Gas guide bottom plate, PCB (Printed Circuit Board) production device and gas guide bottom plate manufacturing method

Abstract

The invention provides an air guide bottom plate, a PCB (Printed Circuit Board) production device and an air guide bottom plate manufacturing method, relates to the technical field of circuit board production, and solves the problems of low manufacturing efficiency and high rejection rate of the air guide bottom plate caused by a mode of processing air guide holes in the air guide bottom plate; the production efficiency of the PCB is low, and the resin is difficult to pass through the hole site on the PCB. The air guide bottom plate comprises a bottom plate body, all positions, corresponding to a PCB needing resin hole plugging, on the bottom plate body are communicated, an air guide groove is carved in the bottom plate body, and a groove opening of the air guide groove faces the PCB; an air guide channel is arranged on one face, facing the PCB, of the bottom plate, and the two ends of the air guide channel are communicated with the air guide groove and the edge of the bottom plate respectively. The manufacturing efficiency of the air guide bottom plate is improved; the position, without grooving, of the bottom plate can be prevented from falling off, and the supporting performance of the gas guide bottom plate is guaranteed; the air guide channel is communicated with the air guide groove and the edge of the bottom plate, air circulation can be achieved under the action of the negative pressure device, and holes in the PCB can be conveniently filled with resin.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, and in particular to an air guide bottom plate, a PCB board production device and a production method of the air guide bottom plate. Background Art

[0002] The air guide base plays a supporting and air guiding role in the production process of PCB boards. When the PCB board is produced, the resin is inserted into the hole of the PCB board with the support of the air guide base. The resin needs to pass through the front and back sides of the PCB board. After the resin is polished clean, copper is deposited on the resin above the hole to make the hole and the copper surface flat. Then it is reinforced by electroplating. The copper plays a conductive role, and then the circuit is printed on the PCB board. Therefore, it is necessary to ensure that the resin passes through the front and back sides of the PCB board when plugging the hole.

[0003] When ensuring that the resin plug holes pass through the front and back sides of the PCB board, the key factor affecting it is the air guide bottom plate. Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of the air guide holes on the air guide bottom plate in the prior art; the air guide bottom plate is provided with multiple and dense air guide holes, with a number of 120,000 holes (inclusive). When manufacturing the PCB board, the angle and pressure of the silk screen scraper are used to stuff the resin into the holes on the PCB board. The air guide bottom plate under the PCB board plays an exhaust role when the resin is stuffed into the holes. Specifically, the negative pressure device sucks away the air between the air guide bottom plate and the PCB board, and between the air guide bottom plate and the table top. The resin can only successfully pass through the holes on the PCB board under the action of negative pressure.

[0004] The applicant has found that the prior art has at least the following technical problems: However, since the air guide holes on the air guide bottom plate are numerous and dense, with a hole number of 120,000 holes (inclusive), and the positions of the air guide holes correspond to the positions of the resin plug holes on the PCB board. When manufacturing the air guide bottom plate, a 2.0 drill bit is used to control deep drilling and one-time drilling, that is, the air guide holes on the air guide bottom plate in the prior art penetrate the two sides of the air guide bottom plate; as a result, after drilling in the dense hole area, many air guide holes that should be arranged at intervals overlap, causing the plate body of the air guide bottom plate to fall off partially, and there are more empty areas.

[0005] This will lead to the following problems:

[0006] 1. The processing of the numerous and dense air holes on the air guide bottom plate is time-consuming and laborious. It takes 12 hours to drill a air guide bottom plate, which is inefficient and has a high scrap rate for the air guide plate.

[0007] 2. If part of the air guide bottom plate falls off, the PCB board cannot be supported at that position. When the resin is inserted into the hole on the PCB board using the angle and pressure of the silk screen scraper, the silk screen scraper will not be strong enough due to the loss of the support of the air guide bottom plate. This will cause the resin to be unable to be inserted into the hole on the back of the PCB, resulting in reduced production efficiency and increased scrap rate of the PCB board.

[0008] In summary, the method of processing the air guide holes on the air guide base plate leads to low manufacturing efficiency and high scrap rate of the air guide base plate, and also leads to low production efficiency of the PCB board, and it is difficult for the resin to pass through the holes on the PCB. Summary of the invention

[0009] The purpose of the present invention is to provide an air guide bottom plate, a PCB production device and an air guide bottom plate production method, so as to solve the technical problems that the air guide holes are processed on the air guide bottom plate in the prior art, resulting in low manufacturing efficiency and high scrap rate of the air guide bottom plate; low production efficiency of the PCB board, and difficulty for the resin to pass through the holes on the PCB. The preferred technical solutions among the many technical solutions provided by the present invention can produce many technical effects as described below.

[0010] To achieve the above object, the present invention provides the following technical solutions:

[0011] The air guide bottom plate provided by the present invention comprises a bottom plate, wherein:

[0012] All positions on the bottom plate corresponding to the holes on the PCB board that need resin plugging are connected, and air guide grooves are engraved, and the notches of the air guide grooves are arranged toward the PCB board;

[0013] An air guide channel is arranged on one side of the bottom plate facing the PCB board, and two ends of the air guide channel are respectively communicated with the air guide groove and the edge of the bottom plate.

[0014] Preferably, the side of the air guide channel facing the PCB board is an open side.

[0015] Preferably, the air guiding channel is a straight channel, a curved channel or a bent channel.

[0016] Preferably, the depth of the air guide groove is 1 / 3-3 / 4 of the thickness of the bottom plate.

[0017] Preferably, the groove depth of the air guide channel is 1 / 3-3 / 4 of the thickness of the bottom plate.

[0018] Preferably, the number of the air guiding channels is at least two, and the two air guiding channels are respectively located on opposite sides of the air guiding groove and are respectively connected to opposite side edges of the bottom plate.

[0019] The present invention also provides a PCB board production device, comprising a negative pressure device and the air guide bottom plate described in any one of claims 1 to 6, wherein the negative pressure device is connected to the air guide channel.

[0020] The present invention also provides a method for producing an air guide bottom plate, which is used to produce the above-mentioned air guide bottom plate. The production method comprises:

[0021] Connect all positions on the bottom plate corresponding to the holes on the PCB board that require resin plugging, and carve out air guide grooves, with the notches of the air guide grooves facing the PCB board;

[0022] An air guide channel is arranged on a side of the bottom plate facing the PCB board, so that two ends of the air guide channel are respectively connected with the air guide groove and the edge of the bottom plate.

[0023] Preferably, the step of connecting all positions on the bottom plate corresponding to the PCB board that require resin plugging holes includes:

[0024] According to the circuit pattern to be printed on the PCB board, a gong machine is used to connect all positions on the bottom plate corresponding to the resin plugging holes required on the PCB board, and the air guide groove is deeply set.

[0025] Preferably, the air guide channel is connected to a negative pressure device, and the negative pressure device is used to suck the air in the air guide channel and the air guide groove, so that the resin fills the holes on the PCB.

[0026] Compared with the prior art, the air-conducting base plate, the PCB board production device and the air-conducting base plate production method provided by the present invention have the following beneficial effects: the air-conducting base plate does not need to drill many dense air-conducting holes on the base plate, and by connecting all positions on the base plate corresponding to the holes on the PCB board that need to be plugged with resin, and engraving air-conducting grooves, it is easy to process and improve the manufacturing efficiency of the air-conducting base plate; and it can prevent the positions of the base plate that do not need to be grooved from falling off, thereby ensuring the supporting performance of the air-conducting base plate; the air-conducting channel is connected to the air-conducting groove and the edge of the base plate, and can provide air circulation under the action of the negative pressure device, so that it is convenient for resin to fill the holes on the PCB.

[0027] The production method of the air guide bottom plate can prevent the plate body of the air guide bottom plate from falling off due to multiple and dense drilling holes, and prevent the position where the air guide bottom plate falls off from being unable to support the PCB board, that is, ensure the supporting function of the air guide bottom plate, and the silk screen scraper can successfully prevent the resin from plugging the holes on the back of the PCB board, thereby reducing the scrap rate of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 It is a schematic diagram of the structure of the air guide hole on the air guide bottom plate in the prior art; in the figure: 1', air guide bottom plate; 101, air guide hole;

[0030] Figure 2 It is a schematic diagram of the structure of the air guide groove and the air guide channel on the bottom plate of the present invention;

[0031] Figure 3 It is a cross-sectional view of the base plate.

[0032] In the figure, 1, bottom plate; 11, air guide groove; 12, air guide channel. DETAILED DESCRIPTION

[0033] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0034] In the description of the present invention, it should be understood that the terms "center", "length", "width", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "side" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0035] In the prior art, the key factor affecting the resin plugging through the front and back sides of the PCB board is the air guide bottom plate. Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of the air guide holes on the air guide bottom plate in the prior art; the air guide bottom plate is provided with multiple and dense air guide holes, with a number of 120,000 holes (inclusive). When manufacturing the PCB board, the angle and pressure of the silk screen scraper are used to stuff the resin into the holes on the PCB board. The air guide bottom plate under the PCB board plays an exhaust role when the resin is stuffed into the holes. Specifically, the negative pressure device sucks away the air between the air guide bottom plate and the PCB board, and between the air guide bottom plate and the table top. The resin can only successfully pass through the holes on the PCB board under the action of negative pressure.

[0036] However, since there are many densely packed air holes on the air guide bottom plate, with the number of holes being 120,000 (inclusive), and the positions of the air holes correspond to the positions of the resin plug holes on the PCB board, a 2.0 drill bit is used to control the depth drilling and drill through at one time when manufacturing the air guide bottom plate, that is, the air holes on the air guide bottom plate in the prior art penetrate the two sides of the air guide bottom plate; as a result, after drilling in the dense hole area, many air guide holes that should be arranged at intervals overlap, causing the plate body of the air guide bottom plate to fall off partially, and leaving more empty areas.

[0037] This will lead to the following problems:

[0038] 1. The processing of the numerous and dense air holes on the air guide bottom plate is time-consuming and laborious. It takes 12 hours to drill a air guide bottom plate, which is inefficient and has a high scrap rate for the air guide plate.

[0039] 2. If part of the air guide bottom plate falls off, the PCB board cannot be supported at that position. When the resin is inserted into the hole on the PCB board using the angle and pressure of the silk screen scraper, the silk screen scraper will not be strong enough due to the loss of the support of the air guide bottom plate. This will cause the resin to be unable to be inserted into the hole on the back of the PCB, resulting in reduced production efficiency and increased scrap rate of the PCB board.

[0040] In view of the above problems, the embodiments of the present invention provide an air guide base plate, a PCB board production device and an air guide base plate production method, which can improve the manufacturing efficiency of the air guide base plate and reduce the scrap rate of the PCB board.

[0041] Combine the following Figure 2 and Figure 3 The technical solution provided by the present invention is described in more detail.

[0042] Embodiment 1:

[0043] like Figure 2 and Figure 3 As shown, the air guide bottom plate provided by the present invention comprises a bottom plate 1, wherein: all positions on the bottom plate 1 corresponding to the PCB board requiring resin plugging holes are connected, and an air guide groove 11 is engraved, and the notch of the air guide groove 11 is arranged toward the PCB board; an air guide channel 12 is arranged on one side of the bottom plate 1 facing the PCB board, and the two ends of the air guide channel 12 are respectively connected with the air guide groove 11 and the edge of the bottom plate 1.

[0044] Among them, the air guide groove 11 is not set through the bottom plate 1, and different from the prior art, the air guide groove 11 connects all positions on the bottom plate 1 corresponding to the resin plugging holes of the PCB board. The shape of the air guide groove 11 corresponds to the shape of the circuit diagram printed on the PCB board. In this way, the air guide groove 11 is located below the required resin plugging holes of the PCB board, and can provide air circulation. After the air guide channel 12, the air guide groove 11 and the negative pressure device are connected, it is ensured that the resin is filled into the holes of the PCB board under the action of negative pressure and protrudes from the surface of the PCB board.

[0045] The air-conducting bottom plate provided by the present invention, on the one hand, does not need to drill many dense air-conducting holes on the bottom plate 1. By connecting all positions on the bottom plate 1 corresponding to the holes on the PCB board that need to be plugged with resin, and engraving air-conducting grooves 11, it is easy to process and improve the manufacturing efficiency of the air-conducting bottom plate; and it can prevent the positions of the bottom plate 1 that do not need to be grooved from falling off, thereby ensuring the supporting performance of the air-conducting bottom plate; the air-conducting channel 12 is connected to the air-conducting groove 11 and the edge of the bottom plate 1, and can provide air circulation under the action of the negative pressure device, so as to facilitate the resin filling of the holes on the PCB.

[0046] On the other hand, it can prevent the plate body of the air guide base plate from falling off due to multiple and dense drilling holes, and prevent the position where the air guide base plate falls off from being unable to support the PCB board, that is, to ensure the supporting function of the air guide base plate, and the silk screen scraper can successfully prevent the resin from plugging the holes on the back of the PCB board, thereby reducing the scrap rate of the PCB board.

[0047] As an alternative embodiment, see Figure 3 As shown, in this embodiment, the side of the air guide channel 12 facing the PCB board is the opening side.

[0048] The air guide channel 12 also does not penetrate through both sides of the bottom plate 1 , thereby preventing the plate body of the bottom plate 1 from falling off and ensuring the supporting performance of the bottom plate 1 .

[0049] As an optional implementation, the air guiding channel 12 is a straight channel, a curved channel, or a bent channel.

[0050] See also Figure 2 As shown, in this embodiment, the air guide channel 12 is a linear channel to ensure good air circulation performance.

[0051] As an optional implementation, in this embodiment, the depth of the air guide groove 11 is 1 / 3-3 / 4 of the thickness of the bottom plate 1. Figure 3 The depth of the air guide groove 11 is half of the thickness of the bottom plate 1. When the thickness of the bottom plate 1 is 3 mm, the depth of the air guide groove 11 is 1.5 mm.

[0052] As an optional implementation, the groove depth of the air guide channel 12 is 1 / 3-3 / 4 of the thickness of the bottom plate 1 .

[0053] Preferably, see Figure 3 The groove depth of the air guide channel 12 is half of the thickness of the bottom plate 1. When the thickness of the bottom plate 1 is 3 mm, the groove depth of the air guide channel 12 is 1.5 mm.

[0054] As an alternative embodiment, see Figure 2 and Figure 3As shown, there are at least two air guiding channels 12 , and the two air guiding channels 12 are respectively located at two opposite sides of the air guiding groove 11 and are respectively connected to two opposite side edges of the bottom plate 1 .

[0055] In the above structure, when the air guide channel 12 is connected to the negative pressure device, the negative pressure device draws out the air in the air guide channel 12 and the air guide groove 11 to ensure air circulation, which is convenient for the resin to fill the holes on the PCB.

[0056] Example 2

[0057] This embodiment provides a PCB board production device, including a negative pressure device and the above-mentioned air guide bottom plate, and the negative pressure device is connected to the air guide channel 12. The negative pressure device can be a vacuum device.

[0058] In the prior art, when manufacturing the bottom guide plate 1, a 2.0 drill bit is used to control the depth drilling and drill through at one time, that is, the air guide holes on the air guide plate in the prior art penetrate the two sides of the air guide plate; as a result, after drilling the dense hole area, many air guide holes that should be arranged at intervals overlap, causing the plate body of the air guide plate to fall off, and there are many empty areas. The plate body of the air guide plate falls off, which will cause the position to be unable to support the PCB board. When the angle and pressure of the silk screen scraper are used to insert the resin into the hole on the PCB board, due to the loss of the support of the air guide plate, the silk screen scraper is not strong enough, which will cause the resin to be unable to plug the hole to the back of the PCB, resulting in reduced production efficiency and increased scrap rate of the PCB board.

[0059] Specifically, in the present application, the air guide groove 11 will not penetrate the bottom plate 1, thereby ensuring the supporting performance of the bottom plate 1. The air guide groove 11 is connected to the air guide channel 12 to ensure air fluidity, and the air guide bottom plate is supported under the PCB board. The negative pressure device sucks away the air between the air guide bottom plate and the PCB board, and between the air guide bottom plate and the table top. The resin successfully passes through the holes on the PCB board under the action of negative pressure, thereby reducing the scrap rate of the PCB board.

[0060] Example 3

[0061] The present embodiment provides a method for producing an air-conducting bottom plate, which is used to produce the above-mentioned air-conducting bottom plate. The production method includes: connecting all positions on the bottom plate 1 corresponding to the resin plugging holes of the PCB board, and engraving an air-conducting groove 11, so that the notch of the air-conducting groove 11 is set toward the PCB board; and setting an air-conducting channel 12 on a side of the bottom plate 1 facing the PCB board, so that the two ends of the air-conducting channel 12 are respectively connected to the air-conducting groove 11 and the edge of the bottom plate 1.

[0062] The production method of the air guide bottom plate can prevent the plate body of the air guide bottom plate from falling off due to multiple and dense drilling holes, and prevent the position where the air guide bottom plate falls off from being unable to support the PCB board, that is, ensure the supporting function of the air guide bottom plate, and the silk screen scraper can successfully prevent the resin from plugging the holes on the back of the PCB board, thereby reducing the scrap rate of the PCB board.

[0063] As an optional implementation, all positions on the base plate 1 corresponding to the PCB board that require resin plugging holes are connected, including: according to the circuit pattern to be printed on the PCB board, all positions on the base plate 1 corresponding to the PCB board that require resin plugging holes are connected using a gong machine, and the air guide groove 11 is deeply carved.

[0064] The shape of the air guide groove 11 corresponds to the shape of the circuit diagram printed on the PCB board. In this way, the air guide groove 11 is located below the required resin plug hole of the PCB board, and can provide air circulation. After the air guide channel 12, the air guide groove 11 and the negative pressure device are connected, it is ensured that the resin is filled into the hole of the PCB board under the action of negative pressure and protrudes from the surface of the PCB board.

[0065] As an optional implementation, the method further includes: connecting the air guide channel 12 to a negative pressure device, and using the negative pressure device to suck the air in the air guide channel 12 and the air guide groove 11, so that the resin fills the holes on the PCB.

[0066] In the prior art, it takes more than ten hours to drill holes on the bottom plate 1 and plug the holes with resin for more than 120,000 holes. The production method of the air guide bottom plate in this embodiment can ensure the integrity of the bottom plate 1 and only takes 1-2 hours to complete the manufacturing, which greatly improves the manufacturing efficiency and reduces the scrap rate.

[0067] In the description of this specification, specific features, structures or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0068] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0069] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. An air guide bottom plate, characterized in that: Comprising a base plate, wherein: All positions on the bottom plate corresponding to the holes on the PCB board that need resin plugging are connected, and air guide grooves are engraved, and the notches of the air guide grooves are arranged toward the PCB board; An air guide channel is arranged on one side of the bottom plate facing the PCB board, and two ends of the air guide channel are respectively communicated with the air guide groove and the edge of the bottom plate.

2. The air guide bottom plate according to claim 1, characterized in that: The side of the air guide channel facing the PCB board is an opening side.

3. The air guide bottom plate according to claim 1, characterized in that: The air guiding channel is a straight channel, a curved channel or a bent channel.

4. The air guide bottom plate according to claim 1, characterized in that: The depth of the air guide groove is 1 / 3-3 / 4 of the thickness of the bottom plate.

5. The air guide bottom plate according to claim 1, characterized in that: The groove depth of the air guide channel is 1 / 3-3 / 4 of the thickness of the bottom plate.

6. The air guide bottom plate according to claim 1, characterized in that: The number of the air guiding channels is at least two, and the two air guiding channels are respectively located at opposite sides of the air guiding groove and are respectively communicated with opposite side edges of the bottom plate.

7. A PCB board production device, characterized in that: It comprises a negative pressure device and the air guide bottom plate described in any one of claims 1 to 6, wherein the negative pressure device is connected to the air guide channel.

8. A method for producing an air guide bottom plate, characterized in that: Used to produce the air guide bottom plate according to any one of claims 1 to 6, the production method comprises: Connect all positions on the bottom plate corresponding to the holes on the PCB board that require resin plugging, and carve out air guide grooves, with the notches of the air guide grooves facing the PCB board; An air guide channel is arranged on a side of the bottom plate facing the PCB board, so that two ends of the air guide channel are respectively connected with the air guide groove and the edge of the bottom plate.

9. The method for producing an air guide bottom plate according to claim 8, characterized in that: The step of connecting all positions on the bottom plate corresponding to the PCB board that require resin plugging holes includes: According to the circuit pattern to be printed on the PCB board, a gong machine is used to connect all positions on the bottom plate corresponding to the resin plugging holes required on the PCB board, and the air guide groove is deeply set.

10. The method for producing an air guide bottom plate according to claim 8, characterized in that: The air guide channel is connected to a negative pressure device, and the negative pressure device is used to suck the air in the air guide channel and the air guide groove, so that the resin fills the holes on the PCB.

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