Manufacturing method of bendable aluminum-based printed circuit board for LED lamp

Abstract

The invention discloses a manufacturing method of a bendable aluminum-based printed circuit board for an LED lamp, and belongs to the technical field of aluminum-based printed circuit boards, and the manufacturing method comprises the steps of raw material preparation, surface layer film covering, first blind groove cutting, second blind groove cutting, reinforcing rib lap joint and blind hole drilling. The aluminum substrate is composed of an aluminum base layer, a circuit layer and an insulating layer located between the aluminum base layer and the circuit layer, a numerical control machine base is adopted as machining equipment, a cutting pattern is preset in a machine tool, oil stains and dust on the surface of the aluminum substrate are removed, then an adhesive is coated, and a high-temperature protection film is attached to the surface of the aluminum substrate for hot pressing or hot melting. According to the invention, the blind groove is formed in the back surface of the aluminum plate, so that the bending difficulty is reduced, meanwhile, the stability and reliability of a circuit are kept, the production process is optimized, the manufacturing process is simplified, and the material cost and the processing period are reduced.

Description

Technical Field

[0001] The invention relates to the technical field of aluminum-based printed circuit boards, and in particular to a method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp. Background Art

[0002] Traditional aluminum substrates are difficult to meet design requirements in environments that require bending and deformation due to their strong rigidity, which can easily lead to circuit damage and affect product reliability and life. With the continuous expansion of the smart lighting market, the demand for LED lamps that can adapt to various complex installation conditions is growing. Therefore, the development of an aluminum-based printed circuit board that can both ensure circuit performance and have good bending characteristics has become an urgent need in the industry.

[0003] The existing solutions mainly include two approaches. One is to use flexible PCB instead of traditional rigid aluminum substrate. This method can effectively increase the flexibility of the circuit board, but the heat dissipation performance of flexible PCB is far inferior to that of aluminum substrate. Long-term operation may cause heat accumulation, affecting the working efficiency and life of LED lamps. The second method is to physically process the traditional aluminum substrate, such as scoring or embossing to increase its bending performance, but this method often destroys the integrity and stability of the aluminum substrate, resulting in the risk of circuit instability or even breakage. Both methods have their own advantages and disadvantages, but neither method has completely solved the problem in practical applications.

[0004] Existing solutions either sacrifice heat dissipation performance or affect the long-term stability and safety of the circuit, and cannot fully meet the design requirements of high-performance LED lamps. These defects are particularly obvious when pursuing high efficiency while also considering aesthetics and installation convenience.

[0005] In the Chinese invention patent with announcement number CN113966083A, an LED lamp, a bendable aluminum-based printed circuit board, a manufacturing method and application are disclosed, which relate to the field of printed circuit board manufacturing technology. The manufacturing method includes: using a single-sided aluminum substrate for cutting; outer layer graphics processing, outer layer etching, target hole punching, solder mask, character production, blind groove processing on the aluminum surface after solder mask; after processing the blind groove, molding. The bendable aluminum-based printed circuit board for LED includes: a single-sided aluminum substrate, auxiliary graphics, auxiliary positioning holes, solder mask and characters, and a first blind groove and a second blind groove. The present invention is a single-sided aluminum substrate, which reduces the difficulty of bending by drilling a deep blind groove on the back of the aluminum plate to reduce the thickness of the bending area; it avoids the use of a soft board + pure glue + aluminum plate pressing process, greatly reducing the processing difficulty and processing time, and at the same time, the use of a simple aluminum plate can also greatly reduce the cost of materials. Compared with the prior art, the present invention takes a different approach, the process is more streamlined, and the quality control points are simpler.

[0006] The technical solution disclosed in the above patent reduces the difficulty of bending to a certain extent through the design of two blind grooves, but this structural design results in no filler inside the second blind groove, too low thickness to provide no support, too low strength, and easy damage. In view of this, this application is proposed. Summary of the invention

[0007] To this end, the present invention provides a method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp to solve the above-mentioned problem.

[0008] The present invention provides the following technical solution: a method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp, comprising the following steps: S1. Raw material preparation: single-sided aluminum substrate is used as raw material, and aluminum substrate with high thermal conductivity and good mechanical properties is selected as substrate, so that the heat dissipation efficiency of the final product can be guaranteed, and heat accumulation during long-term operation is avoided, so as to prevent the working efficiency and service life of the LED lamp from being affected. The aluminum substrate is composed of an aluminum base layer, a circuit layer, and an insulating layer located between the aluminum base layer and the circuit layer. A CNC machine base is used as processing equipment, and a cutting pattern is preset in the machine tool; S2, surface coating, remove the oil and dust on the surface of the aluminum substrate and apply adhesive, adhere the high temperature protective film to the surface of the aluminum substrate and perform hot pressing or hot melting, so that the high temperature protective film is tightly combined with the aluminum substrate to prevent the aluminum substrate from being corroded or scratched by chemicals during processing, effectively resist chemical corrosion during processing, avoid scratches, and further enhance the durability and appearance quality of the product; S3, cutting the first blind groove, using a CNC machine tool to accurately cut the back of the aluminum substrate according to a predetermined pattern to form the first blind groove; S4, cutting the second blind groove, processing the second blind groove in the first blind groove, first, use a CNC machine tool to accurately cut according to a predetermined pattern on the back of the aluminum substrate to form the first blind groove, the edge of the first blind groove is about 5mm wider than the single side of the final product shape; then process the second blind groove again in the same area, the edge of the second blind groove is 5mm narrower than the single side of the first blind groove, and its depth is about 0.5mm deeper than the first blind groove. This multi-level blind groove design not only significantly reduces the hardness of the aluminum substrate in the specified area, facilitating subsequent manual or mechanical bending operations, but also does not destroy the integrity and continuity of the circuit, thereby maintaining the good performance of the circuit; S5, overlap the reinforcing ribs, add reinforcing ribs in the second blind groove, use the flexible substrate as the raw material, cut it into strips, make the length of the reinforcing ribs the same as the length of the second blind groove, and then bond the reinforcing ribs to the second blind groove. By adding the reinforcing ribs, the second blind groove has a certain reinforcement structure. The structural design of the stepped blind groove effectively reduces the hardness of the central area of ​​the aluminum substrate, and the addition of the reinforcing ribs avoids the low hardness caused by the large area coverage of the second blind groove. The combination of the two makes the final finished aluminum substrate easy to bend while not being easily damaged due to low hardness; S6. Drill blind holes and switch to the CNC drilling machine. Use the machine to process blind holes on the reinforcing ribs. By setting the blind holes, the overall hardness of the reinforcing ribs is reduced to a certain extent, while the local bending performance of the reinforcing ribs is improved. Finally, the excess part of the aluminum substrate is cut off to form a finished aluminum substrate.

[0009] As a preferred solution of the present invention, in step S1, the width of the single-sided aluminum substrate is at least 5 mm greater than the width of the finished circuit board, so that sufficient processing space is reserved for the finished aluminum substrate to facilitate processing operations.

[0010] As a preferred solution of the present invention, the specific steps of step S2 are: removing oil and dust on the surface of the aluminum substrate, then removing the oxide layer on the surface of the aluminum substrate to ensure the flatness and cleanliness of the bonding surface, cutting the high-temperature protective film into the size of the aluminum substrate, and then coating a layer of adhesive on one side of the high-temperature protective film, and finally bonding the high-temperature protective film to the surface of the aluminum substrate for hot pressing or hot melting to tightly bond the high-temperature protective film to the aluminum substrate.

[0011] As a preferred solution of the present invention, in step S3, the edge of the first blind groove is 5 mm wider than the outer edge of the aluminum substrate of the final product.

[0012] As a preferred solution of the present invention, in step S4, the edge of the second blind groove is 5 mm narrower than the single side of the first blind groove, and its depth is 0.5 mm deeper than the first layer. The multi-level blind groove design not only significantly reduces the hardness of the aluminum plate in the designated area, facilitating subsequent manual or mechanical bending operations, but also does not destroy the integrity and continuity of the circuit, thereby maintaining good performance of the circuit.

[0013] As a preferred solution of the present invention, in step S6, the diameter of the blind hole is 0.5 mm.

[0014] As a preferred solution of the present invention, in step S6, the distance between each of the blind holes on a single reinforcing rib is 10 mm. The setting of the blind holes further improves the bending ability of the reinforcing rib without excessively affecting the strength of the reinforcing rib, so that the final product is easy to bend as a whole.

[0015] As a preferred solution of the present invention, in step S5, the material of the flexible substrate is polyimide, polyester or polyvinyl chloride, which has excellent heat resistance, mechanical strength, chemical stability and flexibility, and as a supplement to the aluminum substrate, it still meets relevant usage requirements.

[0016] The beneficial effects of the present invention are as follows: 1. The present invention adopts a single-sided aluminum substrate, the back of which is treated with specially designed blind grooves to form a multi-layer stepped structure. The multi-level blind groove design not only significantly reduces the hardness of the aluminum plate in the specified area, facilitating subsequent manual or mechanical bending operations, but also does not destroy the integrity and continuity of the circuit, thereby maintaining good performance of the circuit.

[0017] 2. The present invention covers a layer of high-temperature protective film on the surface of the aluminum substrate, which can effectively resist chemical corrosion and avoid scratches during processing, further enhancing the durability and appearance quality of the product.

[0018] 3. In the present invention, reinforcing ribs are further filled in the second blind grooves, and the reinforcing ribs have blind holes. Under the support of the reinforcing ribs with blind holes, the aluminum substrate is easy to bend while its strength is still guaranteed and it will not be easily damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] Figure 1 It is a schematic diagram of the overall structure of the circuit board of the present invention before cutting; Figure 2 This is a schematic diagram of the bottom structure of the circuit board of the present invention before it is cut; Figure 3 It is a schematic diagram of the structure of the circuit board after cutting of the present invention; Figure 4 It is a schematic diagram of the bottom structure of the circuit board after cutting of the present invention; Figure 5 It is a front view of the circuit board of the present invention after cutting.

[0021] Legend: 1. Aluminum base layer; 101. First blind groove; 102. Second blind groove; 2. Insulation layer; 3. Circuit layer; 4. High temperature protection film; 5. Reinforcement rib; 501. Blind hole. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] like Figure 1-Figure 5 As shown, a method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp comprises the following steps: S1. Raw material preparation. Single-sided aluminum substrate is used as raw material. Aluminum substrate with high thermal conductivity and good mechanical properties is selected as the substrate, so that the heat dissipation efficiency of the final product can be guaranteed, and heat accumulation during long-term operation is avoided to prevent affecting the working efficiency and service life of the LED lamp. The width of the single-sided aluminum substrate is at least 5mm larger than the width of the finished circuit board, and sufficient processing space is reserved for the finished aluminum substrate to facilitate processing operations. The aluminum substrate is composed of an aluminum base layer 1, a circuit layer 3, and an insulating layer 2 located between the aluminum base layer 1 and the circuit layer 3. A CNC machine base is used as a processing equipment, and a cutting pattern is preset in the machine tool; S2, surface coating, after removing the oil and dust on the surface of the aluminum substrate, apply adhesive, adhere the high temperature protective film 4 to the surface of the aluminum substrate and perform hot pressing or hot melting, so that the high temperature protective film 4 is tightly combined with the aluminum substrate. The high temperature protective film 4 is made of high temperature resistant and chemical corrosion resistant polyimide (PI) or polyethylene terephthalate (PET), etc., to prevent the aluminum substrate from being corroded or scratched by chemicals during the processing, effectively resist chemical corrosion during the processing, avoid scratches, and further enhance the durability and appearance quality of the product; S3, cutting the first blind groove 101, using a CNC machine tool to accurately cut the back of the aluminum substrate according to a predetermined pattern to form the first blind groove 101, the edge of the first blind groove 101 is 5mm wider than the outer edge of the aluminum substrate of the final product; S4, cutting the second blind groove 102, processing the second blind groove 102 in the first blind groove 101, first, using a CNC machine tool to accurately cut according to a predetermined pattern on the back of the aluminum substrate to form the first blind groove 101, the edge of the first blind groove 101 is about 5mm wider than the single side of the final product shape; then processing the second blind groove 102 again in the same area, the edge of the second blind groove 102 is 5mm narrower than the single side of the first blind groove 101, and its depth is about 0.5mm deeper than the first blind groove 101. This multi-level blind groove design not only significantly reduces the hardness of the aluminum substrate in the specified area, facilitating subsequent manual or mechanical bending operations, but also does not destroy the integrity and continuity of the circuit, thereby maintaining the good performance of the circuit; S5, overlap the reinforcing ribs 5, add reinforcing ribs 5 in the second blind groove 102, use the flexible substrate as the raw material, cut it into strips, make the length of the reinforcing ribs 5 the same as the length of the second blind groove 102, and then bond the reinforcing ribs 5 to the second blind groove 102. By adding the reinforcing ribs 5, the second blind groove 102 has a certain reinforcement structure. The structural design of the stepped blind groove effectively reduces the hardness of the central area of ​​the aluminum substrate, and the addition of the reinforcing ribs 5 avoids the low hardness caused by the large area coverage of the second blind groove 102. The combination of the two makes the final finished aluminum substrate easy to bend while not being easily damaged due to low hardness; S6, drilling blind holes 501, switching to a drilling CNC machine tool, and processing blind holes 501 on the reinforcing rib 5 through the machine tool. The setting of the blind holes 501 reduces the overall hardness of the reinforcing rib 5 to a certain extent, while improving the local bending performance of the reinforcing rib 5. Finally, the redundant part of the aluminum substrate is cut off to form a finished aluminum substrate.

[0024] The specific steps of step S2 are: removing oil and dust on the surface of the aluminum substrate, then removing the oxide layer on the surface of the aluminum substrate to ensure the flatness and cleanliness of the bonding surface, cutting the high-temperature protective film 4 into the size of the aluminum substrate, and then coating a layer of adhesive on one side of the high-temperature protective film 4, and finally bonding the high-temperature protective film 4 to the surface of the aluminum substrate for hot pressing or hot melting to make the high-temperature protective film 4 tightly bonded to the aluminum substrate.

[0025] In step S4, the edge of the second blind groove 102 is 5 mm narrower than the single side of the first blind groove 101, and its depth is 0.5 mm deeper than the first layer. The multi-level blind groove design not only significantly reduces the hardness of the aluminum plate in the designated area, facilitating subsequent manual or mechanical bending operations, but also does not destroy the integrity and continuity of the circuit, thereby maintaining good performance of the circuit.

[0026] In step S6, the diameter of the blind hole 501 is 0.5 mm. In step S6, the distance between the blind holes 501 on a single reinforcing rib 5 is 10 mm. The setting of the blind holes 501 further improves the bending ability of the reinforcing rib 5 without excessively affecting the strength of the reinforcing rib 5, so that the final product is easy to bend as a whole.

[0027] In step S5, the flexible substrate is made of polyimide, polyester or polyvinyl chloride, which has excellent heat resistance, mechanical strength, chemical stability and flexibility. As a supplement to the aluminum substrate, it still meets relevant usage requirements.

[0028] Example 1 A method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp, comprising the steps of raw material preparation, surface coating, cutting a first blind groove 101, cutting a second blind groove 102, overlapping reinforcing ribs 5, and drilling a blind hole 501. A single-sided aluminum substrate is used as the raw material. The aluminum substrate is composed of an aluminum base layer 1, a circuit layer 3, and an insulating layer 2 located between the aluminum base layer 1 and the circuit layer 3. A CNC machine base is used as a processing device. A cutting pattern is preset in the machine tool. After removing oil and dust from the surface of the aluminum substrate, an adhesive is applied. A high-temperature protective film 4 is attached to the surface of the aluminum substrate for hot pressing or hot melting. , so that the high temperature protection film 4 is closely combined with the aluminum substrate, a CNC machine tool is used to accurately cut according to a predetermined pattern on the back of the aluminum substrate to form a first blind groove 101, a second blind groove 102 is processed in the first blind groove 101, and a reinforcing rib 5 is installed in the second blind groove 102. The flexible substrate is used as a raw material and cut into strips so that the length of the reinforcing rib 5 is the same as that of the second blind groove 102, and then the reinforcing rib 5 is bonded to the second blind groove 102, and the drilling CNC machine tool is switched to process a blind hole 501 on the reinforcing rib 5 by the machine tool. Finally, the redundant part of the aluminum substrate is cut off to form a finished aluminum substrate.

[0029] In step S1, the width of the single-sided aluminum substrate is at least 5 mm greater than the width of the finished circuit board.

[0030] The specific steps of step S2 are: removing oil and dust on the surface of the aluminum substrate, then removing the oxide layer on the surface of the aluminum substrate to ensure the flatness and cleanliness of the bonding surface, cutting the high-temperature protective film 4 into the size of the aluminum substrate, and then coating a layer of adhesive on one side of the high-temperature protective film 4, and finally bonding the high-temperature protective film 4 to the surface of the aluminum substrate for hot pressing or hot melting to make the high-temperature protective film 4 tightly bonded to the aluminum substrate.

[0031] In step S3, the edge of the first blind groove 101 is 5 mm wider than the outer edge of the aluminum substrate of the final product.

[0032] In step S4, the edge of the second blind groove 102 is 5 mm narrower than the single side of the first blind groove 101, and its depth is 0.5 mm deeper than the first layer.

[0033] In step S6, the diameter of the blind hole 501 is 0.5 mm. In step S6, the distance between the blind holes 501 on a single reinforcing rib 5 is 10 mm.

[0034] In step S5 , the material of the flexible substrate is polyimide.

[0035] After testing, the circuit board made in this embodiment remains intact after bending, has no cracks on the surface, and maintains all performances intact, meeting the requirements for circuit board use.

[0036] Example 2 A method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp, comprising the steps of raw material preparation, surface coating, cutting a first blind groove 101, cutting a second blind groove 102, overlapping reinforcing ribs 5, and drilling a blind hole 501. A single-sided aluminum substrate is used as the raw material. The aluminum substrate is composed of an aluminum base layer 1, a circuit layer 3, and an insulating layer 2 located between the aluminum base layer 1 and the circuit layer 3. A CNC machine base is used as a processing device. A cutting pattern is preset in the machine tool. After removing oil and dust from the surface of the aluminum substrate, an adhesive is applied. A high-temperature protective film 4 is attached to the surface of the aluminum substrate for hot pressing or hot melting. , so that the high temperature protection film 4 is closely combined with the aluminum substrate, a CNC machine tool is used to accurately cut according to a predetermined pattern on the back of the aluminum substrate to form a first blind groove 101, a second blind groove 102 is processed in the first blind groove 101, and a reinforcing rib 5 is installed in the second blind groove 102. The flexible substrate is used as a raw material and cut into strips so that the length of the reinforcing rib 5 is the same as that of the second blind groove 102, and then the reinforcing rib 5 is bonded to the second blind groove 102, and the drilling CNC machine tool is switched to process a blind hole 501 on the reinforcing rib 5 by the machine tool. Finally, the redundant part of the aluminum substrate is cut off to form a finished aluminum substrate.

[0037] In step S1, the width of the single-sided aluminum substrate is at least 5 mm greater than the width of the finished circuit board.

[0038] The specific steps of step S2 are: removing oil and dust on the surface of the aluminum substrate, then removing the oxide layer on the surface of the aluminum substrate to ensure the flatness and cleanliness of the bonding surface, cutting the high-temperature protective film 4 into the size of the aluminum substrate, and then coating a layer of adhesive on one side of the high-temperature protective film 4, and finally bonding the high-temperature protective film 4 to the surface of the aluminum substrate for hot pressing or hot melting to make the high-temperature protective film 4 tightly bonded to the aluminum substrate.

[0039] In step S3, the edge of the first blind groove 101 is 5 mm wider than the outer edge of the aluminum substrate of the final product.

[0040] In step S4, the edge of the second blind groove 102 is 5 mm narrower than the single side of the first blind groove 101, and its depth is 0.5 mm deeper than the first layer.

[0041] In step S6, the diameter of the blind hole 501 is 0.5 mm. In step S6, the distance between the blind holes 501 on a single reinforcing rib 5 is 10 mm.

[0042] In step S5 , the material of the flexible substrate is polyester.

[0043] The circuit board made in this embodiment remains intact after being bent after testing, has no cracks on the surface, and all performances remain intact, meeting the requirements for the use of the circuit board. Example 3 A method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp, comprising the steps of raw material preparation, surface coating, cutting a first blind groove 101, cutting a second blind groove 102, overlapping reinforcing ribs 5, and drilling a blind hole 501. A single-sided aluminum substrate is used as the raw material. The aluminum substrate is composed of an aluminum base layer 1, a circuit layer 3, and an insulating layer 2 located between the aluminum base layer 1 and the circuit layer 3. A CNC machine base is used as a processing device. A cutting pattern is preset in the machine tool. After removing oil and dust from the surface of the aluminum substrate, an adhesive is applied. A high-temperature protective film 4 is attached to the surface of the aluminum substrate for hot pressing or hot melting. , so that the high temperature protection film 4 is closely combined with the aluminum substrate, a CNC machine tool is used to accurately cut according to a predetermined pattern on the back of the aluminum substrate to form a first blind groove 101, a second blind groove 102 is processed in the first blind groove 101, and a reinforcing rib 5 is installed in the second blind groove 102. The flexible substrate is used as a raw material and cut into strips so that the length of the reinforcing rib 5 is the same as that of the second blind groove 102, and then the reinforcing rib 5 is bonded to the second blind groove 102, and the drilling CNC machine tool is switched to process a blind hole 501 on the reinforcing rib 5 by the machine tool. Finally, the redundant part of the aluminum substrate is cut off to form a finished aluminum substrate.

[0044] In step S1, the width of the single-sided aluminum substrate is at least 5 mm greater than the width of the finished circuit board.

[0045] The specific steps of step S2 are: removing oil and dust on the surface of the aluminum substrate, then removing the oxide layer on the surface of the aluminum substrate to ensure the flatness and cleanliness of the bonding surface, cutting the high-temperature protective film 4 into the size of the aluminum substrate, and then coating a layer of adhesive on one side of the high-temperature protective film 4, and finally bonding the high-temperature protective film 4 to the surface of the aluminum substrate for hot pressing or hot melting to make the high-temperature protective film 4 tightly bonded to the aluminum substrate.

[0046] In step S3, the edge of the first blind groove 101 is 5 mm wider than the outer edge of the aluminum substrate of the final product.

[0047] In step S4, the edge of the second blind groove 102 is 5 mm narrower than the single side of the first blind groove 101, and its depth is 0.5 mm deeper than the first layer.

[0048] In step S6, the diameter of the blind hole 501 is 0.5 mm. In step S6, the distance between the blind holes 501 on a single reinforcing rib 5 is 10 mm.

[0049] In step S5, the material of the flexible substrate is polyvinyl chloride.

[0050] After testing, the circuit board made by this embodiment remains intact after bending, has no cracks on the surface, and various performances remain intact, meeting the requirements for circuit board use. Based on the test structures of various embodiments, it can be seen that the performance of the circuit board made by this method is effectively improved, the strength is guaranteed and it can be bent, which is a significant technical improvement.

[0051] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A method for manufacturing a bendable aluminum-based printed circuit board for LED lamps, characterized in that: The following steps are involved: S1. Raw material preparation: using a single-sided aluminum substrate as raw material, the aluminum substrate comprising an aluminum base layer (1), a circuit layer (3), and an insulating layer (2) located between the aluminum base layer (1) and the circuit layer (3); using a CNC machine base as processing equipment, and presetting a cutting pattern in the machine tool; S2, surface coating, removing oil and dust from the surface of the aluminum substrate, coating with adhesive, attaching the high temperature protective film (4) to the surface of the aluminum substrate, hot pressing or hot melting, so that the high temperature protective film (4) is tightly bonded to the aluminum substrate; S3, cutting the first blind groove (101), using a CNC machine tool to accurately cut the back side of the aluminum substrate according to a predetermined pattern to form the first blind groove (101); S4, cutting a second blind groove (102), and processing the second blind groove (102) in the first blind groove (101); S5, overlapping the reinforcing rib (5), installing the reinforcing rib (5) in the second blind groove (102), using the flexible substrate as the raw material, cutting it into strips so that the length of the reinforcing rib (5) is the same as the length of the second blind groove (102), and then bonding the reinforcing rib (5) into the second blind groove (102); S6, drilling a blind hole (501), switching to a drilling CNC machine tool, using the machine tool to process a blind hole (501) on the reinforcing rib (5), and finally cutting off the excess portion of the aluminum substrate to form a finished aluminum substrate.

2. The method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp according to claim 1, characterized in that: In step S1, the width of the single-sided aluminum substrate is at least 5 mm greater than the width of the finished circuit board.

3. The method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp according to claim 1, characterized in that: The specific steps of step S2 are: removing oil and dust on the surface of the aluminum substrate, then removing the oxide layer on the surface of the aluminum substrate to ensure that the bonding surface is flat and clean, cutting the high-temperature protective film (4) into the size of the aluminum substrate, then coating a layer of adhesive on one side of the high-temperature protective film (4), and finally bonding the high-temperature protective film (4) to the surface of the aluminum substrate by hot pressing or hot melting, so that the high-temperature protective film (4) is tightly bonded to the aluminum substrate.

4. The method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp according to claim 1, characterized in that: In step S3, the edge of the first blind groove (101) is 5 mm wider than the outer edge of the aluminum substrate of the final product.

5. The method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp according to claim 1, characterized in that: In step S4, the edge of the second blind groove (102) is 5 mm narrower than the single side of the first blind groove (101), and its depth is 0.5 mm deeper than the first layer.

6. The method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp according to claim 1, characterized in that: In step S6, the diameter of the blind hole (501) is 0.5 mm.

7. The method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp according to claim 6, characterized in that: In step S6, the distance between each of the blind holes (501) on a single reinforcing rib (5) is 10 mm.

8. The method for manufacturing a bendable aluminum-based printed circuit board for an LED lamp according to claim 1, characterized in that: In step S5 , the material of the flexible substrate is polyimide, polyester or polyvinyl chloride.

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