Time-difference synchronous continuous cutting device and method for light-transmitting hard and brittle material wafer

Abstract

The invention discloses a time-difference synchronous continuous cutting device and method for light-transmitting hard and brittle material wafers, and belongs to the technical field of light-transmitting hard and brittle material crystal cutting. The cutting device comprises a granite base, a bearing rotating mechanism, a two-degree-of-freedom laser cutting mechanism, a two-degree-of-freedom diamond wire saw cutting mechanism and an automatic control system; according to the processing method, laser and a diamond fretsaw synchronously act on the bottom of the light-transmitting hard and brittle material crystal in a time difference mode, the light-transmitting hard and brittle material crystal is cut from bottom to top, the advantages of laser cutting and fretsaw cutting are reasonably utilized, a spiral line processing track of composite motion is formed, a modified layer is reasonably arranged, and the trend of a crack area is guided; the wire cutting operation direction of the diamond wire saw is opposite to the rotating direction of the light-transmitting hard and brittle material crystal, and the cutting is gradually performed from outside to inside in the processing process, so that the cutting position of the cutting wire and the light-transmitting hard and brittle material crystal is in point contact, the light-transmitting hard and brittle material crystal is efficiently cut, and the surface quality of the light-transmitting hard and brittle material crystal is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of laser processing and heating cutting, and in particular relates to a device and method for differentially synchronously and continuously cutting a light-transmitting hard and brittle material wafer. Background Art

[0002] Transparent hard and brittle material crystals are widely used in semiconductors, electronic components and other fields. The third generation of wide bandgap semiconductor materials represented by silicon carbide is the core material for the development of high-power, high-frequency and high-temperature, strong radiation-resistant blue lasers and ultraviolet detectors. Due to its advantages such as large bandgap width, high thermal conductivity, large electron saturation drift rate, high critical breakdown electric field, low dielectric constant and good chemical stability, it has broad application prospects in communications, automobiles, aviation, aerospace, oil extraction and national defense.

[0003] The first step in the processing of silicon carbide wafers is cutting. Currently, the process is shifting towards thinner wafers, smaller feature sizes and larger sizes. Cutting of transparent hard and brittle material wafers has evolved into a key process step that can increase the yield of silicon carbide devices. The existing technology for separating transparent hard and brittle material wafers uses diamond wire saw cutting or laser cutting. The cutting speed of diamond wire saw cutting is low, and the diamond wire saw wear and the loss of transparent hard and brittle material crystals are high, resulting in high costs. Diamond wire saws may cause chip edge fragmentation and delamination.

[0004] As the size of light-transmitting hard and brittle material wafers increases, the cumulative runway length gradually increases, exceeding the ability of a standard wire saw to complete all the cutting. During laser cutting, the laser beam is focused on the target area, and the light-transmitting hard and brittle material crystal absorbs the laser pulse energy to reach the damage threshold, causing its internal modification, which leads to significant heat-affected zones and microcracks. The blue film may also be affected by heat, affecting the subsequent packaging process. In addition, the ablation rate is very low and requires multiple times to separate the chip. Therefore, how to efficiently cut light-transmitting hard and brittle material crystals and obtain high-precision flat light-transmitting hard and brittle material wafers is an urgent problem to be solved. Summary of the invention

[0005] The purpose of the present invention is to solve the above technical problems and to provide a device and method for synchronously and continuously cutting light-transmitting hard and brittle material wafers.

[0006] A time-delayed synchronous continuous cutting method for a light-transmitting hard and brittle material wafer comprises:

[0007] The laser beam is focused on the light-transmitting hard and brittle material crystal to be processed, and a modified part is formed after S time;

[0008] Diamond wire saw cutting modification section;

[0009] The laser beam and the diamond wire saw move along the same trajectory, with a time difference of S between them;

[0010] The modified part is formed when the pulse energy after laser focusing reaches the damage threshold of the light-transmitting hard and brittle material crystal;

[0011] The light-transmitting hard and brittle material crystal to be processed rotates, and the laser beam and the diamond wire saw cut spirally from the outside to the inside.

[0012] The laser beam is focused on the light-transmitting hard and brittle material crystal to be processed and irradiated downward; the diamond wire saw cuts layer by layer from bottom to top to cut the light-transmitting hard and brittle material crystal into a plurality of sheet crystals.

[0013] Another object of the present invention is to provide a dedicated device for implementing the method.

[0014] A time-delayed synchronous continuous cutting device for light-transmitting hard and brittle material wafers, comprising: a base, a bearing rotation mechanism, a two-degree-of-freedom laser cutting mechanism, a two-degree-of-freedom diamond wire saw cutting mechanism, and a controller;

[0015] The load-bearing rotating mechanism is fixed on the base, and the load-bearing rotating mechanism clamps and drives the light-transmitting hard and brittle material crystal column to be processed to rotate;

[0016] The two-degree-of-freedom laser cutting mechanism comprises a laser assembly and a laser slide;

[0017] The two-degree-of-freedom diamond wire saw cutting mechanism comprises a wire cutting assembly and a wire saw cutting slide;

[0018] The laser slide and the wire saw cutting slide are installed on the periphery of the light-transmitting hard and brittle material crystal to be processed and fixed on the base. Under the control of the controller, the two slides slide inward, outward, up and down relative to the light-transmitting hard and brittle material crystal;

[0019] The laser assembly is mounted on the laser slide, and the laser cutting head is located above the light-transmitting hard and brittle material crystal;

[0020] The wire cutting assembly is installed on the wire saw cutting slide, and the diamond wire saw is in point contact with the light-transmitting hard and brittle material crystal.

[0021] The load-bearing rotating mechanism comprises: a load-bearing support frame, a first load-bearing roller, a second load-bearing roller, a first driving assembly and a second driving assembly;

[0022] The bottom end of the load-bearing support frame is fixedly connected to the base, and the first load-bearing roller and the second load-bearing roller are connected to the load-bearing support frame by upper and lower shafts, and the two are driven by the first drive assembly and the second drive assembly fixedly connected to the lower side of the load-bearing support frame;

[0023] The first drive assembly and the second drive assembly each include a DC servo motor and a coupling, and are connected to a controller;

[0024] The axial distance between the first bearing roller and the second bearing roller is smaller than the diameter of the light-transmitting hard and brittle material crystal column;

[0025] One side of the light-transmitting hard-brittle material crystal column is clamped and driven to rotate by two bearing rollers, and the opposite side is clamped and supported by two driven rollers of a telescopic driven rotating assembly in a two-degree-of-freedom diamond wire saw cutting mechanism.

[0026] The installation angle between the two-degree-of-freedom diamond wire saw cutting mechanism and the two-degree-of-freedom laser cutting mechanism is 90°;

[0027] The two-degree-of-freedom diamond wire saw cutting mechanism comprises: a wire cutting assembly, a retractable driven rotating assembly, a wire cutting Z-direction moving assembly and a wire cutting Y-direction moving assembly;

[0028] The wire cutting assembly comprises: a fifth driving assembly, a wire driving wheel, a wire driven wheel, a diamond wire saw, a tensioning wheel and a telescopic rod;

[0029] The wire driving wheel, the wire driven wheel and the tensioning wheel are connected to the wire cutting Z-direction moving platform of the wire cutting Z-direction moving assembly, and the three are connected through the diamond wire saw transmission;

[0030] The wire drive wheel is driven by the fifth drive assembly, driving the diamond wire saw to rotate in the opposite direction to the direction of the light-transmitting hard and brittle material crystal, and is in point contact with the position where the columnar crystal is cut; the fifth drive assembly is connected to the controller;

[0031] The tension wheel is axially connected to the telescopic rod, and the telescopic rod is adjusted along the Y direction relative to the wire cutting Z direction moving platform, so as to adjust the tightness of the diamond wire saw.

[0032] A retractable driven rotating assembly is provided at the front end of the wire cutting Z-direction moving platform, and a wire cutting assembly is provided at the lower part of the retractable driven rotating assembly; the retractable driven rotating assembly includes a driven roller, a driven roller support frame and a compression spring; the driven roller support frame can slide forward and backward relative to the wire cutting Z-direction moving platform, and a compression spring is provided therebetween; the front end of the driven roller support frame is axially connected to the driven roller, and contacts the columnar outer wall of the light-transmitting hard and brittle material crystal to provide support.

[0033] The wire cutting Z-direction moving assembly comprises a wire cutting Z-direction moving platform, a sixth driving assembly, and a third ball screw; the wire cutting Z-direction moving platform moves in the Z direction along the third ball screw on the wire cutting Y-direction moving base under the drive of the sixth driving assembly;

[0034] The wire cutting Y-direction moving assembly includes a wire cutting Y-direction moving base, a seventh drive assembly, a fourth ball screw, and a wire cutting base; the wire cutting Y-direction moving base moves in the Y direction along the fourth ball screw under the drive of the seventh drive assembly; the sixth drive assembly and the seventh drive assembly are both composed of a DC servo motor and a coupling.

[0035] The two-degree-of-freedom laser cutting mechanism comprises a laser assembly, a laser Z-direction moving assembly and a laser X-direction moving assembly; the laser assembly comprises: a laser cutting head, a laser generator, a laser power line and a laser power supply; the laser cutting head is fixed on the laser generator and is used to focus the laser beam on the target position at the bottom of the crystal; the laser generator is connected to the laser power supply through the laser power line to emit a laser beam, and is fixed on the laser Z-direction moving platform;

[0036] The laser Z-direction moving assembly includes a laser Z-direction moving platform, a third driving assembly, and a first ball screw. The third driving assembly drives the laser Z-direction moving platform to move along the first ball screw in the Z direction on the laser X-direction moving base. The third driving assembly includes a DC servo motor and a coupling.

[0037] The laser X-axis moving assembly includes a laser X-axis moving base, a fourth drive assembly, a second ball screw, and a laser cutting base. The laser X-axis moving base moves in the X direction along the second ball screw on the laser cutting base under the drive of the fourth drive assembly; the fourth drive assembly includes a DC servo motor and a coupling.

[0038] An arc-shaped slideway concentric with the light-transmitting hard-brittle material crystal is provided on the base of the outer periphery of the light-transmitting hard-brittle material crystal column, which is slidably connected with the laser slide and the wire saw cutting slide. The two slide freely on the arc-shaped slideway under the control of the controller to adjust the angle between the laser slide and the wire saw cutting slide.

[0039] A turntable is arranged between the laser assembly and the laser slide table.

[0040] A method for using a time-delayed synchronous continuous cutting device for a light-transmitting hard and brittle material wafer, comprising:

[0041] 1) Set the same cutting trajectory for the laser cutting head and the diamond wire saw on the controller;

[0042] 2) Calculate the time S required for the laser beam of the laser cutting head to focus on the crystal of the light-transmitting hard and brittle material to be processed to form the modified part;

[0043] 3) Start the bearing rotation mechanism, and the two bearing rollers on it rotate in the same direction, driving the transparent hard and brittle material crystal to rotate in a circle; the controller starts the laser slide, and the laser cutting head runs linearly from outside to inside according to the set trajectory. The circular motion and linear motion are combined to form a spiral trajectory. The laser beam of the laser cutting head is focused from top to bottom to the lower end of the transparent hard and brittle material crystal to be processed;

[0044] 4) After S time, the edge of the crystal of the transparent hard and brittle material forms a modified part, accompanied by a crack zone, and the load-bearing rotating mechanism is kept started. The controller starts the wire saw cutting slide, and the diamond wire saw moves linearly from the outside to the inside according to the set cutting trajectory, cutting point by point, and forming a spiral wire cutting trajectory;

[0045] The modified part is formed when the pulse energy after laser focusing reaches the damage threshold of the light-transmitting hard and brittle material crystal.

[0046] The diamond wire saw cuts layer by layer from bottom to top, cutting the light-transmitting hard and brittle material crystal into a plurality of sheet crystals.

[0047] The rotation direction of the diamond wire saw is opposite to the crystal of the light-transmitting hard and brittle material to be processed;

[0048] The laser wavelength of the laser generator is 500-600nm, the power is 4-5kw, the travel speed of the laser cutting head is 100-200nm / s, and the modified part and the crack area are both in the micron range;

[0049] The cutting speed of the diamond wire saw is 1000-1400 m / min, and the rotation speed of the light-transmitting hard and brittle material crystal 300 is 300-600 m / min;

[0050] The peeled transparent hard and brittle material wafer has a thickness of less than 500 μm, a slit width of less than 20 microns, an average processing loss of each wafer of less than 30 μm, a cutting time of each wafer of less than 35 minutes, a crystal surface roughness of less than 5 μm, a curvature of less than 30 μm, a total thickness deviation of less than 20 μm, a damage layer depth of less than 20 μm, and a ratio of the maximum surface crack depth to the damage layer depth of less than 80%.

[0051] The invention provides a time-delayed synchronous continuous cutting device and method for a light-transmitting hard and brittle material wafer, belonging to the technical field of light-transmitting hard and brittle material crystal cutting. The cutting device comprises: a granite base, a bearing rotation mechanism, a two-degree-of-freedom laser cutting mechanism, a two-degree-of-freedom diamond wire saw cutting mechanism and an automatic control system. The laser and the diamond wire saw are used to act on the bottom of the light-transmitting hard and brittle material crystal in a time-delayed synchronous manner, and the light-transmitting hard and brittle material crystal processing method is cut from bottom to top. The advantages of laser cutting and wire saw cutting are reasonably used to form a spiral processing trajectory of a composite motion, and the modified part is reasonably arranged to guide the direction of the crack zone. The running direction of the diamond wire saw wire cutting is opposite to the rotation direction of the light-transmitting hard and brittle material crystal, and the processing process is gradually cut from the outside to the inside, so as to ensure that the cutting line and the cutting position of the light-transmitting hard and brittle material crystal are in point contact, and the light-transmitting hard and brittle material crystal is cut efficiently, thereby improving the surface quality of the light-transmitting hard and brittle material wafer.

[0052] The present invention adopts the time-delayed synchronous action of laser and diamond wire saw to cut the light-transmitting hard and brittle material crystal from bottom to top. The laser cutting focus points are all processed on the spiral line trajectory, the modified part is reasonably arranged, and the direction of the crack zone is guided. The cutting operation direction of the diamond wire saw is opposite to the rotation direction of the crystal. The processing process is gradually cut from the outside to the inside, ensuring that the cutting line and the cutting position of the light-transmitting hard and brittle material crystal are in point contact, thereby improving the cutting accuracy, reducing the processing loss, and improving the surface quality of the light-transmitting hard and brittle material wafer.

[0053] The beneficial effects and advantages of the device and method for synchronously continuously cutting light-transmitting hard and brittle material wafers of the present invention compared with the prior art are as follows:

[0054] 1. The invention discloses a time-delayed synchronous continuous cutting device for a light-transmitting hard and brittle material wafer. The laser cutting focus points are processed on a spiral trajectory. The modified part is reasonably arranged to guide the direction of the crack zone. The running direction of the diamond wire saw is opposite to the rotation direction of the light-transmitting hard and brittle material crystal. The processing is performed step by step from the outside to the inside to ensure that the cutting line is in point contact with the cutting position of the light-transmitting hard and brittle material crystal, reduce the contact overlap area and the cutting span, and efficiently cut the light-transmitting hard and brittle material crystal, thereby improving the cutting accuracy and reducing the processing loss.

[0055] 2. The device for continuously cutting light-transmitting hard and brittle material wafers with time difference synchronization of the present invention can perform continuous multiple processing with only one clamping and positioning, thus reducing the time for preparation work such as polishing and clamping, and meeting the current market demand for high-precision light-transmitting hard and brittle material wafers;

[0056] 3. The present invention provides a method for differentially synchronously continuously cutting of light-transmitting hard and brittle material wafers, which uses laser and diamond wire saw to act differentially and synchronously on the bottom of the light-transmitting hard and brittle material crystal, and cuts the light-transmitting hard and brittle material crystal from bottom to top. It rationally utilizes the advantages of laser cutting and wire saw cutting, and achieves a perfect match between the two, avoiding the problems of repeated polishing and focusing reprocessing in the traditional top-down cutting method, and improving the efficiency of cutting light-transmitting hard and brittle material wafers and the surface quality of the finished product. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 It is a three-dimensional structural schematic diagram of a time-delayed synchronous continuous cutting device for a light-transmitting hard and brittle material wafer according to the present invention;

[0058] Figure 2 It is a front view of a time-delayed synchronous continuous cutting device for light-transmitting hard and brittle material wafers of the present invention;

[0059] Figure 3 It is a top view of a time-differential synchronous continuous cutting device for light-transmitting hard and brittle material wafers of the present invention;

[0060] Figure 4 This is a schematic diagram of the three-dimensional structure of the bearing and rotating mechanism of a time-delayed synchronous continuous cutting device for a light-transmitting hard and brittle material wafer of the present invention;

[0061] Figure 5 It is a three-dimensional structural schematic diagram of a two-degree-of-freedom laser cutting mechanism of a time-delayed synchronous continuous cutting device for a light-transmitting hard and brittle material wafer of the present invention;

[0062] Figure 6 It is a three-dimensional structural schematic diagram of a two-degree-of-freedom diamond wire saw cutting mechanism of a time-delayed synchronous continuous cutting device for a light-transmitting hard and brittle material wafer of the present invention;

[0063] Figure 7 It is a schematic diagram of a laser spiral trajectory processing path of a time-delayed synchronous continuous cutting device for a light-transmitting hard and brittle material wafer of the present invention;

[0064] Figure 8 It is a schematic diagram of differentially timed synchronous processing of light-transmitting hard and brittle material crystals by a device for differentially timed synchronous continuous cutting of light-transmitting hard and brittle material wafers of the present invention.

[0065] In the attached picture:

[0066] 100. Granite base;

[0067] 200. Load-bearing rotating mechanism; 210. Load-bearing support frame; 220. First load-bearing roller; 230. Second load-bearing roller; 240. First drive assembly; 250. Second drive assembly; 300. Translucent hard and brittle material crystal;

[0068] 400. Two-degree-of-freedom laser cutting mechanism; 410. Laser assembly; 411. Laser cutting head; 412. Laser generator; 413. Laser power cord; 414. Laser power supply;

[0069] 420. Laser Z-direction moving assembly; 421. Laser Z-direction moving platform; 422. Third driving assembly; 423. First ball screw; 424. First guide column;

[0070] 430. Laser X-axis moving assembly; 431. Laser X-axis moving base; 432. Fourth driving assembly; 433. Second roller screw; 434. Laser cutting base; 435. Second guide column;

[0071] 500. Two-degree-of-freedom diamond wire saw cutting mechanism; 510. Wire cutting assembly; 511. Fifth drive assembly; 512. Wire driving wheel; 513. Wire driven wheel; 514. Diamond wire saw; 515. Tensioning wheel; 516. Telescopic rod; 520. Telescopic driven rotating assembly; 521. Driven roller; 522. Driven roller support frame; 523. Compression spring; 530. Wire cutting Z-direction moving assembly; 531. Wire cutting Z-direction moving platform; 532. Sixth drive assembly; 533. Third ball screw; 534. Third guide column; 540. Wire cutting Y-direction moving assembly; 541. Wire cutting Y-direction moving base; 542. Seventh drive assembly; 543. Fourth ball screw; 544. Wire cutting base; 545. Fourth guide column;

[0072] 600. Spiral line trajectory; 610. Modified portion; 620. Light-transmitting hard and brittle material wafer. DETAILED DESCRIPTION

[0073] Embodiment 1:

[0074] See attached Figure 1-8 , a time-delayed synchronous continuous cutting device for light-transmitting hard and brittle material wafers, comprising: a base 100, a bearing rotation mechanism 200, a two-degree-of-freedom laser cutting mechanism 400, a two-degree-of-freedom diamond wire saw cutting mechanism 500 and an automatic controller;

[0075] The base 100 is a base made of granite;

[0076] The bearing rotating mechanism 200 is fixed on the base 100 by bolts, and the bearing rotating mechanism 200 clamps and drives the column of the light-transmitting hard and brittle material crystal 300 to be processed to rotate;

[0077] The two-degree-of-freedom laser cutting mechanism 400 includes a laser assembly 410 and a two-degree-of-freedom laser slide;

[0078] The two-degree-of-freedom diamond wire saw cutting mechanism 500 comprises a wire cutting assembly 510 and a two-degree-of-freedom wire saw cutting slide;

[0079] The two-degree-of-freedom laser slide and the two-degree-of-freedom wire saw cutting slide are installed on the periphery of the light-transmitting hard and brittle material crystal 300 and fixed on the base 100. The two-degree-of-freedom laser slide and the two-degree-of-freedom wire saw cutting slide slide inward, outward, upward and downward relative to the light-transmitting hard and brittle material crystal 300 under the control of the automatic controller;

[0080] The laser assembly 410 is mounted on a two-degree-of-freedom laser slide, on which a laser cutting head 411 is located above the light-transmitting hard and brittle material crystal 300;

[0081] The wire cutting assembly 510 is mounted on a two-degree-of-freedom wire saw cutting slide, and the diamond wire saw 514 is in point contact with the lower side of the light-transmitting hard and brittle material crystal 300 .

[0082] See attached Figure 1 and attached Figure 4 The bearing and rotating mechanism 200 comprises: a bearing support frame 210, a first bearing roller 220, a second bearing roller 230, a first driving assembly 240 and a second driving assembly 250;

[0083] The load-bearing support frame 210 is U-shaped, and the bottom end is fixedly connected to the base 100. The first load-bearing roller 220 and the second load-bearing roller 230 are connected to the load-bearing support frame 210 by upper and lower shafts, and are driven by the first drive assembly 240 and the second drive assembly 250 fixedly connected to the base 100 at the lower side of the load-bearing support frame 210 respectively;

[0084] The first drive assembly 240 and the second drive assembly 250 both include a DC servo motor and a coupling, and are connected to an automation controller;

[0085] The axial distance between the first bearing roller 220 and the second bearing roller 230 is smaller than the diameter of the column of the light-transmitting hard and brittle material crystal 30, that is, they are located on one side of the column of the light-transmitting hard and brittle material crystal 30, leaving enough processing space for the two-degree-of-freedom diamond wire saw cutting mechanism 500;

[0086] One side of the column of the light-transmitting hard and brittle material crystal 300 is clamped and driven to rotate by the first bearing roller 220 and the second bearing roller 230, and the opposite side is clamped and supported by two driven rollers 521 of the retractable driven rotating assembly 520 in the two-degree-of-freedom diamond wire saw cutting mechanism 500;

[0087] The first bearing roller 220 and the second bearing roller 230 rotate in the same direction during operation, driving the column of the light-transmitting hard and brittle material crystal 300 to rotate in opposite directions.

[0088] The two-degree-of-freedom diamond wire saw cutting mechanism 500 and the two-degree-of-freedom laser cutting mechanism 400 are installed at an angle of 90° relative to the light-transmitting hard and brittle material crystal 300;

[0089] The two-degree-of-freedom diamond wire saw cutting mechanism 500 comprises: a wire cutting assembly 510, a retractable driven rotating assembly 520, a wire cutting Z-direction moving assembly 530 and a wire cutting Y-direction moving assembly 540;

[0090] The wire cutting assembly 510 includes: a fifth driving assembly 511, a wire driving wheel 512, a wire driven wheel 513, a diamond wire saw 514, a tensioning wheel 515 and a telescopic rod 516;

[0091] The fifth drive assembly 511 includes a DC servo motor and a coupling, and the fifth drive assembly 511 is connected to the automation controller;

[0092] The wire driving wheel 512 and the wire driven wheel 513 are axially connected to the front ends of the wire cutting Z-direction moving platform 531 of the wire cutting Z-direction moving assembly 530, and the rear side thereof is axially connected to the tensioning wheel 515, and the three are connected through the diamond wire saw 514;

[0093] The wire driving wheel 512 is driven by the fifth driving assembly 511, driving the diamond wire saw 514 to rotate in the opposite direction of the rotation direction of the light-transmitting hard and brittle material crystal 300 through the wire driven wheel 513 and the tensioning wheel 515, and is in point contact with the position where the light-transmitting hard and brittle material crystal 300 is cut;

[0094] The tensioning wheel 515 is axially connected to the telescopic rod 516, and the telescopic rod 516 can be adjusted along the Y direction relative to the wire cutting Z-direction moving platform 531, that is, fixed after adjustment; and then the front and rear positions of the tensioning wheel 515 are adjusted to adjust the tightness of the diamond wire saw 514; the diamond wire saw 514 can adopt the GHN series product diamond wire saw.

[0095] A retractable driven rotating assembly 520 is disposed at the upper front end of the wire cutting Z-direction moving platform 531, and a wire cutting assembly 510 is disposed at the lower part of the retractable driven rotating assembly 520;

[0096] The retractable driven rotating assembly 520 includes two driven rollers 521, a driven roller support frame 522 and a compression spring 523; the driven roller support frame 522 can slide forward and backward relative to the linear cutting Z-direction moving platform 531, and a compression spring 523 is arranged between the two;

[0097] The rear side of the driven roller support frame 522 is provided with two sliding bars, which are slidably connected to the sliding holes on both sides of the linear cutting Z-direction moving platform 531, and the compression spring 523 is sleeved on the sliding bars;

[0098] The front end of the driven roller support frame 522 is symmetrically connected to two driven rollers 521 in the upper and lower axes, and contacts the columnar outer wall of the light-transmitting hard and brittle material crystal 300 to achieve clamping support.

[0099] The wire cutting Z-direction moving assembly 530 comprises: a wire cutting Z-direction moving platform 531, a sixth driving assembly 532, a third ball screw 533 and a third guide column 534;

[0100] The wire cutting Y-direction movable base 541 is U-shaped, and the central axis of the connecting plates on both sides thereof is connected to the third ball screw 533, and the third ball screw 533 is transmission-connected to the sixth drive assembly 532; the sixth drive assembly 532 is fixedly connected to the upper end of the wire cutting Y-direction movable base 541, and two third guide columns 534 with the same axial direction are arranged on both sides of the third ball screw 533, and both ends of the third guide column 534 are fixedly connected to the wire cutting Y-direction movable base 541; the base of the wire cutting Z-direction movable platform 531 passes through the third ball screw 533 and the third guide column 534 in sequence, and under the drive of the sixth drive assembly 532, the wire cutting Z-direction movable platform 531 moves in the Z direction along the third ball screw 533, and the sixth drive assembly 532 includes a DC servo motor and a coupling, and the sixth drive assembly 532 is connected to the automation controller.

[0101] The wire cutting Y-axis moving assembly 540 includes: a wire cutting Y-axis moving base 541, a seventh driving assembly 542, a fourth ball screw 543, a wire cutting base 544 and a fourth guide column 545;

[0102] The wire cutting base 544 is U-shaped, and the central axis of the connecting plates on both sides is connected to the fourth ball screw 543, and the fourth ball screw 543 is connected to the seventh drive assembly 542 in transmission connection; the seventh drive assembly 542 is fixedly connected to one end of the wire cutting base 544, and two fourth guide columns 545 with the same axial direction are arranged on both sides of the fourth ball screw 543; the two ends of the fourth guide column 545 are fixedly connected to the wire cutting base 544, and the base of the wire cutting Y-direction movable base 541 passes through the fourth guide column 545 and the fourth ball screw 543. Under the drive of the seventh drive assembly 542, the wire cutting Y-direction movable base 541 moves in the Y direction along the fourth ball screw 543, and the seventh drive assembly 542 includes a DC servo motor and a coupling, and the seventh drive assembly 542 is connected to the automation controller.

[0103] The two-degree-of-freedom laser cutting mechanism 400 includes: a laser assembly 410, a laser Z-direction moving assembly 420 and a laser X-direction moving assembly 430;

[0104] The laser assembly 410 includes: a laser cutting head 411, a laser generator 412, a laser power line 413 and a laser power supply 414;

[0105] A laser cutting head 411 is fixed on the laser generator 412. The laser cutting head 411 is used to focus the laser beam emitted by the laser generator 412 on the target position at the bottom of the light-transmitting hard and brittle material crystal 300. The laser generator 412 is electrically connected to the laser power supply 414 via a laser power line 413 to emit a laser beam. The laser generator 412 is fixedly connected to the laser Z-direction moving platform 421 of the laser Z-direction moving assembly 420.

[0106] The laser Z-direction moving assembly 420 includes: a laser Z-direction moving platform 421, a third driving assembly 422, a first ball screw 423 and a first guide column 424;

[0107] The laser X-axis moving assembly 430 includes: a laser X-axis moving base 431, a fourth driving assembly 432, a second ball screw 433, a laser cutting base 434 and a second guide column 435;

[0108] The laser X-direction movable base 431 is U-shaped, and the central axis of the connecting plates on both sides thereof is connected to the first ball screw 423, and the first ball screw 423 is transmission-connected to the third drive assembly 422, and the third drive assembly 422 is fixedly connected to the laser X-direction movable base 431; both sides of the first ball screw 423 are fixedly connected to the first guide columns 424 with the same axial direction, and the base of the laser Z-direction movable platform 421 passes through the first guide column 424 and the first ball screw 423; the first ball screw 423 is driven to rotate in the third drive assembly 422, so as to drive the laser Z-direction movable platform 421 to move, and the laser Z-direction movable platform 421 moves along the Z direction together with the laser generator 412 and the laser cutting head 411, and the third drive assembly 422 includes a DC servo motor and a coupling, and the third drive assembly 422 is electrically connected to the automation controller;

[0109] The laser cutting base 434 is U-shaped, and the central axis of the connecting plates on both sides is connected to the second ball screw 433. The second ball screw 433 is transmission-connected to the fourth drive assembly 432. The fourth drive assembly 432 is fixedly connected to one end of the laser cutting base 434. Second guide columns 435 with the same axial direction are fixedly connected on both sides of the second ball screw 433. The base of the laser X-direction movable base 431 passes through the second guide column 435 and the second ball screw 433. Driven by the fourth drive assembly 432, the laser X-direction movable base 431 drives the laser generator 412, the laser cutting head 411 and the laser Z-direction movable assembly 420 to move along the second ball screw 433 along the X-direction. The fourth drive assembly 432 includes a DC servo motor and a coupling. The fourth drive assembly 432 is electrically connected to the automation controller.

[0110] Embodiment 2:

[0111] In some embodiments, the retractable driven rotating assembly 520 may not be arranged on the two-degree-of-freedom diamond wire saw cutting mechanism 500. The retractable driven rotating assembly 520 is essentially only a supporting and clamping mechanism on one side of the column of the light-transmitting hard and brittle material crystal 300, and a supporting and clamping mechanism with a transitional effect may be separately arranged on the opposite side of the load-bearing rotating mechanism 200; and then on the periphery of the light-transmitting hard and brittle material crystal 300, an arc-shaped slideway concentric with the light-transmitting hard and brittle material crystal 300 to be processed is provided on the base 100, and is slidably connected to the laser slide and the wire saw cutting slide, and they slide freely on the arc-shaped slideway under the control of the controller to adjust the angle between the laser slide and the wire saw cutting slide; a turntable is provided between the laser assembly 410 and the laser slide; when the pulse energy of the laser is sufficient, in-situ time-delayed synchronous continuous light-transmitting hard and brittle wafer cutting can also be achieved.

[0112] The automatic controller system used in the time-delayed synchronous continuous cutting device of a light-transmitting hard and brittle material wafer of the present invention is an existing mature electric control technology.

[0113] The use method and principle of the time-delayed synchronous continuous cutting device for light-transmitting hard and brittle material wafers of the present invention are as follows:

[0114] A method for continuously cutting a light-transmitting hard and brittle wafer by laser and diamond wire saw with time difference synchronization is provided. The method adopts the above-mentioned device for continuously cutting a light-transmitting hard and brittle wafer with time difference synchronization, and comprises the following steps:

[0115] 1) The first bearing roller 220 and the second bearing roller 230 of the fixed bearing rotating mechanism 200 cooperate with the driven roller 521 of the two-degree-of-freedom diamond wire saw cutting mechanism 500 to position and clamp the light-transmitting hard and brittle material crystal 300;

[0116] 2) setting the cutting tracks of the laser cutting head 411 and the diamond wire saw 514 in the automated controller system, and calculating the time S required for the laser beam of the laser cutting head 411 to focus on the light-transmitting hard and brittle material crystal 300 to form the modified portion 610;

[0117] The modified part 610 refers to the pulse energy after laser focusing reaching the damage threshold of the light-transmitting hard and brittle material crystal 300, so that the inside thereof is modified and a crack zone is generated;

[0118] 3) Start the bearing rotation mechanism 200, and the two bearing rollers thereon rotate in the same direction, driving the light-transmitting hard and brittle material crystal 300 column to rotate; then the third driving assembly 422 and the fourth driving assembly 432 are controlled by the automation controller, and the laser Z-direction moving platform 421 moves linearly from the outside to the inside to the center of the light-transmitting hard and brittle material crystal 300 column according to the cutting trajectory. The trajectory is shown in the attached Figure 7 The spiral trajectory 600 is formed by the rotational motion of the light-transmitting hard and brittle material crystal 300 and the linear motion of the laser, wherein the linear motion speed of the laser is 100-200 nm / s;

[0119] The laser generator 412 emits a laser beam with a wavelength of 500-600nm and a power of 4-5kw. The laser beam is focused from top to bottom through the laser cutting head 411 to the height to be processed at the lower end of the light-transmitting hard and brittle material crystal 300;

[0120] 4) After S time, a modified portion 610 is formed on the edge of the light-transmitting hard and brittle material crystal 300, accompanied by a crack zone, and the first driving assembly 240 and the second driving assembly 250 in the bearing rotation mechanism 200 are kept started, so that the light-transmitting hard and brittle material crystal 300 to be processed starts to rotate at a speed of 300-600 m / min;

[0121] The automation controller controls the fifth drive assembly 511, the sixth drive assembly 532 and the seventh drive assembly 542. The diamond wire saw 514 moves in the opposite direction to the light-transmitting hard and brittle material crystal 300. The diamond wire saw 514 moves linearly from outside to inside according to the set cutting trajectory, cutting point by point to form a spiral cutting trajectory. The cutting speed of the diamond wire saw 514 is 1000-1400 m / min.

[0122] The light-transmitting hard-brittle material wafer 620 is peeled off layer by layer from the light-transmitting hard-brittle material crystal 300 until it falls off. The thickness of the light-transmitting hard-brittle material wafer 620 is less than 500μm, the cutting width is less than 20 microns, the average processing loss per wafer is less than 30μm, the cutting time per wafer is less than 35 minutes, the crystal surface roughness is less than 5μm, the curvature is less than 30μm, the total thickness deviation is less than 20μm, the damage layer depth is less than 20μm, and the ratio of the maximum surface crack depth to the damage layer depth is less than 80%.

Claims

1. A time-delayed synchronous continuous cutting device for light-transmitting hard and brittle material wafers, characterized in that: It comprises a base (100), a bearing rotation mechanism (200), a two-degree-of-freedom laser cutting mechanism (400), a two-degree-of-freedom diamond wire saw cutting mechanism (500), and a controller; The bearing rotation mechanism (200) is fixed on the base (100), and the bearing rotation mechanism (200) clamps and drives the light-transmitting hard and brittle material crystal (300) to be processed to rotate; The two-degree-of-freedom laser cutting mechanism (400) comprises a laser assembly (410) and a laser slide table; The two-degree-of-freedom diamond wire saw cutting mechanism (500) comprises a wire cutting assembly (510) and a wire saw cutting slide; The laser slide and the wire saw cutting slide are mounted on the periphery of the light-transmitting hard and brittle material crystal (300) to be processed and fixed on the base (100); the two slides slide inward, outward, upward and downward relative to the light-transmitting hard and brittle material crystal (300) under the control of the controller; The laser assembly (410) is mounted on a laser slide, and the laser cutting head (411) is arranged above the light-transmitting hard and brittle material crystal (300); The wire cutting assembly (510) is mounted on a wire saw cutting slide, and the diamond wire saw (514) is in point contact with the light-transmitting hard and brittle material crystal (300).

2. The device for continuously cutting light-transmitting hard and brittle material wafers by time-delay synchronization according to claim 1, characterized in that: The load-bearing rotating mechanism (200) comprises: a load-bearing support frame (210), a first load-bearing roller (220), a second load-bearing roller (230), a first driving assembly (240) and a second driving assembly (250); The bottom end of the load-bearing support frame (210) is fixedly connected to the base (100), and the first load-bearing roller (220) and the second load-bearing roller (230) are connected to the load-bearing support frame (210) by upper and lower shafts, and the two are driven by a first driving component (240) and a second driving component (250) fixedly connected to the lower side of the load-bearing support frame (210); The first drive assembly (240) and the second drive assembly (250) both comprise a DC servo motor and a coupling, and are connected to a controller; The axial distance between the first bearing roller (220) and the second bearing roller (230) is smaller than the diameter of the column of the light-transmitting hard and brittle material crystal (300); One side of the light-transmitting hard and brittle material crystal (300) column is clamped and driven to rotate by two bearing rollers; The two-degree-of-freedom diamond wire saw cutting mechanism (500) further comprises a retractable driven rotating assembly (520), wherein two driven rollers (521) of the retractable driven rotating assembly (520) are arranged on the other side of the column of the light-transmitting hard and brittle material crystal (300) to clamp and support it.

3. A time-delayed synchronous continuous cutting device for light-transmitting hard and brittle material wafers according to claim 1 or 2, characterized in that: The installation angle between the two-degree-of-freedom diamond wire saw cutting mechanism (500) and the two-degree-of-freedom laser cutting mechanism (400) is 90°.

4. A time-delayed synchronous continuous cutting device for light-transmitting hard and brittle material wafers according to claim 1 or 2, characterized in that: An arc-shaped slideway concentric with the light-transmitting hard-brittle material crystal (300) is provided on the base (100) at the periphery of the light-transmitting hard-brittle material crystal (300) column, and is slidably connected to the laser slide table and the wire saw cutting slide table. The two slide freely on the arc-shaped slideway under the control of the controller to adjust the angle between the laser slide table and the wire saw cutting slide table.

5. The device for continuously cutting light-transmitting hard and brittle material wafers by time-delay synchronization according to claim 4, characterized in that: A turntable is provided between the laser assembly (410) and the laser slide table.

6. A method for synchronously cutting light-transmitting hard and brittle material wafers in a time-delayed manner, characterized in that: The following steps are involved: Step 1: focusing a laser beam on a light-transmitting hard and brittle material crystal (300) to be processed, and forming a modified portion (610) after a time S; Step 2: Cutting the modified portion (610) with a diamond wire saw (514); Step 3: The laser beam and the diamond wire saw (514) move along the same trajectory, with a time difference of S between the two. The modified portion (610) is formed when the pulse energy after laser focusing reaches the damage threshold of the light-transmitting hard and brittle material crystal (300).

7. The method for synchronously cutting a light-transmitting hard and brittle material wafer according to claim 6, characterized in that: The light-transmitting hard and brittle material crystal (300) to be processed rotates, and the laser beam and the diamond wire saw (514) cut spirally from the outside to the inside.

8. A time-differential synchronous continuous cutting method for light-transmitting hard and brittle material wafers according to claim 6 or 7, characterized in that: The laser beam is focused from above the light-transmitting hard and brittle material crystal (300) to be processed and irradiated downward; the diamond wire saw (514) cuts the light-transmitting hard and brittle material crystal (300) layer by layer from bottom to top, thereby cutting the light-transmitting hard and brittle material crystal (300) into a plurality of sheet-like crystals.

9. The method for synchronously cutting a light-transmitting hard and brittle material wafer according to claim 8, characterized in that: The rotation direction of the diamond wire saw (514) is opposite to that of the light-transmitting hard and brittle material crystal (300) to be processed.

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