Flexible circuit board uncovering method
By controlling the laser path to avoid damaging the circuit under the cover film during laser lid removal, the problem of line damage during laser lid removal is solved, and product quality and production efficiency are improved.
Patent Information
- Application Number
- CN202510038511.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-10
- Publication Date
- 2025-04-11
AI Technical Summary
When laser lifting covers, it is easy to damage the circuit under the cover film, resulting in a decrease in product quality and low production efficiency.
A flexible circuit board cover removal method is adopted, and the inner layer covering film of the double-sided flexible plate is extended through the vertical path of the laser, and the line is exposed. The horizontal path of the laser extends to three sides above the line, and there is one side extending from the copper wire on the line without laser light.
It effectively avoids damage to the circuit under the cover when the laser cover is uncovered, improves product quality and production efficiency, and is simple to operate and is suitable for large-scale mass production.
Smart Images
Figure CN119815698A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of flexible circuit boards, and in particular to a method for uncovering a flexible circuit board. Background Art
[0002] Nowadays, the competition in the FPC (Flexible Printed Circuit) industry is getting more and more intense, and clients are also constantly innovating. Consumers are paying more and more attention to the convenience and durability of the products. Customers require that the products be bent and the lines cross the uncovering area at the same time. The cover (i.e., the covering film, a film layer covering the line) needs to be opened to expose the interior (such as lines, fingers, wiring terminals, etc.) to achieve circuit board connection, to stabilize the accuracy of signal transmission for electrical connections, especially for high-speed data transmission or high-frequency signal transmission applications, and at the same time, it needs to be thin and bendable. Traditionally, laser is generally used for uncovering, that is, the lines or fingers are exposed by laser cutting on the four sides of the cover. Laser cutting is easy to damage the soft board and the junction area, and cutting the four sides of the cover will also damage the lines under the covering film. Summary of the invention
[0003] The technical problem to be solved by the present invention is to provide a flexible circuit board uncovering method, which can avoid damaging the circuit under the cover film during laser uncovering.
[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is: A method for uncovering a flexible circuit board comprises the following steps: S1. Provide a single-sided flexible board and a double-sided flexible board; the single-sided flexible board and the double-sided flexible board are both circuit boards with a cover film; S2, laminating the single-sided flexible board on the double-sided flexible board to obtain a semi-finished circuit board; S3. Perform laser uncovering operation on the uncovering area of the semi-finished circuit board to obtain the target circuit board; the vertical path of the laser extends from the covering film of the single-sided flexible board downward to the covering film of the inner layer of the double-sided flexible board to expose the circuit below, and the horizontal path of the laser extends from three sides above the circuit, and the laser is not performed above one side of the circuit where the copper wire extends.
[0005] The beneficial effects of the present invention are: In this solution, when performing the laser uncovering operation, the vertical path of the laser extends through the covering film of the single-sided flexible board downward to the covering film on the inner layer of the double-sided flexible board to expose the circuit underneath; the horizontal path of the laser extends through three sides above the circuit, and the laser is not performed above one side of the circuit where a copper wire extends. This avoids damage to the circuit under the covering film during laser uncovering, thereby improving product quality and production efficiency. In addition, this uncovering method is simple to operate, easy to implement, and suitable for large-scale batch production. BRIEF DESCRIPTION OF THE DRAWINGS
[0006] Figure 1 A flowchart of the method for uncovering a flexible circuit board according to the present invention; Figure 2 It is a structural schematic diagram of the flexible circuit board of the present invention; Figure 3 is a schematic diagram of the horizontal path of the laser of the present invention; Description of labels: 1. Single-sided flexible board; 11. First covering film layer; 12. First substrate layer; 2. Double-sided flexible board; 21. Second covering film layer; 22. Second base material layer; 23. Circuit; 24. Reinforcement layer; 3. Pure rubber layer; 4. Non-closed end. DETAILED DESCRIPTION
[0007] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in conjunction with the implementation modes and the accompanying drawings.
[0008] Please refer to Figure 1 , the technical solution adopted by the present invention is: A method for uncovering a flexible circuit board comprises the following steps: S1. Provide a single-sided flexible board and a double-sided flexible board; the single-sided flexible board and the double-sided flexible board are both circuit boards with a cover film; S2, laminating the single-sided flexible board on the double-sided flexible board to obtain a semi-finished circuit board; S3. Perform laser uncovering operation on the uncovering area of the semi-finished circuit board to obtain the target circuit board; the vertical path of the laser extends from the covering film of the single-sided flexible board downward to the covering film of the inner layer of the double-sided flexible board to expose the circuit below, and the horizontal path of the laser extends from three sides above the circuit, and the laser is not performed above one side of the circuit where the copper wire extends.
[0009] From the above description, it can be seen that the beneficial effects of the present invention are: In this solution, when performing the laser uncovering operation, the vertical path of the laser extends through the covering film of the single-sided flexible board downward to the covering film on the inner layer of the double-sided flexible board to expose the circuit underneath; the horizontal path of the laser extends through three sides above the circuit, and the laser is not performed above one side of the circuit where a copper wire extends. This avoids damage to the circuit under the covering film during laser uncovering, thereby improving product quality and production efficiency. In addition, this uncovering method is simple to operate, easy to implement, and suitable for large-scale batch production.
[0010] Furthermore, in step S3, the two non-closed ends connected to the upper side of the side where the copper wire extends from the line are bent in the direction in which the two non-closed ends face each other.
[0011] As can be seen from the above description, designing outwardly extending corners at the two non-closed ends can avoid difficulty in opening the cover and torn corners.
[0012] Furthermore, the bending angle of the two non-closed ends ranges from 90° to 180°.
[0013] Furthermore, the bending angle of the two non-closed ends is 90°, and the length of the two non-closed ends bent and extended is in the range of 30 μm-2 mm.
[0014] Furthermore, the method for manufacturing the single-sided flexible board includes the following steps: S11, providing a first covering film layer and a first substrate layer with circuits; S12, laminating the first covering film layer on the first substrate layer to obtain a single-sided flexible board.
[0015] Furthermore, the method for manufacturing the double-sided flexible board includes the following steps: S21, providing two second cover film layers and a second substrate layer with circuits on both sides; S22, laminating two second covering film layers on two opposite side surfaces of the second substrate layer respectively to obtain a double-sided flexible board.
[0016] Furthermore, in step S22, after the two second covering film layers are respectively attached to the two opposite sides of the second substrate layer, the following steps are also included: A reinforcing layer is provided, and the reinforcing layer is attached to a side of the second covering film layer located on the outer layer away from the second substrate layer to obtain a double-sided flexible board.
[0017] Furthermore, the single-sided flexible board and the double-sided flexible board are glued together by a pure glue layer.
[0018] Furthermore, the single-sided flexible board and the double-sided flexible board are respectively provided with bending areas corresponding to each other, and the bending areas of the pure adhesive layer are hollowed out.
[0019] Furthermore, the single-sided flexible board and the double-sided flexible board each have at least one bending area.
[0020] Please refer to Figures 1 to 3 As shown, the first embodiment of the present invention is: Please refer to Figure 1 and Figure 2 A method for uncovering a flexible circuit board 23 comprises the following steps: S1. Provide a single-sided flexible board 1 and a double-sided flexible board 2; both the single-sided flexible board 1 and the double-sided flexible board 2 are circuit boards 23 with a cover film; S2, laminating the single-sided flexible board 1 on the double-sided flexible board 2 to obtain a semi-finished circuit board 23; S3, perform laser uncovering operation on the uncovering area of the semi-finished circuit 23 board to obtain the target circuit 23 board; the vertical path of the laser extends through the covering film of the single-sided flexible board 1 downward to the covering film of the inner layer of the double-sided flexible board 2 and exposes the circuit 23 below it, and the horizontal path of the laser extends through the three sides above the circuit 23, and the laser is not performed above the side of the circuit 23 where the copper wire extends.
[0021] In step S3, the two non-closed ends 4 connected to the upper side of the circuit 23 with the copper wire extending therefrom are bent in the direction in which the two non-closed ends 4 face each other; the circuit 23 can be regarded as a rectangular copper layer, on which many copper wires are connected, and these copper wires extend from one side, so the side of the copper layer with the copper wire extending therefrom is not lasered, and only the other three sides are lasered, so that the circuit 23 under the covering film can be avoided from being damaged during the laser uncovering. The horizontal path of the laser can be referred to Figure 3 As shown in , the corners (i.e., the bends) of its two closed ends refer to the circled parts.
[0022] The bending angle of the two non-closed ends 4 is 90°, and the length of the two non-closed ends 4 extending after bending is 30 μm-2 mm (refer to Figure 3 Indicated by the letter L in the figure), it mainly depends on the difficulty of uncovering and whether there is a line under the extended position. The length can be adjusted according to the actual situation without any impact.
[0023] The manufacturing method of the single-sided flexible board 1 comprises the following steps (for specific structure, please refer to Figure 2 ): S11, providing a first covering film layer 11 and a first substrate layer 12 with a circuit 23; S12 , laminating the first covering film layer 11 on the first substrate layer 12 to obtain a single-sided flexible board 1 .
[0024] The manufacturing method of the double-sided flexible board 2 includes the following steps (for specific structure, please refer to Figure 2 ): S21, providing two second cover film layers 21 and a second substrate layer 22 with circuits 23 on both sides; S22 , respectively laminating the two second covering film layers 21 on the opposite side surfaces of the second substrate layer 22 to obtain a double-sided flexible board 2 .
[0025] In step S22, after the two second covering film layers 21 are respectively attached to the two opposite sides of the second substrate layer 22, the following steps are also included: A reinforcing layer 24 is provided and attached to a side of the second covering film layer 21 located on the outer layer away from the second substrate layer 22 to obtain a double-sided flexible board 2; the reinforcing layer 24 is made of polyimide.
[0026] The single-sided flexible board 1 and the double-sided flexible board 2 are glued together by a pure glue layer 2 .
[0027] The single-sided flexible board 1 and the double-sided flexible board 2 are respectively provided with bending areas corresponding to each other, and the bending area of the pure adhesive layer 2 is hollowed out.
[0028] The single-sided flexible board 1 and the double-sided flexible board 2 each have at least one bending area.
[0029] Due to the printing of anti-etching ink and pure glue window compensation, and the narrow opening area requires a blade or other tools to lift one side and tear it open, the bottom line 23 and the protective film are damaged, and the efficiency is low; therefore, this solution retains the three-side process and designs corners or right-angle extension methods, directly tears it open after laser or lifts it up with a fixture and then uncovers it, which accelerates the uncovering process. This can solve the above efficiency problems and meet customer quality requirements while avoiding the risk of damaging copper and wires.
[0030] In summary, the present invention provides a flexible circuit board uncovering method. During the laser uncovering operation, the vertical path of the laser extends through the covering film of the single-sided flexible board downward to the covering film of the inner layer of the double-sided flexible board to expose the circuit thereunder, and the horizontal path of the laser extends through the three sides above the circuit, and the laser is not performed above one side of the circuit where a copper wire extends. This can avoid damaging the circuit under the covering film during laser uncovering, thereby improving product quality and production efficiency. Moreover, this uncovering method is simple to operate, easy to implement, and suitable for large-scale batch production.
[0031] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent transformations made using the contents of the present invention's specification and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. A method for uncovering a flexible circuit board, characterized in that: The following steps are involved: S1. Provide a single-sided flexible board and a double-sided flexible board; the single-sided flexible board and the double-sided flexible board are both circuit boards with a cover film; S2, laminating the single-sided flexible board on the double-sided flexible board to obtain a semi-finished circuit board; S3. Perform laser uncovering operation on the uncovering area of the semi-finished circuit board to obtain the target circuit board; the vertical path of the laser extends from the covering film of the single-sided flexible board downward to the covering film of the inner layer of the double-sided flexible board to expose the circuit below, and the horizontal path of the laser extends from three sides above the circuit, and the laser is not performed above one side of the circuit where the copper wire extends.
2. The method for uncovering a flexible circuit board according to claim 1, characterized in that: In step S3, the two non-closed ends connected to the upper side of the line from which the copper wire extends are bent in directions in which the two non-closed ends face each other.
3. The method for uncovering a flexible circuit board according to claim 2, characterized in that: The bending angles of the two non-closed ends range from 90° to 180°.
4. The method for uncovering the flexible circuit board according to claim 3, characterized in that: The bending angle of the two non-closed ends is 90°, and the length of the two non-closed ends bent and extended is in the range of 30 μm-2 mm.
5. The flexible circuit board uncovering method according to claim 1, characterized in that: The method for manufacturing the single-sided flexible board comprises the following steps: S11, providing a first covering film layer and a first substrate layer with circuits; S12, laminating the first covering film layer on the first substrate layer to obtain a single-sided flexible board.
6. The method for uncovering a flexible circuit board according to claim 1, characterized in that: The method for manufacturing the double-sided flexible board comprises the following steps: S21, providing two second cover film layers and a second substrate layer with circuits on both sides; S22, laminating two second covering film layers on two opposite side surfaces of the second substrate layer respectively to obtain a double-sided flexible board.
7. The method for uncovering the flexible circuit board according to claim 6, characterized in that: In step S22, after the two second covering film layers are respectively attached to the two opposite sides of the second substrate layer, the following steps are also included: A reinforcing layer is provided, and the reinforcing layer is attached to a side of the second covering film layer located on the outer layer away from the second substrate layer to obtain a double-sided flexible board.
8. The method for uncovering a flexible circuit board according to claim 1, characterized in that: The single-sided flexible board and the double-sided flexible board are glued together by a pure glue layer.
9. The method for uncovering the flexible circuit board according to claim 8, characterized in that: The single-sided flexible board and the double-sided flexible board are respectively provided with bending areas corresponding to each other, and the bending areas of the pure adhesive layer are hollowed out.
10. The method for uncovering the flexible circuit board according to claim 9, characterized in that: The single-sided flexible board and the double-sided flexible board each have at least one bending area.