Resistor load current temperature coefficient test method and test equipment thereof

Abstract

The invention provides a resistor load current temperature coefficient test method and test equipment thereof, the resistor load current temperature coefficient test equipment comprises a constant temperature and humidity chamber, a temperature detector and a current measurement and control instrument, and a main body temperature control device and a graded temperature control device are arranged in the constant temperature and humidity chamber. The graded temperature control device comprises a supporting base plate, an integrated seat and a plurality of jigs, and the jigs are distributed on the supporting base plate and connected with the integrated seat through wire conduits respectively. Each jig comprises a base, an upper cover and an interlayer piece, the upper cover is arranged above the base, a heat preservation space is formed between the upper cover and the base, the interlayer piece is contained in the heat preservation space in a sliding mode, and the interlayer piece is used for containing a test connecting plate; a temperature adjusting assembly is arranged in the base. According to the resistor load current temperature coefficient test method and the test equipment thereof, the actual surface temperature of a resistor product can be more accurately controlled to reach a test specified temperature, so that the precision and the accuracy of a test result are improved.

Description

Technical Field

[0001] The invention relates to the technical field of resistor testing, and in particular to a resistor load current temperature coefficient testing method and testing equipment thereof. Background Art

[0002] Usually, there are some deficiencies and limitations in the performance test methods of resistor products, one of which is the limitation of the temperature coefficient test temperature range and the actual surface temperature of the product. In the traditional temperature coefficient test, usually only the ambient temperature is controlled, and the data is read when the ambient temperature reaches the standard. This design does not take into account the actual surface temperature of the product. For example, the resistor itself will continue to heat up after the load is connected. When the ambient temperature reaches the standard, the actual surface temperature of the resistor does not reach the temperature specified by the test requirements (hereinafter referred to as the specified temperature). Testing in this case affects the precision and accuracy of the resistor product test results.

[0003] There are some standards for temperature coefficient test methods on the market, but the actual surface temperature detection of resistor products has not yet been solved, and there is a lack of corresponding testing equipment on the market.

[0004] Therefore, how to design a resistor load current temperature coefficient test method and its test equipment so that it can more accurately control the actual surface temperature of the resistor product to reach the specified test temperature, thereby improving the precision and accuracy of the test results, is a technical problem that technical personnel in this field need to solve. Summary of the invention

[0005] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a resistor load current temperature coefficient testing method and testing equipment thereof, so that the actual surface temperature of the resistor product can be more accurately controlled to reach the specified test temperature, thereby improving the precision and accuracy of the test results.

[0006] The objective of the present invention is achieved through the following technical solutions:

[0007] A resistor load current temperature coefficient test device, comprising: a constant temperature and humidity chamber, a temperature detector and a current measuring and controlling instrument, wherein the constant temperature and humidity chamber is provided with a main body temperature control device and a graded temperature regulating device, the temperature detector is connected to the constant temperature and humidity chamber through a temperature detection line group, and the current measuring and controlling instrument is connected to the graded temperature control device through a sampling line group;

[0008] The hierarchical temperature control device comprises: a supporting base, an integrated seat and a plurality of fixtures, wherein the plurality of fixtures are evenly distributed on the supporting base, and the plurality of fixtures are respectively connected to the integrated seat through wire tubes;

[0009] Each of the fixtures includes: a base, an upper cover and an isolation layer. The upper cover is arranged above the base, and an insulation space is formed between the upper cover and the base. The isolation layer is slidably accommodated in the insulation space. A test connection plate is provided on the isolation layer, and the test connection plate is used to place a resistor. A temperature adjustment component is provided inside the base.

[0010] In one embodiment, among the multiple fixtures, the temperature adjustment component of a part of the fixtures includes a refrigerator, and the temperature of the insulation space of this part of the fixtures is gradually reduced; the temperature adjustment component of another part of the fixtures includes a heater, and the temperature of the insulation space of this part of the fixtures is gradually increased; the refrigerator or the heater is used to regulate the temperature in the insulation space.

[0011] In one of the embodiments, the upper cover is provided with a ventilation window, and the ventilation window is communicated with the heat preservation space.

[0012] In one of the embodiments, the upper cover is provided with a filter plate, the filter plate cover is provided at the ventilation window, and the filter plate is used to prevent dust from falling onto the test connection board and its resistor.

[0013] In one of the embodiments, a plurality of heat-conducting holes are provided on the base, and the partition member is a hollow structure to promote temperature exchange between the test connection plate on the partition member and the gas in the insulation space; a positioning groove for placing the test connection plate is provided on the partition member.

[0014] In one embodiment, a controller is provided in the integrated seat, and the controller is electrically connected to the sampling line group and the temperature detection line group;

[0015] The temperature detection line group includes an in-box temperature detection line and a product temperature test line. A temperature probe is provided on the integrated seat. The in-box temperature detection line is connected to the temperature probe for testing the ambient temperature in the constant temperature and humidity chamber; the product temperature test line is connected to the temperature sensing probe on each test connection board for testing the surface temperature of the resistor.

[0016] In one of the embodiments, the test connection board is provided with a current output line and a voltage collection line, and the current output line, the voltage collection line and the product temperature test line are all passed through the wire tube.

[0017] A resistor load current temperature coefficient testing method is implemented based on the above resistor load current temperature coefficient testing device, and comprises the following steps:

[0018] Step 1, obtaining a plurality of resistors of the same type and the same batch, and placing the resistors on a plurality of the test connection boards;

[0019] Step 2, placing the test connection board on a plurality of the isolation layers respectively, and accommodating the test connection board and the isolation layers into the corresponding heat preservation spaces;

[0020] Step 3, the main body temperature control device adjusts the temperature in the constant temperature and humidity chamber;

[0021] Step 4, the plurality of temperature regulating components respectively adjust the temperatures of the plurality of corresponding heat preservation spaces;

[0022] Step 5: Take test readings and analyze the test results.

[0023] In summary, the resistor load current temperature coefficient testing method and testing equipment of the present invention can more accurately control the actual surface temperature of the resistor product to achieve the specified test temperature, thereby improving the precision and accuracy of the test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 It is a structural schematic diagram of a resistor load current temperature coefficient testing device of the present invention;

[0026] Figure 2 It is a structural schematic diagram of the hierarchical temperature control device of the present invention;

[0027] Figure 3 for Figure 2 The structural schematic diagram of the fixture shown;

[0028] Figure 4 for Figure 3 The structural decomposition diagram of the fixture shown (I);

[0029] Figure 5 for Figure 3 The structural decomposition diagram of the fixture shown (II);

[0030] Figure 6 for Figure 4 Schematic diagram of the matching relationship between the partition member and the test connection plate shown. DETAILED DESCRIPTION

[0031] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0032] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0034] The present invention provides a resistor load current temperature coefficient testing method and testing device 10 thereof, aiming to more accurately control the actual surface temperature of the resistor product to reach the specified test temperature, thereby improving the precision and accuracy of the test results.

[0035] There are some deficiencies and limitations in the traditional performance test method of resistor products. During the test process, only the ambient temperature inside the test equipment (test box) is controlled, and data is read when the ambient temperature reaches the temperature specified in the test standard. This traditional method does not fully take into account the heating of the resistor itself under load, that is, in actual conditions, the resistor generates heat after being powered on, and there is a difference between the actual surface temperature of the resistor product and the ambient temperature, and the temperature difference takes a long time to stabilize. For example, the test standard specifies a temperature of 20°C. If the traditional test method is used, only the ambient temperature inside the test equipment (test box) is adjusted to 20°C. Under load, the actual surface temperature of the resistor may reach 30°C, so there is a deviation between the surface temperature and the specified temperature, and the test results obtained are not accurate enough. Moreover, since the actual heating of the resistor may fluctuate, the actual surface temperature of the resistor may fluctuate around 30°C, that is, the deviation between the surface temperature and the specified temperature is unstable, so it is difficult to achieve accurate measurement through the existing compensation curve. In other words, using the traditional test method, it is difficult to make the actual surface temperature of the resistor accurately reach the specified temperature of the test standard, and the error of the test result is large.

[0036] To this end, the present invention designs a resistor load current temperature coefficient test method, the main design ideas of the method are as follows: first, select multiple resistors of the same type and batch, and place these resistors in the same environment; then, adjust the overall ambient temperature to supplement the surface temperature of the resistor product, so that the surface temperature reaches the specified temperature of the test standard. For example, the specified temperature of the test standard is 20°C, and the surface temperature of the resistor may reach 30°C under load heating. In this case, the overall ambient temperature needs to be adjusted to -10°C to compensate for the surface temperature.

[0037] At the same time, each resistor is also affected by a separate heat source, which increases or decreases the heat for the corresponding resistor in a small range, so that the actual ambient temperature of multiple resistors forms a step-like distribution. In this way, the test result data of multiple resistors can be summarized to obtain the corresponding test data fitting curve, through which the measurement results of the resistor product at the specified temperature can be obtained more accurately.

[0038] The present invention also provides a resistor load current temperature coefficient test device 10 to implement the above test method. Figure 1 As shown, the test equipment 10 includes: a constant temperature and humidity chamber 100, a temperature detector 200 and a current measuring and controlling instrument 300. The constant temperature and humidity chamber 100 is provided with a main body temperature control device (not shown) and a graded temperature adjustment device 400 (such as Figure 2As shown), the temperature detector 200 is connected to the constant temperature and humidity chamber 100 through the temperature detection line group 210, and the current measurement and control instrument 300 is connected to the graded temperature control device 400 through the sampling line group 310.

[0039] like Figure 2 As shown, the graded temperature control device 400 includes: a supporting base 410, an integrated seat 420 and a plurality of fixtures 430, wherein the plurality of fixtures 430 are evenly distributed on the supporting base 410, and the plurality of fixtures 430 are respectively connected to the integrated seat 420 through wire tubes 440.

[0040] like Figure 3 and Figure 4 As shown, each fixture 430 includes: a base 450, an upper cover 460 and an interlayer 470. The upper cover 460 is arranged above the base 450. A heat preservation space 401 is formed between the upper cover 460 and the base 450. The interlayer 470 is slidably accommodated in the heat preservation space 401. A test connection board 480 is arranged on the interlayer 470. The test connection board 480 is used to place the resistor. In addition, a temperature adjustment component (not shown) is arranged inside the base 450. The temperature adjustment component is the separate heat source mentioned in the above test method.

[0041] Among the multiple fixtures 430, the temperature adjustment components of some of the fixtures 430 include refrigerators, and the temperature of the insulation space 401 of these fixtures 430 is reduced one by one; the temperature adjustment components of another part of the fixtures 430 include heaters, and the temperature of the insulation space 401 of this part of the fixtures is increased one by one. The refrigerator or heater is used to regulate the temperature in the insulation space 401 within a small range. For example, in one part of the fixtures 430, these multiple refrigerators respectively reduce the temperature in the insulation space 401 by 1°C, 2°C, 3°C...; in another part of the fixtures 430, multiple heaters increase the temperature in the insulation space 401 by 1°C, 2°C, 3°C... The specific working principle will be described below.

[0042] In this embodiment, if Figure 4 As shown, the upper cover 460 is provided with a ventilation window 461, and the ventilation window 460 is connected with the heat preservation space 401. The provision of the ventilation window 460 can make the internal temperature of the heat preservation space 401 quickly reach the same as the ambient temperature in the constant temperature and humidity chamber 100. Preferably, the upper cover 460 is provided with a filter plate 462, and the filter plate 462 is covered at the ventilation window 461, and the filter plate 462 is used to prevent dust from falling onto the test connection board 480 and its resistor during the test process.

[0043] Preferably, Figure 4 and Figure 5As shown, a plurality of heat-conducting holes 451 are provided on the base 450, and the partition member 470 is a hollow structure to facilitate the temperature exchange between the test connection board 480 on the partition member 470 and the gas in the heat-insulating space 401. In addition, a positioning groove for placing the test connection board 480 is provided on the partition member 470, which can limit the test connection board 480 to prevent the test connection board 480 and the resistor thereon from being misaligned during the sliding process of the partition member 470.

[0044] In this embodiment, a controller (not shown) is provided in the integrated seat 420, and the controller is electrically connected to the sampling line group 310 and the temperature detection line group 210. The temperature detection line group 210 includes an in-box temperature detection line and a product temperature test line. A temperature probe (not shown) is provided on the integrated seat. The in-box temperature detection line is connected to the temperature probe to test the ambient temperature in the constant temperature and humidity chamber 100; the product temperature test line is connected to the temperature sensing probe on each test connection board 480 to test the surface temperature of the resistor.

[0045] Preferably, Figure 6 As shown, the test connection board 480 is provided with a current output line 481 and a voltage collection line 482, and the current output line 481, the voltage collection line 482 and the product temperature test line are all passed through the wire tube 440. The setting of the wire tube 440 can organize many wires, making the wiring of the graded temperature control device 400 neater, improving neatness and facilitating subsequent maintenance.

[0046] Next, in combination with the above structure, the working principle of the resistor load current temperature coefficient test device 10 of the present invention is explained:

[0047] Before the test, the staff selects a plurality of resistors of the same type and batch, and places these resistors on a plurality of test connection boards 480; then, each test connection board 480 is placed in a corresponding partition 470, and then the partition 470 is pushed into the heat preservation space 401, so that each heat preservation space 401 of the fixture 430 has a test connection board 480;

[0048] During the test, assuming that the specified temperature of the test standard is 20°C, the surface temperature of the resistor may reach 30°C under load heating, then the main temperature control device of the constant temperature and humidity chamber 100 controls the overall ambient temperature in the chamber to -10°C to compensate for the surface temperature of the resistor. At the same time, the temperature adjustment components of a part of the fixtures 430 cool down the temperature in the insulation space 401, for example, the insulation space 401 of the first fixture 430 cools down by 1°C, the insulation space 401 of the second fixture 430 cools down by 2°C, and so on; while the temperature adjustment components of another part of the fixtures 430 heat up the temperature in the insulation space 401, for example, the insulation space 401 of the first fixture 430 heats up by 1°C, the insulation space 401 of the second fixture 430 heats up by 2°C, and so on. Then, readings are recorded for all the test connection boards 480 at the same time, and finally the data of multiple test results are summarized to obtain a corresponding test data fitting curve, through which the measurement results of the resistor product at a specified temperature can be accurately known;

[0049] Furthermore, when it is necessary to test other specified temperatures, it is only necessary to adjust the overall ambient temperature. For example, if the specified temperature of the test standard is further changed to 30°C, the main temperature control device controls the ambient temperature in the constant temperature and humidity chamber 100 to 0°C to compensate for the surface temperature of the resistor. The temperature in the insulation space 401 of the multiple fixtures 430 also maintains a stepped distribution;

[0050] After the test is finished, the staff refers to the above placement sequence and performs the reverse operation to remove the test connection board 480 and the resistor thereon.

[0051] Compared with the prior art, the test equipment 10 of the present invention has refined control over the test of each resistor. Traditional test equipment can only adjust the overall ambient temperature, which can neither solve the difference between the ambient temperature and the surface temperature of the resistor product, nor suppress the fluctuation of the product surface temperature, which leads to large errors in the measurement results. In the present invention, the graded temperature control device 400 provides a separate insulation space 401 for each resistor. In addition to adjusting the overall ambient temperature inside the constant temperature and humidity chamber 100, the test equipment 10 also allows the ambient temperature in multiple insulation spaces 401 to form a stepped distribution. In this way, the test equipment 10 of the present invention can obtain multiple sets of data in a specified temperature range in the same test, so that a fitting curve can be obtained, and then the measurement results of the resistor product at the specified temperature can be accurately known through the fitting curve.

[0052] In combination with the above, the testing method of the present invention is implemented based on the above resistor load current temperature coefficient testing device 10, which mainly includes the following steps:

[0053] Step 1: obtain a plurality of resistors of the same type and the same batch, and place the resistors on a plurality of test connection boards 480;

[0054] Step 2: Place the test connection board 480 on the plurality of isolation layers 470 respectively, and place the test connection board 480 and the isolation layers 470 into the heat preservation space 401 of the corresponding fixture 430;

[0055] Step 3: The main temperature control device adjusts the overall ambient temperature in the constant temperature and humidity chamber 100 according to the test standard;

[0056] Step 4: Multiple temperature adjustment components adjust the temperature of the corresponding insulation space 401 respectively, thereby further adjusting the temperature based on the overall ambient temperature, so that the temperature in the insulation space 401 of the multiple fixtures 430 presents a step-by-step distribution;

[0057] Step 5: Take test readings of all resistors, analyze and obtain a test data fitting curve, and then accurately obtain the measurement results of the resistor product at a specified temperature through the fitting curve.

[0058] In summary, the resistor load current temperature coefficient testing method and testing device 10 of the present invention can more accurately control the actual surface temperature of the resistor product to achieve the specified test temperature, thereby improving the precision and accuracy of the test results.

[0059] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A resistor load current temperature coefficient test device, characterized in that: include: A constant temperature and humidity chamber, a temperature detector and a current measuring and controlling instrument, wherein the constant temperature and humidity chamber is provided with a main body temperature control device and a graded temperature regulating device, the temperature detector is connected to the constant temperature and humidity chamber via a temperature detection line group, and the current measuring and controlling instrument is connected to the graded temperature control device via a sampling line group; The hierarchical temperature control device comprises: a supporting base, an integrated seat and a plurality of fixtures, wherein the plurality of fixtures are evenly distributed on the supporting base, and the plurality of fixtures are respectively connected to the integrated seat through wire tubes; Each of the fixtures includes: a base, an upper cover and an isolation layer. The upper cover is arranged above the base, and an insulation space is formed between the upper cover and the base. The isolation layer is slidably accommodated in the insulation space. A test connection plate is provided on the isolation layer, and the test connection plate is used to place a resistor. A temperature adjustment component is provided inside the base.

2. The resistor load current temperature coefficient test device according to claim 1, characterized in that: Among the multiple fixtures, the temperature adjustment components of some of the fixtures include refrigerators, and the temperatures of the heat preservation spaces of these fixtures are gradually reduced; the temperature adjustment components of another part of the fixtures include heaters, and the temperatures of the heat preservation spaces of these fixtures are gradually increased; the refrigerator or the heater is used to regulate the temperature in the heat preservation space.

3. The resistor load current temperature coefficient test device according to claim 1, characterized in that: The upper cover is provided with a ventilation window, and the ventilation window is communicated with the heat preservation space.

4. The resistor load current temperature coefficient test device according to claim 3, characterized in that: The upper cover is provided with a filter plate, the filter plate cover is arranged at the ventilation window, and the filter plate is used to prevent dust from falling onto the test connection board and its resistor.

5. The resistor load current temperature coefficient test device according to claim 1, characterized in that: The base is provided with a plurality of heat-conducting holes, and the partition is a hollow structure to promote temperature exchange between the test connection plate on the partition and the gas in the heat-insulating space; the partition is provided with a positioning groove for placing the test connection plate.

6. The resistor load current temperature coefficient test device according to claim 1, characterized in that: A controller is provided in the integrated seat, and the controller is electrically connected to the sampling line group and the temperature detection line group; The temperature detection line group includes an in-box temperature detection line and a product temperature test line. A temperature probe is provided on the integrated seat. The in-box temperature detection line is connected to the temperature probe for testing the ambient temperature in the constant temperature and humidity chamber; the product temperature test line is connected to the temperature sensing probe on each test connection board for testing the surface temperature of the resistor.

7. The resistor load current temperature coefficient test device according to claim 6, characterized in that: The test connection board is provided with a current output line and a voltage collection line, and the current output line, the voltage collection line and the product temperature test line are all passed through the wire tube.

8. A method for testing a resistor load current temperature coefficient, implemented based on the resistor load current temperature coefficient testing device according to any one of claims 1 to 7, comprising the following steps: Step 1, obtaining a plurality of resistors of the same type and the same batch, and placing the resistors on a plurality of the test connection boards; Step 2, placing the test connection board on a plurality of the isolation layers respectively, and accommodating the test connection board and the isolation layers into the corresponding heat preservation spaces; Step 3, the main body temperature control device adjusts the temperature in the constant temperature and humidity chamber; Step 4, the plurality of temperature regulating components respectively adjust the temperatures of the plurality of corresponding heat preservation spaces; Step 5: Take test readings and analyze the test results.

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