Ceramic chip packaging structure and method

Abstract

The invention provides a ceramic chip packaging structure and method, and the method comprises the steps: providing a substrate, arranging a steel mesh on the substrate, and forming a circular ceramic chip installation region; arranging a flexible circuit board and a detection head on the ceramic chip mounting area; printing solder paste within a first radius range around the detection head; fourthly, the periphery of the solder paste is coated with red glue; providing a ceramic chip, and covering the ceramic chip mounting area with the ceramic chip to form a primary product; carrying out reflux treatment on the primary product; the periphery of the ceramic chip is sealed by silica gel; and the middle hole of the ceramic chip is sealed by UV glue. According to the ceramic chip packaging method and packaging structure, the solder paste is designed to be distributed around the detection head, the risk that the solder paste spreads to the center is reduced, due to the design of red glue isolation, when reflow soldering is carried out, due to the fact that the melting point of the red glue is higher than that of the solder paste, the red glue cannot be molten when the solder paste is molten, and the service life of the solder paste is prolonged. And the flowability of the red glue is poor, so that outward flowing of the solder paste is limited.

Description

Technical Field

[0001] The present invention relates to the field of chip manufacturing, and in particular to a ceramic chip packaging structure and method. Background Art

[0002] Ceramic chips and ceramic sensors are often used in the medical field to detect various indicators of the human body. The mainstream ceramic chip structures on the market are various, such as CN102868389B for operating a piezoelectric ceramic sensor and a circuit for executing the method, CN107991006A for applying a preloaded piezoelectric ceramic dynamic tensile stress sensor and its calibration method, CN118169255A for a multi-modal SH wave piezoelectric ceramic sensor and its design method, etc.

[0003] Our company currently produces a ceramic chip, and the technical problem we face is that the ceramic chip needs to be printed with solder paste before packaging, and then the ceramic sheet is attached. In order to ensure that the ceramic sheet is tightly bonded with the solder paste and the substrate, it needs to be reflowed in a reflow oven, and then packaged after the reflow is completed. Since reflow is carried out in a reflow oven, the temperature is high enough to melt the solder paste again, but after the solder paste melts, it will be under the pressure of the ceramic sheet, and due to its own fluidity, the solder paste will spread to the center and overflow to the surroundings, making subsequent packaging impossible.

[0004] Based on this technical status, it is necessary to further solve the problem of the fluidity of the molten solder paste causing it to spread to the center and overflow to the surrounding areas. Summary of the invention

[0005] The technical problem to be solved by the embodiments of the present invention is to provide a ceramic chip packaging structure and method to solve the problem that the fluidity of the molten solder paste causes it to spread toward the center and overflow to the surroundings.

[0006] In order to solve the above technical problems, the present invention provides a ceramic chip packaging method, comprising:

[0007] The first step is to provide a substrate and arrange a steel mesh on the substrate to form a circular ceramic sheet mounting area;

[0008] Step 2: Arrange the flexible circuit board and the detection head on the ceramic sheet installation area, and make the detection head located in the center of the ceramic sheet installation area, so that the external circuit of the flexible circuit board extends to the edge of the ceramic sheet installation area;

[0009] Step 3: Print solder paste within the first radius around the detection head;

[0010] Step 4: Apply red glue on the periphery of the solder paste and make the red glue into a ring shape;

[0011] Step 5: Provide a ceramic sheet and cover the ceramic sheet installation area with the ceramic sheet so that the detection head is exposed from the middle hole of the ceramic sheet to form a primary product;

[0012] Step 6: Reflux the primary product;

[0013] Step 7: Use silicone to seal around the ceramic piece;

[0014] Step 8: The central hole of the ceramic sheet is sealed with UV glue, and then the UV glue is cured by ultraviolet light irradiation to form a delivered product.

[0015] The solder paste is arranged in three or four petals, with an annular structure on the periphery and an arc-shaped interior, so as to form a void area in the center that is larger than the detection head.

[0016] In the third step, the first radius is smaller than 3 / 4 of the radius of the ceramic sheet.

[0017] The red glue is a closed loop or is spaced apart by a number of tiny gaps.

[0018] The ceramic chip packaging structure is manufactured by the packaging method described above.

[0019] The ceramic chip packaging method and packaging structure provided by the present invention design the solder paste to be distributedly arranged around the detection head, thereby reducing the risk of the solder paste spreading to the center. Through the design of red glue isolation, during reflow soldering, since the melting point of the red glue is higher than that of the solder paste, the melting of the solder paste will not cause the red glue to melt, and the red glue has poor fluidity, thereby limiting the outward flow of the solder paste. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the first step of the packaging method described in an embodiment of the present invention.

[0021] Figure 2 It is a structural schematic diagram of the second step of the packaging method described in an embodiment of the present invention.

[0022] Figure 3 It is a structural schematic diagram of the third step of the packaging method described in an embodiment of the present invention.

[0023] Figure 4 It is a structural schematic diagram of the fourth step of the packaging method described in an embodiment of the present invention.

[0024] Figure 5 It is a structural schematic diagram of the fifth step of the packaging method described in the embodiment of the present invention.

[0025] Figure 6 It is a structural schematic diagram of the seventh step of the packaging method described in an embodiment of the present invention.

[0026] Figure 7It is a structural schematic diagram of the eighth step of the packaging method described in an embodiment of the present invention. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0028] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0030] like Figure 1-7 As shown, the present invention provides a ceramic chip packaging method, comprising:

[0031] Step 1: Reference Figure 1 , providing a substrate 1, and arranging a steel mesh 2 on the substrate to form a circular ceramic sheet mounting area 21; the substrate is made of PCB material, and the steel mesh 2 is prefabricated, the center of the steel mesh is circular, and the diameter is slightly larger than the diameter of the ceramic sheet, so as to facilitate forming an area for mounting a flexible circuit board therein;

[0032] Step 2: Reference Figure 2 , the flexible circuit board 3 and the detection head 31 are arranged on the ceramic sheet mounting area 21, and the detection head 31 is located at the center of the ceramic sheet mounting area 21, so that the external circuit of the flexible circuit board 3 extends to the edge of the ceramic sheet mounting area 21; the flexible circuit board 3 is attached to the surface of the substrate 1 by an attachment method;

[0033] Step 3: Reference Figure 3, printing solder paste 4 within a first radius around the detection head 31; the solder paste is arranged around the detection head 31 in the shape of four petals, and a certain distance is reserved between the inner edge of the petals and the detection head 31, and the size of the distance is greater than the radius of the middle hole 61 of the ceramic plate, so as to prevent the solder paste from spreading toward the center and then emerging from the middle hole of the ceramic plate;

[0034] Step 4: Reference Figure 4 , apply red glue 5 on the periphery of solder paste 4, and make the red glue form a ring; the red glue restricts the overflow of solder paste from all sides; the height of the red glue is usually slightly higher than the height of solder paste 4;

[0035] Step 5: Reference Figure 5 , providing a ceramic sheet 6, and covering the ceramic sheet installation area with the ceramic sheet 6, so that the detection head is exposed from the middle hole 61 of the ceramic sheet, forming a primary product;

[0036] Step 6: Reflow the primary product. This step needs to be carried out in a reflow oven. For specific processes, please refer to the design requirements of the reflow oven.

[0037] Step 7: Reference Figure 6 , a silicone seal 7 is used around the ceramic sheet 6 to seal the ceramic sheet and the substrate 6 to prevent external liquid from entering the ceramic sheet through the edge of the ceramic sheet;

[0038] Step 8. Reference Figure 7 The middle hole of the ceramic sheet 6 is sealed with UV glue 8, and the cover sealing structure also adopts a ring shape to seal the periphery of the middle hole, leaving only the detection head 31 exposed, and then the UV glue is cured by ultraviolet light irradiation to form a delivered product.

[0039] The solder paste is arranged in three or four petals, with an annular structure on the periphery and an arc-shaped interior, so as to form a void area in the center that is larger than the detection head.

[0040] In the third step, the first radius is smaller than 3 / 4 of the radius of the ceramic sheet.

[0041] The red glue is a closed loop or is spaced apart by a number of tiny gaps.

[0042] The ceramic chip packaging structure is manufactured by the packaging method described above.

[0043] The ceramic chip packaging method and packaging structure provided by the present invention design the solder paste to be distributedly arranged around the detection head, thereby reducing the risk of the solder paste spreading to the center. Through the design of red glue isolation, during reflow soldering, since the melting point of the red glue is higher than that of the solder paste, the melting of the solder paste will not cause the red glue to melt, and the red glue has poor fluidity, thereby limiting the outward flow of the solder paste.

[0044] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0045] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A ceramic chip packaging method, comprising: The first step is to provide a substrate and arrange a steel mesh on the substrate to form a circular ceramic sheet mounting area; Step 2: Arrange the flexible circuit board and the detection head on the ceramic sheet installation area, and make the detection head located in the center of the ceramic sheet installation area, so that the external circuit of the flexible circuit board extends to the edge of the ceramic sheet installation area; Step 3: Print solder paste within the first radius around the detection head; Step 4: Apply red glue on the periphery of the solder paste and make the red glue into a ring shape; Step 5: Provide a ceramic sheet and cover the ceramic sheet installation area with the ceramic sheet so that the detection head is exposed from the middle hole of the ceramic sheet to form a primary product; Step 6: Reflux the primary product; Step 7: Use silicone to seal around the ceramic piece; Step 8: The central hole of the ceramic sheet is sealed with UV glue, and then the UV glue is cured by ultraviolet light irradiation to form a delivered product.

2. The method according to claim 1, characterized in that The solder paste is arranged in three or four petals, with an annular structure on the periphery and an arc-shaped interior, so as to form a void area in the center that is larger than the detection head.

3. The method according to claim 1, characterized in that In the third step, the first radius is smaller than 3 / 4 of the radius of the ceramic sheet.

4. The method according to claim 1, characterized in that: The red glue is a closed loop or is spaced apart by a number of tiny gaps.

5. A ceramic chip packaging structure, characterized in that: It is manufactured by the packaging method described above.

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