Module packaging structure and three-in-one power module

Abstract

The invention relates to the technical field of power semiconductors, in particular to a module packaging structure and a three-in-one power module.The module packaging structure is installed on a PCB and comprises a supporting base, a fixing column and a module shell; the supporting seat and the fixing column are arranged on one side, facing the PCB, of the module shell; the supporting seat is used for supporting the module shell; the fixing columns are used for being matched with limiting holes in a PCB in an inserted mode. The height of the fixing column is higher than that of the supporting seat; the height of the fixing column is equal to the sum of the height of the supporting base and the depth of the limiting hole, the module packaging structure solves the risk that the module pin is broken due to transportation vibration or falling, the material cost and the installation cost can be reduced, the installation efficiency of the module is improved, and meanwhile the module packaging structure is suitable for popularization and application. The three-in-one power module integrates the rectifying circuit, the PFC circuit, the inverter circuit and the driving IC, so that the PCB wiring can be reduced, the module installation efficiency can be improved, and the crosstalk problem of an external circuit is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of power semiconductors, and in particular to a module packaging structure and a three-in-one power module. Background Art

[0002] With the development trend of carbon neutrality, integrated circuit modules have also become mainstream. In the designed power modules, most module packages are applied to PCB boards through brackets to assist the power modules in being protected from falling and vibration, preventing the module pins from cracking and breaking.

[0003] In the existing packaging module technology applied to PCB boards, the PCB boards and modules are fixed by brackets. This method requires the design cost of the brackets, the material cost of the brackets, and the labor cost of installing the brackets, which has the problems of high cost and low installation efficiency. Summary of the invention

[0004] In view of the above-mentioned defects, the object of the present invention is to provide a module packaging structure to solve the problems of high cost and low installation efficiency existing in the above-mentioned use of brackets to fix the modules.

[0005] Another object of the present invention is to provide a three-in-one power module to solve the problems of insufficient integration of the power module, much wiring on the PCB periphery, and much module interference.

[0006] To achieve this object, the present invention adopts the following technical solutions: a module packaging structure, mounted on a PCB board, comprising a support seat, a fixing column and a module housing;

[0007] The support seat and the fixing column are both arranged on the side of the module housing facing the PCB board;

[0008] The fixing column and the supporting seat are arranged in a centrally symmetrical manner with the center of the module housing as a symmetrical point, and the fixing column and the supporting seat are arranged in sequence from the center to the four corners;

[0009] The support base is used to support the module housing;

[0010] The fixing column is used to be plugged into and matched with the limiting hole on the PCB board;

[0011] The height of the fixing column is higher than the height of the supporting seat;

[0012] The height of the fixing column is equal to the height of the supporting seat plus the depth of the limiting hole.

[0013] Furthermore, the support base is a horizontally placed trapezoidal body, and the lower bottom surface of the support base faces the central area of ​​the module housing.

[0014] Furthermore, a three-in-one power module using the module packaging structure is applied, wherein the three-in-one power module integrates a rectifier circuit, a PFC circuit, an inverter circuit and a driver IC, and the three-in-one power module has a W-phase output terminal, a V-phase output terminal and a U-phase output terminal for three-phase current to flow out;

[0015] The rectifier circuit is used to perform uncontrolled rectification on the external alternating current;

[0016] The PFC circuit is used to improve the power factor, the control end of the PFC circuit is connected to the PFCOUT terminal of the driver IC, and the PFC terminal of the PFC circuit outputs a PFC control signal to the outside;

[0017] The inverter circuit is used to convert the input direct current into alternating current, is connected to the driver IC, and provides three-phase alternating current to the driver IC and the outside;

[0018] The driving IC is used to drive the PFC circuit and the inverter circuit.

[0019] Further, the inverter circuit includes a U-phase upper bridge arm diode Q2, a U-phase lower bridge arm diode Q5, a V-phase upper bridge arm diode Q3, a V-phase lower bridge arm diode Q6, a W-phase upper bridge arm diode Q4 and a W-phase lower bridge arm diode Q7;

[0020] The collector of the U-phase upper bridge arm diode Q2, the collector of the V-phase upper bridge arm diode Q3 and the collector of the W-phase upper bridge arm diode Q4 are all connected to the VCC pin of the three-in-one power module, and the VCC pin of the three-in-one power module serves as the positive input terminal of the inverter circuit. The emitter of the U-phase lower bridge arm diode Q5, the emitter of the V-phase lower bridge arm diode Q6 and the emitter of the W-phase lower bridge arm diode Q7 are all connected to the UVW-pin of the three-in-one power module; the HO1 pin of the driver IC is connected to the gate of the U-phase upper bridge arm diode Q2, the HO2 pin of the driver IC is connected to the gate of the V-phase upper bridge arm diode Q3, the HO3 pin of the driver IC is connected to the gate of the W-phase upper bridge arm diode Q4, the LO1 pin of the driver IC is connected to the gate of the U-phase lower bridge arm diode Q5, the LO2 pin of the driver IC is connected to the gate of the V-phase lower bridge arm diode Q6, and the LO3 pin of the driver IC is connected to the gate of the W-phase lower bridge arm diode Q7.

[0021] Further, the rectifier circuit includes a diode D4, a diode D5, a diode D6 and a diode D7, the anode of the diode D4 is connected to the anode of the diode D5, the cathode of the diode D6 is connected to the cathode of the diode D7, the cathode of the diode D7 serves as the DC-P pin of the three-in-one power module, and the anode of the diode D4 serves as the DC-N pin of the three-in-one power module;

[0022] The cathode of the diode D4 is connected to the anode of the diode D7, the cathode of the diode D5 is connected to the anode of the diode D6, the cathode of the diode D4 serves as the AC2 pin of the three-in-one power module, and the cathode of the diode D5 serves as the AC1 pin of the three-in-one power module.

[0023] Furthermore, it also includes a thermistor NTC, which is connected between the FLT / EN pin and the VSS pin of the three-in-one power module, and the FLT / EN pin of the three-in-one power module is connected to the FLT / EN pin of the driver IC. The NTC thermistor is used to detect temperature and input a temperature sampling signal to the driver IC.

[0024] Furthermore, it also includes a plurality of bootstrap capacitors, and the plurality of bootstrap capacitors are respectively connected to the driving IC.

[0025] Furthermore, it also includes a plurality of filter capacitors, and the plurality of filter capacitors are respectively connected to the driver IC.

[0026] Compared with the prior art, the technical solution provided by the present invention can include the following beneficial effects:

[0027] A support base and a fixing column are designed on the module package. The fixing column is embedded in the PCB board, and the support base supports the PCB board. The support base and the fixing column fix and limit the module and the PCB board to prevent the module from horizontally shifting due to shaking during vibration. The module packaging structure not only meets the premise of protecting the module, but also solves the problems of high cost and low installation efficiency of using a bracket to fix the module. At the same time, a three-in-one power module is proposed. The three-in-one power module integrates the rectification part, PFC, and inverter functions into one module, which not only improves the integration of the module, but also reduces the wiring around the PCB and improves the anti-interference ability of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the structure of a module package in the present invention;

[0029] Figure 2 It is a circuit schematic diagram of a three-in-one power module in the present invention;

[0030] Figure 3 It is a partial enlarged diagram of a rectifier circuit in the present invention;

[0031] Figure 4 It is a partial enlarged diagram of a PFC circuit in the present invention;

[0032] Figure 5It is a partial enlarged diagram of an inverter circuit in the present invention;

[0033] Figure 6 It is a partial enlarged view of a driver IC part in the present invention;

[0034] Among them: support base 1, fixing column 2, module housing 3, rectifier circuit 5, PFC circuit 6, inverter circuit 7, driver IC 8, bootstrap capacitor 9, filter capacitor 10. DETAILED DESCRIPTION

[0035] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0036] In the description of the present invention, it is necessary to understand that the terms "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" or "second" may explicitly or implicitly include one or more of the features, and are used to distinguish and describe features, without distinction of order or importance.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0039] A preferred embodiment of the present application is as follows Figure 1 The module packaging structure is installed on a PCB board and includes a support seat 1, a fixing column 2 and a module housing 3;

[0040] The support base 1 and the fixing column 2 are both arranged on the side of the module housing 3 facing the PCB board;

[0041] The fixing column 2 and the support seat 1 are arranged in a centrally symmetrical manner with the center of the module housing 3 as a symmetrical point, and the fixing column 2 and the support seat 1 are arranged in sequence from the center to the four corners;

[0042] The support base 1 is used to support the module housing 3;

[0043] The fixing column 2 is used to be plugged into and matched with the limiting hole on the PCB board;

[0044] The height of the fixing column 2 is higher than the height of the supporting base 1;

[0045] The height of the fixing column 2 is equal to the height of the supporting base 1 plus the depth of the limiting hole.

[0046] Specifically, the PCB board is provided with a limiting hole, and the limiting hole corresponds to the fixing column 2 one by one. After the pins are welded, the module housing 3 is plugged into the PCB board through the cooperation of the fixing column 2 and the limiting hole. The height of the fixing column 2 is equal to the height of the support seat 1 plus the depth of the limiting hole. When the module housing 3 is plugged into the PCB board, the PCB board fits the support seat 1. The cooperation between the fixing column 2 and the limiting hole can prevent the module from being horizontally offset due to shaking during vibration, which brings unnecessary risks to the module pins. At the same time, the support seat 1 plays a supporting role. The support seat 1 can support the module to avoid the module and the PCB from being attached together, which affects the reliable operation of the module. It can solve the risk of breaking the module pins due to transportation vibration or falling, and can also reduce material costs and installation costs, and improve the installation efficiency of the module.

[0047] In an optional embodiment, the support base 1 is a horizontally placed trapezoidal body, and the lower bottom surface of the support base 1 faces the central area of ​​the module housing.

[0048] Specifically, the top of the trapezoidal body is narrow, and the support base of the trapezoidal body can be set closer to the corner of the module to reduce the impact of the support base on the circuit layout inside the module. At the same time, the bottom of the trapezoidal body is wide, which can provide a larger support area, thereby increasing the stability of the support.

[0049] A preferred embodiment of the present application is as follows Figure 2 As shown, a three-in-one power module using the module packaging structure is applied, the three-in-one power module integrates a rectifier circuit 5, a PFC circuit 6, an inverter circuit 7 and a driver IC 8, and the three-in-one power module has a W-phase output terminal, a V-phase output terminal and a U-phase output terminal for three-phase current to flow out;

[0050] The rectifier circuit 5 is used to perform uncontrolled rectification on the external AC power;

[0051] The PFC circuit 6 is used to improve the power factor, the control end of the PFC circuit 6 is connected to the PFCOUT terminal of the driver IC 8, and the PFC terminal of the PFC circuit 6 outputs a PFC control signal to the outside;

[0052] The inverter circuit 7 is used to convert the input direct current into alternating current, is connected to the driver IC 8, and provides three-phase alternating current to the driver IC 8 and the outside;

[0053] The driving IC 8 is used to drive the PFC circuit 6 and the inverter circuit 7 .

[0054] Specifically, Figure 2 As shown, in the embodiment of the present invention, the PFC circuit 6 includes an IGBT transistor Q1, a diode D1, a PFCOUT pin of a driver IC8, a -VCC pin 29 of a three-in-one power module, and a PFC pin (10) of the three-in-one power module. The gate of the IGBT transistor Q1 is connected to the PFCOUT pin of the driver IC8, the collector of the IGBT transistor Q1 is connected to the anode of the diode D1, and the cathode of the diode D1 is externally connected to the DC bus of the PCB board through the VCC pin 13 of the three-in-one power module. At the same time, the DC bus voltage of the PCB board is also connected through the VCC pin 13 of the three-in-one power module. The gate of the IGBT transistor Q1 is connected to the PFCOUT pin of the driver IC8, and the driver IC8 outputs a PFC driving signal to the PFC circuit 6 to control the PFC circuit 6 to output a PFC control signal to the outside, thereby realizing the PFC function of the three-in-one power module. The driver IC8 is provided with an IGBT for driving an external motor, which is a chip for driving the IGBT inside the three-in-one power module.

[0055] The main circuit inside the IPM module is composed of an uncontrolled rectifier part and an inverter circuit part. The uncontrolled rectifier part is the rectifier circuit 5, and its main function is to perform uncontrolled rectification on the voltage output by the voltage regulator. In the same IPM module, the rectified voltage will generally be used as the bus voltage of the inverter circuit through the PCB board. The inverter circuit part is the inverter circuit 7, which mainly inverts the bus voltage, and controls the inverter output of the corresponding three-phase voltage to drive the motor according to the PWM input of the control board. By integrating the rectifier part inside the module first, it can reduce PCB routing, improve the efficiency of module installation, reduce external line crosstalk, and make the module operation more stable.

[0056] Integrating the rectification part, PFC and inverter functions into one module not only improves the integration of the module, but also reduces the wiring around the PCB and improves the anti-interference ability of the module.

[0057] In an optional embodiment, the inverter circuit 7 includes a U-phase upper bridge arm diode Q2, a U-phase lower bridge arm diode Q5, a V-phase upper bridge arm diode Q3, a V-phase lower bridge arm diode Q6, a W-phase upper bridge arm diode Q4 and a W-phase lower bridge arm diode Q7;

[0058] The collector of the U-phase upper bridge arm diode Q2, the collector of the V-phase upper bridge arm diode Q3 and the collector of the W-phase upper bridge arm diode Q4 are all connected to the VCC pin 13 of the three-in-one power module, and the VCC pin 13 of the three-in-one power module serves as the positive input terminal of the inverter circuit 7. The emitter of the U-phase lower bridge arm diode Q5, the emitter of the V-phase lower bridge arm diode Q6 and the emitter of the W-phase lower bridge arm diode Q7 are all connected to the UVW- pin 30 of the three-in-one power module; the HO1 pin of the driver IC8 The HO2 pin of the driver IC8 is connected to the gate of the upper bridge arm diode Q2 of the U phase, the HO3 pin of the driver IC8 is connected to the gate of the upper bridge arm diode Q4 of the W phase, the LO1 pin of the driver IC8 is connected to the gate of the lower bridge arm diode Q5 of the U phase, the LO2 pin of the driver IC8 is connected to the gate of the lower bridge arm diode Q6 of the V phase, and the LO3 pin of the driver IC8 is connected to the gate of the lower bridge arm diode Q7 of the W phase.

[0059] Specifically, the driving IC 8 outputs a corresponding control signal to enable the inverter circuit 7 to operate, thereby realizing the inverter function of the three-in-one power module.

[0060] VB1 pin of driver IC8, VB2 pin of driver IC8, VB3 pin of driver IC8, VB1 pin 24 of three-in-one power module, VB3 pin 16 of three-in-one power module, VS1 pin of driver IC8, VS2 pin of driver IC8, VS3 pin of driver IC8, U, VS1 pin 26 of three-in-one power module, V, VS1 pin 21 of three-in-one power module and W, VS1 pin 17 of three-in-one power module;

[0061] The VB1 pin of the driver IC8 is connected to the VB1 pin 24 of the three-in-one power module, the VB2 pin of the driver IC8 is connected to the VB2 pin 20 of the three-in-one power module, and the VB3 pin of the driver IC8 is connected to the VB2 pin 20 of the three-in-one power module;

[0062] The VS1 pin of the driver IC8 is connected to the U, VS1 pin 26 of the three-in-one power module, the VS2 pin of the driver IC8 is connected to the V, VS1 pin 21 of the three-in-one power module, and the VS3 pin of the driver IC8 is connected to the W, VS1 pin 17 of the three-in-one power module;

[0063] The VB1 pin and VS1 pin of the driver IC8 are respectively connected to the VB1 pin 24 and U, VS1 pin 26 of the three-in-one power module, the VB1 pin 24 of the three-in-one power module is the positive pole of the corresponding U-phase upper bridge arm drive circuit power supply, and the U, VS1 pin 26 of the three-in-one power module is the negative pole of the corresponding U-phase upper bridge arm drive circuit power supply; the VB2 pin and VS2 pin of the driver IC8 are respectively connected to the VB2 pin 20 and V, VS1 pin 21 of the three-in-one power module, VB2 pin 20 is the corresponding positive pole of the V-phase upper bridge arm drive circuit power supply, and V, VS1 pin 21 of the three-in-one power module is the corresponding negative pole of the V-phase upper bridge arm drive circuit power supply; the VB3 pin and VS3 pin of the driver IC8 are respectively connected to the VB3 pin 16 and W, VS1 pin 17 of the three-in-one power module, and the VB3 pin 16 of the three-in-one power module is the corresponding positive pole of the W-phase upper bridge arm drive circuit power supply, and the W, VS1 pin 17 of the three-in-one power module is the corresponding negative pole of the W-phase upper bridge arm drive circuit power supply.

[0064] In an optional embodiment, the rectifier circuit 5 includes a diode D4, a diode D5, a diode D6 and a diode D7, the anode of the diode D4 is connected to the anode of the diode D5, the cathode of the diode D6 is connected to the cathode of the diode D7, the cathode of the diode D7 serves as the DC-P pin of the three-in-one power module, and the anode of the diode D4 serves as the DC-N pin of the three-in-one power module;

[0065] The cathode of the diode D4 is connected to the anode of the diode D7, the cathode of the diode D5 is connected to the anode of the diode D6, the cathode of the diode D4 serves as the AC2 pin of the three-in-one power module, and the cathode of the diode D5 serves as the AC1 pin of the three-in-one power module.

[0066] Specifically, the cathode of the diode D7 serves as the DC-P pin of the three-in-one power module, and thus serves as the positive output terminal of the rectifier circuit 5; the anode of the diode D4 serves as the DC-N pin of the three-in-one power module, which is the negative output terminal of the rectifier circuit 5; the cathode of the diode D5 serves as the AC1 pin of the three-in-one power module, which is the first input terminal of the rectifier circuit 5; the cathode of the diode D4 serves as the AC2 pin of the three-in-one power module, which is the second input terminal of the rectifier circuit 5.

[0067] In an optional embodiment, a thermistor NTC is further included, and the thermistor NTC is connected between the FLT / EN pin and the VSS pin of the three-in-one power module, and the FLT / EN pin of the three-in-one power module is connected to the FLT / EN pin of the driver IC8. The NTC thermistor is used to detect the temperature and input the temperature sampling signal to the driver IC8.

[0068] Specifically, the NTC thermistor inputs the temperature sampling signal to the driver IC8. When it is detected that the temperature is too high, the driver IC8 can send a fault signal to perform corresponding fault protection actions to protect the external motor.

[0069] In an optional embodiment, a plurality of bootstrap capacitors 9 are further included, and the plurality of bootstrap capacitors are respectively connected to the driving IC 8 .

[0070] Specifically, the positive lead of the upper bridge arm driving circuit power supply of the U phase, V phase and W phase and the negative lead of the upper bridge arm driving circuit power supply are provided with the bootstrap capacitor 9 near the driving IC 8, and the bootstrap capacitor 9 can eliminate the high-frequency impedance generated by the distributed inductance and resistance.

[0071] In an optional embodiment, a plurality of filter capacitors 10 are further included, and the plurality of filter capacitors are respectively connected to the driver IC 8 .

[0072] Specifically, the filter capacitor 10 is connected between the input and output ends of the power supply voltage, which can filter out fluctuations and noise in the power supply voltage, making the voltage output by the power supply more stable and stable, ensuring the normal operation of the driver IC8 and other electronic devices. When the driver IC8 is started instantly or the operating frequency is switched, the filter capacitor 10 can be used as a decoupling capacitor to weaken the conduction of the current fluctuations of the driver IC8 to the power supply, and provide instantaneous current for the driver IC8.

[0073] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A module packaging structure, characterized in that: Installed on the PCB board, including a support base, a fixing column and a module housing; The support seat and the fixing column are both arranged on the side of the module housing facing the PCB board; The fixing column and the supporting seat are arranged in a centrally symmetrical manner with the center of the module housing as a symmetrical point, and the fixing column and the supporting seat are arranged in sequence from the center to the four corners; The support base is used to support the module housing; The fixing column is used to be plugged into and matched with the limiting hole on the PCB board; The height of the fixing column is higher than the height of the supporting seat; The height of the fixing column is equal to the height of the supporting seat plus the depth of the limiting hole.

2. The module packaging structure according to claim 1, characterized in that: The support base is a horizontally placed trapezoidal body, and the lower bottom surface of the support base faces the central area of ​​the module housing.

3. A three-in-one power module, characterized in that: The module packaging structure according to any one of claims 1 to 2 is applied, the three-in-one power module integrates a rectifier circuit, a PFC circuit, an inverter circuit and a driver IC, and the three-in-one power module has a W-phase output terminal, a V-phase output terminal and a U-phase output terminal for three-phase current to flow out; The rectifier circuit is used to perform uncontrolled rectification on the external alternating current; The PFC circuit is used to improve the power factor, the control end of the PFC circuit is connected to the PFCOUT terminal of the driver IC, and the PFC terminal of the PFC circuit outputs a PFC control signal to the outside; The inverter circuit is used to convert the input direct current into alternating current, is connected to the driver IC, and provides three-phase alternating current to the driver IC and the outside; The driving IC is used to drive the PFC circuit and the inverter circuit.

4. The three-in-one power module according to claim 3, characterized in that: The inverter circuit includes a U-phase upper bridge arm diode Q2, a U-phase lower bridge arm diode Q5, a V-phase upper bridge arm diode Q3, a V-phase lower bridge arm diode Q6, a W-phase upper bridge arm diode Q4 and a W-phase lower bridge arm diode Q7; The collector of the U-phase upper bridge arm diode Q2, the collector of the V-phase upper bridge arm diode Q3 and the collector of the W-phase upper bridge arm diode Q4 are all connected to the VCC pin of the three-in-one power module, and the VCC pin of the three-in-one power module serves as the positive input terminal of the inverter circuit. The emitter of the U-phase lower bridge arm diode Q5, the emitter of the V-phase lower bridge arm diode Q6 and the emitter of the W-phase lower bridge arm diode Q7 are all connected to the UVW-pin of the three-in-one power module; the HO1 pin of the driver IC is connected to the gate of the U-phase upper bridge arm diode Q2, the HO2 pin of the driver IC is connected to the gate of the V-phase upper bridge arm diode Q3, the HO3 pin of the driver IC is connected to the gate of the W-phase upper bridge arm diode Q4, the LO1 pin of the driver IC is connected to the gate of the U-phase lower bridge arm diode Q5, the LO2 pin of the driver IC is connected to the gate of the V-phase lower bridge arm diode Q6, and the LO3 pin of the driver IC is connected to the gate of the W-phase lower bridge arm diode Q7.

5. The three-in-one power module according to claim 3, characterized in that: The rectifier circuit includes a diode D4, a diode D5, a diode D6 and a diode D7, the anode of the diode D4 is connected to the anode of the diode D5, the cathode of the diode D6 is connected to the cathode of the diode D7, the cathode of the diode D7 serves as the DC-P pin of the three-in-one power module, and the anode of the diode D4 serves as the DC-N pin of the three-in-one power module; The cathode of the diode D4 is connected to the anode of the diode D7, the cathode of the diode D5 is connected to the anode of the diode D6, the cathode of the diode D4 serves as the AC2 pin of the three-in-one power module, and the cathode of the diode D5 serves as the AC1 pin of the three-in-one power module.

6. The three-in-one power module according to claim 3, characterized in that: It also includes a thermistor NTC, which is connected between the FLT / EN pin and the VSS pin of the three-in-one power module. The FLT / EN pin of the three-in-one power module is connected to the FLT / EN pin of the driver IC. The NTC thermistor is used to detect temperature and input a temperature sampling signal to the driver IC.

7. The three-in-one power module according to claim 3, characterized in that: It also includes a plurality of bootstrap capacitors, which are respectively connected to the driving ICs.

8. The three-in-one power module according to claim 3, characterized in that: It also includes a plurality of filter capacitors, and the plurality of filter capacitors are respectively connected to the drive IC.

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