Testing device, system and method for discrete semiconductor device

Abstract

The invention discloses a testing device, system and method for a discrete semiconductor device, and relates to the field of testing, the testing device comprises an acceleration test board, the acceleration test board is provided with a plurality of installation parts, and a plurality of devices to be tested are detachably installed on the installation parts in a one-to-one correspondence manner; the material testing assembly is used for detecting a first material parameter before an accelerated environment test is performed on each to-be-tested device on the accelerated test board and a second material parameter after the accelerated environment test is performed on each to-be-tested device on the accelerated test board based on a material testing instruction; comprising a box body and is used for adjusting the temperature in the box body according to a received acceleration environment test instruction when the acceleration test board is placed in the box body so as to carry out the acceleration environment test on a to-be-tested device fixed on the acceleration test board. The acceleration test board can be repeatedly used, is suitable for various test materials, improves the universality, can achieve the batch test of the to-be-tested device, and is low in cost.

Description

Technical Field

[0001] The present application relates to the field of testing, and in particular to a testing device, system, and method for discrete semiconductor devices. Background Art

[0002] At present, the existing technology for environmental testing of discrete semiconductor devices is generally completed through a dedicated environmental test chamber and its corresponding accelerated test board, or a self-developed environmental accelerated test board is used to perform environmental testing on the device after welding. In the two solutions, the dedicated environmental test chamber is expensive, while the developed welding accelerated test board is cheap, but it can only test fixed materials and has a limited scope of use.

[0003] Therefore, how to provide a solution to the above technical problems is a problem that those skilled in the art need to solve at present. Summary of the invention

[0004] The purpose of the present application is to provide a testing device, system and method for semiconductor discrete devices, which relates to the field of testing. The accelerated test board can be reused, is applicable to a variety of test materials, has improved versatility, and can realize batch testing of devices to be tested at a low cost.

[0005] In order to solve the above technical problems, the present application provides a test device for a semiconductor discrete device, comprising:

[0006] An accelerated test board, wherein a plurality of mounting parts are provided on the accelerated test board, and a plurality of devices to be tested are detachably mounted on the plurality of mounting parts in a one-to-one correspondence;

[0007] A material testing component, used for detecting a first material parameter before an accelerated environmental test and a second material parameter after the accelerated environmental test of each device under test on the accelerated test board based on a material testing instruction, and obtaining test result data of the device under test based on the first material parameter and the second material parameter of each device under test;

[0008] The environmental test box includes a box body, which is used to adjust the temperature in the box body according to the received accelerated environmental test instruction when the accelerated test board is placed in the box body, so as to perform the accelerated environmental test on the device to be tested fixed on the accelerated test board.

[0009] Optionally, the accelerated test board includes a selection component, and the selection component is used to select a target device under test from all the devices under test on the accelerated test board, so that the target device under test is connected to the material testing component;

[0010] The material testing component is used to obtain the first material parameter of the target device under test before the accelerated environmental test and the second material parameter after the accelerated environmental test, and obtain the test result data of the target device under test based on the first material parameter and the second material parameter of each target device under test.

[0011] Optionally, the selection component includes multiple first switches, one end of the first switch is connected to the material testing component, and the other end of the first switch is connected to one of the devices under test, and the multiple first switches are used to respond to the first material testing instructions they receive and perform a disconnection action or a conduction action so that the target device under test corresponding to the first material testing instruction is connected to the material testing component.

[0012] Optionally, the selection component includes a lead cap arranged corresponding to each of the mounting portions, and when the lead cap is in a first position, the device to be tested mounted on the corresponding mounting portion is electrically connected to the material testing component as a target device to be tested, and when the lead cap is in a second position, the device to be tested mounted on the corresponding mounting portion is not electrically connected to the material testing component.

[0013] Optionally, the testing device includes a plurality of fixing components, each of which is used to fix the device under test on the mounting portion.

[0014] Optionally, the fixing assembly includes a clamp-type connector.

[0015] Optionally, the testing device further comprises a protection circuit arranged corresponding to each of the mounting parts, for configuring electrical stress conditions according to configuration instructions, so that the environmental testing chamber performs the accelerated environmental test on the device under test under the electrical stress conditions.

[0016] Optionally, the protection circuit includes a resistance unit and / or a capacitance unit and / or an inductance unit electrically connected to the mounting portion, the resistance unit includes at least one resistance element, the capacitance unit includes at least one capacitance element, and the inductance unit includes at least one inductance element.

[0017] Optionally, the protection circuit further includes a first switch component connected to the resistance unit and / or a second switch component connected to the capacitance unit and / or a third switch component connected to the inductance unit, wherein:

[0018] The first switch assembly is used to select the resistor element electrically connected to the mounting portion according to the configuration instruction;

[0019] The second switch assembly is used to select the capacitive element electrically connected to the mounting portion according to the configuration instruction;

[0020] The third switch component is used to select the capacitive element electrically connected to the mounting portion according to the configuration instruction.

[0021] Optionally, the mounting portion of the test device includes a plurality of power supply terminals connected to a plurality of pins of the device under test in a one-to-one correspondence, and the power supply terminals of the same pins are connected to each other;

[0022] The testing device also includes a power supply circuit, and multiple output terminals of the power supply circuit are connected one-to-one with multiple power supply terminals, and are used to respond to the received second material testing instruction and supply power to the power supply terminals connected thereto through the corresponding output terminals.

[0023] Optionally, the device under test is a three-pin packaged diode.

[0024] In order to solve the above technical problems, the present application also provides a test system for discrete semiconductor devices, comprising:

[0025] The host computer is used to output material test instructions and accelerated environmental test instructions;

[0026] The testing device as described in any one of the above items is used to test the device to be tested in response to the material testing instruction and the accelerated environmental testing instruction.

[0027] In order to solve the above technical problems, the present application also provides a method for testing a semiconductor discrete device, comprising:

[0028] The material testing component detects the first material parameter of each device under test on the accelerated test board before the accelerated environmental test and the second material parameter after the accelerated environmental test based on the material testing instruction, and obtains the test result data of the device under test based on the first material parameter and the second material parameter of each device under test; the accelerated test board is provided with a plurality of mounting parts, and a plurality of devices under test are detachably mounted on the plurality of mounting parts in a one-to-one correspondence;

[0029] The accelerated test board is placed in a box of the environmental test box through an environmental test box, and the temperature in the box is adjusted according to the received accelerated environmental test instruction to perform the accelerated environmental test on the device to be tested fixed on the accelerated test board.

[0030] Optionally, the testing method further includes:

[0031] Selecting a target device under test from among the devices under test on the accelerated test board by a selection component, so that the target device under test is connected to the material testing component;

[0032] The process of detecting the first material parameter before the accelerated environmental test and the second material parameter after the accelerated environmental test of each device under test on the accelerated test board by the material testing component based on the material testing instruction includes:

[0033] The first material parameter of the target device under test before the accelerated environmental test and the second material parameter of the target device under test after the accelerated environmental test are obtained through the material testing component.

[0034] Optionally, the testing method further includes:

[0035] configuring electrical stress conditions according to configuration instructions through protection circuits;

[0036] The process of performing the accelerated environmental test on the device to be tested fixed on the accelerated test board includes:

[0037] The accelerated environmental test is performed on the device under test fixed on the accelerated test board under the electrical stress condition.

[0038] The present application provides a test device for semiconductor discrete devices, in which each device to be tested is detachably connected to an accelerated test board, and the accelerated test board is reusable and applicable to a variety of test materials, thereby improving versatility and realizing batch testing of the devices to be tested. The accelerated test board and the temperature chamber are decoupled, and can be used with a low-cost temperature chamber for accelerated testing, which is low-cost compared to a custom-developed accelerated test environment chamber. The present application also provides a test system and method for semiconductor discrete devices, which have the same beneficial effects as the above-mentioned test device. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0040] Figure 1 A schematic diagram of the structure of a semiconductor discrete device testing device provided in the present application;

[0041] Figure 2 This is a schematic structural diagram of an accelerated test board provided in this application. DETAILED DESCRIPTION

[0042] The core of this application is to provide a testing device, system, and method for semiconductor discrete devices, which relates to the testing field. The accelerated test board can be reused, is applicable to a variety of test materials, improves versatility, and can realize batch testing of devices to be tested at low cost.

[0043] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0044] In a first aspect, the present application provides a test device for a discrete semiconductor device, the test device comprising:

[0045] An accelerated test board 1, on which a plurality of mounting parts are provided, and a plurality of devices to be tested are detachably and one-to-one mounted on the plurality of mounting parts;

[0046] The material testing component 2 is used to detect the first material parameter of each device under test on the accelerated test board 1 before the accelerated environmental test and the second material parameter after the accelerated environmental test based on the material testing instruction, and obtain the test result data of the device under test based on the first material parameter and the second material parameter of each device under test;

[0047] The environmental test box 3 includes a box body, which is used to adjust the temperature in the box body according to the received accelerated environmental test instruction when the accelerated test board 1 is placed in the box body, so as to perform an accelerated environmental test on the device to be tested fixed on the accelerated test board 1.

[0048] It can be understood that the accelerated test for discrete semiconductor devices is mainly divided into two parts, one is the test of material parameters, and the other is the accelerated environmental test of materials. First, the device to be tested is mounted on the accelerated test board 1. The accelerated test board 1 is provided with multiple mounting parts, and each device to be tested is correspondingly mounted on a mounting part. It can be understood that the device to be tested and the mounting part are detachably connected to facilitate replacement of the test material of the accelerated test board 1. After loading, the accelerated test board 1 is set to the test mode, and the material test assembly 2 is connected to the accelerated test board 1. The first material parameters of each device to be tested at room temperature are tested in batches, that is, the material parameters before the accelerated environmental test are performed. The material test assembly 2 is a semiconductor test parameter instrument. Then configure the accelerated test board 1 to the accelerated test mode, and transfer the accelerated test board 1 to the environmental test box 3. The environmental test box 3 can specifically select an ambient temperature box on the market. After the accelerated test board 1 is powered on, an accelerated test is performed on each device to be tested. After the accelerated test is completed, the accelerated test board 1 is taken out of the box and configured to the test mode. The second material parameter after the accelerated test is measured again. The test result data of each device to be tested can be determined based on the first material parameter and the second material parameter, and the relevant data is recorded for subsequent analysis.

[0049] It can be seen that in this embodiment, each device under test is detachably connected to the accelerated test board 1, and the accelerated test board 1 is reusable and applicable to a variety of test materials, thereby improving versatility and realizing batch testing of the devices under test. The accelerated test board 1 is decoupled from the temperature chamber, and can be used with a low-cost temperature chamber for accelerated testing, which is low-cost compared to a custom-developed accelerated test environment chamber.

[0050] Based on the above embodiments:

[0051] In an exemplary embodiment, the accelerated test board 1 includes a selection component, which is used to select a target device under test from all devices under test on the accelerated test board 1, so that the target device under test is connected to the material testing component 2;

[0052] The material testing component 2 is used to obtain the first material parameter of the target device under test before the accelerated environmental test and the second material parameter after the accelerated environmental test, and obtain the test result data of the target device under test based on the first material parameter and the second material parameter of each target device under test.

[0053] In this embodiment, a selection component is provided on the accelerated test board 1, and any device to be tested on the accelerated test board 1 can be selected through the selection component and tested individually without repeatedly removing and loading the device, which greatly reduces the possibility of the material being damaged by external forces such as static electricity during the transfer process and improves the test efficiency.

[0054] In an exemplary embodiment, the selection component includes multiple first switches, one end of the first switch is connected to the material testing component 2, and the other end of the first switch is connected to a device under test, and the multiple first switches are used to respond to the first material testing instructions they receive and perform a disconnection action or a conduction action to connect the target device under test corresponding to the first material testing instruction to the material testing component 2.

[0055] In this embodiment, the selection component can be implemented by multiple first switches. By controlling the conduction or disconnection of the first switch, the device under test connected to the first switch is connected to or disconnected from the material testing component 2. It can be understood that the first material test instructions received by different first switches may be different. The first material test instruction received by the first switch corresponding to the target device under test is used to control the closing of the first switch, and the first material test instruction received by the first switch connected to other devices under test other than the target device under test is used to control the disconnection of the first switch.

[0056] In an exemplary embodiment, the selection component includes a lead cap arranged corresponding to each mounting portion. When the lead cap is in a first position, the device to be tested mounted on the corresponding mounting portion is electrically connected to the material testing component 2 as a target device to be tested. When the lead cap is in a second position, the device to be tested mounted on the corresponding mounting portion is not electrically connected to the material testing component 2.

[0057] In this embodiment, the selection of components can be achieved through lead caps, and by adjusting the position of the lead caps, it is adjusted whether the corresponding device under test is electrically connected to the material testing component 2, thereby achieving the selection of the target device under test, greatly improving the test efficiency and reducing the impact of the loading and unloading operation on the device.

[0058] In an exemplary embodiment, the testing device includes a plurality of fixing components, each of which is used to fix the device under test on the mounting portion.

[0059] In an exemplary embodiment, the securing assembly includes a clamp-type connector.

[0060] In this embodiment, the fixing component includes a clamp-type connector, which can be switched at any time, so as to monitor the status of the device under test at any time without affecting the device under test. The accelerated test card can be reused, and the test / test material can be changed according to the material situation, so as to realize large-scale accelerated testing.

[0061] In an exemplary embodiment, the testing device further includes a protection circuit 11 disposed corresponding to each mounting portion, for configuring electrical stress conditions according to configuration instructions, so that the environmental test chamber 3 performs accelerated environmental testing on the device under test under electrical stress conditions.

[0062] In an exemplary embodiment, the protection circuit 11 includes a resistance unit and / or a capacitance unit and / or an inductance unit electrically connected to the mounting portion, the resistance unit includes at least one resistance element, the capacitance unit includes at least one capacitance element, and the inductance unit includes at least one inductance element.

[0063] In an exemplary embodiment, the protection circuit 11 further includes a first switch component connected to the resistance unit and / or a second switch component connected to the capacitance unit and / or a third switch component connected to the inductance unit, wherein:

[0064] a first switch assembly, for selecting a resistance element electrically connected to the mounting portion according to a configuration instruction;

[0065] a second switch assembly, for selecting a capacitive element electrically connected to the mounting portion according to the configuration instruction;

[0066] The third switch component is used to select a capacitor element electrically connected to the mounting portion according to the configuration instruction.

[0067] In this embodiment, refer to Figure 2 As shown, the accelerated test board 1 is also provided with a protection circuit 11, and is provided with freely installable materials such as resistors, capacitors, and inductors. The above materials are plugged into the accelerated test board 1, and the electrical stress conditions can be freely configured according to environmental conditions. The materials can be accelerated tested under restricted conditions during the accelerated test to protect the test materials from damage.

[0068] In an exemplary embodiment, the mounting portion of the test device includes a plurality of power terminals connected to a plurality of pins of the device under test in a one-to-one correspondence, and the power terminals of the same pins are connected to each other;

[0069] The testing device also includes a power supply circuit, and multiple output terminals of the power supply circuit are connected one-to-one with multiple power supply terminals, and are used to respond to the received second material testing instruction and supply power to the power supply terminals connected thereto through the corresponding output terminals.

[0070] In an exemplary embodiment, the device under test is a diode in a three-pin package.

[0071] The accelerated test board 1 in this embodiment can be directly connected to the power supply circuit. During the accelerated test, it is necessary to configure environmental stress and load appropriate electrical stress conditions. In this embodiment, the power supplies of each port are connected to the same port, and the port can be directly connected to the external power supply circuit. During the test, the accelerated test of loading electrical stress can be performed on the device under test synchronously, which can greatly increase the test efficiency. At the same time, by controlling the output end of the power supply circuit, the output supply voltage of any output end is controlled, thereby realizing the test of different pins of the device under test. In particular, for some materials such as three-pin packaged diodes, the parameters of different diodes in the material containing two diodes can be measured to achieve efficient testing.

[0072] In summary, the present application can freely configure the test materials by configuring relays, bypass resistors, jumper caps and other devices, the test equipment can be reused, and the direction and pins of the material to be tested can be dynamically changed through different connection circuits to meet the needs of batch and rapid testing; the circuit settings of the material can be freely modified according to the designed electrical stress conditions, and the electrical stress can be changed to meet a variety of different electrical stress requirements; it can meet the testing needs of semiconductor discrete devices, and a series of accelerated test device kits can be developed according to different packages to meet the batch application testing and test requirements of a large number of semiconductor discrete devices; the present application integrates the test and testing circuits in the same device, which greatly reduces the possibility of the material being damaged by static electricity and other external forces during the transfer process, and greatly improves the test efficiency; the accelerated test board 1 is decoupled from the environmental test chamber 3, and can be used with most environmental test chambers 3 on the market. Compared with the customized accelerated test environmental chamber, it can greatly reduce the cost of test equipment.

[0073] In a second aspect, the present application also provides a test system for a semiconductor discrete device, comprising:

[0074] The host computer is used to output material test instructions and accelerated environmental test instructions;

[0075] The testing device as described in any of the above embodiments is used to test the device to be tested in response to the material testing instruction and the accelerated environmental testing instruction.

[0076] For an introduction to a semiconductor discrete device testing system provided in the present application, please refer to the above-mentioned embodiments, and the present application will not go into details here.

[0077] A semiconductor discrete device testing system provided in the present application has the same beneficial effects as the above-mentioned semiconductor discrete device testing method.

[0078] In a third aspect, the present application also provides a method for testing a discrete semiconductor device, comprising:

[0079] The material testing component detects the first material parameter of each device under test on the accelerated test board before the accelerated environmental test and the second material parameter after the accelerated environmental test based on the material testing instruction, and obtains the test result data of the device under test based on the first material parameter and the second material parameter of each device under test; the accelerated test board is provided with a plurality of mounting parts, and the plurality of devices under test are detachably and one-to-one mounted on the plurality of mounting parts;

[0080] The accelerated test board is placed in the box of the environmental test box, and the temperature in the box is adjusted according to the received accelerated environmental test instruction to perform an accelerated environmental test on the device to be tested fixed on the accelerated test board.

[0081] In an exemplary embodiment, the testing method further comprises:

[0082] Selecting a target device under test from all devices under test on the accelerated test board by selecting a component, so that the target device under test is connected to the material test component;

[0083] The process of testing the first material parameter before the accelerated environmental test and the second material parameter after the accelerated environmental test of each device under test on the accelerated test board based on the material test instruction by the material test component includes:

[0084] The first material parameter of the target device under test before the accelerated environmental test and the second material parameter of the target device under test after the accelerated environmental test are obtained through the material testing component.

[0085] In an exemplary embodiment, the testing method further comprises:

[0086] configuring electrical stress conditions according to configuration instructions through protection circuits;

[0087] The process of performing an accelerated environmental test on a device under test fixed on an accelerated test board includes:

[0088] The accelerated environmental test is performed on the device under test fixed on the accelerated test board under electrical stress conditions.

[0089] For an introduction to a semiconductor discrete device testing method provided in the present application, please refer to the above-mentioned embodiment, and the present application will not go into details here.

[0090] A method for testing a discrete semiconductor device provided in the present application has the same beneficial effects as the above-mentioned method for testing a discrete semiconductor device.

[0091] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0092] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A test device for a semiconductor discrete device, characterized in that: include: An accelerated test board, wherein a plurality of mounting parts are provided on the accelerated test board, and a plurality of devices to be tested are detachably mounted on the plurality of mounting parts in a one-to-one correspondence; A material testing component, used for detecting a first material parameter before an accelerated environmental test and a second material parameter after the accelerated environmental test of each device under test on the accelerated test board based on a material testing instruction, and obtaining test result data of the device under test based on the first material parameter and the second material parameter of each device under test; The environmental test box includes a box body, which is used to adjust the temperature in the box body according to the received accelerated environmental test instruction when the accelerated test board is placed in the box body, so as to perform the accelerated environmental test on the device to be tested fixed on the accelerated test board.

2. The testing device according to claim 1, characterized in that: The accelerated test board includes a selection component, and the selection component is used to select a target device under test from among all the devices under test on the accelerated test board, so that the target device under test is connected to the material testing component; The material testing component is used to obtain the first material parameter of the target device under test before the accelerated environmental test and the second material parameter after the accelerated environmental test, and obtain the test result data of the target device under test based on the first material parameter and the second material parameter of each target device under test.

3. The testing device according to claim 2, characterized in that: The selection component includes multiple first switches, one end of the first switch is connected to the material testing component, and the other end of the first switch is connected to one of the devices under test, and the multiple first switches are used to respond to the first material testing instructions they receive and perform a disconnection action or a conduction action, so that the target device under test corresponding to the first material testing instruction is connected to the material testing component.

4. The testing device according to claim 2, characterized in that: The selection component includes a lead cap arranged corresponding to each of the mounting parts. When the lead cap is in a first position, the device under test mounted on the corresponding mounting part is electrically connected to the material testing component as a target device under test. When the lead cap is in a second position, the device under test mounted on the corresponding mounting part is not electrically connected to the material testing component.

5. The testing device according to claim 1, characterized in that: The testing device comprises a plurality of fixing components, each of which is used to fix the device under test on the mounting portion.

6. The testing device according to claim 5, characterized in that: The fixing assembly includes a clamp-type connector.

7. The testing device according to claim 1, characterized in that: The testing device further comprises a protection circuit corresponding to each of the mounting parts, which is used to configure electrical stress conditions according to configuration instructions so that the environmental test box performs the accelerated environmental test on the device under test under the electrical stress conditions.

8. The testing device according to claim 7, characterized in that: The protection circuit includes a resistance unit and / or a capacitance unit and / or an inductance unit electrically connected to the mounting portion, the resistance unit includes at least one resistance element, the capacitance unit includes at least one capacitance element, and the inductance unit includes at least one inductance element.

9. The testing device according to claim 8, characterized in that: The protection circuit further comprises a first switch component connected to the resistance unit and / or a second switch component connected to the capacitance unit and / or a third switch component connected to the inductance unit, wherein: The first switch assembly is used to select the resistor element electrically connected to the mounting portion according to the configuration instruction; The second switch assembly is used to select the capacitive element electrically connected to the mounting portion according to the configuration instruction; The third switch component is used to select the capacitive element electrically connected to the mounting portion according to the configuration instruction.

10. The testing device according to any one of claims 1 to 9, characterized in that: The mounting portion of the test device comprises a plurality of power supply terminals connected to a plurality of pins of the device under test in a one-to-one correspondence, and the power supply terminals of the same pins are connected to each other; The testing device also includes a power supply circuit, and multiple output terminals of the power supply circuit are connected one-to-one with multiple power supply terminals, and are used to respond to the received second material testing instruction and supply power to the power supply terminals connected thereto through the corresponding output terminals.

11. The testing device according to claim 9, characterized in that: The device under test is a diode in a three-pin package.

12. A semiconductor discrete device testing system, characterized in that: include: The host computer is used to output material test instructions and accelerated environmental test instructions; The testing device according to any one of claims 1 to 11 is used to test the device under test in response to the material testing instruction and the accelerated environmental testing instruction.

13. A method for testing a discrete semiconductor device, characterized in that: include: The material testing component detects the first material parameter of each device under test on the accelerated test board before the accelerated environmental test and the second material parameter after the accelerated environmental test based on the material testing instruction, and obtains the test result data of the device under test based on the first material parameter and the second material parameter of each device under test; the accelerated test board is provided with a plurality of mounting parts, and a plurality of devices under test are detachably mounted on the plurality of mounting parts in a one-to-one correspondence; The accelerated test board is placed in a box of the environmental test box through an environmental test box, and the temperature in the box is adjusted according to the received accelerated environmental test instruction to perform the accelerated environmental test on the device to be tested fixed on the accelerated test board.

14. The method for testing a discrete semiconductor device according to claim 13, characterized in that: The test method also includes: Selecting a target device under test from among the devices under test on the accelerated test board by a selection component, so that the target device under test is connected to the material testing component; The process of detecting the first material parameter before the accelerated environmental test and the second material parameter after the accelerated environmental test of each device under test on the accelerated test board by the material testing component based on the material testing instruction includes: The first material parameter of the target device under test before the accelerated environmental test and the second material parameter of the target device under test after the accelerated environmental test are obtained through the material testing component.

15. The method for testing a discrete semiconductor device according to claim 13, wherein: The test method also includes: configuring electrical stress conditions according to configuration instructions through protection circuits; The process of performing the accelerated environmental test on the device to be tested fixed on the accelerated test board includes: The accelerated environmental test is performed on the device under test fixed on the accelerated test board under the electrical stress condition.

Images