Testing device suitable for multi-size printed circuit boards

Abstract

The invention belongs to the field of printed circuit board testing, and particularly relates to a testing device suitable for multi-size printed circuit boards. The invention relates to a testing device suitable for printed circuit boards with multiple sizes, which can position and fix circuit boards with different sizes. The testing device comprises a shell and the like, a horizontal moving module is installed on the upper portion in the shell, the horizontal moving module is composed of an X-axis module and a Y-axis module, and a flying probe testing mechanism is installed on the horizontal moving module. According to the invention, the circuit is fixed in an adsorption mode, which is convenient and fast; the circuit board can be automatically loosened through the material ejecting assembly, and the equipment is more convenient to use; when the circuit board is detected, the clamping plates limit the circuit board in four directions, so that the circuit board does not displace in the detection process, and meanwhile, the sliding blocks do not limit the downward movement of the placing hole plate, so that the clamping plates can be suitable for fixing circuit boards with different sizes, and the device is high in universality.

Description

Technical Field

[0001] The invention belongs to the field of printed circuit board testing, and in particular relates to a testing device suitable for printed circuit boards of multiple sizes. Background Art

[0002] Printed circuit boards are one of the most important components in the electronics industry, used to support and connect various electronic components. It realizes the connection function of the circuit by printing conductive patterns on the surface of the insulating substrate and installing and soldering electronic components on it. In the printed circuit board production industry, printed circuit board testing is an important step to ensure that the circuit board functions properly and is defect-free. Effective testing can improve the reliability of the product. It usually consists of visual inspection, electrical testing, functional testing, X-ray testing, boundary scan testing, etc. There are also flying probe testing and online testing in electrical testing. Flying probe testing is a key step in the production of circuit boards. It uses a moving probe to contact the test points on the circuit board to detect electrical characteristics such as open circuits, short circuits, and resistance values.

[0003] When the existing flying probe test device fixes the circuit board, it is usually achieved by passing the positioning rods through the positioning holes at the four corners of the circuit board. Although this method can fix the circuit board, there is still a lot of room for improvement. First of all, the positioning is greatly limited. When there is an error in the hole position, the circuit board is easily damaged when it is fixed. If the positioning hole is larger than the diameter of the positioning rod, the fixing effect will be reduced, which will easily cause the circuit board to shake when the flying probe moves, thereby causing the flying probe to be unable to align.

[0004] Therefore, there is an urgent need to develop a testing device for printed circuit boards of multiple sizes that can position and fix circuit boards of different sizes. Summary of the invention

[0005] In order to overcome the above-mentioned shortcomings of the prior art, the present invention provides a testing device for printed circuit boards of multiple sizes, which can position and fix circuit boards of different sizes.

[0006] Technical solution: A testing device suitable for printed circuit boards of multiple sizes, comprising a shell, a horizontal moving module, a flying probe test mechanism, a vertical moving module and an adsorption component. A horizontal moving module is installed on the upper part of the shell, and a flying probe test mechanism is installed on the horizontal moving module. The horizontal moving module can drive the test end of the flying probe test mechanism to move in the X-axis and Y-axis directions. A vertical moving module is arranged on the rear side of the shell, and an adsorption component is arranged on the vertical moving module. The vertical moving module is used to drive the adsorption component to move in the Z-axis direction. The adsorption component comprises an air pump, an adsorption plate and an air pipe. The air pump is fixedly connected to the lower rear side of the shell by bolts, the adsorption plate is connected to the slider of the vertical moving module, and an air pipe is connected between the adsorption plate and the air pump.

[0007] Furthermore, the horizontal moving module is composed of an X-axis module and a Y-axis module.

[0008] Furthermore, it also includes a lifting material component, which is arranged on the adsorption plate. The lifting material component includes a lifting frame, a placement hole plate and a limit plate. The lifting frame is slidably arranged on the edge of the adsorption plate, and the placement hole plate is fixedly connected between the tops of the lifting frames. The placement hole plate is above the adsorption plate, and the limit plate is fixedly connected to the outer shell below the lifting frame, and the bottom of the lifting frame is in contact with the top of the limit plate.

[0009] Furthermore, the lifting assembly also includes a guide rod and a spring I. The guide rods are vertically arranged at the four corners of the bottom of the adsorption plate. The lifting frame is slidably connected to the guide rods, and the spring I is connected between the lifting frame and the adsorption plate.

[0010] Furthermore, it also includes a side limit component, which is arranged on the placement hole plate, and the side limit component includes a track, a slider, a sliding shaft, a spring II, a clamp and a tension spring. Four inclined grooves are opened on the adsorption plate, and a track is embedded on the placement hole plate above the inclined groove. A slider is slidably connected in the track, and a sliding shaft is arranged on the side of the slider facing the inclined groove. The sliding shaft is above the inclined groove, and a spring II is connected between the slider and the track, and a clamp is slidably connected to the slider. The clamp is also slidably connected to the track, and a tension spring is connected between the clamp and the slider.

[0011] Furthermore, the oblique grooves are combined into a cross, and the depth of the oblique grooves increases from the outside to the inside.

[0012] Furthermore, the inner side surface of the splint is a downwardly inclined slope.

[0013] Furthermore, it also includes an air hole blocking component, which is arranged in the hole of the placement orifice plate. The air hole blocking component includes a blocking block and a spring III. The blocking block is slidably arranged below the hole on the placement orifice plate, and the spring III is connected between the blocking block and the placement orifice plate.

[0014] Furthermore, the pore blocking component also includes a pad, and a hemispherical pad is arranged on the top of the blocking block.

[0015] Compared with the prior art, the present invention has the following advantages: the present invention fixes the circuit by adsorption, which is convenient and quick; the circuit board can be automatically loosened by the lifting component, and the equipment is more convenient to use; when the circuit board is inspected, because the clamping plate limits the four directions of the circuit board, the circuit board will not be displaced during the inspection process, and the slider will not limit the downward movement of the placement hole plate, so that the clamping plate can be used to fix circuit boards of different sizes, and the equipment has strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0018] Figure 2 It is a schematic diagram of the three-dimensional structure inside the present invention.

[0019] Figure 3 It is a schematic diagram of the three-dimensional structure of the present invention for fixing the circuit board structure.

[0020] Figure 4 It is a schematic diagram of the three-dimensional structure of the adsorption component of the present invention.

[0021] Figure 5 It is a schematic diagram of the three-dimensional structure of the top material assembly of the present invention.

[0022] Figure 6 For the present invention Figure 5 A is an enlarged view of the middle image.

[0023] Figure 7 It is a schematic diagram of the three-dimensional structure of the side limiting assembly of the present invention.

[0024] Figure 8 For the present invention Figure 7 Enlarged view of B.

[0025] Fig. 9 It is a schematic diagram of the three-dimensional structure of the pore blocking component of the present invention.

[0026] Fig.10 It is a three-dimensional structural schematic diagram of the blocking block, spring III and cushion block of the present invention.

[0027] The meanings of the reference numerals in the figure are as follows: 1. Shell, 2. Horizontal moving module, 3. Flying probe test mechanism, 4. Vertical moving module, 5. Adsorption assembly, 51. Air pump, 52. Adsorption plate, 53. Air pipe, 6. Ejection assembly, 61. Lifting frame, 62. Placement hole plate, 63. Limiting plate, 64. Guide rod, 65. Spring I, 7. Side limiting assembly, 71. Inclined groove, 72. Track, 73. Slider, 74. Sliding shaft, 75. Spring II, 76. Clamp, 77. Tension spring, 8. Air hole blocking assembly, 81. Block, 82. Spring III, 83. Pad. DETAILED DESCRIPTION

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0029] Thus, a feature indicated in this specification will be used to illustrate one of the features of an embodiment of the present invention, rather than implying that each embodiment of the present invention must have the described feature. In addition, it should be noted that this specification describes many features. Although some features can be combined together to illustrate possible system designs, these features can also be used in other combinations that are not explicitly described. Thus, unless otherwise stated, the described combinations are not intended to be limiting.

[0030] In the description of the present application, the terms “first” and “second” are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0031] In the description of the present application, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] The principle and structure of the present invention are described in detail below with reference to the accompanying drawings and embodiments.

[0033] Embodiment 1: A testing device for printed circuit boards of various sizes, such as Figure 1-Figure 4 As shown, it includes a shell 1, a horizontal moving module 2, a flying probe test mechanism 3, a vertical moving module 4 and an adsorption component 5. The horizontal moving module 2 is installed on the upper part of the shell 1. The horizontal moving module 2 is composed of an X-axis module and a Y-axis module. The flying probe test mechanism 3 is installed on the horizontal moving module 2. The test end of the flying probe test mechanism 3 is connected to the horizontal moving module 2. The horizontal moving module 2 can drive the test end of the flying probe test mechanism 3 to move in the X-axis and Y-axis directions. A vertical moving module 4 is arranged on the rear side of the shell 1. The adsorption component 5 is arranged on the vertical moving module 4. The vertical moving module 4 is used to drive the adsorption component 5 to move in the Z-axis direction. The adsorption component 5 includes an air pump 51, an adsorption plate 52 and an air pipe 53. The air pump 51 is fixedly connected to the lower rear side of the shell 1 by bolts. The adsorption plate 52 is connected to the slider 73 of the vertical moving module 4. The air pipe 53 is connected between the adsorption plate 52 and the air pump 51, and the air pipe 53 is provided with a solenoid valve.

[0034] When using the device to detect circuit boards, first place the circuit board to be detected above the adsorption plate 52, then control the air pump 51 to start working, and fix the circuit board by the adsorption plate 52, then drive the adsorption plate 52 to move upward to the required height through the vertical moving module 4, then control the horizontal moving module 2 to drive the detection end of the flying probe test mechanism 3 to detect the circuit board. After the circuit board detection is completed, the adsorption plate 52 is driven to move downward and reset through the vertical moving module 4, then control the air pump 51 to stop working, and the adsorption plate 52 no longer adsorbs the circuit board. Then the circuit board after the detection can be removed and replaced with a new one, and the above operations are repeated to continue monitoring.

[0035] Embodiment 2: Based on embodiment 1, Figure 5 and Figure 6 As shown, it also includes a lifting component 6, and the lifting component 6 is arranged on the adsorption plate 52. The lifting component 6 includes a lifting frame 61, a placement hole plate 62, a limit plate 63, a guide rod 64 and a spring I 65. The lifting frame 61 is vertically slidably arranged on the edge of the adsorption plate 52, and the placement hole plate 62 is fixedly connected between the top of the lifting frame 61 by bolts. The placement hole plate 62 is above the adsorption plate 52, and the limit plate 63 is fixedly connected to the shell 1 below the lifting frame 61 by bolts. In the initial state, the bottom of the lifting frame 61 contacts the top of the limit plate 63, and the guide rods 64 are vertically arranged at the four corners of the bottom of the adsorption plate 52. The lifting frame 61 is slidably connected to the guide rod 64, and a spring I 65 is connected between the lifting frame 61 and the adsorption plate 52.

[0036] When it is necessary to inspect the circuit board, the circuit board to be inspected is placed above the placement hole plate 62. When the vertical moving module 4 drives the adsorption plate 52 to move upward, the bottom of the lifting frame 61 is no longer restricted by the limit plate 63. The lifting frame 61 moves downward under the action of its own gravity and the reset of the spring I 65, driving the placement hole plate 62 to move downward, and the bottom of the placement hole plate 62 fits with the adsorption plate 52. Then the air pump 51 can be controlled to start working to adsorb the circuit board. After the circuit board inspection is completed, the adsorption plate 52 is driven downward by the vertical moving module 4, and then the lifting frame 61 is driven downward. When the lifting frame 61 moves downward and contacts with the limit plate 63, the lifting frame 61 is pushed to move upward, and then the placement hole plate 62 is driven to move upward. The spring I 65 is compressed, the placement hole plate 62 moves upward and disengages from the adsorption plate 52, so that the adsorbed circuit board is automatically released. Then the circuit board after the inspection is removed, and a new circuit board is replaced and the above steps are repeated to continue the inspection.

[0037] like Figure 7 and Figure 8As shown, it also includes a side limit assembly 7, and the side limit assembly 7 is arranged on the placement hole plate 62. The side limit assembly 7 includes a track 72, a slider 73, a sliding shaft 74, a spring II 75, a clamping plate 76 and a tension spring 77. Four inclined grooves 71 are opened on the adsorption plate 52, and the inclined grooves 71 are combined into a cross. The depth of the inclined groove 71 increases from the outside to the inside. A track 72 is embedded on the placement hole plate 62 above the inclined groove 71, and a slider 73 is slidably connected in the track 72. A sliding shaft 74 is arranged on the side of the slider 73 facing the inclined groove 71, and the sliding shaft 74 can rotate on the slider 73. The sliding shaft 74 is above the inclined groove 71, and a spring II 75 is connected between the slider 73 and the track 72. A clamping plate 76 is slidably connected to the slider 73, and the clamping plate 76 is also slidably connected to the track 72. A tension spring 77 is connected between the clamping plate 76 and the slider 73, and the inner side surface of the clamping plate 76 is a downward inclined surface.

[0038] After the circuit board is placed on the placement hole plate 62, when the vertical moving module 4 drives the adsorption plate 52 to move upward, the placement hole plate 62 moves downward at this time, so that the sliding shaft 74 contacts the surface of the inclined groove 71. At this time, under the action of the downward extrusion force of the placement hole plate 62, the sliding shaft 74 moves toward the middle, driving the slider 73 and the clamping plate 76 to move toward the middle, and the spring II 75 is stretched. When the clamping plate 76 moves inward to contact the circuit board above the placement hole plate 62, the clamping plate 76 pushes the circuit board toward the middle. When the circuit board returns to the middle and cannot move, the clamping plate 76 stops moving. At this time, if the placement hole plate 62 has not yet dropped to the bottom, The slider 73 continues to move inward, and the tension spring 77 is pulled by the rope. The slider 73 will not limit the downward movement of the placement hole plate 62. In this way, when the circuit board is inspected, because the clamping plate 76 limits the four directions of the circuit board, the circuit board will not be displaced during the inspection process. At the same time, the slider 73 will not limit the downward movement of the placement hole plate 62, so that the clamping plate 76 can be used to fix circuit boards of different sizes. The equipment has strong versatility. After the circuit board inspection is completed, when the placement hole plate 62 moves downward to reset, the slider 73 and the clamping plate 76 are reset under the action of the reset of the spring II 75 and the tension spring 77.

[0039] like Fig. 9 and Fig.10 As shown, it also includes an air hole plugging component 8, which is arranged in the hole of the placement orifice plate 62. The air hole plugging component 8 includes a blocking block 81, a spring III 82 and a cushion block 83. The blocking block 81 is slidably arranged below the upper hole of the placement orifice plate 62. The lower part of the blocking block 81 is truncated cone-shaped. The spring III 82 is connected between the blocking block 81 and the placement orifice plate 62. A hemispherical cushion block 83 is arranged on the top of the blocking block 81.

[0040] When testing the circuit board, the circuit board is placed on top of the cushion block 83. When the inclined surface of the clamping plate 76 contacts the circumference of the circuit board, the circuit board is pushed downward, thereby driving the blocking block 81 to move downward, so that the spring III 82 is stretched, and the blocking block 81 moves downward and no longer blocks the holes on the placement hole plate 62. At this time, the holes that are no longer blocked can be ventilated, so that the circuit board is fixed, and the other blocked holes cannot be ventilated, so that the gas will not be released through other holes, and the circuit board can be better fixed.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present invention.

Claims

1. A testing device for printed circuit boards of various sizes, comprising a housing (1), a horizontal moving module (2), a flying probe test mechanism (3), a vertical moving module (4) and an adsorption component (5), wherein the housing (1) is provided with a horizontal moving module (2) on the upper part thereof, the flying probe test mechanism (3) being provided on the horizontal moving module (2), the horizontal moving module (2) being capable of driving a test end of the flying probe test mechanism (3) to move in the directions of the X-axis and the Y-axis, the housing (1) is provided with a vertical moving module (4) on the rear side thereof, the vertical moving module (4) being provided with an adsorption component (5), the vertical moving module (4) being used for driving the adsorption component (5) to move in the direction of the Z-axis, and characterized in that: The adsorption assembly (5) comprises an air pump (51), an adsorption plate (52) and an air pipe (53); the air pump (51) is fixedly connected to the lower rear side of the housing (1) by bolts; the adsorption plate (52) is connected to the slider (73) of the vertical moving module (4); and the air pipe (53) is connected between the adsorption plate (52) and the air pump (51).

2. A testing device for printed circuit boards of multiple sizes according to claim 1, characterized in that: The horizontal movement module (2) is composed of an X-axis module and a Y-axis module.

3. The testing device for printed circuit boards of various sizes according to claim 1, characterized in that: The device also includes a material lifting component (6), the material lifting component (6) is arranged on the adsorption plate (52), and the material lifting component (6) includes a lifting frame (61), a placement hole plate (62) and a limit plate (63). The lifting frame (61) is slidably arranged on the edge of the adsorption plate (52), and the placement hole plate (62) is fixedly connected between the top of the lifting frame (61). The placement hole plate (62) is above the adsorption plate (52), and the limit plate (63) is fixedly connected to the shell (1) below the lifting frame (61), and the bottom of the lifting frame (61) is in contact with the top of the limit plate (63).

4. The testing device for printed circuit boards of multiple sizes according to claim 3, characterized in that: The ejector assembly (6) further comprises a guide rod (64) and a spring I (65). The guide rods (64) are vertically arranged at the four corners of the bottom of the adsorption plate (52). The lifting frame (61) is slidably connected to the guide rods (64). The spring I (65) is connected between the lifting frame (61) and the adsorption plate (52).

5. The testing device for printed circuit boards of multiple sizes according to claim 4, characterized in that: The device also includes a side limit assembly (7), wherein the side limit assembly (7) is arranged on the placement hole plate (62), and the side limit assembly (7) includes a track (72), a slider (73), a sliding shaft (74), a spring II (75), a clamping plate (76) and a tension spring (77). Four inclined grooves (71) are provided on the adsorption plate (52), and a track (72) is embedded on the placement hole plate (62) above the inclined groove (71). The track (72) is slidably connected with the slider (73), and a sliding shaft (74) is arranged on the side of the slider (73) facing the inclined groove (71). The sliding shaft (74) is above the inclined groove (71), and a spring II (75) is connected between the slider (73) and the track (72). A clamping plate (76) is slidably connected to the slider (73), and the clamping plate (76) is slidably connected to the track (72). A tension spring (77) is connected between the clamping plate (76) and the slider (73).

6. The testing device for printed circuit boards of various sizes according to claim 5, characterized in that: The oblique grooves (71) are combined into a cross, and the depth of the oblique grooves (71) increases from the outside to the inside.

7. The testing device for printed circuit boards of various sizes according to claim 5, characterized in that: The inner side surface of the clamping plate (76) is a downwardly inclined inclined surface.

8. The testing device for printed circuit boards of various sizes according to claim 5, characterized in that: The device also includes an air hole plugging component (8), the air hole plugging component (8) is arranged in the hole of the placement orifice plate (62), the air hole plugging component (8) includes a blocking block (81) and a spring III (82), the blocking block (81) is slidably arranged below the upper hole of the placement orifice plate (62), and the spring III (82) is connected between the blocking block (81) and the placement orifice plate (62).

9. The testing device for printed circuit boards of various sizes according to claim 8, characterized in that: The air hole blocking assembly (8) further comprises a cushion block (83), and a hemispherical cushion block (83) is arranged on the top of the blocking block (81).

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