Grinding device and grinding method for semiconductor

Abstract

The grinding device comprises a machine table, a rotatable grinding assembly is arranged on the machine table, the grinding assembly moves on the YZ plane, an object placing table is arranged on the machine table corresponding to the grinding assembly, and a rotatable object placing disc is arranged in the object placing table; the grinding assembly comprises a grinding disc, a first grinding disc, a second grinding disc and a third grinding disc, and the first grinding disc, the second grinding disc and the third grinding disc are coaxially and sequentially distributed on the grinding disc from inside to outside and detachably fixed to the side, facing the storage disc, of the grinding disc. A first grinding surface, a second grinding surface and a third grinding surface are respectively arranged on the first grinding disc, the second grinding disc and the third grinding disc, the horizontal heights of the first grinding surface, the second grinding surface and the third grinding surface are sequentially increased, and meanwhile, the corresponding mesh numbers are also sequentially increased; the first millstone and the second millstone move towards materials in the Z-axis direction below the grinding disc, and the horizontal height can be adjusted. The grinding disc is prevented from being frequently replaced, and the working efficiency is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor material processing, and in particular to a grinding device and a grinding method for semiconductors. Background Art

[0002] Semiconductor silicon wafers are one of the most important materials in modern electronic devices. Their manufacturing process involves multiple steps, among which grinding is one of the key links. The main purpose of silicon wafer grinding is to remove irregularities on the wafer surface and improve its flatness and smoothness to meet the requirements of subsequent processes such as lithography and doping. Grinding equipment usually uses precision grinders. Its working principle is to contact the surface of the silicon wafer through a high-speed rotating abrasive tool to remove excess material. The key parameters in the grinding process include grinding speed, grinding pressure and abrasive selection, which will affect the quality and production efficiency of the final wafer. After grinding, silicon wafers usually need to be cleaned and polished to ensure that there are no particles and scratches on their surface, thereby providing a high-quality substrate for subsequent semiconductor device manufacturing. Through efficient grinding equipment, precise processing of silicon wafers can be achieved, production yield can be improved, manufacturing costs can be reduced, and the rapid development of the semiconductor industry can be promoted.

[0003] In the semiconductor manufacturing process, grinding of silicon wafers is an important process to achieve high flatness and smoothness. However, the grinding equipment in the prior art has the problem of low efficiency. Due to the different requirements for surface quality and roughness in different stages of silicon wafer processing, grinding discs of different materials or particle sizes are required. For example, the rough grinding stage requires a grinding disc with coarser particles to quickly remove materials, while the fine grinding and polishing stages require a grinding disc with finer particles to improve the surface quality. This multi-stage process requires operators to frequently replace the grinding disc, and the grinding disc will be worn out due to long-term use, which further increases the replacement frequency. This cumbersome operation not only consumes a lot of time and manpower, but also reduces production efficiency.

[0004] Therefore, a grinding device and a grinding method for semiconductors are proposed to solve the above-mentioned problem of low efficiency. Summary of the invention

[0005] The object of the present invention is to provide a grinding device and a grinding method for semiconductors to solve the above-mentioned problem of low efficiency.

[0006] To achieve this object, the present invention adopts the following technical solutions: A grinding device for semiconductors, comprising a machine platform, characterized in that a rotatable grinding assembly is arranged on the machine platform, and the grinding assembly moves on a YZ plane, a storage table is arranged on the machine platform corresponding to the grinding assembly, a rotatable storage tray is arranged in the storage table, and the storage tray is used to place materials; The grinding assembly includes a grinding disc and a first grinding disc, a second grinding disc and a third grinding disc coaxially distributed on the grinding disc from the inside to the outside, the first grinding disc, the second grinding disc and the third grinding disc are detachably fixed on the side of the grinding disc facing the storage disc, the first grinding disc, the second grinding disc and the third grinding disc are respectively provided with a first grinding surface, a second grinding surface and a third grinding surface, the horizontal heights of the first grinding surface, the second grinding surface and the third grinding surface are increased in sequence, and the corresponding mesh numbers are also increased in sequence, and the first grinding disc, the second grinding disc and the third grinding disc are used to grind the material on the storage disc in sequence; The first grinding disc and the second grinding disc move toward the material along the Z-axis direction under the grinding disc, and the horizontal height can be adjusted so that after the first grinding surface contacts the surface of the placement disc, the second grinding surface contacts the surface of the material; after the second grinding surface contacts the surface of the placement disc, the third grinding surface contacts the surface of the material.

[0007] The third grinding disc is sleeved on the outside of the second grinding disc, and the second grinding disc is sleeved on the outside of the first grinding disc. The widths of the first grinding surface, the second grinding surface and the third grinding surface are all equal and larger than the diameter of the storage area on the storage disc.

[0008] The machine platform comprises a base, an assembly seat and a mounting seat which are connected in sequence. The mounting seat is slidably connected to the assembly seat and moves linearly along the Y-axis direction. A driving component connected to the grinding disc is arranged on the mounting seat.

[0009] The storage tray is hinged on the base and connected to the assembly seat, the assembly seat abuts against the base, a slide rail is provided on the side of the base along the Y-axis direction, a slider is slidably connected in the slide rail, a protrusion is formed on the side of the assembly seat corresponding to the slider, the slider and the protrusion are hinged with the same connecting plate through a hinge axis, a pushing cylinder connected to the slider is provided on the slide rail along the Y-axis direction, and a water pipe is provided on the storage table corresponding to the storage area.

[0010] The first grinding disc, the second grinding disc and the third grinding disc are respectively provided with a rotatable first connecting member, a second connecting member and a third connecting member, and the first connecting member and the second connecting member are telescopic rods, the top ends of the first connecting member, the second connecting member and the third connecting member penetrate and extend to the top surface of the grinding disc, and the grinding disc is provided with threaded sleeves corresponding to the first connecting member, the second connecting member and the third connecting member, and the first connecting member, the second connecting member and the third connecting member are respectively connected to the corresponding threaded sleeves.

[0011] A support portion is formed on the outer side of the threaded sleeve along the Z-axis direction, a gap is formed between the threaded sleeve and the grinding disc, and the first connecting member, the second connecting member and the third connecting member respectively penetrate the corresponding gaps and are connected to the corresponding threaded sleeves.

[0012] A telescopic space is formed between the first grinding disc, the second grinding disc and the grinding disc, the first connecting member and the second connecting member are respectively located in the telescopic spaces corresponding to the first grinding disc and the second grinding disc, the first grinding disc and the second grinding disc respectively move linearly along the Z-axis direction in the corresponding telescopic spaces, a telescopic edge grinding unit is arranged on the inner side of the first grinding disc, a second edge grinding area is arranged on the outer side of the first grinding disc, and a third edge grinding area is arranged on the outer side of the second grinding disc.

[0013] The edge grinding unit includes a moving block and an edge grinding sleeve. The inner wall of the first grinding disc is provided with at least two sliding grooves at equal intervals along the Z-axis direction. The moving block is slidably connected in the sliding groove, and the moving block is elastically connected to the top wall of the sliding groove. The edge grinding sleeve is connected to the inner side of the moving block, and the bottom end of the edge grinding sleeve extends to the outer side of the first grinding disc. A first edge grinding area is provided on the outer side of the edge grinding sleeve. The mesh numbers of the first edge grinding area, the second edge grinding area, and the third edge grinding area are respectively the same as the mesh numbers of the first grinding surface, the second grinding surface, and the third grinding surface.

[0014] The moving block is connected to the top wall of the slide slot through a spring, and the moving block moves linearly along the Z-axis direction in the slide slot.

[0015] A grinding method for semiconductors, characterized in that it is applied to the grinding device for semiconductors as described in any one of the above, and the grinding method comprises the following steps: Step S1, after placing the material on the placing plate and fixing it, the placing plate and the grinding assembly are rotated by the control unit; Step S2, making the rotating grinding component contact with the material to grind the surface of the material; Step S3, moving the grinding assembly on the YZ plane, allowing the first grinding disc, the second grinding disc and the third grinding disc to grind the surface of the material in sequence, thereby achieving the rough grinding, fine grinding and polishing processes at one time.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention provides a grinding device and a grinding method for semiconductors. Through the first grinding disc, the second grinding disc and the third grinding disc on the grinding assembly, rough grinding, fine grinding and polishing can be achieved in one grinding operation, avoiding the tedious process of frequent replacement of grinding discs, significantly improving work efficiency and reducing production downtime.

[0017] 2. The present invention provides a grinding device and a grinding method for semiconductors. By pushing structures such as a cylinder and a connecting plate, a storage table hinged on a base can be tilted, so that cooling water can flow evenly and cover the entire storage plate, thereby effectively reducing the heat generated during the grinding process and preventing the material from overheating. At the same time, after tilting, it can ensure that the cooling water takes away the waste generated during the grinding process, thereby reducing pollution and improving the overall grinding quality.

[0018] 3. The present invention provides a grinding device and a grinding method for semiconductors. Through the second grinding area, the third grinding area and the first grinding area on the grinding sleeve, the first grinding disc, the second grinding disc and the third grinding disc can grind the side surfaces simultaneously while grinding the surface of the material. This method can not only improve the overall production efficiency and reduce additional processing steps, but also ensure the geometric accuracy of the material and reduce errors caused by multiple processing.

[0019] 4. The present invention provides a grinding device and a grinding method for semiconductors. Through a retractable edge grinding sleeve, a first grinding disc and a second grinding disc, the device and the method can adapt to the height of the sides of different materials during edge grinding, thereby ensuring the best contact between the grinding disc and the material during the grinding process, effectively improving the grinding quality and the surface accuracy of the workpiece, and adapting to the processing requirements of materials of different heights. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a bottom view structural schematic diagram of the grinding assembly in the present invention; Figure 3 It is a schematic cross-sectional structure diagram of the grinding disc in the present invention; Figure 4 It is a schematic diagram of the split structure of the first grinding disc and the second grinding disc in the present invention; Figure 5 It is a schematic diagram of the connection structure between the first grinding disc and the first connecting member in the present invention; Figure 6 For the present invention Figure 5 A schematic diagram of the structure enlargement in the middle; Figure 7 is a bottom view structural schematic diagram of the third connecting member in the present invention; Figure 8 It is a schematic diagram of the connection structure between the slide rail and the slider in the present invention; Fig. 9 It is a schematic diagram of the internal structure of the assembly seat in the present invention.

[0023] Illustrations: 1. Machine; 11. Base; 12. Assembly seat; 121. Protrusion; 122. Electric push rod; 123. Support rod; 124. Connecting port; 13. Mounting seat; 131. Connecting block; 14. Slide rail; 15. Sliding block; 16. Connecting plate; 17. Pushing cylinder; 2. Grinding assembly; 21. Grinding disc; 211. Threaded sleeve; 212. Supporting part; 22. First grinding disc; 221. First grinding surface; 222. First connecting piece; 223. The second edge grinding area; 23. The second grinding disc; 231. The second grinding surface; 232. The second connecting piece; 233. The third edge grinding area; 24. The third grinding disc; 241. The third grinding surface; 242. The third connecting piece; 25. The telescopic space; 26. The edge grinding unit; 261. The slide; 262. The moving block; 263. The edge grinding sleeve; 264. The first edge grinding area; 265. The spring; 3. The storage table; 31. The storage tray; 32. The storage area; 33. The water pipe; 4. The driving assembly. DETAILED DESCRIPTION

[0024] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0026] Embodiment 1: See also Figure 1-9 In this embodiment, a grinding device for semiconductors includes a machine table 1, a rotatable grinding assembly 2 is provided on the machine table 1, and the grinding assembly 2 moves on the YZ plane, a placement table 3 is provided on the machine table 1 corresponding to the grinding assembly 2, and a rotatable placement tray 31 is provided in the placement table 3, and the placement tray 31 is used to place materials; The grinding assembly 2 includes a grinding disc 21 and a first grinding disc 22, a second grinding disc 23 and a third grinding disc 24 which are coaxially distributed on the grinding disc 21 from the inside to the outside. The first grinding disc 22, the second grinding disc 23 and the third grinding disc 24 are all detachably fixed on the side of the grinding disc 21 facing the storage disc 31. The first grinding disc 22, the second grinding disc 23 and the third grinding disc 24 are respectively provided with a first grinding surface 221, a second grinding surface 231 and a third grinding surface 241. The horizontal heights of the first grinding surface 221, the second grinding surface 231 and the third grinding surface 241 increase in sequence, and the corresponding mesh numbers also increase in sequence. The first grinding disc 22, the second grinding disc 23 and the third grinding disc 24 are used to grind the material on the storage disc 31 in sequence. The first grinding disc 22 and the second grinding disc 23 move toward the material along the Z-axis direction below the grinding disc 21, and the horizontal height can be adjusted so that after the first grinding surface 221 contacts the surface of the placement disc 31, the second grinding surface 231 contacts the surface of the material; after the second grinding surface 231 contacts the surface of the placement disc 31, the third grinding surface 241 contacts the surface of the material.

[0027] When in use, the material to be processed is placed on the storage area 32, and the storage plate 31 fixes the material, then the grinding assembly 2 and the storage plate 31 are rotated respectively, and the grinding assembly 2 is moved toward the storage plate 31 until it contacts the material, and the surface of the material is ground. During the grinding process, the grinding assembly 2 is discontinuously moved horizontally, so that the first grinding disc 22, the second grinding disc 23 and the third grinding disc 24 can grind the surface of the material respectively, so that the material is coarsely ground, finely ground and polished at one time, realizing the integration of coarse grinding, fine grinding and polishing. At the same time, when grinding materials at different heights, the first grinding disc 22 and the second grinding disc 23 are moved under the grinding disc 21, and then the horizontal heights of the two are adjusted to avoid the situation where the first grinding surface 221 is in contact with the surface of the placement disc 31 and the second grinding surface 231 is unable to contact the surface of the material due to the first grinding disc 22, and the situation where the second grinding surface 231 is in contact with the surface of the placement disc 31 and the third grinding surface 241 is unable to contact the surface of the material due to the second grinding disc 23, so as to improve adaptability and adapt to materials at different heights.

[0028] It can be understood that in the process of grinding the material, the first grinding surface 221, the second grinding surface 231, and the third grinding surface 241 with increasing mesh sizes on the grinding component 2 can complete the rough grinding, fine grinding and polishing processes of the material in one grinding work, without stopping the machine to replace abrasives of different mesh sizes. Grinding the material in this way effectively improves the work efficiency and reduces the work intensity of the staff. At the same time, the continuous grinding work can also improve the grinding quality of the material surface, thereby improving the material quality.

[0029] It should be noted that the horizontal heights of the first grinding surface 221, the second grinding surface 231 and the third grinding surface 241 are increased in sequence, so that the first grinding disc 22, the second grinding disc 23 and the third grinding disc 24 are distributed in a stepped manner. During the grinding process, the first grinding disc 22 is ground first, and the second grinding disc 23 and the third grinding disc 24 do not contact the material or the storage disc 31, thereby avoiding unnecessary wear. At the same time, because the storage area 32 is located on the storage disc 31 near its outer side, when the first grinding disc 22 finishes the grinding work and the second grinding disc 23 starts grinding, the first grinding disc 22 is away from the storage disc 31, thereby avoiding unnecessary wear. By arranging the positions of the first grinding disc 22, the second grinding disc 23, the third grinding disc 24 and the storage area 32, it is possible to avoid wear of the other grinding discs when any one of the first grinding disc 22, the second grinding disc 23 and the third grinding disc 24 is performing grinding work, thereby effectively increasing the service life and indirectly reducing the production cost.

[0030] It can be understood that the placement tray 31 is driven to rotate by a rotating motor disposed in the placement table 3, and the placement tray 31 fixes the material by adsorption. The specific adsorption structure is well known to those skilled in the art and will not be described in this embodiment.

[0031] Furthermore, the third grinding disc 24 is sleeved on the outside of the second grinding disc 23, and the second grinding disc 23 is sleeved on the outside of the first grinding disc 22. The width of the first grinding surface 221, the width of the second grinding surface 231 and the width of the third grinding surface 241 are all equal and are all larger than the diameter of the storage area 32 on the storage plate 31.

[0032] It should be noted that the width of the first grinding surface 221, the width of the second grinding surface 231 and the width of the third grinding surface 241 are all slightly larger than the diameter of the storage area 32. Through this setting, while meeting the grinding effect, it can avoid increasing the moving stroke of the grinding disc 21 due to the grinding surface being too large, thereby reducing the error rate during grinding.

[0033] Furthermore, the machine 1 includes a base 11, an assembly seat 12 and a mounting seat 13 connected in sequence. The mounting seat 13 is slidably connected to the assembly seat 12 and moves linearly along the Y-axis direction. A driving component 4 connected to the grinding disc 21 is provided on the mounting seat 13; specifically, the storage plate 31, the grinding component 2 and the mounting seat 13 are distributed in sequence in the Y-axis direction.

[0034] It should be noted that after the material is placed, the driving assembly 4 will move the grinding assembly 2 along the Z-axis direction, so that the grinding assembly 2 rotates to grind the material, and after the first grinding disc 22 or the second grinding disc 23 completes the grinding work, the movable mounting seat 13 drives the grinding assembly 2 to move and carry out the next grinding process; specifically, the driving assembly 4 includes a driving cylinder and a driving motor, the driving cylinder is used to drive the grinding assembly 2 to move along the Z-axis direction, and the driving motor is used to drive the grinding assembly 2 to rotate. The setting positions of the driving cylinder and the driving motor are well known to people in this field and will not be described in this embodiment.

[0035] In a specific embodiment, see Fig. 9 A connecting block 131 is fixed to the bottom surface of the mounting seat 13, a connecting port 124 is opened on the top surface of the assembly seat 12 corresponding to the connecting block 131 along the Y-axis direction, a support rod 123 is fixed to the corresponding connecting port 124 in the assembly seat 12, the connecting block 131 passes through the connecting port 124 and extends into the assembly seat 12, the connecting block 131 is sleeved on the support rod 123, and an electric push rod 122 is arranged between the connecting block 131 and the inner side wall of the assembly seat 12 along the Y-axis direction.

[0036] When in use, the electric push rod 122 is telescopically driven to drive the connecting block 131 to move on the support rod 123. When the connecting block 131 moves, it can drive the grinding assembly 2 to move along the Y-axis direction through the mounting block, so that the first grinding disc 22, the second grinding disc 23 and the third grinding disc 24 can grind the material respectively to achieve the integration of rough grinding, fine grinding and polishing.

[0037] Furthermore, the storage tray 31 is hinged on the base 11 and connected to the assembly seat 12, the assembly seat 12 abuts against the base 11, a slide rail 14 is provided on the side of the base 11 along the Y-axis direction, a slider 15 is slidably connected in the slide rail 14, a protrusion 121 is formed on the side of the assembly seat 12 corresponding to the slider 15, the slider 15 and the protrusion 121 are hinged with the same connecting plate 16 through a hinge axis, a pushing cylinder 17 connected to the slider 15 is provided on the slide rail 14 along the Y-axis direction, and a water pipe 33 is provided on the storage tray 31 corresponding to the storage area 32.

[0038] When in use, before the material needs to be ground, the push cylinder 17 is operated. When it is operated, the output shaft is extended, and the slider 15 moves in the slide rail 14 toward the storage table 3. When the slider 15 moves, the slider 15 drives the connecting plate 16 to rotate. When the connecting plate 16 rotates to be perpendicular to the slider 15, the connecting plate 16 lifts the assembly seat 12 through the protrusion 121. The assembly seat 12 is restricted by the hinge of the storage table 3 and is tilted together with the storage table 3. When the storage table 3 is After being tilted, grinding work can be started, and during grinding, the water pipe 33 will also discharge cooling water to cool the material and the grinding assembly 2 during grinding. Because the storage table 3 is tilted, the discharged cooling water can completely cover the entire storage tray 31 after flowing out, cool all the materials on the storage tray 31, and take away the waste generated by grinding. After the cooling water circulates, it can also be gathered together under the effect of the tilted state of the storage table 3, so as to collect the cooling water and the waste together.

[0039] It should be noted that the inclined storage table 3 and the water pipe 33 can promote the flow of cooling water, reduce the accumulation of cooling water in the storage tray 31, avoid uneven grinding or contamination caused by the accumulation of cooling water, and through inclined flushing, the waste on the storage table 3 can be effectively cleaned, thereby improving the cleaning effect of the waste and ensuring the grinding quality.

[0040] Furthermore, the first grinding disc 22, the second grinding disc 23 and the third grinding disc 24 are respectively provided with a rotatable first connecting member 222, a second connecting member 232 and a third connecting member 242, and the first connecting member 222 and the second connecting member 232 are telescopic rods, and the top ends of the first connecting member 222, the second connecting member 232 and the third connecting member 242 penetrate and extend to the top surface of the grinding disc 21, and the grinding disc 21 is provided with a threaded sleeve 211 corresponding to the first connecting member 222, the second connecting member 232 and the third connecting member 242, and the first connecting member 222, the second connecting member 232 and the third connecting member 242 are respectively connected to the corresponding threaded sleeves 211.

[0041] It should be noted that, by providing the first connecting member 222 , the second connecting member 232 and the third connecting member 242 , the first grinding disc 22 , the second grinding disc 23 and the third grinding disc 24 can be easily replaced after being worn.

[0042] When in use, the first connecting member 222, the second connecting member 232, and the third connecting member 242 are connected or separated from the corresponding threaded sleeve 211 by rotating, so as to realize the connection or separation of the first grinding disc 22, the second grinding disc 23, and the third grinding disc 24 with the grinding disc 21; by connecting or separating the first grinding disc 22, the second grinding disc 23, and the third grinding disc 24 with the grinding disc 21 in this way, the efficiency of replacing the first grinding disc 22, the second grinding disc 23, and the third grinding disc 24 is greatly improved.

[0043] It should also be noted that in the process of grinding the material, the first connecting member 222 and the second connecting member 232 of the telescopic rod are squeezed and compressed to ensure that after the first grinding surface 221 contacts the surface of the storage plate 31, the second grinding surface 231 contacts the surface of the material; after the second grinding surface 231 contacts the surface of the storage plate 31, the third grinding surface 241 contacts the surface of the material, ensuring the grinding effect. At the same time, after the first grinding disc 22 and the second grinding disc 23 are completed grinding, the first connecting member 222 and the second connecting member 232 of the telescopic rod can reset the first grinding disc 22 and the second grinding disc 23 through their reset function to facilitate subsequent work. In the specific grinding process, the first connecting member 222 and the second connecting member 232 of the telescopic rod can also adjust the height of the first grinding disc 22 and the second grinding disc 23 in real time during the grinding process according to different material heights.

[0044] In a specific embodiment, the first connecting member 222 and the second connecting member 232 are screws, which cooperate with the threaded sleeve 211 to enable the first grinding disc 22 and the second grinding disc to move along the Z axis toward the material.

[0045] Furthermore, a support portion 212 is formed on the outer side of the threaded sleeve 211 along the Z-axis direction, a gap is formed between the threaded sleeve 211 and the grinding disc 21, and the first connecting member 222, the second connecting member 232 and the third connecting member 242 respectively penetrate the corresponding gaps and are connected to the corresponding threaded sleeve 211.

[0046] During use, when the first connecting member 222, the second connecting member 232, and the third connecting member 242 are connected to the corresponding threaded sleeve 211, the first connecting member 222, the second connecting member 232, and the third connecting member 242 can be rotated through the gap, so that the first connecting member 222, the second connecting member 232, and the third connecting member 242 can be connected or separated from the corresponding threaded sleeve 211. Under the action of the gap, not only the connection or separation rate can be improved, but also the operation process can be made more convenient and quick.

[0047] Furthermore, a telescopic space 25 is formed between the first grinding disc 22, the second grinding disc 23 and the grinding disc 21, the first connecting member 222 and the second connecting member 232 are respectively located in the telescopic space 25 corresponding to the first grinding disc 22 and the second grinding disc 23, the first grinding disc 22 and the second grinding disc 23 respectively move linearly along the Z-axis direction in the corresponding telescopic space 25, a telescopic edge grinding unit 26 is arranged on the inner side of the first grinding disc 22, a second edge grinding area 223 is arranged on the outer side of the first grinding disc 22, and a third edge grinding area 233 is arranged on the outer side of the second grinding disc 23.

[0048] When in use, when the first grinding disc 22 is grinding the surface of the material, the side of the material will be ground synchronously through the edge grinding unit 26, and the edge grinding unit 26 will adaptively adjust its height according to the height of the material; when the second grinding disc 23 is grinding the surface of the material, the side of the material will be ground synchronously through the second edge grinding area 223 on the first grinding disc 22, and the first grinding disc 22 will move in the corresponding telescopic space 25 according to the height of the material, squeeze the first connecting piece 222, and adaptively adjust its height to avoid affecting the grinding work of the second grinding disc 23 due to the height of the first grinding disc 22 not matching the height of the material; when the third grinding disc 24 is grinding the surface of the material, the side of the material will be ground synchronously through the third edge grinding area 233 on the second grinding disc 23, and the second grinding disc 23 will move in the corresponding telescopic space 25 according to the height of the material, squeeze the second connecting piece 232, and adaptively adjust its height to avoid affecting the grinding work of the third grinding disc 24 due to the height of the second grinding disc 23 not matching the height of the material.

[0049] Specifically, when the second grinding disc 23 is performing grinding work, the grinding disc 21 moves toward the surface of the material, and will first make the first grinding disc 22 contact with the surface of the storage disc 31, squeeze the first grinding disc 22, make the first grinding disc 22 move into the corresponding telescopic space 25, and allow the first connecting member 222 to expand and contract to achieve adaptive height adjustment. At the same time, when the third grinding disc 24 is performing grinding work, the moving grinding disc 21 will first make the second grinding disc 23 contact with the surface of the storage disc 31, squeeze the second grinding disc 23, make the second grinding disc 23 move into the corresponding telescopic space 25, and allow the second connecting member 232 to expand and contract to achieve adaptive height adjustment.

[0050] It should be noted that by grinding the material in the above manner, not only the surface of the material can be ground, but also the side of the material can be ground, which reduces the subsequent additional processing steps required, reduces the overall processing cost, and improves production efficiency. By grinding the surface and side at the same time, the error caused by multiple processing can be reduced and the overall processing accuracy can be improved.

[0051] It should also be noted that when it is necessary to grind the side of the material, when the grinding disc 21 moves in the Y-axis direction, there is no need to move the first grinding disc 22 and the second grinding disc 23 from above the placement disc 31, but it is still necessary to ensure that the first grinding disc 22 and the second grinding disc 23 are not in contact with the placement disc 31 to avoid wear on the first grinding surface 221 and the second grinding surface 231.

[0052] It should be noted that, since the heights of the materials to be ground are different, limiting the positions of the first grinding disc 22 and the second grinding disc 23 during simultaneous side grinding will affect the surface grinding work. The first connecting member 222 and the second connecting member 232 of the telescopic rod can allow the first grinding disc 22 and the second grinding disc 23 to move in the corresponding telescopic space 25, thereby adjusting the height to adapt to the height of the side material that needs to be ground.

[0053] Furthermore, the edge grinding unit 26 includes a moving block 262 and an edge grinding sleeve 263. The inner wall of the first grinding disc 22 is provided with at least two slide grooves 261 at equal intervals along the Z-axis direction. The moving block 262 is slidably connected in the slide groove 261, and the moving block 262 is elastically connected to the inner top wall of the slide groove 261. The edge grinding sleeve 263 is connected to the inner side of the moving block 262. The bottom end of the edge grinding sleeve 263 extends to the outer side of the first grinding disc 22. A first edge grinding area 264 is provided on the outer side of the edge grinding sleeve 263. The mesh number of the first edge grinding area 264, the mesh number of the second edge grinding area 223, and the mesh number of the third edge grinding area 233 are respectively the same as the mesh number of the first grinding surface 221, the mesh number of the second grinding surface 231, and the mesh number of the third grinding surface 241.

[0054] In more detail, the moving block 262 is connected to the inner top wall of the slide slot 261 via a spring 265 , and the moving block 262 moves linearly along the Z-axis direction in the slide slot 261 .

[0055] When in use, when the first grinding disc 22 is grinding, synchronous grinding of the side will be performed through the first edge grinding area 264. Before the first grinding disc 22 contacts the surface of the material, the edge grinding sleeve 263 contacts the placement plate 31. The edge grinding sleeve 263 also moves into the first grinding disc 22 as the first grinding disc 22 contacts the surface of the material. When the edge grinding sleeve 263 moves, it drives the moving block 262 to move in the slide groove 261 and squeezes the spring 265, so that the edge grinding sleeve 263 adapts to the height of the side of the material.

[0056] It should be noted that, through the first grinding wheel 22, the second grinding wheel 23, the third grinding wheel 24, the first edge grinding wheel, the second edge grinding area 223, and the third edge grinding area 233 on the edge grinding unit 26, not only the surface of the material can be ground, but also the side of the material can be ground, which effectively reduces the additional steps required for the subsequent process. At the same time, the retractable first grinding wheel 22, the second grinding wheel 23 and the edge grinding sleeve 263 can also adapt to materials of different heights during edge grinding, thereby improving applicability.

[0057] Embodiment 2: A grinding method for a semiconductor in this embodiment is applied to the grinding device for a semiconductor in Embodiment 1. The grinding method comprises the following steps: Step S1, after placing the material on the placing plate 31 and fixing it, the placing plate 31 and the grinding assembly 2 are made to rotate by the control unit; Step S11, after placing the materials, push the cylinder 17 to operate so that the storage table 3 and the assembly table are inclined; Step S21, the control unit controls the rotation motor and the driving assembly 4 to operate, so that the storage plate 31 and the grinding assembly 2 rotate and perform grinding work; Step S2, making the rotating grinding assembly 2 contact with the material to grind the surface of the material; Step S21, through the driving cylinder and the driving motor in the driving assembly 4, the grinding assembly 2 is rotated to approach the material to grind the material.

[0058] Step S3, the grinding assembly 2 is moved on the YZ plane, and the first grinding disc 22, the second grinding disc 23 and the third grinding disc 24 grind the surface of the material in sequence, so as to realize the rough grinding, fine grinding and polishing processes at one time.

[0059] Step S31, during the grinding operation, the first grinding surface 221 of the first grinding disc 22 grinds the surface of the material, and the first grinding area 264 of the grinding sleeve 263 grinds the side of the material; Step S32, the driving assembly 4 cooperates with the electric push rod 122 to move the grinding disc 21, so that the second grinding surface 231 of the second grinding disc 23 grinds the surface of the material, and the second edge grinding area 223 on the first grinding disc 22 grinds the side of the material; Step S33 , the grinding disc 21 moves again, so that the third grinding surface 241 of the third grinding disc 24 grinds the surface of the material, and the third edge grinding area 233 on the second grinding disc 23 grinds the side of the material.

[0060] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A grinding device for semiconductors, comprising a machine platform (1), characterized in that: The machine platform (1) is provided with a rotatable grinding component (2), and the grinding component (2) moves on a YZ plane. The machine platform (1) is provided with a storage table (3) corresponding to the grinding component (2), and a rotatable storage tray (31) is provided in the storage table (3), and the storage tray (31) is used to place materials; The grinding assembly (2) comprises a grinding disc (21) and a first grinding disc (22), a second grinding disc (23) and a third grinding disc (24) which are coaxially distributed on the grinding disc (21) from the inside to the outside. The first grinding disc (22), the second grinding disc (23) and the third grinding disc (24) are all detachably fixed on a side of the grinding disc (21) facing the storage disc (31). The first grinding disc (22), the second grinding disc (23) and the third grinding disc (24) are respectively provided with a first grinding surface (221), a second grinding surface (231) and a third grinding surface (241). The horizontal heights of the first grinding surface (221), the second grinding surface (231) and the third grinding surface (241) are increased in sequence, and the corresponding mesh numbers are also increased in sequence. The first grinding disc (22), the second grinding disc (23) and the third grinding disc (24) are used to grind the material on the storage disc (31) in sequence. The first grinding disc (22) and the second grinding disc (23) are moved toward the material along the Z-axis direction below the grinding disc (21), and the horizontal height can be adjusted so that after the first grinding surface (221) contacts the surface of the placement disc (31), the second grinding surface (231) contacts the surface of the material; and after the second grinding surface (231) contacts the surface of the placement disc (31), the third grinding surface (241) contacts the surface of the material.

2. A grinding device for semiconductors according to claim 1, characterized in that: The third grinding disc (24) is sleeved on the outside of the second grinding disc (23), and the second grinding disc (23) is sleeved on the outside of the first grinding disc (22); the width of the first grinding surface (221), the width of the second grinding surface (231) and the width of the third grinding surface (241) are all equal and are all greater than the diameter of the storage area (32) on the storage disc (31).

3. A grinding device for semiconductors according to claim 2, characterized in that: The machine platform (1) comprises a base (11), an assembly seat (12) and a mounting seat (13) which are connected in sequence. The mounting seat (13) is slidably connected to the assembly seat (12) and moves linearly along the Y-axis direction. The mounting seat (13) is provided with a driving component (4) connected to the grinding disc (21).

4. A grinding device for semiconductors according to claim 3, characterized in that: The storage tray (31) is hinged on the base (11) and connected to the assembly seat (12). The assembly seat (12) abuts against the base (11). A slide rail (14) is provided on the side of the base (11) along the Y-axis direction. A slider (15) is slidably connected in the slide rail (14). A protrusion (121) is formed on the side of the assembly seat (12) corresponding to the slider (15). The slider (15) and the protrusion (121) are hingedly connected to the same connecting plate (16) via a hinge shaft. A pushing cylinder (17) connected to the slider (15) is provided on the slide rail (14) along the Y-axis direction. A water pipe (33) is provided on the storage platform (3) corresponding to the storage area (32).

5. A grinding device for semiconductors according to claim 1, characterized in that: The first grinding disc (22), the second grinding disc (23) and the third grinding disc (24) are respectively provided with a rotatable first connecting member (222), a second connecting member (232) and a third connecting member (242), and the first connecting member (222) and the second connecting member (232) are both telescopic rods, and the top ends of the first connecting member (222), the second connecting member (232) and the third connecting member (242) penetrate through and extend to the top surface of the grinding disc (21), and the grinding disc (21) is provided with a threaded sleeve (211) corresponding to the first connecting member (222), the second connecting member (232) and the third connecting member (242), and the first connecting member (222), the second connecting member (232) and the third connecting member (242) are respectively connected to the corresponding threaded sleeve (211).

6. A grinding device for semiconductors according to claim 5, characterized in that: A support portion (212) is formed on the outer side of the threaded sleeve (211) along the Z-axis direction, a gap is formed between the threaded sleeve (211) and the grinding disc (21), and the first connecting member (222), the second connecting member (232) and the third connecting member (242) respectively penetrate the corresponding gaps and are connected to the corresponding threaded sleeve (211).

7. A grinding device for semiconductors according to claim 5, characterized in that: A telescopic space (25) is formed between the first grinding disc (22), the second grinding disc (23) and the grinding disc (21); the first connecting member (222) and the second connecting member (232) are respectively located in the telescopic spaces (25) corresponding to the first grinding disc (22) and the second grinding disc (23); the first grinding disc (22) and the second grinding disc (23) respectively move linearly along the Z-axis direction in the corresponding telescopic spaces (25); a telescopic edge grinding unit (26) is arranged on the inner side of the first grinding disc (22); a second edge grinding area (223) is arranged on the outer side of the first grinding disc (22); and a third edge grinding area (233) is arranged on the outer side of the second grinding disc (23).

8. A grinding device for semiconductors according to claim 7, characterized in that: The edge grinding unit (26) comprises a moving block (262) and an edge grinding sleeve (263); the inner side wall of the first grinding disc (22) is provided with at least two slide grooves (261) at equal intervals along the Z-axis direction; the moving block (262) is slidably connected in the slide groove (261); the moving block (262) is elastically connected to the inner top wall of the slide groove (261); the edge grinding sleeve (263) is connected to the inner side of the moving block (262); the bottom end of the edge grinding sleeve (263) extends to the outer side of the first grinding disc (22); the outer side of the edge grinding sleeve (263) is provided with a first edge grinding area (264); the mesh number of the first edge grinding area (264), the mesh number of the second edge grinding area (223), and the mesh number of the third edge grinding area (233) are respectively the same as the mesh number of the first grinding surface (221), the mesh number of the second grinding surface (231), and the mesh number of the third grinding surface (241).

9. A grinding device for semiconductors according to claim 8, characterized in that: The moving block (262) is connected to the inner top wall of the slide groove (261) via a spring (265), and the moving block (262) moves linearly along the Z-axis direction in the slide groove (261).

10. A grinding method for semiconductors, characterized in that: Applied to the grinding device for semiconductors as claimed in any one of claims 1 to 9, the grinding method comprises the following steps: Step S1, after placing the material on the placing plate and fixing it, the placing plate and the grinding assembly are rotated by the control unit; Step S2, making the rotating grinding component contact with the material to grind the surface of the material; Step S3, moving the grinding assembly on the YZ plane, allowing the first grinding disc, the second grinding disc and the third grinding disc to grind the surface of the material in turn, and realizing the rough grinding, fine grinding and polishing processes at one time.

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