Chip packaging structure

Abstract

The invention discloses a chip packaging structure, and relates to the technical field of semiconductor packaging. Comprising a packaging cover; the packaging cover and the packaging base are arranged in parallel at intervals from top to bottom; a plurality of middle box body assemblies are arranged, and the plurality of middle box body assemblies are sequentially stacked between the packaging cover and the packaging base from top to bottom; the heat dissipation assembly is arranged on the middle box body assembly; the middle box body assembly comprises an annular box body movably arranged between the packaging cover and the packaging base, a plurality of first clamping grooves and a plurality of second clamping grooves are formed in the two opposite inner walls of the annular box body respectively, and clamping rods are movably arranged between the first clamping grooves and the second clamping grooves; the heat dissipation assembly comprises a first threaded through hole and a second threaded through hole which are formed in the other two opposite inner walls of the annular box body, and a first pipeline and a second pipeline which are in one-to-one correspondence with the first threaded through hole and the second threaded through hole are movably arranged on the outer wall of the annular box body. The invention has the advantages that the influence of the cooling medium on the chip during cooling can be prevented, and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a chip packaging structure. Background Art

[0002] The higher the power density of a semiconductor power module, the greater its heat generation. When the heat generated by a semiconductor power module is high, if the power module is not cooled, on the one hand, the operating state of the power module will be unstable, and on the other hand, the life of the power module will be shortened. In the prior art, a liquid cooling plate is used to dissipate heat from the chip, and a cooling medium is introduced into the liquid cooling plate through a pipe. The circulating cooling medium can quickly take away the heat generated by the chip. However, the liquid cooling plate is prone to damage, causing the cooling medium to overflow from the damaged area, and the overflow of the cooling medium may cause the semiconductor power module to fail. Summary of the invention

[0003] In view of the above-mentioned technical deficiencies, an object of the present invention is to provide a chip packaging structure, which has the advantages of preventing the cooling medium from affecting the chip during cooling.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solution: The present invention provides a chip packaging structure, comprising:

[0005] Packaging cover;

[0006] The packaging base, the packaging cover and the packaging base are arranged in parallel and spaced apart from top to bottom;

[0007] An intermediate box body assembly, wherein a plurality of intermediate box body assemblies are provided, and the plurality of intermediate box body assemblies are stacked in sequence from top to bottom between the packaging cover and the packaging base;

[0008] A heat dissipation component, which is arranged on the middle box body component;

[0009] The intermediate box assembly comprises an annular box body movably arranged between the packaging cover and the packaging base, wherein two opposite inner walls of the annular box body are respectively provided with a plurality of first card slots and a plurality of second card slots, and a card rod is movably arranged between the first card slot and the second card slot;

[0010] The heat dissipation component includes a threaded through hole 1 and a threaded through hole 2 arranged on the other two inner walls of the annular box body that are opposite to each other. A pipe 1 and a pipe 2 corresponding to the threaded through hole 1 and the threaded through hole 2 are movably arranged on the outer wall of the annular box body. The pipe 1 is movably connected to the threaded through hole 1, the pipe 2 is movably connected to the threaded through hole 2, and the pipes 1 on the two adjacent annular boxes above and below are movably connected, and the pipes 2 on the two adjacent annular boxes above and below are movably connected.

[0011] Preferably, an installation groove is provided in the card rod, and elastic card seats are provided at both ends of the card rod in the length direction, and card plates 1 and 2 that match card slot 1 and card slot 2 are respectively provided on the side walls of the two elastic card seats. Card plates 1 and 2 are respectively movably inserted into card slot 1 and card slot 2, which is convenient for passing the chip through and fixing it in the installation groove on the card rod, and card plates 1 and 2 at both ends of the card rod in the length direction are respectively movably inserted into card slot 1 and card slot 2 for fixing, thereby improving the fixing effect of the chip.

[0012] Preferably, the pipe 1 and the pipe 2 are of the same size and shape, and the pipe 1 comprises:

[0013] The main pipeline 1 is an external threaded pipe structure, and the main pipeline 1 is threadedly connected to the threaded through hole 1;

[0014] The upper division is in charge of one;

[0015] The lower branch pipe 1, the upper branch pipe 1 and the lower branch pipe 1 are evenly distributed along the circumference of the end of the main pipe 1 away from the threaded through hole 1, and the upper branch pipe 1 and the lower branch pipe 1 are both connected to the main pipe 1;

[0016] Flange 1, multiple flanges 1 are provided, and flange 1 is provided at one end of the upper branch pipe 1 away from the main pipe 1 and at one end of the lower branch pipe 1 away from the main pipe 1;

[0017] A plugging device, wherein a plurality of plugging devices are provided, and a plugging device is movably provided at an end of the flange device away from the upper branch pipe device and an end of the flange device away from the lower branch pipe device;

[0018] Pipeline 2 includes:

[0019] Main pipeline 2, the main pipeline 2 is an external threaded pipe structure, and the main pipeline 2 is threadedly connected to the threaded through hole 2;

[0020] Upper Division II;

[0021] The lower branch pipe 2, the upper branch pipe 2 and the lower branch pipe 2 are evenly distributed along the circumference of one end of the main pipe 2 away from the threaded through hole 2, and the upper branch pipe 2 and the lower branch pipe 2 are both connected to the main pipe 2;

[0022] Flange 2, multiple flanges 2 are provided, and one end of the upper branch pipe 2 away from the main pipe 2 and one end of the lower branch pipe 2 away from the main pipe 2 are both provided with flange 2;

[0023] Plug 2, there are multiple plugs, and one end of flange 2 away from upper branch pipe 2 and one end of flange 2 away from lower branch pipe 2 are both movably provided with plugs, so that pipe 1 and pipe 2 on the upper and lower annular boxes can be connected in sequence according to the needs of the annular box, thereby effectively cooling the chip.

[0024] Preferably, a plurality of tube clamp seats are arranged on the top surface of the clamp rod, a heat dissipation hose is movably arranged between threaded through hole one and threaded through hole two, a movable clamp of the heat dissipation hose is arranged on the tube clamp seat, connecting tubes matching threaded through hole one and threaded through hole two are rotatably arranged at both ends of the heat dissipation hose in the length direction, and the two connecting tubes are respectively threadedly connected in threaded through hole one and threaded through hole two, so that the heat dissipation hose can be effectively fixed when in use.

[0025] Preferably, an arc-shaped groove matching the outer diameter of the heat dissipation hose is provided on the top surface of the tube clamp seat, and the heat dissipation hose is movably clamped in the arc-shaped opening of the arc-shaped groove, so as to effectively fix the heat dissipation hose.

[0026] Preferably, the elastic holder is a hollow rectangular frame structure, and the top and bottom of the elastic holder are both wave plate structures, so that the elastic holder can be compressed when the card rod is installed, and the elastic holder can be reset after the card rod is installed.

[0027] Preferably, the top of the card slot one and the top of the card slot two are both provided with anti-idiot grooves, and card plate one and card plate two are both provided with anti-idiot cards that are compatible with the shape and size of the anti-idiot grooves, which can prevent card plate one and card plate two from loosening after being installed in the anti-idiot grooves at the corresponding positions.

[0028] Preferably, a sealing ring clamp is provided on the bottom surface of the packaging cover and on the bottom opening of the annular box body, and a sealing ring clamp groove is provided on the top surface of the packaging base and on the top opening of the annular box body. The shape and size of the sealing ring clamp and the sealing ring clamp groove are matched, so as to improve the overall sealing performance.

[0029] Preferably, the packaging cover is provided with a plurality of locking bolts evenly distributed along the circumference, the packaging base is provided with a plurality of internal threaded bottom holes compatible with the locking bolts, the sealing ring groove is provided with a plurality of internal threaded through holes compatible with the locking bolts, the locking bolts are movably passed through the internal threaded through holes and connected to the internal threaded bottom holes at corresponding positions, thereby improving the overall sealing.

[0030] The beneficial effects of the present invention are: 1. By setting up the heat dissipation component, an appropriate number of intermediate box body components can be installed according to the number of chips, thereby improving the applicability of the chip packaging structure; and multiple intermediate box body components can be connected through pipeline one and pipeline two, thereby ensuring a better cooling effect on the chip; at the same time, it avoids the disadvantage of the cooling medium affecting the chip when using a liquid cooling plate for cooling in the prior art.

[0031] 2. The heat dissipation hose is arranged so that the outer peripheral wall of the heat dissipation hose is in contact with the chip on the clamping rod, thereby facilitating the heat dissipation effect on the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 A schematic structural diagram of a chip packaging structure provided by an embodiment of the present invention.

[0034] Figure 2 A schematic diagram of a packaging cover structure of a chip packaging structure provided by an embodiment of the present invention.

[0035] Figure 3 A schematic diagram of a packaging base structure of a chip packaging structure provided by an embodiment of the present invention.

[0036] Figure 4 A schematic diagram of the position of a clamping rod of a chip packaging structure provided by an embodiment of the present invention.

[0037] Figure 5 A schematic diagram of the position of a threaded through hole in a chip packaging structure provided by an embodiment of the present invention.

[0038] Figure 6 for Figure 5 A schematic diagram of the enlarged structure in the middle.

[0039] Figure 7 A schematic diagram of a clamping rod structure of a chip packaging structure provided by an embodiment of the present invention.

[0040] Figure 8 for Figure 7 Enlarged schematic diagram of the structure at point B in the middle.

[0041] Fig. 9 A schematic diagram of the blocking first and blocking second positions of a chip packaging structure provided by an embodiment of the present invention.

[0042] Fig.10 for Fig. 9 Enlarged schematic diagram of the structure at point C in the middle.

[0043] Description of the reference numerals: 1. packaging cover; 11. locking bolt; 12. internal thread bottom hole; 13. internal thread through hole; 2. packaging base; 3. intermediate box body assembly; 31. annular box body; 311. sealing ring clamp; 312. sealing ring clamp groove; 32. clamp groove 1; 33. clamp groove 2; 34. clamp rod; 341. mounting groove; 342. elastic clamp seat; 343. clamp plate 1; 344. clamp plate 2; 35. foolproof groove; 351. foolproof clamp; 4. Thermal component; 41, threaded through hole one; 42, threaded through hole two; 43, pipe one; 431, main pipe one; 432, upper branch pipe one; 433, lower branch pipe one; 434, flange one; 435, plug one; 44, pipe two; 441, main pipe two; 442, upper branch pipe two; 443, lower branch pipe two; 444, flange two; 445, plug two; 45, connecting pipe; 46, pipe holder; 461, arc-shaped slot; 47, heat dissipation hose. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] Embodiment 1

[0046] like Figures 1 to 8 As shown, the present invention provides a chip packaging structure, including a packaging cover 1; the packaging cover 1 and the packaging base 2 are arranged in parallel and spaced from top to bottom; a plurality of intermediate box body components 3 are provided, and the plurality of intermediate box body components 3 are stacked in sequence from top to bottom between the packaging cover 1 and the packaging base 2; a heat dissipation component 4 is arranged on the intermediate box body component 3; the intermediate box body component 3 includes an annular box body 31 movably arranged between the packaging cover 1 and the packaging base 2, and the annular box body 31 has a plurality of first card slots 32 and a plurality of second card slots 33 respectively arranged on two opposite inner walls, and the card slots 1 32 and the card slots 2 33 are movably arranged between them. A clamping rod 34 is movably provided; the heat dissipation component 4 includes a threaded through hole 1 41 and a threaded through hole 2 42 arranged on the other two opposite inner walls of the annular box body 31, and a pipe 1 43 and a pipe 2 44 corresponding to the threaded through hole 1 41 and the threaded through hole 2 42 are movably provided on the outer wall of the annular box body 31, and the pipe 1 43 is movably connected to the threaded through hole 1 41, and the pipe 2 44 is movably connected to the threaded through hole 2 42, and the pipe 1 43 on the two adjacent annular box bodies 31 are movably connected, and the pipe 2 44 on the two adjacent annular box bodies 31 are movably connected.

[0047] An installation groove 341 is provided in the card rod 34, and elastic card seats 342 are provided at both ends of the length direction of the card rod 34. Card plates 1 343 and 344 matching card slot 1 32 and card slot 2 33 are respectively provided on the side walls of the two elastic card seats 342. Card plates 1 343 and 344 are respectively movably inserted in card slot 1 32 and card slot 2 33.

[0048] The number of intermediate box body components 3 to be used is selected according to the number of chips (that is, when there is only one chip, one intermediate box body component 3 can be installed between the packaging cover 1 and the packaging base 2; when there are multiple chips, multiple intermediate box body components 3 can be installed in sequence between the packaging cover 1 and the packaging base 2); two clamping rods 34 can be installed in the same annular box body 31 at the same time, so that the two ends of the chip can be respectively clamped into the installation grooves 341 in the two clamping rods 34; then the clamping plate 1 343 and the clamping plate 2 344 at the two ends of the clamping rod 34 in the length direction are respectively clamped into the opposite The first and second card slots 32 and 33 are inserted into the corresponding card slots 32 and 33 (according to the size of the chip, the distance between the two card rods 34 is adjusted so that the card plates 1 343 and 344 at both ends are inserted into the corresponding card slots 32 and 33); and then the pipe 1 43 and the second card slot 44 are respectively threadedly connected to the threaded through hole 1 41 and the threaded through hole 2 42 on the two inner walls of the annular box body 31, so that the pipe 1 43 or the pipe 2 44 can be connected to the air outlet of the cold air fan set outside (the pipe 2 44 or the pipe 1 43 can be exhausted).

[0049] When only one intermediate box body assembly 3 is installed, pipe one 43 or pipe two 44 can be used as air intake, and pipe two 44 or pipe one 43 can be used as exhaust; when multiple intermediate box body assemblies 3 are installed, pipe one 43 or pipe two 44 in the intermediate box body assembly 3 located in the upper layer can be used as air intake, and pipe two 44 or pipe one 43 in the intermediate box body assembly 3 located in the lower layer can be used as exhaust, so that cold air can pass through the interior of each intermediate box body assembly 3, thereby achieving a better cooling effect on the chip.

[0050] The elastic holder 342 is a hollow rectangular frame structure, and the top and bottom of the elastic holder 342 are both wavy plate structures, so that the elastic holder 342 can be compressed when the card rod 34 is installed, so that the card plate 1 343 and the card plate 2 344 at both ends of the length direction of the card rod 34 can be respectively inserted into the card slot 1 32 and the card slot 2 33 at the corresponding positions; at the same time, after the card rod 34 is installed, the elastic holder 342 can be reset, which is beneficial to keep the position of the card rod 34 stable.

[0051] The top of the card slot 1 32 and the top of the card slot 2 33 are both provided with anti-idiot grooves 35, and the card plate 1 343 and the card plate 2 344 are both provided with anti-idiot cards 351 that are compatible with the shape and size of the anti-idiot grooves 35, which can prevent the card plate 1 343 and the card plate 2 344 from loosening after being installed in the anti-idiot grooves 35 at the corresponding positions.

[0052] When the clamping rod 34 is installed in the annular box body 31, since a sealing ring clamp 311 is provided on the bottom surface of the packaging cover 1 and on the bottom surface opening of the annular box body 31, a sealing ring clamp groove 312 is provided on the top surface of the packaging base 2 and on the top surface opening of the annular box body 31, the shape and size of the sealing ring clamp 311 and the sealing ring clamp groove 312 are adapted to each other; a plurality of locking bolts 11 are evenly distributed along the circumference of the packaging cover 1, a plurality of internal threaded bottom holes 12 adapted to the locking bolts 11 are provided on the packaging base 2, a plurality of internal threaded through holes 13 adapted to the locking bolts 11 are provided in the sealing ring clamp groove 312, and the locking bolts 11 are movably penetrated through the internal threaded through holes 13 and connected to the internal threaded bottom holes 12 at corresponding positions; the annular box body 31 can be installed between the packaging cover 1 and the packaging base 2, and the sealing ring clamp 311 on the bottom surface of the packaging cover 1 is inserted into The sealing ring clamp 311 is inserted into the sealing ring clamp groove 312 on the top surface of the annular box body 31 (when multiple intermediate box body assemblies 3 are installed, the sealing ring clamp 311 on the bottom surface of the packaging cover 1 is inserted into the sealing ring clamp groove 312 on the top surface of the annular box body 31 at the uppermost position), and the sealing ring clamp 311 on the bottom surface opening of the annular box body 31 is inserted into the sealing ring clamp groove 312 on the top surface of the packaging base 2 (when multiple intermediate box body assemblies 3 are installed, the sealing ring clamp 311 on the bottom surface opening of the annular box body 31 at the lowermost position is inserted into the sealing ring clamp groove 312 on the top surface of the packaging base 2); then the locking bolt 11 is passed through the packaging cover 1 and the annular box body 31 (that is, passed through the sealing ring clamp 311 and the sealing ring clamp groove 312) and is threadedly connected to the internal threaded bottom hole 12 on the packaging base 2, thereby achieving better sealing after chip packaging.

[0053] Embodiment 2

[0054] Based on the first embodiment, Figure 1 , Figures 4 to 5 , Fig. 9As shown, the size and shape of pipeline 1 43 and pipeline 2 44 are the same. Pipe 1 43 includes a main pipeline 1 431, which is an externally threaded pipe structure, and the main pipeline 1 431 is threadedly connected to the threaded through hole 1 41; the upper branch pipe 1 432 and the lower branch pipe 1 433 are evenly distributed along the circumference of the end of the main pipeline 1 431 away from the threaded through hole 1 41, and the upper branch pipe 1 432 and the lower branch pipe 1 433 are both connected to the main pipeline 1 431; a plurality of flanges 1 434 are provided, and the end of the upper branch pipe 1 432 away from the main pipeline 1 431 and the end of the lower branch pipe 1 433 away from the main pipeline 1 431 are both provided with flanges 1 434; a plurality of plugs 1 435 are provided, and the end of the flange 1 434 away from the upper branch pipe 1 432 and the end of the flange 1 434 away from the lower branch pipe 1 433 are both movable A plug 435 is movably provided; the pipeline 44 comprises: a main pipeline 441, the main pipeline 441 is an external threaded pipe structure, and the main pipeline 441 is threadedly connected with the threaded through hole 42; the upper branch pipe 442 and the lower branch pipe 443 are evenly distributed circumferentially along the end of the main pipeline 441 away from the threaded through hole 42, and the upper branch pipe 442 and the lower branch pipe 443 are both connected to the main pipeline 441; a plurality of flanges 444 are provided, and the end of the upper branch pipe 442 away from the main pipeline 441 and the end of the lower branch pipe 443 away from the main pipeline 441 are both provided with flanges 444; a plurality of plugs 445 are provided, and the end of the flange 444 away from the upper branch pipe 442 and the end of the flange 444 away from the lower branch pipe 443 are both movably provided with plugs 445.

[0055] When an annular box body 31 is used (i.e., an annular box body 31 is installed between the packaging cover 1 and the packaging base 2), the flange 1 434 on the upper branch pipe 1 432 or the lower branch pipe 1 433 in the pipeline 1 43 can be removed (and the flange 2 444 on the upper branch pipe 2 442 or the lower branch pipe 2 443 in the pipeline 2 44 can also be removed); and then the lower branch pipe 1 433 or the upper branch pipe 1 432 in the pipeline 1 43 is connected to the air outlet of the cooling fan arranged outside (or the lower branch pipe 2 443 or the upper branch pipe 443 in the pipeline 2 44 is connected to the air outlet of the cooling fan arranged outside). The second branch pipe 442 is connected to the air outlet of the cooling fan set outside), and the cold air can enter the annular box body 31 through the lower branch pipe 1 433 or the upper branch pipe 1 432 in the pipeline 1 43 (or the lower branch pipe 2 443 or the upper branch pipe 2 442 in the pipeline 2 44) to cool the chip. The cold air entered into the annular box body 31 is then discharged through the lower branch pipe 2 443 or the upper branch pipe 2 442 in the pipeline 2 44 (or the lower branch pipe 1 433 or the upper branch pipe 1 432 in the pipeline 1 43), thereby achieving the effect of cooling the chip.

[0056] When multiple annular box bodies 31 are used (i.e., two or more annular box bodies 31 are installed between the packaging cover 1 and the packaging base 2), the multiple annular box bodies 31 can be stacked up from top to bottom, and the upper branch pipe 1 432 and the plugging 1 435 on the lower branch pipe 1 433 of the pipeline 1 43 on each annular box body 31 are removed, and the upper branch pipe 2 442 and the plugging 2 445 on the lower branch pipe 2 443 of the pipeline 2 44 are removed at the same time; and then the pipelines 1 43 on the two adjacent annular box bodies 31 are connected (i.e., the upper branch pipe 1 432 and the lower branch pipe 1 433 on the pipeline 1 43 are connected). The lower branch pipe 1 433 in the annular box body 31 at the upper position is connected to the upper branch pipe 1 432 in the annular box body 31 at the lower position through a flange 1 434), and the pipes 44 on the two adjacent annular boxes 31 are connected at the same time (that is, the lower branch pipe 2 443 in the annular box body 31 at the upper position is connected to the upper branch pipe 2 442 in the annular box body 31 at the lower position through a flange 1 434); then the upper branch pipe 1 432 (or pipe 1 432) in the pipe 1 43 on the annular box body 31 at the uppermost layer is connected. The upper branch pipe 242 in the second pipe 44 is connected to the air outlet of the cold air machine arranged outside, and the lower branch pipe 243 in the second pipe 44 of the second pipe 44 on the annular box body 31 at the lowest layer is not installed with the plug 245; the cold air enters through the upper branch pipe 1 432 in the first pipe 43 of the first pipe 43 on the annular box body 31 at the highest layer (or the upper branch pipe 242 in the second pipe 44), and then passes through each annular box body 31 from top to bottom in sequence, and finally is discharged through the lower branch pipe 243 in the second pipe 44 of the second pipe 44 on the annular box body 31 at the lowest layer At this time, the cold air can pass through each annular box body 31 in sequence, so as to achieve the effect of heat dissipation for each chip (the remaining air outlets of the cold air fan that are not connected to the outside and the upper branch pipe 1 432, the lower branch pipe 1 433, the upper branch pipe 2 442 or the lower branch pipe 2 443 for discharging cold air are blocked by using the blocking 1 435 and the blocking 2 445; the blocking 1 435 or the blocking 2 445 on multiple upper branch pipes 1 432, the lower branch pipe 1 433, the upper branch pipe 2 442 or the lower branch pipe 2 443 can also be removed at the same time to increase the exhaust speed.

[0057] Embodiment 3

[0058] Based on the first embodiment, Figures 7 to 10As shown, a plurality of pipe clamping seats 46 are arranged on the top surface of the clamping rod 34, a heat dissipation hose 47 is movably arranged between the threaded through hole 1 41 and the threaded through hole 2 42, and the heat dissipation hose 47 is movably clamped on the pipe clamping seat 46, and connecting pipes 45 matching the threaded through hole 1 41 and the threaded through hole 2 42 are rotatably arranged at both ends of the length direction of the heat dissipation hose 47, and the two connecting pipes 45 are respectively threadedly connected in the threaded through hole 1 41 and the threaded through hole 2 42; an arc-shaped clamping groove 461 matching the outer diameter of the heat dissipation hose 47 is arranged on the top surface of the pipe clamping seat 46, and the heat dissipation hose 47 is movably clamped in the arc-shaped clamping groove 461 When the heat dissipation hose 47 needs to be installed, the connecting pipes 45 at both ends of the length direction of the heat dissipation hose 47 can be connected to the threaded through hole 1 41 and the threaded through hole 2 42 respectively (the connecting pipe 45 is a threaded pipe structure, which can facilitate the threaded connection or disassembly between the connecting pipe 45 and the threaded through hole 1 41 and the threaded through hole 2 42); because the heat dissipation hose 47 is a hose, after the connecting pipe 45 is connected to the threaded through hole 1 41 and the threaded through hole 2 42, the heat dissipation hose 47 can be clamped into the arc-shaped clamping groove 461 on the pipe clamping seat 46 at the corresponding position according to the length of the heat dissipation hose 47 (such as Fig.10 As shown), the heat dissipation hose 47 can be fixed (a longer heat dissipation hose 47 can be used, so that the heat dissipation hose 47 is distributed in a snake shape, and at the same time, the outer peripheral wall of the heat dissipation hose 47 is in contact with the chip on the clamp rod 34, which is beneficial to improve the heat dissipation effect of the chip.

[0059] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A chip packaging structure, characterized in that: include: Packaging cover (1); The packaging base (2), the packaging cover (1) and the packaging base (2) are arranged in parallel and spaced apart from top to bottom; An intermediate box body assembly (3), wherein a plurality of intermediate box body assemblies (3) are provided, and the plurality of intermediate box body assemblies (3) are stacked in sequence from top to bottom between the packaging cover (1) and the packaging base (2); A heat dissipation component (4), the heat dissipation component (4) being arranged on the middle box body component (3); The intermediate box body component (3) comprises an annular box body (31) movably arranged between the packaging cover (1) and the packaging base (2); a plurality of first card slots (32) and a plurality of second card slots (33) are respectively arranged on two opposite inner walls of the annular box body (31); and a card rod (34) is movably arranged between the first card slot (32) and the second card slot (33); The heat dissipation component (4) comprises a threaded through hole (41) and a threaded through hole (42) arranged on the other two opposite inner walls of the annular box body (31); a pipe (43) and a pipe (44) corresponding to the threaded through hole (41) and the threaded through hole (42) are movably arranged on the outer wall of the annular box body (31); the pipe (43) and the threaded through hole (41) are movably connected; the pipe (44) and the threaded through hole (42) are movably connected; and the pipes (43) on the two adjacent annular boxes (31) are movably connected; and the pipes (44) on the two adjacent annular boxes (31) are movably connected.

2. A chip packaging structure as claimed in claim 1, characterized in that: A mounting groove (341) is arranged in the clamping rod (34), and elastic clamping seats (342) are arranged at both ends of the clamping rod (34) in the length direction. A clamping plate (343) and a clamping plate (344) that are matched with the clamping slot (32) and the clamping slot (33) are arranged on the side walls of the two elastic clamping seats (342), respectively. The clamping plate (343) and the clamping plate (344) are movably inserted in the clamping slot (32) and the clamping slot (33) respectively.

3. The chip packaging structure according to claim 1, characterized in that: The size and shape of the pipeline 1 (43) and the pipeline 2 (44) are the same. The pipeline 1 (43) includes: The main pipe 1 (431) is an externally threaded pipe structure, and the main pipe 1 (431) is threadedly connected to the threaded through hole 1 (41); Upper Division 1 (432); The lower branch pipe (433), the upper branch pipe (432) and the lower branch pipe (433) are evenly distributed along the circumference of one end of the main pipe (431) away from the threaded through hole (41), and the upper branch pipe (432) and the lower branch pipe (433) are both connected to the main pipe (431); Flange 1 (434), multiple flanges 1 (434) are provided, and one end of the upper branch pipe 1 (432) away from the main pipe 1 (431) and one end of the lower branch pipe 1 (433) away from the main pipe 1 (431) are both provided with flange 1 (434); A plug (435), wherein a plurality of plugs (435) are provided, and a plug (435) is movably provided at one end of the flange (434) away from the upper branch pipe (432) and one end of the flange (434) away from the lower branch pipe (433); Pipeline 2 (44) includes: The second main pipe (441) is an externally threaded pipe structure, and the second main pipe (441) is threadedly connected to the second threaded through hole (42); Upper Division II (442); The lower branch pipe 2 (443), the upper branch pipe 2 (442) and the lower branch pipe 2 (443) are evenly distributed along the circumference of one end of the main pipe 2 (441) away from the threaded through hole 2 (42), and the upper branch pipe 2 (442) and the lower branch pipe 2 (443) are both connected to the main pipe 2 (441); Flange 2 (444), multiple flanges 2 (444) are provided, and flange 2 (444) is provided at one end of the upper branch pipe 2 (442) away from the main pipe 2 (441) and at one end of the lower branch pipe 2 (443) away from the main pipe 2 (441); The second plug (445) is provided in plurality, and the second plug (445) is movably provided at one end of the second flange (444) away from the second upper branch pipe (442) and at one end of the second flange (444) away from the second lower branch pipe (443).

4. The chip packaging structure according to claim 1, characterized in that: A plurality of pipe clamping seats (46) are arranged on the top surface of the clamping rod (34), and a heat dissipation hose (47) is movably arranged between the first threaded through hole (41) and the second threaded through hole (42). The heat dissipation hose (47) is movably clamped on the pipe clamping seat (46), and connecting pipes (45) adapted to the first threaded through hole (41) and the second threaded through hole (42) are rotatably arranged at both ends of the heat dissipation hose (47) in the length direction, and the two connecting pipes (45) are respectively threadedly connected in the first threaded through hole (41) and the second threaded through hole (42).

5. A chip packaging structure as claimed in claim 4, characterized in that: An arc-shaped clamping groove (461) matching the outer diameter of the heat dissipation hose (47) is arranged on the top surface of the tube clamping seat (46), and the heat dissipation hose (47) is movably clamped in the arc-shaped opening of the arc-shaped clamping groove (461).

6. A chip packaging structure as claimed in claim 2, characterized in that: The elastic card seat (342) is a hollow rectangular frame-shaped structure, and the top and bottom of the elastic card seat (342) are both wave plate-shaped structures.

7. The chip packaging structure according to claim 1, characterized in that: The top of the first card slot (32) and the top of the second card slot (33) are both provided with anti-mistake grooves (35), and the first card plate (343) and the second card plate (344) are both provided with anti-mistake cards (351) that are compatible with the shape and size of the anti-mistake grooves (35).

8. The chip packaging structure according to claim 1, characterized in that: A sealing ring clamp (311) is provided on the bottom surface of the packaging cover (1) and on the bottom surface opening of the annular box body (31), and a sealing ring clamp groove (312) is provided on the top surface of the packaging base (2) and on the top surface opening of the annular box body (31), and the shape and size of the sealing ring clamp (311) and the sealing ring clamp groove (312) are compatible.

9. The chip packaging structure according to claim 1, characterized in that: A plurality of locking bolts (11) are evenly distributed along the circumference of the packaging cover (1), a plurality of internal thread bottom holes (12) matched with the locking bolts (11) are provided on the packaging base (2), a plurality of internal thread through holes (13) matched with the locking bolts (11) are provided in the sealing ring groove (312), and the locking bolts (11) are movably passed through the internal thread through holes (13) and connected to the internal thread bottom holes (12) at corresponding positions.

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