure 4B Draw according to Figure 4A An exploded view of the camera module 40 in the fourth embodiment. Figure 4A and Figure 4B It can be seen that the camera module 40 includes a photosensitive element module 41 (indicated at Figure 4D ) and an imaging lens 42, wherein the imaging lens 42 and the photosensitive element module 41 are arranged opposite to each other.

[0250] Please refer to FIG. 4C to FIG. 4E ,in Figure 4C Draw according to Figure 4B A partial enlarged view of the camera module 40 in the fourth embodiment, Figure 4D Draw according to Figure 4A The exploded view of the photosensitive element module 41 in the fourth embodiment, Figure 4E Draw according to Figure 4A Partial exploded view of the photosensitive element module 41 in the fourth embodiment. FIG. 4A to FIG. 4EIt can be seen that the photosensitive element module 41 includes an electronic element group (not shown), and the electronic element group includes a first electronic element 411, a second electronic element 412, an electronic element board 420 and a flexible circuit 430, wherein the second electronic element 412 is spaced apart from the first electronic element 411, the first electronic element 411 and the second electronic element 412 are disposed on the electronic element board 420, and the flexible circuit 430 is disposed on the electronic element board 420. In detail, the first electronic element 411 can be a photosensitive element, and the second electronic element 412 can be an image processing element.

[0251] Depend on Figure 4B and Figure 4D It can be known that the camera module 40 may further include a filter element 43 , wherein the filter element 43 is disposed corresponding to the first electronic element 411 .

[0252] Depend on Figure 4E It can be known that the electronic component board 420 includes a first circuit 421 and a second circuit 422 , wherein the first circuit 421 and the second circuit 422 are respectively disposed on opposite sides of the first electronic component 411 , and the first circuit 421 is electrically connected to the first electronic component 411 .

[0253] Depend on Figure 4B , Figure 4C and Figure 4E As can be seen, the flexible circuit 430 includes a connecting portion 431, a bending portion 432, and an electrical path 433. The connecting portion 431 is connected to the electronic component board 420. The bending portion 432 is disposed on a side of the connecting portion 431 away from the first electronic component 411 and the second electronic component 412, and the bending portion 432 is bent along a thickness direction of the electronic component board 420. The electrical path 433 includes a first end 445 and a second end 446, and at least a portion of the electrical path 433 is disposed at the bending portion 432.

[0254] The first end 445 and the second end 446 are electrically connected to the first circuit 421 and the second circuit 422 , respectively. The first end 445 and the second end 446 are electrically connected to the first electronic element 411 and the second electronic element 412 , respectively. The first end 445 and the second end 446 are disposed at the connection portion 431 .

[0255] Depend on FIG. 4B to FIG. 4D It can be known that the photosensitive element module 41 may further include a bracket 460 , wherein the bracket 460 includes a through hole 461 , the through hole 461 is disposed corresponding to the first electronic element 411 and the filter element 43 , and the bending portion 432 is disposed on the bracket 460 .

[0256] Depend on Figure 4CIt can be known that the bracket 460 may further include a bending guide structure 423, wherein the bending guide structure 423 is disposed corresponding to a side of the bending portion 432 connected to the connecting portion 431, and the bending portion 432 bends along the bending guide structure 423. Further, the bending portion 432 bends along a bending direction WD.

[0257] Please refer to Figure 4F and Figure 4G ,in Figure 4F Draw according to Figure 4A A top view of the photosensitive element module 41 in the fourth embodiment, Figure 4G Draw according to Figure 4F A partial enlarged view of the photosensitive element module 41 in the fourth embodiment. FIG. 4E to FIG. 4G It can be known that the connection portion 431 of the flexible circuit 430 may include a plurality of openings, and the openings are respectively a first opening 442 a and a second opening 442 b , wherein the first opening 442 a is disposed opposite to a photosensitive surface IMG of the first electronic component 411 .

[0258] The flexible circuit 430 is opaque, and the first window 442a may include an anti-glare structure 447, and the anti-glare structure 447 may include a plurality of protrusions 447a, wherein the protrusions 447a gradually shrink in the direction close to the photosensitive surface IMG, and the length of the protrusions 447a along the direction close to the first electronic component 411 is L, and the length L is 0.2 mm. In this way, the flexible circuit 430 can block the glare generated by the circuit contacts, and the protrusions 447a can further avoid the glare generated by the reflection from the first window 442a to the photosensitive surface IMG. The protrusions 447a gradually shrink in the direction parallel to the photosensitive surface IMG, and can also further shrink in the direction perpendicular to the photosensitive surface IMG, and the protrusions 447a are continuously arranged along the first window 442a.

[0259] <Fifth embodiment>

[0260] Please refer to Figure 5A and Figure 5B ,in Figure 5A A three-dimensional diagram of a camera module 50 according to a fifth embodiment of the present disclosure is shown. Figure 5B Draw according to Figure 5A A schematic diagram of a camera module 50 in a fifth embodiment. Figure 5A and Figure 5B It can be seen that the camera module 50 includes a photosensitive element module 51 (indicated at Figure 5G ) and an imaging lens 52, wherein the imaging lens 52 and the photosensitive element module 51 are arranged opposite to each other.

[0261] Please refer to Figure 5C to Figure 5G ,in Figure 5C Draw according to Figure 5A A cross-sectional view of a camera module 50 in a fifth embodiment, Figure 5D Draw according to Figure 5C A partial enlarged view of the camera module 50 in the fifth embodiment, Figure 5E Draw according to Figure 5A Another schematic diagram of the camera module 50 in the fifth embodiment, Fig. 5F Draw according to Figure 5A An exploded view of the camera module 50 in the fifth embodiment, Figure 5G Draw according to Figure 5A A top view of the photosensitive element module 51 in the fifth embodiment. FIG. 5A to FIG. 5G It can be seen that the photosensitive element module 51 includes an electronic element group (not shown), and the electronic element group includes a first electronic element 511, a second electronic element 512, an electronic element board 520 and a flexible circuit, wherein the second electronic element 512 is spaced apart from the first electronic element 511, the first electronic element 511 and the second electronic element 512 are disposed on the electronic element board 520, and the flexible circuit is disposed on the electronic element board 520. In detail, the first electronic element 511 can be a photosensitive element, and the second electronic element 512 can be an image processing element.

[0262] Specifically, the flexible circuit includes a first flexible circuit 530 a and a second flexible circuit 530 b , and the first flexible circuit 530 a and the second flexible circuit 530 b are disposed on the electronic component board 520 .

[0263] Depend on Fig. 5F and Figure 5G It can be seen that the electronic component board 520 includes a first circuit 521 and a second circuit 522 , wherein the first circuit 521 and the second circuit 522 are respectively disposed on opposite sides of the first electronic component 511 , and the first circuit 521 is electrically connected to the first electronic component 511 .

[0264] Depend on Figure 5C , Figure 5D and Fig. 5F It can be seen that the first flexible circuit 530a and the second flexible circuit 530b respectively include a connecting portion 531, a bending portion and an electrical path 533. The connecting portion 531 is connected to the electronic component board 520. The bending portion is disposed on a side of the connecting portion 531 away from the first electronic component 511 and the second electronic component 512, and the bending portion is bent along a thickness direction of the electronic component board 520. The electrical path 533 includes a first end 545 and a second end 546, and at least a portion of the electrical path 533 is disposed at the bending portion.

[0265] Specifically, the first flexible circuit 530a includes a first bending portion 532a, and the second flexible circuit 530b includes a second bending portion 532b.

[0266] The first end 545 and the second end 546 are electrically connected to the first circuit 521 and the second circuit 522 , respectively. The first end 545 and the second end 546 are electrically connected to the first electronic element 511 and the second electronic element 512 , respectively. The first end 545 and the second end 546 are disposed at the connection portion 531 .

[0267] Depend on Figure 5C and Figure 5E It can be known that the photosensitive element module 51 may further include a bracket 560 , wherein the bracket 560 includes a through hole (not shown), the through hole is arranged corresponding to the first electronic element 511 , and the first bending portion 532 a and the second bending portion 532 b are arranged on the bracket 560 .

[0268] Depend on Figure 5C and Figure 5D It can be seen that the imaging lens 52 may further include a bending guide structure 523, wherein the bending guide structure 523 and the first bending portion 532a are connected to a side of the connecting portion 531, and the bending guide structure 523 and the second bending portion 532b are connected to a side of the connecting portion 531, and the first bending portion 532a and the second bending portion 532b are bent along the bending guide structure 523.

[0269] Depend on Figure 5B It can be seen that the second bending portion 532b of the second flexible circuit 530b may include a bending auxiliary hole 541 , wherein the bending auxiliary hole 541 is disposed on a side of the second bending portion 532b close to the electronic component board 520 , and the electrical path 533 is disposed around the bending auxiliary hole 541 .

[0270] Depend on Fig. 5F It can be seen that the connection portion 531 of the second flexible circuit 530b may include a plurality of windows, and the windows are respectively a first window 542a and a second window 542b, wherein the first window 542a is arranged opposite to a photosensitive surface of the first electronic component 511, and the second window 542b is arranged opposite to the second electronic component 512.

[0271] Depend on Figures 5B to 5G It can be known that the electronic component assembly may further include a hardness reinforcement plate 551 , wherein the hardness reinforcement plate 551 is disposed on the first bending portion 532 a , and the hardness reinforcement plate 551 is relatively fixed to the electronic component board 520 , the bracket 560 and the imaging lens 52 .

[0272] Please refer to Figure 5H , which is drawn according to Figure 5A A partial enlarged view of the photosensitive element module 51 in the fifth embodiment. Figure 5HIt can be known that the electronic component assembly may further include a multi-layer circuit board 553 , wherein the multi-layer circuit board 553 may include the electronic component board 520 and a first flexible circuit 530 a , and the first flexible circuit 530 a extends from the electronic component board 520 in a direction away from the first electronic component 511 .

[0273] Depend on Fig. 5F and Figure 5H It can be seen that the electronic component board 520 may further include a component corresponding hole 524, a substrate 554, an upper circuit 571, a hard layer 572, a lower circuit 573 and a connecting wire 574, wherein the first electronic component 511 is arranged in the component corresponding hole 524 and the substrate 554, the first flexible circuit 530a is arranged between the hard layer 572, the hard layer 572 is respectively arranged in the upper circuit 571 and the lower circuit 573, and the connecting wire 574 connects the upper circuit 571 and the first electronic component 511.

[0274] <Sixth embodiment>

[0275] Please refer to Fig. 6A and Figure 6B ,in Fig. 6A A three-dimensional diagram of an electronic device 60 according to a sixth embodiment of the present disclosure is shown. Figure 6B Draw according to Fig. 6A A schematic diagram of an electronic device 60 in the sixth embodiment. Fig. 6A and Figure 6B It can be seen that the electronic device 60 is a smart phone, wherein the electronic device 60 can also be a notebook computer, a tablet computer, a driving recorder, etc., but not limited thereto. The electronic device 60 includes a camera module and an image capture control interface 610. Further, the camera module can be the camera module of the first embodiment to the fifth embodiment described above, but the present disclosure is not limited thereto.

[0276] In the sixth embodiment, the camera modules are respectively a front camera module 621, a wide-angle camera module 622, a telephoto camera module 623, an ultra-wide-angle camera module 624, a macro camera module 625 and a TOF module (Time-Of-Flight) 626, wherein the TOF module 626 may also be other types of camera modules and is not limited to this configuration.

[0277] Specifically, in the sixth embodiment, the front camera module 621 and the TOF module 626 are disposed on the front side of the electronic device 60 , while the wide-angle camera module 622 , the telephoto camera module 623 , the ultra-wide-angle camera module 624 and the macro camera module 625 are disposed on the back side of the electronic device 60 .

[0278] The image capture control interface 610 may be a touch screen, which is used to display images and has a touch function, and can be used to manually adjust the shooting angle. Specifically, the image capture control interface 610 includes an image playback button 611, a camera module switching button 612, a focus and photo button 613, an integrated menu button 614, and a zoom control button 615. Specifically, the user enters the shooting mode through the image capture control interface 610 of the electronic device 60. The camera module switching button 612 can freely switch to use one of the front camera module 621, wide-angle camera module 622, telephoto camera module 623, ultra-wide-angle camera module 624 and macro camera module 625 for shooting. The zoom control button 615 is used to adjust the zoom. The focus and photo button 613 is used to capture images after taking a good view and confirming one of the front camera module 621, wide-angle camera module 622, telephoto camera module 623, ultra-wide-angle camera module 624 and macro camera module 625. The image playback button 611 allows the user to view the photos after capturing. The integrated menu button 614 is used to adjust the details of the image capture (such as timed photography, photo ratio, etc.).

[0279] The electronic device 60 may further include a reminder light 63 , which is disposed on the front of the electronic device 60 and can be used to remind the user of unread messages, missed calls and the status of the phone.

[0280] Furthermore, after the user enters the shooting mode through the imaging control interface 610 of the electronic device 60, the camera module collects imaging light on the photosensitive element and outputs electronic signals related to the image to the image signal processor (not shown) of the single-chip system 65, wherein the single-chip system 65 may also include a random access memory (RAM) (not shown), a central processing unit (not shown) and a storage unit (Storage Unit) (not shown), and may also include but not be limited to a display unit (Display), a control unit (Control Unit), a read-only memory (ROM) or a combination thereof.

[0281] Furthermore, the electronic device 60 may further include an image software processor and an image signal processor, and may further integrate the image software processor, the image signal processor, a position locator, a transmission signal processor, a gyroscope, a storage unit and a random access memory into a single chip system 65 .

[0282] In response to the camera specifications of the electronic device 60, the electronic device 60 may further include an optical image stabilization component (not shown in the figure). Furthermore, the electronic device 60 may further include at least one auxiliary focus element 66 and at least one sensing element (not shown in the figure). The auxiliary focus element 66 may include a light emitting element 661 that compensates for color temperature, an infrared ranging element (not shown in the figure), a laser focus module (not shown in the figure), etc. The sensing element may have the function of sensing physical momentum and actuation energy, such as an accelerometer, a gyroscope, a Hall Effect Element, a position locator, and a transmission signal processor to sense the shaking and jitter imposed by the user's hand or the external environment, thereby facilitating the automatic focus function and the optical image stabilization component configured in the camera module of the electronic device 60 to obtain good imaging quality, and helping the electronic device 60 according to the present disclosure to have multiple modes of shooting functions, such as optimized Selfie, low-light HDR (High Dynamic Range, high dynamic range imaging), high-resolution 4K (4K Resolution) video recording, etc. In addition, the user can directly view the shooting screen of the camera through the image capture control interface 610 and manually operate the viewfinder range on the image capture control interface 610 to achieve a what-you-see-is-what-you-get auto focus function.

[0283] Further, the camera module, optical image stabilization component, sensor element, auxiliary focus element 66 and electronic element 642 can be arranged on an electronic component board 64, and electrically connected to image signal processor and other related components through connector 641 to execute the shooting process, wherein the electronic component board 64 can be a flexible printed circuit board (Flexible Printed Circuitboard, FPC). Current electronic devices such as smart phones have a trend of being thin and light. The camera module and related components are arranged on the electronic component board, and the circuit is integrated to the main board of the electronic device by using a connector, which can meet the requirements of the mechanism design and circuit layout of the limited space inside the electronic device and obtain a greater margin, and also make the automatic focus function of its camera module more flexible through the touch screen of the electronic device. In the sixth embodiment, the sensor element and the auxiliary focus element 66 are arranged on the electronic component board 64 and at least one other flexible circuit board (not shown in the figure), and are electrically connected to the imaging signal processing element and other related components through the corresponding connector to execute the shooting process. In other embodiments (not shown in the figure), the sensor element and the auxiliary optical element can also be arranged on the main board of the electronic device or other forms of carrier according to the requirements of the mechanism design and circuit layout.

[0284] Furthermore, the wide-angle camera module 622 can capture images with high pixels within a certain range, and has the function of high resolution and low distortion. The imaging result of the telephoto camera module 623 may have a smaller viewing angle and depth of field than the wide-angle camera module 622, and can be used to capture moving targets, that is, the actuator (not shown) of the electronic device 60 can drive the telephoto camera module 623 to quickly and continuously auto focus on the target, so that the target object is not blurred due to being far away from the focus position. The imaging result of the ultra-wide-angle camera module 624 may have a larger viewing angle and depth of field than the wide-angle camera module 622, but it is often accompanied by greater distortion.

[0285] Specifically, by using camera modules with different focal lengths to frame and combining with image processing technology, the zoom function can be implemented in the electronic device 60 .

[0286] <Seventh embodiment>

[0287] Please refer to Figure 7 , which is a schematic diagram showing an electronic device applied to a drone 70 according to the seventh embodiment of the present disclosure. Figure 7 It can be known that the electronic device (not shown) includes a camera module. Further, the camera module can be the camera module of the first to fifth embodiments described above, but the present disclosure is not limited thereto.

[0288] In the seventh embodiment, the camera modules are respectively a front camera module 71 a and a side camera module 71 b .

[0289] Specifically, the front camera module 71a is disposed at the front end of the drone 70, and the side camera module 71b is disposed at the side of the drone 70. In this way, the electronic device can cope with complex ambient light.

[0290] <Eighth Embodiment>

[0291] Please refer to Figure 8 , which is a schematic diagram showing an electronic device applied to a car 80 according to an eighth embodiment of the present disclosure. Figure 8 It can be known that the electronic device (not shown) includes a camera module. Further, the camera module can be the camera module of the first to fifth embodiments described above, but the present disclosure is not limited thereto.

[0292] In the eighth embodiment, the camera modules are respectively a front camera module 81 a , a side camera module 81 b , and a rear camera module 81 c .

[0293] The front camera module 81a, the side camera module 81b and the rear camera module 81c are respectively disposed at the front, side and rear of the car 80, so as to help the driver obtain external space information outside the car 80, such as external space information I1, I2, I3, I4, but not limited thereto. In this way, more viewing angles can be provided to reduce blind spots, thereby helping to improve driving safety.

[0294] <Ninth embodiment>

[0295] Please refer to Fig. 9 , which is a schematic diagram showing an electronic device applied to a computer 90 according to a ninth embodiment of the present disclosure. Fig. 9 It can be known that the electronic device (not shown) includes a camera module. Further, the camera module can be the camera module of the first to fifth embodiments described above, but the present disclosure is not limited thereto.

[0296] In the ninth embodiment, the camera modules are respectively a video camera module 91 a and an infrared camera module 91 b , wherein the video camera module 91 a and the infrared camera module 91 b are both disposed on the front side of the computer 90 .

[0297] <Tenth embodiment>

[0298] Please refer to Fig.10 , which illustrates a schematic diagram of an electronic device applied to a wearable device 1000 according to the tenth embodiment of the present disclosure. Fig.10 It can be known that the electronic device (not shown) includes a camera module. Further, the camera module can be the camera module of the first embodiment to the fifth embodiment described above, but the present disclosure is not limited thereto.

[0299] In the tenth embodiment, the camera module is a video camera module 1010 , wherein the video camera module 1010 is disposed on the front side of the wearable device 1000 .

[0300] Although the present invention has been disclosed as above by means of implementation modes and examples, they are not intended to limit the present invention. Any person having ordinary knowledge in the technical field may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the definition of the attached claims.

Claims

1. An electronic component assembly, characterized in that: Include: a first electronic component; an electronic component board, the first electronic component is disposed on the electronic component board, and the electronic component board comprises a first circuit and a second circuit, wherein the first circuit and the second circuit are respectively disposed on opposite sides of the first electronic component, and the first circuit is electrically connected to the first electronic component; and A flexible circuit is disposed on the electronic component board, and the flexible circuit comprises: a connecting portion, connected to the electronic component board; a bending portion, disposed on a side of the connecting portion away from the first electronic component, and bent along a thickness direction of the electronic component board; and An electrical path includes a first end and a second end, and at least a portion of the electrical path is disposed at the bending portion, wherein the first end and the second end are electrically connected to the first circuit and the second circuit respectively, and the first end and the second end are disposed at the connecting portion.

2. The electronic component assembly according to claim 1, wherein: The bending portion is relatively fixed to the electronic component board.

3. The electronic component assembly according to claim 2, wherein: Also includes: A hardness reinforcement plate is arranged on the bending portion, and the hardness reinforcement plate is relatively fixed to the electronic component board.

4. The electronic component assembly according to claim 1, wherein: The electronics board also contains: A bending guide structure is arranged corresponding to a side of the bending portion connected to the connecting portion, and the bending portion is bent along the bending guide structure.

5. The electronic component assembly according to claim 1, wherein: The dimension of the bending portion in the thickness direction of the electronic component board is less than or equal to the dimension of the bending portion in a thickness direction perpendicular to the thickness direction of the electronic component board and perpendicular to the bending portion.

6. The electronic component assembly according to claim 1, wherein: The bending portion comprises: A bending auxiliary hole is arranged on a side of the bending portion close to the electronic component board, and the electrical path is arranged around the bending auxiliary hole; The dimension of the bending auxiliary hole in the thickness direction of the electronic component board is less than or equal to the dimension of the bending auxiliary hole in a thickness direction perpendicular to the thickness direction of the electronic component board and perpendicular to the bending portion.

7. The electronic component assembly according to claim 1, wherein: Also includes: A shape maintaining element is arranged corresponding to a side of the bending portion connected to the connecting portion, and the shape maintaining element is relatively fixed to the electronic component board.

8. The electronic component assembly according to claim 1, wherein: The connecting portion of the flexible circuit comprises: A window is arranged opposite to the first electronic component.

9. The electronic component assembly according to claim 1, wherein: Also includes: A multi-layer circuit board comprises the electronic component board and the flexible circuit, wherein the flexible circuit extends from the electronic component board in a direction away from the first electronic component.

10. The electronic component assembly according to claim 1, wherein: The electronics board also contains: A component corresponding hole, the first electronic component is arranged in the component corresponding hole.

11. The electronic component assembly according to claim 1, wherein: Also includes: a second electronic component, disposed on the electronic component board, and the second electronic component is electrically connected to the second circuit; The electronic component board further includes a third circuit, and the third circuit is electrically connected to the first electronic component and the second electronic component.

12. The electronic component assembly according to claim 1, wherein: The electronic component board also includes a contact; The electrical path includes a first sub-path and a second sub-path, the first sub-path and the second sub-path are electrically connected to the first circuit and the second circuit respectively, and the first sub-path and the second sub-path are electrically connected through the contact.

13. The electronic component assembly according to claim 1, wherein: The bent portion does not include other electronic components.

14. A photosensitive element module, characterized in that: Include: The electronic component assembly as claimed in claim 1; Wherein, the first electronic element is a photosensitive element.

15. The photosensitive element module according to claim 14, wherein: Also includes: A bracket including a through hole; The through hole is arranged corresponding to the photosensitive element, and the bending portion is arranged on the bracket.

16. The photosensitive element module according to claim 15, characterized in that: The electronic component set also includes: A hardness reinforcement plate is arranged on the bending portion, and the hardness reinforcement plate is relatively fixed to the bracket.

17. The photosensitive element module according to claim 15, wherein: The bracket also contains: A bending guide structure is arranged corresponding to a side of the bending portion connected to the connecting portion, and the bending portion is bent along the bending guide structure.

18. The photosensitive element module according to claim 14, wherein: The connecting portion of the flexible circuit includes an opening, and the opening is arranged opposite to a photosensitive surface of the photosensitive element; The flexible circuit is opaque, the opening comprises a plurality of protrusions, the plurality of protrusions gradually shrink towards the direction approaching the photosensitive surface, and the length of the plurality of protrusions along the direction approaching the photosensitive element is between 0.08 mm and 0.43 mm.

19. A camera module, characterized in that: Include: The photosensitive element module as claimed in claim 14; and An imaging lens is arranged opposite to the photosensitive element.

20. The camera module according to claim 19, wherein: The imaging lens defines an imaging lens height from the photosensitive element in the thickness direction of the electronic component board, and the bending portion of the flexible circuit defines a bending portion height from the photosensitive element in the thickness direction of the electronic component board; Wherein, the height of the imaging lens is greater than or equal to the height of the bending portion.

21. The camera module according to claim 19, wherein: The electronic component set also includes: A hardness reinforcement plate is arranged on the bending portion, and the hardness reinforcement plate is relatively fixed to the imaging lens.

22. The camera module according to claim 19, wherein: The imaging lens includes: A bending guide structure is arranged corresponding to a side of the bending portion connected to the connecting portion, and the bending portion is bent along the bending guide structure.

23. The camera module of claim 19, wherein: The bending portion of the flexible circuit is light-proof and includes a shielding area, which is arranged on a side of the bending portion away from the connecting portion, and the shielding area is arranged corresponding to the image height of the imaging lens.

24. An electronic device, characterized in that: Include: The camera module of claim 19.

25. An electronic component assembly, characterized in that: Include: a first electronic component; a second electronic component, spaced apart from the first electronic component; an electronic component board, the first electronic component and the second electronic component are disposed on the electronic component board; and A flexible circuit is disposed on the electronic component board, and the flexible circuit comprises: a connecting portion, connected to the electronic component board; a bending portion, disposed on a side of the connecting portion away from the first electronic component and the second electronic component, and the bending portion is bent along a thickness direction of the electronic component board; and An electrical path includes a first end and a second end, and at least a portion of the electrical path is disposed at the bending portion, wherein the first end and the second end are electrically connected to the first electronic component and the second electronic component respectively, and the first end and the second end are disposed at the connecting portion.

26. The electronic component assembly according to claim 25, characterized in that: Also includes: A hardness reinforcement plate is arranged on the bending portion, and the hardness reinforcement plate is relatively fixed to the electronic component board.

27. The electronic component assembly according to claim 25, wherein: The dimension of the bending portion in the thickness direction of the electronic component board is less than or equal to the dimension of the bending portion in a thickness direction perpendicular to the thickness direction of the electronic component board and perpendicular to the bending portion.

28. The electronic component assembly according to claim 25, characterized in that: The bending portion comprises: A bending auxiliary hole is arranged on a side of the bending portion close to the electronic component board, and the electrical path is arranged around the bending auxiliary hole; The dimension of the bending auxiliary hole in the thickness direction of the electronic component board is less than or equal to the dimension of the bending auxiliary hole in a thickness direction perpendicular to the thickness direction of the electronic component board and perpendicular to the bending portion.

29. The electronic component assembly according to claim 25, wherein: Also includes: A multi-layer circuit board comprises the electronic component board and the flexible circuit, wherein the flexible circuit extends from the electronic component board in a direction away from the first electronic component.

30. The electronic component assembly according to claim 25, wherein: The electronics board also contains: A component corresponding hole, the first electronic component is arranged in the component corresponding hole.

31. A photosensitive element module, characterized in that: Include: The electronic component assembly as claimed in claim 25; Wherein, the first electronic element is a photosensitive element.

32. The photosensitive element module according to claim 31, wherein: The connecting portion of the flexible circuit includes an opening, and the opening is arranged opposite to a photosensitive surface of the photosensitive element; The flexible circuit is opaque, the opening comprises a plurality of protrusions, the plurality of protrusions gradually shrink towards the direction approaching the photosensitive surface, and the length of the plurality of protrusions along the direction approaching the photosensitive element is between 0.08 mm and 0.43 mm.

33. A camera module, characterized in that: Include: The photosensitive element module as claimed in claim 31; and An imaging lens is arranged opposite to the photosensitive element.

34. The camera module of claim 33, wherein: The imaging lens defines an imaging lens height from the photosensitive element in the thickness direction of the electronic component board, and the bending portion of the flexible circuit defines a bending portion height from the photosensitive element in the thickness direction of the electronic component board; Wherein, the height of the imaging lens is greater than or equal to the height of the bending portion.

35. An electronic device, characterized in that: Include: The camera module of claim 33.

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