Flexible circuit board, electric connection assembly and manufacturing method of electric connection assembly

By distinguishing crimped gold fingers from non-crunched gold fingers on a flexible circuit board, and using the detection module to identify the appearance characteristics of the gold fingers, the accuracy of the crimped equipment when crimping terminals is solved, achieving higher aesthetics and strength.

CN119815684APending Publication Date: 2025-04-11ZHUHAI ALL WINNER FPC
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Patent Information

Application Number
CN202411934307.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-25
Publication Date
2025-04-11

AI Technical Summary

Technical Problem

When using a crimping device to crimp the terminal on the gold finger, it is easy to cause the problem of crimping the upper terminal for non-crimping gold fingers or the gold fingers for crimping leakage of pressure terminals.

Method used

A flexible circuit board is designed that includes crimped gold fingers and non-crunched gold fingers, both of which are different in appearance characteristics. The detection module recognizes the appearance characteristics of the gold finger, ensuring that the terminals are accurately crimped on the crimped gold finger.

Benefits of technology

It effectively avoids the problem of crimping the upper terminal of non-crimping gold fingers or crimping gold finger leaking pressure terminals, and improves the accuracy and overall aesthetics and strength of crimping equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention belongs to the technical field of flexible circuit boards, and particularly provides a flexible circuit board, an electric connection assembly and a manufacturing method of the electric connection assembly, the electric connection assembly comprises a terminal and the flexible circuit board, the flexible circuit board comprises a base material layer, one side of the base material layer is provided with a line, a crimping golden finger and a non-crimping golden finger, and the non-crimping golden finger is arranged on the other side of the base material layer. The crimping golden fingers are electrically connected with the circuit, the non-crimping golden fingers are insulated from the circuit, and the appearance characteristics of the crimping golden fingers are different from the appearance characteristics of the non-crimping golden fingers. Through the difference of appearance characteristics of the crimped golden fingers and the non-crimped golden fingers, the appearance characteristics of the golden fingers can be detected by using a detection module when a terminal is automatically crimped on the golden fingers by using crimping equipment, so that the crimped golden fingers in the golden fingers can be identified; therefore, the terminal can be accurately crimped on the crimping golden finger by the crimping equipment, and the problem that the non-crimping golden finger crimps the terminal or the crimping golden finger does not press the terminal is avoided.
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Description

Technical Field

[0001] The present application belongs to the technical field of flexible circuit boards, and specifically relates to a flexible circuit board, an electrical connection component, and a method for manufacturing the electrical connection component. Background Art

[0002] Traditional tin-soldered plug-in connectors have poor reliability and are easily affected by the vibration of the car during driving, which may cause the welding position to crack. The use of crimping terminals and gold fingers of flexible circuit boards will be the main development direction of connectors for new energy battery flexible circuit boards. While making gold fingers for crimping on flexible circuit boards, non-crimping gold fingers are often also made to improve the overall aesthetics or strength. However, when using crimping equipment to automatically crimp the terminal on the gold fingers, there is often a problem of non-crimping gold fingers crimping the terminal, or the crimping gold fingers missing the terminal. Summary of the invention

[0003] The purpose of the present application is to provide a flexible circuit board, an electrical connection component and a method for manufacturing an electrical connection component, aiming to solve the technical problems in the prior art that when a terminal is crimped onto a gold finger using a crimping device, a gold finger that is not used for crimping is crimped onto the terminal, or a gold finger used for crimping misses the terminal.

[0004] In the first aspect, in order to achieve the above-mentioned purpose, the technical solution adopted in the present application is: a flexible circuit board, including a substrate layer, on one side of the substrate layer are arranged circuits, crimped gold fingers and non-crimped gold fingers, the crimped gold fingers are electrically connected to the circuits, the non-crimped gold fingers are insulated from the circuits, and the appearance characteristics of the crimped gold fingers are different from the appearance characteristics of the non-crimped gold fingers.

[0005] Compared with the prior art, the beneficial effect of the flexible circuit board provided by the present application is that the crimping gold fingers electrically connected to the circuit are used to crimp with the terminal for conductivity, and the non-crimping gold fingers insulated from the circuit are not crimped with the terminal, which is used to improve the overall aesthetics and strength. By using the difference in appearance characteristics between the crimping gold fingers and the non-crimping gold fingers, when the terminal is automatically crimped on the gold fingers using the crimping equipment, the appearance characteristics of the gold fingers can be detected by the detection module to identify the crimping gold fingers in the gold fingers, thereby ensuring that the crimping equipment accurately crimps the terminal on the crimping gold fingers, avoiding the problem of non-crimping gold fingers crimping on the terminal, or crimping gold fingers missing the terminal.

[0006] Furthermore, the substrate layer has a first outer edge, and the crimped gold finger and the non-crimped gold finger are both located between the first outer edge and the circuit, and are arranged in parallel and spaced apart along the length direction of the first outer edge, and the distance between the end of the crimped gold finger away from the circuit and the first outer edge is smaller than the distance between the end of the non-crimped gold finger away from the circuit and the first outer edge.

[0007] Furthermore, there are multiple crimping gold fingers, which are arranged in parallel and spaced apart along the length direction of the first outer shape edge, and the distance between one end of each crimping gold finger close to the first outer shape edge and the first outer shape edge is equal.

[0008] Furthermore, the distance between one end of the crimped gold finger close to the first outer edge and the first outer edge is 0.3-0.6 mm, and the distance between one end of the non-crimped gold finger close to the first outer edge and the first outer edge is greater than or equal to 2 mm.

[0009] Furthermore, the shape of one end of the crimped gold finger close to the first outer shape edge is different from the shape of one end of the non-crimped gold finger close to the first outer shape edge.

[0010] Further, the substrate layer includes a main body and a protruding portion, the circuit is arranged on the main body, the protruding portion is flush with the main body, one side of the protruding portion is connected to the main body, and the other side of the protruding portion has a first outer shape edge;

[0011] The protrusion includes a base and a filling part, the base is connected to the filling part on at least one of the two opposite sides in the length direction of the first outer edge, a crimping gold finger is arranged on the base, and a non-crimping gold finger is arranged on the filling part.

[0012] Furthermore, the flexible circuit board also includes a back reinforcement layer, which is arranged on the side of the base material layer facing away from the crimping gold fingers, and the back reinforcement layer and the crimping gold fingers correspond to each other in the thickness direction of the flexible circuit board.

[0013] Furthermore, the substrate layer has a first outer edge, and the flexible circuit board also includes a conductive layer and a front covering layer. The conductive layer is arranged on the side of the substrate layer facing away from the back reinforcement layer. The conductive layer includes circuits, crimped gold fingers and non-crimped gold fingers. The crimped gold fingers and non-crimped gold fingers are arranged in parallel and spaced apart along the length direction of the first outer edge. The front covering layer is arranged on the side of the conductive layer facing away from the substrate layer. The front covering layer covers the circuit, and an end of the front covering layer close to the first outer edge covers an end of the crimped gold finger away from the first outer edge, and an end of the back reinforcement layer away from the first outer edge overlaps with an end of the front covering layer close to the first outer edge.

[0014] In the second aspect, in order to achieve the above-mentioned purpose, the technical solution adopted in the present application is: an electrical connection component, including a terminal and the above-mentioned flexible circuit board, and the terminal is crimped with a crimping gold finger.

[0015] Compared with the prior art, the beneficial effect of the electrical connection assembly provided by the present application is that: the above-mentioned flexible circuit board is adopted, and the difference in appearance characteristics between the crimped gold fingers and the non-crimped gold fingers is utilized so that when the crimping equipment is used to automatically crimp the terminal on the gold fingers, the detection module can be used to detect the appearance characteristics of the gold fingers to identify the crimped gold fingers among the gold fingers, thereby ensuring that the crimping equipment accurately crimps the terminal on the crimped gold fingers, avoiding the problem of non-crimped gold fingers crimping the terminals, or crimping the gold fingers missing the terminals.

[0016] In the third aspect, in order to achieve the above-mentioned purpose, the technical solution adopted by the present application is: a method for manufacturing an electrical connection component, comprising:

[0017] Provide a crimping device, a terminal and the above-mentioned flexible circuit board, the crimping device includes a crimping module, a detection module and a control module, and the crimping module and the detection module are both electrically connected to the control module;

[0018] The detection module detects the appearance features of the gold fingers to identify the crimped gold fingers among the gold fingers, and sends the detection results to the control module;

[0019] The crimping module crimps the terminal onto the crimping gold finger under the control of the control module.

[0020] Compared with the prior art, the beneficial effect of the manufacturing method of the electrical connection assembly provided by the present application is that when using a crimping device to automatically crimp the terminal onto the gold finger, the appearance characteristics of the gold finger are first detected by the detection module to identify the crimped gold finger among the gold fingers, and the detection result is sent to the control module. Then, the crimping module accurately crimps the terminal onto the crimped gold finger under the control of the control module, thereby avoiding the problem of crimping a terminal onto a non-crimped gold finger or missing a terminal onto a crimped gold finger. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 A partial schematic diagram of a flexible circuit board provided in an embodiment of the present application;

[0023] Figure 2 for Figure 1 An enlarged view of the flexible circuit board at point A shown;

[0024] Figure 3 for Figure 1An enlarged view of the flexible circuit board at B shown;

[0025] Figure 4 for Figure 1 A partial cross-sectional view of the flexible circuit board shown;

[0026] Figure 5 A flowchart of the steps of a method for manufacturing an electrical connection assembly provided in an embodiment of the present application.

[0027] Among them, the reference numerals in the figure are:

[0028] 10. substrate layer; 11. main body; 12. protrusion; 121. first outer edge; 122. base; 123. first filling part; 124. second filling part; 13. substrate adhesive layer; 14. substrate PI layer;

[0029] 20. Conductive layer; 21. Circuit; 22. Crimp gold finger; 23. Non-crimp gold finger;

[0030] 30. Back reinforcement layer; 31. Reinforced adhesive layer; 32. Reinforced PI layer;

[0031] 40. front covering layer; 41. covering film adhesive layer; 42. covering film PI layer. DETAILED DESCRIPTION

[0032] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0033] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0035] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] Combination Figure 1 and Figure 2 As shown, an embodiment of the present application provides a flexible circuit board, including a substrate layer 10, on one side of the substrate layer 10 are arranged a circuit 21, a crimped gold finger 22 and a non-crimped gold finger 23, the crimped gold finger 22 is electrically connected to the circuit 21, the non-crimped gold finger 23 is insulated from the circuit 21, and the appearance characteristics of the crimped gold finger 22 are different from the appearance characteristics of the non-crimped gold finger 23.

[0037] Gold fingers refer to conductive contacts arranged at the edge of a circuit board. The surface of the contacts is gold-plated and the shape is similar to a finger, so they are called gold fingers. The crimped gold fingers 22 electrically connected to the circuit 21 are used to crimp with the terminal for conductivity. The non-crimped gold fingers 23 insulated from the circuit 21 are not crimped with the terminal, and are used to improve the overall aesthetics and strength. By distinguishing the difference in appearance features between the crimped gold fingers 22 and the non-crimped gold fingers 23, when the terminal is automatically crimped on the gold fingers using a crimping device, the appearance features of the gold fingers can be detected using a detection module to identify the crimped gold fingers 22 in the gold fingers, thereby ensuring that the crimping device accurately crimps the terminal on the crimped gold fingers 22, and avoiding the problem of the non-crimped gold fingers 23 crimping on the terminal, or the crimped gold fingers 22 missing the terminal.

[0038] The appearance features of the gold finger include length, width, thickness, shape, color, etc. The difference between the crimped gold finger 22 and the non-crimped gold finger 23 can be reflected in one or more of the above features.

[0039] In one embodiment, in combination Figure 1 and Figure 2 As shown, the substrate layer 10 has a first outer edge 121, and the crimped gold finger 22 and the non-crimped gold finger 23 are both located between the first outer edge 121 and the circuit 21, and are arranged in parallel and spaced apart along the length direction of the first outer edge 121. The distance a between the end of the crimped gold finger 22 away from the circuit 21 and the first outer edge 121 is smaller than the distance b between the end of the non-crimped gold finger 23 away from the circuit 21 and the first outer edge 121.

[0040] When the terminal is automatically crimped onto the gold finger using the crimping device, the detection module is moved linearly along the length direction of the first outer edge 121 of the substrate layer 10. When the detection module recognizes the existence of the gold finger, the crimping device automatically crimps the terminal onto the gold finger. Since the distance a between the end of the crimped gold finger 22 away from the circuit 21 and the first outer edge 121 is smaller than the distance b between the end of the non-crimped gold finger 23 away from the circuit 21 and the first outer edge 121, by controlling the recognition area c of the detection module between the non-crimped gold finger 23 and the first outer edge 121, it can be ensured that the detection module only recognizes the crimped gold finger 22 and avoids recognizing the non-crimped gold finger 23 during the linear movement along the length direction of the first outer edge 121, thereby avoiding the problem of the non-crimped gold finger 23 crimping the terminal or the crimped gold finger 22 missing the terminal.

[0041] In one embodiment, Figure 1 As shown, there are multiple crimping gold fingers 22, and the multiple crimping gold fingers 22 are arranged in parallel and spaced apart along the length direction of the first outer shape edge 121, and the distance between one end of each crimping gold finger 22 close to the first outer shape edge 121 and the first outer shape edge 121 is equal. By keeping the distance between one end of each crimping gold finger 22 close to the first outer shape edge 121 and the first outer shape edge 121 uniform, it is ensured that when the detection module moves linearly along the length direction of the first outer shape edge 121, each crimping gold finger 22 can be identified in sequence without omission, thereby ensuring that each crimping gold finger 22 can be successfully crimped onto the terminal.

[0042] In one embodiment, the distance a between the end of the crimping gold finger 22 close to the first outer edge 121 and the first outer edge 121 is 0.3-0.6 mm, and the distance b between the end of the non-crimping gold finger 23 close to the first outer edge 121 and the first outer edge 121 is greater than 2 mm. When the substrate layer 10 is punched out, there is generally a deviation of 0.1-0.15 mm. By controlling the distance a between the end of the crimping gold finger 22 close to the first outer edge 121 and the first outer edge 121 to be 0.3-0.6 mm, it is possible to avoid damaging the crimping gold finger 22 when the substrate layer 10 is punched out. By making the distance b between the end of the non-crimping gold finger 23 close to the first outer edge 121 and the first outer edge 121 greater than or equal to 2 mm, it is possible to form a sufficient distance to avoid the recognition area c of the detection module, thereby preventing the detection module from recognizing the non-crimping gold finger 23.

[0043] In one embodiment, Figure 2As shown, the shape of the end of the crimping gold finger 22 close to the first outer edge 121 is different from the shape of the end of the non-crimping gold finger 23 close to the first outer edge 121. In terms of program design, when the detection module identifies that the shape of the gold finger is the shape of the crimping gold finger 22, the crimping device performs the action of crimping the terminal on the gold finger. When the detection module identifies that the shape of the gold finger is not the shape of the crimping gold finger 22, or the shape of the non-crimping gold finger 23, the crimping device does not perform the action of crimping the terminal on the gold finger. In this way, even if the non-crimping gold finger 23 enters the recognition area c of the detection module and is detected due to the deviation of the moving direction of the detection module or the deviation of the positioning position of the flexible circuit board, the crimping device will not perform the action of crimping the terminal on the non-crimping gold finger 23, thereby greatly improving the accuracy of the crimping terminal and ensuring that the terminal will only be crimped on the crimping gold finger 22, but not on the non-crimping gold finger 23.

[0044] Specifically, the end of the crimping gold finger 22 near the first outer edge 121 is square, and the end of the non-crimping gold finger 23 near the first outer edge 121 has an arc-shaped or V-shaped outer contour line. By designing the end of the crimping gold finger 22 near the first outer edge 121 to be square, and designing the end of the non-crimping gold finger 23 near the first outer edge 121 to be an arc-shaped or V-shaped outer contour line, the shapes of the two are obviously different, so that it is convenient for the detection module to distinguish the crimping gold finger 22 from the non-crimping gold finger 23. Of course, in some other embodiments, the shapes of the two can be interchangeable, that is, the end of the crimping gold finger 22 near the first outer edge 121 has an arc-shaped or V-shaped outer contour line, and the end of the non-crimping gold finger 23 near the first outer edge 121 is square. In addition to the shapes exemplified above, the end of the crimping gold finger 22 near the first outer edge 121 and the end of the non-crimping gold finger 22 near the first outer edge 121 can also be other shapes, and the specific shapes are not limited, as long as the two can form a difference to facilitate the detection module to identify.

[0045] In one embodiment, the width of the non-crimped gold finger 23 is different from the width of the crimped gold finger 22. The width of the non-crimped gold finger 23 and the width of the crimped gold finger 22 both refer to the dimensions along the length direction of the first outer edge 121. The width of the non-crimped gold finger 23 may be greater than the width of the crimped gold finger 22, or may be less than the width of the crimped gold finger 22. Exemplarily, the width of the non-crimped gold finger 23 is greater than the width of the crimped gold finger 22. In terms of program design, when the width of the pattern of the gold finger identified by the detection module is less than a certain value, it is judged as the crimped gold finger 22, and the crimping device performs the action of crimping the terminal on the gold finger. When the width of the pattern of the gold finger identified by the detection module is greater than a certain value, it is judged as the non-crimped gold finger 23, and the crimping device does not perform the action of crimping the terminal on the gold finger. In this way, even if the non-crimped gold finger 23 enters the identification area c of the detection module and is detected due to the deviation of the moving direction of the detection module or the deviation of the positioning position of the flexible circuit board, the crimping device will not perform the action of crimping the terminal on the non-crimped gold finger 23, thereby greatly improving the accuracy of the crimped terminal and ensuring that the terminal will only be crimped on the crimped gold finger 22, and not on the non-crimped gold finger 23. Specifically, the width of the non-crimped gold finger 23 can differ from the width of the crimped gold finger 22 by 1.5 times or more. In actual applications, when the number of non-crimped gold fingers 23 originally designed is multiple, and there are two adjacent non-crimped gold fingers 23, the two adjacent non-crimped gold fingers 23 can be merged into one, which can not only achieve the purpose of increasing the width of the non-crimped gold fingers 23, but also reduce the difficulty of production.

[0046] In one embodiment, in combination Figure 1 and Figure 3As shown, the substrate layer 10 includes a main body 11 and a protrusion 12, the circuit 21 is arranged on the main body 11, the protrusion 12 is flush with the main body 11, one side of the protrusion 12 is connected to the main body 11, and the other side of the protrusion 12 forms a first outer edge 121; the protrusion 12 includes a base 122 and a filling part, the base 122 is connected to the filling part on at least one of the two opposite sides in the length direction of the first outer edge 121, the base 122 is provided with a crimping gold finger 22, and the filling part is provided with a non-crimping gold finger 23. When making a connector, after the terminal and the gold finger are crimped, the end of the flexible circuit board provided with the gold finger needs to be inserted into the connector female groove, but the width of the end of the flexible circuit board provided with the gold finger is usually smaller than the width of the connector female groove, and there is space for left and right movement, which affects the quality of the product. The present application provides a filler portion on at least one of the two opposite sides of the base 122, so that the overall width of the protrusion 12 is adapted to the width of the connector female groove, thereby preventing the protrusion 12 from moving left and right in the connector female groove, and by providing non-crimped gold fingers 23 on the filler portion, the overall aesthetics and strength of the protrusion 12 can be improved. Specifically, Figure 3 There are two filler parts shown in the figure, which are the first filler part 123 and the second filler part 124. The first filler part 123 and the second filler part 124 are connected to the opposite sides of the base 122 respectively, so that the base 122 can be located in the middle of the female groove of the connector to ensure product quality. The first filler part 123 and the second filler part 124 are both provided with non-crimped gold fingers 23. The number of protrusions 12 is not limited, and can be one or more. Figure 1 There are two protrusions 12 shown in the figure, and the two protrusions 12 are respectively used to be inserted into two female grooves of the connector.

[0047] In one embodiment, Figure 4 As shown, the flexible circuit board also includes a back reinforcement layer 30, which is arranged on the side of the substrate layer 10 that is away from the crimping gold finger 22, and the back reinforcement layer 30 corresponds to the crimping gold finger 22 in the thickness direction of the flexible circuit board. When the terminal is crimped on the crimping gold finger 22, it is necessary to make the tip of the terminal penetrate the substrate layer 10 and then bend it to contact and conduct with the crimping gold finger 22. However, the substrate layer 10 is generally too thin and easily torn. The present application arranges the back reinforcement layer 30 on the side of the substrate layer 10 that is away from the crimping gold finger 22, and makes the back reinforcement layer 30 correspond to the crimping gold finger 22 in the thickness direction of the flexible circuit board, so as to improve the overall strength and prevent the substrate layer 10 from being torn. In order to improve production efficiency, the back reinforcement layer 30 also corresponds to the non-crimping gold finger 23 in the thickness direction of the flexible circuit board, that is, the back reinforcement layer 30 covers all the crimping gold fingers 22 and non-crimping gold fingers 23 at one time.

[0048] In one embodiment, Figure 4 As shown, the flexible circuit board also includes a conductive layer 20 and a front cover layer 40. The conductive layer 20 is arranged on the side of the base material layer 10 facing away from the back reinforcement layer 30. The conductive layer 20 includes a circuit 21, a crimping gold finger 22 and a non-crimping gold finger 23. The front cover layer 40 is arranged on the side of the conductive layer 20 facing away from the base material layer 10. The front cover layer 40 covers the circuit 21. An end of the front cover layer 40 close to the first outer edge 121 covers an end of the crimping gold finger 22 away from the first outer edge 121. An end of the back reinforcement layer 30 away from the first outer edge 121 overlaps with an end of the front cover layer 40 close to the first outer edge 121. By arranging the front cover layer 40 on the side of the conductive layer 20 facing away from the back reinforcement layer 30, the front cover layer 40 covers the circuit 21 of the conductive layer 20, thereby protecting the circuit 21. The end of the front cover layer 40 close to the first outer edge 121 also covers the end of the crimping gold finger 22 away from the first outer edge 121. The part of the front crimping gold finger 22 not covered by the front cover layer 40 is used for crimping with the terminal. By making the end of the back reinforcement layer 30 away from the first outer edge 121 overlap with the end of the front cover layer 40 close to the first outer edge 121, it is possible to avoid the crimping gold finger 22 from breaking at the edge of the front cover layer 40 close to the first outer edge 121 when the back reinforcement layer 30 is hot-pressed. Specifically, the dimension d of the overlapping part of the back reinforcement layer 30 and the front cover layer 40 in the length direction of the crimping gold finger 22 is 2-3 mm. Specifically, one end of the front covering layer 40 close to the first outer edge 121 also covers one end of the non-crimped gold finger 23 away from the first outer edge 121. By making the end of the back reinforcing layer 30 away from the first outer edge 121 overlap with the end of the front covering layer 40 close to the first outer edge 121, it is also possible to avoid the non-crimped gold finger 23 from breaking at the edge of the corresponding front covering layer 40 close to the first outer edge 121 when the back reinforcing layer 30 is hot-pressed.

[0049] Specifically, the substrate layer 10 includes a substrate adhesive layer 13 and a substrate PI layer 14 which are stacked, the conductive layer 20 is arranged on the side of the substrate adhesive layer 13 facing away from the substrate PI layer 14, the front cover layer 40 includes a cover film adhesive layer 41 and a cover film PI layer 42, the cover film adhesive layer 41 is arranged on the side of the conductive layer 20 facing away from the substrate adhesive layer 13, and the cover film PI layer 42 is arranged on the side of the cover film adhesive layer 41 facing away from the conductive layer 20, and the back reinforcement layer 30 includes a reinforcement adhesive layer 31 and a reinforcement PI layer 32, the reinforcement adhesive layer 31 is arranged on the side of the substrate PI layer 14 facing away from the substrate adhesive layer 13, and the reinforcement PI layer 32 is arranged on the side of the reinforcement adhesive layer 31 facing away from the substrate PI layer 14. The substrate PI layer 14, the cover film PI layer 42 and the reinforcement PI layer 32 are made of the same material, which is convenient to obtain and is not easily deformed when heated and pressurized. Among them, the thickness of the reinforcement PI layer 32 can be selected to be 0.5-1 mil, and the thickness of the reinforcement adhesive layer 31 can be selected to be 15-25 μm.

[0050] The embodiment of the present application further provides an electrical connection assembly, including the above-mentioned flexible circuit board with terminals, wherein the terminals are crimped with crimping gold fingers 22 .

[0051] The above-mentioned flexible circuit board is adopted, and the difference in appearance characteristics between the crimped gold finger 22 and the non-crimped gold finger 23 is utilized so that when the terminal is automatically crimped on the gold finger using the crimping equipment, the appearance characteristics of the gold finger can be detected by the detection module to identify the crimped gold finger 22 among the gold fingers, thereby ensuring that the crimping equipment accurately crimps the terminal on the crimped gold finger 22, avoiding the problem of the non-crimped gold finger 23 being crimped on the terminal, or the crimped gold finger 22 missing the terminal.

[0052] Furthermore, the electrical connection assembly also includes a female socket, which is provided with a female groove, and the crimped terminal and the crimping gold finger 22 are inserted into the female groove.

[0053] After the terminal and the crimping gold finger 22 are crimped, glue can be dispensed on the terminal and the crimping gold finger 22 so that the glue wraps the terminal and the crimping gold finger 22 for protection, and then inserted into the female groove of the female socket and fixed by snap buckles.

[0054] The present application also provides a method for manufacturing an electrical connection assembly. Figure 5 As shown, including:

[0055] S10: providing a crimping device, a terminal and the above-mentioned flexible circuit board, wherein the crimping device includes a crimping module, a detection module and a control module, and the crimping module and the detection module are both electrically connected to the control module;

[0056] S20: The detection module detects the appearance features of the gold finger to identify the crimped gold finger 22 among the gold fingers, and sends the detection result to the control module;

[0057] S30: The crimping module crimps the terminal onto the crimping gold finger 22 under the control of the control module.

[0058] When using the crimping equipment to automatically crimp the terminal onto the gold finger, the appearance characteristics of the gold finger are first detected by the detection module to identify the crimped gold finger 22 in the gold finger, and the detection result is sent to the control module. Then, the crimping module accurately crimps the terminal onto the crimped gold finger 22 under the control of the control module, so as to avoid the problem of crimping the terminal with the non-crimped gold finger 23 or the terminal being missed by the crimped gold finger 22.

[0059] Further, the substrate layer 10 has a first outer edge 121, and the crimped gold finger 22 and the non-crimped gold finger 23 are both located between the first outer edge 121 and the circuit 21, and are arranged in parallel and spaced apart along the length direction of the first outer edge 121, and the distance a between the end of the crimped gold finger 22 away from the circuit 21 and the first outer edge 121 is smaller than the distance b between the end of the non-crimped gold finger 23 away from the circuit 21 and the first outer edge 121; in step S30, the recognition area c of the detection module is located between the non-crimped gold finger 23 and the first outer edge 121, and the detection module moves in a straight line along the length direction of the first outer edge 121 of the substrate layer 10, and identifies the crimped gold finger 22 among the gold fingers by detecting the gold fingers that have entered the recognition area c. Since the identification area c of the detection module is located between the non-crimped gold finger 23 and the first outer edge 121, it can ensure that the detection module only identifies the crimped gold finger 22 while avoiding identifying the non-crimped gold finger 23 during the process of moving in a straight line along the length direction of the first outer edge 121, thereby avoiding the problem of the non-crimped gold finger 23 crimping the terminal or the crimped gold finger 22 missing the terminal.

[0060] Furthermore, the shape of the end of the crimped gold finger 22 near the first outer edge 121 is different from the shape of the end of the non-crimped gold finger 23 near the first outer edge 121; in step S30, the identification area c of the detection module is located between the non-crimped gold finger 23 and the first outer edge 121, and the detection module moves linearly along the length direction of the first outer edge 121 of the substrate layer 10, and the crimped gold finger 22 among the gold fingers is identified by detecting the shape of the gold finger in the identification area c. In this way, even if the non-crimped gold finger 23 enters the identification area c of the detection module and is detected due to the deviation of the moving direction of the detection module or the deviation of the positioning position of the flexible circuit board, the crimping module will not perform the action of crimping the terminal on the non-crimped gold finger 23, thereby greatly improving the accuracy of the crimped terminal, ensuring that the terminal will only be crimped on the crimped gold finger 22, and not on the non-crimped gold finger 23.

[0061] After step S30, the method further includes the following steps:

[0062] S40: Check the crimping condition of the crimped terminal and the crimping gold finger 22 to confirm whether the terminal and the crimping gold finger 22 are in good contact, whether the crimping gold finger 22 is broken, and other defects.

[0063] S50: Glue is dispensed on the terminal and the crimping gold finger 22 so that the glue wraps the terminal and the crimping gold finger 22 to play a protective role.

[0064] S60: Provide a female socket having a female groove, insert the crimped terminal and the crimping gold finger 22 into the female groove, and fix them by snapping.

[0065] S70: Use special equipment to test and confirm that it meets customer quality requirements.

[0066] It should be noted that the above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A flexible circuit board, characterized in that: It comprises a substrate layer, on one side of which a circuit, a crimped gold finger and a non-crimped gold finger are arranged, the crimped gold finger is electrically connected to the circuit, the non-crimped gold finger is insulated from the circuit, and the appearance features of the crimped gold finger are different from those of the non-crimped gold finger.

2. The flexible circuit board according to claim 1, characterized in that: The substrate layer has a first outer edge, the crimped gold finger and the non-crimped gold finger are both located between the first outer edge and the circuit, and are arranged in parallel and spaced apart along the length direction of the first outer edge, and the distance between one end of the crimped gold finger away from the circuit and the first outer edge is smaller than the distance between one end of the non-crimped gold finger away from the circuit and the first outer edge.

3. The flexible circuit board according to claim 2, characterized in that: There are multiple crimping gold fingers, which are arranged in parallel and spaced apart along the length direction of the first outer shape edge, and the distance between one end of each crimping gold finger close to the first outer shape edge and the first outer shape edge is equal.

4. The flexible circuit board according to claim 2, characterized in that: The distance between one end of the crimped gold finger close to the first outer edge and the first outer edge is 0.3-0.6 mm, and the distance between one end of the non-crimped gold finger close to the first outer edge and the first outer edge is greater than or equal to 2 mm.

5. The flexible circuit board according to claim 2, characterized in that: The shape of one end of the crimping gold finger close to the first outer edge is different from the shape of one end of the non-crimping gold finger close to the first outer edge.

6. The flexible circuit board according to claim 1, characterized in that: The substrate layer includes a main body and a protruding portion, the circuit is arranged on the main body, the protruding portion is flush with the main body, one side of the protruding portion is connected to the main body, and the other side of the protruding portion has a first outer shape edge; The protrusion includes a base and a filling portion, the base is connected to the filling portion on at least one of the two opposite sides in the length direction of the first outer edge, the base is provided with the crimping gold finger, and the filling portion is provided with the non-crimping gold finger.

7. The flexible circuit board according to claim 1, characterized in that: The flexible circuit board further comprises a back side reinforcement layer, which is arranged on a side of the base material layer facing away from the crimping gold fingers, and the back side reinforcement layer corresponds to the crimping gold fingers in a thickness direction of the flexible circuit board.

8. The flexible circuit board according to claim 7, characterized in that: The substrate layer has a first outer edge, and the flexible circuit board also includes a conductive layer and a front covering layer. The conductive layer is arranged on the side of the substrate layer facing away from the back reinforcement layer. The conductive layer includes the circuit, the crimping gold finger and the non-crimping gold finger. The crimping gold finger and the non-crimping gold finger are arranged in parallel and spaced apart along the length direction of the first outer edge. The front covering layer is arranged on the side of the conductive layer facing away from the substrate layer. The front covering layer covers the circuit, and an end of the front covering layer close to the first outer edge covers an end of the crimping gold finger away from the first outer edge, and an end of the back reinforcement layer away from the first outer edge overlaps with an end of the front covering layer close to the first outer edge.

9. An electrical connection assembly, characterized in that: It comprises a terminal and a flexible circuit board as described in any one of claims 1 to 8, wherein the terminal is crimped with the crimping gold finger.

10. A method for manufacturing an electrical connection assembly, characterized in that: include: Provide a crimping device, a terminal, and a flexible circuit board as described in any one of claims 1 to 8, wherein the crimping device comprises a crimping module, a detection module, and a control module, and the crimping module and the detection module are both electrically connected to the control module; The detection module detects the appearance features of the gold fingers to identify the crimped gold fingers among the gold fingers, and sends the detection result to the control module; The crimping module crimps the terminal onto the crimping gold finger under the control of the control module.