Power module including semiconductor module components and alignment portions and method for

Abstract

There is provided a power module (100) comprising a semiconductor module component (10) and an alignment portion (20), wherein the alignment portion (20) is fixed on a lateral top surface (10T) of the semiconductor module component (10) and comprises at least one recessed portion (20R). The semiconductor module component (10) comprises at least one terminal (12, 13) oriented at least in some places vertically relative to a lateral top surface (10T) of the semiconductor module component (10) and located at least partially within the at least one recessed portion (20R) for alignment in the lateral direction. In the vertical direction, the at least one terminal (12, 13) protrudes beyond the at least one recessed portion (20R). The at least one recessed portion (20R) is located on a side surface (20S) of the alignment portion (20), where the at least one recessed portion (20R) is a vertical groove as an open recess on the side surface (20S) of the alignment portion (20), and where the groove is not a through-hole completely surrounded by an inner wall (20W) of the at least one recessed portion (20R) in a lateral direction. Furthermore, a method for forming a power module (100) comprising a semiconductor module component (10) is provided.

Description

Technical Field

[0001] The present disclosure relates to a power module including a semiconductor module component and an alignment portion and a method for forming such a power module. Background Art

[0002] When implementing power modules (e.g., power semiconductor modules) in various applications, the power modules should be mechanically and electrically connected to control electronics (e.g., gate drivers or other integrated circuits configured to control the power modules). The control electronics may be arranged on an assembly board, such as a control board, which may be a printed circuit board. Such an assembly board may be arranged on top of the power module. The electrical connection between one or more power semiconductor modules and the assembly board may be provided by terminals of one or more power modules, such as by main terminals (e.g., in the form of power terminals) and / or auxiliary terminals in the form of control terminals.

[0003] Therefore, it is necessary to accurately position one or more power modules relative to the position of the assembly board in order to facilitate the process of mechanically and electrically interconnecting the one or more power modules to the assembly board. In addition, when the terminals are inserted or pressed into the contact holes of the assembly board, it is desirable to have sufficient mechanical support for the terminals so that the terminals can be inserted into the contact holes in a safe and efficient manner. The use of an integrated alignment portion can help provide an efficient and simplified method for accurately positioning one or more power modules relative to the position of the assembly board, such as for accurately positioning the terminals of one or more power modules (e.g., in the form of main terminals and / or auxiliary terminals) relative to the position of the contact holes of the assembly board.

[0004] Document US2021 / 358869 A1 describes a semiconductor device comprising a semiconductor module, a printed board and a positioning member. The semiconductor module comprises a housing for accommodating components, wherein the housing has a front surface on which electrode terminals, control terminals (external terminals) and reference pins are formed. The printed board comprises terminal holes, and the printed board is electrically connected to control terminals passing through and attached to these terminal holes. Each of the four reference pins of the semiconductor module passes through a corresponding one of the four corners of the printed board. In addition, a positioning element of the positioning member passes through the printed board. The positioning member is placed between the semiconductor module and the printed board. The positioning member has a front surface, wherein the positioning element is formed on the front surface of the positioning member. The control terminals and reference pins of the semiconductor module pass through the positioning member. Summary of the invention

[0005] Embodiments of the present disclosure, such as those claimed in the independent claims, address the above shortcomings in the art in whole or in part. Other embodiments of power modules and methods for forming power modules with integrated alignment and other embodiments of methods for interconnecting one or more power modules to an assembly board (e.g., a control board) are the subject of other claims.

[0006] According to an embodiment of the power module, a semiconductor module component and an alignment portion are included. The alignment portion is fixed on a lateral top surface of the semiconductor module component. The alignment portion includes at least one recessed portion. The semiconductor module component includes at least one terminal. The terminal is oriented perpendicular to the lateral top surface of the semiconductor module component at least in some places. For the purpose of alignment in the lateral direction, the terminal is at least partially located in the at least one recessed portion. In the vertical direction, the at least one terminal protrudes beyond the at least one recessed portion.

[0007] Since the alignment portion is fixed to the semiconductor module component, the alignment portion is an integral part of the power module. If the power module is mechanically and electrically connected to the assembly board, the alignment portion is located, for example, between the semiconductor module component and the assembly board. Using the alignment portion, the lateral position of the terminal can be accurately adjusted to, for example, the lateral position of the contact hole of the assembly board. In addition, the alignment portion can provide mechanical support for the terminal so that the terminal can be inserted or pressed into the contact hole of the assembly board in a safe and simplified manner. In view of this aspect, the correct alignment of one or several terminals (for example, pin-shaped terminals) of the power module relative to one or several contact holes of the assembly board (for example, a control board) can be ensured. Therefore, it can be avoided that some terminals are bent or displaced and cannot be assembled into the contact holes of the assembly board.

[0008] Here and below, for the sake of clarity and simplicity, features of the power module and method are sometimes described in conjunction with only one recessed portion and / or only one terminal. However, it should be understood that these features can also be applied to multiple recessed portions and / or multiple terminals, respectively. Different recessed portions can be formed identically or differently. The terminals can be formed identically or differently. The power module can include more than one module component, for example, more than one semiconductor module component. The alignment portion can be arranged on a single module component or on several module components. For example, the alignment portion is arranged on several module components, which are arranged transversely to each other to form, for example, a six-unit (Sixpack) module, wherein the module components (for example, three module components) are arranged in a row on the cooler.

[0009] Therefore, it is possible that the alignment portion comprises a plurality of recessed portions, the plurality of recessed portions comprising at least one recessed portion mentioned above. The recessed portions may be spaced apart from each other along a lateral direction, for example along a horizontal direction. The semiconductor module component may comprise a plurality of terminals, the plurality of terminals comprising at least one terminal mentioned above. The terminals may be spaced apart from each other along a lateral direction, for example along a horizontal direction.

[0010] The vertical direction is to be understood as meaning a direction pointing perpendicularly to the top surface of the semiconductor module component. The lateral direction is to be understood as meaning a direction parallel to the top surface of the semiconductor module component. The vertical direction and the lateral direction are orthogonal to each other. The top surface of the semiconductor module component is a lateral surface, which can be defined by two vectors pointing, for example, in the horizontal direction and the longitudinal direction. The horizontal direction can be a lateral direction along which the recessed portion of the alignment portion or the terminals of the semiconductor module component or the power module are spaced apart from each other. The longitudinal direction can be another lateral direction along which the terminals protrude from the side surface of the semiconductor module component. The recess can extend along the longitudinal direction.

[0011] In a lateral direction perpendicular to the horizontal direction, i.e. in a longitudinal direction, at least one terminal or a plurality of terminals may be positioned at a lateral position of a side surface of the semiconductor module component. The terminal may also extend vertically from the body of the module component. For the purpose of alignment in the lateral direction and for the purpose of mechanical support in the vertical direction, each of the plurality of terminals may be at least partially located in one of the recessed portions.

[0012] According to another embodiment of the power module, at least one recessed portion or a plurality of recessed portions are located on the side surface of the alignment portion. In a plan view of the lateral top surface of the semiconductor module component, the at least one recessed portion and the at least one terminal may be located outside the lateral top surface of the semiconductor module component, for example outside the periphery of the lateral top surface of the semiconductor module component.

[0013] According to another embodiment of the power module, at least one recessed portion is formed as a groove extending through the alignment portion in the vertical direction. The groove is, for example, an open portion on the side surface of the alignment portion. In the vertical direction, the groove may extend partially or completely through the alignment portion. However, the groove is not a through hole completely surrounded by the inner wall of the recessed portion in the lateral direction. The groove is more precisely an open recess on the side surface of the alignment portion. The groove may have a retaining structure or a supporting structure for supporting the terminal in the vertical direction and providing alignment of the terminal. The supporting structure is, for example, not on the entire bottom of the groove. The supporting structure may have the form of a step, but is not limited thereto. Moreover, the bottom portion of the terminal may have a tensile structure. After aligning the terminal, the retaining structure or the supporting structure is located, for example, below the terminal in the case of the bottom surface. If the retaining structure or the supporting structure has the form of a step on the side wall of the groove, the lateral tensile structure (for example, the crossbar of the terminal) is arranged on the surface of the step.

[0014] According to another embodiment of the power module, at least one recessed portion includes a retaining structure configured to mechanically support at least one terminal when the at least one terminal is pressed or inserted in a forward direction (e.g., in a direction pointed by the terminal tip) along a vertical direction. Thus, the retaining structure can provide alignment of at least one terminal in a vertical direction. For example, the entire terminal or at least a portion of the terminal is retained or supported by the retaining structure of the recessed portion. The alignment of at least one terminal is achieved in two ways: moving a module component with one or more terminals toward a fixed assembly plate, and moving the assembly plate toward a fixed module component with one or more terminals.

[0015] According to another embodiment of the power module, the retaining structure is provided by a stepped structure of the inner wall of the at least one recessed portion. At least one terminal may include a laterally extending structure, for example in the form of a single-sided rod or in the form of a crossbar, wherein the laterally extending structure is arranged on the stepped surface of the stepped structure. Additionally or alternatively, the retaining structure may also be provided by the bottom area of ​​the at least one recessed portion. The lower portion of the at least one terminal may be arranged on the bottom area of ​​the at least one recessed portion. In order to insert the at least one terminal, the retaining structure or the lower bottom area does not extend over the entire cross-section of the recessed portion. The lower portion of the at least one terminal is, for example, a horizontal portion, which may have an extension to contact the retaining structure or the lower bottom area of ​​the recessed portion.

[0016] According to another embodiment of the power module, the alignment portion is electrically insulating. For example, the alignment portion is made of an electrically insulating material. The alignment portion may include a body made of an electrically insulating material.

[0017] According to another embodiment of the power module, the power module includes a shielding layer configured to protect semiconductor module components from electromagnetic interference and / or to protect the assembly board from electromagnetic interference with the power module (e.g., in high voltage applications). The shielding layer can be embedded in the alignment portion. The shielding layer can be a layer made of a conductive material. However, since the shielding layer is not configured to be assigned to any electrical polarity of the power module, the alignment portion remains electrically insulated even if the shielding layer is embedded in the alignment portion. For example, when the shielding layer is embedded in the alignment portion, the shielding layer does not have any portion accessible from the outside. In other words, the shielding layer is completely embedded in the alignment portion. The shielding layer can also be arranged on the top surface or the bottom surface of the alignment portion. However, in a top view, it is conceivable that the shielding layer does not completely cover the top surface and / or the bottom surface of the alignment portion. In general, the shielding layer should not contact other electrical parts except the ground contact.

[0018] According to another embodiment of the power module, the alignment portion is mechanically connected to the semiconductor module component by a bonding layer, for example after an alignment procedure. The bonding layer may be a glue layer, an adhesive layer, etc. Additionally or alternatively, the alignment portion may be mechanically connected to the semiconductor module component by a snap-fit ​​connection or by a clamping connection. Furthermore, additionally or as another alternative, the alignment portion may be mechanically connected to the semiconductor module component by a pin hole connection or by one or more screws.

[0019] According to another embodiment of the power module, at least one terminal is a pin terminal or a press-fit terminal. The press-fit terminal can be inserted or pressed into a contact hole of the assembly board and mechanically fixed to the contact hole of the assembly board without using additional connection means.

[0020] According to another embodiment of the power module, the alignment portion includes a plurality of recessed portions, the plurality of recessed portions including at least one recessed portion. The semiconductor module component may include a plurality of terminals, the plurality of terminals including at least one terminal. The terminal may be a main terminal and / or an auxiliary terminal. For the purpose of alignment along the lateral direction and for the purpose of mechanical support along the vertical direction, each of the plurality of terminals may be at least partially located in one of the plurality of recessed portions. The plurality of terminals may belong to a single module component or to several module components. Therefore, each module component may be fixed to only one alignment portion, or several module components may be fixed to a common alignment portion.

[0021] According to an embodiment of a method for fixing an alignment portion (e.g., an electrically insulating alignment portion) including at least one recessed portion to a semiconductor module component including at least one terminal, the method includes the following steps: positioning the alignment portion in an inclined orientation relative to a lateral top surface of the semiconductor module component to insert at least one terminal into at least one recessed portion of the alignment portion, the at least one terminal being oriented perpendicular to the lateral top surface of the semiconductor module component at least in some places, wherein the recessed portion is located at an edge area of ​​the alignment portion.

[0022] The method further comprises the following steps: moving the alignment portion towards the lateral top surface of the semiconductor module component so that the alignment portion reaches a horizontal orientation relative to the lateral top surface of the semiconductor module component, wherein, in a vertical direction, at least one terminal protrudes beyond at least one recessed portion, and wherein at least one recessed portion is configured for aligning at least one terminal in a lateral direction and for providing additional mechanical support for at least one terminal in a vertical direction. Thus, alignment in a vertical direction can also be provided. Furthermore, the method further comprises: fixing the alignment portion to the semiconductor module component to form a power module comprising the alignment portion and the semiconductor module component.

[0023] In order to prevent the misalignment or unwanted bending of one or more terminals, the alignment portion and / or the module component may have an additional alignment structure for supporting the correct alignment between the module component and the alignment portion. The alignment portion can be aligned with the power module or one or more module components using a pin and a hole in the terminal or mold body, or vice versa. The alignment portion can also be aligned on one side of the mold body or elsewhere. In addition, in order to align between the alignment portion and the power module or module component (for example, between the alignment portion and the mold body of the module component), a stop structure (bedstop-structure) or a guide structure can be used in the alignment portion or in the module component. In addition, a combined method of alignment and fixing using a snap-fit ​​connection and / or a screw connection is feasible. With regard to providing alignment in the vertical direction, it should be noted that if the terminal is low and positioned in the vertical direction, it can be aligned in the vertical direction. If the terminal is too high, the alignment tool will still act as a support and the assembly plate will be pressed against one or more terminals.

[0024] According to another embodiment of the method, in order to electrically connect the power module to the assembly board, the method comprises the following steps: positioning the power module and the assembly board one above the other in a vertical direction, wherein the assembly board has at least one contact hole for receiving at least one terminal of the semiconductor module component. In addition, inserting the at least one terminal into the at least one contact hole, wherein at least one recessed portion of the alignment portion comprises a retaining structure that carries and mechanically supports the at least one terminal when the at least one terminal is pressed into the at least one contact hole. Here, the alignment of the at least one terminal can be achieved in two situations, namely, by: moving the module component with one or more terminals toward the fixed assembly board, and moving the assembly board toward the fixed module component with one or more terminals.

[0025] Therefore, an arrangement is provided, which includes a power module according to any example or embodiment described herein and an assembly board, wherein the power module and the assembly board are arranged one above the other in a vertical direction. The assembly board has at least one contact hole or several contact holes, into which at least one terminal of a plurality of terminals of a semiconductor module component is inserted.

[0026] The present disclosure includes several aspects based on embodiments and examples of power modules including at least one semiconductor module component and an alignment portion and methods for forming such power modules. Each feature described for one of these aspects is also disclosed herein for another aspect, even if the corresponding feature is not explicitly mentioned in the context of a particular aspect. For example, the method described in the present disclosure is directed to a method for forming the power module described herein. Therefore, the features and advantages described in connection with the method can be used for a power module, and vice versa.

[0027] Although the present disclosure can make various modifications and alternative forms, the details are shown by way of example in the drawings and will be described in detail. However, it should be understood that it is not intended to limit the present disclosure to the embodiments and examples specifically described. On the contrary, it is intended to cover all modifications, equivalents, and alternatives that fall within the scope of the present disclosure defined by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are included to provide further understanding. In the accompanying drawings, elements of the same structure and / or function may be given the same reference symbols. It will be understood that the examples shown in the accompanying drawings are illustrative representations and are not necessarily drawn to scale.

[0029] Figure 1A The general concept of a power module according to one example of the present disclosure is schematically shown in a cross-sectional view.

[0030] Figure 1BA terminal within a recess of an alignment portion according to one example of the present disclosure is shown in a top view.

[0031] Figure 2A and Figure 2B Further examples of power modules are shown.

[0032] Figure 3 An example of a semiconductor module component of a power module is shown.

[0033] Figure 4A and Figure 4B An example of a terminal being located in a recessed portion of an alignment portion when the terminal is inserted into a contact hole of an assembly board is shown.

[0034] Figure 4C and Figure 4D Some exemplary layouts of the recessed portions of the alignment portion are shown.

[0035] Figure 5 and Figure 6 Some examples of power modules interconnected to an assembled board are shown.

[0036] Fig. 7A , Figure 7B , Figure 7C , Fig.7D , Fig. 8A , Figure 8B and Figure 8C Some method steps are shown for fixing the alignment portion on the top surface of the semiconductor module component. DETAILED DESCRIPTION

[0037] 1 shows a cross-sectional view of a power module 100 according to an embodiment. The power module 100 includes at least one module component 10, such as a semiconductor module component 10. The module component 10 may be or include an electronic chip, a semiconductor chip, a sensor (e.g., for measuring temperature or movement), a switching device (e.g., an IGBT), a power MOSFET made of silicon, silicon carbide, gallium nitride or other semiconductor materials, a diode, a discrete device (e.g., a resistor), a capacitor, an inductive component or a transistor, but is not limited thereto.

[0038] The power module 100 further includes an alignment portion 20. The alignment portion 20 is arranged on at least one semiconductor module component 10. For example, the alignment portion 20 is mechanically fixed on the top surface 10T of the module component 10. The mechanical fixation of the alignment portion 20 on the module component 10 can be achieved, for example, by gluing, screw connection, riveting, or by a snap-fit ​​connection or clamping connection between the alignment portion 20 and the module component 10, but is not limited thereto.

[0039] The alignment portion 20 may be electrically insulating. For example, the alignment portion 20 is formed of an electrically insulating material. The alignment portion 20 may be manufactured by a molding process, such as by plastic injection molding. The alignment portion 20 includes at least one recessed portion 20R. The recessed portion 20R is, for example, formed on a side surface 20S of the alignment portion 20. The recessed portion 20R may be a vertical groove. The vertical groove is, for example, a notch on the side surface 20S of the alignment portion 20. For example, the recessed portion 20R is formed as a vertical groove extending through the alignment portion 20 in a vertical direction.

[0040] like Figure 1A As shown in FIG. 1 , the recessed portion 20R is formed at the end portion of the alignment portion 20. In a plan view of the top surface 10T of the module part 10, the recessed portion 20R may not overlap with the top surface 10T of the module part 10. Therefore, the alignment portion 20 is fixed to the module part 10 in such a manner that the recessed portion 20R is located on the side of the top surface 10T of the module part 10 in a top view. Figure 1A Furthermore, it is conceivable that the recessed portion 20R overlaps with the top surface 10T of the module component 10 so that the recessed portion 20R is located on the top surface 10T of the module component 10 in a plan view.

[0041] The module component 10 includes at least one terminal 12 or a plurality of terminals 12. The terminal 12 may be an auxiliary terminal, such as a control terminal and to be connected to a control board. The terminal 12 may also be a power terminal or a main terminal. The terminal 12 may have a transverse portion and a vertical portion, wherein the transverse portion and the vertical portion may be provided by bending the terminal 12, i.e., bending a portion of the transverse portion so that the bent portion of the transverse portion becomes a vertical portion.

[0042] The vertical portion may have a press-fit connector at its vertical end portion. Figure 1A As shown in , the lateral portion of the terminal 12 is parallel to the top surface 10T of the module component 10 and protrudes laterally beyond the side surface 10S of the module component 10. Therefore, the lateral portion is vertically directed relative to the side surface 10S of the module component 10. The vertical portion of the terminal 12 is perpendicular to the top surface 10T of the module component 10. Therefore, at least in some places, the terminal 12 is oriented perpendicular to the lateral top surface 10T of the semiconductor module component 10.

[0043] For the purpose of alignment in the lateral direction, the terminal 12 or the vertical portion of the terminal 12 is at least partially located in at least one recessed portion 20R. The recessed portion 20R may have a side opening for receiving the terminal 12. Once the terminal 12 is located in the recessed portion 20R, the offset of the lateral position of the terminal 12 is limited, resulting in the position alignment of the terminal 12. In the vertical direction, the terminal 12 (for example, the tip of the vertical portion of the terminal 12) protrudes beyond the recessed portion 20R and is freely accessible. In a plan view of the lateral top surface 10T of the semiconductor module component 10, the recessed portion 20R and the terminal 12 are located outside the lateral top surface 10T of the semiconductor module component 10.

[0044] Figure 2A The power module 100 shown in FIG. Figure 1A The power module 100 shown in FIG. 1 is substantially the same except that Figure 2A A bonding layer 40 is shown arranged between the alignment portion 20 and the module component 10. The bonding layer 40 may be an adhesive layer or a glue layer, which is used to mechanically connect the alignment portion 20 to the module component 10. Alternatively, a snap-fit ​​connection or screws may be used to mechanically connect the alignment portion 20 to the module component 10. This is for example shown in FIG. Figure 5 and Figure 6 Shown in.

[0045] Another difference between Figure 1 and Figure 2 is that according to Figure 2A , the power module 100 includes a shielding layer 50, which is configured to protect the module component 10 from electromagnetic interference or to protect the assembly board 30 from interference with the power module 100. The shielding layer 50 can be embedded in the alignment portion 20. The shielding layer 50 can be formed of a conductive material. For example, a metal sheet or a partially conductive plastic material can be embedded in the alignment portion 20. Alternatively, the assembly board 30 can be mounted on top of the power module 100, for example, Figure 5 and Figure 6 The assembly board 30 may be a printed circuit board including control electronics.

[0046] Figure 2B The power module 100 shown in FIG. Figure 2A The power module 100 shown in FIG. 1 is substantially the same as that shown in FIG. 1 , except that the shielding layer 50 is disposed on the top surface of the alignment portion 20. Figure 2B In addition, the shielding layer 50 may also be arranged on the bottom surface of the alignment portion 20. In the latter case, the shielding layer 50 is arranged between the alignment portion 20 and the module component 10.

[0047] Figure 3 An example of a module component 10 of a power module 100 is shown, which is to be interconnected to, for example, Figure 4Aand Figure 4B Here, for simplicity, the alignment portion 20 on the top surface 10T of the module component 10 is not shown.

[0048] The module component 10 has a plurality of terminals 12, such as auxiliary terminals 12, on its side surface 10S. For example, the terminal 12 is a pin-shaped terminal. The terminal 12 has a vertical portion pointing to the vertical Z direction. The module component 10 further includes another terminal 13 extending in the lateral direction, such as a main terminal 13, which is configured, for example, to electrically connect the module component 10. In addition to the drawings of the present disclosure, similar to the terminal 12, the main terminal 13 can have a lateral portion and a vertical portion. Therefore, the main terminal 13 can be bent. The alignment portion 20 can also be used to align the main terminal 13.

[0049] At least one main terminal 13 may have an opening 13H. The opening 13H may be configured to receive a snap-fit ​​portion 20H of the alignment portion 20 for forming a snap-fit ​​connection between the alignment portion 20 and the module component 10. This is for example Figure 5 and Fig. 7A Shown in.

[0050] Once the alignment portion 20 is attached to the top surface 10T of the module component 10, each terminal 12 is located in a corresponding recessed portion 20R of the alignment portion 20. Thus, the terminals 12 can be positioned and aligned relative to the positions of the recessed portions 20R of the alignment portion 20 in both the transverse horizontal X direction and the transverse longitudinal Y direction.

[0051] like Figure 4A and Figure 4B As shown, when the terminals 12 are inserted into the contact holes 30H of the assembly board 30, the alignment portions 20 can provide mechanical support for the terminals. Figure 4A The lateral extension structure 12B of the auxiliary terminal 12 shown in the figure is in the form of a crossbar 12B or as shown in the figure Figure 4B A horizontal portion of the terminal 12 is shown, and it should be noted that considerable mechanical force is required to insert the press-fit terminal 12. The assembly board 30 may be a control board implemented as a printed circuit board, for example.

[0052] like Figure 4A and Figure 4B As schematically shown in FIG. 1 , the assembly board 30 may be arranged in a vertical position on top of the power module 100. In the presence of the alignment portion 20, the terminal 12 or the vertical portion of the terminal may be positioned and aligned relative to the contact hole 30H of the assembly board 30 in the lateral X and Y directions. In order to electrically interconnect the power module 100 with the assembly board, the terminal 12 (e.g., Figure 4A and Figure 4BThe press-fit terminal 12 is shown in FIG. 1 , and is inserted or pressed into the contact hole 30H of the assembly board 30 .

[0053] The terminal 12 is formed of a conductive material or has an external metallization. Figure 4A and Figure 4B As shown in FIG. 1 , inside and partly outside the contact hole 30H, the assembly board 30 may be provided with a contact layer 30C for electrical contact with the terminal 12. The contact layer 30C may be a metallization, for example made of copper with an optional coating.

[0054] Terminal 12 or the vertical portion of terminal 12 includes upper portion 12A and lower portion 12L. Only upper portion 12A protrudes beyond recess 20R of alignment portion 23 and is inserted into contact hole 30C. Lower portion 12L of terminal 12 is located inside recess 20R, for example, completely inside recess 20R.

[0055] like Figure 4A and Figure 4B As shown in , the terminal 12 includes a transverse extension structure 12B, for example, in the form of a crossbar 12B. The crossbar 12B can have a larger transverse cross-section or extension than the upper portion 12A and / or the lower portion 12L of the terminal 12. For example, the crossbar 12B has the largest transverse cross-section or extension of the terminal 12 or the vertical portion of the terminal 12. The crossbar 12B is configured to mechanically support and / or anchor the terminal 12 to the alignment portion 20. Here, the alignment portion 20 has a corresponding support or retaining structure for receiving the crossbar 12B. Figure 4A and Figure 4B In addition, the transversely extending structure 12B may also have another geometric shape, such as being formed as a single-sided rod.

[0056] The recessed portion 20R of the alignment portion 20 may include a retaining structure 20M configured to retain and mechanically support the terminal 12, for example, when the terminal 12 is pressed in a forward direction (e.g., toward the assembly board 30) along a vertical direction. Alternatively, the assembly board 30 may be pressed toward one or more terminals 12.

[0057] like Figure 4A As shown in , the retaining structure 20M is provided by a stepped structure of the inner wall 20W of the recessed portion 20R. The stepped structure can form a receiving portion for receiving and retaining the terminal 12. In this case, the crossbar 12B of the terminal 12 is arranged on the stepped surface 20Z of the stepped structure or can be suspended on the stepped surface 20Z of the stepped structure. Therefore, the recessed portion 20R or the alignment portion 20 provides mechanical support for the terminal 12, for example when the alignment portion 20 is pressed along the vertical Z direction, and for example when the press-fit portion of the terminal is inserted into the contact hole 30H of the assembly board 30, or vice versa, as shown in Figure 4AThus, the recessed portion 20R provides alignment of the terminal 12 along the Z direction.

[0058] like Figure 4B As shown in , the retaining structure 20M may be provided by the bottom region 20B of the recessed portion 20R. In this case, the lower horizontal portion 12L of the terminal 12 may be arranged on the bottom region 20B of the recessed portion 20R and thus mechanically supported by the bottom region 20B.

[0059] Here, it should be noted that if the terminal 12 is a flexible auxiliary terminal 12, it should be supported on the transverse extension structure 12B in the vertical direction, for example, on the crossbar 12B near the press-fit area, for example, at the stepped surface 20Z of the inner wall 20W (such as Figure 4A ), so as to avoid the risk of deformation of the flexible auxiliary terminal 12 during the insertion and / or pressing of the flexible auxiliary terminal 12 into the contact hole 30H. Figure 4B As shown in FIG. 1 , the support on the bottom region 20B can be used for a standard pin terminal or a mechanically stable terminal, such as for a main terminal 13 or a thicker terminal.

[0060] Figure 4C and Figure 4D Some exemplary layouts of the cross section of the recessed portion 20R in the XY plane are shown. The recessed portion 20R may be formed as follows: Figure 4C The groove shown in FIG. 1 has a rectangular shape with straight walls, or is formed as shown in FIG. Figure 4D However, the layout of the cross section of the recessed portion 20R is not limited to Figure 4C and Figure 4D For example, the recessed portion 20R may also be formed to have a curved wall or to have a V-shaped groove.

[0061] Therefore, if Figures 4A to 4D As shown in , the recessed portion 20R formed as a vertical groove, for example, can be used to position and align the terminal 12 in the lateral X and Y directions and to mechanically support and align the terminal 12 in the vertical Z direction. The positioning and alignment of the terminal 12 in the lateral X and Y directions can be provided by the side walls and end walls of the recessed portion 20R. Mechanical support for the terminal 12 along the vertical Z direction can be provided by the bottom area 20B and / or a receiving portion (also called a boss), which is formed, for example, as a stepped structure on the inner wall of the recessed portion 20R. As shown in Figure 4A As shown in FIG. 1 , the receiving portion is configured for receiving a laterally extending structure 12B, for example in the form of a crossbar 12B of the terminal 12 .

[0062] Figure 5A snap-fit ​​connection between a module component 10 and an alignment portion 20 is shown. The snap-fit ​​connection can be formed by a snap-fit ​​portion 20H of the alignment portion 20 and a snap-fit ​​opening of the main terminal 13. The snap-fit ​​portion 20H is, for example, a button-shaped protrusion of the alignment portion 20. The snap-fit ​​portion 20H can be inserted into the snap-fit ​​opening 13H of the main terminal 13. For example, the snap-fit ​​portion 20H is made of an elastic material and has a larger cross-section than the snap-fit ​​opening 13H of the main terminal 13 in some places. The snap-fit ​​portion 20H can be temporarily deformed when inserted into the snap-fit ​​opening 13H of the main terminal 13. In a plan view of the top surface 10T of the module component 10, the snap-fit ​​connection is realized outside the top surface 10T. The snap-fit ​​connection also provides correct alignment of the alignment portion 20 relative to the module component 10.

[0063] The mechanical fastening of the power module 100 to the assembly plate 30 can also be achieved by screws, for example by Figure 5 The first screw 41 shown in FIG. 4 is implemented. The first screw 41 extends through the assembly plate 30 in the vertical direction and enters the alignment portion 20. However, the first screw 41 does not extend through the alignment portion 20.

[0064] according to Figure 5 , the module component 10 is arranged on a carrier 11. The carrier 11 may be a base plate, a cooler or a heat sink, but is not limited thereto.

[0065] Figure 6 Another arrangement of a power module 100 connected to an assembly plate 30 is shown, wherein the power module 100 comprises at least one module part 10 and an alignment portion 20. The power module 100 further comprises a printed circuit board 14 and a carrier 11, wherein the printed circuit board 14 is arranged between the carrier 11 and the module part 10. In order to have an additional fixation, further screws, such as a second screw 42, may be used, wherein the second screw 42 fixes the assembly plate 30 not only to the alignment portion 20 but also to the module part 10 and the printed circuit board 14. Thus, in the vertical direction, the common second screw 42 extends through the assembly plate 30, the alignment portion 20 and the module part 10 and into the printed circuit board 14.

[0066] The fixing of the alignment portion 20 to the module part 10 can also be achieved by screws (to the module body or to the main terminals, similar to a snap-fit ​​connection). Figure 6 , the screws can extend to the carrier 11 below the power module 100 so that the entire arrangement is fixed by the screws. Other possible methods for fixing and / or aligning the alignment portion 20 to the power module 100 or the module component 10 include, for example, a clamping connection, a pin-hole connection, a snap-fit ​​connection, the use of a stop structure and / or the use of a guide structure (such as a guide rail).

[0067] In addition, except for Figures 1 to Figure 6 In addition, the alignment portion 20 may include a plurality of recessed portions 20R for receiving a plurality of terminals 12. Each of the plurality of terminals 12 may be arranged in one of the recessed portions 20R for the purpose of alignment along the lateral X and Y directions and for the purpose of mechanical support along the vertical Z direction. One alignment portion 20 may be fixed to more than one module component 10, for example, to three module components 10 (such as arranged in a row), forming a so-called six-unit module, which may include three module components 10 mounted on a carrier 11 as a cooler. Before and after the power module 100 is mounted on the assembly plate 30, the alignment portion 20 remains on top of one or more module components 10. For example, the alignment portion 20 is located between the assembly plate 30 and the one or more module components 10 or between the assembly plate 30 and the module housing of the power module 100 or the module housing of one or more module components 10.

[0068] Fig. 7A , Figure 7B , Figure 7C and Fig.7D Some method steps are shown for fixing the alignment portion 20 to the module component 10 using a snap-fit ​​connection. In addition to the snap-fit ​​connection, further screws can also be used, such as Figure 8C The third screw 43 shown in FIG. Figure 2A or Figure 2B The bonding layer 40 is shown in FIG. Screws may also be used between the alignment portion 20 and the terminals 12 / 13 .

[0069] like Fig. 7A and Figure 7B As shown in , the alignment portion 20 is moved in a lateral direction in an inclined orientation toward the terminal 12 or toward a row of terminals 12, so that one or more terminals 12 (e.g., one or more press-fit terminals 12) can be inserted into the recessed portion 20R of the alignment portion 20. The recessed portion 20R provides alignment in a direction orthogonal to the orientation of the terminal 12. Subsequently, the alignment portion 20 is moved to a horizontal direction, as shown in FIG. Figure 7C and Fig.7D As shown in . Therefore, the possible one or more lateral extension structures 12B of one or more terminals 12 can be inserted into one or more receiving parts of one or more recessed parts 20R, and the possible one or more lateral extension structures 12B of one or more terminals 12 are located on the corresponding bosses or recesses of the one or more receiving parts. First

[0070] Figure 7C Several different positions of the terminal 12 relative to the recess 20R of the alignment portion 20 are shown in top view. Figure 7CThe different positions of the terminals 12 shown in FIG. 1 relative to the recess 20R of the alignment portion 20 may correspond to Figure 7B The terminals 12 are shown in different positions relative to the alignment portion 20 .

[0071] Terminal 12 has a transversely extending structure 12B in the form of a crossbar. Recess 20R has a stepped surface 20Z for receiving and supporting transversely extending structure 12B. Once transversely extending structure 12B is arranged on stepped surface 20Z, alignment of terminal 12 is achieved not only in the transverse direction but also in the vertical direction.

[0072] according to Fig.7D , when the alignment portion 20 reaches the horizontal orientation, the terminal 12 has the correct alignment in the direction parallel to the orientation of the terminal 12 and in the vertical direction. Finally, the alignment portion 12 (which is also formed as a support portion of one or more terminals 12) is mechanically fixed to one or more main terminals 13 (which may be formed as power terminals) by using one or more snap fits in one or more holes formed as one or more snap fit openings 13H of one or more main terminals 13 or using one or more snap fits at the side of one or more main terminals 13. Afterwards, the assembly board 30 can be mounted to the power module 100.

[0073] Fig. 8A , Figure 8B and Figure 8C Some method steps for securing the alignment portion 20 to one or more module components 10 using screws 43 are shown. Fig. 8A and Figure 8B The method steps described in Fig. 7A and Figure 7B The method steps shown in are substantially the same, except that the alignment portion 20 does not have the one or more snap-fit ​​portions 20H.

[0074] according to Figure 8C , the fixing can be completed by a screw connection with one or more module components 10, for example, a screw connection with one or more enclosures or with the main terminals 13 of one or more module components 10. The screw (here the third screw 43) extends through the alignment portion 20 in the vertical direction and enters one or more module components 10. Other or additional methods for fixing the alignment portion 20 are also feasible, for example, gluing the alignment portion 20 to one or more module components 10 or clamping the alignment portion 20 to one or more module components 10 in any type of manner can also be used. These fixing methods are also applicable to other installations of the alignment plate 20.

[0075] The embodiments shown in the described figures represent exemplary embodiments of a power module and a method for fixing an alignment portion to at least one module component or for connecting a power module to an assembly board; therefore, they do not constitute a complete list of all embodiments according to improved arrangements of a power module or a method. The actual arrangement of a power module or a method may differ from the exemplary embodiments described above.

[0076] European Patent Application 22194844.1 from which this application claims priority, the disclosure content of which is hereby incorporated herein by reference.

[0077] Reference numerals

[0078] 100 Power Modules

[0079] 10Semiconductor module components

[0080] 10S Side surface of semiconductor module component

[0081] Top surface of 10T semiconductor module component

[0082] 11 Carrier

[0083] 12Terminals of semiconductor module components

[0084] Upper part of 12A terminal

[0085] 12B terminal lateral extension structure or crossbar

[0086] 12L lower part of the terminal

[0087] 13 Main terminals of semiconductor module components

[0088] 13H Snap-fit ​​opening for main terminal / semiconductor module components

[0089] 14 Circuit Board

[0090] 20 Alignment section

[0091] 20H snap fit part of the alignment section

[0092] 20R recessed portion of the alignment section

[0093] 20S Alignment part side surface

[0094] 20B Bottom area of ​​the recessed portion

[0095] 20M recessed part / alignment part holding structure

[0096] 20W Inner wall of the concave part

[0097] 20Z Stepped surface of the inner wall

[0098] 30 Assembled Boards

[0099] Contact layer of 30C assembly board

[0100] Contact holes of 30H assembly board

[0101] 40 bonding layer

[0102] 41 First Screw

[0103] 42 Second screw

[0104] 43 Third screw

[0105] 50 shielding layers

[0106] X horizontal direction

[0107] Y horizontal direction / vertical direction

[0108] Z vertical direction

Claims

1. A power module (100), comprising a semiconductor module component (10) and an alignment portion (20), wherein: - the alignment portion (20) is fixed on the lateral top surface (10T) of the semiconductor module component (10) and comprises at least one recessed portion (20R), the semiconductor module component (10) comprises at least one terminal (12, 13), which is oriented vertically at least in places relative to a lateral top surface (10T) of the semiconductor module component (10) and, for the purpose of alignment in the lateral direction, is at least partially located within the at least one recessed portion (20R), - the at least one terminal (12, 13) protrudes beyond the at least one recessed portion (20R) in the vertical direction, and -The at least one recessed portion (20R) is located on the side surface (20S) of the alignment portion (20), wherein the at least one recessed portion (20R) is a vertical groove as an open recess on the side surface (20S) of the alignment portion (20), and wherein the groove is not a through hole completely surrounded by the inner wall (20W) of the at least one recessed portion (20R) in the lateral direction.

2. The power module (100) according to claim 1, in, The alignment portion (20) is electrically insulating.

3. The power module (100) according to any one of claims 1 to 2, in, In a plan view of a lateral top surface (10T) of the semiconductor module component (10), the at least one recessed portion (20R) and the at least one terminal (12, 13) are located outside the lateral top surface (10T) of the semiconductor module component (10).

4. The power module (100) according to any one of claims 1 to 3, wherein: - the terminal (12) comprises a transverse portion and a vertical portion, - the transverse portion is parallel to the top surface (10T) of the module part (10) and projects laterally beyond the side surface (10S) of the module part (10) and is therefore directed vertically relative to the side surface (10S) of the module part (10), and - The vertical portion of the terminal (12) is perpendicular to the top surface (10T) of the module component (10).

5. The power module (100) according to any one of claims 1 to 4, in, The at least one recessed portion (20R) includes a retaining structure (20M) configured to mechanically support the at least one terminal (12, 13) when the at least one terminal (12, 13) is pressed or inserted toward a forward direction along the vertical direction.

6. The power module (100) according to claim 5, in, - the retaining structure (20M) is provided by a stepped structure of the inner wall (20W) of the at least one recessed portion (20R), and - the at least one terminal (12, 13) comprises a laterally extending structure (12B) arranged on a step surface (20Z) of the stepped structure.

7. The power module (100) according to claim 5, in, - said retaining structure (20M) is provided by a bottom region (20B) of said at least one recessed portion (20R), and - the lower portion (12L) of the at least one terminal (12, 13) is arranged on a bottom region (20B) of the at least one recessed portion (20R).

8. The power module (100) according to any one of claims 1 to 7, comprising a shielding layer (50), the shielding layer being configured to protect the semiconductor module component (10) from electromagnetic interference, wherein: The shielding layer (50) is embedded in the alignment portion (20) or arranged on the top surface or the bottom surface of the alignment portion (20).

9. The power module (100) according to any one of claims 1 to 8, in, The alignment portion (20) is mechanically connected to the semiconductor module component (10) via a bonding layer (40).

10. The power module (100) according to any one of claims 1 to 8, wherein: The alignment portion (20) is mechanically connected to the semiconductor module component (10) by a snap-fit ​​connection or by a clamping connection or by a pin-hole connection or by screws (42, 43).

11. The power module (100) according to any one of claims 1 to 10, wherein: The at least one terminal (12, 13) is a pin-type terminal or a press-fit terminal.

12. The power module (100) according to any one of claims 1 to 11, wherein: - the alignment portion (20) comprises a plurality of recessed portions (20R), the plurality of recessed portions including the at least one recessed portion (20R), - the semiconductor module component (10) comprises a plurality of terminals (12, 13), the plurality of terminals comprising the at least one terminal (12, 13), - Each of the plurality of terminals (12, 13) is at least partially located within one of the recessed portions (20R) for the purpose of alignment along the transverse direction and for the purpose of mechanical support along the vertical direction.

13. An arrangement comprising an assembly plate (30) and a power module (100) according to any one of claims 1 to 12, wherein: - the power module (100) and the assembly board (30) are arranged one above the other along the vertical direction, and The assembly board (30) has at least one contact hole (30H), and the at least one terminal (12, 13) of the semiconductor module component (10) is inserted into the at least one contact hole.

14. A method for fixing an alignment portion (20) including at least one recessed portion (20R) to a semiconductor module component (10) including at least one terminal (12, 13), the method comprising: - positioning the alignment portion (20) in an inclined orientation relative to the lateral top surface (10T) of the semiconductor module component (10) to insert the at least one terminal (12, 13) into the at least one recessed portion (20R) of the alignment portion (20), the at least one terminal being oriented perpendicularly to the lateral top surface (10T) of the semiconductor module component (10) at least in some places, wherein the at least one recessed portion (20R) is located at an edge region of the alignment portion (20), and the at least one recessed portion (20R) is located on the side surface (20S) of the alignment portion (20), wherein the at least one recessed portion (20R) is a vertical groove as an open recess on the side surface (20S) of the alignment portion (20), and wherein the groove is not a through hole completely surrounded by an inner wall (20W) of the at least one recessed portion (20R) in the lateral direction; - moving the alignment portion (20) towards the lateral top surface (10T) of the semiconductor module component (10) so that the alignment portion (20) reaches a horizontal orientation relative to the lateral top surface (10T) of the semiconductor module component (10), wherein, in a vertical direction, the at least one terminal (12, 13) protrudes beyond the at least one recessed portion (20R), and wherein the at least one recessed portion (20R) is configured to align the at least one terminal (12, 13) in a lateral direction and to provide additional mechanical support for the at least one terminal (12, 13) in the vertical direction; and - fixing the alignment portion (20) to the semiconductor module component (10) to form a power module (100) comprising the alignment portion (20) and the semiconductor module component (10).

15. The method according to claim 14, further used for electrically connecting the power module (100) to an assembly board (30), the method comprising: - positioning the power module (100) and the assembly plate (30) one above the other along the vertical direction, wherein the assembly plate (30) has at least one contact hole (30H) for receiving the at least one terminal (12, 13) of the semiconductor module component (10), and -Inserting the at least one terminal (12, 13) into the at least one contact hole (30H), wherein the at least one recessed portion (20R) of the alignment portion (20) includes a retaining structure (20M), which carries and mechanically supports the at least one terminal (12) when the at least one terminal (12, 13) is inserted or pressed into the at least one contact hole (30H).

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