Condensation cavity capable of automatically adjusting flow of cooling liquid and laser

Abstract

The invention discloses a condensation cavity capable of automatically adjusting the flow of cooling liquid and a laser, and relates to the technical field of lasers. The light gathering cavity comprises a liquid inlet assembly, a communication assembly and a pumping assembly. The liquid inlet assembly comprises a sealing shell and n automatic adjusting structures. The sealing shell is provided with a main liquid inlet hole, a first liquid outlet hole and n second liquid outlet holes. The automatic adjusting structure comprises a memory spring and a liquid blocking piece. The memory spring can extend or shorten along with temperature changes, the first end of the memory spring is tightly attached to the first end of the liquid blocking piece, the liquid blocking piece can be pushed to move in the first direction in the extending process, and the shape of the second end of the liquid blocking piece is matched with that of the second liquid outlet hole. And the second end of the liquid blocking piece can gradually block the second liquid outlet hole in the process of moving towards the first direction. The communication assembly comprises a sealing pipe and a heat conduction piece. The pump assembly includes n pump sidewalls. Therefore, the condensation cavity can adjust the flow of the cooling liquid based on the temperature, and the stability of the temperature in the condensation cavity is improved.

Description

Technical Field

[0001] The present invention relates to the field of laser technology, and in particular to a focusing cavity and a laser capable of automatically adjusting the flow rate of a cooling liquid. Background Art

[0002] Usually, the focusing cavity is composed of a working medium, a pump light device and a temperature control system. During operation, the pump light will generate a large amount of heat when irradiating the working medium. This heat will directly affect the performance of the working medium and thus affect the output parameters of the laser.

[0003] In the prior art, cooling liquid is usually used to control the temperature of the focusing cavity to ensure the constant temperature of the focusing cavity. When the cooling liquid is connected to one end of the focusing cavity, the cooling liquid will be divided into two paths, one for the working medium to dissipate heat, and the other for the pump side wall to dissipate heat. Among them, the heat dissipation of the working medium is the main heat dissipation requirement.

[0004] However, since the interior of the focusing cavity is in a sealed state, it is difficult to determine the real-time temperature of the working medium, and it is even more difficult to adjust the flow rate of the coolant based on the temperature. Summary of the invention

[0005] The present specification provides a focusing cavity and a laser that automatically adjust the flow rate of cooling liquid, so as to at least partially solve the above-mentioned problems existing in the prior art.

[0006] This manual adopts the following technical solutions:

[0007] This specification provides a focusing cavity for automatically adjusting the flow of cooling liquid, including a liquid inlet component, a connecting component and a pump component;

[0008] The liquid inlet assembly comprises a sealed shell and n automatic adjustment structures; the outer surface of the sealed shell is provided with a total liquid inlet hole, a first liquid outlet hole and n second liquid outlet holes; the n automatic adjustment structures are all arranged in the sealed shell; the automatic adjustment structure comprises a memory spring and a liquid blocking member; the memory spring can be extended or shortened with the change of temperature, and the first end of the memory spring is in close contact with the first end of the liquid blocking member, and can push the liquid blocking member to move in the first direction during the extension process; the shape of the second end of the liquid blocking member is adapted to the second liquid outlet hole, and the second end of the liquid blocking member can gradually block the second liquid outlet hole during the movement of the liquid blocking member in the first direction;

[0009] The connecting component includes a sealing tube and a heat conducting member disposed inside the sealing tube; the top end of the sealing tube is in close contact with the first liquid outlet hole, and the top end of the heat conducting member passes through the first liquid outlet hole, enters the interior of the liquid inlet component, and is adjacent to the second ends of the n memory springs respectively;

[0010] The pump assembly includes n pump side walls; the first surface area and the interior of the pump side wall are both loose and porous structures; the first surface area of ​​the pump side wall is in close contact with the second liquid outlet.

[0011] Preferably, the automatic adjustment structure further includes a return member;

[0012] There is a first acting force between the return member and the liquid blocking member, and the first acting force can push and / or drive the liquid blocking member to move in a second direction opposite to the first direction;

[0013] When the temperature of the memory spring is within a preset temperature range, the second force applied by the memory spring to the liquid blocking member corresponds to the magnitude of the first force;

[0014] After absorbing the heat conducted by the heat conductive member, the temperature of the memory spring can rise to a level greater than the preset temperature range, and the second force can increase as the temperature of the memory spring rises. The memory spring stretches and pushes the liquid blocking member to move in the first direction, and the second force can decrease as the memory spring stretches until the second force corresponds to the magnitude of the first force again.

[0015] Preferably, the return member is provided with a first magnetic pole, and the liquid blocking member is provided with a second magnetic pole opposite thereto;

[0016] The first magnetic pole and the second magnetic pole have the same magnetic properties, and the repulsive force between the first magnetic pole and the second magnetic pole can push the liquid blocking member to move in a second direction opposite to the first direction.

[0017] Preferably, the return member is further provided with a third magnetic pole and a slide rail;

[0018] The automatic adjustment structure also includes a close contact heat conductive member;

[0019] The close contact heat conducting member comprises a sliding portion, a close contact portion and a heat conducting portion; the sliding portion and the heat conducting portion are both fixed to a first side of the close contact portion;

[0020] The shape of the sliding part is adapted to the slide rail, and can slide along the slide rail in the first direction and the second direction; the second side of the close contact part is adapted to the shape of the heat conductive member, and can be in close contact with the heat conductive member; the sliding part is provided with a fourth magnetic pole opposite to the third magnetic pole, the third magnetic pole and the fourth magnetic pole have the same magnetic properties, and the repulsive force between the third magnetic pole and the fourth magnetic pole can push and maintain the close contact between the close contact part and the heat conductive member; the heat conductive member is a cylindrical structure, and the outer diameter of the heat conductive member is adapted to the inner diameter of the memory spring;

[0021] The memory spring is sleeved on the outer side of the heat conducting part.

[0022] Preferably, the bottom of the sealed housing is further provided with n fixing holes;

[0023] A fixing protrusion is arranged at the bottom of the return member, and the shape, position and / or size of the fixing protrusion is matched with the fixing hole, and the fixing protrusion can be embedded in the fixing hole.

[0024] Preferably, the focusing cavity for automatically adjusting the flow of the cooling liquid further includes a liquid outlet structure;

[0025] The second surface area of ​​the pump side wall is a loose and porous structure;

[0026] The outer surface of the liquid outlet structure is provided with a total liquid outlet hole, a first liquid inlet hole and n second liquid inlet holes; the n second liquid inlet holes are respectively in close contact with the second surface areas of the n pump side walls;

[0027] The bottom end of the sealing tube passes through the first liquid inlet hole and enters the interior of the liquid outlet structure.

[0028] Preferably, the sealed housing comprises a housing body and a cover plate;

[0029] The liquid outlet structure comprises a structural body and a bottom plate.

[0030] Preferably, the focusing cavity for automatically adjusting the flow of the cooling liquid further comprises a working medium;

[0031] The working medium is disposed between the n pump side walls, and the working medium is in close contact with the sealing tube;

[0032] n=3.

[0033] Preferably, the material of the memory spring at least includes memory alloy;

[0034] The memory alloy contains iron and / or nickel.

[0035] On the other hand, the present specification provides a laser, comprising a focusing cavity for automatically adjusting the flow rate of cooling liquid provided by any of the above aspects.

[0036] At least one of the above technical solutions adopted in this specification can achieve the following beneficial effects:

[0037] Based on the above embodiment, the focusing cavity for automatically adjusting the flow of cooling liquid includes a liquid inlet component, a connecting component and a pump component. Among them, the liquid inlet component includes a sealed shell and n automatic adjustment structures. The outer surface of the sealed shell is provided with a total liquid inlet hole, a first liquid outlet hole and n second liquid outlet holes. The n automatic adjustment structures are all arranged in the sealed shell. The automatic adjustment structure includes a memory spring and a liquid blocking member. The memory spring can be extended or shortened with the change of temperature, and the first end of the memory spring is in close contact with the first end of the liquid blocking member, and can push the liquid blocking member to move in the first direction during the extension process, and the shape of the second end of the liquid blocking member is adapted to the second liquid outlet hole, and the second end of the liquid blocking member can gradually block the second liquid outlet hole during the movement of the liquid blocking member in the first direction. The connecting component includes a sealing tube and a heat conducting member arranged inside the sealing tube, the top end of the sealing tube is in close contact with the first liquid outlet hole, and the top end of the heat conducting member passes through the first liquid outlet hole, enters the interior of the liquid inlet component, and is adjacent to the second ends of the n memory springs respectively. The pump assembly comprises n pump side walls. The first surface area and the interior of the pump side wall are both loose and porous structures, and the first surface area of ​​the pump side wall is closely attached to the second liquid outlet.

[0038] It can be seen from the above content that the focusing cavity can adjust the flow of the coolant flowing to the pump side wall based on the temperature, thereby adjusting the flow of the coolant flowing to the sealing tube, thereby adjusting the temperature of the working medium and improving the temperature stability in the focusing cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The drawings described herein are used to provide a further understanding of this specification and constitute a part of this specification. The illustrative embodiments and descriptions of this specification are used to explain this specification and do not constitute an improper limitation on this specification. In the drawings:

[0040] Figure 1 A schematic diagram of the structure of a focusing cavity for automatically adjusting the flow of cooling liquid provided in one embodiment of the present specification;

[0041] Figure 2a A schematic diagram of a partial structure of a sealed housing provided in accordance with an embodiment of the present specification;

[0042] Figure 2b A schematic diagram of a partial structure of a sealed housing provided in accordance with an embodiment of the present specification;

[0043] Figure 3 A schematic diagram of an automatic adjustment process of an automatic adjustment structure provided in one embodiment of this specification;

[0044] Figure 4 A schematic diagram of a portion of the structure of a focusing cavity for automatically adjusting the flow of cooling liquid provided in one embodiment of the present specification;

[0045] Figure 5 A schematic diagram of a portion of the structure of a focusing cavity for automatically adjusting the flow of cooling liquid provided in one embodiment of the present specification;

[0046] Figure 6 A schematic diagram of a portion of the structure of a focusing cavity for automatically adjusting the flow of cooling liquid provided in one embodiment of the present specification;

[0047] Figure 7 A schematic diagram of a portion of the structure of a focusing cavity for automatically adjusting the flow of cooling liquid provided in one embodiment of the present specification;

[0048] Figure 8 A schematic diagram of a portion of the structure of a focusing cavity for automatically adjusting the flow of cooling liquid provided in one embodiment of the present specification;

[0049] Fig. 9 A schematic diagram of the structure of an automatic adjustment structure provided for one embodiment of the present specification.

[0050] Description of reference numerals:

[0051] Liquid inlet component 1; connecting component 2; pump component 3; sealed shell 11; main liquid inlet hole 111; first liquid outlet hole 112; second liquid outlet hole 113; automatic adjustment structure 12; memory spring 121; liquid blocking member 122; sealing tube 21; heat conducting member 22; first magnetic pole 123; second magnetic pole 124; return member 125; third magnetic pole 126; fourth magnetic pole 134; close contact heat conducting member 13; heat conducting part 131; close contact part 132; sliding part 133; liquid outlet component 4; second liquid inlet hole 41; cover plate 114; side plate 5; shell sleeve 14. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solutions and advantages of this specification more clear, the technical solutions of this specification will be clearly and completely described below in combination with the specific embodiments of this specification and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0053] In the description of the present invention, it should be noted that the term "or" is generally used in a meaning including "and / or", unless the content clearly indicates otherwise.

[0054] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. In addition, in the description of the present application, the terms "first", "second" and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0055] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0056] The technical solutions provided by the embodiments of this specification are described in detail below in conjunction with the accompanying drawings.

[0057] Figure 1 A schematic diagram of the structure of a focusing cavity for automatically adjusting the flow rate of cooling liquid provided in an embodiment of the present specification is shown in FIG. Figure 1 As shown, the focusing cavity includes a liquid inlet component 1, a connecting component 2 and a pump component 3.

[0058] Preferably, the liquid inlet assembly 1 includes a sealed housing 11 and n automatic adjustment structures 12 .

[0059] Preferably, a total liquid inlet hole 111 , a first liquid outlet hole 112 and n second liquid outlet holes 113 are formed on the outer surface of the sealed shell 11 .

[0060] Figure 2a as well as Figure 2b A partial structural diagram of a sealed housing 11 provided in one embodiment of the present specification is shown in FIG. Figure 2a as well as Figure 2b As shown, the total liquid inlet 111 is opened on the side wall of the sealed shell 11 , the first liquid outlet 112 is opened in the middle position of the bottom surface of the sealed shell 11 , and n second liquid outlet holes 113 are opened around the bottom surface of the sealed shell 11 .

[0061] Preferably, the n automatic adjustment structures 12 are all disposed in the sealed housing 11 .

[0062] Preferably, the automatic adjustment structure 12 includes a memory spring 121 and a liquid blocking member 122 .

[0063] Preferably, the memory spring 121 can extend or shorten as the temperature changes, and the first end of the memory spring 121 is in close contact with the first end of the liquid blocking member 122, and can push the liquid blocking member 122 to move in the first direction during the extension process.

[0064] Preferably, the shape of the second end of the liquid blocking member 122 is adapted to the second liquid outlet 113 , and the second end of the liquid blocking member 122 can gradually block the second liquid outlet 113 during the process of the liquid blocking member 122 moving toward the first direction.

[0065] Figure 3 A schematic diagram of the automatic adjustment process of the automatic adjustment structure 12 provided in one embodiment of the present specification is shown in FIG. Figure 3 As shown, as the temperature changes, the length of the memory spring 121 gradually increases, and the liquid blocking member 122 gradually blocks the second liquid outlet 113 .

[0066] Preferably, the communication component 2 includes a sealing tube 21 and a heat conducting member 22 disposed inside the sealing tube 21 .

[0067] Preferably, the top end of the sealing tube 21 is in close contact with the first liquid outlet 112 , and the top end of the heat conducting member 22 passes through the first liquid outlet 112 , enters the interior of the liquid inlet assembly 1 , and is adjacent to the second ends of the n memory springs 121 .

[0068] Figure 4 A partial structural diagram of a focusing cavity for automatically adjusting the flow of cooling liquid provided in an embodiment of the present specification, such as Figure 4 As shown, the sealing tube 21 is directly connected to the first liquid outlet 112 , and the tubular heat conducting member 22 passes through the sealing tube 21 .

[0069] Preferably, the pump assembly 3 includes n pump side walls.

[0070] Preferably, the first surface area and the interior of the pump side wall are both loose and porous structures.

[0071] Preferably, the first surface area of ​​the pump side wall is in close contact with the second liquid outlet 113 , so that the liquid can penetrate into the interior of the pump side wall through the first surface area.

[0072] Preferably, the focusing cavity for automatically adjusting the flow of the cooling liquid also includes a working medium.

[0073] Preferably, the working medium is disposed between the n pump side walls, and the working medium is in close contact with the sealing tube 21 .

[0074] Based on the above embodiment, the focusing cavity for automatically adjusting the flow of cooling liquid includes a liquid inlet component 1, a connecting component 2 and a pump component 3. Among them, the liquid inlet component 1 includes a sealed shell 11 and n automatic adjustment structures 12. The outer surface of the sealed shell 11 is provided with a total liquid inlet hole 111, a first liquid outlet hole 112 and n second liquid outlet holes 113. The n automatic adjustment structures 12 are all arranged in the sealed shell 11. The automatic adjustment structure 12 includes a memory spring 121 and a liquid blocking member 122. The memory spring 121 can be extended or shortened with the change of temperature, and the first end of the memory spring 121 is closely attached to the first end of the liquid blocking member 122, and can push the liquid blocking member 122 to move in the first direction during the extension process, and the shape of the second end of the liquid blocking member 122 is adapted to the second liquid outlet hole 113, and the second end of the liquid blocking member 122 can gradually block the second liquid outlet hole 113 during the movement of the liquid blocking member 122 in the first direction. The connecting component 2 includes a sealing tube 21 and a heat conducting member 22 disposed inside the sealing tube 21. The top end of the sealing tube 21 is in close contact with the first liquid outlet 112, and the top end of the heat conducting member 22 passes through the first liquid outlet 112, enters the interior of the liquid inlet component 1, and is respectively adjacent to the second ends of the n memory springs 121. The pump component 3 includes n pump side walls. The first surface area and the interior of the pump side wall are both loose and porous structures, and the first surface area of ​​the pump side wall is in close contact with the second liquid outlet 113.

[0075] It can be seen from the above content that the focusing cavity can adjust the flow of the coolant flowing to the pump side wall based on the temperature, thereby adjusting the flow of the coolant flowing to the sealing tube 21, thereby adjusting the temperature of the working medium and improving the temperature stability in the focusing cavity.

[0076] Preferably, the automatic adjustment structure 12 further includes a return member 125 .

[0077] Preferably, there is a first force between the return member 125 and the liquid blocking member 122, and the first force can push and / or drive the liquid blocking member 122 to move in a second direction opposite to the first direction.

[0078] Preferably, when the temperature of the memory spring 121 is within a preset temperature range, the second force applied by the memory spring 121 to the liquid blocking member 122 corresponds to the magnitude of the first force.

[0079] Preferably, when the temperature of the memory spring 121 is within a preset temperature range, the liquid blocking member 122 does not block the second liquid outlet 113 .

[0080] Preferably, after absorbing the heat conducted by the heat conductive member 22, the temperature of the memory spring 121 can rise to a level greater than the preset temperature range, and the second force can increase as the temperature of the memory spring 121 rises, the memory spring 121 stretches and pushes the liquid blocking member 122 to move in the first direction, and the second force can decrease as the memory spring 121 stretches until the second force corresponds to the magnitude of the first force again.

[0081] Preferably, when the temperature of the memory spring 121 drops to the preset temperature range, the second force decreases, the first force is greater than the second force, the memory spring 121 shortens, and the second force gradually increases, and the liquid blocking member 122 moves in a second direction opposite to the first direction under the push and / or drive of the first force until the second force corresponds to the magnitude of the first force again.

[0082] It should be emphasized that there is friction between the various parts, so the first force and the second force do not need to be completely equal to each other for the blocking member to stop moving. In other words, the second force described in this specification corresponds to the first force, which does not mean that the second force is equal to the first force in a strict sense and has an opposite direction, but that under the influence of friction, the second force and the first force, the forces between the various parts are balanced, the speed is zero, and the deformation is no longer performed.

[0083] Preferably, the return member 125 is provided with a first magnetic pole 123, and the liquid blocking member 122 is provided with a second magnetic pole 124 opposite thereto. Furthermore, the first magnetic pole 123 and the second magnetic pole 124 have the same magnetic properties, and the repulsive force between the first magnetic pole 123 and the second magnetic pole 124 can push the liquid blocking member 122 to move in a second direction opposite to the first direction.

[0084] Preferably, the first force is the repulsive force between the first magnetic pole 123 and the second magnetic pole 124. Of course, the first force may also be generated by other structures, which is not limited in this specification.

[0085] Figure 5 A partial structural diagram of a focusing cavity for automatically adjusting the flow of cooling liquid provided in an embodiment of the present specification, such as Figure 5 As shown, the first magnetic pole 123 and the second magnetic pole 124 are arranged opposite to each other, and the direction of the repulsive force between the first magnetic pole 123 and the second magnetic pole 124 is opposite to the direction of the second force generated by the extension of the memory spring 121. The first magnetic pole 123 is embedded in the return member 125, and the second magnetic pole 124 is fixed to the surface of the liquid blocking member 122.

[0086] Preferably, the return member 125 is also configured with a third magnetic pole 126 and a slide rail.

[0087] Preferably, the automatic adjustment structure 12 further includes a close-fitting heat-conducting member 13 .

[0088] Preferably, the close contact heat conductive member 13 includes a sliding portion 133 , a close contact portion 132 and a heat conductive portion 131 .

[0089] Preferably, the sliding portion 133 and the heat conducting portion 131 are both fixed to the first side of the close contact portion 132 .

[0090] Preferably, the shape of the sliding portion 133 is adapted to the slide rail, and can slide along the slide rail in the first direction and the second direction.

[0091] Preferably, the second side of the close-fitting portion 132 is adapted to the shape of the heat-conducting member 22 and can be in close contact with the heat-conducting member 22 .

[0092] Preferably, the sliding portion 133 is configured with a fourth pole 134 opposite to the third pole 126 , and the third pole 126 and the fourth pole 134 have the same magnetic properties. The repulsive force between the third pole 126 and the fourth pole 134 can push and maintain the close contact between the sealing portion 132 and the thermal conductive member 22 .

[0093] Preferably, the heat conducting portion 131 is a cylindrical structure, and the outer diameter of the heat conducting portion 131 is adapted to the inner diameter of the memory spring 121 .

[0094] Preferably, the memory spring 121 is sleeved on the outer side of the heat conducting portion 131 .

[0095] Preferably, the heat conducting portion 131 and / or the close contact portion 132 and / or the heat conducting member 22 are made of a heat conducting material, and the thermal conductivity of the heat conducting material is greater than or equal to a first parameter. The first parameter is a preset value, which may be 300 W / m·K, 280 W / m·K, etc., and is not limited in this specification.

[0096] Figure 6 A partial structural diagram of a focusing cavity for automatically adjusting the flow of cooling liquid provided in an embodiment of the present specification, such as Figure 6 As shown, the third magnetic pole 126 is arranged opposite to the fourth magnetic pole 134, and the memory spring 121 is sleeved on the outside of the heat-conducting portion 131, the close contact portion 132 is in close contact with the heat-conducting member 22, and the sliding portion 133 can slide along the slide rail. The third magnetic pole 126 is embedded in the slide rail of the return member 125, and the fourth magnetic pole 134 is fixed to the sliding portion 133 in close contact with the heat-conducting member 13.

[0097] Preferably, the bottom of the sealed housing 11 is further provided with n fixing holes.

[0098] Preferably, a fixing protrusion is provided at the bottom of the return member 125, and the shape, position and / or size of the fixing protrusion is matched with the fixing hole, and the fixing protrusion can be embedded in the fixing hole.

[0099] Preferably, the focusing cavity for automatically adjusting the flow of the cooling liquid also includes a liquid outlet structure.

[0100] Preferably, the second surface area of ​​the pump side wall is a loose and porous structure.

[0101] Preferably, the outer surface of the liquid outlet structure is provided with a total liquid outlet, a first liquid inlet and n second liquid inlet holes 41 , and the n second liquid inlet holes 41 are respectively in close contact with the second surface areas of the n pump side walls.

[0102] Preferably, the bottom end of the sealing tube 21 passes through the first liquid inlet hole and enters the interior of the liquid outlet structure.

[0103] Figure 7 A partial structural diagram of a focusing cavity for automatically adjusting the flow of cooling liquid provided in an embodiment of the present specification, such as Figure 7 As shown, the liquid inlet assembly 1 and the liquid outlet assembly 4 are connected through the sealing tube 21, and the heat conducting member 22 passes through the liquid inlet assembly 1 and the liquid outlet assembly 4. In addition, the second liquid inlet hole 41 is opened on the side of the liquid outlet structure.

[0104] Preferably, the first liquid inlet hole is opened on the side of the liquid inlet component 1.

[0105] Preferably, the sealed housing 11 includes a housing body and a cover plate 114 .

[0106] Preferably, the liquid outlet structure includes a structural body and a bottom plate.

[0107] Preferably, n=3.

[0108] Preferably, the material of the memory spring 121 at least includes memory alloy.

[0109] Preferably, the memory alloy contains iron and / or nickel.

[0110] Preferably, the focusing cavity for automatically adjusting the flow of the cooling liquid includes a plurality of side panels 5 .

[0111] Preferably, the side plate 5 is disposed between the liquid inlet assembly 1 and the liquid outlet assembly 4 .

[0112] Figure 8 A partial structural diagram of a focusing cavity for automatically adjusting the flow of cooling liquid provided in an embodiment of the present specification, such as Figure 8 As shown, the cover plate 114 seals the top of the sealed housing 11 , and the side plate 5 is disposed between the liquid inlet assembly 1 and the liquid outlet assembly 4 .

[0113] Preferably, the automatic adjustment structure 12 further includes n outer shell sleeves 14 .

[0114] Preferably, the outer shell sleeve 14 can be sleeved onto the outer side of the memory spring 121 and a portion of the structure that is in close contact with the heat conductive element 13 .

[0115] Fig. 9 A schematic diagram of the structure of the automatic adjustment structure 12 provided in one embodiment of the present specification is shown in FIG. Fig. 9 As shown, in the automatic adjustment structure 12 , the close contact heat conductive member 13 is connected with the liquid blocking member 122 , the memory spring 121 and other structures, and the close contact heat conductive member 13 and part of the memory spring 121 are sleeved inside the outer shell sleeve 14 .

[0116] It is understood by those skilled in the art that the memory alloy can deform as the temperature changes, and the performance parameters such as the degree of deformation and the temperature range corresponding to the deformation can be adjusted, which will not be elaborated in this specification.

[0117] The above is a focusing cavity for automatically adjusting the flow rate of cooling liquid provided in one or more embodiments of this specification. Based on the same idea, this specification also provides a corresponding laser.

[0118] Preferably, the laser includes a focusing cavity for automatically adjusting the flow rate of the cooling liquid provided by any one of the above embodiments.

[0119] It should be noted that all actions of acquiring signals, information or data in this application are carried out in compliance with the relevant data protection laws and policies of the country where they are located, and with the authorization given by the owner of the corresponding device.

[0120] In the 1990s, it was very clear whether the improvement of a technology was a hardware improvement (for example, improvements to the circuit structure of diodes, transistors, switches, etc.) or a software improvement (improvement of the method flow). However, with the development of technology, many improvements in the method flow today can be regarded as direct improvements in the hardware circuit structure. Designers almost always obtain the corresponding hardware circuit structure by programming the improved method flow into the hardware circuit. Therefore, it cannot be said that the improvement of a method flow cannot be implemented using a hardware entity module. For example, a programmable logic device (PLD) (such as a field programmable gate array (FPGA)) is such an integrated circuit whose logical function is determined by the user's programming of the device. Designers can "integrate" a digital system on a PLD by programming it themselves, without having to ask a chip manufacturer to design and produce a dedicated integrated circuit chip. Moreover, nowadays, instead of manually making integrated circuit chips, this kind of programming is mostly implemented by "logic compiler" software, which is similar to the software compiler used when developing and writing programs, and the original code before compilation must also be written in a specific programming language, which is called hardware description language (HDL). There is not only one HDL, but many kinds, such as ABEL (Advanced Boolean Expression Language), AHDL (Altera Hardware Description Language), Confluence, CUPL (Cornell University Programming Language), HDCal, JHDL (Java Hardware Description Language), Lava, Lola, MyHDL, PALASM, RHDL (Ruby Hardware Description Language), etc. The most commonly used ones are VHDL (Very-High-Speed ​​Integrated Circuit Hardware Description Language) and Verilog. Those skilled in the art should also know that it is only necessary to program the method flow slightly in the above-mentioned hardware description languages ​​and program it into the integrated circuit, and then it is easy to obtain the hardware circuit that implements the logic method flow.

[0121] The controller can be implemented in any appropriate manner, for example, the controller can take the form of a microprocessor or processor and a computer-readable medium storing a computer-readable program code (such as software or firmware) that can be executed by the (micro)processor, a logic gate, a switch, an application-specific integrated circuit (ASIC), a programmable logic controller, and an embedded microcontroller. Examples of controllers include, but are not limited to, the following microcontrollers: ARC 625D, Atmel AT91SAM, Microchip PIC18F26K20, and Silicone Labs C8051F320. The memory controller can also be implemented as part of the control logic of the memory. Those skilled in the art also know that in addition to implementing the controller in a purely computer-readable program code manner, the controller can be implemented in the form of a logic gate, a switch, an application-specific integrated circuit, a programmable logic controller, and an embedded microcontroller by logically programming the method steps. Therefore, this controller can be considered as a hardware component, and the devices included therein for implementing various functions can also be regarded as structures within the hardware component. Or even, the devices for implementing various functions can be regarded as both software modules for implementing the method and structures within the hardware component.

[0122] The systems, devices, modules or units described in the above embodiments may be implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer. Specifically, the computer may be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0123] For the convenience of description, the above device is described in various units according to their functions. Of course, when implementing this specification, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0124] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0125] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0126] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0127] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0128] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0129] The memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0130] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0131] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0132] Those skilled in the art will appreciate that the embodiments of this specification may be provided as methods, systems or computer program products. Therefore, this specification may take the form of a complete hardware embodiment, a complete software embodiment or an embodiment combining software and hardware. Moreover, this specification may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0133] This specification may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. This specification may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0134] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0135] The above description is only an embodiment of this specification and is not intended to limit this specification. For those skilled in the art, this specification may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this specification should be included in the scope of the claims of this application.

Claims

1. A focusing cavity for automatically adjusting the flow of cooling liquid, characterized in that: Including liquid inlet components, connecting components and pump components; The liquid inlet assembly comprises a sealed shell and n automatic adjustment structures; the outer surface of the sealed shell is provided with a total liquid inlet hole, a first liquid outlet hole and n second liquid outlet holes; the n automatic adjustment structures are all arranged in the sealed shell; the automatic adjustment structure comprises a memory spring and a liquid blocking member; the memory spring can be extended or shortened with the change of temperature, and the first end of the memory spring is in close contact with the first end of the liquid blocking member, and can push the liquid blocking member to move in the first direction during the extension process; the shape of the second end of the liquid blocking member is adapted to the second liquid outlet hole, and the second end of the liquid blocking member can gradually block the second liquid outlet hole during the movement of the liquid blocking member in the first direction; The connecting component includes a sealing tube and a heat conducting member disposed inside the sealing tube; the top end of the sealing tube is in close contact with the first liquid outlet hole, and the top end of the heat conducting member passes through the first liquid outlet hole, enters the interior of the liquid inlet component, and is adjacent to the second ends of the n memory springs respectively; The pump assembly includes n pump side walls; the first surface area and the interior of the pump side wall are both loose and porous structures; the first surface area of ​​the pump side wall is in close contact with the second liquid outlet.

2. The focusing cavity for automatically adjusting the flow rate of cooling liquid according to claim 1 is characterized in that: The automatic adjustment structure also includes a return member; There is a first acting force between the return member and the liquid blocking member, and the first acting force can push and / or drive the liquid blocking member to move in a second direction opposite to the first direction; When the temperature of the memory spring is within a preset temperature range, the second force applied by the memory spring to the liquid blocking member corresponds to the magnitude of the first force; After absorbing the heat conducted by the heat conductive member, the temperature of the memory spring can rise to a level greater than the preset temperature range, and the second force can increase as the temperature of the memory spring rises. The memory spring stretches and pushes the liquid blocking member to move in the first direction, and the second force can decrease as the memory spring stretches until the second force corresponds to the magnitude of the first force again.

3. The focusing cavity for automatically adjusting the flow rate of cooling liquid according to claim 2 is characterized in that: The return member is provided with a first magnetic pole, and the liquid blocking member is provided with a second magnetic pole opposite thereto; The first magnetic pole and the second magnetic pole have the same magnetic properties, and the repulsive force between the first magnetic pole and the second magnetic pole can push the liquid blocking member to move in a second direction opposite to the first direction.

4. The focusing cavity for automatically adjusting the flow rate of cooling liquid according to claim 3 is characterized in that: The return member is also provided with a third magnetic pole and a slide rail; The automatic adjustment structure also includes a close contact heat conductive member; The close contact heat conducting member comprises a sliding portion, a close contact portion and a heat conducting portion; the sliding portion and the heat conducting portion are both fixed to a first side of the close contact portion; The shape of the sliding part is adapted to the slide rail, and can slide along the slide rail in the first direction and the second direction; the second side of the close contact part is adapted to the shape of the heat conductive member, and can be in close contact with the heat conductive member; the sliding part is provided with a fourth magnetic pole opposite to the third magnetic pole, the third magnetic pole and the fourth magnetic pole have the same magnetic properties, and the repulsive force between the third magnetic pole and the fourth magnetic pole can push and maintain the close contact between the close contact part and the heat conductive member; the heat conductive member is a cylindrical structure, and the outer diameter of the heat conductive member is adapted to the inner diameter of the memory spring; The memory spring is sleeved on the outer side of the heat conducting part.

5. The focusing cavity for automatically adjusting the flow of cooling liquid according to claim 2, characterized in that: The bottom of the sealing shell is also provided with n fixing holes; A fixing protrusion is arranged at the bottom of the return member, and the shape, position and / or size of the fixing protrusion is matched with the fixing hole, and the fixing protrusion can be embedded in the fixing hole.

6. The focusing cavity for automatically adjusting the flow of cooling liquid according to any one of claims 1 to 5, characterized in that: The light-collecting cavity for automatically adjusting the flow rate of the cooling liquid also includes a liquid outlet structure; The second surface area of ​​the pump side wall is a loose and porous structure; The outer surface of the liquid outlet structure is provided with a total liquid outlet hole, a first liquid inlet hole and n second liquid inlet holes; the n second liquid inlet holes are respectively in close contact with the second surface areas of the n pump side walls; The bottom end of the sealing tube passes through the first liquid inlet hole and enters the interior of the liquid outlet structure.

7. The focusing cavity for automatically adjusting the flow rate of cooling liquid according to claim 6, characterized in that: The sealed housing comprises a housing body and a cover plate; The liquid outlet structure comprises a structural body and a bottom plate.

8. The focusing cavity for automatically adjusting the flow of cooling liquid according to any one of claims 1 to 5, characterized in that: The light-collecting cavity for automatically adjusting the flow rate of the cooling liquid also includes a working medium; The working medium is disposed between the n pump side walls, and the working medium is in close contact with the sealing tube; n＝3。 9. The focusing cavity for automatically adjusting the flow of cooling liquid according to any one of claims 1 to 5, characterized in that: The material of the memory spring at least includes memory alloy; The memory alloy contains iron and / or nickel.

10. A laser, characterized in that: A focusing cavity for automatically adjusting the flow rate of cooling liquid comprising the light focusing cavity as described in any one of claims 1 to 9.

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