Film pasting equipment suitable for CPU substrate

Abstract

The invention relates to film pasting equipment applicable to a CPU (central processing unit) substrate, which comprises an equipment base, a lifting support mounted on the equipment base, a feeding device mounted on the equipment base, a displacement adjusting device mounted on the lifting support, a film taking device mounted on the displacement adjusting device, and a back film removing device mounted on one side of the feeding device of the equipment base. A film pasting device is further mounted on the equipment base; and a control device is mounted on the equipment base. The feeding device comprises a feeding support connected with the equipment base, a feeding lifting driving device is installed at the lower end of the feeding support, a storage plate is installed on the feeding lifting driving device, the feeding support is located on the outer side of the storage plate and provided with a stacking guide mechanism, and a material distributing device is installed on the feeding support in a mirror image mode. And a stockpiling sensing device is further mounted on the feeding bracket. Therefore, automatic material taking, back film tearing and film pasting can be achieved, manual participation is not needed in the whole film pasting process, and the defect that film pasting flaws are caused by dust brought by manual work is overcome.

Description

Technical Field

[0001] The invention relates to a film pasting device, in particular to a film pasting device suitable for a CPU substrate. Background Art

[0002] During the processing of existing LGA chip packaging, it is necessary to apply a film on the back of the substrate to protect the chip contacts. The conventional method is to apply the film manually. In this way, the film application efficiency is low and there may be film application defects.

[0003] At the same time, there are also semi-automatic film laminating machines. However, when taking out the film and tearing off the back film, the existing semi-automatic film laminating machines are prone to taking out multiple films, and the back film is not completely torn off, leaving residues. Therefore, the subsequent film laminating effect is affected. Therefore, manual methods are still required to participate in the process of separating the back film or taking out the film. In addition, during the actual film laminating process, there will still be film laminating defects such as bubbles.

[0004] In view of the above-mentioned defects, the designer actively conducts research and innovation in order to create a film-sticking device suitable for CPU substrates to make it more valuable for industrial use. Summary of the invention

[0005] In order to solve the above technical problems, the purpose of the present invention is to provide a film pasting device suitable for CPU substrates.

[0006] The film pasting device suitable for CPU substrate of the present invention comprises a device base, a lifting bracket is installed on the device base, wherein: a feeding device is installed on the device base, a displacement adjustment device is installed on the lifting bracket, a film taking device is installed on the displacement adjustment device, the device base is located on one side of the feeding device, a back film removal device is installed, and a film pasting device is also installed on the device base; a control device is installed on the device base, and the control device is electrically connected with the feeding device, the displacement adjustment device, the film taking device, the back film removal device, and the film pasting device; the feeding device comprises a feeding bracket connected to the device base, a feeding lifting drive device is installed at the lower end of the feeding bracket, a storage plate is installed on the feeding lifting drive device, the feeding bracket is located on the outer side of the storage plate, a stacking guide mechanism is installed, a material dividing device is mirror-mounted on the feeding bracket, and a stacking sensing device is also installed on the feeding bracket.

[0007] Furthermore, in the above-mentioned film-sticking equipment suitable for CPU substrates, a placing base is installed on the feed bracket, a through hole is opened on the placing base, and the placement plate is movably installed in the through hole. When in standby state, the placement plate is flush with the through hole, and the feed lifting drive device is a cylinder.

[0008] Furthermore, in the above-mentioned film pasting equipment suitable for CPU substrates, the stacking guide mechanism is a guide column that is distributed around the outer corners of the placement plate and installed vertically, and a guide groove is opened on the guide column, and the corners of the placement plate are movably contacted with the guide groove.

[0009] Furthermore, the above-mentioned film-sticking equipment suitable for CPU substrates, wherein the material distribution device includes a supporting bracket connected to the feeding bracket, a bottom air blowing head is installed on the supporting bracket, the supporting bracket is located at the upper end of the bottom air blowing head, and a top air blowing head is installed, the top air blowing head has an angle with the horizontal plane, and the air outlet paths of the bottom air blowing head and the top air blowing head constitute a material distribution blowing angle.

[0010] Furthermore, in the above-mentioned film-laminating equipment suitable for CPU substrates, the stacking sensing device includes a sensing bracket mirror-mounted on a feeding bracket, a grating is mounted on the sensing bracket, and a light-transmitting hole is opened at the mounting position of the sensing bracket corresponding to the grating.

[0011] Furthermore, the above-mentioned film-sticking equipment suitable for CPU substrate, wherein the displacement adjustment device includes a mounting plate connected to the lifting bracket, a plurality of X-axis linear motors are installed on the mounting plate, and X-axis sliders are distributed on the X-axis linear motors, and the film-removing device is connected to the X-axis slider.

[0012] Furthermore, the above-mentioned film-sticking equipment suitable for CPU substrate, wherein the film-taking device includes a carrying plate connected to the displacement adjustment device, a Y-axis linear motor is installed on the carrying plate, a Y-axis slider is movably installed on the Y-axis linear motor, a film-taking bracket is installed on the Y-axis slider, and an adsorption component is installed under the film-taking bracket.

[0013] Furthermore, in the above-mentioned film-sticking equipment suitable for CPU substrate, a plurality of elastic buffer connecting rods are installed between the film-taking bracket and the adsorption component, and the adsorption component includes an air pressure regulating box, and a plurality of suction cups are connected to the lower end of the air pressure regulating box.

[0014] Furthermore, the above-mentioned film-sticking equipment suitable for CPU substrates, wherein the back-film removal device includes a traction linear motor installed on the equipment base, a traction slider is movably installed on the traction linear motor, a separation blow head is installed on the traction slider, the traction slider is located on one side of the air outlet end of the separation blow head, and a clamping assembly is installed, the clamping assembly includes a clamping cylinder, and a clamping claw is connected to the driving end of the clamping cylinder.

[0015] Furthermore, the above-mentioned film pasting equipment suitable for CPU substrate, wherein the film pasting device includes a film pasting platform connected to the equipment base, the equipment base is located at the rear side of the film pasting platform and is also equipped with a film pasting stroke linear motor, a stroke adjustment slider is movably installed on the film pasting stroke linear motor, a hanging bracket is installed on the stroke adjustment slider, a pressure cylinder is installed on the hanging bracket, and a roller assembly is connected to the pressure cylinder; the roller assembly includes a pressure plate connected to the pressure cylinder, and the pressure plate is movably connected to the roller assembly through an elastic buffer connecting rod.

[0016] By means of the above scheme, the present invention has at least the following advantages:

[0017] 1. It can meet the needs of automatic material picking, back film tearing and film pasting. The whole film pasting process does not require manual participation, reducing the defects of film pasting caused by dust caused by manual labor.

[0018] 2. An independent film-taking device is provided to meet the requirement of free feeding of membrane components between various workstations, without manual intervention for auxiliary workstation switching, thus improving feeding efficiency.

[0019] 3. The feeding device is equipped with a bottom blowing head and a top blowing head, which can realize the lossless distribution of the top membrane components without electrostatic adhesion.

[0020] 4. The back film removal device can achieve lossless separation of the back film without manual tearing and will not cause back film residue.

[0021] 5. The film laminating device can meet the requirements of roller pressing and tight fitting, and can squeeze out bubbles to improve the yield rate after film laminating.

[0022] 6. The overall structure is simple, easy to manufacture and use, can be arranged at the terminal of the CPU substrate processing equipment, and can be connected using material transfer equipment, with good versatility.

[0023] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of a film laminating device suitable for CPU substrates.

[0025] Figure 2 It is a structural schematic diagram of the feeding device.

[0026] Figure 3 It is a structural schematic diagram of the shifting and adjusting device.

[0027] Figure 4 It is a structural schematic diagram of the membrane extraction device.

[0028] Figure 5 It is a schematic diagram of the structure of the back film removal device.

[0029] Figure 6 It is a structural schematic diagram of a film sticking device.

[0030] The meanings of the reference numerals in the drawings are as follows.

[0031] 1 Lifting bracket 2 Feeding bracket

[0032] 3 Feed lift drive device 4 Storage plate

[0033] 5 Stacking guide mechanism 6 Loading bracket

[0034] 7 Bottom air blowing head 8 Top air blowing head

[0035] 9 Induction bracket 10 Grating

[0036] 11 Mounting plate 12 X-axis linear motor

[0037] 13X axis slider 14 bearing plate

[0038] 15Y axis linear motor 16 film taking bracket

[0039] 17 Adsorption assembly 18 Traction linear motor

[0040] 19 Traction slider 20 Separation blowing head

[0041] 21 Clamping cylinder 22 Clamping claw

[0042] 23 Film sticking stroke linear motor 24 Stroke adjustment slider

[0043] 25 Mounting bracket 26 Pressure cylinder

[0044] 27 Roller assembly 28 Elastic buffer connecting rod

[0045] 29 Feeding device 30 Shifting and adjusting device

[0046] 31 Film removal device 32 Back film removal device

[0047] 33 Film sticking device DETAILED DESCRIPTION

[0048] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0049] like Figures 1 to 6The film laminating equipment suitable for CPU substrate includes an equipment base, on which a lifting bracket 1 is installed. The difference is that a feeding device 29 is installed on the equipment base to facilitate the preparation of the film assembly to be laminated. At the same time, a displacement adjustment device 30 is installed on the lifting bracket 1, and a film taking device 31 is installed on the displacement adjustment device 30. In this way, the film assembly can be selected to switch and feed between various stations such as back film removal and film laminating. During the implementation, the equipment base is located on one side of the feeding device 29, and a back film removal device 32 is installed, and a film laminating device 33 is also installed on the equipment base. In addition, a control device is installed on the equipment base, and the control device is electrically connected to the feeding device 29, the displacement adjustment device 30, the film taking device 31, the back film removal device 32, and the film laminating device 33. In this way, convenient automatic coordinated control can be achieved. The control device can preferably be a commercially available industrial computer, and the drive control of each device is realized through a preset program, which will not be repeated here.

[0050] During the implementation, in order to stack the membrane components layer by layer and facilitate the subsequent final use, the feeding device 29 includes a feeding bracket 2 connected to the equipment base, and a feeding lifting drive device 3 is installed at the lower end of the feeding bracket 2, and a storage plate 4 is installed on the feeding lifting drive device 3. In this way, after the upper membrane components are taken, the membrane components in the preparation state can be gradually lifted, which is convenient for the membrane taking device 31 to dock and take. At the same time, in order to facilitate the vertical stacking, the feeding bracket 2 is located on the outside of the storage plate 4, and a stacking guide mechanism 5 is installed. Considering that the membrane component monomer is relatively thin, a material separation device is installed on the feeding bracket 2 in a mirror image, which is convenient for separating the upper single-layer membrane components during the material taking period. Furthermore, a stacking sensing device is also installed on the feeding bracket 2. In this way, when the material is about to be taken out or has been taken out, the corresponding processing equipment can be reminded to replenish the material.

[0051] In combination with a preferred embodiment of the present invention, a placing base is installed on the feeding bracket 2, a through hole is provided on the placing base, a storage plate 4 is movably installed in the through hole, and when in the standby state, the storage plate 4 is flush with the through hole, and the feeding lifting drive device 3 is a cylinder. In this way, the membrane components in the stack can be gradually lifted. It is also possible to lift all the membrane components during the material removal process, so as to facilitate the subsequent selection of the membrane component at the top by the material dividing device. At the same time, in order to achieve appropriate limiting of each membrane component in the stacked state, the stacking guide mechanism 5 is a guide column that is distributed around the outer corners of the storage plate 4 and is vertically installed, and a guide groove is provided on the guide column, and the corners of the storage plate 4 are in movably contact with the guide groove.

[0052] Further, the material distribution device used in the present invention includes a supporting bracket 6 connected to the feeding bracket 2, a bottom air blowing head 7 is installed on the supporting bracket 6, the supporting bracket 6 is located at the upper end of the bottom air blowing head 7, and a top air blowing head 8 is installed, the top air blowing head 8 is at an angle with the horizontal plane, and the air outlet paths of the bottom air blowing head 7 and the top air blowing head 8 constitute a material distribution blowing angle. During use, the bottom air blowing head 7 and the top air blowing head 8 introduce ion wind, and the membrane assembly located at the top is separated and blown under the guidance of the material distribution blowing angle. At the same time, the stacking sensing device used includes a sensing bracket 9 installed on the feeding bracket 2 in a mirror image, and a grating 10 is installed on the sensing bracket 9. The sensing bracket 9 corresponds to the installation position of the grating 10, and a light-transmitting hole is opened, which will not cause the grating 10 to be blocked. In this way, the material shortage state can be timely known through the sensing of the grating 10. Of course, the material taking process can also be sensed by the grating 10.

[0053] In combination with the actual implementation, the displacement adjustment device 30 includes a mounting plate 11 connected to the lifting bracket 1, a plurality of X-axis linear motors 12 are mounted on the mounting plate 11, X-axis sliders 13 are distributed on the X-axis linear motors 12, and the film taking device 31 is connected to the X-axis sliders 13. In this way, stable mounting can be achieved, ensuring that the subsequent film taking device 31 has a stable moving stroke, and the film assembly will not be offset or dropped due to shaking.

[0054] At the same time, in order to achieve smooth transfer of the membrane assembly between various workstations, the film taking device 31 includes a carrier plate 14 connected to the displacement adjustment device 30, a Y-axis linear motor 15 is installed on the carrier plate 14, and a Y-axis slider is movably installed on the Y-axis linear motor 15. In this way, effective Y-axis gap adjustment can be achieved to meet the vertical spacing between different workstations, ensure the feeding accuracy of the membrane assembly, and perform appropriate obstacle avoidance during feeding. In addition, a film taking bracket 16 is installed on the Y-axis slider, and an adsorption component 17 is installed under the film taking bracket 16. Specifically, a number of elastic buffer connecting rods 28 are installed between the film taking bracket 16 and the adsorption component 17. In this way, even if the Y-axis slider has a certain vibration during the subsequent displacement, it can be absorbed by the elastic buffer connecting rod 28, and the stress of the vibration will not be transmitted to the adsorption component 17. Furthermore, in order to achieve stable material taking adsorption and quick release when film pasting is required, the adsorption component 17 includes an air pressure regulating box, and a number of suction cups are connected to the lower end of the air pressure regulating box. During the implementation period, the air pressure regulating box is equipped with commercially available negative pressure equipment, which will not be described in detail here.

[0055] Looking further, the back film removal device 32 used in the present invention includes a traction linear motor 18 installed on the equipment base, a traction slider 19 is movably installed on the traction linear motor 18, and a separation blowing head 20 is installed on the traction slider 19. During assembly, the separation blowing head 20 can be connected to an airflow blowing device such as an ion blower. The traction slider 19 is located on one side of the air outlet end of the separation blowing head 20 and is installed with a clamping assembly. At the same time, in order to effectively locate the extended end of the back film extending from the membrane assembly, the clamping assembly includes a clamping cylinder 21, and the driving end of the clamping cylinder 21 is connected to a clamping claw 22. In this way, the extended end of the back film is grasped by the clamping claw 22 to achieve preliminary separation of the back film. As the separation blowing head 20 blows gas into the previous separation opening, the separation of the back film is achieved by moving the traction slider 19 to obtain the membrane body. In addition, in order to avoid electrostatic interference, the gas can be an ion wind.

[0056] During the implementation, in order to effectively fit the film body with the back film removed on the CPU substrate, the film pasting device 33 includes a film pasting platform connected to the device base, which is used to place the CPU substrate. At the same time, the device base is also equipped with a film pasting stroke linear motor 23 on the rear side of the film pasting platform, and a stroke adjustment slider 24 is movably installed on the film pasting stroke linear motor 23. In addition, a hanging bracket 25 is installed on the stroke adjustment slider 24, and a pressure cylinder 26 is installed on the hanging bracket 25, and a roller assembly 27 is connected to the pressure cylinder 26. In this way, after the film removal device 31 places the film body on the CPU substrate, stable film pasting is achieved through the force of the roller assembly 27. Furthermore, in order to improve the quality of film pasting and realize the extrusion of bubbles, the roller assembly 27 includes a pressure plate connected to the pressure cylinder 26, and the pressure plate is movably connected to the roller assembly through the elastic buffer connecting rod 28.

[0057] The working principle of the present invention is as follows:

[0058] The user stacks the membrane components to be processed on the placement plate 4 , and with the assistance of the stacking guide mechanism 5 , the stacking is stable.

[0059] After operation, the adsorption component 17 of the membrane removal device 31 arrives above the membrane assembly and waits. The feed lifting drive device 3 realizes upward feeding, and the bottom blowing head 7 and the top blowing head 8 work synchronously to separate the top membrane assembly. In addition, the upper surface of the membrane assembly is in contact with the adsorption component 17. The adsorption component 17 operates synchronously to achieve adsorption of the membrane assembly. The removal of the membrane assembly is completed. After this process is completed, the feed lifting drive device 3 can adjust the position of the storage plate 4 as needed to achieve gradual feed lifting or reset to meet different feeding and taking needs. Relying on the stockpiling sensing device, when the stock is lower than the preset value, feedback can be given through the control device to facilitate replenishment.

[0060] Afterwards, the film removal device 31 brings the film assembly to the workstation of the back film removal device 32. The clamping claw 22 of the back film removal device 32 clamps the extended end of the back film attached to the lower surface of the film assembly. Afterwards, the traction linear motor 18 operates to tear an opening in the back film. Next, the separation blowing head 20 blows air, and the traction linear motor 18 further operates to drive the clamping claw 22 away from the film assembly to achieve complete separation of the back film. At this time, through the operation of the adsorption component 17, the film body with the back film removed still maintains a stable adsorbed state. The back film can be uniformly collected by an external material receiving component.

[0061] Next, the film taking device 31 delivers the film body to the film sticking station where the film sticking device 33 is located, and the CPU substrate has been placed on the film sticking platform. Subsequently, the film taking device 31 descends to allow the film body to adhere to the CPU substrate. After that, the film sticking device 33 controls the rolling component 27 to roll from one end of the CPU substrate to the other end to meet the bonding of the film body and squeeze out the bubbles. At the same time, the adsorption component 17 releases the adsorption state. In addition, through the presence of the elastic buffer link 28, the rolling component 27 can always fit on the surface of the film body and provide appropriate rolling stress.

[0062] Thus, the film lamination of a single CPU substrate is completed.

[0063] It can be seen from the above textual description and the accompanying drawings that the present invention has the following advantages:

[0064] 1. It can meet the needs of automatic material picking, back film tearing and film pasting. The whole film pasting process does not require manual participation, reducing the defects of film pasting caused by dust caused by manual labor.

[0065] 2. An independent film-taking device is provided to meet the requirement of free feeding of membrane components between various workstations, without manual intervention for auxiliary workstation switching, thus improving feeding efficiency.

[0066] 3. The feeding device is equipped with a bottom blowing head and a top blowing head, which can realize the lossless distribution of the top membrane components without electrostatic adhesion.

[0067] 4. The back film removal device can achieve lossless separation of the back film without manual tearing and will not cause back film residue.

[0068] 5. The film laminating device can meet the requirements of roller pressing and tight fitting, and can squeeze out bubbles to improve the yield rate after film laminating.

[0069] 6. The overall structure is simple, easy to manufacture and use, can be arranged at the terminal of the CPU substrate processing equipment, and can be connected using material transfer equipment, with good versatility.

[0070] In addition, the indicated orientations or positional relationships described in the present invention are all based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or structure referred to must have a specific orientation or be operated with a specific orientation structure. Therefore, they cannot be understood as limitations on the present invention.

[0071] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A film laminating device suitable for a CPU substrate comprises a device base, a lifting bracket is installed on the device base, and the characteristics are: A feeding device is installed on the equipment base, a displacement adjustment device is installed on the lifting bracket, a film taking device is installed on the displacement adjustment device, the equipment base is located on one side of the feeding device, and is equipped with a back film removal device, and a film pasting device is also installed on the equipment base; a control device is installed on the equipment base, and the control device is electrically connected to the feeding device, the displacement adjustment device, the film taking device, the back film removal device, and the film pasting device; the feeding device includes a feeding bracket connected to the equipment base, a feeding lifting drive device is installed at the lower end of the feeding bracket, a storage plate is installed on the feeding lifting drive device, the feeding bracket is located on the outer side of the storage plate, and is equipped with a stacking guide mechanism, a material dividing device is mirror-mounted on the feeding bracket, and a stacking sensing device is also installed on the feeding bracket.

2. The film laminating device suitable for CPU substrate according to claim 1, characterized in that: A placing base is installed on the feeding bracket, a through hole is opened on the placing base, and the placing plate is movably installed in the through hole. When in a standby state, the placing plate is flush with the through hole, and the feeding lifting drive device is a cylinder.

3. The film laminating device suitable for CPU substrate according to claim 1, characterized in that: The stacking guide mechanism is a guide column which is distributed around the outer corners of the storage plate and is installed vertically. The guide column is provided with a guide groove, and the corners of the storage plate are in active contact with the guide groove.

4. The film laminating device for CPU substrate according to claim 1 is characterized in that: The material distribution device includes a supporting bracket connected to the feeding bracket, a bottom air blowing head is installed on the supporting bracket, the supporting bracket is located at the upper end of the bottom air blowing head, and a top air blowing head is installed, the top air blowing head has an angle with the horizontal plane, and the air outlet paths of the bottom air blowing head and the top air blowing head constitute a material distribution blowing angle.

5. The film laminating device suitable for CPU substrate according to claim 1, characterized in that: The stacking induction device comprises an induction bracket mirror-mounted on the feeding bracket, a grating is mounted on the induction bracket, and a light-transmitting hole is provided in the induction bracket corresponding to the installation position of the grating.

6. The film laminating device suitable for CPU substrate according to claim 1, characterized in that: The displacement adjustment device includes a mounting plate connected to the lifting bracket, a plurality of X-axis linear motors are mounted on the mounting plate, X-axis sliders are distributed on the X-axis linear motors, and the film taking device is connected to the X-axis sliders.

7. The film laminating device suitable for CPU substrate according to claim 1, characterized in that: The film taking device includes a supporting plate connected to the displacement adjustment device, a Y-axis linear motor is installed on the supporting plate, a Y-axis slider is movably installed on the Y-axis linear motor, a film taking bracket is installed on the Y-axis slider, and an adsorption component is installed under the film taking bracket.

8. The film laminating device suitable for CPU substrate according to claim 7, characterized in that: A plurality of elastic buffer connecting rods are installed between the film taking support and the adsorption assembly. The adsorption assembly includes an air pressure regulating box. The lower end of the air pressure regulating box is connected to a plurality of suction cups.

9. The film laminating device suitable for CPU substrate according to claim 1, characterized in that: The back film removal device includes a traction linear motor installed on the equipment base, a traction slider is movably installed on the traction linear motor, a separation blow head is installed on the traction slider, the traction slider is located on one side of the air outlet end of the separation blow head, and a clamping assembly is installed, the clamping assembly includes a clamping cylinder, and a clamping claw is connected to the driving end of the clamping cylinder.

10. The film laminating device suitable for CPU substrate according to claim 1, characterized in that: The film pasting device includes a film pasting platform connected to the equipment base, the equipment base is located on the rear side of the film pasting platform and is also equipped with a film pasting stroke linear motor, a stroke adjustment slider is movably installed on the film pasting stroke linear motor, a hanging bracket is installed on the stroke adjustment slider, a pressure cylinder is installed on the hanging bracket, and a rolling assembly is connected to the pressure cylinder; the rolling assembly includes a pressure plate connected to the pressure cylinder, and the pressure plate is movably connected to the roller assembly through an elastic buffer connecting rod.

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