Silicon carbide honeycomb ceramic carrier
By setting a polygonal pore structure in the silicon carbide honeycomb ceramic carrier, the existing carrier has solved the problems of low mechanical strength and poor pollution resistance in water treatment, and the effect of efficient water filtration and improving compressive strength is achieved.
Patent Information
- Application Number
- CN202510026023.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2025-04-15
AI Technical Summary
During the water treatment process, existing honeycomb ceramic carriers have problems such as low mechanical strength, not resistant to organic solvents, not resistant to microbial corrosion, not resistant to chemical corrosion, easy deformation of membrane pores, poor anti-pollution ability, and complex structure.
The silicon carbide honeycomb ceramic carrier adopts a polygonal pore structure. By uniformly setting polygonal through holes in the tubular honeycomb ceramic carrier, the pressure between the walls is reduced, which is conducive to reducing pressure and water effluent.
It realizes efficient water filtration, improves the compressive strength and service life of the carrier, and has the advantages of high purity water flux, strong acid and alkali resistance, and high bonding strength of interfaces at different levels.
Smart Images
Figure CN119819121A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of water treatment, and in particular to a tubular honeycomb ceramic carrier. Background Art
[0002] Honeycomb ceramics are composed of numerous equal holes in various shapes, with the largest number of holes reaching 120 to 140 per square centimeter, a density of 0.3 to 0.6 grams per cubic centimeter, and a water absorption rate of up to 20%. Due to the characteristics of porous thin walls, the geometric surface area of the carrier is greatly increased and the thermal shock resistance is improved. The mesh holes of the products produced are mainly triangular and square. The triangular ones have much better bearing capacity than the square ones, and the number of holes is also more. This is especially important as a catalytic carrier. With the increase of the number of holes per unit area and the decrease of the thickness of the carrier pore wall, the thermal shock resistance of the ceramic carrier is improved, and the temperature of thermal shock damage is also increased. Therefore, honeycomb ceramics must reduce the expansion coefficient and increase the number of holes per unit area. The earliest raw materials for the production of honeycomb ceramics were mainly kaolin, talc, aluminum powder, clay, etc., especially the application of diatomaceous earth, zeolite, expanded soil and refractory materials. Honeycomb ceramics are increasingly widely used and their performance is getting better and better.
[0003] In addition to honeycomb ceramics for sintering, unsintered honeycomb ceramics have also appeared, which greatly improves the activity of catalytic performance. Not only has the appearance size developed from the smallest ball ring shape to large-sized columns, squares and circles. According to different mold designs, honeycomb ceramics of different sizes, shapes and structures can be made. For example, the molecular sieve catalyst used in the air adsorption drying of oil refining in the petrochemical industry has a size of up to 0.8m and a width of 0.25m square, with a hole number of 25 per square centimeter. There have been great changes in raw materials, processes and mechanical manufacturing. In particular, the production process has been greatly improved. Honeycomb ceramics as catalysts require no cracking during manufacturing and molding, and the organic components must be released cleanly. In addition to wear resistance, they also require a certain mechanical strength and can be regenerated and reused many times.
[0004] Honeycomb ceramics can be made of a variety of materials. The main materials are: cordierite, mullite, aluminum titanate, activated carbon, silicon carbide, activated alumina, zirconium oxide, silicon nitride and cordierite-mullite, cordierite-aluminum titanate and other composite matrices.
[0005] After the activated carbon powder or particles are made into honeycomb ceramic shapes, the purification and wastewater treatment capabilities of water treatment are greatly improved, especially in the pharmaceutical industry, antibiotics, hormones, vitamins, nucleic acid injections and various injections, dehydration, decolorization and impurity removal of drugs, etc. In the more complex water treatment field, such ceramic membranes have problems such as low mechanical strength, resistance to organic solvents, resistance to microbial erosion, resistance to chemical erosion, easy deformation of membrane pores, poor anti-pollution ability, and complex structure.
[0006] Therefore, there is still a need for a pressure-resistant tubular honeycomb ceramic carrier that can be used for efficient water treatment. Summary of the invention
[0007] In view of the above problems, the present invention provides a silicon carbide honeycomb ceramic carrier having a polygonal pore structure, which is beneficial for bearing uniform pressure during water treatment and facilitating water filtration.
[0008] The technical solution adopted by the present invention to solve the above technical problems is: a silicon carbide honeycomb ceramic carrier, which includes: a tubular honeycomb ceramic carrier, wherein polygonal through holes are evenly arranged parallel to the axial direction of the tubular honeycomb ceramic carrier.
[0009] In the above technical solution, compared with circular holes, by providing polygonal holes, the thickness of the side walls between adjacent through holes can be made uniform, thereby reducing the pressure between the walls, which is beneficial to reducing pressure and water discharge.
[0010] In a further embodiment, the polygon is a regular hexagon. In other embodiments, the polygon is a regular triangle, a regular quadrilateral, a regular pentagon or a regular octagon.
[0011] In the above technical solution, by setting the through holes into regular hexagons, it is beneficial to form a tube cross-section with a honeycomb structure, in which the wall thickness between two adjacent holes is uniform, thereby greatly reducing the filtration pressure compared to circular holes, which is beneficial to water discharge and prolonging the service life.
[0012] In a further embodiment, the tubular honeycomb ceramic carrier is a recrystallized silicon carbide honeycomb ceramic carrier, a composite silicon carbide honeycomb ceramic carrier or a cordierite honeycomb ceramic carrier.
[0013] In this technical solution, especially when recrystallized silicon carbide is used as the carrier material, a honeycomb ceramic filter carrier with high compressive strength can be produced, so that it can be used in application scenarios with higher pressure requirements.
[0014] In a further embodiment, the thickness of the wall between two adjacent holes is 100 μm to 1 cm, preferably 1 mm-50 mm, further preferably 1 mm-10 mm, further preferably 1 mm-5 mm, for example 1 mm, 2 mm, 3 mm, 4 mm or 5 mm.
[0015] In this technical solution, the thinner the thickness between two adjacent holes, the better the water permeability, and thus the lower the required pressure. However, if the thickness is too thin, the compressive strength is likely to be too low.
[0016] In further embodiments, the average pore size of the wall between two adjacent holes is 1 nm to 50 μm, preferably 10 nm to 20 μm, more preferably 20 nm to 10 μm, and even more preferably 50 nm to 1 μm. For example, in some embodiments, the average pore size of the wall between two adjacent holes is 1 nm, 2 nm, 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, 8 nm, 9 nm, 10 nm, 11 nm, 12 nm, 13 nm, 14 nm, 15 nm, 16 nm, 17 nm, 18 nm, 19 nm, 20 nm. In other embodiments, the average pore size of the wall between two adjacent holes is 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, 100 nm, 110 nm, 120 nm, 130 nm, 140 nm, 150 nm, 160 nm, 170 nm, 180 nm, 190 nm, 200 nm. In some other embodiments, the average pore size of the wall between two adjacent holes is 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, or 20 μm.
[0017] In the above technical solution, by setting the average pore size of the wall between two adjacent pores to different pore sizes, different filtration ranges can be achieved, so that the obtained honeycomb ceramic carrier can be applied to different filtration scenarios. For example, in some cases, by setting the average pore size of the wall between two adjacent pores to 1-20nm, most of the ion components can be filtered out, thereby achieving the effect of reverse osmosis.
[0018] The beneficial effects of the present invention are: the prepared silicon carbide reverse osmosis membrane has high interconnected porosity, gradient pore distribution, high strength, high pure water flux, strong acid and alkali resistance, high interface bonding strength at different levels, simple operation, and high yield rate. The prepared silicon carbide reverse osmosis membrane has a flexural strength of >50MPa, a pure water flux of more than 8m / (mh), and a pH tolerance range of 0-14. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings, but this description does not constitute a limitation to the present invention.
[0020] Figure 1 is an overall view of a honeycomb ceramic support according to one embodiment of the present invention.
[0021] Figure 2 is an end view of a honeycomb ceramic support according to one embodiment of the present invention. DETAILED DESCRIPTION
[0022] The technical solution of the present invention is further described in detail below in conjunction with embodiments, but this description does not constitute a limitation of the present invention.
[0023] At present, the technology of applying honeycomb ceramic carriers (or membranes) to water treatment is still immature. To this end, the present invention proposes a silicon carbide honeycomb ceramic carrier, which includes: a tubular honeycomb ceramic carrier, wherein polygonal through holes are evenly arranged parallel to the axis direction of the tubular honeycomb ceramic carrier. Compared with circular holes, by setting polygonal holes, the side wall thickness between adjacent through holes can be made uniform, thereby reducing the pressure between the walls, which is conducive to reducing pressure and water discharge.
[0024] In some embodiments, the polygon is a regular hexagon. In other embodiments, the polygon is a regular triangle, a regular quadrilateral, a regular pentagon or a regular octagon. By arranging the through holes into regular hexagons, it is beneficial to form a tube cross section with a honeycomb structure, wherein the wall thickness between two adjacent holes is uniform, thereby greatly reducing the filtration pressure compared to the circular holes, which is beneficial to water discharge and prolonging the service life.
[0025] In other embodiments, the tubular honeycomb ceramic carrier is a recrystallized silicon carbide honeycomb ceramic carrier, a composite silicon carbide honeycomb ceramic carrier or a cordierite honeycomb ceramic carrier. In particular, when recrystallized silicon carbide is used as the carrier material, a honeycomb ceramic filter carrier with high compressive strength can be prepared, so as to be used in application scenarios with higher pressure requirements.
[0026] In other embodiments, the thickness of the wall between two adjacent holes is 100 μm to 1 cm, preferably 1 mm-50 mm, more preferably 1 mm-10 mm, and even more preferably 1 mm-5 mm, such as 1 mm, 2 mm, 3 mm, 4 mm or 5 mm. The thinner the thickness between two adjacent holes, the better the water permeability, and thus the lower the required pressure. However, if the thickness is too thin, the compressive strength is easily too low.
[0027] In other embodiments, the average pore size of the wall between two adjacent holes is 1 nm to 50 μm, preferably 10 nm to 20 μm, more preferably 20 nm to 10 μm, and more preferably 50 nm to 1 μm. For example, in some embodiments, the average pore size of the wall between two adjacent holes is 1 nm, 2 nm, 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, 8 nm, 9 nm, 10 nm, 11 nm, 12 nm, 13 nm, 14 nm, 15 nm, 16 nm, 17 nm, 18 nm, 19 nm, 20 nm. In other embodiments, the average pore size of the wall between two adjacent holes is 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, 100 nm, 110 nm, 120 nm, 130 nm, 140 nm, 150 nm, 160 nm, 170 nm, 180 nm, 190 nm, 200 nm. In some other embodiments, the average pore size of the wall between two adjacent holes is 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, or 20 μm.
[0028] Embodiment 1:
[0029] S1: Preparation of the base layer
[0030] S11, taking micron-sized silicon carbide powder, organosilicon polymer, asphalt, and tung oil in a mass ratio of 100:9:7:5 for standby use;
[0031] S12, mixing raw materials: firstly, mixing silicon carbide powder and organosilicon polymer evenly to form a mixture, then mixing asphalt and tung oil evenly to form a mixture, and finally mixing the obtained mixtures evenly again;
[0032] S13, putting the mixture obtained in step S12 into an extruder to form a body having a plurality of through holes;
[0033] S14, placing the silicon carbide body in an oven, heating it to 55°C at a rate of 5-10°C / min, and keeping it at that temperature for 25 minutes, and cooling it to room temperature with the oven to obtain a dry body;
[0034] S2: Preparation of filter layer
[0035] S21, immersing the dried green body obtained in step S14 in starch colloid for 3 minutes, and then drying in an oven;
[0036] S22, mixing water, nano silicon carbide powder, organosilicon polymer and carboxymethyl cellulose in a mass ratio of 100:33:12:1 to obtain silicon carbide slurry;
[0037] S23, injecting silicon carbide slurry into the channel of the dried body processed in step S21, and allowing the silicon carbide slurry to flow in the channel of the silicon carbide base layer for 30 seconds;
[0038] S24, placing the silicon carbide blank coated with silicon carbide slurry according to the method of step S23 into a tubular furnace, heating it to 1120°C at a rate of 10°C / min, keeping it warm for 1 hour, then heating it to 1450°C at a rate of 5°C / min, keeping it warm for 2 hours, cooling it to room temperature with the furnace, so that the silicon carbide substrate and the filter layer are completely sintered together, and finally a tubular reverse osmosis silicon carbide honeycomb membrane is obtained.
[0039] Embodiment 2:
[0040] S1: Preparation of the base layer
[0041] S11, taking micron-sized silicon carbide powder, organosilicon polymer, asphalt, and tung oil in a mass ratio of 100:9:8:5 for standby use;
[0042] S12, mixing raw materials: firstly, mixing silicon carbide powder and organosilicon polymer evenly to form a mixture, then mixing asphalt and tung oil evenly to form a mixture, and finally mixing the obtained mixtures evenly again;
[0043] S13, putting the mixture obtained in step S12 into an extruder to form a body having a plurality of through holes;
[0044] S14, placing the silicon carbide blank into an oven, heating it to 55°C at a rate of 5°C / min, and keeping it at that temperature for 25 minutes, and cooling it to room temperature with the oven to obtain a dry blank;
[0045] S2: Preparation of filter layer
[0046] S21, immersing the dried green body obtained in step S14 in starch colloid for 3 minutes, and then drying in an oven;
[0047] S22, mixing water, nano silicon carbide powder, organosilicon polymer and carboxymethyl cellulose in a mass ratio of 100:40:12:1 to obtain silicon carbide slurry;
[0048] S23, injecting silicon carbide slurry into the channel of the dried body processed in step S21, and allowing the silicon carbide slurry to flow in the channel of the silicon carbide base layer for 30 seconds;
[0049] S24, placing the silicon carbide blank coated with silicon carbide slurry according to the method of step S23 into a tubular furnace, heating it to 1120°C at a rate of 10°C / min, keeping it warm for 1 hour, then heating it to 1450°C at a rate of 5°C / min, keeping it warm for 2 hours, cooling it to room temperature with the furnace, so that the silicon carbide substrate and the filter layer are completely sintered together, and finally a tubular reverse osmosis silicon carbide honeycomb membrane is obtained.
[0050] Comparative Example 1
[0051] S1: Preparation of the base layer
[0052] S11, taking micron-sized silicon carbide powder, organosilicon polymer, asphalt and kerosene in a mass ratio of 100:9:8:5 for standby use;
[0053] S12, mixing raw materials: firstly, mixing silicon carbide powder and organosilicon polymer evenly to form a mixture, then mixing asphalt and tung oil evenly to form a mixture, and finally mixing the obtained mixtures evenly again;
[0054] S13, putting the mixture obtained in step S12 into an extruder to form a body having a plurality of through holes;
[0055] S14, placing the silicon carbide body in an oven, heating it to 55°C at a rate of 10°C / min, and keeping it at that temperature for 25 minutes, and cooling it to room temperature with the oven to obtain a dried body;
[0056] S2: Preparation of filter layer
[0057] S21, immersing the dried green body obtained in step S14 in starch colloid for 3 minutes, and then drying in an oven;
[0058] S22, mixing water, nano silicon carbide powder, organosilicon polymer and carboxymethyl cellulose in a mass ratio of 100:40:12:1 to obtain silicon carbide slurry;
[0059] S23, injecting silicon carbide slurry into the channel of the dried body processed in step S21, and allowing the silicon carbide slurry to flow in the channel of the silicon carbide base layer for 30 seconds;
[0060] S24, placing the silicon carbide blank coated with silicon carbide slurry according to the method of step S23 into a tubular furnace, heating it to 1120°C at a rate of 10°C / min, keeping it warm for 1 hour, then heating it to 1400°C at a rate of 5°C / min, keeping it warm for 2 hours, cooling it to room temperature with the furnace, so that the silicon carbide substrate and the filter layer are completely sintered together, and finally a tubular reverse osmosis silicon carbide honeycomb membrane is obtained.
Claims
1. A silicon carbide honeycomb ceramic carrier, characterized in that include: A honeycomb ceramic carrier, wherein polygonal through holes are evenly arranged parallel to the axial direction of the tubular honeycomb ceramic carrier, the tube wall is arc-shaped and has uniform thickness, the void distribution of the honeycomb ceramic carrier is uneven, and the average pore size is 10-20 microns.
2. The tubular honeycomb ceramic carrier according to claim 1, characterized in that: The polygon is a regular hexagon.
3. The tubular honeycomb ceramic carrier according to claim 1, characterized in that: The polygon is a regular triangle, a regular quadrilateral, a regular pentagon or a regular octagon.
4. The tubular honeycomb ceramic carrier according to claim 1, characterized in that: The tubular honeycomb ceramic carrier is a recrystallized silicon carbide honeycomb ceramic carrier, a composite silicon carbide honeycomb ceramic carrier or a cordierite honeycomb ceramic carrier.
5. The tubular honeycomb ceramic carrier according to claim 1, characterized in that: The thickness of the wall between two adjacent holes is 100 μm to 1 cm.
6. The tubular honeycomb ceramic carrier according to claim 5, characterized in that: The thickness of the wall between two adjacent holes is 1 mm to 50 mm.
7. The tubular honeycomb ceramic carrier according to claim 5, characterized in that: The thickness of the wall between two adjacent holes is 1 mm, 2 mm, 3 mm, 4 mm or 5 mm.
8. The tubular honeycomb ceramic carrier according to claim 5, characterized in that: The average pore diameter of the wall between two adjacent pores is 1 nm to 50 μm.
9. The tubular honeycomb ceramic carrier according to claim 5, characterized in that: The average pore size of the wall between two adjacent pores is 50 nm to 1 μm.
10. The tubular honeycomb ceramic carrier according to claim 5, characterized in that: The average pore size of the wall between two adjacent pores is 1 nm, 2 nm, 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, 8 nm, 9 nm, 10 nm, 11 nm, 12 nm, 13 nm, 14 nm, 15 nm, 16 nm, 17 nm, 18 nm, 19 nm, and 20 nm.