An automatic soldering and cooling device for an LED circuit board

Abstract

The present invention relates to the technical field of circuit boards, and in particular to an automatic soldering cooling device for LED circuit boards, which includes a bracket, a lower housing, and an upper housing; the bracket is fixedly connected to the lower housing; the lower housing is hinged to the upper housing; it also includes a connecting half-ring, an arched cooling plate, etc.; several connecting half-rings are arranged in the lower housing and the upper housing respectively; all the connecting half-rings in the lower housing are jointly fixedly connected to an arched cooling plate; all the connecting half-rings in the upper housing are jointly fixedly connected to another arched cooling plate. In the present invention, the cooling air flow flows through the right side of each plate from right to left, thereby simultaneously achieving a good cooling effect on the right sides of multiple plates, solving the problem in the prior art that only a single circuit board can be cooled at a time, multiple circuit boards cannot be cooled simultaneously, and the cooling efficiency is low.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and particularly relates to an automatic soldering cooling device for LED circuit boards. Background Art

[0002] A circuit board, also known as a printed circuit board, is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. Since it is made by electronic printing technology, it is called a "printed" circuit board. When a circuit board is produced, a cooling device is generally used to cool the soldering of the circuit board; however, in the current traditional circuit board soldering cooling device, during use, only a single circuit board can be cooled at a time, and multiple circuit boards cannot be cooled simultaneously, resulting in low cooling efficiency and room for improvement. Summary of the Invention

[0003] In order to overcome the disadvantages mentioned in the background, the present invention provides an automatic soldering cooling device for LED circuit boards.

[0004] The technical solution is: an automatic soldering cooling device for LED circuit boards, including a bracket, a lower housing, and an upper housing; the bracket is fixedly connected to the lower housing; the lower housing is hinged to the upper housing; it also includes a connecting semi-ring, an arched cooling plate, a wind ring, a connecting disk, a telescopic airbag, and a card slot; several connecting semi-rings are arranged in the lower housing and the upper housing respectively; all the connecting semi-rings in the lower housing are fixedly connected to form an arched cooling plate together; all the connecting semi-rings in the upper housing are fixedly connected to form another arched cooling plate together; the two arched cooling plates are symmetric with each other and jointly form a cylinder with an open end; a wind ring is installed on the arched cooling plate; the wind ring is fixedly connected to the connecting disk; the connecting disk is provided with a telescopic airbag; the telescopic airbag is provided with an air injection port, and the air injection port is connected to an external air pump; each arched cooling plate is provided with several first ventilation grooves; the expanded telescopic airbag is provided with several second ventilation grooves, and the first ventilation grooves and the second ventilation grooves are staggered; each arched cooling plate is provided with several card slots.

[0005] Further, the upper housing is provided with a handle.

[0006] Further, a first convex part is arranged on the left side of each first ventilation groove of the arched cooling plate; a second convex part is arranged on the left side of each second ventilation groove of the expanded telescopic airbag.

[0007] Further, a curved part is arranged on the left side of the lower housing and the left side of the upper housing respectively.

[0008] Further, the connecting semi-ring is arranged in a heat dissipation fin structure.

[0009] Further, the air injected into the telescopic airbag from the air injection port is cold air.

[0010] Furthermore, a number of baffle half-rings are fixedly connected inside each lower housing and each upper housing, and the baffle half-rings and the connecting half-rings are staggered, and there is a gap between the baffle half-rings and the arched cooling plate.

[0011] Furthermore, a frustum-shaped guide cylinder with a smaller left side and a larger right side is installed on the air ring.

[0012] Furthermore, a filter screen plate is installed on the guide cylinder.

[0013] The beneficial effects of the present invention are as follows: 1. In the present invention, the cooling air flow flows through the right side of each plate from right to left, thus achieving a good cooling effect on the right sides of multiple plates at the same time, solving the problem in the prior art that only a single circuit board can be cooled at a time, and multiple circuit boards cannot be cooled simultaneously, resulting in low cooling efficiency.

[0014] 2. In the present invention, when the telescopic airbag expands towards the inner side of the arched cooling plate, if air continues to be injected into the telescopic airbag, the second convex part on the telescopic airbag will expand. Then, during the above cooling process, a part of the cold air moves along the original path to cool the right side of the plate, while another part of the cold air, after being intercepted and guided by the first convex part and the second convex part, will move towards the left side of the plate to cool the left side of the plate, thus realizing double-sided cooling of the plate and improving the cooling efficiency.

[0015] 3. In the present invention, the connecting half-ring with a heat dissipation fin structure is provided to dissipate heat from the arched cooling plate, avoiding the problem that the service life of the arched cooling plate will be affected to a certain extent due to being in a high-temperature state for a long time; and, through the arc-shaped part, the cold air blown out from the left end of the arched cooling plate is guided to pass through the channel between the lower housing, the upper housing and the arched cooling plate from left to right and then blown out from the right side of the channel. During this process, the cold air dissipates heat from the connecting half-ring in the channel and takes away the heat absorbed by the connecting half-ring to ensure its heat dissipation effect; at the same time, through the baffle structure jointly formed by the staggered connecting half-rings and baffle half-rings, the air flow passing through the channel moves in a wavy shape, prolonging the contact time between the air flow and the connecting half-ring, thereby improving the heat dissipation effect of the air flow on the connecting half-ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is the first structural schematic diagram disclosed by the present invention;

[0017] Figure 2 is the second structural schematic diagram disclosed by the present invention;

[0018] Figure 3 is the state schematic diagram of the open state of the lower housing and the upper housing disclosed by the present invention;

[0019] Figure 4 Explosion diagram of the structure connecting the connecting half-ring, arched cooling plate and telescopic airbag disclosed by the present invention;

[0020] Figure 5 Schematic diagram of the placement state of the plate disclosed by the present invention;

[0021] Figure 6 Schematic diagram of the inflated state of the telescopic airbag disclosed by the present invention;

[0022] Figure 7 Schematic diagram of the structures of convex part 1 and convex part 2 disclosed by the present invention;

[0023] Figure 8 Schematic diagram of the air flow direction disclosed by the present invention.

[0024] Marks in the attached drawings: 1 - support, 2 - lower housing, 3 - upper housing, 4 - connecting half-ring, 5 - arched cooling plate, 6 - air ring, 7 - connecting disc, 8 - telescopic airbag, 9 - card slot, 20 - baffle half-ring, 30 - guide cylinder, 40 - filter screen plate, 51 - convex part 1, 81 - convex part 2, 001 - plate, 2001 - bent arc part, 5001 - ventilation slot 1, 8001 - ventilation slot 2. Detailed implementation manners

[0025] The following description is only for the preferred embodiments of the present invention and does not limit the protection scope of the present invention accordingly.

[0026] Embodiment 1

[0027] An automatic soldering and cooling device for an LED circuit board, as Figures 1 - 8 shown, includes a support 1, a lower housing 2 and an upper housing 3; the support 1 is bolted to the lower housing 2; the lower housing 2 is hinged to the upper housing 3;

[0028] It further includes a connecting half-ring 4, an arched cooling plate 5, an air ring 6, a connecting disc 7, a telescopic airbag 8 and a card slot 9; several connecting half-rings 4 are arranged in each of the lower housing 2 and the upper housing 3; all the connecting half-rings 4 in the lower housing 2 are jointly fixed to an arched cooling plate 5; all the connecting half-rings 4 in the upper housing 3 are jointly fixed to another arched cooling plate 5; the two arched cooling plates 5 are symmetric with each other and jointly form a cylinder with an open end; the arched cooling plate 5 is provided with an air ring 6, the air ring 6 is fixed to the connecting disc 7, and the connecting disc 7 is provided with a telescopic airbag 8; the telescopic airbag 8 is provided with an air injection port, and the air injection port is communicated with an external air pump; each arched cooling plate 5 is provided with several ventilation slots 1 5001; several ventilation slots 2 8001 are provided on the inflated telescopic airbag 8, and the ventilation slots 1 5001 and the ventilation slots 2 8001 are staggered; each arched cooling plate 5 is provided with several card slots 9.

[0029] The upper housing 3 is provided with a handle, and the upper housing 3 can be quickly opened through the handle, improving convenience.

[0030] The specific working process of the present invention is as follows:

[0031] It should be noted in advance that when the telescopic airbag 8 is in a contracted state, its left end is located on the right side of the rightmost card slot 9.

[0032] First, the operator adjusts the upper housing 3 to the open state as shown in Figure 3 the figure;

[0033] Subsequently, as shown in Figure 5 , the operator puts the plates 001 into the lower housing 2 one by one, and is limited by the card slots 9. There will be a gap between the position of the first ventilation groove 5001 and the inner ring surface of the plate 001 to facilitate air flow;

[0034] Then, the operator adjusts the upper housing 3 to the closed state as shown in Figure 1 the figure;

[0035] Then, control the external air pump to inject air into the telescopic airbag 8 through the air injection port, so that the telescopic airbag 8 gradually expands horizontally to the left;

[0036] When its left end abuts against the lower housing 2 and the upper housing 3, the telescopic airbag 8 stops expanding horizontally. Continuing to inject air into the telescopic airbag 8 will cause the telescopic airbag 8 to expand towards the inner side of the arched cooling plate 5 until the outer side of the telescopic airbag 8 adheres to the inner ring surface of the plate 001. There will be a gap between the position of the second ventilation groove 8001 and the inner ring surface of the plate 001 to facilitate air flow;

[0037] At this time, control the air ring 6 to input cold air for cooling between the arched cooling plate 5 and the telescopic airbag 8, so that the cold air passes through between the arched cooling plate 5 and the telescopic airbag 8 from right to left. During this process, the cold air will first contact the right side of the rightmost plate 001, and then move along the right side of the plate 001 to the first ventilation groove 5001, and then pass through the first ventilation groove 5001 and move left along the inner side of the arched cooling plate 5, and then contact the right side of the next plate 001, and move along the right side of the next plate 001 to the second ventilation groove 8001, and pass through the second ventilation groove 8001 and then continue to move left along the outer side of the telescopic airbag 8, and so on, so that the air flow passes through the right side of each plate 001 from right to left, thereby simultaneously achieving a good cooling effect on the right sides of multiple plates 001.

[0038] After completing the cooling work on the right side of the plate 001, first control the telescopic airbag 8 to contract, then open the upper housing 3. After the operator adjusts the orientation of the plate 001, then cool the other side of the plate 001 according to the above steps.

[0039] Example 2

[0040] On the basis of the above-mentioned Example 1, as Figures 7 - 8 shown, a convex part one 51 is arranged on the left side of each ventilation slot one 5001 of the arched cooling plate 5; a convex part two 81 is arranged on the left side of each ventilation slot two 8001 of the expanded telescopic airbag 8.

[0041] The specific working process of the present invention is as follows:

[0042] According to the above work, only the cooling of the right side of the plate 001 can be achieved at one time. If the left side of the plate 001 needs to be cooled, it is necessary to open the upper housing 3 and then adjust the orientation of the plate 001, and the cooling efficiency needs to be improved;

[0043] Therefore, the present invention sets the convex part one 51 and the convex part two 81. After the telescopic airbag 8 expands towards the inner side of the arched cooling plate 5, when the air is continuously injected into the telescopic airbag 8, the convex part two 81 on the telescopic airbag 8 will expand out. Then, during the above cooling process, a part of the cold air moves along the original path to cool the right side of the plate 001, while another part of the cold air will move towards the left side of the plate 001 after being intercepted and guided by the convex part one 51 and the convex part two 81 to cool the left side of the plate 001, so as to realize the double-sided cooling of the plate 001 at the same time and improve the cooling efficiency.

[0044] Example 3

[0045] On the basis of the above-mentioned Example 2, as Figures 3 - 8 shown, a bending arc part 2001 is arranged on the left side of the lower housing 2 and the left side of the upper housing 3 respectively.

[0046] The connecting half-ring 4 is arranged as a heat dissipation fin structure.

[0047] The air injected into the telescopic airbag 8 from the air injection port is cold air, so as to avoid the temperature on the plate 001 being conducted into the telescopic airbag 8, resulting in a rapid increase in the air temperature in the telescopic airbag 8, and then causing the temperature in the area where the telescopic airbag 8 is located and the inner area of the arched cooling plate 5 to increase, affecting the cooling effect on the plate 001.

[0048] A plurality of baffle half-rings 20 are fixedly connected in each lower housing 2 and each upper housing 3 respectively, and the baffle half-rings 20 and the connecting half-ring 4 are arranged in a staggered manner, and there is a distance between the baffle half-rings 20 and the arched cooling plate 5.

[0049] The air ring 6 is installed with a frustum-shaped guide cylinder 30 with a smaller left side and a larger right side.

[0050] The draft tube 30 is installed with a filter screen plate 40, and the air flow blown out from the right side of the channel between the lower housing 2, the upper housing 3 and the arched cooling plate 5 is filtered through the filter screen plate 40 to intercept the tin particles falling off the surface of the sheet 001 in the air flow, preventing the tin particles from being carried by the air flow into the external air and causing pollution to the external air.

[0051] The working process of the present invention is as follows:

[0052] During the above cooling process, the part of the arched cooling plate 5 in contact with the sheet 001 will receive heat transfer, resulting in an increase in the temperature of the arched cooling plate 5. If the arched cooling plate 5 is in a high-temperature state for a long time, it will affect the service life of the arched cooling plate 5 to a certain extent.

[0053] Therefore, during the above cooling process, the arched cooling plate 5 is dissipated heat through the connecting half-ring 4 provided with a heat dissipation fin structure, avoiding the problem that the 5-arched cooling plate will affect the service life of the 5-arched cooling plate to a certain extent due to being in a high-temperature state for a long time; and, the cold air blown out from the left end of the arched cooling plate 5 is guided through the arc part 2001, so that it passes through the channel between the lower housing 2, the upper housing 3 and the arched cooling plate 5 from left to right after being guided, and then is blown out from the right side of the channel. During this process, the connecting half-ring 4 in the channel is dissipated heat by the cold air, taking away the heat absorbed by the connecting half-ring 4 to ensure its heat dissipation effect; at the same time, the baffle structure formed by the alternately distributed connecting half-ring 4 and the baffle half-ring 20 makes the air flow passing through the channel move in a wavy shape, prolonging the contact time between the air flow and the connecting half-ring 4, thereby enhancing the heat dissipation effect of the air flow on the connecting half-ring 4.

[0054] At the same time, the draft tube 30 guides the air flow blown out from the right side of the channel between the lower housing 2, the upper housing 3 and the arched cooling plate 5 to diffuse outward, away from the area where the air ring 6 is located, avoiding the problem that the air flow blown out from the right side of the channel is sucked into the air ring 6, resulting in too high temperature of the air input into the arched cooling plate 5 by the air ring 6 and poor cooling effect.

[0055] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. An automated solder cooling device for an LED circuit board, comprising a bracket (1), a lower shell (2) and an upper shell (3); the bracket (1) is fixedly connected to the lower shell (2); the lower shell (2) is hingedly connected to the upper shell (3); the characteristics are: The invention also comprises a connecting half ring (4), an arched cooling plate (5), an air ring (6), a connecting plate (7), a telescopic air bag (8) and a slot (9); a plurality of connecting half rings (4) are respectively arranged in the lower shell (2) and the upper shell (3); all the connecting half rings (4) in the lower shell (2) are fixedly connected to one arched cooling plate (5); all the connecting half rings (4) in the upper shell (3) are fixedly connected to another arched cooling plate (5); the two arched cooling plates (5) are symmetrical to each other and together form a cylinder with an open end; the arched cooling plates (5 ) is provided with an air ring (6); the air ring (6) is fixedly connected with a connecting plate (7); the connecting plate (7) is provided with a telescopic air bag (8); the telescopic air bag (8) is provided with an air injection port, and the air injection port is connected to an external air pump; each arched cooling plate (5) is provided with a plurality of ventilation slots 1 (5001); the inflated telescopic air bag (8) is provided with a plurality of ventilation slots 2 (8001), and the ventilation slots 1 (5001) and the ventilation slots 2 (8001) are staggered; each arched cooling plate (5) is provided with a plurality of card slots (9); The upper shell (3) is provided with a handle; A convex portion 1 (51) is provided on the left side of each ventilation slot 1 (5001) of the arched cooling plate (5); a convex portion 2 (81) is provided on the left side of each ventilation slot 2 (8001) of the inflated telescopic airbag (8).

2. The automatic solder cooling device for LED circuit board according to claim 1, characterized in that: A curved portion (2001) is respectively provided on the left side of the lower shell (2) and the left side of the upper shell (3).

3. The automatic solder cooling device for LED circuit board according to claim 2, characterized in that: The connecting half ring (4) is configured as a heat dissipation fin structure.

4. The automatic solder cooling device for LED circuit board according to claim 3, characterized in that: The air injected into the telescopic air bag (8) from the air injection port is cold air.

5. The automatic solder cooling device for LED circuit board according to claim 4, characterized in that: A plurality of baffle half rings (20) are fixedly connected in each lower shell (2) and each upper shell (3), and the baffle half rings (20) and the connecting half rings (4) are arranged in a staggered manner, and there is a spacing between the baffle half rings (20) and the arched cooling plates (5).

6. The automatic solder cooling device for LED circuit board according to claim 5, characterized in that: The wind ring (6) is provided with a truncated cone-shaped flow guide cylinder (30) which is smaller on the left and larger on the right.

7. The automatic solder cooling device for LED circuit board according to claim 6, characterized in that: The guide tube (30) is provided with a filter screen plate (40).

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