Coil component

By designing multi-layer support members in the coil assembly to separate the current and heat dissipation paths, the problem of low reliability of the coil assembly in high temperature environments is solved, and the Itemp characteristics are significantly improved.

CN119833288APending Publication Date: 2025-04-15SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information

Application Number
CN202411422940.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-10-13
Filing Date
2024-10-12
Publication Date
2025-04-15

AI Technical Summary

Technical Problem

The existing coil components have low reliability in high temperature environments and are difficult to effectively dissipate heat, resulting in poor Itemp characteristics.

Method used

A coil assembly is designed, which includes a body, a support member and a coil. The support member consists of two layers, the first layer is used to dissipate internal heat, the second layer directly supports the coil, and separates the path through which current flows and the heat dissipation path through a specific structure to improve heat dissipation efficiency.

Benefits of technology

By improving the heat dissipation structure, the high temperature reliability of the coil assembly is improved and the Itemp characteristics related to the high temperature are improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a coil assembly. The coil component includes: a body including a first surface, a second surface opposite to the first surface in a first direction, and a plurality of side surfaces connecting the first surface to the second surface; a support member disposed within the body and having a through hole, the coil disposed on at least one surface of the support member, in which the support member includes a first layer, a second layer disposed on both surfaces of the first layer and contacting the coil, and a third layer disposed on both surfaces of the second layer and contacting the coil, both ends of the coil extend to two side surfaces of the main body opposite to each other in a second direction, respectively, and the first layer extends to one of two side surfaces of the main body opposite to each other in a third direction.
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Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0136419 filed on October 13, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a coil assembly. Background Art

[0003] An inductor (coil component) is a representative passive electronic component used in electronic devices together with a resistor and a capacitor.

[0004] As electronic devices have achieved high performance and have been miniaturized, the number of electronic components used in the electronic devices has also increased and become miniaturized.

[0005] Recently, due to the popularization of electric vehicles, the demand for electronic device products used for electrical components of vehicles has increased. Therefore, there is a need for higher reliability compared to IT devices, and there is a need for products that can improve I temp Characteristics (temperature characteristics) of inductors. Summary of the invention

[0006] One aspect of the present disclosure is to improve I2C related to high temperature reliability by easily dissipating heat generated inside a coil assembly. temp characteristic.

[0007] According to one aspect of the present disclosure, a coil component includes: a main body, including a first surface and a second surface opposite to each other in a first direction and a plurality of side surfaces connecting the first surface to the second surface, the plurality of side surfaces including the first side surface and the second side surface opposite to each other in the second direction, and a third side surface and a fourth side surface opposite to each other in a third direction; a support member, arranged in the main body and having a through hole; and a coil, arranged on at least one surface of the support member, the coil including a first end extending to the first side surface, and a second end extending to the second side surface, wherein the support member includes a first layer and a second layer arranged on two surfaces of the first layer and contacting the coil, and the first layer extends to at least one of the third side surface and the fourth side surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view schematically showing a coil component according to a first exemplary embodiment of the present disclosure; Figure 2 It is schematically shown Figure 1 An exploded perspective view of the support member and the coil; Figure 3 yes Figure 1 A top view of the coil assembly in FIG. Figure 4 yes Figure 3 The coil assembly in the figure does not have a top view of the coil; Figure 5 is along Figure 1 A cross-sectional view taken along line II' in FIG. Figure 6 is along Figure 1 A cross-sectional view taken along line II-II'; 7A to 7F Each shows an example of the first layer of the present disclosure; Figure 8 is a perspective view schematically showing a coil component according to a second exemplary embodiment of the present disclosure; Fig. 9 It is schematically shown Figure 8 An exploded perspective view of the support member and the coil; Fig.10 yes Figure 8 A top view of the coil assembly in FIG. Fig.11 yes Fig.10 The coil assembly in the figure does not have a top view of the coil; Fig.12 is along Figure 8 A cross-sectional view taken along line III-III'; Fig.13A and Fig. 13B is a perspective view schematically showing a coil component according to a third exemplary embodiment and modifications thereof in the present disclosure; and FIG. 14A to FIG. 14C is a perspective view schematically showing a coil component according to a fourth exemplary embodiment and its modifications in the present disclosure. DETAILED DESCRIPTION

[0009] The terms used in this specification are only used to describe specific exemplary embodiments and are not intended to limit the present disclosure. Unless there is a significantly different meaning in the context, the expression used in the singular includes the expression in the plural form. In this specification, it should be understood that terms such as "including" or "having" are intended to indicate that there are features, quantities, steps, actions, elements, parts or combinations thereof disclosed in the specification, and are not intended to exclude the possibility that one or more other features, quantities, steps, actions, elements, parts or combinations thereof may exist or may be added. In addition, throughout the specification, "on ... " means being located above or below the target part, and does not necessarily mean being located on the upper side relative to the direction of gravity.

[0010] Furthermore, bonding does not only mean a case of direct physical contact between two components in a contact relationship, but should also be used as a concept including a case where another component is interposed between the two components so that either of the two components is in contact with the other component.

[0011] The size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, and thus the present disclosure is not necessarily limited to the shown size and thickness.

[0012] In the drawings, an X direction may be defined as a first direction or a thickness direction, a Y direction may be defined as a second direction or a length direction, and a Z direction may be defined as a third direction or a width direction.

[0013] Hereinafter, a coil component according to an exemplary embodiment in the present disclosure will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, the same or corresponding components are assigned the same reference numerals and a repeated description thereof is omitted.

[0014] Various types of electronic components are used in electronic devices, and various types of coil components may be appropriately used in these electronic components for various purposes such as noise cancellation.

[0015] In other words, the coil components in electronic devices can be used as power inductors, high-frequency inductors, general-purpose magnetic beads, GHz magnetic beads, common-mode filters, etc.

[0016] First Exemplary Embodiment Figure 1 is a perspective view schematically showing a coil component according to a first exemplary embodiment in the present disclosure. Figure 2 It is schematically shown Figure 1 An exploded perspective view of the support structure and coil in FIG. Figure 3 yes Figure 1 A top view of the coil assembly in FIG. Figure 4 yes Figure 3 The coil assembly in Figure 1 does not have a top view of the coil. Figure 5 is along Figure 1 A cross-sectional view taken along line II' in FIG. Figure 6 It is along Figure 1 A cross-sectional view taken along line II-II'.

[0017] Reference Figures 1 to 5 The coil component 1000 according to the first exemplary embodiment in the present disclosure may include a body 100 , a support member 200 , a coil 300 , and external electrodes 400 and 500 and may further include an insulating film (IF) and an insulating layer 600 .

[0018] Hereinafter, main components constituting the coil component 1000 according to the present exemplary embodiment are described in detail.

[0019] The body 100 forms the exterior of the coil component 1000 according to the present exemplary embodiment, and the support member 200 and the coil 300 are embedded in the body 100 .

[0020] The body 100 may be entirely formed in a hexahedral shape.

[0021] The body 100 includes a first surface 101 and a second surface 102 opposite to each other in a first direction (X direction), a first side surface 103 and a second side surface opposite to each other in a second direction (Y direction), and a third side surface 105 and a fourth side surface 106 opposite to each other in a third direction (Z direction). Each of the first side surface 103, the second side surface 104, the third side surface 105 and the fourth side surface 106 of the body 100 corresponds to a plurality of side surfaces of the body 100 connecting the first surface 101 and the second surface 102 of the body 100.

[0022] As an example, the coil component 1000 according to the present exemplary embodiment formed with the external electrodes 400 and 500 has a length of 2.5 mm, a width of 2.0 mm, and a thickness of 0.8 mm, a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.6 mm, a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.6 mm, a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.4 mm, a length of 1.4 mm, a width of 1.2 mm, and a thickness of 0.65 mm, a length of 1.0 mm, a width of 0.7 mm, and a thickness of 0.65 mm, a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.65 mm, or a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.5 mm, but is not limited thereto. In addition, the aforementioned exemplary values ​​of the length, width, and thickness of the coil component 1000 refer to values ​​that do not reflect process errors, and therefore values ​​within a range that may be identified as process errors should be considered as the aforementioned exemplary values.

[0023] The main body 100 may include a magnetic material and a resin. Specifically, the main body 100 may be formed by stacking one or more magnetic composite sheets in which a magnetic material is dispersed in a resin. However, the main body 100 may have a structure other than a structure in which a magnetic material is dispersed in a resin. For example, the main body 100 may be formed using a magnetic material such as ferrite, or may be formed using a non-magnetic material.

[0024] The magnetic material can be ferrite or magnetic metal powder.

[0025] The ferrite may be, for example, at least one of spinel ferrite (such as Mg-Zn-based ferrite, Mn-Zn-based ferrite, Mn-Mg-based ferrite, Cu-Zn-based ferrite, Mg-Mn-Sr-based ferrite and Ni-Zn-based ferrite), hexagonal ferrite (such as Ba-Zn-based ferrite, Ba-Mg-based ferrite, Ba-Ni-based ferrite, Ba-Co-based ferrite and Ba-Ni-Co-based ferrite), garnet-type ferrite (such as Y-based ferrite) and Li-based ferrite.

[0026] The magnetic metal powder may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the magnetic metal powder may include at least one of pure iron powder, Fe-Si-based alloy powder, Fe-Si-Al-based alloy powder, Fe-Ni-based alloy powder, Fe-Ni-Mo-based alloy powder, Fe-Ni-Mo-Cu-based alloy powder, Fe-Co-based alloy powder, Fe-Ni-Co-based alloy powder, Fe-Cr-based alloy powder, Fe-Cr-Si-based alloy powder, Fe-Si-Cu-Nb-based alloy powder, Fe-Ni-Cr-based alloy powder, and Fe-Cr-Al-based alloy powder.

[0027] The magnetic metal powder may be amorphous or crystalline. For example, the magnetic metal powder may be Fe-Si-B-Cr based amorphous alloy powder, but is not limited thereto.

[0028] The ferrite and the magnetic metal powder may each have an average diameter of about 0.1 μm to 30 μm, but is not limited thereto.

[0029] The body 100 may include two or more types of magnetic materials dispersed in the resin. Here, different kinds of magnetic materials refer to magnetic materials dispersed in the resin and distinguished from each other by any one of average diameter, composition, crystallinity, and shape.

[0030] The resin may include epoxy resin, polyimide, liquid crystal polymer, etc., alone or in combination, but is not limited thereto.

[0031] The body 100 has a core 110 passing through the support member 200 and the coil 300. The core 110 may be formed by filling a through hole of the support member 200 with a magnetic composite sheet, but is not limited thereto.

[0032] The support member 200 may be disposed within the body 100. The support member 200 is configured to support the coil 300.

[0033] Exemplary embodiments in the present disclosure propose a structure of a coil component to easily dissipate heat generated inside the coil component as follows.

[0034] The support member 200 may include a plurality of layers. Specifically, the support member includes a first layer 210 and a second layer 220 disposed on both sides of the first layer 210 and in contact with the coil.

[0035] The first layer 210 is used to dissipate heat generated when the coil component 1000 is used on a mounting board and / or heat transferred to the coil component from the outside. Specifically, when current flows in the coil 300, heat may be generated by direct current resistance (Rdc), and as the coil component becomes smaller and more integrated, the coil component may be more susceptible to heat generation. In other words, the high temperature reliability of the coil component may be reduced. temp (Indicator of high temperature reliability of coil component) refers to the rated current for temperature rise. When the temperature rise is 40°C, using a current exceeding the corresponding current may cause damage to the coil component. The coil component according to the exemplary embodiment of the present disclosure can have an improved I related to high temperature reliability by improving the heat dissipation structure. temp characteristic.

[0036] The first layer 210 of the present exemplary embodiment is used to effectively dissipate heat to improve I temp characteristic.

[0037] Reference Figure 3 and Figure 4 , the arrangement of the first layer 210 is described in detail. Figure 3 yes Figure 1 A top view of the coil assembly in FIG. Figure 4 yes Figure 3 1 and 1 . The coil assembly in FIG. 1 has no top view of the coil. For convenience, the outer electrodes 400 and 500 and the insulating layer 600 are omitted in the drawings. The first layer 210 constitutes an intermediate layer of the support member 200. The first layer 210 may not be in direct contact with the coil 300. Instead, the first layer 210 may form a thermal path for dissipating heat inside the coil assembly.

[0038] The first layer 210 may promote heat dissipation in the third direction (Z direction) of the main body. Specifically, the first layer 210 may extend to one side surface or two side surfaces of the main body that are opposite to each other in the third direction. That is, the first layer 210 may extend to the third side surface 105 or the fourth side surface 106.

[0039] The first layer 210 may be spaced apart from the first side surface 103 and the second side surface 104, which are two side surfaces of the body that are opposite to each other in the second direction (Y direction). This is in contrast to the second layer 220 that will be described below and extends to the first side surface 103 and the second side surface 104. In the coil component according to the present exemplary embodiment, the path through which current flows and the path through which heat is dissipated are separated from each other, thereby enabling effective heat dissipation.

[0040] The thermal conductivity of the first layer 210 may be higher than the thermal conductivity of the second layer 220. The thermal conductivity may be measured by a heat flow meter. Even if not described in the present disclosure, other methods and / or tools understood by a person of ordinary skill in the art may be used.

[0041] The first layer 210 may include an insulating material and a filler. Various types of resins may be used as the insulating material. Specifically, the first layer 210 may be formed using an insulating material including a thermosetting insulating resin (such as an epoxy resin), a thermoplastic insulating resin (such as polyimide), or a photosensitive insulating resin.

[0042] Compared with the second layer 220, the first layer 210 may further include a filler. The filler may include at least one selected from the group consisting of carbon nanotubes (CNTs), graphene, conductive polymers, Cu (copper), Ag (silver), and Au (gold). In particular, when carbon nanotubes are used, they may form a CNT epoxy composite material with an insulating material. However, the present disclosure is not limited thereto.

[0043] The filler may include a material having high thermal conductivity, and may promote heat dissipation in the third direction (Z direction) of the body 100 .

[0044] The second layer 220 may be in contact with the coil 300. That is, the second layer 220 is configured to directly support the coil 300. Specifically, the second layer 220 is disposed on the upper and lower surfaces of the first layer 210, and constitutes the outermost layer of the support member 200.

[0045] Reference Figure 3 and Figure 4The arrangement of the second layer 220 is described in detail. The second layer 220 may extend to two surfaces of the body that are opposite to each other in the second direction (Y direction). As will be described below, since both ends of the coil 300 extend to the first side surface 103 and the second side surface 104, the second layer 220 may extend to two side surfaces of the body that are opposite to each other in the second direction (Y direction) to support the two ends of the coil 300. However, the present disclosure is not limited thereto, and the second layer 220 may not extend to two side surfaces of the body that are opposite to each other in the second direction (Y direction).

[0046] The second layer 220 may be spaced apart from two side surfaces 105 and 106 of the body opposite to each other in the third direction. That is, only the first layer 210 of the support member 200 may extend to the third side surface 105 and / or the fourth side surface 106 of the body.

[0047] The second layer 220 may be formed using an insulating material including at least one of a thermosetting insulating resin (such as an epoxy resin), a thermoplastic insulating resin (such as polyimide), and a photosensitive insulating resin, or may be formed using an insulating material obtained by impregnating an insulating resin with a reinforcing material (such as glass fiber or an inorganic filler). For example, the second layer 220 may be formed by stacking an insulating film on each of the two sides of the first layer 210. The insulating film may be a common non-photosensitive insulating film such as an Ajinomoto build-up film (ABF) or a prepreg, or a photosensitive insulating film such as a dry film or PID. However, the present disclosure is not limited thereto, and the insulating film may be formed by coating a liquid insulating resin and then curing it.

[0048] The second layer 220 may not include the filler of the aforementioned first layer 210. That is, the second layer 220 may not include carbon nanotubes, graphene, conductive polymers, Cu (copper), Ag (silver), and Au (gold).

[0049] As described above, since the arrangements of the first layer 210 and the second layer 220 are slightly different, the thickness of the supporting member 200 may vary according to locations.

[0050] Specifically, the thickness relationship may be different in the area of ​​the support member 200 that directly supports the coil 300. Figure 5, the regions of the two ends 311 and 321 of the supporting coil of the supporting member 200 may be thinner than other regions. The second layer 220 extends to the first side surface 103 and the second side surface 104 of the main body, while the first layer 210 does not extend to the first side surface 103 and the second side surface 104 of the main body, and therefore, a thickness difference may occur. Therefore, the two ends 311 and 321 of the coil may be arranged closer to the center of the main body 100 based on the first direction (X direction) of the main body 100 than the portion of the coil 300 other than the two ends. That is, the lower surface of the end 311 of the first coil pattern may be located at a lower position than the lower surface of the first coil pattern 310 other than the end. Similarly, the upper surface of the end 321 of the second coil pattern may be located at a higher position than the upper surface of the second coil pattern 320 excluding the end.

[0051] The area of ​​the support member 200 that directly supports the coil 300 (excluding both ends of the coil) may be thicker than the area that does not directly support the coil 300. Figure 6 , a portion of the first layer 210 that does not support the coil 300 extends to the third and fourth side surfaces 105 and 106 of the body. Since the second layer 220 is not provided in a corresponding portion of the first layer 210, a thin region of the support member 200 may be formed.

[0052] The coil 300 is disposed on the support member 200. The coil 300 is embedded in the body 100 and exhibits the characteristics of a coil component. For example, when the coil component 1000 of the present exemplary embodiment is used as a power inductor, the coil 300 can be used to stabilize the power of the electronic device and maintain the output voltage by storing the electric field as a magnetic field.

[0053] The coil 300 is formed on at least one of the two opposing surfaces of the support member 200 and forms at least one turn. In the present exemplary embodiment, the coil 300 may include coil patterns 310 and 320 and a via V.

[0054] Reference Figures 1 to 3 , the first coil pattern 310 and the second coil pattern 320 may be respectively disposed on two surfaces of the support member 200 opposite to each other, and may be in the form of a planar spiral forming at least one turn around the core 110 as an axis of the body 100. For example, based on Figure 1 The first coil pattern 310 is disposed on the upper surface of the support member 200 to form at least one turn around the core 110 as an axis. The second coil pattern 320 is disposed on the lower surface of the support member 200 to form at least one turn around the core 110 as an axis.

[0055] Both ends of the coil patterns 310 and 320 may extend to two side surfaces of the body that are opposite to each other in the second direction (Y direction). That is, the end 311 of the first coil pattern and the end 321 of the second coil pattern may extend to the first side surface 103 and the second side surface 104 of the body 100, respectively. The end 311 of the first coil pattern may extend to the first side surface 103 of the body 100 and be connected to the first external electrode 400. In addition, the end 321 of the second coil pattern may extend to the second side surface 104 of the body 100 and be connected to the second external electrode 500.

[0056] The coil 300 may further include a via hole V connecting the first coil pattern 310 to the second coil pattern 320. Specifically, the via hole V may connect the inner ends of the innermost turns of the first coil pattern 310 and the second coil pattern 320 through both the first layer 210 and the second layer 220 of the support member 200. Therefore, a signal input to the first external electrode 400 may be output to the second external electrode 500 through the first coil pattern 310, the via hole V, and the second coil pattern 320. With this structure, all components of the coil 300 may be integrally used as a single coil connected between the first external electrode 400 and the second external electrode 500.

[0057] At least one of the coil patterns 310 and 320 and the via V may include at least one conductive layer.

[0058] For example, when the first coil pattern 310 and the via hole V are plated on the upper surface of the support member 200 (based on Figure 1 When the first coil pattern 310 and the via V are formed in a direction (in a direction in a direction), the first coil pattern 310 and the via V may each include a seed layer and an electroplating layer. The seed layer may be formed by electroless plating or a vapor deposition method (such as sputtering). Each of the seed layer and the electroplating layer may have a single-layer structure or a multi-layer structure. The electroplating layer having a multi-layer structure may be formed as a conformal film structure in which one electroplating layer is covered by another electroplating layer or a structure in which another electroplating layer is stacked only on one surface of one electroplating layer. The seed layer of the first coil pattern 310 and the seed layer of the via V may be formed integrally so that no boundary may be formed therebetween, but the present disclosure is not limited thereto. The electroplating layer of the first coil pattern 310 and the electroplating layer of the via V may be formed integrally so that no boundary may be formed therebetween, but the present disclosure is not limited thereto.

[0059] The coil patterns 310 and 320 and the via V may each include a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo), or alloys thereof, but are not limited thereto.

[0060] The external electrodes 400 and 500 may be disposed on the first side surface 103 and the second side surface 104 of the body 100 and respectively connected to both ends of the coil 300. Specifically, the first external electrode 400 may be disposed on the first side surface 103 of the body 100 and connected to the end 311 of the first coil pattern. In addition, the second external electrode 500 may be disposed on the second side surface 104 of the body 100 and connected to the end 321 of the second coil pattern.

[0061] The external electrodes 400 and 500 may extend to the first surface 101 of the body 100. When the coil component 1000 according to the present exemplary embodiment is mounted on a printed circuit board, the external electrodes 400 and 500 electrically connect the coil component 1000 to the printed circuit board, etc. For example, the external electrodes 400 and 500 spaced apart from each other on the first surface 101 of the body 100 may be electrically connected to a connection portion of the printed circuit board.

[0062] The external electrodes 400 and 500 may be formed using a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or alloys thereof, but are not limited thereto.

[0063] Each of the external electrodes 400 and 500 may be formed of a plurality of layers. For example, the first external electrode 400 may include a first layer in contact with the end portion 311 of the first coil pattern and a second layer disposed on the first layer. Here, the first layer may be a conductive resin layer including conductive particles and an insulating resin or may be a copper (Cu) plating layer, and the conductive particles include at least one of copper (Cu) and silver (Ag). The second layer may have a double-layer structure including a nickel (Ni) plating layer and a tin (Sn) plating layer.

[0064] Although not shown in the drawings, an insulating film (IF) may be provided between the coil 300 and the body 100 to cover the coil 300. The insulating film (IF) may be formed on the surfaces of the support member 200 and the coil 300. The insulating film (IF) is used to insulate the coil 300 from the body 100, and may include a known insulating material such as polyparaxylene, but is not limited thereto. The insulating film (IF) may be formed by a method such as vapor deposition, but is not limited thereto, and may be formed by stacking insulating films on both sides of the support member 200.

[0065] In addition, the coil component 1000 according to the present exemplary embodiment may further include an insulating layer 600 covering the first and second side surfaces 103 and 104 of the body 100 .

[0066] For example, the insulating layer may be formed by applying an insulating material including an insulating resin to the surface of the body 100 and curing it. In this case, the insulating layer may include at least one of a thermoplastic resin (such as a polystyrene-based resin, a vinyl acetate-based resin, a polyester-based resin, a polyethylene-based resin, a polypropylene-based resin, a polyamide-based resin, a rubber-based resin, and an acrylic-based resin), a thermosetting resin (such as a phenol-based resin, an epoxy-based resin, a urethane-based resin, a melamine-based resin, and an alkyd-based resin), and a photosensitive insulating resin.

[0067] 7A to 7F Each shows an example of the first layer of the present disclosure.

[0068] Reference 7A to 7F , the first layer 210 may extend to both the third side surface 105 and the fourth side surface 106, or may extend to either the third side surface 105 or the fourth side surface 106. In addition, the gap may extend along the third direction (Z direction) to the side surface 105 and / or 106 of the body (for example, formed in the middle of the first layer 210 in the second direction (Y direction)). The first layer 210 may include a first portion 211 and a second portion 212 spaced apart from each other in the second direction (Y direction) with respect to the gap.

[0069] Second Exemplary Embodiment Figure 8 is a perspective view schematically showing a coil component according to a second exemplary embodiment in the present disclosure. Fig. 9 It is schematically shown Figure 8 An exploded perspective view of the support structure and coil in FIG. Fig.10 yes Figure 8 A top view of the coil assembly in FIG. Fig.11 yes Fig.10 The coil assembly in Figure 1 does not have a top view of the coil. Fig.12 It is along Figure 8 A cross-sectional view taken along line III-III'.

[0070] Compared with the coil component 1000 according to the first exemplary embodiment, the coil component 2000 according to the second exemplary embodiment has a second layer 220 with a different arrangement. Specifically, after forming the first coil pattern 310 and the second coil pattern 320, a portion of the support member 200 may be removed. Therefore, the second layer 220 does not extend to the two side surfaces of the body 100 that are opposite to each other in the second direction (Y direction). That is, the second layer 220 does not extend to the first side surface 103 and the second side surface 104 of the body 100. A portion of the body 100 may be filled in place of the removed portion of the support member 200.

[0071] As in the above-described first exemplary embodiment, since the second layer 220 does not extend to two side surfaces of the body 100 opposing each other in the third direction (Z direction), the second layer 220 is spaced apart from all side surfaces 103 , 104 , 105 , and 106 of the body 100 .

[0072] As described above, since the second layer 220 does not extend to the first and second side surfaces 103 and 104 of the body 100 , at least a portion of each of the ends 311 and 321 of the first and second coil patterns may not contact the second layer 220 .

[0073] The end portion 311 of the first coil pattern may be disposed on the same horizontal plane as the horizontal plane at which the portion other than the end portion of the first coil pattern 310 is disposed. That is, the lower surface of the end portion 311 of the first coil pattern may have the same height as the lower surface other than the end portion of the first coil pattern 310. Similarly, the upper surface of the end portion 321 of the second coil pattern may have the same height as the upper surface of the second coil pattern 320 other than the end portion.

[0074] Hereinafter, other descriptions of the respective exemplary embodiments are the same as those of the first exemplary embodiment and thus are omitted.

[0075] Third Exemplary Embodiment Fig.13A and Fig. 13B is a perspective view schematically showing a coil component according to a third exemplary embodiment and its modifications in the present disclosure.

[0076] Compared with the coil component 1000 according to the first exemplary embodiment, the coil component 3000 according to the third exemplary embodiment further includes a third external electrode 700 .

[0077] The third external electrode 700 is disposed on the first surface 101 of the body 100 to improve heat dissipation characteristics of the coil assembly.

[0078] Reference Fig.13A , the third external electrode 700 is disposed on the first surface 101 of the body 100 and between the first external electrode 400 and the second external electrode 500 .

[0079] Reference Fig. 13B , the third external electrode 700 may extend to the third side surface 105 of the body.

[0080] The third external electrode 700 may include at least one of a conductive resin layer and an electroplating layer. The conductive resin layer may be formed by paste printing or the like and may include one or more conductive metals selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag), and a thermosetting resin. The electroplating layer may include one or more selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn).

[0081] Hereinafter, other descriptions of the respective exemplary embodiments are the same as those of the first exemplary embodiment and thus are omitted.

[0082] Fourth Exemplary Embodiment FIG. 14A to FIG. 14C is a perspective view schematically showing a coil component according to a fourth exemplary embodiment and its modifications in the present disclosure.

[0083] Compared with the coil component 1000 according to the first exemplary embodiment, the coil component 4000 according to the fourth exemplary embodiment further includes a pad 800 .

[0084] The pad 800 is disposed on the second surface 102 of the body 100 to improve the heat dissipation characteristics of the coil assembly.

[0085] Reference Fig.14A , the pad 800 may cover the entire second surface 102 of the body 100 .

[0086] Reference Fig. 14B , the pad 800 may cover a portion of the second surface 102 of the body 100 .

[0087] Reference Fig. 14C , the pad 800 may cover the entire second surface 102 of the body 100 and may have a concavo-convex shape.

[0088] The pad 800 may include at least one of a conductive resin layer and an electroplating layer. The conductive resin layer may be formed by paste printing or the like and may include one or more conductive metals selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag), and a thermosetting resin. The electroplating layer may include one or more selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn).

[0089] Hereinafter, other descriptions of the respective exemplary embodiments are the same as those of the first exemplary embodiment and thus are omitted.

[0090] According to one aspect of the present disclosure, heat generated inside the coil assembly can be easily dissipated, thereby improving I temp characteristic.

[0091] While exemplary embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A coil assembly, comprising: a body including a first surface and a second surface opposite to each other in a first direction and a plurality of side surfaces connecting the first surface to the second surface, the plurality of side surfaces including the first side surface and the second side surface opposite to each other in the second direction, and a third side surface and a fourth side surface opposite to each other in a third direction; a supporting member disposed in the main body and having a through hole; as well as a coil disposed on at least one surface of the support member, the coil comprising a first end extending to the first side surface, and a second end extending to the second side surface, wherein the supporting member includes a first layer and a second layer disposed on both surfaces of the first layer and contacting the coil, and The first layer extends to at least one of the third side surface and the fourth side surface.

2. The coil assembly according to claim 1, wherein: The first layer includes resin and filler, The second layer includes the same resin as the resin included in the first layer, and The filler includes at least one selected from the group consisting of carbon nanotubes, graphene, conductive polymers, copper, silver, and gold.

3. The coil assembly according to claim 1, wherein: The thermal conductivity of the first layer is higher than the thermal conductivity of the second layer.

4. The coil assembly according to claim 1, wherein: The first layer does not directly contact the coil.

5. The coil assembly according to claim 1, wherein: The first layer is spaced apart from the first side surface and the second side surface.

6. The coil assembly according to claim 1, wherein: The second layer extends to the first side surface and the second side surface.

7. The coil assembly according to claim 1, wherein: The second layer is spaced apart from the third side surface and the fourth side surface.

8. The coil assembly according to claim 7, wherein: The second layer is spaced apart from the first side surface and the second side surface.

9. The coil assembly according to claim 1, wherein: The coil includes a first coil pattern disposed on a first surface of the support member, a second coil pattern disposed on a second surface of the support member opposite to the first surface of the support member, and a via hole penetrating through the support member to connect the first coil pattern to the second coil pattern.

10. The coil assembly according to claim 9, wherein: The via penetrates both the first layer and the second layer.

11. The coil assembly according to claim 1, wherein: The first layer extends to the third side surface and the fourth side surface.

12. The coil assembly according to claim 11, wherein: The first layer includes a first portion and a second portion spaced apart from each other in the second direction.

13. The coil assembly according to claim 12, wherein: The first portion and the second portion are spaced apart from each other by a gap extending to the third side surface and the fourth side surface along the third direction.

14. The coil assembly according to claim 1, further comprising: a first external electrode and a second external electrode, connected to the first end and the second end of the coil, respectively, and disposed on the first side surface and the second side surface, Wherein, the first external electrode and the second external electrode extend to the first surface of the body.

15. The coil assembly according to claim 14, further comprising: A third external electrode is disposed on the first surface of the body and between the first external electrode and the second external electrode. 16 . The coil component of claim 14 , further comprising a pad disposed on the second surface of the body.

17. The coil assembly according to claim 2, wherein: The resin includes a thermosetting insulating resin, a thermoplastic insulating resin or a photosensitive insulating resin.

18. The coil assembly according to claim 2, wherein: The second layer does not contain the filler.

19. The coil assembly according to claim 1, wherein: The first layer extends to the third side surface or the fourth side surface.

20. The coil assembly according to claim 19, wherein The portion of the first layer extending to the third side surface or the fourth side surface includes a gap extending to the third side surface or the fourth side surface along the third direction.

Citation Information

Patent Citations

  • Film stripping apparatus and de-lamination equipment, semiconductor manufacturing equipment including the same

    KR1020230136419A