Blanking device for wafer production

Abstract

The invention relates to the technical field of blanking devices, and provides a blanking device for wafer production, which comprises a mounting rack and laser cutting equipment, and further comprises a plurality of arc-shaped supporting seats, a mounting barrel and a mounting seat, an arc-shaped bulge is arranged in the middle of each arc-shaped supporting seat, and a plurality of arc-shaped bulges are arranged in the mounting barrel; a circumference adjusting assembly is arranged between the multiple arc-shaped supporting seats and the mounting rack, supporting falling assemblies are arranged on the arc-shaped supporting seats, an XY-axis moving mechanism is arranged between the mounting barrel and the top of the mounting rack, the laser cutting equipment is arranged in the mounting barrel, and the mounting seats correspond to the arc-shaped supporting seats one to one. According to the technical scheme, the technical problem that in the prior art, in the cutting process of the outer side area of the wafer, due to the fact that the texture of the wafer is thin, when the outer side area of the wafer is continuously cut, the phenomenon that wafer waste inclines downwards easily occurs, and the cutting end face of the wafer is uneven is solved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of punching devices, and in particular, to a punching device for wafer production. Background Art

[0002] Wafers are one of the most important raw materials of LEDs. They are the light-emitting components of LEDs and the core part of LEDs. During the production process of wafers, two processes, polysilicon preparation and crystal growth, are first required to prepare polysilicon ingots. The polysilicon ingots are then sliced ​​to make wafers. The surface of the wafers is then ground and eroded to reduce mechanical defects on the surface of the wafers. The surface of the wafers is then polished and various front-end processes are performed on the wafers to form multiple separate circuit patterns inside the wafers. According to the multiple circuit patterns on the surface of the wafers, the surface of the wafers is cut using laser cutting equipment to separate the wafers into multiple rectangular chips, each of which is provided with a separate circuit pattern. The chips are then packaged to complete the wafer production operation.

[0003] When using laser cutting equipment to cut wafers, because the shape of each chip is generally rectangular, when cutting the wafer, the outermost area of ​​the wafer needs to be cut first. When cutting the outer area of ​​the wafer, the laser cutting equipment will be used to perform circular cutting on the outer side of the wafer. However, when cutting part of the wafer, because the wafer is thin, the waste material cut from the wafer will tilt downward. At this time, during the cutting process of the remaining area of ​​the wafer, it is easy for the waste material to tilt downward, resulting in an uneven surface texture of the wafer, which leads to an uneven cut end face of the wafer. Summary of the invention

[0004] In order to overcome the above-mentioned defects, an embodiment of the present invention provides a punching device for chip production, which solves the technical problem in the related technology that during the cutting process of the outer area of ​​the wafer, the wafer waste is easily tilted downward when the outer area of ​​the wafer is continuously cut due to the thin texture of the wafer, resulting in an uneven cut end surface of the wafer.

[0005] The present invention provides a wafer production punching device, comprising a mounting frame and a laser cutting device, and further comprising: An arc-shaped support seat, wherein the number of the arc-shaped support seats is set to be multiple, an arc-shaped protrusion is provided in the middle of the arc-shaped support seat, a circumferential adjustment component is provided between the multiple arc-shaped support seats and the mounting frame, and a support drop component is provided on the arc-shaped support seat; An installation cylinder, wherein an XY axis moving mechanism is arranged between the installation cylinder and the top of the installation frame, and the laser cutting device is arranged in the installation cylinder; The mounting seat corresponds one to one with the arc-shaped support seat, and the circumferential adjustment component is also arranged between the plurality of mounting seats and the mounting cylinder. An elastic extrusion component is arranged on one side of the mounting seat, and a longitudinal punching component is arranged on the other side of the mounting seat.

[0006] In order to adjust the positions of the arc-shaped support seat and the mounting seat, the circumferential adjustment assembly further includes a fixed cylinder, an annular threaded disk and a movable seat, the fixed cylinder is fixedly connected to the mounting frame or the mounting cylinder, the annular threaded disk is rotatably connected to the fixed cylinder, a driving structure is arranged between the annular threaded disk and the fixed cylinder, a plurality of sliding grooves are opened on the fixed cylinder, the movable seat is slidably connected to the sliding grooves, the movable seat is threadedly connected to the annular threaded disk, and the arc-shaped support seat and the mounting seat are both fixedly connected to the movable seat.

[0007] In order to support the bottom of the wafer being punched, further, the supporting and falling assembly comprises a supporting frame, and a spring damper is arranged between the supporting frame and the arc-shaped supporting seat.

[0008] In order to increase the supporting area for the wafer, further, one side of the arc-shaped protrusion is fixedly connected with an arc-shaped supporting plate, and the top of the arc-shaped protrusion is flush with the top of the arc-shaped supporting plate.

[0009] In order to drive the mounting cylinder to move in multiple directions, the XY-axis moving mechanism further includes a moving slot frame 1, the moving slot frame 1 is fixedly connected to the top of the mounting frame, the moving slot frame 1 is slidably connected to a moving slot frame 2, a screw drive structure is arranged between the moving slot frame 1 and the moving slot frame 2, and the screw drive structure is also arranged between the mounting cylinder and the moving slot frame 2.

[0010] In order to extrude the top of the punched wafer, further, the elastic extrusion assembly comprises an arc-shaped extrusion plate, a driving electric cylinder is arranged on the mounting seat, and the arc-shaped extrusion plate is fixedly connected to the output end of the driving electric cylinder.

[0011] In order to punch out the outermost area of ​​the chip, further, the longitudinal punching assembly includes a lifting plate, a curved punching plate and a limit assembly, a sliding member is fixedly connected to one side of the mounting seat, the lifting plate is longitudinally slidably connected to the sliding member, the spring damper is also arranged between the lifting plate and the sliding member, the curved punching plate is fixedly connected to the bottom of the lifting plate, and the limit assembly is arranged between the lifting plate and the mounting seat.

[0012] In order to complete the fixation and punching operation of the wafer, further, the arc-shaped extrusion plate corresponds to the arc-shaped support plate, and the arc-shaped punching plate corresponds to the support frame.

[0013] In order to drive the lifting plate to move longitudinally, the limiting assembly further includes a rotating groove and a wedge-shaped support block, the rotating groove is fixedly connected to the mounting seat, a rotating shaft is rotatably connected inside the mounting seat, a first driving motor is fixedly connected to the rotating groove, an output end of the first driving motor is fixedly connected to the rotating shaft, the wedge-shaped support block is fixedly connected to the rotating shaft, a through groove is opened on the lifting plate, and the inner top wall of the through groove is set to a slope surface, and the wedge-shaped support block contacts the slope surface.

[0014] In order to make the positions of the moving seat and the arc-shaped supporting seat correspond to each other, further, a position sensor is arranged at the bottom of the mounting seat, and a calibration point is arranged in the middle of the arc-shaped protrusion.

[0015] The beneficial effects of the embodiments of the present invention are: In the present invention, when it is necessary to perform punching operation on the outermost area of ​​the chip, the wafer to be punched is first placed between the top ends of multiple arc-shaped support plates, and then the circular moving mechanism drives the arc-shaped support seat to move so that the chip is clamped between multiple support frames, and then the laser cutting equipment cuts the outer area of ​​the chip, but does not directly perform a thorough cutting operation on the chip. A small area is used to connect the outer area of ​​the chip with the middle area of ​​the chip, and the thickness of the chip connection is welded as thin as possible, and then the elastic extrusion component supports the top end of the chip, so that the chip is clamped between the elastic extrusion component and the arc-shaped support plate, and then the longitudinal punching component is used to punch the outermost area of ​​the chip, and the outer area of ​​the chip is quickly cut longitudinally, while ensuring that the cutting port of the outer area of ​​the chip remains flat. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in describing the embodiments of the present invention. Obviously, the drawings described below are only some exemplary embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on the contents of the exemplary embodiments of the present invention and these drawings without creative work.

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of a partial cross-section of the coordination of the arc-shaped support seat, the arc-shaped protrusion, the mounting cylinder, the mounting seat and the fixed cylinder in the present invention; Figure 3It is a schematic diagram of the structure of the arc-shaped support seat, the arc-shaped protrusion and the support frame in the present invention; Figure 4 For the present invention Figure 3 A schematic diagram of the partially enlarged structure at point A in the middle; Figure 5 It is a schematic diagram of the structure of the fixed cylinder, the mounting seat, the lifting plate, the arc-shaped extrusion plate and the arc-shaped blanking plate in the present invention; Figure 6 It is a schematic diagram of the structure of the mounting seat, the lifting plate, the arc extrusion plate, the arc punching plate and the position sensor in the present invention; Figure 7 It is a schematic diagram of the partial cross-section of the structure of the mounting seat, the lifting plate, the rotating groove and the wedge-shaped support block in the present invention.

[0018] In the figure: 1. mounting frame; 2. laser cutting equipment; 3. arc-shaped support seat; 4. arc-shaped protrusion; 5. mounting cylinder; 6. mounting seat; 7. fixed cylinder; 8. annular threaded disk; 9. moving seat; 10. supporting frame; 11. spring damper; 12. arc-shaped support plate; 13. moving slot frame one; 14. moving slot frame two; 15. arc-shaped extrusion plate; 16. driving electric cylinder; 17. lifting plate; 18. sliding member; 19. arc-shaped blanking plate; 20. rotating slot; 21. rotating shaft; 22. first driving motor; 23. wedge-shaped support block; 24. position sensor; 25. calibration point; 26. second driving motor; 27. transmission gear; 28. transmission screw; 29. ​​third driving motor. DETAILED DESCRIPTION The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention.

[0019] In order to simplify the drawings, only the parts related to the disclosure are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically shown, or only one of them is marked. In this article, "one" not only means "only one", but also means "more than one", and "several" includes "two" and "more than two".

[0020] In this document, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0022] In the description of this embodiment, terms such as "up", "down", "left", and "right" and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0023] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0024] like Figures 1 to 7 As shown, the present invention discloses a punching device for chip production, including a mounting frame 1 and a laser cutting device 2. The laser cutting device 2 is a prior art device for cutting chips in the prior art, and the chip surface is cut according to the shape of a circuit pattern. The laser cutting device 2 is a prior art device that can be used to adjust the cutting depth.

[0025] It also includes an arc-shaped support seat 3, the number of which is set to be multiple, an arc-shaped protrusion 4 is set in the middle of the arc-shaped support seat 3, a circumferential adjustment component is set between the multiple arc-shaped support seats 3 and the mounting frame 1, the circumferential adjustment component includes a fixed cylinder 7, an annular threaded disk 8 and a movable seat 9, the fixed cylinder 7 is fixedly connected to the mounting frame 1 or the mounting cylinder 5, the annular threaded disk 8 is rotatably connected in the fixed cylinder 7, a driving structure is set between the annular threaded disk 8 and the fixed cylinder 7, the driving structure includes a second driving motor 26, the second driving motor 26 is set on the fixed cylinder 7, the annular threaded disk 8 A transmission gear 27 is provided on the output end of the second driving motor 26, and the two transmission gears 27 are meshed. A plurality of slide grooves are provided on the fixed cylinder 7, and the movable seat 9 is slidably connected to the slide groove. The movable seat 9 is threadedly connected to the annular threaded disk 8. The arc-shaped support seat 3 and the mounting seat 6 are both fixedly connected to the movable seat 9. When the position of the movable seat 9 needs to be adjusted, the second driving motor 26 is started, and the annular threaded disk 8 is driven to rotate through the two transmission gears 27, so that the plurality of movable seats 9 threadedly connected to the annular threaded disk 8 slide in the slide groove, and the position of the arc-shaped support seat 3 or the mounting seat 6 is adjusted; A support and drop assembly is arranged on the arc-shaped support seat 3, and the support and drop assembly includes a support frame 10, and a spring damper 11 is arranged between the support frame 10 and the arc-shaped support seat 3. After the outermost area of ​​the wafer is punched out, the outermost area of ​​the wafer is caused to shrink during the descending process, so that the spring damper 11 arranged between the support frame 10 and the arc-shaped support seat 3 is completely separated from the outermost area of ​​the wafer and the central area of ​​the wafer. When the wafer is initially fixed, the wafer is contacted with the arc surface of the inner wall of the support frame 10 to complete the fixing and clamping operation of the wafer. In addition, the support frame 10 can also fully support the outermost area of ​​the wafer to keep the wafer stable during the cutting operation.

[0026] An arc-shaped support plate 12 is fixedly connected to one side of the arc-shaped protrusion 4 , and the top of the arc-shaped protrusion 4 is flush with the top of the arc-shaped support plate 12 . When the wafer is clamped, the wafer will be clamped between the support frame 10 , the arc-shaped protrusion 4 and the arc-shaped support plate 12 .

[0027] An XY axis moving mechanism is arranged between the mounting cylinder 5 and the top of the mounting frame 1, and the laser cutting device 2 is arranged in the mounting cylinder 5. The XY axis moving mechanism includes a moving slot frame 13, and the moving slot frame 13 is fixedly connected to the top of the mounting frame 1. A moving slot frame 2 14 is slidably connected to the moving slot frame 13, and a screw driving structure is arranged between the moving slot frame 13 and the moving slot frame 2 14. A screw driving structure is also arranged between the mounting cylinder 5 and the moving slot frame 2 14, and the screw driving mechanism includes a transmission screw 28, and the transmission screw 28 is rotatably connected in the moving slot frame 13 and the moving slot frame 2 14. The moving slot frame 2 1 4 is threadedly connected to a transmission screw 28 rotatably connected in the movable slot frame 1 13, and the installation cylinder 5 is threadedly connected to the transmission screw 28 rotatably connected in the movable slot frame 2 14. The movable slot frame 1 13 and the movable slot frame 2 14 are both provided with a third driving motor 29, and the output end of the third driving motor 29 is fixedly connected to the transmission screw 28. When it is necessary to adjust the components on the installation cylinder 5 to realize the sequential cutting operation of multiple areas on the wafer, the two third driving motors 29 are used to drive the two transmission screws 28 to rotate, so as to realize the comprehensive movement operation of multiple components such as the installation cylinder 5 and the laser cutting device 2.

[0028] The mounting seat 6 corresponds to the arc-shaped support seat 3 one by one, and a circumferential adjustment component is also arranged between the multiple mounting seats 6 and the mounting cylinder 5. An elastic extrusion component is arranged on one side of the mounting seat 6, and the elastic extrusion component includes an arc-shaped extrusion plate 15. A driving electric cylinder 16 is arranged on the mounting seat 6, and the arc-shaped extrusion plate 15 is fixedly connected to the output end of the driving electric cylinder 16. After the mounting seat 6 is moved to the position corresponding to the arc-shaped support seat 3, in order to keep the central area of ​​the wafer stable during the punching process of the wafer, the driving electric cylinder 16 is started to drive the arc-shaped extrusion plate 15 to descend, so that the arc-shaped extrusion plate 15 contacts with the top of the wafer, thereby fixing the wafer.

[0029] A longitudinal blanking assembly is provided on the other side of the mounting seat 6, and the longitudinal blanking assembly includes a lifting plate 17, an arc-shaped blanking plate 19 and a limiting assembly. A sliding member 18 is fixedly connected to one side of the mounting seat 6, and a lifting plate 17 is longitudinally slidably connected to the sliding member 18. A spring damper 11 is also provided between the lifting plate 17 and the sliding member 18. The bottom of the lifting plate 17 is fixedly connected to the arc-shaped blanking plate 19, and a limiting assembly is provided between the lifting plate 17 and the mounting seat 6. After the outermost area of ​​the wafer is cut in a stroke-like manner using the laser cutting equipment 2, the limiting assembly stops the limiting operation of the lifting and lowering. Under the action of the spring damper 11 provided between the lifting plate 17 and the sliding member 18, the lifting plate 17 is rapidly lowered, so that the lifting plate 17 drives the arc-shaped blanking plate 19 to descend, and the arc-shaped blanking plate 19 performs a blanking operation on the cutting area outside the wafer; The limiting assembly includes a rotating groove 20 and a wedge-shaped support block 23. The rotating groove 20 is fixedly connected to the mounting seat 6. A rotating shaft 21 is rotatably connected in the mounting seat 6. A first driving motor 22 is fixedly connected to the rotating groove 20. The output end of the first driving motor 22 is fixedly connected to the rotating shaft 21. The wedge-shaped support block 23 is fixedly connected to the rotating shaft 21. A through groove is provided on the lifting plate 17, and the inner top wall of the through groove is set as a slope. The wedge-shaped support block 23 contacts the slope. When it is necessary to keep the lifting plate 17 fixed, the first driving motor 22 is started to drive the rotating shaft 21 to rotate, so that the rotating shaft 21 drives the wedge-shaped support block 23 to rise, so that the top of the wedge-shaped support block 23 contacts the slope, and the lifting plate 17 remains stable on the sliding member 18. When it is necessary to lower the lifting plate 17, the first driving motor 22 is started to drive the rotating shaft 21 and the wedge-shaped support block 23 to descend, so that the lifting plate 17 can be quickly lowered in the through groove.

[0030] The arc-shaped extrusion plate 15 corresponds to the arc-shaped support plate 12, the arc-shaped blanking plate 19 corresponds to the support frame 10, a position sensor 24 is provided at the bottom of the mounting seat 6, and a calibration point 25 is provided in the middle of the arc-shaped protrusion 4. During use of the present invention, it is necessary to strictly ensure that the position movement of the arc-shaped support seat 3 and the mounting seat 6 remains corresponding, so after the position of the moving seat 9 is adjusted, the position of the arc-shaped support seat 3 and the mounting seat 6 is judged through the position sensor 24 and the calibration point 25.

[0031] Working principle of the blanking device for wafer production: First, start the two second drive motors 26 to drive the annular threaded disk 8 to rotate, so that the movable seat 9 moves in the fixed cylinder 7, and adjust the positions of the arc support seat 3 and the mounting seat 6. Then, place the wafer between the multiple arc support plates 12, and continue to adjust the position of the movable seat 9 so that the outer wall of the wafer contacts the inner arc surface of the multiple support frames 10 to fix and clamp the wafer. Then, use the laser cutting equipment 2 to cut the outer area of ​​the wafer. Then, start the driving electric cylinder 16 to drive the arc extrusion plate 15 to descend, so that the arc extrusion plate 15 contacts the top of the wafer, thereby fixing the wafer. Start the first drive motor 22 to drive the rotating shaft 21 and the wedge-shaped support block 23 to descend, so that the lifting plate 17 quickly descends in the through groove, and the arc punching plate 19 descends to punch the outer area of ​​the wafer, so that the cut area of ​​the wafer descends together with the support frame 10. The cut wafer is taken out from the support frame 10, and the support frame 10 continues to rise under the action of the spring damper 11. When the arc-shaped support seat 3 is moved, the inner arc surface of the support frame 10 clamps the remaining area of ​​the wafer, and then the laser cutting equipment 2 is used to cut the remaining area of ​​the wafer.

[0032] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A blanking device for wafer production, comprising a mounting frame (1) and a laser cutting device (2), characterized in that: Also includes: An arc-shaped support seat (3), wherein the number of the arc-shaped support seats (3) is set to be multiple, an arc-shaped protrusion (4) is provided in the middle of the arc-shaped support seat (3), a circumferential adjustment component is provided between the multiple arc-shaped support seats (3) and the mounting frame (1), and a support drop component is provided on the arc-shaped support seat (3); An installation cylinder (5), wherein an XY axis moving mechanism is arranged between the installation cylinder (5) and the top of the installation frame (1), and the laser cutting device (2) is arranged in the installation cylinder (5); A mounting seat (6), wherein the mounting seat (6) corresponds to the arc-shaped support seat (3) one by one, the circumferential adjustment component is also arranged between a plurality of the mounting seats (6) and the mounting cylinder (5), an elastic extrusion component is arranged on one side of the mounting seat (6), and a longitudinal punching component is arranged on the other side of the mounting seat (6).

2. A wafer production punching device according to claim 1, characterized in that: The circumference adjustment component comprises: A fixed cylinder (7), the fixed cylinder (7) being fixedly connected to the mounting frame (1) or the mounting cylinder (5); an annular threaded disc (8), the annular threaded disc (8) being rotatably connected inside the fixed cylinder (7), and a driving structure being provided between the annular threaded disc (8) and the fixed cylinder (7); A movable seat (9), wherein a plurality of slide grooves are provided on the fixed cylinder (7), the movable seat (9) penetrates and is slidably connected to the slide grooves, the movable seat (9) is threadedly connected to the annular threaded disk (8), and the arc-shaped support seat (3) and the mounting seat (6) are both fixedly connected to the movable seat (9).

3. A wafer production punching device according to claim 2, characterized in that: The support and drop assembly comprises: A support frame (10), wherein a spring damper (11) is provided between the support frame (10) and the arc-shaped support seat (3).

4. A wafer production punching device according to claim 3, characterized in that: An arc-shaped support plate (12) is fixedly connected to one side of the arc-shaped protrusion (4), and the top end of the arc-shaped protrusion (4) is flush with the top end of the arc-shaped support plate (12).

5. A wafer production punching device according to claim 4, characterized in that: The XY axis moving mechanism comprises: A movable trough frame (13) is fixedly connected to the top of the mounting frame (1), a movable trough frame (14) is slidably connected to the movable trough frame (13), a screw drive structure is provided between the movable trough frame (13) and the movable trough frame (14), and the screw drive structure is also provided between the mounting cylinder (5) and the movable trough frame (14).

6. A wafer production punching device according to claim 5, characterized in that: The elastic extrusion component comprises: An arc-shaped extrusion plate (15), a driving electric cylinder (16) is arranged on the mounting seat (6), and the arc-shaped extrusion plate (15) is fixedly connected to the output end of the driving electric cylinder (16).

7. A wafer production punching device according to claim 6, characterized in that: The longitudinal blanking assembly comprises: A lifting plate (17), one side of the mounting seat (6) is fixedly connected to a sliding member (18), the lifting plate (17) is longitudinally slidably connected to the sliding member (18), and the spring damper (11) is also provided between the lifting plate (17) and the sliding member (18); An arc-shaped blanking plate (19), the bottom of the lifting plate (17) being fixedly connected to the arc-shaped blanking plate (19); A position limiting component is provided between the lifting plate (17) and the mounting seat (6).

8. A wafer production punching device according to claim 7, characterized in that: The arc-shaped extrusion plate (15) corresponds to the arc-shaped support plate (12), and the arc-shaped punching plate (19) corresponds to the support frame (10).

9. A wafer production punching device according to claim 8, characterized in that: The limiting component comprises: a rotating groove (20), the rotating groove (20) being fixedly connected to the mounting seat (6), a rotating shaft (21) being rotatably connected inside the mounting seat (6), a first driving motor (22) being fixedly connected to the rotating groove (20), and an output end of the first driving motor (22) being fixedly connected to the rotating shaft (21); A wedge-shaped support block (23), the wedge-shaped support block (23) being fixedly connected to the rotating shaft (21), the lifting plate (17) being provided with a through slot, and the inner top wall of the through slot being configured as a slope, the wedge-shaped support block (23) being in contact with the slope.

10. A wafer production punching device according to claim 9, characterized in that: A position sensor (24) is provided at the bottom of the mounting seat (6), and a calibration point (25) is provided in the middle of the arc-shaped protrusion (4).

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