Intelligent diode chip packaging and detecting integrated device

Abstract

The invention discloses an intelligent diode chip packaging and detecting integrated device, and relates to the technical field of diode chip packaging and detection.The intelligent diode chip packaging and detecting integrated device comprises a shell, a first opening, a machine door, a plastic sealing head, a supporting table, a mechanical arm and a cooling assembly, the first opening is formed in the outer wall of the shell, and the machine door is installed on the outer wall of the shell; a plastic sealing head is installed on the inner wall of the shell, a supporting table is installed on the inner wall of the shell, and a mechanical arm is installed on the inner wall of the shell. A first supporting rod moves to drive a first sliding barrel to move, the first sliding barrel moves to enable the first supporting rod to drive a first spring to move, the first spring moves to enable the first supporting rod to drive a dispersing head to move, and the dispersing head moves to disperse a water source discharged by a first pipeline; and the dispersed water source is uniformly sprayed to the surface of the semiconductor cooling block to quickly cool the semiconductor cooling block, so that the function of quickly cooling the packaged diode chip to improve the production speed of the integrated device is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of diode chip packaging and detection, and in particular to an intelligent diode chip packaging and detection integrated device. Background Art

[0002] As one of the core components of electronic products, the quality and performance of diodes directly affect the stability and reliability of the entire system. With the continuous upgrading of electronic products, the quality inspection requirements for diodes are becoming higher and higher. The background technology of the intelligent diode chip packaging and detection integrated device involves the development trend of the semiconductor industry and the importance of diodes in electronic products. With the continuous expansion of the electronic product market and the continuous advancement of technology, the intelligent diode chip packaging and detection integrated device will have broad market application prospects. However, the diode chips of the existing diode chip packaging and detection integrated device cannot be quickly cooled down after packaging, which reduces the production speed of the integrated device.

[0003] The existing integrated diode chip packaging and testing device has the following defects: 1. Patent document CN115267512A discloses a detection device for chip package and a detection method for chip package, "including a fixed frame and a support assembly arranged on both sides of the fixed frame for supporting the packaging shell, the support assembly includes a rotatable traction rope and a partition fixedly sleeved on the outside of the traction rope, and the pins protruding from the packaging shell are placed between the two partitions; a limit assembly is arranged on the partition, and a driving assembly is arranged between the partition and the inner wall of the fixed frame. When the traction rope drives the packaging shell to move to the inside of the fixed frame, the driving assembly unfolds the limit assembly and places it on the top of the pin; through the elasticity of the traction rope itself, when the probe moves upward and squeezes the pin excessively, the traction rope will bend, so that the packaging shell moves upward to avoid direct confrontation with the probe, which can have a certain buffering effect on the packaging shell, which is beneficial to avoid hard contact between the probe and the pin, and can protect it well", but the diode chip of the existing diode chip packaging and detection integrated device cannot be quickly cooled down after packaging, which reduces the production speed of the integrated device; 2. Patent document CN113690159A discloses a chip package detection system and a chip package detection method, "including a conveying module, an image capture module, a detection module and a processor. The conveying module is used to convey a plurality of chip packages along a conveying path so that the plurality of chip packages sequentially pass through an imaging area and an inspection area on the conveying path. The image capture module is disposed in the imaging area and moves in the imaging area to capture a plurality of images of at least two adjacent chip packages among the plurality of chip packages in the imaging area. The inspection module is disposed in the inspection area to perform chip inspection on the plurality of chip packages. The processor is coupled to the image capture module and the inspection module to determine whether to perform parallel inspection on the at least two adjacent chip packages according to the plurality of images", but the diode chips of the existing diode chip packaging and inspection integrated device are not convenient to be removed after packaging, which reduces the discharge efficiency; 3. Patent document CN110849295A discloses a detection device applied to chip packaging process, "including a collimation detection part, a laser detection part and an alignment detection part respectively arranged between the chip and the substrate, the collimation detection part is used to preliminarily detect the parallelism between the chip and the substrate, the laser detection part is used to further detect the parallelism between the chip and the substrate, and the alignment detection part is used to detect the degree of alignment between the marking point of the chip and the marking point of the substrate. In addition to detecting the degree of alignment, two parallelism tests are required, and the detection accuracy is naturally improved. Therefore, the detection accuracy of the detection device applied to the chip packaging process provided by the present invention is relatively high. The present invention also discloses a chip packaging system including the above-mentioned detection device applied to the chip packaging process", but the existing diode chip packaging and detection integrated device cannot quickly detect unqualified diode chip packaging, reducing product output quality; 4. Patent document CN116774002B discloses a HAST test box for detecting chip packaging reliability, "including a box body, sealed placement bins are symmetrically arranged on both sides of the bottom of the box body, a storage cavity is arranged between the two sealed placement bins, a storage rack is installed in the middle of the storage cavity, and two working cavities are vertically arranged on the top of the box body, and detection placement mechanisms are installed in the two working cavities. A sealed door is connected to one side of the box body by a hinge, and a plurality of closed locks are arranged between the sealed door and the box body for locking; by starting a rotating motor to slowly drive the first placement tooth plate to rotate, the first placement tooth plate drives the second placement tooth plate to rotate, and then the first placement tooth plate and the second placement tooth plate are rotated to further increase the contact area between the product and the external environment and shorten the sufficient contact time, thereby improving the efficiency of the test", but the existing diode chip packaging and detection integrated device cannot quickly detect and remove unqualified diode chips, which reduces the manufacturing quality of diode chips. Summary of the invention

[0004] The purpose of the present invention is to provide an intelligent diode chip packaging and detection integrated device to solve the technical problem in the above-mentioned background technology that the diode chip of the diode chip packaging and detection integrated device cannot be quickly cooled after packaging, reducing the production speed of the integrated device.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an intelligent diode chip packaging and detection integrated device, comprising a shell, a No. 1 port, a machine door, a plastic sealing head, a support platform, a mechanical arm and a cooling component, the outer wall of the shell is provided with a No. 1 port, the outer wall of the shell is provided with a machine door, the inner wall of the shell is provided with a plastic sealing head, the inner wall of the shell is provided with a support platform, the inner wall of the shell is provided with a mechanical arm, the inner wall of the shell is provided with a cooling component, the outer wall of the No. 1 port is provided with a conveyor belt, the inner wall of the support platform is provided with a jacking component, and the top of the support platform is provided with a packaging groove; The cooling assembly includes a No. 1 box, a semiconductor cooling block, a No. 1 pipe, a water pump, a cooling pipe, a No. 1 motor, and a No. 1 L-shaped frame. The No. 1 box is located on the inner wall of the support platform, the semiconductor cooling block is located on the inner wall of the No. 1 box, the No. 1 pipe runs through the outer wall of the No. 1 box, the water pump runs through the outer wall of the No. 1 box, the cooling pipe is installed on the outer wall of the packaging groove, and the output end of the water pump extends to the inner wall of the cooling pipe, one end of the No. 1 pipe extends to the inner wall of the cooling pipe, the No. 1 motor runs through the outer wall of the No. 1 box, the No. 1 L-shaped frame is located on the inner wall of the No. 1 box, a No. 1 slide is installed on the outer wall of the No. 1 slide, a No. 1 support rod is installed on the outer wall of the No. 1 slide, a No. 1 support rod is installed on the outer wall of the No. 1 support rod, a No. 1 spring is installed on the outer wall of the No. 1 support rod, and one end of the No. 1 spring is connected to the outer wall of the No. 1 L-shaped frame, a No. 1 striking head is installed on the output end of the No. 1 motor, and a dispersion head is installed on the outer wall of the No. 1 support rod.

[0006] Preferably, the dispersion head moves through pipe No. 1, slide cylinder No. 1 moves through the support of L-shaped frame No. 1, striking head No. 1 is located above support rod No. 1, and the dispersion head is located above the semiconductor cooling block.

[0007] Preferably, the pushing assembly includes a No. 2 box, a top plate, a No. 2 opening, a No. 2 motor, a No. 2 spring, a limit block, and a top head. The No. 2 box is located on the inner wall of the support platform, the top plate is located on the inner wall of the packaging groove, the No. 2 opening is opened at the bottom of the packaging groove, a No. 1 support tube is installed through the top of the No. 2 box, a No. 2 L-shaped frame is installed through the inner wall of the No. 1 support tube, and one end of the No. 2 L-shaped frame is connected to the bottom of the top plate through the No. 2 opening, the No. 2 motor is located on the inner wall of the No. 2 box, the top head is located at the output end of the No. 2 motor, the No. 2 spring is located on the outer wall of the No. 2 L-shaped frame, and one end of the No. 2 spring is connected to the inner wall of the No. 2 box, and the limit block is located on the inner wall of the No. 2 box.

[0008] Preferably, the limit block is located below the second L-shaped frame, the top is located below the second L-shaped frame, and the second L-shaped frame moves through the first support cylinder.

[0009] Preferably, a detection component is installed on the inner wall of the shell, a pushing component is installed on the outer wall of the conveyor belt, and a collecting cylinder is installed on one side of the conveyor belt.

[0010] Preferably, the detection component includes a camera and a processing module. The camera is located on the inner wall of the shell, the camera is above the conveyor belt, the processing module is located on the outer wall of the shell, the processing module is electrically connected to the camera, the processing module is electrically connected to the pop-up component, the camera is used to capture the real-time image of the diode chip after packaging, and the processing module has a built-in image of a good product after the diode chip is packaged.

[0011] Preferably, the real-time image after the diode chip is packaged is transmitted to a processing module, which compares the real-time image after the diode chip is packaged with the image of good products after the diode chip is packaged. If the comparison results of the real-time image after the diode chip is packaged and the image of good products after the diode chip is packaged match, it is set as a qualified picture state; if the comparison results of the real-time image after the diode chip is packaged and the image of good products after the diode chip is packaged do not match, it is set as an unqualified picture state.

[0012] Preferably, the pushing assembly includes a No. 5 box, a No. 3 cylinder, a No. 5 cylinder, an air pump, a blocking ball, a T-shaped frame, a T-shaped push rod, and a No. 6 cylinder. The No. 5 box is located on the outer wall of the conveyor belt, the No. 3 cylinder is located on the inner wall of the No. 5 box, the No. 5 cylinder runs through the outer wall of the No. 3 cylinder, the air pump runs through the inner wall of the No. 5 box, and the output end of the air pump is connected to one end of the No. 5 cylinder, a sealing ring is installed on the inner wall of the No. 5 cylinder, a No. 5 spring is installed on the outer wall of the sealing ring, the T-shaped frame is located at one end of the No. 5 spring, the blocking ball is located at one end of the T-shaped frame, the No. 6 cylinder runs through the outer wall of the No. 5 box, the T-shaped push rod runs through the inner wall of the No. 6 cylinder, and one end of the T-shaped push rod extends to the inner wall of the No. 3 cylinder, and a sealing block is installed on one end of the T-shaped push rod.

[0013] Preferably, the T-shaped push rod is moved with the support of the No. 6 tube and the No. 3 tube, the sealing ring cooperates with the blocking ball to seal the No. 5 tube, the outer wall of the T-shaped push rod is installed with a No. 8 spring, and one end of the No. 8 spring is connected to the inner wall of the No. 5 box.

[0014] Preferably, the method for using the integrated device comprises the following steps: Step S1, the water pump is started to suck the cold water in the No. 1 box into the cooling pipe. At this time, the diode chip is packaged by the plastic sealing head and then cooled by the cooling pipe. The water source in the cooling pipe enters the No. 1 box through the No. 1 pipe. At this time, the No. 1 motor rotates to drive the No. 1 striking head to rotate, and the No. 1 striking head rotates to drive the No. 1 support rod to move. The movement of the No. 1 support rod drives the No. 1 slide cylinder to move, and the No. 1 slide cylinder moves to drive the No. 1 support rod to move the No. 1 spring. The movement of the No. 1 spring causes the No. 1 support rod to drive the dispersion head to move. The dispersion head moves to disperse the water source discharged from the No. 1 pipe, and the dispersed water source is evenly sprinkled on the surface of the semiconductor cooling block to quickly cool it down, thereby realizing the function of quickly cooling the diode chip after packaging and improving the production speed of the integrated device; Step S2, the function of the limit block is to provide a limit for the No. 2 L-shaped frame. After the diode chip is packaged and cooled, the No. 2 motor rotates to drive the top head to rotate, and the rotation of the top head drives the No. 2 L-shaped frame to move. The movement of the No. 2 L-shaped frame drives the No. 2 spring to move. The movement of the No. 2 spring causes the No. 2 L-shaped frame to drive the top plate to move. The top plate moves to push the packaged diode chip out of the packaging groove, realizing the function of conveniently removing the diode chip after packaging and improving the discharge efficiency; Step S3, when the processing module detects that the image is in a qualified state, the processing module controls the material pushing component not to start, and after the material pushing component is not started, the camera continues to shoot the real-time image of the diode chip after packaging until the processing module detects that the image is unqualified. When the processing module detects that the image is unqualified, the processing module controls the material pushing component to start, and after the material pushing component is started, the camera continues to shoot the real-time image of the diode chip after packaging until the processing module detects that the image is qualified, thereby realizing the function of the diode chip packaging and detection integrated device to quickly detect unqualified diode chip packaging and improve product output quality; Step S4, after the screen is in an unqualified state, the air pump starts to generate pressurized gas to drive the blocking ball to move, the movement of the blocking ball drives the T-shaped frame to move, the movement of the T-shaped frame drives the No. 5 spring to move, the movement of the No. 5 spring causes the blocking ball to move away from the sealing ring, at this time the No. 5 tube is opened to pass the gas into the No. 3 tube, and its pressurized gas drives the sealing block to move, the movement of the sealing block drives the T-shaped push rod to move, the movement of the T-shaped push rod drives the No. 8 spring to move, the movement of the No. 8 spring causes the T-shaped push rod to push the unqualified diode chip into the collection tube, thereby realizing the function of quickly detecting and removing unqualified diode chips and improving the manufacturing quality of diode chips.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention is installed with a water pump to start the cold water in the No. 1 box to suck into the cooling pipe. At this time, the diode chip is packaged by the plastic sealing head and then cooled by the cooling pipe. The water source in the cooling pipe enters the No. 1 box through the No. 1 pipe. At this time, the No. 1 motor rotates to drive the No. 1 striking head to rotate. The No. 1 striking head rotates to drive the No. 1 support rod to move. The No. 1 support rod moves to drive the No. 1 slide cylinder to move the No. 1 support rod to move the No. 1 spring. The No. 1 spring moves to drive the No. 1 support rod to move the dispersion head. The dispersion head moves to disperse the water source discharged from the No. 1 pipe. The dispersed water source is evenly sprinkled on the surface of the semiconductor cooling block to quickly cool it down, thereby realizing the function of quickly cooling the diode chip after packaging and improving the production speed of the integrated device. 2. The function of the present invention to provide a limit block for the No. 2 L-shaped frame is to provide a limit for the No. 2 L-shaped frame. After the diode chip is packaged and cooled, the No. 2 motor rotates to drive the head to rotate, and the rotation of the head drives the No. 2 L-shaped frame to move, and the No. 2 spring moves, and the No. 2 L-shaped frame drives the top plate to move. The top plate moves to push the packaged diode chip out of the packaging groove, thereby realizing the function of conveniently removing the packaged diode chip and improving the discharge efficiency; 3. The present invention is equipped with a processing module, and when it detects that the picture is in a qualified state, the processing module controls the material pushing component to not start. After the material pushing component is not started, the camera continues to shoot the real-time image of the diode chip after packaging until the processing module detects that the picture is unqualified. When the processing module detects that the picture is unqualified, the processing module controls the material pushing component to start. After the material pushing component is started, the camera continues to shoot the real-time image of the diode chip after packaging until the processing module detects that the picture is qualified, thereby realizing the function of the diode chip packaging and detection integrated device to quickly detect unqualified diode chip packaging and improve product output quality; 4. The present invention is installed with an air pump that starts to generate pressurized gas after the screen is in an unqualified state, which drives the blocking ball to move, and the movement of the blocking ball drives the T-shaped frame to move, and the movement of the T-shaped frame drives the No. 5 spring to move, and the movement of the No. 5 spring causes the blocking ball to move away from the sealing ring. At this time, the No. 5 tube is opened to pass the gas into the No. 3 tube, and its pressurized gas drives the sealing block to move, and the movement of the sealing block drives the T-shaped push rod to move, and the movement of the T-shaped push rod drives the No. 8 spring to move, and the movement of the No. 8 spring causes the T-shaped push rod to push the unqualified diode chip into the collecting tube, thereby realizing the function of quickly detecting and removing the unqualified diode chips and improving the manufacturing quality of the diode chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a front view structural schematic diagram of the present invention; Figure 2 It is a front structural schematic diagram of the present invention; Figure 3 It is a schematic diagram of the support platform structure of the present invention; Figure 4 It is a schematic diagram of the cooling pipe structure of the present invention; Figure 5 For the present invention Figure 4 A structural diagram of ; Figure 6 It is a schematic diagram of the top plate structure of the present invention; Figure 7 It is a schematic diagram of the camera structure of the present invention; Figure 8 It is a schematic diagram of the diode chip detection process of the present invention; Fig. 9 It is a schematic diagram of the T-shaped push rod structure of the present invention; Fig.10 For the present invention Fig. 9 Schematic diagram of the B structure.

[0017] In the figure: 1, housing; 2, machine door; 3, processing module; 4, port No. 1; 5, conveyor belt; 6, plastic sealing head; 7, mechanical arm; 8, support table; 9, box No. 1; 10, semiconductor cooling block; 11, water pump; 12, packaging slot; 13, cooling pipe; 14, pipeline No. 1; 15, motor No. 1; 16, striking head No. 1; 17, L-shaped frame No. 1; 18, slide cylinder No. 1; 19, spring No. 1; 20, support rod No. 1; 21, dispersion head; 22. Box No. 2; 23. Support cylinder No. 1; 24. L-shaped frame No. 2; 25. Opening No. 2; 26. Top plate; 27. Spring No. 2; 28. Limit block; 29. ​​Motor No. 2; 30. Top head; 31. Box No. 5; 32. Cylinder No. 6; 33. T-shaped push rod; 34. Cylinder No. 3; 35. Sealing block; 36. Air pump; 37. Cylinder No. 5; 38. Sealing ring; 39. Spring No. 5; 40. T-shaped frame; 41. Ball blocking; 42. Camera. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0020] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, it can be understood according to the specific situation.

[0021] Example 1: Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5, an embodiment provided by the present invention: an intelligent diode chip packaging and detection integrated device, comprising a shell 1, a No. 1 port 4, a machine door 2, a plastic sealing head 6, a support platform 8, a mechanical arm 7 and a cooling component, the outer wall of the shell 1 is provided with a No. 1 port 4, the outer wall of the shell 1 is provided with a machine door 2, the inner wall of the shell 1 is provided with a plastic sealing head 6, the inner wall of the shell 1 is provided with a support platform 8, the inner wall of the shell 1 is provided with a mechanical arm 7, the inner wall of the support platform 8 is provided with a cooling component, the outer wall of the No. 1 port 4 is provided with a conveyor belt 5, the inner wall of the support platform 8 is provided with a jacking component, the top of the support platform 8 is provided with a packaging groove 12, the inner wall of the shell 1 is provided with a detection component, the outer wall of the conveyor belt 5 is provided with a pushing component, and a collecting cylinder is provided on one side of the conveyor belt 5, and the machine door is opened. 2 The diode chip is placed in the packaging groove 12, and the plastic sealing head 6 is started to package the diode chip. After the diode chip is packaged, the mechanical arm 7 takes the diode chip to the surface of the conveyor belt 5, and the conveyor belt 5 is started to detect the diode chip and then move it out. The cooling assembly includes a No. 1 box 9, a semiconductor cooling block 10, a No. 1 pipeline 14, a water pump 11, a cooling pipe 13, a No. 1 motor 15, and a No. 1 L-shaped frame 17. The No. 1 box 9 is located on the inner wall of the support platform 8, the semiconductor cooling block 10 is located on the inner wall of the No. 1 box 9, the No. 1 pipeline 14 runs through the outer wall of the No. 1 box 9, the water pump 11 runs through the outer wall of the No. 1 box 9, the cooling pipe 13 is installed on the outer wall of the packaging groove 12, and the output end of the water pump 11 extends to the inner wall of the cooling pipe 13, and one end of the No. 1 pipeline 14 extends To the inner wall of the cooling pipe 13, the No. 1 motor 15 passes through the outer wall of the No. 1 box 9, the No. 1 L-shaped frame 17 is located on the inner wall of the No. 1 box 9, the No. 1 slide 18 is installed on the outer wall of the No. 1 slide 18, the No. 1 support rod 20 is installed on the outer wall of the No. 1 support rod 20, the No. 1 spring 19 is installed on the outer wall of the No. 1 support rod 20, and one end of the No. 1 spring 19 is connected to the outer wall of the No. 1 L-shaped frame 17, the No. 1 striking head 16 is installed on the output end of the No. 1 motor 15, the No. 1 support rod 20 is installed on the outer wall of the dispersion head 21, the dispersion head 21 is moved through the No. 1 pipe 14, the No. 1 slide 18 is moved by the support of the No. 1 L-shaped frame 17, the No. 1 striking head 16 is located above the No. 1 support rod 20, and the dispersion head 21 is located above the semiconductor cooling block 10 The water pump 11 is started to suck the cold water in the No. 1 box 9 into the cooling pipe 13. At this time, the diode chip is packaged by the plastic sealing head 6 and then cooled by the cooling pipe 13. The water source in the cooling pipe 13 enters the No. 1 box 9 through the No. 1 pipe 14. At this time, the No. 1 motor 15 rotates to drive the No. 1 striking head 16 to rotate. The No. 1 striking head 16 rotates to drive the No. 1 support rod 20 to move. The No. 1 support rod 20 moves to drive the No. 1 slide 18 to move. The No. 1 slide 18 moves to make the No. 1 support rod 20 drive the No. 1 spring 19 to move. The No. 1 spring 19 moves to make the No. 1 support rod 20 drive the dispersion head 21 to move. The dispersion head 21 moves to disperse the water source discharged from the No. 1 pipe 14. The dispersed water source is evenly sprinkled on the surface of the semiconductor cooling block 10 to quickly cool it down.The function of rapid cooling of the diode chip after packaging and improving the production speed of the integrated device is realized.

[0022] Example 2: Please refer to Figure 2 , Figure 3 and Figure 6 The present invention provides an embodiment: the push assembly includes a No. 2 box 22, a top plate 26, a No. 2 opening 25, a No. 2 motor 29, a No. 2 spring 27, a limit block 28, and a top head 30. The No. 2 box 22 is located on the inner wall of the support platform 8, the top plate 26 is located on the inner wall of the packaging groove 12, and the No. 2 opening 25 is opened at the bottom of the packaging groove 12. The top of the No. 2 box 22 is penetrated by a No. 1 support tube 23, and the inner wall of the No. 1 support tube 23 is penetrated by a No. 2 L-shaped frame 24, and one end of the No. 2 L-shaped frame 24 is connected to the bottom of the top plate 26 through the No. 2 opening 25. The No. 2 motor 29 is located on the inner wall of the No. 2 box 22, and the top head 30 is located at the output end of the No. 2 motor 29. The No. 2 spring 27 is located on the outer wall of the No. 2 L-shaped frame 24, and the No. 2 spring 27 is One end is connected to the inner wall of the No. 2 box 22, the limit block 28 is located on the inner wall of the No. 2 box 22, the limit block 28 is located below the No. 2 L-shaped frame 24, the top head 30 is located below the No. 2 L-shaped frame 24, the No. 2 L-shaped frame 24 is moved by the No. 1 support tube 23, the function of the limit block 28 is to provide a limit for the No. 2 L-shaped frame 24, after the diode chip package is cooled down, the No. 2 motor 29 rotates to drive the top head 30 to rotate, the rotation of the top head 30 drives the No. 2 L-shaped frame 24 to move, the No. 2 L-shaped frame 24 moves to drive the No. 2 spring 27 to move, the No. 2 spring 27 moves to make the No. 2 L-shaped frame 24 drive the top plate 26 to move, the top plate 26 moves to push the packaged diode chip out of the packaging groove 12, so as to realize the function of conveniently removing the diode chip after packaging and improving the discharge efficiency.

[0023] Example 3: Please refer to Figure 2 , Figure 7 and Figure 8An embodiment provided by the present invention: the detection component includes a camera 42 and a processing module 3, the camera 42 is located on the inner wall of the shell 1, the camera 42 is above the conveyor belt 5, the processing module 3 is located on the outer wall of the shell 1, the processing module 3 is electrically connected to the camera 42, the processing module 3 is electrically connected to the pop-up component, the camera 42 is used to capture the real-time image of the diode chip after packaging, the processing module 3 has a built-in good product image of the diode chip after packaging, the real-time image of the diode chip after packaging is transmitted to the processing module 3, the real-time image of the diode chip after packaging is compared with the good product image of the diode chip after packaging by the processing module 3, and the comparison result of the real-time image of the diode chip after packaging and the good product image of the diode chip after packaging is matched and set as the image is qualified state, if the comparison result between the real-time image of the diode chip after packaging and the qualified image of the diode chip after packaging does not match, it is set as an unqualified image state. When the processing module 3 detects the qualified image state, the processing module 3 controls the pushing component not to start. After the pushing component is not started, the camera 42 continues to shoot the real-time image of the diode chip after packaging until the processing module 3 detects the unqualified image state. When the processing module 3 detects the unqualified image state, the processing module 3 controls the pushing component to start. After the pushing component is started, the camera 42 continues to shoot the real-time image of the diode chip after packaging until the processing module 3 detects the qualified image state, thereby realizing the function of the integrated diode chip packaging and detection device to quickly detect unqualified diode chip packaging and improve product output quality.

[0024] Example 4: Please refer to Figure 2 , Fig. 9 and Fig.10The present invention provides an embodiment: the pushing assembly includes a No. 5 box 31, a No. 3 cylinder 34, a No. 5 cylinder 37, an air pump 36, a blocking ball 41, a T-shaped frame 40, a T-shaped push rod 33, and a No. 6 cylinder 32. The No. 5 box 31 is located on the outer wall of the conveyor belt 5, the No. 3 cylinder 34 is located on the inner wall of the No. 5 box 31, the No. 5 cylinder 37 runs through the outer wall of the No. 3 cylinder 34, the air pump 36 runs through the inner wall of the No. 5 box 31, and the output end of the air pump 36 is connected to one end of the No. 5 cylinder 37, a sealing ring 38 is installed on the inner wall of the No. 5 cylinder 37, and a No. 5 spring 39 is installed on the outer wall of the sealing ring 38, the T-shaped frame 40 is located at one end of the No. 5 spring 39, the blocking ball 41 is located at one end of the T-shaped frame 40, the No. 6 cylinder 32 runs through the outer wall of the No. 5 box 31, the T-shaped push rod 33 runs through the inner wall of the No. 6 cylinder 32, and one end of the T-shaped push rod 33 extends to the inner wall of the No. 3 cylinder 34, and the T-shaped push rod 3 A sealing block 35 is installed at one end of 3, and the T-shaped push rod 33 is moved by the support of the sixth tube 32 and the third tube 34, and the sealing ring 38 cooperates with the blocking ball 41 to seal the fifth tube 37. After the image is in an unqualified state, the air pump 36 is started to generate pressurized gas to drive the blocking ball 41 to move, and the movement of the blocking ball 41 drives the T-shaped frame 40 to move, and the movement of the T-shaped frame 40 drives the fifth spring 39 to move, and the movement of the fifth spring 39 causes the blocking ball 41 to move away from the sealing ring 38. At this time, the fifth tube 37 is opened to pass the gas into the third tube 34, and its pressurized gas drives the sealing block 35 to move, and the movement of the sealing block 35 drives the T-shaped push rod 33 to move, and the movement of the T-shaped push rod 33 drives the eighth spring to move, and the movement of the eighth spring causes the T-shaped push rod 33 to push the unqualified diode chip into the collecting tube, thereby realizing the function of quickly detecting and removing the unqualified diode chip and improving the manufacturing quality of the diode chip.

[0025] The method for using the integrated device comprises the following steps: Step S1, the water pump 11 is started to suck the cold water in the No. 1 box 9 into the cooling pipe 13. At this time, the diode chip is packaged by the plastic sealing head 6 and then cooled by the cooling pipe 13. The water source in the cooling pipe 13 enters the No. 1 box 9 through the No. 1 pipe 14. At this time, the No. 1 motor 15 rotates to drive the No. 1 striking head 16 to rotate. The No. 1 striking head 16 rotates to drive the No. 1 support rod 20 to move. The No. 1 support rod 20 moves to drive the No. 1 slide 18 to move so that the No. 1 support rod 20 drives the No. 1 spring 19 to move. The No. 1 spring 19 moves so that the No. 1 support rod 20 drives the dispersion head 21 to move. The dispersion head 21 moves to disperse the water source discharged from the No. 1 pipe 14. The dispersed water source is evenly sprinkled on the surface of the semiconductor cooling block 10 to quickly cool it down, thereby realizing the function of quickly cooling the diode chip after packaging and improving the production speed of the integrated device; Step S2, the function of the limit block 28 is to provide a limit for the No. 2 L-shaped frame 24. After the diode chip is packaged and cooled, the No. 2 motor 29 rotates to drive the top head 30 to rotate, and the rotation of the top head 30 drives the No. 2 L-shaped frame 24 to move. The movement of the No. 2 L-shaped frame 24 drives the No. 2 spring 27 to move. The movement of the No. 2 spring 27 causes the No. 2 L-shaped frame 24 to drive the top plate 26 to move. The top plate 26 moves to push the packaged diode chip out of the packaging groove 12, thereby realizing the function of conveniently removing the diode chip after packaging and improving the discharge efficiency; Step S3, when the processing module 3 detects that the image is in a qualified state, the processing module 3 controls the material pushing component to not start. After the material pushing component is not started, the camera 42 continues to shoot the real-time image of the diode chip after packaging until the processing module 3 detects that the image is unqualified. When the processing module 3 detects that the image is unqualified, the processing module 3 controls the material pushing component to start. After the material pushing component is started, the camera 42 continues to shoot the real-time image of the diode chip after packaging until the processing module 3 detects that the image is qualified, thereby realizing the function of the integrated diode chip packaging and detection device to quickly detect unqualified diode chip packaging and improve product output quality; Step S4, after the screen is in an unqualified state, the air pump 36 is started to generate pressurized gas to drive the blocking ball 41 to move, the movement of the blocking ball 41 drives the T-shaped frame 40 to move, the movement of the T-shaped frame 40 drives the No. 5 spring 39 to move, the movement of the No. 5 spring 39 causes the blocking ball 41 to move away from the sealing ring 38, at this time the No. 5 tube 37 is opened to pass the gas into the No. 3 tube 34, and its pressurized gas drives the sealing block 35 to move, the movement of the sealing block 35 drives the T-shaped push rod 33 to move, the movement of the T-shaped push rod 33 drives the No. 8 spring to move, the movement of the No. 8 spring causes the T-shaped push rod 33 to push the unqualified diode chip into the collecting tube, thereby realizing the function of quickly detecting and removing the unqualified diode chips and improving the manufacturing quality of the diode chips.

[0026] Working principle: the water pump 11 starts to suck the cold water in the No. 1 box 9 into the cooling pipe 13. At this time, the diode chip is packaged by the plastic sealing head 6 and then cooled by the cooling pipe 13. The water source in the cooling pipe 13 enters the No. 1 box 9 through the No. 1 pipe 14. At this time, the No. 1 motor 15 rotates to drive the No. 1 striking head 16 to rotate. The No. 1 striking head 16 rotates to drive the No. 1 support rod 20 to move. The No. 1 support rod 20 moves to drive the No. 1 slide 18 to move. The No. 1 slide 18 moves to make the No. 1 support rod 20 drive the No. 1 spring 19 to move. The No. 1 spring 19 moves to make the No. 1 support rod 20 drive the dispersion head 21 to move. The dispersion head 21 moves to discharge the No. 1 pipe 14. The water source is dispersed, and the dispersed water source is evenly sprinkled on the surface of the semiconductor cooling block 10 to quickly cool it down, thereby realizing the function of quickly cooling the diode chip after packaging and improving the production speed of the integrated device. The function of the limit block 28 is to provide a limit for the No. 2 L-shaped frame 24. After the diode chip is packaged and cooled, the No. 2 motor 29 rotates to drive the top head 30 to rotate, and the rotation of the top head 30 drives the No. 2 L-shaped frame 24 to move, and the movement of the No. 2 L-shaped frame 24 drives the No. 2 spring 27 to move, and the movement of the No. 2 L-shaped frame 24 drives the top plate 26 to move, and the top plate 26 moves to push the packaged diode chip out of the packaging groove 12, thereby realizing the convenient removal of the diode chip after packaging. The function of improving the discharge efficiency is that when the processing module 3 detects that the picture is in a qualified state, the processing module 3 controls the pushing component to not start. After the pushing component is not started, the camera 42 continues to shoot the real-time image of the diode chip after packaging until the processing module 3 detects that the picture is unqualified. When the processing module 3 detects that the picture is unqualified, the processing module 3 controls the pushing component to start. After the pushing component is started, the camera 42 continues to shoot the real-time image of the diode chip after packaging until the processing module 3 detects that the picture is qualified, thereby realizing the function of the diode chip packaging and detection integrated device to quickly detect unqualified diode chip packaging and improve the product output quality. The picture is not qualified. After the qualified state, the air pump 36 starts to generate pressurized gas to drive the blocking ball 41 to move, the movement of the blocking ball 41 drives the T-shaped frame 40 to move, the movement of the T-shaped frame 40 drives the No. 5 spring 39 to move, the movement of the No. 5 spring 39 causes the blocking ball 41 to move away the sealing ring 38, at this time the No. 5 tube 37 is opened to pass the gas into the No. 3 tube 34, and its pressurized gas drives the sealing block 35 to move, the movement of the sealing block 35 drives the T-shaped push rod 33 to move, the movement of the T-shaped push rod 33 drives the No. 8 spring to move, the movement of the No. 8 spring causes the T-shaped push rod 33 to push the unqualified diode chip into the collection tube, thereby realizing the function of quickly detecting and removing unqualified diode chips to improve the manufacturing quality of diode chips.

[0027] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. An intelligent diode chip packaging and detection integrated device, comprising a housing (1), a No. 1 port (4), a machine door (2), a plastic sealing head (6), a support platform (8), a mechanical arm (7) and a cooling component, characterized in that: The outer wall of the shell (1) is provided with a No. 1 opening (4), the outer wall of the shell (1) is provided with a machine door (2), the inner wall of the shell (1) is provided with a plastic sealing head (6), the inner wall of the shell (1) is provided with a support platform (8), the inner wall of the shell (1) is provided with a mechanical arm (7), the inner wall of the shell (1) is provided with a cooling component, the outer wall of the No. 1 opening (4) is provided with a conveyor belt (5), the inner wall of the support platform (8) is provided with a jacking component, and the top of the support platform (8) is provided with a packaging groove (12); The cooling assembly comprises a first box (9), a semiconductor cooling block (10), a first pipe (14), a water pump (11), a cooling pipe (13), a first motor (15), and a first L-shaped frame (17). The first box (9) is located on the inner wall of the support platform (8), the semiconductor cooling block (10) is located on the inner wall of the first box (9), the first pipe (14) runs through the outer wall of the first box (9), the water pump (11) runs through the outer wall of the first box (9), the cooling pipe (13) is installed on the outer wall of the packaging groove (12), and the output end of the water pump (11) extends to the inner wall of the cooling pipe (13), and one end of the first pipe (14) extends to the cooling pipe (13). The inner wall of the cooling tube (13), the No. 1 motor (15) penetrates the outer wall of the No. 1 box (9), the No. 1 L-shaped frame (17) is located on the inner wall of the No. 1 box (9), the No. 1 slide cylinder (18) is installed on the outer wall of the No. 1 L-shaped frame (17), the No. 1 support rod (20) is installed on the outer wall of the No. 1 slide cylinder (18), the No. 1 support rod (20) is installed on the outer wall of the No. 1 spring (19), and one end of the No. 1 spring (19) is connected to the outer wall of the No. 1 L-shaped frame (17), the No. 1 striking head (16) is installed on the output end of the No. 1 motor (15), and the No. 1 support rod (20) is installed on the outer wall of the No. 1 dispersion head (21).

2. The intelligent diode chip packaging and detection integrated device according to claim 1, characterized in that: The dispersion head (21) moves through the No. 1 pipeline (14), the No. 1 slide cylinder (18) moves through the support of the No. 1 L-shaped frame (17), the No. 1 striking head (16) is located above the No. 1 support rod (20), and the dispersion head (21) is located above the semiconductor cooling block (10).

3. The intelligent diode chip packaging and detection integrated device according to claim 1, characterized in that: The push-moving assembly comprises a No. 2 box (22), a top plate (26), a No. 2 opening (25), a No. 2 motor (29), a No. 2 spring (27), a stop block (28), and a push head (30); the No. 2 box (22) is located on the inner wall of the support platform (8); the top plate (26) is located on the inner wall of the packaging groove (12); the No. 2 opening (25) is opened at the bottom of the packaging groove (12); a No. 1 support tube (23) is installed through the top of the No. 2 box (22); and the inner wall of the No. 1 support tube (23) is provided with a A No. 2 L-shaped frame (24) is installed through the No. 2 L-shaped frame (24), and one end of the No. 2 L-shaped frame (24) is connected to the bottom of the top plate (26) through the No. 2 opening (25). The No. 2 motor (29) is located on the inner wall of the No. 2 box (22). The top head (30) is located at the output end of the No. 2 motor (29). The No. 2 spring (27) is located on the outer wall of the No. 2 L-shaped frame (24), and one end of the No. 2 spring (27) is connected to the inner wall of the No. 2 box (22). The limit block (28) is located on the inner wall of the No. 2 box (22).

4. The intelligent diode chip packaging and detection integrated device according to claim 3, characterized in that: The limit block (28) is located below the second L-shaped frame (24), the top head (30) is located below the second L-shaped frame (24), and the second L-shaped frame (24) is moved by the first support cylinder (23).

5. The intelligent diode chip packaging and detection integrated device according to claim 1, characterized in that: The inner wall of the shell (1) is installed with a detection component, the outer wall of the conveyor belt (5) is installed with a material pushing component, and one side of the conveyor belt (5) is installed with a collecting cylinder.

6. The intelligent diode chip packaging and detection integrated device according to claim 5, characterized in that: The detection component comprises a camera (42) and a processing module (3); the camera (42) is located on the inner wall of the shell (1); the camera (42) is located above the conveyor belt (5); the processing module (3) is located on the outer wall of the shell (1); the processing module (3) is electrically connected to the camera (42); the processing module (3) is electrically connected to the pop-up component; the camera (42) is used to capture a real-time image of the diode chip after packaging; and the processing module (3) has a built-in image of a good product of the diode chip after packaging.

7. The intelligent diode chip packaging and detection integrated device according to claim 6, characterized in that: The real-time image after the diode chip is packaged is transmitted to the processing module (3), and the real-time image after the diode chip is packaged is compared with the good product image after the diode chip is packaged by the processing module (3). If the comparison result between the real-time image after the diode chip is packaged and the good product image after the diode chip is packaged matches, the image is set to be in a qualified state; if the comparison result between the real-time image after the diode chip is packaged and the good product image after the diode chip is packaged does not match, the image is set to be in an unqualified state.

8. The intelligent diode chip packaging and detection integrated device according to claim 5, characterized in that: The pusher assembly comprises a No. 5 box (31), a No. 3 cylinder (34), a No. 5 cylinder (37), an air pump (36), a blocking ball (41), a T-shaped frame (40), a T-shaped push rod (33), and a No. 6 cylinder (32). The No. 5 box (31) is located on the outer wall of the conveyor belt (5), the No. 3 cylinder (34) is located on the inner wall of the No. 5 box (31), the No. 5 cylinder (37) penetrates the outer wall of the No. 3 cylinder (34), the air pump (36) penetrates the inner wall of the No. 5 box (31), and the output end of the air pump (36) is connected to one end of the No. 5 cylinder (37). The inner wall of the No. 5 cylinder (37) is provided with a sealing ring (38), the outer wall of the sealing ring (38) is provided with a No. 5 spring (39), a T-shaped frame (40) is located at one end of the No. 5 spring (39), a blocking ball (41) is located at one end of the T-shaped frame (40), the No. 6 cylinder (32) passes through the outer wall of the No. 5 box (31), a T-shaped push rod (33) passes through the inner wall of the No. 6 cylinder (32), and one end of the T-shaped push rod (33) extends to the inner wall of the No. 3 cylinder (34), and a sealing block (35) is provided at one end of the T-shaped push rod (33).

9. The intelligent diode chip packaging and detection integrated device according to claim 8, characterized in that: The T-shaped push rod (33) is supported by the No. 6 cylinder (32) and the No. 3 cylinder (34) to move, and the sealing ring (38) cooperates with the blocking ball (41) to seal the No. 5 cylinder (37). The outer wall of the T-shaped push rod (33) is installed with a No. 8 spring, and one end of the No. 8 spring is connected to the inner wall of the No. 5 box (31).

10. A method for using a smart diode chip packaging and detection integrated device, applicable to the smart diode chip packaging and detection integrated device according to any one of claims 1 to 9, characterized in that: The method for using the integrated device comprises the following steps: Step S1, the water pump (11) is started to suck the cold water in the No. 1 box (9) into the cooling pipe (13). At this time, the diode chip is packaged by the plastic sealing head (6) and then cooled by the cooling pipe (13). The water source in the cooling pipe (13) enters the No. 1 box (9) through the No. 1 pipe (14). At this time, the No. 1 motor (15) rotates to drive the No. 1 striking head (16) to rotate. The No. 1 striking head (16) rotates to drive the No. 1 support rod (20) to move. The No. 1 support rod (20) moves to drive the No. 1 slide cylinder (18). The No. 1 slide cylinder (18) moves to make the No. 1 support rod (20) drive the No. 1 spring (19) to move. The No. 1 spring (19) moves to make the No. 1 support rod (20) drive the dispersion head (21) to move. The dispersion head (21) moves to disperse the water source discharged from the No. 1 pipe (14). The dispersed water source is evenly sprinkled on the surface of the semiconductor cooling block (10) to quickly cool it down. Step S2, the function of the limit block (28) is to provide a limit for the No. 2 L-shaped frame (24). After the diode chip is packaged and cooled, the No. 2 motor (29) rotates to drive the top head (30) to rotate. The rotation of the top head (30) drives the No. 2 L-shaped frame (24) to move. The movement of the No. 2 L-shaped frame (24) drives the No. 2 spring (27) to move. The movement of the No. 2 spring (27) causes the No. 2 L-shaped frame (24) to drive the top plate (26) to move. The top plate (26) moves to push the packaged diode chip out of the packaging groove (12). Step S3, when the processing module (3) detects that the image is in a qualified state, the processing module (3) controls the material pushing component to not start, and after the material pushing component is not started, the camera (42) continues to capture the real-time image of the diode chip after packaging, until the processing module (3) detects that the image is in an unqualified state. When the processing module (3) detects that the image is in an unqualified state, the processing module (3) controls the material pushing component to start, and after the material pushing component is started, the camera (42) continues to capture the real-time image of the diode chip after packaging, until the processing module (3) detects that the image is in a qualified state; Step S4, after the screen is in an unqualified state, the air pump (36) is started to generate pressurized gas to drive the blocking ball (41) to move, the blocking ball (41) moves to drive the T-shaped frame (40), the T-shaped frame (40) moves to drive the No. 5 spring (39), the No. 5 spring (39) moves to make the blocking ball (41) move away from the sealing ring (38), at this time, the No. 5 tube (37) is opened to pass the gas into the No. 3 tube (34), the pressurized gas drives the sealing block (35) to move, the sealing block (35) moves to drive the T-shaped push rod (33), the T-shaped push rod (33) moves to drive the No. 8 spring, the No. 8 spring moves to make the T-shaped push rod (33) push the unqualified diode chip into the collection tube.

Images