Air injection structure and plasma etching machine

Abstract

The invention discloses an air injection structure and a plasma etching machine. The air injection structure comprises an air inlet pipe sleeve which can be communicated with an air source; the air injection part is detachably connected with the air inlet pipe sleeve, and an accommodating space is formed after the air injection part is connected with the air inlet pipe sleeve; the gas path switching piece is movably arranged in the accommodating space; wherein the gas path switching part is provided with gas through hole groups, the gas injection part is provided with gas injection hole groups, the number of the gas through hole groups is multiple, the number of the gas injection hole groups is multiple, each gas injection hole group corresponds to one gas through hole group, the injection directions of the gas injection hole groups are different, and the gas path switching part is movably arranged. And the conduction between one gas injection hole group and the corresponding gas through hole group can be switched to the conduction between the other gas injection hole group and the other gas through hole group. According to the air injection structure, air injection in multiple directions can be achieved, periodic air injection in multiple directions can be achieved along with continuous movement of the air path switching piece, the plasma concentration uniformity is improved, and the plasma etching uniformity is improved.

Description

Technical Field

[0001] The invention relates to the technical field of jet structures, in particular to a jet structure and a plasma etcher. Background Art

[0002] Plasma etcher, also called plasma plane etcher, plasma etcher or plasma surface treatment instrument, is used in the semiconductor industry. Inductively coupled plasma etching is the result of the interaction of chemical and physical processes. The basic principle is that under vacuum and low pressure, the radio frequency generated by the ICP radio frequency power supply (ICP is the abbreviation of Inductively Coupled Plasma, representing inductively coupled plasma) is output to the annular coupling coil, and a certain proportion of mixed etching gas is coupled to glow discharge to generate high-density plasma. Under the action of the RF radio frequency (RF is the abbreviation of Radio Frequency, indicating the electromagnetic frequency that can be radiated into space) of the lower electrode, these plasmas bombard the surface of the substrate, and the chemical bonds of the semiconductor in the substrate pattern area are broken, generating volatile substances with the etching gas, which are separated from the substrate in the form of gas and are drawn out from the vacuum pipeline.

[0003] The air injection structure used in the existing plasma etcher can only achieve air intake in a single direction, has a relatively simple function, and has poor uniformity of plasma concentration in the chamber and poor etching uniformity.

[0004] Therefore, how to broaden the function of the gas jet structure and improve the uniformity of plasma etching is a technical problem that technicians in this field currently need to solve. Summary of the invention

[0005] In view of this, an object of the present invention is to provide a gas injection structure to broaden the function of the gas injection structure and improve the uniformity of plasma etching.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] A jet structure, comprising:

[0008] An air inlet sleeve capable of being connected to an air source;

[0009] An injection member is detachably connected to the air intake sleeve, and a receiving space is formed after the injection member and the air intake sleeve are connected;

[0010] An air path switching component is movably disposed in the accommodation space;

[0011] Wherein, the gas circuit switching component is provided with a gas through hole group, and the jet component is provided with a jet hole group, the number of the gas through hole groups and the jet hole groups are both multiple groups, and each group of the jet hole groups corresponds to a group of the gas through hole groups, and the jet direction of each group of the jet hole groups is different. Based on the movable setting of the gas circuit switching component, the conduction between the jet hole group and the corresponding gas through hole group can be switched to the conduction between another jet hole group and another gas through hole group.

[0012] Optionally, in the above-mentioned jet structure, the gas path switching component is rotatably disposed in the accommodating space.

[0013] Optionally, in the above-mentioned jet structure, the gas path switching component includes a switching shaft and an airway switching disk, the axis of the switching shaft is arranged perpendicular to the airway switching disk, and the gas through hole group is arranged on the airway switching disk.

[0014] Optionally, in the above-mentioned jet structure, the number of the jet hole groups is three, namely a first jet hole group, a second jet hole group and a third jet hole group;

[0015] The number of the gas through hole groups is three, namely a first gas through hole group, a second gas through hole group and a third gas through hole group, wherein the first gas through hole group, the second gas through hole group and the third gas through hole group correspond to the first gas injection hole group, the second gas injection hole group and the third gas injection hole group respectively;

[0016] Wherein, when the gas circuit switching component rotates to the first preset position, the first gas through hole group and the first injection hole group are connected; when the gas circuit switching component rotates to the second preset position, the second gas through hole group and the second injection hole group are connected; when the gas circuit switching component rotates to the third preset position, the third gas through hole group and the third injection hole group are connected.

[0017] Optionally, in the above jet structure, the jet direction of the first jet hole group is vertically downward, the jet direction of the second jet hole group is inclined downward to the vertical direction, and the jet direction of the third jet hole group is perpendicular to the vertical direction.

[0018] Optionally, in the above-mentioned jet structure, the first jet hole group is arranged on a side of the second jet hole group close to the center of the jet element, and the third jet hole group is arranged on a side of the second jet hole group away from the center of the jet element;

[0019] The first gas through hole group is arranged on a side of the second gas through hole group close to the center of the gas channel switching disk, and the third gas through hole group is arranged on a side of the second gas through hole group away from the center of the gas channel switching disk.

[0020] Optionally, in the above-mentioned jet structure, the first jet hole group includes a plurality of directly downward jet holes, the second jet hole group includes a plurality of obliquely downward jet holes, and the third jet hole group includes a plurality of lateral jet holes, wherein the number of the directly downward jet holes, the obliquely downward jet holes and the lateral jet holes are equal, and the plurality of directly downward jet holes, the plurality of obliquely downward jet holes and the plurality of lateral jet holes are all distributed in a circular array with the center of the jet element as the array center;

[0021] The first gas hole group includes a plurality of downward gas holes, the second gas hole group includes a plurality of downward slanting gas holes, and the third gas hole group includes a plurality of lateral gas holes, wherein the number of the downward gas holes, the downward slanting gas holes and the lateral gas holes are equal, and the plurality of downward gas holes, the downward slanting gas holes and the lateral gas holes are distributed in a circular array with the center of the airway switching disk as the array center.

[0022] Optionally, in the above-mentioned jet structure, the centers of the corresponding downward jet holes, oblique downward jet holes and lateral jet holes are all located on the same radial straight line of the jet component, and on the circumference of the airway switching disk, the corresponding downward gas holes, oblique downward gas holes and lateral gas holes are all offset from each other.

[0023] Optionally, in the above-mentioned jet structure, on the circumference of the jet component, the corresponding downward jet holes, oblique downward jet holes and lateral jet holes are offset from each other, and the centers of the corresponding downward gas holes, oblique downward gas holes and lateral gas holes are all located on the same radial straight line of the airway switching disk.

[0024] Optionally, in the above-mentioned jet structure, the axis of the downward jet hole is parallel to the vertical direction, the axis of the oblique downward jet hole is inclined to the vertical direction, and the axis of the lateral jet hole includes a first axis portion parallel to the vertical direction and a second axis portion perpendicular to the first axis portion.

[0025] Optionally, in the above-mentioned jet structure, the airway switching disk is provided with a combined airway groove, the combined airway groove is formed by extending radially along the airway switching disk, and each downward jet hole has an oblique downward jet hole and a lateral jet hole arranged on the same radial straight line with its center;

[0026] Wherein, when the gas circuit switching component moves to the fourth preset position, the combined gas channel groove is simultaneously connected to the first jet hole group and the second jet hole group; or, when the gas circuit switching component moves to the fourth preset position, the combined gas channel groove is simultaneously connected to the first jet hole group, the second jet hole group and the third jet hole group; or, when the gas circuit switching component moves to the fourth preset position, the combined gas channel groove is simultaneously connected to the second jet hole group and the third jet hole group; or, when the gas circuit switching component moves to the fourth preset position, the combined gas channel groove is simultaneously connected to the first jet hole group and the third jet hole group.

[0027] Optionally, in the above-mentioned jet structure, the length of the combined airway groove is greater than the radial distance between the downward jet hole and the downward oblique jet hole;

[0028] Alternatively, the length of the combined airway groove is greater than the distance between the downward jet hole and the lateral jet hole;

[0029] Alternatively, the length of the combined airway groove is greater than the distance between the oblique downward air jet hole and the lateral air jet hole;

[0030] Alternatively, in the circumferential direction of the jet component, the corresponding downward jet hole, the oblique downward jet hole and the lateral jet hole are all offset from each other, the length of the combined air duct groove is greater than the radial distance between the downward jet hole and the lateral jet hole, and the combined air duct groove extends on the line connecting the centers of the downward jet hole and the lateral jet hole.

[0031] Optionally, in the above-mentioned jet structure, the gas path switching component further comprises an air uniforming disk arranged on the switching shaft, and a plurality of air uniforming holes are evenly distributed on the air uniforming disk, and the shapes and sizes of the plurality of air uniforming holes are equal.

[0032] Optionally, in the above-mentioned jet structure, the jet structure further includes a rotary drive member for driving the gas path switching member to rotate, and the gas path switching member is connected to the rotary output shaft of the rotary drive member through a coupling.

[0033] Optionally, in the above-mentioned jet structure, the air intake pipe sleeve is provided with an air intake pipeline that can be communicated with an air source.

[0034] Optionally, in the above-mentioned jet structure, a controller electrically connected to the rotary drive member is further included, so that the jet hole group is controlled by the controller to perform periodic pulse jetting in multiple directions.

[0035] Optionally, in the above-mentioned jet structure, a magnetic fluid seal or a sealing ring seal is used between the air path switching component and the air intake pipe sleeve.

[0036] A plasma etcher comprises the above-mentioned gas injection structure.

[0037] Optionally, in the above plasma etcher, it also includes a plasma reaction chamber, a vacuum pump, a pressure control valve, an excitation radio frequency power supply, a plasma coupling coil, a bias radio frequency power supply and a bias electrode;

[0038] The vacuum pump is connected to the plasma reaction chamber, the pressure control valve is arranged on the connecting pipeline between the plasma reaction chamber and the vacuum pump, the plasma coupling coil is electrically connected to the excitation RF power supply, the bias RF power supply is electrically connected to the bias electrode, and the plasma coupling coil and the bias electrode are located in the plasma reaction chamber.

[0039] Optionally, in the above plasma etcher, a ceramic dielectric window and a shielding cover are also included;

[0040] The ceramic dielectric window is arranged in the plasma reaction chamber, the gas injection structure is arranged in the ceramic dielectric window, and the shielding cover is arranged outside the plasma reaction chamber.

[0041] Optionally, in the above plasma etcher, a magnetic fluid seal or a sealing ring seal is used between the jet structure and the ceramic dielectric window.

[0042] When the jet structure provided by the present invention is used, since the jet component is detachably connected to the air intake sleeve, and a receiving space is formed after the jet component and the air intake sleeve are connected, the gas circuit switching component is movably arranged in the receiving space, the gas circuit switching component is provided with a gas through hole group, and the jet component is provided with a jet hole group. Based on the movable arrangement of the gas circuit switching component, the conduction between the jet hole group and the corresponding gas through hole group can be switched to the conduction between another jet hole group and another gas through hole group. Therefore, the air intake sleeve is connected to the gas source, and the air flow flows through the receiving space, the gas through hole group and the jet hole group in sequence, and the air intake is realized through the jet hole group. Since the number of the gas through hole group and the jet hole group is multiple, and each jet hole group corresponds to one gas through hole group, The injection direction of each jet hole group is different. Based on the movable setting of the gas path switching member, the conduction between the jet hole group and the corresponding gas through hole group can be switched to the conduction between another jet hole group and another gas through hole group. Therefore, the jet structure can realize jetting in multiple directions and realize switching of multiple injection directions based on the movable setting of the gas path switching member. For example, in a specific embodiment of the present invention, the jet hole groups are set to three groups, and the three jet hole groups are respectively the first jet hole group, the second jet hole group and the third jet hole group. The injection directions of the first jet hole group, the second jet hole group and the third jet hole group are respectively vertically downward, obliquely downward and perpendicular to the vertical direction. The gas through hole groups are set to three groups, and the three gas through hole groups are respectively The hole groups are respectively a first gas through hole group, a second gas through hole group and a third gas through hole group, and the first gas through hole group, the second gas through hole group and the third gas through hole group correspond to the first jet hole group, the second jet hole group and the third jet hole group respectively. Based on the movable setting of the gas path switching member, when the gas path switching member can move to the first preset position, the first gas through hole group and the first jet hole group are connected, and the airflow injection direction of the injection structure is vertically downward. When the gas path switching member moves to the second preset position, the second gas through hole group and the second jet hole group are connected, and the airflow injection direction of the injection structure is inclined downward. When the gas path switching member moves to the third preset position, the third gas through hole group and the third jet hole group are connected. The airflow injection direction of the jet structure is perpendicular to the vertical direction. Therefore, the application of the jet structure to the plasma etcher can not only meet the downward jetting requirements of the etching process, but also meet the lateral air intake or inclined downward air intake during plasma cleaning of the chamber, thereby broadening the function of the jet structure. At the same time, based on the movable setting of the gas path switching member, the conduction between the jet hole group and the corresponding gas through hole group can be switched to the conduction between another jet hole group and another gas through hole group. Therefore, with the continuous movement of the gas path switching member, the jet structure can also realize periodic jetting in multiple directions, thereby improving the uniformity of plasma concentration in the chamber, thereby improving the uniformity of plasma etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0044] Figure 1 A schematic cross-sectional structure diagram of a first gas injection hole group and a first gas through hole group provided by an embodiment of the present invention when they are aligned and connected;

[0045] Figure 2 A schematic cross-sectional structure diagram of a second gas injection hole group and a second gas through hole group provided by an embodiment of the present invention when they are aligned and connected;

[0046] Figure 3 A schematic cross-sectional structure diagram of a third gas injection hole group and a third gas through hole group provided by an embodiment of the present invention when they are aligned and connected;

[0047] Figure 4 A schematic cross-sectional structure diagram of a combined airway groove provided by an embodiment of the present invention when it is connected to a first jet hole group and a second jet hole group at the same time;

[0048] Figure 5 A schematic diagram of a top view of a jetting component provided by an embodiment of the present invention;

[0049] Figure 6 A schematic diagram of the structure of a gas path switching component provided by an embodiment of the present invention;

[0050] Figure 7 A schematic diagram of the hole layout on a jetting component provided by an embodiment of the present invention;

[0051] Figure 8 A schematic diagram of the hole layout on an airway switching disk provided in an embodiment of the present invention;

[0052] Fig. 9 A schematic diagram of a top view structure of a first gas injection hole group and a first gas through hole group provided by an embodiment of the present invention when they are aligned and connected;

[0053] Fig.10 A schematic diagram of a top view of a second gas injection hole group and a second gas through hole group provided by an embodiment of the present invention when they are aligned and connected;

[0054] Fig.11 A schematic diagram of a top view structure of a third gas injection hole group and a third gas through hole group provided by an embodiment of the present invention when they are aligned and connected;

[0055] Fig.12A schematic diagram of a top view structure of a combined airway groove provided by an embodiment of the present invention when it is connected to a first jet hole group and a second jet hole group at the same time;

[0056] Fig.13 A schematic diagram of a periodic pulse jet flow rate of a jet structure switching between a first jet hole group and a second jet hole group provided by an embodiment of the present invention;

[0057] Fig.14 A schematic diagram of a periodic pulse jet flow rate of a jet structure provided by an embodiment of the present invention switching between a first jet hole group, a second jet hole group and a third jet hole group;

[0058] Fig.15 A schematic diagram of a periodic jet flow rate of an jet structure provided by an embodiment of the present invention, in which jets are sequentially switched between jets from a first jet hole group, jets from a second jet hole group, and jets from a third jet hole group, and jets are simultaneously jetted from the first jet hole group and the second jet hole group;

[0059] Fig.16 A schematic diagram of a working process of an injection structure provided by an embodiment of the present invention;

[0060] Fig.17 A schematic structural diagram of an air jet structure provided in an embodiment of the present invention applied to a plasma etcher.

[0061] Among them, 100 is an air inlet sleeve, 101 is a first sealing ring, 102 is an air inlet pipeline, 200 is an injection component, 201 is a first injection hole group, 202 is a second injection hole group, 203 is a third injection hole group, 300 is an air path switching component, 301 is a switching shaft, 302 is an airway switching disk, 3021 is a first gas through hole group, 3022 is a second gas through hole group, 3023 is a third gas through hole group, 3024 is a combined airway groove, 303 is a gas uniforming disk, 400 is a rotating drive component, 401 is a coupling, 500 is a plasma reaction chamber, 501 is a plasma coupling coil, 502 is a bias electrode, 503 is a ceramic dielectric window, 5031 is a second sealing ring, 504 is a shielding cover, 600 is a vacuum pump, 700 is a pressure control valve, 800 is an excitation RF power supply, and 900 is a bias RF power supply. DETAILED DESCRIPTION

[0062] In view of this, the core of the present invention is to provide a jet structure to broaden the function of the jet structure and improve the uniformity of plasma etching.

[0063] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0064] like Figures 1 to 17 As shown, an embodiment of the present invention discloses an injection structure, which is characterized by comprising an air intake sleeve 100, an injection component 200 and an air path switching component 300.

[0065] Among them, the air intake sleeve 100 can be connected to the air source; the jet component 200 is detachably connected to the air intake sleeve 100, and the jet component 200 and the air intake sleeve 100 are connected to form a accommodating space; the air circuit switching component 300 is movably arranged in the accommodating space; wherein, the air circuit switching component 300 is provided with a gas through hole group, and the jet component 200 is provided with a jet hole group, the number of gas through hole groups and jet hole groups are multiple groups, and each group of jet hole groups corresponds to a group of gas through hole groups, and the injection direction of each group of jet hole groups is different. Based on the movable setting of the air circuit switching component 300, the conduction between the jet hole group and the corresponding gas through hole group can be switched to the conduction between another jet hole group and another gas through hole group.

[0066] When the jet structure provided by the present invention is used, since the jet component 200 is detachably connected to the air intake sleeve 100, and a receiving space is formed after the jet component 200 is connected to the air intake sleeve 100, the gas circuit switching component 300 is movably arranged in the receiving space, the gas circuit switching component 300 is provided with a gas through hole group, and the jet component 200 is provided with a jet hole group. Based on the movable arrangement of the gas circuit switching component 300, the conduction between the jet hole group and the corresponding gas through hole group can be switched to the conduction between another jet hole group and another gas through hole group. Therefore, the air intake sleeve 100 is connected to the gas source, and the air flow flows through the receiving space, the gas through hole group and the jet hole group in sequence, and the air intake is realized through the jet hole group; since the gas through hole group and the jet The number of the air hole groups is multiple, and each air hole group corresponds to a gas through hole group. The injection direction of each air hole group is different. Based on the movable setting of the air path switching member 300, the conduction between the air hole group and the corresponding gas through hole group can be switched to the conduction between another air hole group and another gas through hole group. Therefore, the jet structure can realize jetting in multiple directions and realize switching of multiple jet directions based on the movable setting of the air path switching member 300. For example, in a specific embodiment of the present invention, the air hole groups are set to three groups, and the three air hole groups are respectively a first air hole group 201, a second air hole group 202 and a third air hole group 203. The first air hole group 201, the second air hole group 202 and the third air hole group 203 are respectively The spray directions of the gas through hole group 202 and the third gas through hole group 203 are vertically downward, obliquely downward and perpendicular to the vertical direction, respectively. The gas through hole group is set to three groups, and the three gas through hole groups are respectively the first gas through hole group 3021, the second gas through hole group 3022 and the third gas through hole group 3023. The first gas through hole group 3021, the second gas through hole group 3022 and the third gas through hole group 3023 correspond to the first gas through hole group 201, the second gas through hole group 202 and the third gas through hole group 203, respectively. Based on the movable setting of the gas path switching member 300, when the gas path switching member 300 can move to the first preset position, the first gas through hole group 3021 and the first gas through hole group 201 guide The airflow injection direction of the jet structure is vertically downward. When the gas path switching member 300 moves to the second preset position, the second gas through hole group 3022 and the second jet hole group 202 are connected. The airflow injection direction of the jet structure is obliquely downward. When the gas path switching member 300 moves to the third preset position, the third gas through hole group 3023 and the third jet hole group 203 are connected. The airflow injection direction of the jet structure is perpendicular to the vertical direction. Therefore, the application of the jet structure to the plasma etcher can not only meet the downward jetting requirements of the etching process, but also meet the lateral air intake or oblique downward air intake during plasma cleaning of the chamber, thereby broadening the function of the jet structure.At the same time, based on the movable setting of the gas path switching member 300, the conduction between the gas injection hole group and the corresponding gas through hole group can be switched to the conduction between another gas injection hole group and another gas through hole group. Therefore, with the continuous movement of the gas path switching member 300, the injection structure can also realize periodic injection in multiple directions, improve the uniformity of plasma concentration in the chamber, and improve the uniformity of plasma etching. ;

[0067] It should be noted that the above-mentioned gas circuit switching component 300 can perform reciprocating linear motion or rotation and other types of motion. As long as the type of motion can meet the use requirements, it belongs to the protection scope of the present invention; optionally, in a specific embodiment of the present invention, the gas circuit switching component 300 is rotatably arranged in the accommodating space, so that the gas circuit switching component 300 can realize the switching of multiple gas injection directions by rotation.

[0068] like Figure 6 As shown, the air path switching component 300 includes a switching shaft 301 and an airway switching disk 302. The axis of the switching shaft 301 is arranged perpendicular to the airway switching disk 302. The gas hole group is arranged on the airway switching disk 302 so that the airway switching disk 302 rotates with the switching shaft 301. Based on the rotation of the airway switching disk 302, the gas hole group on the airway switching disk 302 also rotates accordingly, thereby realizing the switching of multiple gas injection directions.

[0069] The present invention does not impose any specific limitation on the number and arrangement of the above-mentioned gas injection hole groups and gas through hole groups. As long as the number and arrangement can meet the use requirements, they belong to the protection scope of the present invention.

[0070] Optionally, the number of the jet hole groups provided in the embodiment of the present invention is three groups, namely, the first jet hole group 201, the second jet hole group 202 and the third jet hole group 203, the number of the gas through hole groups is three groups, namely, the first gas through hole group 3021, the second gas through hole group 3022 and the third gas through hole group 3023, the first gas through hole group 3021, the second gas through hole group 3022 and the third gas through hole group 3023 correspond to the first jet hole group 201, the second jet hole group 202 and the third jet hole group 203 respectively; wherein, the gas path switching member 3 When the gas circuit switching component 300 rotates to the first preset position, the first gas through hole group 3021 and the first jet hole group 201 are connected; when the gas circuit switching component 300 rotates to the second preset position, the second gas through hole group 3022 and the second jet hole group 202 are connected; when the gas circuit switching component 300 rotates to the third preset position, the third gas through hole group 3023 and the third jet hole group 203 are connected. Based on the continuous rotation of the gas circuit switching component 300, the jet structure can switch among jetting from the first jet hole group 201, jetting from the second jet hole group 202 and jetting from the third jet hole group 203.

[0071] It should be understood that the present invention does not limit the specific injection direction of each of the above-mentioned jet hole groups. In practical applications, the injection direction of the jet hole group can be adaptively adjusted according to actual injection requirements. As long as the injection direction can meet the use requirements, it belongs to the protection scope of the present invention.

[0072] Optionally, the jet direction of the first jet hole group 201 provided in the embodiment of the present invention is vertically downward, the jet direction of the second jet hole group 202 is inclined downward from the vertical direction, and the jet direction of the third jet hole group 203 is perpendicular to the vertical direction, so that the jet structure can be applied to the plasma etcher to realize the switching of three air intake modes: downward air intake, oblique downward air intake and lateral air intake. Based on the continuous rotation of the gas path switching member 300, the jet structure can realize the following operation: Fig.14 The pulse jet is switched in sequence in three directions: the downward direction, the oblique downward direction and the lateral direction.

[0073] In addition, the first jet hole group 201 is arranged on a side of the second jet hole group 202 close to the center of the jet element 200, and the third jet hole group 203 is arranged on a side of the second jet hole group 202 away from the center of the jet element 200; the first gas through hole group 3021 is arranged on a side of the second gas through hole group 3022 close to the center of the gas channel switching disk 302, and the third gas through hole group 3023 is arranged on a side of the second gas through hole group 3022 away from the center of the gas channel switching disk 302, that is, the first jet hole group 201 is arranged on the inner side of the second jet hole group 202, and the third jet hole group 203 is arranged on the outer side of the second jet hole group 202, so that the first jet hole group 201 can jet in a vertical downward direction, the second jet hole group 202 can jet in an oblique downward direction, and the third jet hole group 203 can jet in a lateral direction. Even if the three gases are jetted at the same time, there will be no interference between the various jet paths.

[0074] The first jet hole group 201 includes a plurality of downward jet holes, the second jet hole group 202 includes a plurality of oblique downward jet holes, and the third jet hole group 203 includes a plurality of lateral jet holes, wherein the number of the downward jet holes, the oblique downward jet holes, and the lateral jet holes are equal; the first gas through hole group 3021 includes a plurality of downward gas through holes, the second gas through hole group 3022 includes a plurality of oblique downward gas through holes, and the third gas through hole group 3023 includes a plurality of lateral gas through holes, wherein the number of the downward gas through holes, the oblique downward gas through holes, and the lateral gas through holes are equal, so that each downward jet hole corresponds to one downward gas through hole, each oblique downward jet hole corresponds to one oblique downward gas through hole, and each lateral jet hole corresponds to one lateral gas through hole.

[0075] It should be understood that the above-mentioned multiple downward jet holes, multiple oblique downward jet holes and multiple lateral jet holes can be evenly distributed in the circumferential direction of the jet component 200 or distributed in an arithmetic progression distance, and the above-mentioned multiple downward gas through holes, oblique downward gas through holes and lateral gas through holes can be evenly distributed in the circumferential direction of the airway switching disk 302 or distributed in an arithmetic progression distance, etc. In actual applications, the number and distribution of the downward jet holes, oblique downward jet holes and lateral jet holes, as well as the number and distribution of the downward gas through holes, oblique downward gas through holes and lateral gas through holes can be adaptively adjusted according to actual needs.

[0076] Optionally, the multiple downward jet holes, multiple oblique downward jet holes and multiple lateral jet holes provided in the embodiment of the present invention are all distributed in a circular array with the center of the jet component 200 as the array center; the multiple downward gas holes, multiple oblique downward gas holes and lateral gas holes are all distributed in a circular array with the center of the airway switching disk 302 as the array center, so that the jet structure can perform periodic airflow direction switching based on the rotation of the airway switching component 300.

[0077] For example, in a specific embodiment of the present invention, the number of the downward jet holes, the downward oblique jet holes and the lateral jet holes are all six, and the angles between adjacent downward jet holes, between adjacent downward oblique jet holes and between adjacent lateral jet holes are all 60°; the number of the downward gas through holes, the downward oblique gas through holes and the lateral gas through holes are also six, and the angles between adjacent downward gas through holes, adjacent downward oblique gas through holes and adjacent lateral gas through holes are 60°.

[0078] In addition, the centers of the corresponding downward jet holes, oblique downward jet holes, and lateral jet holes are all located on the same radial straight line of the jet component 200. In the circumferential direction of the airway switching disk 302, the corresponding downward gas through holes, oblique downward gas through holes, and lateral gas through holes are all offset from each other, so that when the downward gas through holes and the downward jet holes are aligned and connected, the oblique downward jet holes and their corresponding oblique downward gas through holes will not be connected, and the lateral jet holes and their corresponding lateral gas through holes will not be connected, and the jet structure only sprays the downward airflow; when the oblique downward gas through holes and the oblique downward gas through holes are aligned and connected, the oblique downward gas through holes and the lateral gas through holes will not be connected, and the jet structure only sprays the downward airflow; When the jet holes are aligned and connected, the downward jet hole and its corresponding downward gas through hole will not be connected, and the lateral jet hole and its corresponding lateral gas through hole will not be connected, and the jet structure only sprays airflow in the oblique downward direction; when the downward gas through hole and the downward jet hole are aligned and connected, the oblique downward jet hole and its corresponding oblique downward gas through hole will not be connected, and the lateral jet hole and its corresponding lateral gas through hole will not be connected, and the jet structure only sprays airflow in the oblique downward direction, thereby enabling the jet structure to achieve jet switching in three directions based on the rotation of the gas path switching component 300.

[0079] Of course, the corresponding downward jet holes, oblique downward jet holes and lateral jet holes can also be offset from each other in the circumferential direction of the jet component 200, and the centers of the corresponding downward gas holes, oblique downward gas holes and lateral gas holes can be located on the same radial straight line of the airway switching disk 302, so that the jet structure can also realize jet switching in three directions based on the rotation of the airway switching component 300.

[0080] The axis of the downward jet hole provided by the present invention can be a straight line or a combination of a curve and a straight line, as long as it is a structure that can spray jets vertically downward. Optionally, the axis of the downward jet hole provided in the embodiment of the present invention is parallel to the vertical direction, that is, the downward jet hole is a straight hole, so as to reduce airflow resistance and facilitate jetting in the downward direction; similarly, the axes of the oblique jet hole and the lateral jet hole can be straight lines or a combination of curves and straight lines, as long as the jet direction of the oblique jet hole is inclined to the vertical direction and the jet direction of the lateral jet hole is perpendicular to the vertical direction. Optionally, the axis of the oblique jet hole is inclined to the vertical direction, that is, the oblique jet hole is a straight hole inclined to the vertical direction, and the axis of the lateral jet hole includes a first axis portion parallel to the vertical direction and a second axis portion perpendicular to the first axis portion, that is, the axis of the lateral jet hole is L-shaped, so as to reduce airflow loss and facilitate gas injection.

[0081] In addition, the airway switching disk 302 is provided with a combined airway groove 3024, which is formed by extending radially along the airway switching disk 302, and each of the lower jet holes has an oblique jet hole and a lateral jet hole whose center is arranged on the same radial straight line as the center of the circle. That is to say, the centers of the corresponding lower jet holes, oblique jet holes and lateral jet holes are all arranged along a radial straight line of the jet element 200, and the extension track of the combined airway groove 3024 is also along the radial direction of the airway switching disk 302. The jet element 200 and the airway switching disk 302 are coaxially arranged. When the air path switching member 300 moves to the fourth preset position, the combined airway groove 3024 can be connected to the first jet hole group 201 and the second jet hole group 202 at the same time, so as to realize the combined jetting in the downward direction and the oblique downward direction; or, the length of the combined airway groove 3024 is long enough, and when the air path switching member 300 moves to the fourth preset position, the combined airway groove 3024 is connected to the first jet hole group 201, the second jet hole group 202 and the third jet hole group 203 at the same time, so as to realize the combined jetting in the downward direction, the oblique downward direction and the combined direction.

[0082] Specifically, the length of the combined airway groove 3024 is greater than the radial distance between the downward jet hole and the oblique downward jet hole, so that the combined airway groove 3024 can be connected to the first jet hole group 201 and the second jet hole group 202 at the same time, so as to realize the combined jetting in the downward direction and the oblique downward direction; or, the length of the combined airway groove 3024 is greater than the distance between the downward jet hole and the lateral jet hole, so that the combined airway groove 3024 is connected to the first jet hole group 201, the second jet hole group 202 and the third jet hole group 203 at the same time, so as to realize the combined jetting in the downward direction, the oblique downward direction and the combined direction.

[0083] It should be noted that the combined airway groove 3024 is not limited to the above two forms. The combined airway groove 3024 can also be moved radially toward the side away from the center of the circle, so that the length of the combined airway groove 3024 is greater than the radial distance between the oblique jet hole and the lateral jet hole, and the combined airway groove 3024 is simultaneously connected with the second jet hole group 202 and the third jet hole group 203, so that the second jet hole group 202 and the third jet hole group 203 can be jetted simultaneously; or, in the circumferential direction of the jet part, the corresponding downward jet hole, the oblique jet hole and the lateral jet hole are offset from each other, the length of the combined airway groove is greater than the radial distance between the downward jet hole and the lateral jet hole, and the combined airway groove extends on the line connecting the centers of the downward jet hole and the lateral jet hole, so that the combined airway groove 3024 connects the first jet hole group 201 and the third jet hole group 203, so that the first jet hole group 201 and the third jet hole group 203 can be jetted simultaneously.

[0084] Furthermore, the gas path switching component 300 also includes a gas uniforming disk 303 arranged on the switching shaft 301, and a plurality of gas uniforming holes are evenly distributed on the gas uniforming disk 303, and the shapes and sizes of the plurality of gas uniforming holes are equal, so as to make the gas flow evenly pass through the gas uniforming disk 303, thereby improving the uniformity of plasma concentration in the chamber of the plasma etcher, so that the uniformity of plasma etching is further improved.

[0085] In addition, the jet structure further includes a rotary drive member 400 for driving the gas circuit switching member 300 to rotate. The gas circuit switching member 300 is connected to the rotary output shaft of the rotary drive member 400 via a coupling 401 so as to drive the gas circuit switching member 300 to rotate via the rotary drive member 400 .

[0086] When the rotary drive member 400 drives the gas path switching member 300 to swing slightly within the angle interval between the lower gas through hole and the lower oblique gas through hole, and the combined gas channel groove 3024 is arranged outside the angle interval, the jet structure can achieve the following Fig.13When the rotary drive member 400 drives the gas path switching member 300 to swing in the maximum angle interval formed by the gas through hole directly below, the gas through hole obliquely below and the lateral gas through hole, and the combined gas channel groove 3024 is arranged outside the maximum angle interval, the jet structure can achieve the following Fig.14 Of course, it is also possible to only set the downward gas through hole, the oblique gas through hole and the lateral gas through hole on the airway switching disk 302, without setting the combined airway groove 3024, and when the rotating driving member 400 drives the airway switching member 300 to rotate continuously, the jet structure can also be realized as shown in the figure. Fig.14 In addition, when the airway switching disk 302 is provided with the downward gas through hole, the oblique gas through hole, the lateral gas through hole and the combined airway groove 3024 at the same time, as the rotating driving member 400 drives the airway switching member 300 to rotate continuously, the jet structure can be realized as follows Fig.15 The periodic pulse jet shown is a jet that jets in the downward direction, obliquely downward direction, sideways direction, and the downward and obliquely downward directions simultaneously and switches in sequence.

[0087] The air intake pipe sleeve 100 provided by the present invention is provided with an air intake pipeline 102 which can be communicated with an air source, so that the air source is introduced into the air injection structure through the air intake pipeline 102 to realize air injection.

[0088] In addition, the jet structure further includes a controller electrically connected to the rotary drive member 400, so as to control the jet hole group to perform periodic pulse jetting in multiple directions through the controller, and select a suitable jetting mode according to the relationship between the rotation angle and the jetting type pre-entered in the controller.

[0089] The above-mentioned gas circuit switching component 300 and the intake pipe sleeve 100 are sealed by magnetic fluid sealing or sealing ring sealing. As long as the sealing method can meet the sealing requirements, it belongs to the protection scope of the present invention; optionally, a first sealing ring 101 is provided between the gas circuit switching component 300 and the intake pipe sleeve 100 provided in the embodiment of the present invention for sealing.

[0090] In addition, the present invention also discloses a plasma etcher, including the jet structure as described above, and thus has all the technical effects of the jet structure as described above, which will not be described in detail herein.

[0091] Furthermore, the plasma etcher further comprises a plasma reaction chamber 500, a vacuum pump 600, a pressure control valve 700, an excitation RF power supply 800, a plasma coupling coil 501, a bias RF power supply 900 and a bias electrode 502; wherein the vacuum pump 600 is connected to the plasma reaction chamber 500, the pressure control valve 700 is arranged on the connecting pipeline between the plasma reaction chamber 500 and the vacuum pump 600, the plasma coupling coil 501 is electrically connected to the excitation RF power supply 800, the bias RF power supply 900 is electrically connected to the bias electrode 502, and the plasma coupling coil and the bias electrode 501 are electrically connected to each other. 2 is located in the plasma reaction chamber, and the plasma reaction chamber 500 is evacuated by a vacuum pump 600, and a process gas is sprayed into the plasma reaction chamber 500 through an air jet structure. Under vacuum low pressure, the radio frequency generated by the bias radio frequency power supply 900 is output to the annular plasma coupling coil 501, and plasma is generated under the action of the plasma coupling coil 501. The bias electrode 502 provides a bias voltage to accelerate the plasma to bombard the substrate, so that the chemical bonds of the semiconductor in the pattern area of ​​the substrate are broken, and volatile substances are generated with the etching gas, which are separated from the substrate in the form of gas and are pumped away from the vacuum pipeline.

[0092] In addition, the above-mentioned plasma etcher also includes a ceramic dielectric window 503 and a shielding cover 504; wherein, the ceramic dielectric window 503 is arranged in the plasma reaction chamber, and the jet structure is arranged on the ceramic dielectric window 503, so that the ceramic dielectric window 503 is reused to support the jet structure, and there is no need to set up additional supporting parts, thereby reducing the number of parts and components and reducing costs; the shielding cover 504 is arranged on the outside of the plasma reaction chamber to play a shielding role.

[0093] The jet structure and the ceramic medium window 503 may also be sealed with magnetic fluid or a sealing ring. Any sealing method that can meet the use requirements falls within the protection scope of the present invention. Optionally, a second sealing ring 5031 is provided between the jet structure and the ceramic medium window 503 provided in the embodiment of the present invention for sealing.

[0094] The terms "first" and "second" and the like in the specification and claims of the present invention and the above drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but may include steps or units that are not listed.

[0095] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A jet structure, characterized in that: include: An air inlet sleeve capable of being connected to an air source; An injection member is detachably connected to the air intake sleeve, and a receiving space is formed after the injection member and the air intake sleeve are connected; An air path switching component is movably disposed in the accommodation space; Wherein, the gas circuit switching component is provided with a gas through hole group, and the jet component is provided with a jet hole group, the number of the gas through hole groups and the jet hole groups are both multiple groups, and each group of the jet hole groups corresponds to a group of the gas through hole groups, and the jet direction of each group of the jet hole groups is different. Based on the movable setting of the gas circuit switching component, the conduction between the jet hole group and the corresponding gas through hole group can be switched to the conduction between another jet hole group and another gas through hole group.

2. The jet structure according to claim 1, characterized in that: The gas path switching component is rotatably disposed in the accommodating space.

3. The jet structure according to claim 2, characterized in that: The gas path switching component includes a switching shaft and an airway switching disk. The axis of the switching shaft is arranged perpendicular to the airway switching disk, and the gas through hole group is arranged on the airway switching disk.

4. The jet structure according to claim 3, characterized in that: The number of the jet hole groups is three, namely a first jet hole group, a second jet hole group and a third jet hole group; The number of the gas through hole groups is three, namely a first gas through hole group, a second gas through hole group and a third gas through hole group, wherein the first gas through hole group, the second gas through hole group and the third gas through hole group correspond to the first gas injection hole group, the second gas injection hole group and the third gas injection hole group respectively; Wherein, when the gas circuit switching component rotates to the first preset position, the first gas through hole group and the first injection hole group are connected; when the gas circuit switching component rotates to the second preset position, the second gas through hole group and the second injection hole group are connected; when the gas circuit switching component rotates to the third preset position, the third gas through hole group and the third injection hole group are connected.

5. The jet structure according to claim 4, characterized in that: The jet direction of the first jet hole group is vertically downward, the jet direction of the second jet hole group is inclined downward to the vertical direction, and the jet direction of the third jet hole group is perpendicular to the vertical direction.

6. The jet structure according to claim 5, characterized in that: The first jet hole group is arranged on a side of the second jet hole group close to the center of the jet element, and the third jet hole group is arranged on a side of the second jet hole group away from the center of the jet element; The first gas through hole group is arranged on a side of the second gas through hole group close to the center of the gas channel switching disk, and the third gas through hole group is arranged on a side of the second gas through hole group away from the center of the gas channel switching disk.

7. The jet structure according to claim 5, characterized in that: The first jet hole group includes a plurality of directly downward jet holes, the second jet hole group includes a plurality of obliquely downward jet holes, and the third jet hole group includes a plurality of lateral jet holes, wherein the number of the directly downward jet holes, the obliquely downward jet holes, and the lateral jet holes are all equal, and the plurality of directly downward jet holes, the plurality of obliquely downward jet holes, and the plurality of lateral jet holes are all distributed in a circular array with the center of the jet element as the array center; The first gas hole group includes a plurality of downward gas holes, the second gas hole group includes a plurality of downward slanting gas holes, and the third gas hole group includes a plurality of lateral gas holes, wherein the number of the downward gas holes, the downward slanting gas holes and the lateral gas holes are equal, and the plurality of downward gas holes, the downward slanting gas holes and the lateral gas holes are distributed in a circular array with the center of the airway switching disk as the array center.

8. The jetting structure according to claim 7, characterized in that: The centers of the corresponding downward jet holes, oblique downward jet holes and lateral jet holes are all located on the same radial straight line of the jet component, and on the circumference of the airway switching disk, the corresponding downward gas through holes, oblique downward gas through holes and lateral gas through holes are offset from each other.

9. The jet structure according to claim 7, characterized in that: On the circumference of the jet component, the corresponding downward jet holes, oblique downward jet holes and lateral jet holes are all offset from each other, and the centers of the corresponding downward gas through holes, oblique downward gas through holes and lateral gas through holes are all located on the same radial straight line of the airway switching disk.

10. The jetting structure according to claim 7, characterized in that: The axis of the downward jet hole is parallel to the vertical direction, the axis of the oblique jet hole is inclined to the vertical direction, and the axis of the lateral jet hole includes a first axis portion parallel to the vertical direction and a second axis portion perpendicular to the first axis portion.

11. The jetting structure according to claim 7, characterized in that: The airway switching disk is provided with a combined airway groove, which is formed by extending radially along the airway switching disk, and each downward jet hole has an oblique downward jet hole and a lateral jet hole arranged on the same radial straight line with its center; Wherein, when the gas circuit switching component moves to the fourth preset position, the combined gas channel groove is simultaneously connected to the first jet hole group and the second jet hole group; or, when the gas circuit switching component moves to the fourth preset position, the combined gas channel groove is simultaneously connected to the first jet hole group, the second jet hole group and the third jet hole group; or, when the gas circuit switching component moves to the fourth preset position, the combined gas channel groove is simultaneously connected to the second jet hole group and the third jet hole group; or, when the gas circuit switching component moves to the fourth preset position, the combined gas channel groove is simultaneously connected to the first jet hole group and the third jet hole group.

12. The jetting structure according to claim 11, characterized in that: The length of the combined airway groove is greater than the radial distance between the downward jet hole and the downward oblique jet hole; Alternatively, the length of the combined airway groove is greater than the distance between the downward jet hole and the lateral jet hole; Alternatively, the length of the combined airway groove is greater than the distance between the oblique downward air jet hole and the lateral air jet hole; Alternatively, in the circumferential direction of the jet component, the corresponding downward jet hole, the oblique downward jet hole and the lateral jet hole are all offset from each other, the length of the combined air duct groove is greater than the radial distance between the downward jet hole and the lateral jet hole, and the combined air duct groove extends on the line connecting the centers of the downward jet hole and the lateral jet hole.

13. The jetting structure according to claim 4, characterized in that: The gas path switching component further comprises an air uniforming disk arranged on the switching shaft, and a plurality of air uniforming holes are evenly distributed on the air uniforming disk, and the shapes and sizes of the plurality of air uniforming holes are equal.

14. The jetting structure according to claim 1, characterized in that: The jet structure further comprises a rotary drive member for driving the gas circuit switching member to rotate, and the gas circuit switching member is connected to a rotary output shaft of the rotary drive member via a coupling.

15. The jetting structure according to claim 1, characterized in that: The air intake pipe sleeve is provided with an air intake pipeline which can be communicated with an air source.

16. The jetting structure according to claim 1, characterized in that: The device also includes a controller electrically connected to the rotary drive member, so as to control the jet hole group to perform periodic pulse jetting in multiple directions through the controller.

17. The jetting structure according to claim 1, characterized in that: A magnetic fluid seal or a sealing ring seal is used between the gas path switching component and the air intake pipe sleeve.

18. A plasma etcher, characterized in that: Comprising the jet structure according to any one of claims 1 to 17.

19. The plasma etcher according to claim 18, characterized in that: It also includes a plasma reaction chamber, a vacuum pump, a pressure control valve, an excitation radio frequency power supply, a plasma coupling coil, a bias radio frequency power supply and a bias electrode; The vacuum pump is connected to the plasma reaction chamber, the pressure control valve is arranged on the connecting pipeline between the plasma reaction chamber and the vacuum pump, the plasma coupling coil is electrically connected to the excitation RF power supply, the bias RF power supply is electrically connected to the bias electrode, and the plasma coupling coil and the bias electrode are located in the plasma reaction chamber.

20. The plasma etcher according to claim 18, characterized in that: Also included are ceramic dielectric windows and shielding covers; The ceramic dielectric window is arranged in the plasma reaction chamber, the gas injection structure is arranged in the ceramic dielectric window, and the shielding cover is arranged outside the plasma reaction chamber.

21. The plasma etcher according to claim 20, characterized in that: The jet structure and the ceramic medium window are sealed by magnetic fluid sealing or sealing ring sealing.

Images