Heat dissipation mechanism and electronic equipment

Abstract

The invention discloses a heat dissipation mechanism and electronic equipment. The heat dissipation mechanism comprises a bearing assembly, a heat dissipation assembly and a buckling assembly, the bearing assembly comprises a base used for assembling an electronic device, and a heat conduction film is attached to the electronic device. The heat dissipation assembly comprises a top plate provided with a penetrating hole and a crimping unit connected with the top plate, and the crimping unit comprises a pressing sheet inclined towards one side deviating from the heat conduction film; the buckling assembly comprises a cover plate and an abutting unit connected with the cover plate, the abutting unit comprises an abutting piece, the abutting piece penetrates through the penetrating hole to extrude the pressing piece to be tightly attached to a heat conduction rubber piece on the electronic device, the side, facing the pressing piece, of the abutting piece is provided with a resisting part, the side, deviating from the heat conduction rubber piece, of the pressing piece is provided with a protrusion, and the abutting piece moves along the penetrating hole to abut against the pressing piece. The abutting piece moves along the penetrating hole, so that the abutting part is located below the protrusion and abuts against the protrusion, or the abutting piece moves along the penetrating hole, so that the abutting part is located below the top plate and abuts against the top plate. According to the heat dissipation mechanism, assembly and effective heat dissipation of the electronic device are achieved, and the heat dissipation performance is high.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic devices, and in particular to a heat dissipation mechanism and an electronic device. Background Art

[0002] Electronic devices such as memory and chips are one of the important components of electronic devices. With the development of science and technology, the amount of computing power of electronic devices has increased, and the heat generated by electronic devices has also increased. When the temperature of electronic devices is too high, the normal operation of electronic devices will be affected. At present, a thermal conductive film is usually attached to the electronic device, and then a heat sink is inserted so that the heat sink can be close to the thermal conductive film, so that the heat on the electronic device is dissipated through the thermal conductive film and the heat sink. However, there are the following problems when inserting the heat sink. On the one hand, when the heat sink is inserted from top to bottom, the thermal conductive film attached to the electronic device may be touched by the heat sink and fall off; on the other hand, the heat sink may not be effectively attached to the thermal conductive film, resulting in poor heat dissipation performance. Summary of the invention

[0003] In view of the above, it is necessary to provide a heat dissipation mechanism and an electronic device to effectively dissipate heat from electronic devices.

[0004] The embodiment of the present application provides a heat dissipation mechanism, including a receiving component, a heat dissipation component and a snap-fit ​​component; the receiving component includes a base for assembling an electronic device, at least one of the two opposite sides of the electronic device is provided with a thermally conductive film; the heat dissipation component includes a top plate and a crimping unit connected to the top plate, the crimping unit includes the same number of pressing sheets as the thermally conductive films, the pressing sheets are located on the side of the thermally conductive films that is away from the electronic device, the pressing sheets are inclined toward the side away from the thermally conductive films, and the top plate is provided with the same number of through holes as the pressing sheets; the snap-fit ​​component includes a cover plate and an abutment unit connected to the cover plate, the abutment unit includes the same number of abutment sheets as the pressing sheets The contact piece is provided in the through hole to squeeze the corresponding pressing sheet to move toward the electronic device so that the pressing sheet is closely attached to the corresponding thermal conductive film on the electronic device, and a stopper is provided on the side of the contact piece facing the corresponding pressing sheet; wherein a protrusion is provided on the side of the pressing sheet away from the corresponding thermal conductive film, the through hole is located above the corresponding protrusion, and the contact piece can be moved along the length direction of the through hole so that the stopper is located below the corresponding protrusion and abuts against the corresponding protrusion; or, the contact piece can be moved along the length direction of the through hole so that the stopper is located below the top plate and abuts against the top plate.

[0005] In some embodiments, the heat dissipation mechanism also includes a heat exchange component, which is arranged on one side of the receiving component. The heat dissipation component also includes a connecting member, which is connected to the top plate and is located on one side of the crimping unit. The connecting member is connected to the heat exchange component, and the heat exchange component is used to perform heat exchange with the heat dissipation component.

[0006] In some embodiments, the heat dissipation assembly further includes a side plate, which is connected to the top plate and is located on a side of the crimping unit facing away from the connector.

[0007] In some embodiments, a heat conductive sheet is provided at the connection between the heat exchange component and the connector, and the heat conductive sheet is attached between the heat exchange component and the connector.

[0008] In some embodiments, the heat dissipation mechanism also includes a thermally conductive strip and a conductive sheet, wherein the conductive sheet is attached to the heat exchange component, one end of the thermally conductive strip is attached to the top plate and is located between the top plate and the cover plate, and the other end of the thermally conductive strip is attached to the conductive sheet.

[0009] In some embodiments, the heat exchange component includes a shell, a base plate and a plurality of fins, wherein the plurality of fins are evenly arranged on the base plate, the shell is provided with a receiving cavity, the base plate is connected to the shell and the plurality of fins are located in the receiving cavity, the shell is further provided with an inlet and an outlet, the inlet is used to introduce liquid medium into the receiving cavity so that the liquid medium flows between the plurality of fins, and the outlet is used to lead the liquid medium out of the receiving cavity.

[0010] In some embodiments, a push portion is provided on a side of the cover plate facing away from the abutting unit, and the push portion is used to receive an external force to move the cover plate and the abutting unit.

[0011] In some embodiments, the cover plate is provided with an avoidance hole; the snap-fit ​​assembly further includes a handle, which is connected to the cover plate and arranged across the avoidance hole.

[0012] In some embodiments, the through hole includes a first hole and a second hole that are connected, the second hole is located above the corresponding protrusion, and along the width direction of the through hole, the size of the first hole is larger than the size of the second hole, and the second hole is adapted to the abutment.

[0013] An embodiment of the present application also provides an electronic device, comprising an electronic device and a heat dissipation mechanism as described in any of the above technical solutions, wherein the electronic device is assembled on the base, and the pressing sheet of the crimping unit is tightly attached to the thermal conductive adhesive sheet on the electronic device under the abutment of the abutment member of the abutment unit.

[0014] The heat dissipation mechanism and electronic equipment described above assemble the electronic device on the base, and insert the heat dissipation component from the top of the base downward. When inserting the heat dissipation component, since the pressing piece is inclined toward the side away from the corresponding thermal conductive film, that is, the pressing piece is opened at a certain angle relative to the thermal conductive film, the pressing piece will not touch the thermal conductive film on the electronic device when inserting the heat dissipation component, effectively preventing the thermal conductive film from falling off. After the heat dissipation component is inserted, the buckling component is inserted from the top of the base downward. When inserting the buckling component, the abutment member penetrates the through hole on the top plate, and the abutment member squeezes the corresponding pressing piece so that the pressing piece moves toward the electronic device, thereby The pressing piece is pressed tightly against the corresponding thermal conductive film on the electronic device, effectively avoiding poor contact between the pressing piece and the thermal conductive film, and can effectively dissipate heat for the electronic device. After the snap-fit ​​assembly is inserted, the abutment of the abutment unit of the snap-fit ​​assembly can move along the length direction of the through hole, so that the abutment on the abutment is located below the protrusion of the corresponding pressing piece and abuts against the protrusion of the corresponding pressing piece, or the abutment on the abutment is located below the top plate and abuts against the top plate, effectively avoiding the snap-fit ​​assembly from detaching from the heat dissipation assembly, making the pressing piece unable to effectively stick to the corresponding thermal conductive film, and improving the stability of the heat dissipation mechanism.

[0015] The heat dissipation mechanism and electronic device of the embodiments of the present application realize the assembly and effective heat dissipation of electronic devices through the cooperation of the receiving component, the heat dissipation component and the snap-fit ​​component, so that the pressing sheet can effectively adhere to the thermal conductive film on the electronic device to dissipate the heat of the electronic device. The heat dissipation performance of the heat dissipation mechanism is strong and the structure is stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the heat dissipation mechanism provided in an embodiment of the present application.

[0017] Figure 2 yes Figure 1 Schematic diagram of the exploded view of the heat dissipation mechanism shown.

[0018] Figure 3 yes Figure 1 Cross-sectional view of the heat dissipation mechanism along III-III.

[0019] Figure 4 yes Figure 1 Schematic diagram of the exploded view of the heat exchange component.

[0020] Figure 5 It is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0021] Main component symbols

[0022] Electronic equipment 1

[0023] Heat dissipation mechanism 100

[0024] Mounting component 10

[0025] Base 11

[0026] Heat dissipation component 20

[0027] Top Plate 21

[0028] Drilling hole 211

[0029] First hole 213

[0030] Second hole 215

[0031] Crimping unit 23

[0032] Tablet 231

[0033] Bump 233

[0034] Connector 25

[0035] Main body 251

[0036] Extension 253

[0037] Bolt hole 255

[0038] Positioning hole 257

[0039] Screw 27

[0040] Side Panel 29

[0041] Fastening assembly 30

[0042] Cover 31

[0043] Pushing portion 311

[0044] Avoidance hole 313

[0045] Abutment unit 33

[0046] Abutment 331

[0047] Resisting portion 333

[0048] Handle 35

[0049] Heat exchange assembly 40

[0050] Positioning column 41

[0051] Housing 43

[0052] Accommodating chamber 431

[0053] Import 433

[0054] Exit 435

[0055] First connector 437

[0056] Second connector 439

[0057] Bottom plate 45

[0058] Fins 47

[0059] Thermal conductive sheet 50

[0060] Thermal Conductive Strip 60

[0061] Conductive sheet 70

[0062] Heat dissipation module 100a

[0063] Electronic devices 200

[0064] Thermal conductive film 300 DETAILED DESCRIPTION

[0065] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0066] In the description of the present application, it should be understood that the terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, it should be noted that the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0067] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0068] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0069] See also Figure 1 The embodiment of the present application provides a heat dissipation mechanism 100, which is used to assemble and dissipate heat from an electronic device 200, wherein the electronic device 200 may be an object that can generate heat, such as a memory or a chip. The heat dissipation mechanism 100 includes a receiving component 10, a heat dissipation component 20, and a buckle component 30.

[0070] Please refer to Figure 2 and Figure 3 The mounting assembly 10 includes a base 11 for assembling an electronic device 200, wherein a thermal conductive adhesive 300 is attached to at least one of the two opposite sides of the electronic device 200, and the thermal conductive adhesive 300 is used to conduct away the heat generated by the electronic device 200. The heat dissipation component 20 includes a top plate 21 and a crimping unit 23 connected to the top plate 21. The crimping unit 23 includes the same number of pressing plates 231 as the thermally conductive film 300. The pressing plates 231 are located on the side of the corresponding thermally conductive film 300 away from the electronic device 200. The pressing plates 231 are inclined toward the side away from the corresponding thermally conductive film 300, so that the end of the pressing plate 231 away from the top plate 21 is opened at a certain angle relative to the electronic device 200. A protrusion 233 is provided on the side of the pressing plate 231 away from the corresponding thermally conductive film 300. The length of the protrusion 233 is much smaller than the length of the pressing plate 231. The top plate 21 is provided with the same number of through holes 211 as the pressing plates 231. The through holes 211 are located above the corresponding protrusions 233. The length direction of the through holes 211 is the same as the length direction of the top plate 21. The heat dissipation component 20 is made of a material with strong thermal conductivity, such as copper, aluminum, iron, etc. The buckle assembly 30 includes a cover plate 31 and an abutting unit 33 connected to the cover plate 31. The abutting unit 33 includes abutting members 331 having the same number as the pressing sheet 231. The cover plate 31 is arranged parallel to the top plate 21. The abutting members 331 are vertically connected to the cover plate 31 so that the pressing sheet 231 is inclined relative to the abutting members 331. The size of the abutting members 331 is smaller than the size of the through hole 211. The abutting members 331 are penetrated through the through hole 211 of the cover plate 31 to press the corresponding pressing sheet 231 to move toward the electronic device 200, so that the pressing sheet 231 is closely attached to the corresponding thermal conductive adhesive sheet 300 on the electronic device 200. A stopper 333 is provided on one side of the abutting member 331 facing the corresponding pressing sheet 231. The abutting member 331 can move along the length direction of the through hole 211 so that the stopper 333 is located below the corresponding protrusion 233 and the stopper 333 abuts against the corresponding protrusion 233. It can be understood that the resisting portion 333 substantially forms a step structure on the abutting member 331 , so that the protrusion 233 on the pressing sheet 231 forms a barb structure relative to the resisting portion 333 of the abutting member 331 .

[0071] When the heat dissipation mechanism 100 is actually used, the electronic device 200 is assembled on the base 11, and the two opposite sides of the electronic device 200 are both provided with thermal conductive adhesive sheets 300. Accordingly, the pressing unit 23 of the heat dissipation component 20 includes two pressing sheets 231, and the ends of the two pressing sheets 231 away from the top plate 21 are opened at a certain angle due to the inclination relative to the electronic device 200. The cover plate 31 is provided with two through holes 211, and the abutting unit 33 of the buckling component 30 includes two abutting members 331. In a specific implementation, the heat dissipation component 20 is inserted downward from the top of the base 11. When inserting the heat dissipation component 20, since the ends of the two pressing sheets 231 away from the top plate 21 are opened at a certain angle, the pressing sheets 231 will not touch the thermal conductive adhesive sheets 300 on the electronic device 200 when inserting the heat dissipation component 20, and the thermal conductive adhesive sheets 300 are effectively prevented from falling off due to touching the thermal conductive adhesive sheets 300. After the heat dissipation component 20 is inserted, the snap-fit ​​component 30 is inserted downward from the top of the base 11. When the snap-fit ​​component 30 is inserted, the two abutment members 331 are respectively penetrated through the two penetration holes 211 on the top plate 21, and each abutment member 331 squeezes the corresponding pressing sheet 231 so that the pressing sheet 231 moves toward the electronic device 200, and the two pressing sheets 231 are pressed against the corresponding thermal conductive film 300 on the electronic device 200, effectively avoiding poor contact between the pressing sheet 231 and the thermal conductive film 300, and can effectively conduct the heat of the electronic device 200, thereby effectively dissipating the heat of the electronic device 200. After the buckle assembly 30 is inserted, the buckle assembly 30 is moved as a whole along the length direction of the through hole 211, so that the abutting member 331 moves along the length direction of the through hole 211, so that the abutting portion 333 on the abutting member 331 is located below the protrusion 233 of the corresponding pressing sheet 231, and the abutting portion 333 abuts against the corresponding protrusion 233, effectively preventing the buckle assembly 30 from being separated from the heat dissipation component 20 and making the pressing sheet 231 unable to effectively adhere to the corresponding thermal conductive adhesive sheet 300, thereby improving the use stability of the heat dissipation mechanism 100. When disassembling, the buckle assembly 30 only needs to be moved in the opposite direction along the length direction of the through hole 211, so that the abutting portion 333 on the abutting member 331 moves out from under the protrusion 233 of the corresponding pressing sheet 231, and the buckle assembly 30 can be pulled out. After the buckle assembly 30 is pulled out, the heat dissipation component 20 can be pulled out, thereby realizing the disassembly of the heat dissipation mechanism 100, and the assembly and disassembly of the heat dissipation mechanism 100 is convenient.

[0072] In the embodiment of the present application, the receiving assembly 10 includes four bases 11, each base 11 is used to assemble the electronic device 200, and the two opposite sides of each electronic device 200 are affixed with a thermal conductive adhesive 300. The heat dissipation assembly 20 includes four crimping units 23, each crimping unit 23 includes two pressing sheets 231, the two pressing sheets 231 are connected together, the two pressing sheets 231 can be integrally formed, and the ends of the two pressing sheets 231 away from the top plate 21 are opened at a certain angle, and five through holes 211 are opened on the top plate 21, wherein two adjacent pressing sheets 231 in two adjacent crimping units 23 can share one through hole 211. The snap-fit ​​assembly 30 includes four abutment units 33, wherein two adjacent abutment members 331 in two adjacent abutment units 33 can be connected together, so that the snap-fit ​​assembly 30 includes five abutment members 331 in total. In this way, by setting the above-mentioned number of bases 11, crimping units 23, through holes 211 and abutments 331, the heat dissipation mechanism 100 can dissipate heat for four electronic devices 200 at the same time, thereby improving the heat dissipation performance of the heat dissipation mechanism 100. Among them, when the length of the electronic device 200 is longer, the length of the pressing plate 231 should also be adaptively increased, and two protrusions 233 are arranged at intervals on each pressing plate 231. Correspondingly, ten through holes 211 are opened on the top plate 21, and the number of abutments 331 is ten. It can be understood that when the length of the electronic device 200 is longer, more protrusions 233, through holes 211 and abutments 331 can be set, which can be set according to actual conditions, and the embodiments of the present application do not make specific limitations on this.

[0073] It can be understood that in other embodiments, the housing component 10 can also include more or fewer bases 11, for example, n bases 11, where n is a natural number, the heat dissipation component 20 includes n crimping units 23, the top plate 21 is provided with n+1 through holes 211, and the snap-fit ​​component 30 includes n+1 abutment members 331, so that the heat dissipation mechanism 100 can dissipate heat for more or fewer electronic devices 200 at the same time.

[0074] It can be understood that in other embodiments, when the housing assembly 10 includes more or fewer bases 11, the number of thermal conductive films 300 on the electronic devices 200 on each base 11 can be one or two, and accordingly, the number of pressing sheets 231 in each crimping unit 23 and the number of abutment members 331 in the abutment unit 33 can be adaptively changed, and the embodiments of the present application do not specifically limit this.

[0075] In order to better dissipate heat for the electronic device 200, in the embodiment of the present application, the heat dissipation mechanism 100 further includes a heat exchange component 40, which is disposed on one side of the receiving component 10, and the heat dissipation component 20 further includes a connector 25, which is connected to the top plate 21 and is located on one side of the crimping unit 23, and the connector 25 is connected to the heat exchange component 40, and the heat exchange component 40 is used to perform heat exchange with the heat dissipation component 20, thereby cooling the heat dissipation component 20. In this way, by providing the above-mentioned heat exchange component 40, the heat dissipation component 20 conducts the heat of the electronic device 200 to the heat exchange component 40 to perform heat exchange with the heat exchange component 40, so that the heat exchange component 40 cools the heat dissipation component 20, so that the heat dissipation component 20 better dissipates heat for the electronic device 200, and the heat dissipation performance of the heat dissipation mechanism 100 is improved.

[0076] Specifically, the connector 25 includes a main body 251 and an extension 253. The main body 251 is roughly U-shaped. The main body 251 is connected to the top plate 21 and is located on one side of the crimping unit 23. The extension 253 is vertically connected to the middle of the main body 251 and extends outward toward the side away from the crimping unit 23. Two bolt holes 255 are provided on the extension 253. The screws 27 pass through the bolt holes 255 to connect the connector 25 to the heat exchange component 40 so that the connector 25 is connected to the heat exchange component 40. Furthermore, a positioning column 41 is provided on the heat exchange component 40, and a positioning hole 257 is also provided on the extension 253. The positioning hole 257 is located between the two bolt holes 255. Through the positioning and matching of the positioning column 41 and the positioning hole 257, the extension 253 is accurately connected to the heat exchange component 40, thereby realizing the accurate connection between the connector 25 and the heat exchange component 40.

[0077] It is understandable that the heat dissipation component 20 and the heat exchange component 40 may be connected together by welding, integral molding, etc., so as to improve the structural strength and stability of the heat dissipation mechanism 100.

[0078] In order to protect the crimping unit 23 of the heat dissipation assembly 20, in the embodiment of the present application, the heat dissipation assembly 20 further includes a side plate 29, which is connected to the top plate 21 and is located on the side of the crimping unit 23 away from the connector 25, that is, the side plate 29 and the connector 25 are respectively located on both sides of the crimping unit 23. In this way, by providing the above-mentioned side plate 29, the crimping unit 23 or multiple crimping units 23 are located between the side plate 29 and the connector 25, thereby preventing the crimping unit 23 from being directly impacted by an external mechanism and deforming, and failing to ensure that the pressing sheet 231 maintains an open angle relative to the electronic device 200. Through the protective effect of the side plate 29, it is ensured that the crimping unit 23 can be used stably, thereby improving the stability of the heat dissipation assembly 20.

[0079] In order to make the heat dissipation component 20 conduct heat to the heat exchange component 40 better, in the embodiment of the present application, a heat conductive sheet 50 is provided at the connection between the heat exchange component 40 and the connector 25, and the heat conductive sheet 50 is attached between the heat exchange component 40 and the connector 25. Specifically, the heat conductive sheet 50 is attached between the heat exchange component 40 and the extension portion 253 of the connector 25. In this way, by providing the above-mentioned heat conductive sheet 50, the heat dissipation component 20 can better conduct heat to the heat exchange component 40, thereby improving the heat dissipation performance of the heat dissipation mechanism 100.

[0080] In order to further enable the heat dissipation component 20 to better conduct heat to the heat exchange component 40, in the embodiment of the present application, the heat dissipation mechanism 100 also includes a heat conduction bar 60 and a conduction sheet 70. The conduction sheet 70 is attached to the heat exchange component 40. One end of the heat conduction bar 60 is attached to the top plate 21 and is located between the top plate 21 and the cover plate 31. The other end of the heat conduction bar 60 is attached to the conduction sheet 70. One end of the heat conduction bar 60 is roughly U-shaped to increase the contact area between the heat conduction bar 60 and the top plate 21, thereby improving the heat conduction efficiency between the top plate 21 and the heat conduction bar 60. The heat conduction bar 60 can be made of materials with strong thermal conductivity such as copper, aluminum, and iron. In this way, by providing the above-mentioned heat conduction bar 60 and conduction sheet 70, the heat dissipation component 20 can further better conduct heat to the heat exchange component 40. The conductive sheet 70, the heat conductive sheet 50 and the heat conductive adhesive sheet 300 can be made of the same material, for example, they are all made of thermally conductive silicone with good thermal conductivity. On the one hand, the thermally conductive silicone can achieve heat conduction, and on the other hand, the thermally conductive silicone can achieve adhesion between two objects. It can be understood that the conductive sheet 70, the heat conductive sheet 50 and the heat conductive adhesive sheet 300 can also be thermally conductive gel, thermally conductive paste and other thermal conductive media.

[0081] It can be understood that in other embodiments, the number of thermal conductive strips 60 can also be two, three or more, and two, three or more thermal conductive strips 60 are arranged at intervals and are all arranged on the heat exchange component 40 and the top plate 21. The specific setting can be made according to actual conditions, and the embodiment of the present application does not make specific limitations on this.

[0082] In the embodiment of the present application, it is defined that the housing component 10, the heat dissipation component 20 and the buckle component 30 constitute a heat dissipation module 100a, the number of heat dissipation modules 100a is two, the heat exchange component 40 is located between the two heat dissipation modules 100a and the heat exchange component 40 is respectively connected to the two extensions 253 of the two heat dissipation modules 100a, wherein the two ends of the heat conduction bar 60 are respectively attached to the top plates 21 of the two heat dissipation modules 100a, and the middle part of the heat conduction bar 60 is attached to the conductive sheet 70 on the heat exchange component 40. In this way, the two heat dissipation modules 100a are cooled by one heat exchange component 40, thereby improving the utilization rate of the heat exchange component 40.

[0083] It can be understood that in other embodiments, the middle part of the thermal conductive bar 60 is welded to the heat exchange component 40, the two ends of the thermal conductive bar 60 are welded to the two heat dissipation components 20 on both sides, and the heat exchange component 40 is welded to the two heat dissipation components 20 on both sides, that is, the thermal conductive bar 60, the heat exchange component 40 and the two heat dissipation components 20 on both sides are welded.

[0084] It can be understood that in other embodiments, the middle part of the thermal conductive strip 60 is welded to the heat exchange component 40, the heat exchange component 40 is connected to the two heat dissipation components 20 on both sides by screws 27, and the two ends of the thermal conductive strip 60 are connected to the two heat dissipation components 20 on both sides by screws 27 or welding.

[0085] It can be understood that in other embodiments, the middle part of the thermal conductive bar 60 is connected to the heat exchange component 40 by means of screws 27, the heat exchange component 40 is connected to the two heat dissipation components 20 on both sides by means of screws 27, and both ends of the thermal conductive bar 60 are connected to the two heat dissipation components 20 on both sides by means of screws 27, that is, the thermal conductive bar 60, the heat exchange component 40 and the two heat dissipation components 20 on both sides are fixedly connected by means of screws 27.

[0086] It can be understood that the thermal conductive strip 60, the heat exchange component 40 and the two heat dissipation components 20 on both sides can be connected by one or more methods such as welding and screws 27, and the embodiment of the present application does not specifically limit this.

[0087] It can be understood that in other embodiments, the number of heat dissipation modules 100a can be more, for example, five, and correspondingly, the number of heat exchange components 40 is four. The five heat dissipation modules 100a and the four heat exchange components 40 are arranged crosswise in sequence. The length of the thermal conductive strip 60 can be adaptively increased, or a thermal conductive strip 60 can be arranged between every two heat dissipation modules 100a. The specific setting can be made according to actual conditions, and the embodiment of the present application does not make any specific limitation on this.

[0088] In order to enable the snap-fit ​​assembly 30 to be better stuck on the heat dissipation assembly 20 and to enable the abutment 331 to be more easily inserted into the through hole 211, in the embodiment of the present application, each through hole 211 includes a first hole 213 and a second hole 215 that are connected, and the second hole 215 is located above the corresponding protrusion 233. Along the width direction of the through hole 211, the size of the first hole 213 is larger than the size of the second hole 215, and the second hole 215 is adapted to the corresponding abutment 331. In this way, when inserting the snap-fit ​​component 30, the abutment 331 is inserted from the larger first hole 213, and after the abutment 331 is inserted into place and effectively squeezes the pressing sheet 231 against the thermal conductive film 300, the snap-fit ​​component 30 is pushed along the length direction of the through hole 211, so that the abutment 331 is located in the second hole 215, and the abutment portion 333 is located below the corresponding protrusion 233, so that the snap-fit ​​component 30 can be better stuck on the heat dissipation component 20 and the abutment 331 can be more easily inserted into the through hole 211.

[0089] It can be understood that in other embodiments, the protrusion 233 on the pressing sheet 231 can be omitted, and accordingly, a stop portion 333 can be provided to extend upward to the bottom of the top plate 21. In this way, when inserting the snap-fit ​​component 30, the abutment 331 is inserted from the larger first hole 213, and after the abutment 331 is inserted into place and effectively squeezes the pressing sheet 231 to fit tightly against the thermal conductive adhesive 300, the snap-fit ​​component 30 is pushed along the length direction of the through hole 211, so that the abutment 331 is located in the second hole 215, and the stop portion 333 is located below the top plate 21. Since the size of the first hole 213 is larger than the size of the second hole 215, the stop portion 333 abuts against the top plate 21, thereby achieving a fixed connection between the snap-fit ​​component 30 and the heat dissipation component 20, effectively preventing the snap-fit ​​component 30 from detaching from the heat dissipation component 20 and making the pressing sheet 231 unable to effectively fit tightly against the corresponding thermal conductive adhesive 300, thereby improving the stability of the heat dissipation mechanism 100.

[0090] Furthermore, in the embodiment of the present application, a push portion 311 is provided on the side of the cover plate 31 away from the abutment unit, and the push portion 311 has an inclined surface or an arc surface, and the push portion 311 is used to bear external force, such as human power, mechanical thrust, etc., to move the cover plate 31 and the abutment unit 32. In this way, by providing the above-mentioned push portion 311, the cover plate 31 and the abutment unit 33 can be driven to move by the push portion 311.

[0091] In order to facilitate the removal of the snap-fit ​​assembly 30 and avoid the thermal conductive strip 60, in the embodiment of the present application, an avoidance hole 313 is provided on the cover plate 31, and the snap-fit ​​assembly 30 also includes a handle 35, which is connected to the cover plate 31 and arranged across the avoidance hole 313. In this way, by providing the above-mentioned avoidance hole 313, on the one hand, it is convenient to reduce the weight of the cover plate 31, so as to facilitate the removal of the snap-fit ​​assembly 30, and on the other hand, the thermal conductive strip 60 is avoided through the avoidance hole 313, so as to facilitate the installation of a larger area of ​​the thermal conductive strip 60 on the top plate 21, thereby improving the heat conduction efficiency between the top plate 21 and the thermal conductive strip 60. In addition, by providing the above-mentioned handle 35, it is convenient to insert and remove the snap-fit ​​assembly 30; the cover plate 31 and the abutment unit 33 can also be driven to move by the handle 35.

[0092] In order to make it easier for the abutment 331 to press the corresponding pressing piece 231, in the embodiment of the present application, the end of the abutment 331 (including the abutment 331 connected together in two adjacent abutment units 33) facing away from the cover plate 31 is set to be conical. In this way, by limiting the end of the abutment 331 facing away from the cover plate 31 to be conical, on the first hand, it is convenient to insert the abutment 331 between two adjacent pressing pieces 231, and on the second hand, through the inclined surface on the cone, it is convenient for the abutment 331 to fit with the inclined pressing piece 231, so that the abutment 331 can more easily press the inclined pressing piece 231, reduce the friction between the abutment 331 and the pressing piece 231, effectively avoid wearing the pressing piece 231, and ensure the strength and stability of the pressing piece 231.

[0093] Please refer to Figure 2 and Figure 4In the embodiment of the present application, the heat exchange assembly 40 includes a shell 43, a bottom plate 45 and a plurality of fins 47, wherein the plurality of fins 47 are evenly arranged on the bottom plate 45, the shell 43 is provided with a receiving cavity 431, the bottom plate 45 is connected to the shell 43 and the plurality of fins 47 are located in the receiving cavity 431, wherein the bottom plate 45 is embedded in the shell 43 so that the bottom plate 45 is flush with the shell 43, and the positioning column 41 is provided on the side of the shell 43 away from the bottom plate 45. The side of the shell 43 away from the bottom plate 45 is also provided with an inlet 433 and an outlet 435, the inlet 433 is used to introduce the liquid medium into the receiving cavity 431 so that the liquid medium flows between the plurality of fins 47, and the outlet 435 is used to lead the liquid medium out of the receiving cavity 431. Thus, by setting the specific structure of the heat exchange assembly 40, the liquid medium is introduced into the accommodating chamber 431 through the inlet 433 and the liquid medium is led out of the accommodating chamber 431 through the outlet 435, so that the liquid medium flows between the multiple fins 47 and takes away the heat on the shell 43, thereby achieving heat dissipation of the extension 253 and the heat conductive strip 60, thereby achieving heat dissipation of the heat dissipation assembly 20 and the electronic device 200. The liquid medium can be cooling water, refrigerant or other fluid that can be used for heat exchange with the shell 43, and the accommodating chamber 431 can be divided into two or more parts, which can be set according to actual conditions.

[0094] In the embodiment of the present application, the inlet 433 is connected to a first joint 437, and the outlet 435 is connected to a second joint 439. The first joint 437 is used to introduce the liquid medium into the inlet 433, and the second joint 439 is used to lead the liquid medium out of the outlet 435. The first joint 437 and the second joint 439 are also used to communicate with an external liquid circulation system (not shown). In this way, by providing the above-mentioned first joint 437 and second joint 439, the effect of connecting the heat exchange component 40 with the external liquid circulation system is achieved, so that the external liquid circulation system continuously provides the heat exchange component 40 with a continuously flowing liquid medium, thereby improving the heat exchange efficiency of the heat exchange component 40.

[0095] The heat dissipation mechanism 100 of the embodiment of the present application realizes the assembly and effective heat dissipation of the electronic device 200 through the cooperation of the receiving component 10, the heat dissipation component 20 and the snap-fit ​​component 30, so that the pressing sheet 231 can effectively adhere to the thermal conductive film 300 on the electronic device 200 to dissipate the heat of the electronic device 200. The heat dissipation mechanism 100 has strong heat dissipation performance, stable structure and easy installation.

[0096] The heat dissipation mechanism 100 of the embodiment of the present application further achieves further cooling of the heat dissipation component 20 through the cooperation of the heat exchange component 40, the heat conductive sheet 50, the heat conductive strip 60 and the conductive sheet 70, thereby further improving the heat dissipation performance of the heat dissipation mechanism 100.

[0097] See also Figure 5, the embodiment of the present application also provides an electronic device 1. The electronic device 1 includes an electronic device 200 and a heat dissipation mechanism 100 as described in the above technical solution, the electronic device 200 is mounted on the base 11 of the heat dissipation mechanism 100, the electronic device 200 and the heat dissipation mechanism 100 are both mounted inside the electronic device 1, and the pressing piece 231 of the pressing unit 23 is tightly attached to the thermal conductive film 300 on the electronic device 200 under the abutment of the abutment member 331 of the abutment unit 33. In this way, by setting the above-mentioned heat dissipation mechanism 100, the pressing piece 231 can effectively be attached to the thermal conductive film 300 on the electronic device 200 to dissipate the heat of the electronic device 200, thereby achieving heat dissipation of the electronic device 200, and the heat dissipation mechanism 100 has strong heat dissipation performance, stable structure, and convenient installation, which is conducive to improving the performance of the electronic device 1.

[0098] In the embodiment of the present application, the electronic device 1 may be a laptop computer. It is understandable that in other embodiments, the electronic device 1 may also be a mobile phone, a tablet computer, a smart watch, smart glasses, a camera, a television, a refrigerator, or other devices that can use heat-generating devices such as memory and chips, and the embodiment of the present application does not specifically limit this.

[0099] It is obvious to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present application.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A heat dissipation mechanism, characterized in that: include: The receiving assembly comprises a base for assembling an electronic device, at least one of two opposite sides of the electronic device being provided with a thermally conductive adhesive film; A heat dissipation assembly, comprising a top plate and a crimping unit connected to the top plate, wherein the crimping unit comprises the same number of pressing sheets as the thermally conductive film, the pressing sheets are located on a side of the thermally conductive film away from the electronic device, the pressing sheets are inclined toward a side away from the thermally conductive film, and the top plate is provided with the same number of through holes as the pressing sheets; A buckle assembly, comprising a cover plate and an abutment unit connected to the cover plate, wherein the abutment unit comprises abutment pieces having the same number as the pressing pieces, the abutment pieces being inserted through the insertion holes to press the corresponding pressing pieces to move toward the electronic device so that the pressing pieces are closely attached to the corresponding thermal conductive adhesive sheets on the electronic device, and a stopper is provided on one side of the abutment piece facing the corresponding pressing piece; Wherein, a protrusion is provided on the side of the pressing sheet facing away from the corresponding thermal conductive film, the penetration hole is located above the corresponding protrusion, and the abutment member can move along the length direction of the penetration hole so that the blocking portion is located below the corresponding protrusion and abuts against the corresponding protrusion; or, the abutment member can move along the length direction of the penetration hole so that the blocking portion is located below the top plate and abuts against the top plate.

2. The heat dissipation mechanism according to claim 1, characterized in that: The heat dissipation mechanism also includes a heat exchange component, which is arranged on one side of the receiving component. The heat dissipation component also includes a connecting piece, which is connected to the top plate and is located on one side of the crimping unit. The connecting piece is connected to the heat exchange component, and the heat exchange component is used to perform heat exchange with the heat dissipation component.

3. The heat dissipation mechanism according to claim 2, characterized in that: The heat dissipation assembly further includes a side plate, which is connected to the top plate and is located at a side of the crimping unit away from the connector.

4. The heat dissipation mechanism according to claim 2, characterized in that: A heat conducting sheet is provided at the connection between the heat exchange component and the connecting member, and the heat conducting sheet is attached between the heat exchange component and the connecting member.

5. The heat dissipation mechanism according to claim 2, characterized in that: The heat dissipation mechanism also includes a heat conductive strip and a conductive sheet. The conductive sheet is attached to the heat exchange component. One end of the heat conductive strip is attached to the top plate and located between the top plate and the cover plate, and the other end of the heat conductive strip is attached to the conductive sheet.

6. The heat dissipation mechanism according to claim 2, characterized in that: The heat exchange component includes a shell, a base plate and a plurality of fins, wherein the plurality of fins are evenly arranged on the base plate, the shell is provided with a receiving cavity, the base plate is connected to the shell and the plurality of fins are located in the receiving cavity, the shell is further provided with an inlet and an outlet, the inlet is used to introduce a liquid medium into the receiving cavity so that the liquid medium flows between the plurality of fins, and the outlet is used to lead the liquid medium out of the receiving cavity.

7. The heat dissipation mechanism according to claim 1, characterized in that: A push portion is provided on one side of the cover plate away from the abutting unit, and the push portion is used to receive external force to move the cover plate and the abutting unit.

8. The heat dissipation mechanism according to claim 1, characterized in that: The cover plate is provided with an avoidance hole; the buckling assembly further comprises a handle, which is connected to the cover plate and arranged across the avoidance hole.

9. The heat dissipation mechanism according to claim 1, characterized in that: The penetration hole includes a first hole and a second hole that are connected. The second hole is located above the corresponding protrusion. Along the width direction of the penetration hole, the size of the first hole is larger than the size of the second hole. The second hole is adapted to the abutment member.

10. An electronic device, characterized in that: It comprises an electronic device and a heat dissipation mechanism as described in any one of claims 1 to 9, wherein the electronic device is assembled on the base, and the pressing sheet of the crimping unit is tightly attached to the thermal conductive adhesive sheet on the electronic device under the abutment of the abutting piece of the abutting unit.

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