Diamond double-sided precision machining device and method

Abstract

The invention provides a diamond double-sided precision machining device and method. In the process of replacing the machining procedure of the to-be-machined diamond piece, the other face, not subjected to vacuum adsorption in the previous procedure, of the to-be-machined diamond piece is completely and tightly attached to a vacuum adsorption unit in the next procedure while it is maintained that the previous procedure completely adsorbs one face of the to-be-machined diamond piece in a vacuum mode; completely absorbing the other surface of the to-be-processed diamond wafer in vacuum by adopting the vacuum absorption unit of the next procedure, and then desorbing the to-be-processed diamond wafer from the vacuum absorption unit of the previous procedure; in this way, continuous control over the stress in the double-face finish machining process of the diamond piece is achieved, the diamond piece deformation problem caused by stress change is avoided, then the secondary machining problem caused by shape change due to deformation of the diamond piece is completely solved, the machining difficulty of the diamond piece is greatly reduced, and the machining efficiency of the diamond piece is improved. And the total thickness deviation level of the diamond sheet is obviously improved.

Description

Technical Field

[0001] The invention belongs to the technical field of mechanical processing, and in particular relates to a diamond double-sided precision processing device and method. Background Art

[0002] As the hardest substance in nature, diamond is widely used in machinery, automobiles, aerospace, semiconductor processing and other fields due to its extremely high hardness and excellent wear resistance. At the same time, diamond has high thermal conductivity, extremely low thermal expansion coefficient, good chemical stability, and high optical transmittance, which makes diamond have broad application prospects in biomedicine, semiconductors, optical devices, electronic information, quantum frontiers and other fields. In the fields of optics, thermal, electrical, electrochemistry, etc., the standard tolerance of the total thickness deviation of CVD diamond after processing is ±0.05 mm, and the common process limit is ±0.025 mm. When there are special application requirements, the requirement for the total thickness deviation of CVD diamond can reach the micron level.

[0003] The main methods of diamond processing include etching, grinding, polishing, etc. Regardless of the method used to process diamond, when the material is removed from the diamond, the diamond will be deformed; after the diamond is deformed, it will affect the original warpage of the diamond, thereby changing the original morphology of the diamond surface. If the diamond is processed again, part of the diamond area needs to be processed again, which increases the difficulty of further processing of the diamond and reduces the processing efficiency. At the same time, the accuracy of the total thickness deviation of the original diamond will also change.

[0004] Chinese patent application CN 116638405 A discloses an automatic face-changing chamfering machine and processing method for wave plate wafers. In the patent application, the wave plate to be processed is clamped in a vacuum adsorption mode during the processing process. A group of wave plate chamfering clamps, wave plate unloading clamps and wave plate loading clamps with different through-hole sizes are pre-designed, and the wave plate to be processed is "blown away" by one tubular wave plate vacuum clamp while being "adsorbed" by another tubular wave plate vacuum clamp, so as to complete the automatic flipping of the wave plate to be processed, so as to meet the processing requirements of wave plates of different sizes and shapes, make the wave plate evenly stressed, and reduce the generation of deformation and stress during the wave plate processing. Although the deformation and stress of the wave plate to be processed in the patent application are reduced during the vacuum flipping process, deformation and stress will still be generated, which can still cause a significant change in the total thickness deviation of the original diamond, thereby failing to solve the problem that stress deformation becomes an obstacle to the higher precision processing of diamond sheets. Summary of the invention

[0005] In view of this, the main purpose of the present invention is to provide a diamond double-sided precision machining device and method, which can achieve "zero" deformation control of diamond and achieve the purpose of improving the total thickness deviation level after double-sided mirror machining of diamond. After adopting this device and method, during the double-sided precision machining of diamond, the stress changes of diamond caused by external loads or temperature and other factors can be constrained, the deformation during the double-sided precision machining of diamond can be effectively controlled, the difficulty of diamond machining can be reduced, the machining efficiency can be improved, and the total thickness deviation machining level of diamond can be significantly improved.

[0006] The specific technical solutions are as follows: A diamond double-sided precision machining device, It comprises a vacuum adsorption platform, a guide rail, a mobile clamping device, a processing component, a mechanical flipping device and a numerical control system, wherein the vacuum adsorption platform is used to place and adsorb the diamond sheet to be processed, and the mobile clamping device is installed on the guide rail and can move along the guide rail between the vacuum adsorption platform, the processing component and the mechanical flipping device; The mobile clamping device can make the diamond sheet to be processed move along the guide rail, rotate and move up and down, and includes a first vacuum adsorption chuck that can completely adsorb the processed diamond sheet; The processing component is used to process the diamond sheet to be processed, including a processing material used to process the diamond sheet to be processed; The mechanical flipping device comprises a second vacuum adsorption chuck which can completely adsorb the processed diamond sheet, and the mechanical flipping device can make the diamond sheet to be processed rotate in the horizontal direction, flip itself over and move up and down; The numerical control system is used to control the automatic processing process of the diamond sheet to be processed. The signal output end of the numerical control system is connected to the vacuum adsorption platform, the mobile clamping device, the processing component and the mechanical flipping device respectively. When the diamond sheet to be processed is being processed, the numerical control system can control the vacuum adsorption unit between the vacuum adsorption platform, the mobile clamping device and the mechanical flipping component to completely adsorb the diamond sheet to be processed according to the processing procedure. When the processing procedure of the diamond sheet to be processed is changed, while maintaining the previous processing procedure to completely adsorb one side of the diamond sheet to be processed, the other side of the diamond sheet to be processed that is not adsorbed by the previous processing procedure is firstly completely and tightly fitted with the vacuum adsorption unit of the next processing procedure, and then the vacuum adsorption unit of the next processing procedure is used to completely adsorb the other side of the diamond sheet to be processed, and then the diamond sheet to be processed is desorbed from the vacuum adsorption unit of the previous processing procedure, wherein the vacuum adsorption unit is the vacuum adsorption platform, the first vacuum adsorption chuck or the second vacuum adsorption chuck.

[0007] The "replacement process" in the present invention mainly refers to the process of replacing the vacuum adsorption process of the diamond sheet to be processed; the "first surface" and "second surface" in the present invention are two surfaces of the diamond sheet to be processed that are arranged opposite to each other; "complete adsorption" or "complete vacuum adsorption" means that all areas of the "first surface" and / or "second surface" are vacuum adsorbed on the corresponding vacuum adsorption unit, that is, all areas of the "first surface" and / or "second surface" are tightly attached to the vacuum adsorption unit.

[0008] Among them, the area of ​​the surface of any vacuum adsorption unit in contact with the diamond sheet to be processed is not less than the single-side area of ​​the diamond sheet to be processed, that is, the area of ​​the surface of the vacuum adsorption platform, the first vacuum adsorption chuck and the second vacuum adsorption chuck in contact with the diamond sheet to be processed is not less than the area of ​​the first surface or the second surface of the diamond sheet to be processed, so as to ensure that the first surface or the second surface of the diamond sheet to be processed can be completely and tightly attached to the vacuum adsorption unit.

[0009] During the replacement process of the diamond sheet to be processed, while the first side or the second side of the diamond sheet to be processed is kept in a vacuum adsorption state by using the vacuum adsorption unit of the previous process, the second side or the first side of the diamond sheet to be processed which is not vacuum adsorbed by the previous process is first closely attached to the vacuum adsorption unit of the next process, and then vacuum adsorbed by the vacuum adsorption unit of the next process, and firmly fixed on the vacuum adsorption unit of the next process. Therefore, after the first side or the second side of the diamond sheet to be processed is desorbed from the adsorption state maintained by the previous process, the diamond sheet to be processed can also be firmly fixed on the vacuum adsorption unit of the next process, so that the diamond to be processed is always in a stress state during the processing, avoiding the problem of diamond sheet deformation caused by stress change; after the double-sided processing process is completed, the double-sided processed diamond is deformed, although the morphology changes, the total thickness deviation remains unchanged, thereby reducing the difficulty of diamond sheet processing and significantly improving the processing level of the total thickness deviation of the diamond sheet.

[0010] Based on the above, each vacuum adsorption unit in the vacuum adsorption platform, the first vacuum adsorption chuck and the second vacuum adsorption chuck is mainly a vacuum adsorption clamping structure composed of a central ceramic microporous suction cup located in the center and a plurality of annular ceramic microporous suction cups sleeved on the central ceramic microporous suction cup, and each ceramic microporous suction cup is connected to the numerical control system through an electromagnetic valve; in this way, different adsorption areas can be selected to adsorb diamonds according to the size of the diamond piece to be processed during processing. The central ceramic microporous suction cup can be round, square or other shapes, and the corresponding annular ceramic microporous suction cup can be in the shape of a round ring or a square ring. The number of annular ceramic microporous suction cups in the vacuum adsorption clamping structure can be determined according to the size of the diamond piece to be processed.

[0011] Based on the above, the mobile clamping device further includes a first up-and-down moving hydraulic device and a first rotating shaft, wherein the first vacuum adsorption chuck is mounted on the first rotating shaft, the first up-and-down moving hydraulic device, the first rotating shaft and the first vacuum adsorption chuck are arranged in sequence from top to bottom, and the first up-and-down moving hydraulic device drives the first rotating shaft to carry the first vacuum adsorption chuck to move up and down or rotate. Preferably, the center of the first vacuum adsorption chuck is fixed on the first rotating shaft.

[0012] The mobile clamping device can be moved to the top of the vacuum adsorption platform, the mechanical flipping device is on the right side of the vacuum adsorption platform, and the processing component is on the right side of the mechanical flipping device. The first vacuum adsorption chuck can be moved along the guide rail to the top of the vacuum adsorption platform, the second vacuum adsorption chuck and the processing component. The center of the first vacuum adsorption chuck, the center of the second vacuum adsorption chuck, and the center of the vacuum adsorption platform can be on the same axis.

[0013] Based on the above, the mechanical flipping device also includes a second rotating shaft, a second up and down moving hydraulic device and a mechanical rotating device. The second vacuum adsorption chuck is fixed on the second rotating shaft and can be flipped 180° back and forth with the second rotating shaft itself; one end of the second up and down moving hydraulic device is installed with the second rotating shaft, and can drive the second rotating shaft to move up and down and rotate; the other end is installed on the mechanical rotating device, and can drive the second vacuum adsorption chuck to rotate as a whole with the second up and down moving hydraulic device and the second rotating shaft.

[0014] Based on the above, the processing component can be a processing component such as grinding and polishing. Specifically, the processing component also includes a motor for driving the processing material to rotate and a cooling device for cooling the processing material. Among them, the processing material is a replaceable processing material, which can be a grinding and polishing tool such as a diamond grinding wheel, a CMP polishing pad, a cast iron disc, etc. Among them, the use of a diamond grinding wheel, a CMP polishing pad, etc. can achieve fine polishing processing of a diamond sheet; the use of a cast iron disc in combination with an abrasive can achieve grinding processing of a diamond sheet.

[0015] Among them, the diamond double-sided precision processing device also includes a vacuum adsorption device that can control the adsorption of the diamond sheet to be processed. The vacuum adsorption device is connected to the vacuum adsorption platform, the first vacuum adsorption chuck and the second vacuum adsorption chuck through solenoid valves, and is connected to the signal output end of the numerical control system.

[0016] The present invention also provides a diamond double-sided precision machining method, which uses the above-mentioned diamond double-sided precision machining device to perform double-sided machining on a diamond sheet to be machined, and specifically comprises the following steps: Processing the first surface: firstly controlling the mobile clamping device to vacuum adsorb the second surface of the diamond sheet to be processed, and then controlling the diamond sheet to be processed to move along the guide rail to the processing component with the mobile clamping device, and processing the first surface of the diamond sheet to be processed; Automatic flipping: while maintaining the first vacuum adsorption chuck to tightly adsorb the second side of the diamond sheet to be processed, firstly closely fit the processed first side of the diamond sheet to be processed with the second vacuum adsorption chuck, then control the second vacuum adsorption chuck to adsorb the processed first side of the diamond sheet to be processed, then desorb the diamond sheet to be processed from the first vacuum adsorption chuck to expose the unprocessed second side of the diamond sheet to be processed, then control the diamond sheet to be processed on the second vacuum adsorption chuck to first rotate with the mechanical rotating device to the position where it is offset from the first vacuum adsorption chuck, and then flip 180° with the second rotating axis, so that the diamond sheet to be processed is located below the second vacuum adsorption chuck; Processing the second surface: first control the second vacuum adsorption chuck that adsorbs the turned-over diamond sheet to be processed to be located above the vacuum adsorption platform, then tightly fit the second surface of the diamond sheet to be processed with the vacuum adsorption platform, then control the vacuum adsorption platform to adsorb the second surface of the diamond sheet to be processed, and then desorb the first surface of the diamond sheet to be processed from the second vacuum adsorption chuck; then repeat the steps of processing the first surface, control the mobile clamping device to first vacuum adsorb the processed first surface of the diamond sheet to be processed, and then move to the processing component to process the second surface of the diamond sheet to be processed.

[0017] Based on the above method, it also includes the steps of preparing and placing the diamond sheet to be processed: placing the clean diamond sheet to be processed on the vacuum adsorption platform, and adsorbing the first surface of the diamond sheet to be processed on the vacuum adsorption platform; The step of processing the first surface includes: first controlling the mobile clamping device to move along the guide rail to the vacuum adsorption platform, then controlling the first rotating shaft and the first vacuum adsorption chuck to descend along with the first up-and-down hydraulic device until the first vacuum adsorption chuck is tightly attached to the second surface of the diamond sheet to be processed, then starting the first vacuum adsorption chuck to adsorb the second surface of the diamond sheet to be processed, and then separating the first surface of the diamond sheet to be processed from the vacuum adsorption platform; First, the mobile clamping device is controlled to move along the guide rail to above the processing component; then, the first rotating spindle is controlled to descend by controlling the first up and down moving hydraulic device, so that the first surface of the diamond sheet to be processed is completely covered by the processing material, and then the first surface of the diamond sheet to be processed is processed until the processing of the first surface is completed.

[0018] In the automatic flipping step, after the diamond sheet to be processed is detached from the first vacuum adsorption chuck, the mechanical rotation device is driven to first control the second vacuum adsorption chuck to rotate 90° toward the vacuum adsorption platform to the second vacuum adsorption chuck rotation and face-changing position, and then control the diamond sheet to be processed on the second vacuum adsorption chuck to flip 180° along the second rotation axis, so that the diamond sheet to be processed is located below the second vacuum adsorption chuck.

[0019] The step of processing the second surface comprises: starting the mechanical rotating device to control the second vacuum adsorption chuck to rotate toward the vacuum adsorption platform, so that the center of the second vacuum adsorption chuck and the center of the vacuum adsorption platform are on the same axis; then starting the second up-and-down hydraulic device to control the second vacuum adsorption chuck to rotate and descend until the unprocessed second surface of the diamond sheet to be processed is tightly attached to the vacuum adsorption platform, and then controlling the vacuum adsorption platform to vacuum adsorb the unprocessed second surface of the diamond sheet to be processed; then desorbing the processed first surface of the diamond sheet to be processed from the second vacuum adsorption chuck, and controlling the second vacuum adsorption chuck to move away from the vacuum adsorption platform; Repeat the steps of processing the first surface, and control the mobile clamping device to vacuum absorb the processed first surface of the diamond sheet to be processed, then move the diamond sheet to be processed to the processing component, and process the unprocessed second surface of the diamond sheet to be processed until the processing of the second surface is completed, thereby completing the precision processing of both surfaces of the diamond sheet to be processed, and removing the diamond sheet with precision processing on both surfaces.

[0020] Among them, the step of removing the diamond sheet with precision machining on both sides includes: first controlling the mobile clamping device to carry the diamond sheet with precision machining on both sides to move along the guide rail to the vacuum adsorption platform, then placing the diamond sheet with precision machining on both sides on the vacuum adsorption platform, and removing the diamond sheet with precision machining on both sides from the vacuum adsorption platform.

[0021] Therefore, compared with the prior art, the diamond double-sided precision machining device and method provided by the present invention avoids the deformation problem of the diamond sheet caused by stress change by continuously controlling the stress during the double-sided precision machining of the diamond sheet, thereby completely eliminating the secondary processing problem caused by the change in the morphology of the diamond sheet due to deformation, greatly reducing the difficulty of diamond sheet machining, improving the diamond sheet machining efficiency, and significantly improving the total thickness deviation level of the diamond sheet.

[0022] The central ceramic microporous suction cup and the annular ceramic microporous suction cup in all vacuum adsorption units of the present invention are respectively connected to different solenoid valves. During processing, different adsorption areas can be selected to adsorb diamonds according to the size of the diamond piece to be processed, so that the diamond double-sided precision processing device and method have strong versatility and can be used to process various types of diamond pieces.

[0023] In addition, the processing parts in the present invention can be processing parts such as grinding and polishing, so that the diamond double-sided precision processing device can realize fine processing such as grinding and polishing, and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of a diamond double-sided precision machining device according to Embodiment 1 of the present invention; Figure 2 Schematic diagram of the structure of each vacuum adsorption unit in the first embodiment of the present invention; Figure 3 A flowchart of the steps of the double-sided precision machining method of diamond provided in the second embodiment of the present invention; Figure 4 A schematic diagram of the automatic turning over process of a diamond sheet to be processed provided in the second embodiment of the present invention; Among them, the component symbols in the above figures represent: 1. guide rail, 2. first up and down moving hydraulic device, 3. first rotating axis, 4. first vacuum adsorption chuck, 5. second vacuum adsorption chuck, 6. diamond piece to be processed, 7. vacuum adsorption platform, 8. second rotating axis, 9. second up and down moving hydraulic device, 10. mechanical rotating device, 11. processing material, 12. circular ceramic microporous suction cup, 13, 14, 15. circular ceramic microporous suction cup. DETAILED DESCRIPTION

[0025] The technical solution of the present invention is further described in detail below through specific implementation methods.

[0026] The terms used in the present invention are all commonly used terms in the field. The raw materials, equipment, preparation processes, test methods, etc. used are all prior art in the field unless otherwise specified. The method steps without specifying specific conditions in the embodiments are usually determined according to conventional conditions or based on detection experience. The directional words such as "left", "right", "up", "down" or "up and down" in the present invention only express relative positional relationships.

[0027] Embodiment 1 See also Figure 1This embodiment provides a double-sided diamond precision processing device, including a vacuum adsorption platform 7 for placing and adsorbing a diamond sheet 6 to be processed, a guide rail 1, a mobile clamping device installed on the guide rail 1, a processing component, a mechanical flipping device, a vacuum adsorption device and a numerical control system. In this embodiment, the guide rail 1 is a linear guide rail, the mobile clamping device can be moved to the top of the vacuum adsorption platform 7 through the guide rail 1, the mechanical flipping device is on the right side of the vacuum adsorption platform 7, and the processing component is on the right side of the mechanical flipping device.

[0028] The mobile clamping device is used to adsorb the diamond sheet 6 to be processed, and can make the diamond sheet 6 to be processed move, rotate and move up and down along the guide rail 1. Specifically, the mobile clamping device includes a first up and down moving hydraulic device 2, a first rotating shaft 3 and a first vacuum adsorption chuck 4 for completely vacuum adsorbing the diamond sheet 6 to be processed, wherein the first vacuum adsorption chuck 4 is mounted on the first rotating shaft 3, and the center of the first vacuum adsorption chuck 4 coincides with the central axis of the first rotating shaft 3. The first rotating shaft 3 is mounted on the first up and down moving hydraulic device 2, and can carry the first vacuum adsorption chuck 4 and the diamond sheet 6 to be processed to move up and down or rotate along the direction of gravity under the drive of the first up and down moving hydraulic device 2. The first up and down moving hydraulic device 2 is mounted on the guide rail 1, and can make the mobile clamping device as a whole move left and right along the guide rail 1 between the vacuum adsorption platform 7, the processing component and the mechanical flipping device.

[0029] The processing component is used to process the diamond sheet 6 to be processed. In this embodiment, the processing component is a fine polishing component, specifically including a replaceable processing material 11, a motor for driving the processing material 11 to rotate, and a cooling device for cooling the processing material; wherein the processing material 11 is a diamond grinding wheel; in other embodiments, the processing material 11 can be replaced by a CMP polishing pad.

[0030] The mechanical flipping device is used to adsorb the diamond sheet 6 to be processed and can make the diamond sheet 6 to be processed rotate left and right in the horizontal direction, flip itself and move up and down. Specifically, the mechanical flipping device includes a second vacuum adsorption chuck 5 for completely vacuum adsorption of the diamond sheet 6 to be processed, a second rotating shaft 8, a second up and down moving hydraulic device 9 and a mechanical rotating device 10. Among them, the second vacuum adsorption chuck 5 is fixed on the second rotating shaft 8 and can be turned back and forth 180° with the second rotating shaft 8. The second rotating shaft 8 is installed at one end of the second up and down moving hydraulic device 9, and the central axis of the second rotating shaft 8 and the central axis of the second up and down moving hydraulic device 9 are vertically arranged. Under the drive of the second up and down moving hydraulic device 9, the second rotating shaft 8 can carry the second vacuum adsorption chuck 5 and the diamond sheet 6 to be processed to move up and down and rotate along the gravity direction. The other end of the second up and down moving hydraulic device 9 is installed on the mechanical rotating device, and the second up and down moving hydraulic device 9, the second rotating shaft 8, the second vacuum adsorption chuck 5 and the diamond sheet 6 to be processed can be controlled to rotate left and right in the horizontal direction as a whole with the second up and down moving hydraulic device 9. When the second vacuum adsorption chuck 5 rotates left and right in the horizontal direction, the center thereof can coincide with the center of the first vacuum adsorption chuck 5 .

[0031] The vacuum adsorption device is mainly used to provide vacuum to the vacuum adsorption platform 7, the first vacuum adsorption chuck 4 and the second vacuum adsorption chuck 5, so as to control the adsorption of the diamond sheet to be processed 6. The vacuum adsorption device is connected to the vacuum adsorption platform 7, the first vacuum adsorption chuck 4 and the second vacuum adsorption chuck 5 through three solenoid valves, and is connected to the signal output end of the numerical control system, so as to realize independent control of the vacuum adsorption platform 7, the first vacuum adsorption chuck 4 and the second vacuum adsorption chuck 5.

[0032] Please also read Figure 2The vacuum adsorption platform 7, the first vacuum adsorption chuck 4 and the second vacuum adsorption chuck 5 are all three vacuum adsorption units in the diamond double-sided precision processing device provided in this embodiment, wherein each vacuum adsorption unit is composed of a circular ceramic microporous suction cup 12 located in the center and annular ceramic microporous suction cups 13, 14, 15 sleeved on the circular ceramic microporous suction cup 12, and the annular ceramic microporous suction cups 13, 14, 15 and the circular ceramic microporous suction cup 12 are concentrically arranged to form four circular adsorption areas, and the diameters of the four adsorption areas increase from the circular ceramic microporous suction cup 12 outwards. In this embodiment, the diameters of the four adsorption areas are 25 mm, 50 mm, 75 mm, and 100 mm respectively. The circular ceramic microporous suction cup 12 and the annular ceramic microporous suction cups 13, 14, 15 are connected to the vacuum adsorption device through four different solenoid valves; in this way, different adsorption areas can be selected according to the size of the diamond piece to be processed to adsorb the diamond piece to be processed during processing, ensuring that the surface of the diamond piece to be processed is completely adsorbed. In other embodiments, the circular ceramic microporous suction cup 12 can be replaced by a square ceramic microporous suction cup, and the annular ceramic microporous suction cup 13 can be replaced by a square ring ceramic microporous suction cup.

[0033] The numerical control system is used to control the double-sided finishing process of the diamond sheet 6 to be processed. The signal output end of the numerical control system is respectively connected to the vacuum adsorption platform 7, the mobile clamping device, the mechanical flipping device, the processing component and the vacuum adsorption device, and controls the entire automatic double-sided finishing process of the diamond sheet 6 to be processed. Specifically, the numerical control system can control the vacuum adsorption unit between the vacuum adsorption platform 7, the mobile clamping device and the mechanical flipping component to adsorb the diamond sheet 6 to be processed according to the processing process. When the diamond sheet 6 to be processed is replaced during the adsorption process, while maintaining the previous process to completely vacuum adsorb one side of the diamond sheet 6 to be processed, the other side of the diamond sheet 6 to be processed is first completely and tightly attached to the vacuum adsorption unit of the next process, and then the vacuum adsorption unit of the next process is used to completely vacuum adsorb the other side of the diamond sheet to be processed, and then one side of the diamond sheet 6 to be processed is desorbed from the vacuum adsorption unit of the previous process. In this way, after the diamond sheet 6 to be processed is desorbed from the adsorption state maintained in the previous process, it can still be firmly fixed on the vacuum adsorption unit of the next process, so that it is always in a stressed state during the entire processing process, avoiding the deformation problem of the diamond sheet caused by stress change, reducing the difficulty of diamond sheet processing, and significantly improving the processing level of the total thickness deviation of the diamond sheet.

[0034] Embodiment 2 Please also read Figure 3 and Figure 4This embodiment provides a double-sided diamond precision machining method, which uses the double-sided diamond precision machining device provided in Example 1 to perform planar machining on the two surfaces of the diamond sheet 6 to be machined. The specific machining method includes the following steps: Step 1: Prepare and place the diamond sheet to be processed Wipe the surfaces of the diamond sheet 6 to be processed and the vacuum adsorption platform 7 clean to ensure that the surfaces are free of contamination; then place the first side (lower surface) of the diamond sheet 6 to be processed on the vacuum adsorption platform 7 to ensure that the center of the vacuum adsorption platform coincides with the center of the diamond sheet to be processed, and turn on the vacuum adsorption platform 7 to vacuum adsorb the lower surface of the diamond sheet 6 to be processed so that the lower surface is completely adsorbed on the vacuum adsorption platform 7.

[0035] Step 2: Process the first side of the diamond sheet to be processed The mobile clamping device is controlled to move along the linear guide rail 1 to the vacuum adsorption platform 7 to ensure that the center of the first rotating shaft and the center of the vacuum adsorption platform are on the same axis; then the first up-and-down moving hydraulic device 2 is started to control the first rotating shaft 3 and the first vacuum adsorption chuck 4 to slowly descend, and after the first vacuum adsorption chuck 4 contacts the diamond piece 6 to be processed, a certain pressure is continued to be applied to ensure that the second surface (upper surface) of the diamond piece to be processed is completely and tightly fitted with the first vacuum adsorption chuck 4, and then the vacuum adsorption of the first vacuum adsorption chuck 4 is turned on to completely adsorb the upper surface of the diamond piece to be processed on the first vacuum adsorption chuck 4; then the vacuum adsorption function of the vacuum adsorption platform 7 is turned off, and the lower surface of the diamond piece to be processed is desorbed from the vacuum adsorption platform 7, so that the diamond piece to be processed is always in a stressed state during the process of being transferred from the vacuum adsorption platform 7 to the first vacuum adsorption chuck 4, avoiding the problem of stress deformation of the diamond piece caused by the change of force during the conversion process; then the first up-and-down moving hydraulic device 2 is started to control the first rotating shaft 3 and the first vacuum adsorption chuck 4 to move away from the vacuum adsorption platform 7. At this time, the diamond sheet 6 to be processed is fixed on the first vacuum adsorption chuck 4 and moves away from the vacuum adsorption platform 7 along with the first up-and-down hydraulic device 2 .

[0036] The mobile clamping device is controlled to move along the linear guide rail 1 to above the processing material 11 in the processing component; then the first up-and-down moving hydraulic device 2 is started, and the first rotating shaft 3 is controlled to slowly descend, so that the first surface of the diamond sheet 6 to be processed is fitted with the diamond grinding wheel as the processing material 11, ensuring that all areas of the first surface of the diamond sheet 6 to be processed are completely covered by the diamond grinding wheel, and then the CNC system controls the rotation of the diamond grinding wheel and the first rotating shaft 3, and continues to control the first up-and-down moving hydraulic device 2 to load pressure to perform fine processing on the first surface of the diamond sheet.

[0037] Step 3: Automatically turn over the diamond sheet to be processed 3.1: Vacuum adsorption chuck adsorbs the processed surface (first surface) of the diamond sheet to be processed After finishing the first surface of the diamond sheet 6 to be processed, the first up-and-down hydraulic device 2 is started to control the first rotating shaft 3 and the first vacuum adsorption chuck 4 to rise; then the mechanical rotating device is started to control the second vacuum adsorption chuck 5 to rotate toward the first vacuum adsorption chuck 4 to ensure that the center of the second vacuum adsorption chuck is on the same axis as the center of the first vacuum adsorption chuck; then the second up-and-down hydraulic device 10 is controlled to rise and apply pressure, and after the surface of the second vacuum adsorption chuck 5 is closely attached to the first surface of the processed surface of the diamond sheet 6 to be processed, the second vacuum adsorption chuck 5 is turned on for vacuum adsorption, and the processed surface of the diamond sheet to be processed is completely adsorbed on the second vacuum adsorption chuck 5, and then the numerical control system controls the electromagnetic valve to close the first vacuum adsorption chuck 4, and the second surface of the diamond sheet to be processed is desorbed from the first vacuum adsorption chuck 4, so that the diamond sheet 6 to be processed is always in a stressed state during the process of transferring from the first vacuum adsorption chuck 4 to the second vacuum adsorption chuck 5, so as to avoid the deformation of the diamond sheet caused by the replacement process; finally, the first up-and-down hydraulic device 2 is started to control the first rotating shaft 3 and the first vacuum adsorption chuck 4 to rise. At this time, the diamond sheet 6 to be processed is separated from the first vacuum adsorption chuck 4 , and all areas of the processed surface of the diamond sheet to be processed are tightly attached to the second vacuum adsorption chuck 5 and are located above the second vacuum adsorption chuck 5 .

[0038] 3.2: Mechanical flipping device rotates 180° The mechanical rotating device 11 is started to control the second vacuum adsorption chuck 5 to rotate to the face-changing position, which is staggered with the vacuum adsorption platform 7, the first vacuum adsorption chuck 4 and the processing material 11, so as to ensure that there is no interference when the second vacuum adsorption chuck 5 is turned over; then the second rotating shaft 8 is started to control the second vacuum adsorption chuck 5 to turn over 180°. At this time, the diamond sheet 6 to be processed is located below the second vacuum adsorption chuck 5.

[0039] 3.3: Adsorb the processed surface of the diamond sheet to be processed on the vacuum adsorption platform The mechanical rotating device 11 is started to control the second vacuum adsorption chuck 5 to rotate toward the vacuum adsorption platform to ensure that the center of the second vacuum adsorption chuck and the center of the vacuum adsorption platform are on the same axis; then the second up-and-down moving hydraulic device 9 is started to control the second vacuum adsorption chuck 5 to rotate and slowly descend. After the vacuum adsorption platform 7 contacts the diamond sheet 6 to be processed, a certain pressure is continued to be applied to ensure that the processed surface of the diamond sheet to be processed is tightly fitted with the vacuum adsorption platform 7, and then the vacuum adsorption platform 7 is opened to make the processed surface of the diamond sheet to be processed completely adsorbed on the vacuum adsorption platform 7; then the numerical control system closes the second vacuum adsorption chuck 5 by controlling the electromagnetic valve, and the processed surface of the diamond sheet to be processed is desorbed from the second vacuum adsorption chuck 5. In this way, the diamond sheet 6 to be processed is always in a stressed state during the process of being transferred from the second vacuum adsorption chuck 5 to the vacuum adsorption platform 7, avoiding the problem of stress deformation of the diamond sheet caused by the replacement process; then the second up-and-down moving hydraulic device 10 and the mechanical rotating device 11 are started in sequence to control the second vacuum adsorption chuck 5 to move away from the vacuum adsorption platform 7.

[0040] Step 4: Process the second side of the diamond sheet to be processed The mobile clamping device is controlled to move along the linear guide rail 1 to the vacuum adsorption platform 7 to ensure that the center of the first rotating shaft and the center of the vacuum adsorption platform are on the same axis; then the first up-and-down moving hydraulic device 2 is started to control the first rotating shaft 3 and the first vacuum adsorption chuck 4 to slowly descend; after the first vacuum adsorption chuck 4 contacts the processed surface of the diamond sheet to be processed, a certain pressure is continued to be applied to ensure that the processed surface of the diamond sheet to be processed is tightly fitted with the first vacuum adsorption chuck 4, and then the first vacuum adsorption chuck 4 is opened to make the processed surface of the diamond sheet to be processed completely adsorbed on the first vacuum adsorption chuck 4; then the vacuum adsorption platform 7 is closed, and the processed surface of the diamond sheet to be processed is desorbed from the vacuum adsorption platform 7, so that the diamond sheet to be processed 6 is always in a stressed state during the process of being transferred from the first vacuum adsorption platform 7 to the first vacuum adsorption chuck 4, avoiding the problem of stress deformation of the diamond sheet caused by the replacement process; then the first up-and-down moving hydraulic device 2 is started to control the first rotating shaft and the first vacuum adsorption chuck to move away from the vacuum adsorption platform.

[0041] The mobile clamping device is controlled to move along the linear guide rail 1 to above the diamond grinding wheel; then the first up-and-down moving hydraulic device 2 is started, and the first rotating shaft 3 is controlled to slowly descend, so that the second side of the diamond sheet to be processed is fitted with the diamond grinding wheel to ensure that all areas of the second side of the diamond sheet to be processed are completely covered by the diamond grinding wheel, and then the diamond grinding wheel and the first rotating shaft 3 are controlled to rotate, and the first up-and-down moving hydraulic device 2 is continued to be controlled to load pressure to process the second side of the diamond sheet to be processed.

[0042] Step 5: Complete the precision machining of both sides of the diamond sheet to be processed and remove the double-sided precision-machined diamond sheet After the processing of the second side of the diamond piece to be tested is completed, the first up-and-down hydraulic device 2 is started to control the first rotating shaft 3 and the first vacuum adsorption chuck 4 to rise; then the mobile clamping device is controlled to move along the linear guide rail 1 to the vacuum adsorption platform 7 to ensure that the center of the first rotating shaft and the center of the vacuum adsorption platform are on the same axis; after starting the first up-and-down hydraulic device 2, the first rotating shaft 3 and the first vacuum adsorption chuck 4 are controlled to slowly descend, and after the double-sided processed diamond piece is in contact with the vacuum adsorption platform 7, the vacuum adsorption of the first vacuum adsorption chuck 4 is turned off; after starting the first up-and-down hydraulic device 2, the first rotating shaft 3 and the first vacuum adsorption chuck 4 are controlled to rise and move away from the vacuum adsorption platform 7; finally, the double-sided processed diamond piece is removed, and the precision processing of both sides of the diamond piece can be completed.

[0043] Therefore, in the diamond double-sided finishing device and method provided by the embodiment of the present invention, during the entire double-sided finishing process, the diamond sheet to be processed is completely attached to the vacuum adsorption chuck by the adsorption force of vacuum adsorption, thereby preventing the deformation of the diamond sheet and avoiding secondary processing problems caused by deformation; after the diamond processing is completed, the adsorption force is removed, the diamond sheet is deformed, and the morphology changes, but the total thickness deviation remains unchanged.

[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the specific implementation methods of the present invention can still be modified or some technical features can be replaced by equivalents without departing from the spirit of the technical solution of the present invention, which should be included in the scope of the technical solution for protection of the present invention.

Claims

1. A double-sided diamond precision machining device, characterized in that: It comprises a vacuum adsorption platform, a guide rail, a mobile clamping device, a processing component, a mechanical flipping device and a numerical control system, wherein the vacuum adsorption platform is used to place and adsorb the diamond sheet to be processed, and the mobile clamping device is installed on the guide rail and can move along the guide rail between the vacuum adsorption platform, the processing component and the mechanical flipping device; The mobile clamping device can make the diamond sheet to be processed move along the guide rail, rotate and move up and down, and includes a first vacuum adsorption chuck that can completely adsorb the processed diamond sheet; The processing component is used to process the diamond sheet to be processed, including a processing material used to process the diamond sheet to be processed; The mechanical flipping device comprises a second vacuum adsorption chuck which can completely adsorb the processed diamond sheet, and the mechanical flipping device can make the diamond sheet to be processed rotate in the horizontal direction, flip itself over and move up and down; The numerical control system is used to control the automatic processing of the diamond sheet to be processed, and the signal output end of the numerical control system is respectively connected to the vacuum adsorption platform, the mobile clamping device, the processing component and the mechanical turning device; When the diamond sheet to be processed is being processed, the numerical control system can control the vacuum adsorption unit between the vacuum adsorption platform, the mobile clamping device and the mechanical flipping assembly to completely adsorb the diamond sheet to be processed according to the processing procedure. When the diamond sheet to be processed is changing the processing procedure, while maintaining the previous processing procedure to completely adsorb one side of the diamond sheet to be processed, the other side of the diamond sheet to be processed that has not been adsorbed by the previous processing procedure is firstly completely and tightly fitted with the vacuum adsorption unit of the next processing procedure, and then the vacuum adsorption unit of the next processing procedure is used to completely adsorb the other side of the diamond sheet to be processed, and then the diamond sheet to be processed is desorbed from the vacuum adsorption unit of the previous processing procedure, wherein the vacuum adsorption unit is the vacuum adsorption platform, the first vacuum adsorption chuck or the second vacuum adsorption chuck.

2. The double-sided diamond precision machining device according to claim 1, characterized in that: Each vacuum adsorption unit in the vacuum adsorption platform, the first vacuum adsorption chuck and the second vacuum adsorption chuck is mainly a vacuum adsorption clamping structure composed of a central ceramic microporous suction cup located in the center and a plurality of annular ceramic microporous suction cups sleeved on the central ceramic microporous suction cup, and each ceramic microporous suction cup is connected to the CNC system through an electromagnetic valve.

3. The double-sided diamond precision machining device according to claim 1, characterized in that: The mobile clamping device also includes a first up and down moving hydraulic device and a first rotating shaft, wherein the first vacuum adsorption chuck is installed on the first rotating shaft, the first up and down moving hydraulic device, the first rotating shaft and the first vacuum adsorption chuck are arranged in sequence from top to bottom, and the first up and down moving hydraulic device drives the first rotating shaft to carry the first vacuum adsorption chuck to move up and down or rotate.

4. The double-sided diamond precision machining device according to claim 1, characterized in that: The mechanical flipping device also includes a second rotating shaft, a second up and down moving hydraulic device and a mechanical rotating device. The second vacuum adsorption chuck is fixed on the second rotating shaft and can be flipped 180° back and forth with the second rotating shaft itself; the second rotating shaft is installed on one end of the second up and down moving hydraulic device, and can drive the second rotating shaft to move up and down and rotate; the other end of the second up and down moving hydraulic device is installed on the mechanical rotating device, and can drive the second vacuum adsorption chuck to rotate as a whole with the second up and down moving hydraulic device and the second rotating shaft.

5. The double-sided diamond precision machining device according to claim 1, characterized in that: The processing part is a grinding processing part or a polishing processing part.

6. A diamond double-sided precision machining method, using the diamond double-sided precision machining device according to any one of claims 1 to 5 to perform double-sided machining on a diamond sheet to be machined, comprising the following steps: Processing the first surface: firstly controlling the mobile clamping device to vacuum adsorb the second surface of the diamond sheet to be processed, and then controlling the diamond sheet to be processed to move along the guide rail to the processing component with the mobile clamping device, and processing the first surface of the diamond sheet to be processed; Automatic flipping: while maintaining the first vacuum adsorption chuck to tightly adsorb the second side of the diamond sheet to be processed, firstly closely fit the first side of the diamond sheet to be processed that has been processed with the second vacuum adsorption chuck, then control the second vacuum adsorption chuck to adsorb the first side of the diamond sheet to be processed, then desorb the diamond sheet to be processed from the first vacuum adsorption chuck to expose the unprocessed second side of the diamond sheet to be processed, then control the diamond sheet to be processed on the second vacuum adsorption chuck to first rotate with the mechanical rotating device to the position where it is offset from the first vacuum adsorption chuck, and then flip 180° with the second rotating axis, so that the diamond sheet to be processed is located below the second vacuum adsorption chuck, and the flipping of the diamond sheet to be processed is completed; Processing the second surface: first control the second vacuum adsorption chuck that adsorbs the turned-over diamond sheet to be processed to be located above the vacuum adsorption platform, then tightly fit the second surface of the diamond sheet to be processed with the vacuum adsorption platform, then control the vacuum adsorption platform to adsorb the second surface of the diamond sheet to be processed, and then desorb the first surface of the diamond sheet to be processed from the second vacuum adsorption chuck; then repeat the steps of processing the first surface, control the mobile clamping device to first vacuum adsorb the processed first surface of the diamond sheet to be processed, and then move to the processing component to process the second surface of the diamond sheet to be processed.

7. The double-sided precision machining method of diamond according to claim 6, characterized in that: The method further includes the steps of preparing and placing the diamond sheet to be processed: placing the clean diamond sheet to be processed on the vacuum adsorption platform, and completely adsorbing the first surface of the diamond sheet to be processed on the vacuum adsorption platform; The step of processing the first surface includes: first controlling the mobile clamping device to move along the guide rail to the vacuum adsorption platform, then controlling the first rotating shaft and the first vacuum adsorption chuck to descend along with the first up-and-down hydraulic device until the first vacuum adsorption chuck is completely and tightly attached to the second surface of the diamond sheet to be processed, then starting the first vacuum adsorption chuck to completely adsorb the second surface of the diamond sheet to be processed, and then separating the first surface of the diamond sheet to be processed from the vacuum adsorption platform; First, the mobile clamping device is controlled to move along the guide rail to above the processing component; then, the first rotating spindle is controlled to descend by controlling the first up and down moving hydraulic device, so that the first surface of the diamond sheet to be processed is completely covered by the processing material, and then the first surface of the diamond sheet to be processed is processed until the processing of the first surface is completed.

8. The double-sided precision machining method of diamond according to claim 7, characterized in that: In the automatic flipping step, after the diamond sheet to be processed is detached from the first vacuum adsorption chuck, the mechanical rotation device is driven to first control the second vacuum adsorption chuck to rotate 90° toward the vacuum adsorption platform to the second vacuum adsorption chuck rotation and face-changing position, and then control the diamond sheet to be processed on the second vacuum adsorption chuck to flip 180° along the second rotation axis, so that the diamond sheet to be processed is located below the second vacuum adsorption chuck.

9. The double-sided precision machining method of diamond according to claim 8, characterized in that: The step of processing the second surface includes starting the mechanical rotating device to control the second vacuum adsorption chuck to rotate toward the vacuum adsorption platform, so that the center of the second vacuum adsorption chuck and the center of the vacuum adsorption platform are on the same axis; then starting the second up-and-down hydraulic device to control the second vacuum adsorption chuck to rotate and descend until the unprocessed second surface of the diamond sheet to be processed is tightly attached to the vacuum adsorption platform, and then controlling the vacuum adsorption platform to vacuum adsorb the unprocessed second surface of the diamond sheet to be processed; then desorbing the processed first surface of the diamond sheet to be processed from the second vacuum adsorption chuck, and controlling the second vacuum adsorption chuck to move away from the vacuum adsorption platform; Repeat the steps of processing the first surface, and control the mobile clamping device to vacuum absorb the processed first surface of the diamond sheet to be processed, then move the diamond sheet to be processed to the processing component, and process the unprocessed second surface of the diamond sheet to be processed until the processing of the second surface is completed, completing the precision processing of both surfaces of the diamond sheet to be processed, and removing the diamond sheet with precision processing on both surfaces.

10. The diamond double-sided precision machining method according to claim 9, characterized in that: The step of removing the diamond sheet with precision machining on both sides includes first controlling the mobile clamping device to carry the diamond sheet with precision machining on both sides and move along the guide rail to the vacuum adsorption platform, then placing the diamond sheet with precision machining on both sides on the vacuum adsorption platform, and removing the diamond sheet with precision machining on both sides from the vacuum adsorption platform.

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