Wafer decoding apparatus and method of use thereof

Abstract

The application provides a wafer decoding device and a use method thereof, which comprise a cabinet, a support, a clamping mechanism, a switching mechanism, a plurality of electrode connecting seats, a cover body and a wind screen mechanism, the cabinet is arranged on the ground, the support is arranged on a side of the cabinet away from the ground, a work position hole is formed in the center of the cabinet, the clamping mechanism is arranged on the support and used for clamping and transferring a wafer, the switching mechanism is arranged in the cabinet and used for selectively switching the electrode connecting seats and making the telescopic end extend into the work position hole, the electrode connecting seat is internally provided with a first inner cavity and a second inner cavity, the cover body is movably sleeved on the outside of the clamping mechanism, the cover body is abutted in the second inner cavity, so that the electrode connecting seat is sealed, and the wind screen mechanism is annularly arranged in the cover body, the device does not need to replace a test card seat, can be adapted to different batches of wafer types for decoding test, makes the decoding process in a closed environment, can cool the wafer electrode and the probe contact surface, and improves the efficiency and stability of wafer decoding.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer decoding production, in particular to a wafer decoding device and a use method thereof. BACKGROUND

[0002] The main function of the wafer decoding device is to decode the digital signal or encoded information on the wafer. The wafer is usually used to store a large amount of data or information, such as program code in integrated circuits, digital images, audio signals, etc. The decoding device reads these encoded information on the wafer and converts it into understandable data format, such as text, image, audio, etc. by using built-in decoding algorithm or logic circuit.

[0003] The wafer test board, wafer test system and wafer test method disclosed in CN113687206B, the body, the system includes a plurality of first through holes, the first through hole communicates both sides of the body; the wafer test area is arranged on one side of the body; and the main signal connector is arranged on the same side of the body, and the main signal connector is used for connecting the wafer test area without passing through the first through hole; wherein, the wafer test area connects the wafer, and at least one main signal test is carried out on the wafer through the main signal connector; the wafer test area includes: a plurality of test points arranged on the first surface a of the wafer test board, the plurality of test points are distributed and arranged around the periphery of the wafer test area; a plurality of test needles are arranged on the second surface b of the wafer test board, and the plurality of test needles are distributed and correspondingly connected with the plurality of test points; wherein, the plurality of first through holes are respectively connected between the plurality of test needles and the plurality of test points.

[0004] Most of the existing wafers are arranged on the workbench during the test decoding process, and the single test socket is in contact with the corresponding wafer for testing. When different batches of wafers are decoded and tested, the test socket needs to be replaced frequently, thereby reducing the test efficiency. In addition, during the test decoding process, a large amount of heat is generated at the contact point between the probe and the wafer electrode, which affects the stability of decoding, thereby reducing the efficiency and stability of wafer decoding. SUMMARY

[0005] Therefore, the present application provides a wafer decoding device and a use method thereof, which can adapt to different batches of wafers for decoding test without replacing the test socket, and can cool the contact surface between the wafer electrode and the probe in a closed environment, thereby improving the efficiency and stability of wafer decoding.

[0006] The technical scheme of the present application is as follows: in the first aspect, the present application provides a wafer decoding device, which comprises a cabinet body, a support, a clamping mechanism, a switching mechanism, a plurality of electrode connecting seats, a cover body and a wind screen mechanism, wherein,

[0007] The cabinet body is arranged on the ground and is hollow inside;

[0008] The support is arranged on the side of the cabinet body away from the ground, and a work station hole is formed in the center of the cabinet body;

[0009] The clamping mechanism is arranged on the support and is used for clamping and transferring the wafer;

[0010] The switching mechanism is arranged in the cabinet body, and the switching mechanism has a plurality of uniformly distributed telescopic ends, and the plurality of telescopic ends can rotate circumferentially;

[0011] A plurality of electrode connecting seats are respectively arranged on the telescopic ends of the switching mechanism, the plurality of telescopic ends rotate circumferentially to selectively switch the electrode connecting seats, and the telescopic ends are telescoped to extend into the work station hole;

[0012] The electrode connecting seat is provided with a first inner cavity and a second inner cavity, the first inner cavity and the second inner cavity are arranged in a spaced manner, the wafer is placed in the matched first inner cavity, a plurality of electrode probe groups are arranged in the first inner cavity, one end of the electrode probe group abuts against the electrode of the wafer, and the other end is connected with an external coding port;

[0013] The cover body is movably sleeved on the outside of the clamping mechanism, and is provided with an opening towards the cabinet body side, the cover body abuts in the second inner cavity, and the electrode connecting seat is sealed;

[0014] The wind screen mechanism is annularly arranged in the cover body and located at the opening of the cover body, the wind screen mechanism has a plurality of annularly and uniformly distributed air holes, and the plurality of air holes blow air to the side of the clamped wafer.

[0015] On the basis of the above technical scheme, preferably, the clamping mechanism comprises a horizontal moving assembly, a pushing assembly, a positioning assembly and an image acquisition assembly, wherein,

[0016] The horizontal moving assembly is arranged on the side of the support away from the cabinet body, and the horizontal moving assembly has a horizontal moving end which can move along a horizontal straight line;

[0017] The pushing assembly is arranged on the horizontal moving end of the horizontal moving assembly, and the pushing assembly has a pushing end which can move linearly towards the cabinet body side;

[0018] The positioning assembly is arranged on the pushing end of the pushing assembly, and the positioning assembly has a plurality of pairs of clamping parts which can move towards each other, and the clamping parts move towards each other to clamp the wafer;

[0019] The image acquisition assembly is arranged at the center of the side of the positioning assembly away from the pushing assembly, and is used for acquiring the picture of the wafer to be grabbed.

[0020] On the basis of the above technical scheme, preferably, the positioning assembly comprises a connecting seat, a driving unit, a cross body, a plurality of pairs of lead screws and a plurality of positioning pieces, wherein,

[0021] The connector is fixed to the pushing end of the pushing component, and the connector is hollow inside;

[0022] The cross body is fixed on the side of the connecting seat away from the pushing component. The cross body has multiple oppositely arranged mounting cavities, and the multiple mounting cavities are evenly distributed in a ring along the axis of the cross body.

[0023] Multiple pairs of lead screws are respectively installed in the mounting cavities that are arranged oppositely, and the lead screws are rotatably connected in the mounting cavities. The two opposite lead screws are on the same straight line and the threads are arranged in opposite directions.

[0024] Multiple positioning components are threaded to the outside of each lead screw, and the positioning components are slidably connected in the mounting cavity. The distance between each positioning component and the axis of the cross body is equal, and the positioning component serves as the clamping part of the positioning assembly.

[0025] The drive unit is located in the connector and between multiple pairs of lead screws. It is used to drive the multiple pairs of lead screws to rotate synchronously, so that multiple positioning elements move towards each other to clamp the wafer.

[0026] Based on the above technical solutions, preferably, the drive unit includes a first electric motor, a main bevel gear, and multiple auxiliary bevel gears, wherein,

[0027] The first motor is fixed inside the connecting seat, and the output shaft of the first motor passes through and extends into the cross body;

[0028] The main bevel gear is fixed on the output shaft of the first motor and is located at the center of the cross body;

[0029] Multiple auxiliary bevel gears are located on the side of each lead screw closest to the main bevel gear, and all of the auxiliary bevel gears mesh with the main bevel gear.

[0030] Based on the above technical solutions, preferably, the pushing component includes a mounting base, a first push rod, and several guide members, wherein,

[0031] The transverse component is a linear movement module. The mounting base is fixed on the transverse end of the transverse component, and the mounting base has several guide holes on the side facing the cabinet.

[0032] The first push rod is fixed on the mounting base;

[0033] Several guide components are disposed in each guide hole and are slidably connected to the inside of the guide hole. One end of the guide component passes through the guide hole and is fixedly connected to the cover.

[0034] The cover body is provided with a sliding hole in the axial direction, the connecting seat has an upper end and a lower end, the movable end of the first push rod is fixedly connected to the upper end of the connecting seat, the upper end of the connecting seat is slidably connected to the sliding hole, the lower end of the connecting seat has a diameter greater than that of the sliding hole, the lower end of the connecting seat is located in the cover body and abuts against the inner wall of the cover body.

[0035] On the basis of the above technical scheme, preferably, the switching mechanism comprises a second motor, a shaft cylinder and a plurality of second push rods, wherein,

[0036] The shaft cylinder is rotationally connected to the inner side of the cabinet body;

[0037] The second motor is arranged on the cabinet body, and the output shaft of the second motor is fixedly connected to the shaft cylinder axis, for driving the shaft cylinder to rotationally move in the circumferential direction;

[0038] The fixed ends of the plurality of second push rods are arranged on the outer side of the shaft cylinder and are uniformly distributed in a ring shape along the shaft cylinder axis; and the plurality of electrode connecting seats are arranged on the movable ends of the plurality of second push rods.

[0039] On the basis of the above technical scheme, preferably, the shaft axis of the work station hole is in the same straight line as the shaft axis of the shaft cylinder, and the outer contour shape of the electrode connecting seat matches the inner contour shape of the work station hole; a plurality of pads are further arranged in the first inner cavity, the wafer is placed on the plurality of pads, a ventilation opening is arranged on the outer side of the first inner cavity and is in communication with the second inner cavity, the cover body abuts against the second inner cavity, and the air hole of the air screen mechanism corresponds to the position of the ventilation opening.

[0040] On the basis of the above technical scheme, preferably, each electrode probe group comprises a probe, an elastic member and a limiting plate, wherein,

[0041] A plurality of insertion holes are arranged on the electrode connecting seat;

[0042] The elastic member is fixed between the electrode connecting seat and the limiting plate, and the position of the elastic member corresponds to the position of the insertion hole;

[0043] The probe is fixed at the shaft axis of the limiting plate, one end of the probe penetrates the elastic member and the insertion hole in sequence and extends into the first inner cavity, and the height of the probe extending into the first inner cavity is greater than the height of the pad.

[0044] On the basis of the above technical scheme, preferably, the device further comprises a feeding transmission belt, a plurality of material loading plates and a discharging transmission belt, wherein,

[0045] The feeding transmission belt and the discharging transmission belt are arranged on the two sides of the cabinet body, and the transmission directions of the feeding transmission belt and the discharging transmission belt are the same as the moving direction of the horizontal moving assembly, and the feeding transmission belt and the discharging transmission belt are both caterpillar belts;

[0046] The plurality of carrier trays are arranged on the shaft connecting the feeding conveying belt and the discharging conveying belt, and are arranged at intervals, and the carrier trays are arranged with the wafers to be decoded, and the central axis of the carrier tray is in the same line with the central axis of the transverse moving end;

[0047] The transverse moving ends of the transverse moving assembly move across the feeding conveying belt and the discharging conveying belt, and the transverse moving assembly has two transverse moving ends which move synchronously, and each of the transverse moving ends is arranged with a clamping mechanism, the position of one clamping mechanism corresponds to the position of the electrode connecting seat, and the position of the other clamping mechanism corresponds to the position of the carrier tray at the end of the feeding conveying belt, and the distance from the output end surface of the feeding conveying belt and the input end surface of the discharging conveying belt to the central position of the electrode connecting seat is equal.

[0048] In the second aspect, the application further provides a wafer decoding device and a wafer decoding method.

[0049] S1, the feeding conveying belt drives the carrier tray to move towards the cabinet side, and stops when moving to the rightmost end, and the transverse moving assembly drives the two transverse moving ends to move to the leftmost side, the clamping mechanism is located at the position corresponding to the carrier tray at the rightmost end, and the image acquisition assembly identifies the type of the wafer to be decoded and obtains the corresponding clamping parameter information;

[0050] S2, according to the clamping parameter information, the first motor and the second motor are respectively driven to operate, the first motor drives a plurality of pairs of screw rods to rotate synchronously, so that a plurality of positioning members move towards each other to clamp the wafer to be decoded, the second motor drives the shaft cylinder to rotate, so that the electrode connecting seat corresponding to the wafer to be decoded rotates to correspond to the work position hole, and the second push rod pushes the electrode connecting seat corresponding to the wafer to be decoded to extend out of the work position hole;

[0051] S3, the transverse moving assembly drives the two transverse moving ends to move to the rightmost side, and moves the clamped wafer to be decoded downwards to be placed on the cushion block in the first inner cavity, and after placement, the two transverse moving ends of the transverse moving assembly are driven to move to the leftmost side, at this time, the clamping mechanism on the left side clamps the wafer to be decoded in the carrier tray below, and the clamping mechanism on the right side positions and clamps the wafer to be decoded in the first inner cavity, the electrode of the wafer to be decoded abuts against the electrode probe group, so that the decoding circuit is connected to decode the wafer to be decoded;

[0052] S4, the cover body moves downwards with the clamping mechanism and abuts against the second inner cavity to form a sealed space with the electrode connecting seat, the air holes of the air screen mechanism blow air into the first inner cavity along the air vents to cool the bottom of the wafer, and the air screen mechanism on the other clamping mechanism blows air to the opening side of the cover body to form a screen resistance to prevent dust from adhering to the surface of the wafer;

[0053] S5, after the wafer to be decoded in the first inner cavity is decoded, the horizontal movement assembly drives the two horizontal movement ends to move to the rightmost side, and places the decoded wafer on the leftmost wafer carrier disc on the discharge conveying belt, and places the wafer to be decoded grabbed on the right into the first inner cavity, and repeats steps S3-S5 to complete the decoding of the wafer.

[0054] The wafer decoding device and the use method thereof have the following beneficial effects relative to the prior art:

[0055] (1) The matching electrode connecting seat is flexibly selected through the switching mechanism to adapt to different wafers, and then the matching electrode connecting seat is quickly adjusted according to different batches of wafers, the time and manpower required for replacing the electrode connecting seat are reduced, the efficiency of wafer decoding is improved, the accurate positioning and transfer of the clamping mechanism are combined to ensure the accurate alignment and electrical connection of the wafer and the electrode probe group, the cooperation of the cover body and the wind screen mechanism forms a closed and stable environment, external interference and dust adhesion are effectively reduced, the decoding accuracy and reliability are improved, and therefore the production efficiency and decoding quality are significantly improved;

[0056] (2) The synchronous rotation of the multiple pairs of first lead screws is realized through the driving unit, so that the wafer is clamped from four different directions at the same time in the clamping process, accurate positioning of the wafer is realized, the stability and accuracy of the clamping process are improved, and the complexity and maintenance cost of the transmission system are also reduced;

[0057] (3) The cover body is movably sleeved outside the positioning assembly, can realize clamping and fixing of wafers placed at different height positions of different types of electrode connecting seats, and also reduces the error risk in the operation process;

[0058] (4) The elastic member has elasticity and buffering effect, can cope with the impact and vibration of the probe when contacting the wafer electrode point, is beneficial to protecting the probe and the electrode point on the wafer from being damaged, improves the service life of the equipment, and since the electrodes on the wafer have different heights, the elastic member can make the probe always closely fit the electrodes of the wafer, and cooperate with the clamping mechanism to make the wafer be at the same height position, thereby improving the testing accuracy and reliability;

[0059] (5) The coordinated work of the feeding conveying belt, the horizontal movement assembly, the clamping mechanism thereof, and the discharge conveying belt realizes automatic feeding, clamping, processing and discharge of the wafer, and greatly improves the work efficiency of wafer decoding. BRIEF DESCRIPTION OF DRAWINGS

[0060] In order to make the technical solutions in the embodiments of the present application or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only aim to explain some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative effort.

[0061] Figure 1 A perspective view of the wafer decoding device of the present application;

[0062] Figure 2 A front view of the wafer decoding device of the present application;

[0063] Figure 3 A side sectional view of the wafer decoding device of the present application;

[0064] Figure 4 A schematic view of the clamping mechanism and the cover connection structure of the wafer decoding device of the present application;

[0065] Figure 5 A sectional view of the electrode connecting seat structure of the wafer decoding device of the present application;

[0066] Figure 6 A sectional view of the cover and the electrode connecting seat structure connection of the wafer decoding device of the present application;

[0067] Figure 7 A perspective view of the positioning assembly of the wafer decoding device of the present application;

[0068] Figure 8 A schematic view of the driving unit structure of the wafer decoding device of the present application. DETAILED DESCRIPTION

[0069] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of the present application.

[0070] In a first aspect, as Figures 1-8As shown, the wafer decoding device provided by the present application comprises a cabinet 1, a support 2, a clamping mechanism 3, a switching mechanism 4, a plurality of electrode connecting seats 5, a cover body 6 and a wind screen mechanism 7, wherein the cabinet 1 is arranged on the ground and is hollow inside; the support 2 is arranged on the side of the cabinet 1 away from the ground, and a work position hole 100 is formed in the center of the cabinet 1; the clamping mechanism 3 is arranged on the support 2 and is used for clamping and transferring the wafer; the switching mechanism 4 is arranged in the cabinet 1 and has a plurality of uniformly distributed telescopic ends, and the plurality of telescopic ends can rotate circumferentially; the plurality of electrode connecting seats 5 are respectively arranged on the telescopic ends of the switching mechanism 4, the electrode connecting seats 5 are selectively switched by the circumferential rotation of the telescopic ends, and the telescopic ends are telescopically extended into the work position hole 100; the electrode connecting seat 5 is provided with a first inner cavity 500 and a second inner cavity 510, the first inner cavity 500 and the second inner cavity 510 are arranged in a spaced manner, the wafer is placed in the matched first inner cavity 500, a plurality of electrode probe groups 501 are arranged in the first inner cavity 500, one end of the electrode probe group 501 abuts against the electrode of the wafer, and the other end is connected with an external coding port; the cover body 6 is movably sleeved outside the clamping mechanism 3 and is provided with an opening towards the cabinet 1, the cover body 6 abuts against the second inner cavity 510 to make the electrode connecting seat 5 airtight; and the wind screen mechanism 7 is annularly arranged in the cover body 6 and is located at the opening of the cover body 6, the wind screen mechanism 7 has a plurality of annularly and uniformly distributed air holes, and the air holes blow air to the side of the clamped wafer.

[0071] It should be noted that the switching mechanism 4 switches the corresponding matched electrode connecting seat 5 according to the wafer to be decoded, and the matched electrode connecting seat 5 is telescopically extended into the work position hole 100 through the telescopic end of the switching mechanism 4, so as to selectively switch different electrode connecting seats 5, so that the device can flexibly adapt to different types of wafers and decoding requirements, improve the production efficiency, clamp the wafer to be decoded through the clamping mechanism 3 and transfer it to the first inner cavity 500 for positioning and clamping, so as to ensure that the electrode of the wafer is aligned with the electrode probe group 501 in the electrode connecting seat 5, make the electrode probe group 501 abut against the electrode of the wafer, form an electrical connection, the other end is connected with an external coding port, read the coding information on the wafer to realize the decoding operation, and ensure the accuracy of wafer decoding. In the moving process of the clamping mechanism 3, the cover body 6 cooperates with the second inner cavity 510 of the electrode connecting seat 5 to form an airtight environment, reduce external interference, avoid affecting the wafer decoding process, at the same time, the wind screen mechanism 7 can further control the temperature and humidity in the cover body 6 by blowing air, provide a more stable and reliable environment for wafer decoding, improve the reliability of decoding, and in the clamping and transferring process, the wind screen mechanism 7 can form a wind screen at the opening of the cover body 6 by blowing air to prevent dust in the outside world from adhering to the surface of the wafer.

[0072] It can be understood that the wind screen mechanism 7 is a ring-shaped air pipe, and an outer connecting pipe connected in communication is fixed to the outer side of the ring-shaped air pipe, and the outer connecting pipe is connected in communication with an air outlet of an external air cooling device, and is used for blowing air into the ring-shaped air pipe.

[0073] According to the embodiment, the matched electrode connecting seat 5 is flexibly selected by the switching mechanism 4 to adapt to different wafers, combined with the accurate positioning and transfer of the clamping mechanism 3, the accurate alignment and electrical connection of the wafer and the electrode probe group 501 are ensured, and the cooperation of the cover body 6 and the wind screen mechanism 7 forms a closed and stable environment, effectively reduces the external interference and dust adhesion, improves the accuracy and reliability of decoding, and significantly improves the production efficiency and decoding quality.

[0074] The clamping mechanism 3 in the embodiment includes a horizontal moving assembly 31, a pushing assembly 32, a positioning assembly 33 and an image acquisition assembly 34, wherein the horizontal moving assembly 31 is arranged on the side of the support 2 away from the cabinet body 1, and the horizontal moving assembly 31 has a horizontal moving end movable along a horizontal straight line; the pushing assembly 32 is arranged on the horizontal moving end of the horizontal moving assembly 31, and the pushing assembly 32 has a pushing end movable linearly towards the cabinet body 1; the positioning assembly 33 is arranged on the pushing end of the pushing assembly 32, and the positioning assembly 33 has a plurality of pairs of clamping portions movable towards each other, and the clamping portions move towards each other to clamp the wafer; and the image acquisition assembly 34 is arranged at the center of the side of the positioning assembly 33 away from the pushing assembly 32, and is used for acquiring the picture of the wafer to be grabbed.

[0075] It should be noted that the horizontal straight line movement of the horizontal moving assembly 31 and the linear pushing of the pushing assembly 32 realize the accurate positioning and transfer of the wafer in a two-dimensional plane; the plurality of pairs of clamping portions of the positioning assembly 33 can move towards each other to accurately clamp the wafer, and ensure the stability of the wafer during the transfer process; at the same time, the image acquisition assembly 34 is an industrial camera, which can acquire the picture of the wafer to be grabbed in real time, and provide accurate visual feedback for the clamping mechanism, and further improve the accuracy of clamping.

[0076] As a preferred embodiment, the positioning assembly 33 in the embodiment comprises a connecting seat 331, a driving unit 332, a cross body 333, a plurality of pairs of lead screws 334 and a plurality of positioning members 335, wherein the connecting seat 331 is fixed on the pushing end of the pushing assembly 32 and is internally hollow; the cross body 333 is fixed on the side of the connecting seat 331 away from the pushing assembly 32, a plurality of oppositely arranged mounting cavities 3330 are formed in the cross body 333, and the mounting cavities 3330 are evenly distributed in a ring shape along the axis of the cross body 333; the plurality of pairs of lead screws 334 are arranged in the oppositely arranged mounting cavities 3330, and the lead screws 334 are rotationally connected in the mounting cavities 3330, and the opposite two lead screws 334 are in the same straight line and are oppositely threaded; the plurality of positioning members 335 are threadedly connected to the outside of the lead screws 334, and the positioning members 335 are slidingly connected in the mounting cavities 3330, the distance from each positioning member 335 to the axis of the cross body 333 is equal, and the positioning member 335 serves as a clamping part of the positioning assembly 33; the driving unit 332 is arranged in the connecting seat 331 and between the plurality of pairs of lead screws 334, for driving the plurality of pairs of lead screws 334 to rotate synchronously, so that the plurality of positioning members 335 move towards each other to clamp the wafer.

[0077] It should be noted that the connecting seat 331 is fixed on the pushing end of the pushing assembly 32, which serves as a support structure of the entire positioning assembly 33, a plurality of oppositely arranged mounting cavities 3330 are formed in the cross body 333, which provides space for the installation of the lead screws 334 and the positioning members 335, the plurality of pairs of lead screws 334 are arranged in the oppositely arranged mounting cavities 3330, and the opposite two lead screws 334 are in the same straight line and are oppositely threaded, so that when the opposite two lead screws rotate synchronously, the positioning members 335 on the outside thereof move towards or away from each other, the positioning members 335 are threadedly connected to the outside of the lead screws 334 and slidingly connected in the mounting cavities 3330, so as to move along the axis direction of the mounting cavities 3330 under the drive of the lead screws 334.

[0078] It can be understood that when the wafer needs to be clamped, the driving unit 332 is started, and the plurality of pairs of first lead screws 334 are driven to rotate synchronously by the transmission mechanism, and since the opposite two first lead screws 334 are oppositely threaded, when they rotate, the positioning members 335 connected thereto move towards each other; when the positioning members 335 move to the position in contact with the wafer, the wafer is clamped, thereby achieving precise positioning and clamping of the wafer.

[0079] Specifically, the positioning member 335 in the embodiment has an L shape, and the mounting cavities 3330 are four in number and are evenly distributed in a ring shape around the shaft of the cross body 333, so that the wafer is clamped from four different directions at the same time during clamping, thereby achieving accurate positioning of the wafer. Meanwhile, the positioning member 335 has an L shape, which can not only clamp the wafer from the side, but also clamp and fix the wafer from the top in cooperation with the pushing action of the pushing assembly 32. This clamping mode is stable and reliable, and can adapt to wafers of different sizes and shapes, thereby ensuring the stability and accuracy of the wafer during transfer.

[0080] As a preferred embodiment, the driving unit 332 in the embodiment includes a first motor 3321, a main bevel gear 3322, and a plurality of secondary bevel gears 3323. The first motor 3321 is fixed in the connecting seat 331, and the output shaft of the first motor 3321 extends through the cross body 333. The main bevel gear 3322 is fixed on the output shaft of the first motor 3321 and located at the center of the cross body 333. The plurality of secondary bevel gears 3323 are arranged on the side of each lead screw 334 close to the main bevel gear 3322, and each secondary bevel gear 3323 is engaged with the main bevel gear 3322.

[0081] It should be noted that when the first motor 3321 is started, the output shaft starts to rotate and drives the main bevel gear 3322 to rotate. Since the main bevel gear 3322 is engaged with the plurality of secondary bevel gears 3323, when the main bevel gear rotates, it drives the secondary bevel gears to rotate synchronously. The rotation of the secondary bevel gears further drives the respective first lead screws 334 to rotate. Since the threads of the two opposite first lead screws 334 are oppositely arranged, when they rotate, they drive the respective positioning members 335 to move towards or away from each other. When the positioning members 335 move to the position in contact with the wafer, they clamp the wafer, thereby achieving accurate positioning and clamping of the wafer.

[0082] In the embodiment, the engagement of the main bevel gear 3322 and the plurality of secondary bevel gears 3323 achieves synchronous rotation of the plurality of pairs of first lead screws 334, which not only improves the stability and accuracy of the clamping process, but also reduces the complexity and maintenance cost of the transmission system.

[0083] As a preferred implementation, the pushing assembly 32 in the embodiment comprises a mounting seat 321, a first pushing rod 322 and a plurality of guide members 323, wherein the horizontal moving assembly 31 is a linear moving module, the mounting seat 321 is fixed on the horizontal moving end of the horizontal moving assembly 31, and a plurality of guide holes are formed in the mounting seat 321 towards one side of the cabinet 1; the first pushing rod 322 is fixed on the mounting seat 321; the plurality of guide members 323 are respectively arranged in the guide holes and are slidingly connected to the inner side of the guide holes, one end of each guide member 323 penetrates through the guide hole and is fixedly connected to the cover body 6; a sliding hole is formed in the axial direction of the cover body 6, the connecting seat 331 has an upper end and a lower end, the movable end of the first pushing rod 322 is fixedly connected to the upper end of the connecting seat 331, the upper end of the connecting seat 331 is slidingly connected in the sliding hole, the lower end of the connecting seat 331 has a diameter larger than that of the sliding hole, and the lower end of the connecting seat 331 is located in the cover body 6 and abuts against the inner wall of the cover body 6.

[0084] It should be noted that when the horizontal moving assembly 31 is started and moves in a specific direction, the mounting seat 321 and the components such as the first pushing rod 322 and the guide members 323 thereon will also move, since the guide members 323 are fixedly connected to the cover body 6, the cover body 6 will also move with the horizontal moving assembly, and the sliding movement of the guide members 323 in the guide holes ensures the stability and accuracy of the movement of the cover body 6; when the cover body 6 moves to the position corresponding to the second inner cavity 510, the first pushing rod 322 starts to extend, the movable end thereof pushes the upper end of the connecting seat 331 to move in the direction of the sliding hole, since the upper end of the connecting seat 331 is slidingly connected in the sliding hole, the connecting seat 331 can smoothly push the positioning assembly 33 and the wafer to move into the cover body 6, when the bottom end of the cover body 6 abuts against the inner bottom wall of the second inner cavity 510, the further downward movement of the first pushing rod 322 will not cause the cover body 6 to move, and when the first pushing rod 322 retracts, the connecting seat 331 moves, the lower end of the connecting seat 331 supports the cover body 6 to move upwards synchronously, so that the different types of electrode connecting seats 5 can clamp and fix the wafers at different height positions, and the error risk in the operation process is reduced.

[0085] As a preferred implementation, the switching mechanism 4 in the embodiment comprises a second motor 41, a shaft cylinder 42 and a plurality of second pushing rods 43, wherein the shaft cylinder 42 is rotationally connected to the inner side of the cabinet 1; the second motor 41 is arranged on the cabinet 1, and the output shaft of the second motor 41 is fixedly connected to the shaft center of the shaft cylinder 42 for driving the shaft cylinder 42 to rotate in the circumferential direction; the fixed ends of the plurality of second pushing rods 43 are arranged on the outer side of the shaft cylinder 42 and are uniformly distributed in a ring shape along the shaft center of the shaft cylinder 42; and the plurality of electrode connecting seats 5 are respectively arranged on the movable ends of the second pushing rods 43.

[0086] It should be noted that when the second motor 41 starts, the output shaft drives the shaft cylinder 42 to rotate, and since the fixed ends of the second push rod 43 are uniformly distributed on the outside of the shaft cylinder 42, as the shaft cylinder 42 rotates, the second push rod 43 and the electrode connecting seat 5 on the movable end thereof will also move circumferentially, so that the switching of different electrode connecting seats 5 between the corresponding positions of the work position hole 100 can be realized, and then the use of the matching electrode connecting seat 5 can be quickly adjusted according to different batches of wafers, thereby reducing the time and manpower required for replacing the electrode connecting seat and improving the efficiency of wafer decoding.

[0087] It can be understood that since the number of electrode connecting seats 5 can be configured according to actual needs, the number of second push rods 43 and electrode connecting seats 5 can be increased to adapt to new needs.

[0088] As a preferred embodiment, the axis of the work position hole 100 in the embodiment is in the same straight line as the axis of the shaft cylinder 42, and the outer contour shape of the electrode connecting seat 5 matches the inner contour shape of the work position hole 100; a plurality of pads 502 are further arranged in the first inner cavity 500, the wafer is placed on the plurality of pads 502, and a ventilation opening 520 is formed on the outside of the first inner cavity 500 and communicates with the second inner cavity 510, the cover body 6 abuts in the second inner cavity 510, and the air hole of the air screen mechanism 7 corresponds to the position of the ventilation opening 520.

[0089] It should be noted that a plurality of pads 502 are arranged in the first inner cavity 500, the pads 502 are used to support the wafer, so that the wafer can be kept stable during testing or processing and will not affect the test results due to shaking, and the plurality of pads 502 keep a gap between the wafer and the inner wall of the first inner cavity 500, the cover body 6 abuts in the second inner cavity 510, when the cover body 6 is moved into position, it will tightly cover the opening of the ventilation opening 520 and the second inner cavity 510, ensuring the sealing of the airflow, and preventing the entry of external dust and impurities, during decoding, the airflow generated by the air screen mechanism 7 can smoothly enter the first inner cavity 500, thereby realizing effective cooling of the wafer, and the power and air speed of the air screen mechanism 7 can be adjusted according to actual needs to meet the airflow requirements during different wafer testing or processing, thereby improving the reliability of wafer decoding.

[0090] As a preferred embodiment, each electrode probe group 501 in the embodiment comprises a probe 5011, an elastic member 5012 and a limiting plate 5013, wherein a plurality of through holes 530 are formed on the electrode connecting seat 5; the elastic member 5012 is fixed between the electrode connecting seat 5 and the limiting plate 5013, and the position of the elastic member 5012 corresponds to the position of the through hole 530; the probe 5011 is fixed at the shaft center of the limiting plate 5013, and one end of the probe 5011 penetrates the elastic member 5012 and the through hole 530 in sequence and extends into the first inner cavity 500, and the height of the probe 5011 extending into the first inner cavity 500 is greater than the height of the pad 502.

[0091] It should be noted that the elastic member 5012 provides necessary elasticity and buffering to cope with the impact and vibration of the probe 5011 when contacting the electrode points on the wafer, which is beneficial to protect the probe 5011 and the electrode points on the wafer from being damaged, and improves the service life of the equipment. In addition, due to the different heights of the electrodes on the wafer, the probe 5011 can always be tightly attached to the electrodes on the wafer through the elastic member 5012, and the wafer is at the same height position by cooperating with the clamping mechanism 3, which improves the accuracy and reliability of the test.

[0092] In addition, the outside of the probe 5011 is wrapped with an insulating sleeve made of a material with high insulation performance, which has excellent electrical insulation performance and can effectively prevent current from flowing between the probe 5011 and other non-target areas, thereby ensuring the safety during the decoding process.

[0093] The embodiment also comprises a feeding transmission belt 8, a plurality of material loading plates 9 and a discharging conveying belt 10, wherein the feeding transmission belt 8 and the discharging conveying belt 10 are separately arranged on the two sides of the cabinet 1, and the transmission directions are the same as the moving directions of the transverse ends of the transverse assembly 31, the feeding transmission belt 8 and the discharging conveying belt 10 are both caterpillar belts; the plurality of material loading plates 9 are separately arranged on the connecting shafts of the feeding transmission belt 8 and the discharging conveying belt 10, and the plurality of material loading plates 9 are arranged at intervals, the wafer to be decoded is placed on the material loading plate 9, and the central axis of the material loading plate 9 is in the same straight line with the central axis of the transverse end; the transverse ends of the transverse assembly 31 move across between the feeding transmission belt 8 and the discharging conveying belt 10, and the transverse assembly 31 has two transverse ends, the two transverse ends move synchronously in the transverse direction, and each transverse end is provided with a clamping mechanism 3, the position of one clamping mechanism 3 corresponds to the position of the electrode connecting seat 5, and the position of the other clamping mechanism 3 corresponds to the position of the material loading plate 9 at the end of the feeding transmission belt 8, and the distance from the output end surface of the feeding transmission belt 8 to the input end surface of the discharging conveying belt 10 to the central position of the electrode connecting seat 5 is equal.

[0094] It should be noted that through the cooperation of the feeding conveying belt 8, the transverse movement assembly 31 and its clamping mechanism 3, the discharge conveying belt 10 and other assemblies, automatic feeding, clamping, processing and discharging of the wafer are realized. This greatly improves the automation degree and production efficiency of the system.

[0095] In a second aspect, the application also provides a method for using the wafer decoding device, which is realized by using the wafer decoding device described above, and includes the following steps:

[0096] S1, the feeding conveying belt 8 drives the carrier disc 9 to move towards the cabinet 1 side, stops when moving to the rightmost end, drives the two transverse movement ends of the transverse movement assembly 31 to move to the leftmost side, the clamping mechanism 3 is located at the position corresponding to the rightmost carrier disc 9, the image acquisition assembly 34 identifies the type of the wafer to be decoded, and obtains the corresponding clamping parameter information;

[0097] S2, according to the clamping parameter information, respectively drive the first motor 3321 and the second motor 41 to operate, the first motor 3321 drives a plurality of pairs of lead screws 334 to rotate synchronously, so that a plurality of positioning members 335 move towards each other to clamp the wafer to be decoded, the second motor 41 drives the shaft cylinder 42 to rotate, so that the electrode connecting seat 5 corresponding to the wafer to be decoded rotates to correspond to the work position hole 100, and the second push rod 43 pushes the electrode connecting seat 5 corresponding to the wafer to be decoded to extend out of the work position hole 100;

[0098] S3, the transverse movement assembly 31 drives the two transverse movement ends to move to the rightmost side, and places the clamped wafer to be decoded on the cushion block 502 in the first inner cavity 500, and then drives the two transverse movement ends of the transverse movement assembly 31 to move to the leftmost side, at this time, the clamping mechanism 3 on the left side clamps the wafer to be decoded in the carrier disc 9 below, and the clamping mechanism 3 on the right side positions and clamps the wafer to be decoded in the first inner cavity 500, the electrode of the wafer to be decoded abuts against the electrode probe group 501, so that the decoding circuit is connected to decode the wafer to be decoded;

[0099] S4, the cover body 6 moves downward with the clamping mechanism 3, and abuts against the second inner cavity 510 to form a sealed space with the electrode connecting seat 5, the air hole of the air screen mechanism 7 blows air into the first inner cavity 500 along the air vent 520 to cool the bottom of the wafer, and the air screen mechanism 7 on the other clamping mechanism 3 blows air to the opening side of the cover body 6 to form a screen resistance, preventing dust from adhering to the surface of the wafer;

[0100] S5, after the wafer to be decoded in the first inner cavity 500 is decoded, the transverse movement assembly 31 drives the two transverse movement ends to move to the rightmost side, and places the decoded wafer on the leftmost carrier disc 9 of the discharge conveying belt 10, and places the wafer to be decoded grabbed on the right side into the first inner cavity 500, and repeats steps S3-S5 to complete the decoding of the wafer.

[0101] It should be noted that the image acquisition assembly 34 identifies the type of wafer to be decoded, obtains the corresponding clamping parameter information, acquires the shape, size and color characteristics of the wafer through the industrial camera, analyzes the collected image through the image processing algorithm, compares the shape, size and color characteristics of the wafer with the preset wafer type database, identifies the type of wafer, and obtains the clamping parameters corresponding to the wafer from the preset clamping parameter database according to the type of wafer. The clamping parameters include clamping position and clamping force, which will be used to guide the subsequent clamping mechanism operation, to ensure that the wafer will not be damaged during clamping and can be clamped stably. During clamping, the clamping force of the clamping mechanism is monitored in real time by the pressure sensor arranged on the positioning piece 335, and is adjusted in real time to ensure that the wafer can be clamped and processed stably and accurately during subsequent processing, thereby improving the accuracy and efficiency of decoding.

[0102] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer decoding apparatus, characterized by comprising: The utility model relates to a kind of wafer transfer device, including cabinet (1), support (2), clamping mechanism (3), switching mechanism (4), multiple electrode connecting seat (5), cover body (6) and wind screen mechanism (7), wherein, The cabinet (1) is provided on the ground, and the inside is hollow; The support (2) is provided on the side of the cabinet (1) away from the ground, and a work station hole (100) is formed in the center of the cabinet (1); The clamping mechanism (3) is provided on the support (2) for transferring and clamping the wafer; The switching mechanism (4) is provided in the cabinet (1), and the switching mechanism (4) has multiple uniformly distributed telescopic ends, and the multiple telescopic ends can rotate circumferentially; Multiple electrode connecting seats (5) are respectively provided on the telescopic ends of each switching mechanism (4), and the multiple telescopic ends rotate circumferentially to selectively switch the electrode connecting seat (5), and the telescopic end is telescopic to extend into the work station hole (100); The electrode connecting seat (5) is provided with a first inner cavity (500) and a second inner cavity (510), the first inner cavity (500) and the second inner cavity (510) are spaced apart, the wafer is placed in the matching first inner cavity (500), and a plurality of electrode probe groups (501) are provided in the first inner cavity (500), one end of the electrode probe group (501) abuts the electrode of the wafer, and the other end is connected with an external coding port; The cover body (6) is movably sleeved on the outside of the clamping mechanism (3), and is provided with an opening towards the cabinet (1), the cover body (6) abuts in the second inner cavity (510), so that the electrode connecting seat (5) is sealed; The wind screen mechanism (7) is annularly arranged in the cover body (6) and located at the opening of the cover body (6), and the wind screen mechanism (7) has a plurality of annularly and uniformly distributed air holes for air supply to the side of the clamped wafer.

2. The wafer decoding apparatus of claim 1, wherein: The clamping mechanism (3) includes a horizontal moving assembly (31), a pushing assembly (32), a positioning assembly (33), and an image acquisition assembly (34), wherein, The horizontal moving assembly (31) is provided on the side of the support (2) away from the cabinet (1), and the horizontal moving assembly (31) has a horizontal moving end that can move along a horizontal straight line; The pushing assembly (32) is provided on the horizontal moving end of the horizontal moving assembly (31), and the pushing assembly (32) has a pushing end that can move linearly towards the cabinet (1); The positioning assembly (33) is provided on the pushing end of the pushing assembly (32), and the positioning assembly (33) has a plurality of pairs of clamping portions that can move towards each other to clamp the wafer; The image acquisition assembly (34) is provided at the center of the side of the positioning assembly (33) away from the pushing assembly (32), and is used for acquiring the picture of the wafer to be grabbed.

3. The wafer decoding apparatus of claim 2, wherein: The positioning assembly (33) includes a connecting seat (331), a driving unit (332), a cross frame (333), a plurality of lead screws (334), and a plurality of positioning members (335), wherein, The connecting seat (331) is fixed on the pushing end of the pushing assembly (32), and the inside of the connecting seat (331) is hollow. The cross body (333) is fixed on the side of the connecting seat (331) away from the pushing assembly (32), a plurality of installation cavities (3330) are arranged on the cross body (333) in opposite positions, and the installation cavities (3330) are evenly distributed in a ring shape along the axis of the cross body (333); A plurality of pairs of lead screws (334) are arranged in the opposite installation cavities (3330), and the lead screws (334) are rotatably connected in the installation cavities (3330); and the opposite two lead screws (334) are in the same straight line, and the threads of the two lead screws (334) are oppositely arranged; A plurality of positioning members (335) are threadedly connected to the outer sides of the lead screws (334), and the positioning members (335) are slidably connected in the installation cavities (3330); the distances from the positioning members (335) to the axis of the cross body (333) are equal; and the positioning members (335) serve as clamping parts of the positioning assembly (33); The driving unit (332) is arranged in the connecting seat (331) and located between the plurality of pairs of lead screws (334), and is used for driving the plurality of pairs of lead screws (334) to rotate synchronously, so that the plurality of positioning members (335) move towards each other to clamp the wafer.

4. The wafer decoding apparatus of claim 3, wherein: The driving unit (332) comprises a first motor (3321), a main bevel gear (3322) and a plurality of secondary bevel gears (3323), wherein The first motor (3321) is fixed in the connecting seat (331), and the output shaft of the first motor (3321) penetrates and extends into the cross body (333); The main bevel gear (3322) is fixed on the output shaft of the first motor (3321) and located at the center of the cross body (333); The plurality of secondary bevel gears (3323) are arranged on the side of each lead screw (334) close to the main bevel gear (3322), and the plurality of secondary bevel gears (3323) are in mesh with the main bevel gear (3322).

5. The wafer decoding apparatus of claim 4, wherein: The pushing assembly (32) comprises a mounting seat (321), a first push rod (322) and a plurality of guide members (323), wherein The mounting seat (321) is fixed on the moving end of the horizontal moving assembly (31), and a plurality of guide holes are formed in the side of the mounting seat (321) facing the cabinet (1); The first push rod (322) is fixed on the mounting seat (321); The plurality of guide members (323) are arranged in the guide holes and slidably connected to the inner sides of the guide holes; one end of the guide member (323) penetrates the guide hole and is fixedly connected with the cover body (6); The cover body (6) is provided with a sliding hole in the axial direction, the connecting seat (331) has an upper end and a lower end, the movable end of the first push rod (322) is fixedly connected with the upper end of the connecting seat (331), the upper end of the connecting seat (331) is slidably connected in the sliding hole, the diameter of the lower end of the connecting seat (331) is larger than the diameter of the sliding hole, the lower end of the connecting seat (331) is located in the cover body (6) and abuts against the inner wall of the cover body (6).

6. The wafer decoding apparatus of claim 1, wherein: The switching mechanism (4) comprises a second motor (41), a shaft cylinder (42) and a plurality of second push rods (43), wherein The shaft cylinder (42) is rotatably connected to the inner side of the cabinet (1); A second motor (41) is arranged on the cabinet body (1), and an output shaft of the second motor (41) is fixedly connected with the shaft cylinder (42) in the axial center, for driving the shaft cylinder (42) to rotate circumferentially. Fixed ends of a plurality of second push rods (43) are arranged on the outside of the shaft cylinder (42) and are uniformly distributed in a ring shape along the axial center of the shaft cylinder (42); a plurality of electrode connecting bases (5) are respectively arranged on the movable ends of the second push rods (43).

7. The wafer decoding apparatus of claim 6, wherein: The axial center of the work station hole (100) is in the same straight line as the axial center of the shaft cylinder (42), and the outer contour shape of the electrode connecting base (5) matches the inner contour shape of the work station hole (100); a plurality of pads (502) are further arranged in the first inner cavity (500), and a wafer is placed on the pads (502); a ventilation opening (520) is arranged on the outside of the first inner cavity (500) and is in communication with the second inner cavity (510); the cover body (6) abuts against the second inner cavity (510), and the air hole of the wind screen mechanism (7) corresponds to the position of the ventilation opening (520).

8. The wafer decoding apparatus of claim 7, wherein: Each electrode probe group (501) comprises a probe (5011), an elastic member (5012) and a limiting plate (5013), wherein, A plurality of penetrating holes (530) are arranged on the electrode connecting base (5); The elastic member (5012) is fixed between the electrode connecting base (5) and the limiting plate (5013), and the position of the elastic member (5012) corresponds to the position of the penetrating hole (530); The probe (5011) is fixed at the axial center of the limiting plate (5013), and one end of the probe (5011) penetrates the elastic member (5012) and the penetrating hole (530) in sequence and extends into the first inner cavity (500); the height of the probe (5011) extending into the first inner cavity (500) is greater than the height of the pad (502).

9. The wafer decoding apparatus of claim 5, wherein: Further comprising a feeding transmission belt (8), a plurality of material loading plates (9) and a discharging transmission belt (10), wherein, The feeding transmission belt (8) and the discharging transmission belt (10) are arranged on the two sides of the cabinet body (1), and the transmission directions are the same as the moving directions of the horizontal moving ends of the horizontal moving assembly (31); the feeding transmission belt (8) and the discharging transmission belt (10) are both caterpillar belts; The plurality of material loading plates (9) are arranged on the connecting shafts of the feeding transmission belt (8) and the discharging transmission belt (10), and are arranged in intervals; the material loading plates (9) are used for placing wafers to be decoded; the central axes of the material loading plates (9) are in the same straight line as the central axes of the horizontal moving ends; The horizontal moving ends of the horizontal moving assembly (31) move horizontally across the feeding transmission belt (8) and the discharging transmission belt (10); the horizontal moving assembly (31) has two horizontal moving ends which move horizontally synchronously; each horizontal moving end is provided with a clamping mechanism (3); the position of one clamping mechanism (3) corresponds to the position of the electrode connecting base (5); the position of the other clamping mechanism (3) corresponds to the position of the material loading plate (9) at the end of the feeding transmission belt (8); the distance from the output end surface of the feeding transmission belt (8) to the central position of the electrode connecting base (5) is equal to the distance from the input end surface of the discharging transmission belt (10) to the central position of the electrode connecting base (5).

10. A method of using a wafer decoding apparatus, implemented using the wafer decoding apparatus of any one of claims 1-9, characterized in that: The method comprises the following steps: S1, the feeding conveying belt (8) drives the carrier tray (9) to move towards the cabinet (1) side, stops when moving to the rightmost end, drives the two horizontal moving ends of the horizontal moving assembly (31) to move to the leftmost side, the clamping mechanism (3) is located at the position corresponding to the rightmost carrier tray (9), the image acquisition assembly (34) identifies the type of the wafer to be decoded, and obtains the corresponding clamping parameter information; S2, according to the clamping parameter information, respectively drive the first motor (3321) and the second motor (41) to operate, the first motor (3321) drives a plurality of pairs of lead screws (334) to rotate synchronously, so that a plurality of positioning members (335) move towards each other to clamp the wafer to be decoded, the second motor (41) drives the shaft cylinder (42) to rotate, so that the electrode connecting seat (5) corresponding to the wafer to be decoded is rotated to correspond to the work position hole (100), and the second push rod (43) pushes the electrode connecting seat (5) corresponding to the wafer to be decoded to extend out of the work position hole (100); S3, the horizontal moving assembly (31) drives the two horizontal moving ends to move to the rightmost side, and places the clamped wafer to be decoded on the cushion block (502) in the first inner cavity (500) after moving down, and then drives the two horizontal moving ends of the horizontal moving assembly (31) to move to the leftmost side, at this time, the clamping mechanism (3) on the left side clamps the wafer to be decoded in the carrier tray (9) below, and the clamping mechanism (3) on the right side positions and clamps the wafer to be decoded in the first inner cavity (500), the electrode of the wafer to be decoded abuts against the electrode probe group (501), so that the decoding circuit is communicated to decode the wafer to be decoded; S4, the cover body (6) moves down with the clamping mechanism (3) and abuts against in the second inner cavity (510), forms a sealed space with the electrode connecting seat (5), the air hole of the air screen mechanism (7) blows air, enters into the first inner cavity (500) along the air vent (520), blows air to cool the bottom of the wafer, and the air screen mechanism (7) on the other clamping mechanism (3) blows air to the opening side of the cover body (6) to form a screen resistance, preventing dust from adhering to the surface of the wafer; S5, after the wafer to be decoded in the first inner cavity (500) is decoded, the horizontal moving assembly (31) drives the two horizontal moving ends to move to the rightmost side, and places the decoded wafer on the leftmost carrier tray (9) on the discharge conveying belt (10), and places the wafer to be decoded grabbed on the right side into the first inner cavity (500), and repeats steps S3-S5 to complete the decoding of the wafer.

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