Probe rapid heating and constant temperature control method and system, ear thermometer and readable storage medium

Abstract

The invention relates to the technical field of temperature measurement, in particular to a probe rapid heating and constant temperature control method and system, an ear thermometer and a readable storage medium. Comparing the obtained environment temperature with a preset temperature range; different preset heating modes are selected according to the comparison result, and the probe is selectively and rapidly heated according to preset heating time corresponding to the different preset heating modes; before the preset heating time is reached, at least the temperature of a temperature sensor in the probe is close to, equal to or higher than a preset temperature T; and after the preset heating time is up, constant temperature control is carried out, so that the temperature of the temperature sensor is stabilized at the preset temperature T, and the temperature of a probe plastic part in the probe is close to or stabilized at the preset temperature T. According to the scheme, the purpose of reducing measurement errors and even avoiding the measurement errors can be achieved.

Description

Technical Field

[0001] The present invention relates to the field of temperature measurement technology, and in particular to a method and system for rapid probe heating and constant temperature control, an ear thermometer and a readable storage medium. Background Art

[0002] When using a traditional unheated ear thermometer to take measurements in a low-temperature environment, significant challenges are encountered. Since the ear canal temperature is usually higher than the unheated ear thermometer probe temperature, when the probe is inserted deep into the ear canal, the cold end of the thermopile temperature sensor will be severely affected by the high temperature of the ear canal. This thermal shock not only causes immediate deviations in the sensor data, but also seriously affects the accuracy and reliability of the measurement.

[0003] In order to deal with the above problems, preheating infrared ear thermometers came into being. After turning on, this type of ear thermometer first heats the entire probe module to gradually approach the ear canal temperature. The original intention of this design is to reduce the impact of the ear canal temperature on the thermopile temperature sensor by preheating the probe module, thereby improving the accuracy of the measurement. Among them, the heating resistor is embedded in the ceramic substrate, and together with thermistors, thermopiles and other electronic components, it constitutes a thermopile temperature sensor. The thermopile temperature sensor is tightly combined with the probe plastic part through a copper cap.

[0004] During the working process of the preheating infrared ear thermometer, it takes a certain amount of time for the heating resistor to heat up to the set temperature and for the entire probe module to reach the set temperature. Due to the unevenness of heat transfer, the part closer to the heating resistor will reach the set temperature faster, while the probe plastic is the slowest to reach the set temperature. This results in that during the measurement and acquisition process, even if the thermopile temperature sensor has reached the set temperature, the probe plastic is still in an undesirable temperature state. This temperature imbalance will not only cause the temperature of the thermopile temperature sensor to be lowered and regenerate a thermal shock response, but also introduce measurement errors. Especially in low temperature environments, this error phenomenon is more obvious.

[0005] In order to improve the heating effect of the probe module, the PID temperature control algorithm is traditionally used for constant temperature control. However, the performance of this algorithm is not ideal under low temperature conditions. Although the temperature of the thermistor can slowly reach and maintain the set temperature, the temperature of the probe plastic is lower than the set value. This means that even if the thermistor inside the thermopile temperature sensor is in a constant temperature state, the actual temperature distribution of the entire probe module is still uneven. This uneven temperature distribution not only affects the accuracy of the measurement, but also limits the use of the ear thermometer in low temperature environments.

[0006] Therefore, how to solve the problem of the above-mentioned prior art that the heating effect of the probe plastic part is not ideal under certain environments and thus affects the measurement accuracy has become a topic to be studied and solved by the present invention. Summary of the invention

[0007] The object of the present invention is to provide a method and system for rapid probe heating and constant temperature control, an ear thermometer and a readable storage medium.

[0008] In order to achieve the above object, the technical solution adopted by the present invention is:

[0009] The method for rapid heating and constant temperature control of a probe comprises the following steps:

[0010] Get the ambient temperature;

[0011] Comparing the acquired ambient temperature with a preset temperature range;

[0012] Selecting different predetermined heating modes according to the comparison result, and selectively and rapidly heating the probe according to the predetermined heating times corresponding to the different predetermined heating modes;

[0013] Before the predetermined heating time is reached, the temperature of at least the temperature sensor in the probe approaches, is equal to or exceeds the preset temperature T;

[0014] After the predetermined heating time is reached, constant temperature control is performed so that the temperature of the temperature sensor is stabilized at the preset temperature T, and the temperature of the probe plastic part in the probe is close to or stabilized at the preset temperature T.

[0015] In the above scheme, the ambient temperature needs to be detected first, which facilitates targeted adjustments for different ambient temperatures.

[0016] After obtaining the ambient temperature information, compare it with the preset temperature range. The preset temperature range is set to two or more, and is set according to needs. There is no specific restriction here. By comparing with the preset temperature range, dynamic and flexible adjustments can be made according to the comparison results, which is suitable for heating and constant temperature control of the probe in different environments.

[0017] By rapidly heating the probe according to the predetermined heating time and the predetermined heating time, before the predetermined heating time, at least the temperature of the temperature sensor in the probe is close to, equal to or exceeds the preset temperature T (adjustable value, set according to the normal temperature of the human ear canal). Since the probe is initially rapidly heated rather than thermostatically controlled, the probe temperature rises rapidly. In the case of limited preheating time for the probe, it can first ensure that the temperature of the temperature sensor is appropriate after rapid preheating, and secondly, the temperature of the probe plastic part can be rapidly increased, so as to avoid the internal temperature of the temperature sensor being greatly affected by the low temperature of the probe plastic part, thereby reducing the thermal shock effect of the ear canal temperature on the internal temperature of the temperature sensor, and finally achieving the purpose of reducing or even avoiding measurement errors.

[0018] After the predetermined heating time is reached, constant temperature control is required. During this process, on the one hand, if the temperature of the temperature sensor exceeds the preset temperature T, the temperature sensor can be cooled down; on the other hand, if the temperature of the temperature sensor is lower than the preset temperature T, the temperature sensor can be heated; on the other hand, the temperature of the probe plastic part can be further increased. Through the above three settings, firstly, the temperature of the temperature sensor is stabilized at the preset temperature T, so as to improve the accuracy of the measurement results by reducing or avoiding the above thermal shock effects; secondly, the influence of the probe plastic part on the temperature of the temperature sensor is reduced, which is also for the purpose of improving the accuracy of the measurement results.

[0019] Through the combination of the above rapid preheating and constant temperature control, a better preheating effect of the probe can be achieved for different ambient temperatures without extending the preheating time. Specifically, when the temperature is low, the probe is first heated quickly while the preheating time remains unchanged, and then flexibly controlled according to the actual temperature of the probe to achieve the constant temperature target or approach the constant temperature target; in addition, rapid heating is an optional step rather than a necessary step. Whether it is implemented is determined according to the specific ambient temperature. In the case of high temperature, the rapid heating step is not set to avoid the probe temperature being too high after preheating and affecting the measurement result.

[0020] In a further embodiment, the preset temperature range includes a low temperature range, a medium temperature range and a high temperature range.

[0021] By making a more specific division of the preset temperature range, multiple comparison results can be obtained, and then dynamic and flexible adjustments can be made according to the comparison results, which is suitable for heating and constant temperature control of the probe in different environments.

[0022] In a further embodiment, the predetermined heating method includes a low-temperature heating method corresponding to the low-temperature range, a medium-temperature heating method corresponding to the medium-temperature range, and a high-temperature heating method corresponding to the high-temperature range.

[0023] For various heating methods, the heating steps of some heating methods are the same as a whole (such as low-temperature heating method and medium-temperature heating method), but there are differences in details (such as differences in predetermined heating times), while some heating methods involve fewer steps, achieving flexible and dynamic adjustment.

[0024] In a further embodiment, the low temperature heating method comprises:

[0025] Microcontroller in T L1 Outputting a full duty cycle within a time period, the heating resistor heats the probe so that the internal temperature of the temperature sensor quickly reaches a first standard temperature range W1;

[0026] The steps of the medium temperature heating method include:

[0027] The microcontroller is in T M1 A full duty cycle is output within the time period, and the heating resistor heats the probe so that the internal temperature of the temperature sensor quickly reaches the third standard temperature range W3.

[0028] In a low-temperature environment, the microcontroller outputs a full-duty cycle signal, and the heating resistor is driven by the full-duty cycle signal and the heating circuit to heat at full power, thereby achieving rapid heating of the probe. Generally, before the end of the rapid heating stage, the internal temperature of the temperature sensor has exceeded the preset temperature T, and the heating effect of the probe plastic is also ideal. The problem of insufficient heating is solved, reducing the temperature impact of the probe plastic on the temperature sensor.

[0029] In a medium temperature environment, the microcontroller outputs a full duty cycle signal, and the heating resistor is driven by the full duty cycle signal and the heating circuit to heat at full power, thereby achieving rapid heating of the probe. Generally, before the end of the rapid heating stage, the internal temperature of the temperature sensor may exceed the preset temperature T (or at least be close to the preset temperature T).

[0030] The main purpose of the first stage in the low-temperature heating method (i.e., the above-mentioned rapid heating stage) is to quickly allow the internal temperature of the temperature sensor to reach the first standard temperature range W1; the main purpose of the first stage in the medium-temperature heating method (i.e., the above-mentioned rapid heating stage) is to quickly allow the internal temperature of the temperature sensor to reach the third standard temperature range W3.

[0031] In a further embodiment, the low temperature heating method further comprises:

[0032] The microcontroller is in T L2 The output duty cycle is adjusted according to the PID temperature control algorithm during the time period, and the heating resistor continues to heat the probe so that the internal temperature of the temperature sensor gradually stabilizes at the preset temperature T, and the temperature of the probe plastic part gradually stabilizes at the second standard temperature range W2;

[0033] The steps of the medium temperature heating method also include:

[0034] The microcontroller is in T M2 The output duty cycle is adjusted according to the PID temperature control algorithm within the time period, and the heating resistor continues to heat the probe so that the internal temperature of the temperature sensor and the temperature of the probe plastic part are gradually stabilized at the preset temperature T;

[0035] The steps of the high temperature heating method include:

[0036] The microcontroller is in T H1The output duty cycle is adjusted according to the PID temperature control algorithm within a time period, and the heating resistor heats the probe so that the internal temperature of the temperature sensor and the temperature of the probe plastic part are gradually stabilized at the preset temperature T.

[0037] After the rapid heating stage is over, both the low temperature heating method and the medium temperature heating method implement the PID temperature control algorithm, as follows:

[0038] For low-temperature heating, the microcontroller turns off the full duty cycle signal, uses the PID temperature control algorithm and adjusts the duty cycle according to the algorithm. At this time, the probe is still heated, and the temperature sensor cools down when the full-power heating is stopped, and finally stabilizes at the preset temperature T;

[0039] For the medium temperature heating mode, the microcontroller turns off the full duty cycle signal, adopts the PID temperature control algorithm and adjusts the duty cycle according to the algorithm, so that the temperature sensor gradually stabilizes at the preset temperature T.

[0040] In a further solution, the first standard temperature range W1 satisfies: W1 ≥ T;

[0041] The second standard temperature range W2 satisfies: T-n1≤W2≤T;

[0042] The third standard temperature range W3 satisfies: T-n2≤W3≤T+n3;

[0043] The n1, the n2 and the n3 are all non-negative finite decimals or integers.

[0044] The first standard temperature range W1 satisfies: W1 ≥ T, which means that the internal temperature of the temperature sensor at least quickly reaches the preset temperature T, so as to avoid the internal temperature of the temperature sensor being stabilized at the preset temperature T due to a short subsequent heating time.

[0045] The second standard temperature range W2 satisfies: T-n1≤W2≤T, indicating that the temperature of the probe plastic gradually reaches an ideal range close to the preset temperature T, thereby avoiding that insufficient heating of the probe plastic affects the internal temperature of the temperature sensor and thus affects the accuracy of the measurement result.

[0046] The third standard temperature range W3 satisfies: T-n2≤W3≤T+n3, which means that the internal temperature of the temperature sensor at least quickly reaches a range close to the preset temperature T. Since the subsequent heating time is longer (compared to the low-temperature heating method), there is no restriction on the internal temperature of the temperature sensor to at least quickly reach the preset temperature T.

[0047] In a further embodiment, the T L1 With the T M1 Satisfaction: T L1 >T M1 .

[0048] Since the temperature corresponding to the low temperature range is lower than the temperature corresponding to the medium temperature range, in order to ensure that the internal temperature of the temperature sensor at least quickly reaches the preset temperature T, so as to avoid the internal temperature of the temperature sensor being affected by the short subsequent heating time and stabilizing at the preset temperature T, the predetermined heating time in the low temperature heating mode is set to be greater than the predetermined heating time in the medium temperature heating mode.

[0049] In a further embodiment, the steps of the PID temperature control algorithm include:

[0050] Assign values, including proportional coefficient Kp, integral coefficient Ki, differential coefficient Kd, preset temperature T and integral value PIDintegral;

[0051] Acquiring the internal temperature of the temperature sensor;

[0052] Calculating the difference PIDerr between the internal temperature of the temperature sensor and the preset temperature T;

[0053] Summing the difference PIDerr and the integral value PIDintegral;

[0054] Update the integral value PIDintegral according to the summation result;

[0055] Obtaining a control result value PIDresult according to the proportional coefficient Kp, the integral coefficient Ki, the differential coefficient Kd, the difference PIDerr and the integral value PIDintegral;

[0056] Adjusting the output duty cycle of the microcontroller according to the control result value PIDresult;

[0057] Update the last deviation value PIDerr_last.

[0058] Through the setting of PID temperature control algorithm, it can be used in conjunction with the rapid heating stage or used alone to achieve the purpose of gradually stabilizing the temperature sensor at the preset temperature T, and also achieve the purpose of continuously heating the probe plastic part.

[0059] In a further solution, the control result value PIDresult satisfies:

[0060] PIDresult=Kp*PIDerr+Ki*PIDintegral+Kd*(PIDerr-PIDerr_last).

[0061] The control result value PIDresult plays a key role in the constant temperature control stage. According to the control result value PIDresult, the output duty cycle of the microcontroller can be adjusted to promote the temperature sensor to gradually stabilize at the preset temperature T.

[0062] A probe rapid heating and constant temperature control system is also provided, which is used for the probe rapid heating and constant temperature control in the method described in any of the above embodiments; the probe rapid heating and constant temperature control system includes a heating resistor, a heating circuit, a microcontroller and a thermistor;

[0063] The heating resistor serves as a component for heating the probe;

[0064] The heating circuit is responsible for transmitting electrical energy to the heating resistor and controlling the power output of the heating resistor;

[0065] The microcontroller is used as a component for controlling the on / off or power output of the heating resistor;

[0066] The thermistor serves as a component for transmitting internal temperature information of the temperature sensor to the microcontroller.

[0067] The heating resistor, heating circuit, microcontroller and thermistor cooperate to realize dynamic and flexible heating of the probe. The specific functions of the four structures refer to the above description.

[0068] An ear thermometer is also provided herein, comprising a housing and a probe rapid heating and constant temperature control system as described in the above embodiment installed on the housing.

[0069] The rapid heating and constant temperature control system of the probe is applied to the ear thermometer to improve the measurement accuracy of the ear thermometer, as follows:

[0070] In a low-temperature environment, the ear canal temperature is higher than that of an unheated ear thermometer probe. When the ear thermometer probe goes deep into the ear canal, the cold end of the thermopile temperature sensor will be severely affected by the hot ear canal temperature. This thermal shock will cause deviations in the collected thermopile temperature sensor data.

[0071] Under the action of rapid probe heating and constant temperature control system, after the ear thermometer is turned on, the entire probe module (thermopile temperature sensor and probe plastic parts) is first heated, so that it is quickly heated to a temperature close to the ear canal temperature. Before measurement, the heated probe module can effectively reduce the impact of the ear canal temperature on the thermopile temperature sensor.

[0072] In a further solution, the ear thermometer also includes a copper cap, a ceramic substrate and a thermopile;

[0073] The ceramic substrate is disposed in the housing;

[0074] The heating resistor is embedded in the ceramic substrate;

[0075] The thermistor and the thermopile are welded on the surface of the ceramic substrate;

[0076] The copper cap is arranged on the ceramic substrate and covers the thermistor and the thermopile.

[0077] In this embodiment, the heating resistor, the thermistor, the copper cap, the ceramic substrate and the thermopile form a temperature sensor;

[0078] The ear thermometer also includes a probe plastic part, and the probe plastic part and the temperature sensor form a probe module.

[0079] The ear thermometer includes the above structures, and the combination of these structures facilitates the ear thermometer to achieve temperature measurement.

[0080] It takes time for the heating resistor to heat to the preset temperature T and for the entire probe module to heat to the preset temperature T. The part closer to the heating resistor will reach the preset temperature T faster, and the probe plastic is the slowest to reach the preset temperature T. Often, the thermopile temperature sensor reaches the preset temperature T, but the probe plastic has not yet reached the preset temperature T. The measurement and acquisition process turns off the heating control, and the probe plastic is not heated sufficiently and is still at a low temperature, which will also lower the temperature of the thermopile temperature sensor, produce a thermal shock response, and cause measurement errors. The lower the ambient temperature, the more obvious the measurement error phenomenon. This problem can be solved by setting the rapid heating stage of the probe.

[0081] A readable storage medium is also provided herein, on which a control program is stored. When the control program is executed by a processor, the processor executes the steps of the method described in any of the above embodiments.

[0082] Since the control program is stored on a readable storage medium, it can be easily modified, updated or replaced, which means that when the above method is improved or needs to be adapted to a new application scenario, only the control program needs to be adjusted accordingly without making large-scale changes to the hardware.

[0083] The readable storage medium and the control program thereon can be easily transplanted from one processor or system to another processor or system, which enables the above method to be widely used on different hardware platforms and improves its versatility and applicability.

[0084] The terms “first”, “second”, etc. used in this document do not specifically refer to an order or sequence, nor are they used to limit the present case. They are only used to distinguish components or operations described with the same technical terms.

[0085] As used herein, “connected” or “positioned” may refer to two or more components or devices being in direct physical contact with each other, or being in indirect physical contact with each other, or may refer to two or more components or devices operating or moving with each other.

[0086] The terms “include,” “including,” “have,” etc. used in this document are open-ended terms, meaning including but not limited to.

[0087] The terms used herein generally have the ordinary meanings of each term used in the art, in the context of the present invention, and in the specific context, unless otherwise noted. Certain terms used to describe the present invention will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art regarding the description of the present invention.

[0088] The terms "front", "back", "up", "down", "left", "right", etc. used in this article are all directional terms. In this case, they are only used to illustrate the positional relationship between the various structures, and are not used to limit the protection plan of this case and the specific direction during actual implementation.

[0089] The working principle and advantages of the present invention are as follows: obtaining the ambient temperature; comparing the obtained ambient temperature with a preset temperature range; selecting different preset heating methods according to the comparison results, and selectively and quickly heating the probe according to the preset heating times corresponding to the different preset heating methods; before the preset heating time is reached, at least the temperature of the temperature sensor in the probe is close to, equal to or exceeds the preset temperature T; after the preset heating time is reached, constant temperature control is performed so that the temperature of the temperature sensor is stabilized at the preset temperature T, and the temperature of the probe plastic part in the probe is close to or stabilized at the preset temperature T. Through the above settings, a better preheating effect of the probe can be achieved for different ambient temperatures, and there is no need to extend the preheating time. Specifically, when the temperature is low, the probe is first quickly heated while the preheating time remains unchanged, and then flexibly controlled according to the actual temperature of the probe to achieve the constant temperature target or get closer to the constant temperature target, so as to achieve the temperature of the temperature sensor to be stable at the preset temperature T, so as to improve the accuracy of the measurement result by reducing or avoiding the influence of thermal shock, and at the same time achieve the purpose of reducing the influence of the probe plastic parts on the temperature of the temperature sensor, so as to improve the accuracy of the measurement result; in addition, rapid heating is an optional step rather than a necessary step. Whether to implement it is determined according to the specific ambient temperature. For high temperature conditions, the rapid heating step is not set to avoid the probe temperature being too high after preheating and affecting the measurement result. BRIEF DESCRIPTION OF THE DRAWINGS

[0090] Attached Figure 1 This is a flow chart of a method for rapid heating and constant temperature control of a probe according to an embodiment of the present invention;

[0091] Attached Figure 2This is a flow chart of the PID temperature control algorithm of an embodiment of the present invention;

[0092] Attached Figure 3 This is a schematic diagram of the structure of an ear thermometer according to an embodiment of the present invention;

[0093] Attached Figure 4 For the embodiment of the present invention Figure 3 Enlarged view of point A in the middle;

[0094] Attached Figure 5 It is a schematic diagram of the structure of the temperature sensor according to an embodiment of the present invention;

[0095] Attached Figure 6 This is one of the partial structural schematic diagrams of the temperature sensor according to the embodiment of the present invention;

[0096] Attached Figure 7 This is the second schematic diagram of the partial structure of the temperature sensor according to the embodiment of the present invention.

[0097] In the above figures: 1. Shell; 2. Heating resistor; 3. Heating circuit; 4. Microcontroller; 5. Thermistor; 6. Copper cap; 7. Ceramic substrate; 8. Thermopile; 9. Probe plastic part; 10. Temperature sensor. DETAILED DESCRIPTION

[0098] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

[0099] Embodiment: The present invention will be clearly described below with diagrams and detailed descriptions. After understanding the embodiments of the present invention, any person skilled in the art can make changes and modifications based on the techniques taught by the present invention without departing from the spirit and scope of the present invention.

[0100] The terms used herein are only for describing specific embodiments and are not intended to be limiting of the present invention. Singular forms such as "a", "this", "here", "this" and "the" as used herein also include plural forms.

[0101] See attached Figure 1 -Attached Figure 7 , a method for rapid heating and constant temperature control of a probe, comprising the following steps:

[0102] Get the ambient temperature;

[0103] Comparing the acquired ambient temperature with a preset temperature range;

[0104] Selecting different predetermined heating modes according to the comparison result, and selectively and rapidly heating the probe according to the predetermined heating times corresponding to the different predetermined heating modes;

[0105] Before reaching the predetermined heating time, the temperature of at least the temperature sensor 10 in the probe approaches, is equal to or exceeds the preset temperature T;

[0106] After the predetermined heating time is reached, constant temperature control is performed so that the temperature of the temperature sensor 10 is stabilized at the preset temperature T, and the temperature of the probe plastic part 9 in the probe is close to or stabilized at the preset temperature T.

[0107] According to the above steps, the ambient temperature needs to be detected first. For example, the ear thermometer is usually used indoors, and the indoor temperature needs to be detected. By detecting the ambient temperature, it is convenient to make targeted adjustments for different ambient temperatures.

[0108] After obtaining the ambient temperature information, compare it with the preset temperature range. The preset temperature range is set to two or more, and is set according to needs. There is no specific restriction here. By comparing with the preset temperature range, dynamic and flexible adjustments can be made according to the comparison results, which is suitable for heating and constant temperature control of the probe in different environments.

[0109] The comparison result can be obtained by comparing with the preset temperature range. It should be noted here that the comparison result will be obtained by comparing with the preset temperature range, that is, the ambient temperature will be determined to be in a certain temperature range. The instructions mentioned below are also emphasized here. Even if the subsequent temperature range is limited, for example, the lowest is only mentioned to be zero degrees, but in some areas it will reach minus ten degrees (not considering the use of indoor heating, etc.), this does not mean that the comparison result cannot be obtained in an environment of zero degrees and ten degrees. The zero degree setting is just an example, and the preset temperature range can be adjusted according to actual conditions.

[0110] After the comparison result is obtained, the probe is selectively and quickly heated according to the predetermined heating method and the predetermined heating time. For example, there are two preset temperature ranges, but rapid heating is required only when one of the preset temperature ranges is reached. At this time, the predetermined heating method and the predetermined heating time are set to single.

[0111] By rapidly heating the probe according to the predetermined heating time and the predetermined heating time, before the predetermined heating time, at least the temperature of the temperature sensor 10 in the probe is close to, equal to or exceeds the preset temperature T (adjustable value, set according to the normal temperature of the human ear canal), and no requirement is made for the temperature of the probe plastic part 9. Since the probe is initially rapidly heated rather than thermostatically controlled, the probe temperature rises rapidly. In the case of limited preheating time of the probe, it is possible to first ensure that the temperature sensor 10 (also known as the thermopile 8 temperature sensor 10) is at an appropriate temperature after preheating, and secondly to increase the temperature of the probe plastic part 9, so as to avoid the internal temperature of the temperature sensor 10 being greatly affected by the lower temperature of the probe plastic part 9, thereby reducing the thermal shock effect of the ear canal temperature on the internal temperature of the temperature sensor 10, and finally achieving the purpose of reducing or even avoiding measurement errors.

[0112] After the predetermined heating time is reached, constant temperature control is required. During this process, on the one hand, if the temperature of the temperature sensor 10 exceeds the preset temperature T, the temperature sensor 10 can be cooled down; on the other hand, if the temperature of the temperature sensor 10 is lower than the preset temperature T, the temperature sensor 10 can be heated; on the other hand, the temperature of the probe plastic part 9 can be further increased. Through the above three aspects of the setting, firstly, the temperature of the temperature sensor 10 is stabilized at the preset temperature T, so as to improve the accuracy of the measurement result by reducing or avoiding the above thermal shock effect, and secondly, the influence of the probe plastic part 9 on the temperature of the temperature sensor 10 is reduced, which is also for the purpose of improving the accuracy of the measurement result.

[0113] Through the settings in this embodiment, a better preheating effect of the probe can be achieved for different ambient temperatures without extending the preheating time. Specifically, when the temperature is low, the probe is first quickly heated while the preheating time remains unchanged, and then flexibly controlled according to the actual temperature of the probe to achieve a constant temperature target or approach the constant temperature target; in addition, rapid heating is an optional step rather than a necessary step. Whether to implement it is determined based on the specific ambient temperature. For high temperature conditions, the rapid heating step is not set to avoid excessively high probe temperature after preheating and affecting the measurement results.

[0114] In this embodiment, the preset temperature range includes a low temperature range, a medium temperature range and a high temperature range.

[0115] It should be noted that the above three temperature ranges cannot be understood literally. Taking the low temperature range as an example, the conventional understanding may be that temperatures below ten degrees or even below five degrees are considered low temperatures, but this low temperature is a setting made based on measurement experience and measurement research, and is an adjustable value. This low temperature range can be 20 to 25 degrees or 0 to 20 degrees. It is only used as an example to facilitate understanding, and does not represent a restricted range. The low temperature range can also be called the low-medium temperature range, which is not restricted here.

[0116] By making a more specific division of the preset temperature range, multiple comparison results can be obtained, and then dynamic and flexible adjustments can be made according to the comparison results, which is suitable for heating and constant temperature control of the probe in different environments.

[0117] In this embodiment, the predetermined heating method includes a low-temperature heating method corresponding to the low-temperature range, a medium-temperature heating method corresponding to the medium-temperature range, and a high-temperature heating method corresponding to the high-temperature range.

[0118] The working environment temperature of the ear thermometer can be divided into: low temperature, 10-20°; medium temperature, 20-30°; high temperature, 30-40°, but not limited to this.

[0119] Different predetermined heating methods are proposed corresponding to different temperature ranges, specifically, a low-temperature heating method corresponding to the low-temperature range, a medium-temperature heating method corresponding to the medium-temperature range, and a high-temperature heating method corresponding to the high-temperature range.

[0120] For various heating methods, the heating steps of some heating methods are the same as a whole (such as low-temperature heating method and medium-temperature heating method), but there are differences in details (such as differences in predetermined heating times), while some heating methods involve fewer steps, achieving flexible and dynamic adjustment.

[0121] In this embodiment, the steps of the low temperature heating method include:

[0122] Microcontroller 4 in T L1 The full duty cycle is output within the time period, and the heating resistor 2 heats the probe so that the internal temperature of the temperature sensor 10 quickly reaches the first standard temperature range W1;

[0123] The steps of the medium temperature heating method include:

[0124] The microcontroller 4 is at T M1 The full duty cycle is output within the time period, and the heating resistor 2 heats the probe so that the internal temperature of the temperature sensor 10 quickly reaches the third standard temperature range W3.

[0125] In a low temperature environment, the microcontroller 4 outputs a full duty cycle signal, and the heating resistor 2 is driven by the full duty cycle signal and the heating circuit 3 to heat at full power, thereby achieving rapid heating of the probe. Generally, before the end of the rapid heating stage, the internal temperature of the temperature sensor 10 has exceeded the preset temperature T, and the heating effect of the probe plastic part 9 is also relatively ideal. The problem of insufficient heating is solved, thereby reducing the temperature impact of the probe plastic part 9 on the temperature sensor 10.

[0126] In a medium temperature environment, the microcontroller 4 outputs a full duty cycle signal, and the heating resistor 2 is driven by the full duty cycle signal and the heating circuit 3 to heat at full power to achieve rapid heating of the probe; generally, before the end of the rapid heating stage, the internal temperature of the temperature sensor 10 is likely to exceed the preset temperature T (at least close to the preset temperature T).

[0127] Since the conditions of low temperature, medium temperature and high temperature are different, the preset heating time in the low temperature heating mode and the medium temperature heating mode is different, and the preset heating time is not set for the high temperature heating mode.

[0128] The main purpose of the first stage in the low-temperature heating method (i.e., the above-mentioned rapid heating stage) is to quickly allow the internal temperature of the temperature sensor 10 to reach the first standard temperature range W1; the main purpose of the first stage in the medium-temperature heating method (i.e., the above-mentioned rapid heating stage) is to quickly allow the internal temperature of the temperature sensor 10 to reach the third standard temperature range W3.

[0129] The first target temperature range W1 and the third target temperature range W3 may overlap or only involve a common range.

[0130] In this embodiment, the low temperature heating method further comprises:

[0131] The microcontroller 4 is at T L2 The output duty cycle is adjusted according to the PID temperature control algorithm during the time period, and the heating resistor 2 continues to heat the probe so that the internal temperature of the temperature sensor 10 gradually stabilizes at the preset temperature T, and the temperature of the probe plastic part 9 gradually stabilizes at the second standard temperature range W2;

[0132] The steps of the medium temperature heating method also include:

[0133] The microcontroller 4 is at T M2 The output duty cycle is adjusted according to the PID temperature control algorithm during the time period, and the heating resistor 2 continues to heat the probe so that the internal temperature of the temperature sensor 10 and the temperature of the probe plastic part 9 are gradually stabilized at the preset temperature T;

[0134] The steps of the high temperature heating method include:

[0135] The microcontroller 4 is at TH1 The output duty cycle is adjusted according to the PID temperature control algorithm within a time period, and the heating resistor 2 heats the probe so that the internal temperature of the temperature sensor 10 and the temperature of the probe plastic part 9 are gradually stabilized at the preset temperature T.

[0136] After the rapid heating stage is over, both the low temperature heating method and the medium temperature heating method implement the PID temperature control algorithm, as follows:

[0137] For low temperature heating, the microcontroller 4 turns off the full duty cycle signal, adopts the PID temperature control algorithm and adjusts the duty cycle according to the algorithm. At this time, the probe is still heated, and the temperature sensor 10 cools down in the state of stopping full power heating, and finally stabilizes at the preset temperature T;

[0138] For the medium temperature heating mode, the microcontroller 4 turns off the full duty cycle signal, adopts the PID temperature control algorithm and adjusts the duty cycle according to the algorithm, so that the temperature sensor 10 gradually stabilizes at the preset temperature T.

[0139] The high temperature heating method does not have a rapid heating stage. Since the temperature in the high temperature range is close to the preset temperature T, the microcontroller 4 does not output a full duty cycle signal. Instead, a PID temperature control algorithm is directly used to adjust the duty cycle according to the algorithm so that the temperature sensor 10 gradually stabilizes at the preset temperature T.

[0140] It should be emphasized that the above three heating methods can all achieve the temperature sensor 10 finally stabilizing at the preset temperature T, while the probe plastic part 9 may be difficult to reach the preset temperature T during the preheating stage under the heating treatment of the low-temperature heating method, which is an expected and acceptable result.

[0141] In this embodiment, the first standard temperature range W1 satisfies: W1 ≥ T;

[0142] The second standard temperature range W2 satisfies: T-n1≤W2≤T;

[0143] The third standard temperature range W3 satisfies: T-n2≤W3≤T+n3;

[0144] The n1, the n2 and the n3 are all non-negative finite decimals or integers.

[0145] n1, n2 and n3 can be set to values ​​such as 3, 5, 10, etc., and there is no limitation here.

[0146] The first standard temperature range W1 satisfies: W1 ≥ T, indicating that the internal temperature of the temperature sensor 10 at least quickly reaches the preset temperature T, thereby preventing the internal temperature of the temperature sensor 10 from being stabilized at the preset temperature T due to a short subsequent heating time.

[0147] The second standard temperature range W2 satisfies: T-n1≤W2≤T, indicating that the temperature of the probe plastic part 9 gradually reaches an ideal range close to the preset temperature T, avoiding that insufficient heating of the probe plastic part 9 affects the internal temperature of the temperature sensor 10 and thus affects the accuracy of the measurement result.

[0148] The third standard temperature range W3 satisfies: T-n2≤W3≤T+n3, which means that the internal temperature of the temperature sensor 10 at least quickly reaches a range close to the preset temperature T. Since the subsequent heating time is longer (compared to the low-temperature heating method), there is no restriction on the internal temperature of the temperature sensor 10 to at least quickly reach the preset temperature T.

[0149] In this embodiment, the T L1 With the T M1 Satisfaction: T L1 >T M1 .

[0150] Since the temperature corresponding to the low temperature range is lower than the temperature corresponding to the medium temperature range, in order to ensure that the internal temperature of the temperature sensor 10 at least quickly reaches the preset temperature T, so as to avoid the internal temperature of the temperature sensor 10 being affected by the short subsequent heating time and stabilizing at the preset temperature T, the predetermined heating time in the low temperature heating mode is set to be greater than the predetermined heating time in the medium temperature heating mode.

[0151] In this embodiment, the steps of the PID temperature control algorithm include:

[0152] Assign values, including proportional coefficient Kp, integral coefficient Ki, differential coefficient Kd, preset temperature T and integral value PIDintegral;

[0153] Acquiring the internal temperature of the temperature sensor 10;

[0154] Calculating the difference PIDerr between the internal temperature of the temperature sensor 10 and the preset temperature T;

[0155] Summing the difference PIDerr and the integral value PIDintegral;

[0156] Update the integral value PIDintegral according to the summation result;

[0157] Obtaining a control result value PIDresult according to the proportional coefficient Kp, the integral coefficient Ki, the differential coefficient Kd, the difference PIDerr and the integral value PIDintegral;

[0158] Adjusting the output duty cycle of the microcontroller 4 according to the control result value PIDresult;

[0159] Update the last deviation value PIDerr_last.

[0160] It should be noted that according to the PID control principle, the basic components of the PID controller include proportional (P), integral (I) and differential (D). In the following formula: e(t) is the error at the current moment, Kp is the proportional gain, Ki is the integral gain, is the accumulated error from system startup to the present moment, Kd is the differential gain, de(t)dt is the rate of change of the error, and u(t) is the total output of the controller.

[0161] The PID algorithm is as follows:

[0162]

[0163] The present application adopts a PID temperature control algorithm, and the steps are as above. The key is to obtain the control result value PIDresult according to the proportional coefficient Kp, the integral coefficient Ki, the differential coefficient Kd, the difference PIDerr and the integral value PIDintegral, and then adjust the output duty cycle of the microcontroller 4 according to the control result value PIDresult, so that the temperature sensor 10 gradually stabilizes at the preset temperature T.

[0164] Regarding the last deviation value PIDerr_last, it is explained here that initially there is only one difference value PIDerr (set as the first difference value), and then a second difference value PIDerr (set as the second difference value) appears. At this time, the first difference value is used as the last deviation value PIDerr_last, and so on.

[0165] By setting the PID temperature control algorithm, in conjunction with the rapid heating stage or used alone, the temperature sensor 10 is gradually stabilized at the preset temperature T, and the probe plastic part 9 is continuously heated.

[0166] In this embodiment, the control result value PIDresult satisfies:

[0167] PIDresult=Kp*PIDerr+Ki*PIDintegral+Kd*(PIDerr-PIDerr_last).

[0168] The above PID temperature control algorithm is summarized as follows:

[0169] System initialization;

[0170] Assign PID value;

[0171] Set the target temperature (preset temperature T), obtain the actual probe temperature and get the difference between the two;

[0172] The difference is integrated and summed;

[0173] P(out) = proportional coefficient * difference, I(out) = integral coefficient * difference integral sum, D(out) = differential coefficient * (difference - last difference), update the last difference;

[0174] Get a new duty cycle value = P(out) + I(out) + D(out), corresponding to the above control result value PIDresult;

[0175] The microcontroller 4 adjusts the duty cycle of the square wave according to the new duty cycle value, and acts on the heating circuit 3 .

[0176] A probe rapid heating and constant temperature control system is also provided, which is used for the probe rapid heating and constant temperature control in the method described in any of the above embodiments; the probe rapid heating and constant temperature control system comprises a heating resistor 2, a heating circuit 3, a microcontroller 4 and a thermistor 5;

[0177] The heating resistor 2 is used as a component for heating the probe;

[0178] The heating circuit 3 is responsible for transmitting electrical energy to the heating resistor 2 and controlling the power output of the heating resistor 2;

[0179] The microcontroller 4 is used as a component to control the on / off or power output of the heating resistor 2;

[0180] The thermistor 5 serves as a component for transmitting internal temperature information of the temperature sensor 10 to the microcontroller 4 .

[0181] The heating resistor 2, the heating circuit 3, the microcontroller 4 and the thermistor 5 cooperate to realize dynamic and flexible heating of the probe. The specific functions of the four structures refer to the above description.

[0182] An ear thermometer is also provided herein, comprising a housing 1 and a probe rapid heating and constant temperature control system as described in the above embodiment installed on the housing 1 .

[0183] The rapid heating and constant temperature control system of the probe is applied to the ear thermometer to improve the measurement accuracy of the ear thermometer, as follows:

[0184] In a low temperature environment, the ear canal temperature is higher than the temperature of an unheated ear thermometer probe. When the ear thermometer probe goes deep into the ear canal, the cold end of the thermopile 8 temperature sensor 10 will be severely affected by the hot ear canal temperature. This thermal shock will cause the collected thermopile 8 temperature sensor 10 data to be biased.

[0185] Under the action of the rapid heating and constant temperature control system of the probe, after the ear thermometer is turned on, the entire probe module (thermopile 8 temperature sensor 10 and probe plastic part 9) is first heated to quickly heat it to a temperature close to the ear canal temperature. Before measurement, the heated probe module can effectively reduce the influence of the ear canal temperature on the thermopile 8 temperature sensor 10.

[0186] In this embodiment, the ear thermometer further includes a copper cap 6, a ceramic substrate 7 and a thermopile 8;

[0187] The ceramic substrate 7 is disposed in the housing 1;

[0188] The heating resistor 2 is embedded in the ceramic substrate 7;

[0189] The thermistor 5 and the thermopile 8 are welded on the surface of the ceramic substrate 7;

[0190] The copper cap 6 is disposed on the ceramic substrate 7 and covers the thermistor 5 and the thermopile 8 .

[0191] In this embodiment, the heating resistor 2, the thermistor 5, the copper cap 6, the ceramic substrate 7 and the thermopile 8 form a temperature sensor 10;

[0192] The ear thermometer further comprises a probe plastic part 9 , and the probe plastic part 9 and the temperature sensor 10 form a probe module.

[0193] The above two embodiments are described as a whole here. The heating resistor 2 is embedded in the ceramic substrate 7, and the thermistor 5, the thermopile 8 and other electronic components are welded on the surface of the ceramic substrate 7. The copper cap 6 covers the thermistor 5 and the thermopile 8 on the surface of the ceramic substrate 7. The whole composed of these components constitutes the thermopile 8 temperature sensor 10. The copper cap 6 of the thermopile 8 temperature sensor 10 has threads on the outside and is pressed onto the ribs inside the probe plastic part 9 to form the entire probe module. The heat generated by the heating resistor 2 is first conducted to the ceramic substrate 7, and the electronic components on the ceramic substrate 7 are also heated, and the copper cap 6 covering the ceramic substrate 7 is also heated.

[0194] The power lines and signal lines of the heating resistor 2, thermistor 5, and thermopile 8 are connected to the hardware mainboard (the hardware mainboard includes a microcontroller 4 and a heating circuit 3) in the form of an FPC soft row. The microcontroller 4 on the hardware mainboard generates a square wave signal with a duty cycle to control the heating circuit 3, so that the heating resistor 2 is heated, thereby heating the entire probe module. The microcontroller 4 converts the signal of the thermistor 5 to obtain the temperature of the probe module, runs the rapid heating and constant temperature control algorithm of the probe, adjusts and changes the duty cycle square wave signal, thereby controlling and adjusting the temperature of the probe module, so that it quickly heats up to a temperature close to the ear canal and keeps the temperature stable.

[0195] It takes time for the heating resistor 2 to heat to the preset temperature T and for the entire probe module to heat to the preset temperature T. The part closer to the heating resistor 2 will reach the preset temperature T faster, and the probe plastic part 9 is the slowest to reach the preset temperature T. Often, the thermopile 8 temperature sensor 10 reaches the preset temperature T, but the probe plastic part 9 has not yet reached the preset temperature T. The measurement and acquisition process turns off the heating control, and the probe plastic part 9 is still at a low temperature due to insufficient heating, which will also lower the temperature of the thermopile 8 temperature sensor 10, generating a thermal shock response and causing measurement errors. The lower the ambient temperature, the more obvious the measurement error phenomenon. This problem is solved by setting up a rapid heating stage for the probe.

[0196] A readable storage medium is also provided herein, on which a control program is stored. When the control program is executed by a processor, the processor executes the steps of the method described in any of the above embodiments.

[0197] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for rapid heating and constant temperature control of a probe, characterized in that: Get the ambient temperature; Comparing the acquired ambient temperature with a preset temperature range; Selecting different predetermined heating modes according to the comparison result, and selectively and rapidly heating the probe according to the predetermined heating times corresponding to the different predetermined heating modes; Before the predetermined heating time is reached, the temperature of at least the temperature sensor (10) in the probe approaches, is equal to, or exceeds a preset temperature T; After the predetermined heating time is reached, constant temperature control is performed so that the temperature of the temperature sensor (10) is stabilized at the preset temperature T, and the temperature of the probe plastic part (9) in the probe is close to or stabilized at the preset temperature T.

2. The method for rapid probe heating and constant temperature control according to claim 1, characterized in that: The preset temperature range includes a low temperature range, a medium temperature range and a high temperature range.

3. The method for rapid probe heating and constant temperature control according to claim 2, characterized in that: The predetermined heating method includes a low-temperature heating method corresponding to the low-temperature range, a medium-temperature heating method corresponding to the medium-temperature range, and a high-temperature heating method corresponding to the high-temperature range.

4. The method for rapid probe heating and constant temperature control according to claim 3, characterized in that: The steps of the low temperature heating method include: The microcontroller (4) outputs a full duty cycle within a time period TL1, and the heating resistor (2) heats the probe so that the internal temperature of the temperature sensor (10) quickly reaches a first standard temperature range W1; The steps of the medium temperature heating method include: The microcontroller (4) outputs a full duty cycle in the TM1 time period, and the heating resistor (2) heats the probe so that the internal temperature of the temperature sensor (10) quickly reaches the third standard temperature range W3.

5. The method for rapid probe heating and constant temperature control according to claim 4, characterized in that: The steps of the low temperature heating method also include: The microcontroller (4) adjusts the output duty cycle according to the PID temperature control algorithm within the TL2 time period, and the heating resistor (2) continues to heat the probe so that the internal temperature of the temperature sensor (10) gradually stabilizes at the preset temperature T, and the temperature of the probe plastic part (9) gradually stabilizes at the second standard temperature range W2; The steps of the medium temperature heating method also include: The microcontroller (4) adjusts the output duty cycle according to the PID temperature control algorithm within the TM2 time period, and the heating resistor (2) continues to heat the probe so that the internal temperature of the temperature sensor (10) and the temperature of the probe plastic part (9) gradually stabilize at the preset temperature T; The steps of the high temperature heating method include: The microcontroller (4) adjusts the output duty cycle according to the PID temperature control algorithm within the TH1 time period, and the heating resistor (2) heats the probe so that the internal temperature of the temperature sensor (10) and the temperature of the probe plastic part (9) gradually stabilize at the preset temperature T.

6. The method for rapid probe heating and constant temperature control according to claim 5, characterized in that: The first standard temperature range W1 satisfies: W1 ≥ T; The second standard temperature range W2 satisfies: T-n1≤W2≤T; The third standard temperature range W3 satisfies: T-n2≤W3≤T+n3; The n1, the n2 and the n3 are all non-negative finite decimals or integers.

7. The method for rapid probe heating and constant temperature control according to claim 5, characterized in that: The TL1 and the TM1 satisfy: TL1>TM1.

8. The method for rapid probe heating and constant temperature control according to any one of claims 1 to 7, characterized in that: The steps of the PID temperature control algorithm include: Assign values, including proportional coefficient Kp, integral coefficient Ki, differential coefficient Kd, preset temperature T and integral value PIDintegral; Acquiring the internal temperature of the temperature sensor (10); Calculating a difference PIDerr between the internal temperature of the temperature sensor (10) and the preset temperature T; Summing the difference PIDerr and the integral value PIDintegral; Update the integral value PIDintegral according to the summation result; Obtaining a control result value PIDresult according to the proportional coefficient Kp, the integral coefficient Ki, the differential coefficient Kd, the difference PIDerr and the integral value PIDintegral; adjusting the output duty cycle of the microcontroller (4) according to the control result value PIDresult; Update the last deviation value PIDerr_last.

9. The method for rapid probe heating and constant temperature control according to claim 8, characterized in that: The control result value PIDresult satisfies: PIDresult=Kp*PIDerr+ Ki *PIDintegral+Kd*(PIDerr-PIDerr_last).

10. A probe rapid heating and constant temperature control system, used for the probe rapid heating and constant temperature control in the method according to any one of claims 1 to 9, characterized in that: The probe rapid heating and constant temperature control system comprises a heating resistor (2), a heating circuit (3), a microcontroller (4) and a thermistor (5); The heating resistor (2) serves as a component for heating the probe; The heating circuit (3) is responsible for transmitting electrical energy to the heating resistor (2) and controlling the power output of the heating resistor (2); The microcontroller (4) is used as a component for controlling the on / off state or power output of the heating resistor (2); The thermistor (5) serves as a component for transmitting internal temperature information of the temperature sensor (10) to the microcontroller (4).

11. An ear thermometer, characterized in that: The ear thermometer comprises a housing (1) and a probe rapid heating and constant temperature control system as claimed in claim 10 mounted on the housing (1).

12. The ear thermometer according to claim 11, characterized in that: The ear thermometer also includes a copper cap (6), a ceramic substrate (7) and a thermopile (8); The ceramic substrate (7) is arranged in the housing (1); The heating resistor (2) is embedded in the ceramic substrate (7); The thermistor (5) and the thermopile (8) are welded on the surface of the ceramic substrate (7); The copper cap (6) is arranged on the ceramic substrate (7) and covers the thermistor (5) and the thermopile (8).

13. The ear thermometer according to claim 12, characterized in that: The heating resistor (2), the thermistor (5), the copper cap (6), the ceramic substrate (7) and the thermopile (8) form a temperature sensor (10); The ear thermometer also includes a probe plastic part (9), and the probe plastic part (9) and the temperature sensor (10) form a probe module.

14. A readable storage medium, characterized in that: The readable storage medium stores a control program, and when the control program is executed by a processor, the processor executes the steps of the method according to any one of claims 1 to 9.

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