Surface treatment method for glass-based electronic substrate

Abstract

The invention is applicable to the technical field of surface treatment, and provides a glass-based electronic substrate surface treatment method which comprises the following steps: performing oil removal and charge adjustment treatment on a glass-based electronic substrate at the temperature of 30-60 DEG C; the glass-based electronic substrate is subjected to five-stage countercurrent DI water washing treatment at the temperature of 10-40 DEG C; carrying out conductive layer deposition treatment on the glass-based electronic substrate by utilizing a two-dimensional nano material solvent at the temperature of 20-30 DEG C; the glass-based electronic substrate is dried at the temperature of 80-100 DEG C; and the linear speed of each process is 2-4M / min. According to the method, the defects of high cost and high pollution of a traditional process are overcome, the deposition process duration is only 3-8 min, the formed film layer has the characteristics of acid resistance, alkali resistance and high temperature resistance, the binding force is high, the quality is more stable, main materials can be recycled, the product reliability and preparation efficiency are greatly improved, and the method is suitable for industrial production. And the original vacuum magnetron sputtering copper or chemical copper process is effectively replaced.

Description

Technical Field

[0001] The present application belongs to the field of surface treatment technology, and in particular relates to a method for conducting the surface and holes of a glass-based electronic substrate. Background Art

[0002] Glass-based products have the characteristics of low expansion and contraction. Therefore, the application fields of subsequent high-end carriers and flip-chip products will be very wide. At present, such products all use sputtering copper process and chemical copper process to realize the conductive process of hole metallization and surface copper metallization. Among them, the chemical copper process mainly involves alkaline whole-hole degreasing, three-stage countercurrent water washing, micro-etching, two-stage countercurrent water washing, pre-impregnation, activation, chemical copper plating and other processes; while the flash plating process mainly involves acid degreasing, acid pre-impregnation, copper sulfate electroplating and other processes; the target material of the sputtering process is expensive and the cost is high, and it mainly involves cleaning the base material, evaporating the bottom layer, creating a vacuum environment, cold trap cooling, argon injection, sputtering and other processes; graphic transfer mainly involves substrate surface cleaning, film pasting, alignment exposure, development and other processes; the flash etching process mainly involves selective nickel-gold plating, film stripping, two-stage countercurrent water washing, flash etching and other processes.

[0003] The chemical copper process is a catalytic redox reaction, which will produce more by-products. The vertical copper deposition process takes 60-90 minutes, and the horizontal copper deposition process takes 30-50 minutes. It has the problems of long process, low efficiency, severe environmental pollution, acid and alkali resistance, oxidation resistance, and a certain service life of the main material. The sputtering copper process is to sputter a copper film layer after evaporation treatment, and the process takes 20-30 minutes. It has the problems of high cost, long process, low efficiency, severe environmental pollution, acid and alkali resistance, oxidation resistance, and the target material cannot be recycled.

[0004] It can be seen that the above-mentioned substrate surface treatment methods generally have problems such as long process, low efficiency, acid and alkali resistance, oxidation resistance, serious environmental pollution, and low yield rate. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a glass-based electronic substrate surface treatment method, aiming to solve the problems of existing substrate surface treatment methods such as long process, low efficiency, acid and alkali resistance, oxidation resistance, severe environmental pollution, and low yield.

[0006] The embodiment of the present application is implemented as follows: a method for treating the surface of a glass-based electronic substrate, comprising:

[0007] The glass-based electronic substrate is degreased and charged by using a degreasing and charge adjusting agent, the temperature is 30-60°C, and the line speed is 2-4M / min;

[0008] The glass-based electronic substrate is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 10 to 40° C., a water change frequency conductivity of 1 to 10 S / m, a water flow rate of 5 to 30 L / min, and a line speed of 2 to 4 M / min;

[0009] The conductive layer is deposited on the glass-based electronic substrate using a two-dimensional nanomaterial solvent at a temperature of 20 to 30° C., a water jet pressure of 5 to 30 kg, and a line speed of 2 to 4 m / min;

[0010] The glass-based electronic substrate is dried at a temperature of 80 to 100° C. and a line speed of 2 to 4 M / min.

[0011] Preferably, the two-dimensional nanomaterial solvent is prepared by mixing two-dimensional nanomaterial, dispersant, stabilizer, film-forming agent, organic solvent or water.

[0012] Preferably, the pH value of the two-dimensional nanomaterial solvent is 2-9, and the solid content is 0.01-1%.

[0013] Preferably, the two-dimensional nanomaterial is a sheet structure with a thickness of 10 to 100 nm.

[0014] Preferably, the concentration of the degreasing and charge adjusting agent is 1-10%, the pH value is 10-14, the alkali equivalent is 0.01-0.25N, and the service life is 15-25mg / L copper content.

[0015] Preferably, the surface treatment method of the glass-based electronic substrate further comprises:

[0016] Using plasma or ultrasound to remove the excess conductive layer on the surface of the glass-based electronic substrate;

[0017] The glass-based electronic substrate with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing treatment and a drying treatment.

[0018] The surface treatment method for a glass-based electronic substrate provided in the embodiment of the present application innovatively proposes a two-dimensional nanomaterial surface treatment and conductive layer deposition technology. Based on the high conductivity, high thermal conductivity, wear resistance and strong bonding strength between the two-dimensional nanomaterial surface treatment and the glass, the high cost and high pollution of the traditional process of the product are solved from the perspectives of process, cost and environmental protection. The deposition process of the two-dimensional nanomaterial takes only 3-8 minutes. The formed two-dimensional nanomaterial film layer has acid resistance, alkali resistance and high temperature resistance, strong bonding strength, more stable quality, and the main material can be recycled, which greatly improves the reliability and preparation efficiency of the product and effectively replaces the original vacuum magnetron sputtering copper or chemical copper process. The present application solves the process improvements and upgrades related to electronic products such as the bonding strength of the product on the glass, the circuit preparation and the conductivity of the holes, and can be applied to the manufacturing products of the CORE layer of the FCBGA of the high-end IC carrier and the preparation field of the circuit and hole conductivity of glass-based PCBs such as mini backlights and glass LCDs. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the present application more clear, the present application is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

[0020] The present invention provides a method for treating the surface of a glass-based electronic substrate, comprising the following steps:

[0021] The glass-based electronic substrate after hole trimming is degreased and charge adjusted using a degreasing and charge adjusting agent at a temperature of 30 to 60°C and a line speed of 2 to 4 M / min (the workpiece operation time is approximately 1 to 3 minutes);

[0022] The glass-based electronic substrate is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 10-40° C., a water change frequency conductivity of 1-10 S / m, a water flow rate of 5-30 L / min, and a line speed of 2-4 M / min (the operation time of the workpiece is about 2-6 minutes);

[0023] The conductive layer is deposited on the glass-based electronic substrate using a two-dimensional nanomaterial solvent at a temperature of 20 to 30° C., a water jet pressure of 5 to 30 kg, and a line speed of 2 to 4 m / min (the operation time of the workpiece is about 3 to 8 minutes);

[0024] The glass-based electronic substrate is dried at a temperature of 80-100° C. and a line speed of 2-4 M / min (the operation time of the workpiece is about 1-4 minutes).

[0025] Among them, the process of depositing a conductive layer on the surface of the above-mentioned two-dimensional nanomaterial includes oil removal and charge adjustment treatment, five-stage countercurrent DI water washing treatment, conductive layer deposition treatment and drying treatment, which can be implemented based on existing equipment on the market. For example, the equipment can be the TGM-GPCB-V-000 horizontal two-dimensional nanomaterial surface treatment processing and production equipment manufactured by Symene Gold, Julong, Dongwei, and Universe.

[0026] In the embodiment of the present application, the time for degreasing and charge adjustment of the glass-based electronic substrate using the degreasing and charge adjustment agent is 1-3 minutes, and the corresponding equipment line speed parameter is 2-4M / min. The main function of this process is to remove the contamination on the surface of the glass-based electronic substrate and adjust the charge, so that the adsorption of the subsequent two-dimensional nanomaterial surface treatment is more firm. The subsequent five-stage countercurrent DI water washing treatment of the glass-based electronic substrate is mainly to clean the excess degreasing and charge adjustment agent to avoid residual contamination of the subsequent process solution.

[0027] The concentration of the degreasing and charge adjusting agent is 1-10%, the pH value is 10-14, the alkali equivalent is 0.01-0.25N, and the service life is 15-25mg / L copper content. The degreasing and charge adjusting agent can be TGM-GPCB-001 model product purchased from Symene Gold.

[0028] In the embodiment of the present application, the process of depositing a conductive layer on the glass-based electronic substrate using a two-dimensional nanomaterial solvent is a key core process, which replaces the flash plating process in the traditional process.

[0029] The two-dimensional nanomaterial solvent is prepared by mixing two-dimensional nanomaterial, dispersant, stabilizer, film-forming agent, organic solvent or water. The pH value of the two-dimensional nanomaterial solvent is 2-9, and the solid content is 0.01-1%.

[0030] Preferably, the two-dimensional nanomaterial solvent comprises the following components in percentage by mass: 0.01-0.5% of two-dimensional nanomaterial, 0.001-0.05% of dispersant, 1-5% of stabilizer, 1-5% of film-forming agent, and 90-95% of organic solvent or water.

[0031] The two-dimensional nanomaterial is a sheet structure with a thickness of 10 to 100 nm, and a deposited film with excellent conductivity and bonding strength is completed through the action of static electricity, molecular forces, etc. The two-dimensional nanomaterial can be one or more of nanometal materials, nanocarbon particles, nanographene sheets, graphene quantum dots, carbon nanotubes, etc. The nanometal material can be nanogold, nanopalladium, etc.

[0032] The dispersant may be a small molecule or a macromolecular compound, such as one or more components of ANP, PVL, PVP, CMC, etc.

[0033] The stabilizer may be a chemical with a certain ion balance ability including electrolytes or surfactants, such as one or more components of organic amines, ammonia water, sodium hydroxide, potassium hydroxide, sulfuric acid or quaternary ammonium salt surfactants, phosphate surfactants, etc.

[0034] The film former may be an organic molecule that is sensitive to pH and heat, such as one or more components of polyvinyl acetate, polyacrylate emulsion, hyaluronic acid, acrylate / octyl ammonium acrylate copolymer, polyvinyl pyrrolidone, polyvinyl alcohol, acrylic acid copolymer, etc.

[0035] The organic solvent may be one or more of alcohols such as DMF, methylformamide, ethanol, methanol, and ethers such as methyl ether, ethyl ether, and methyl ethyl ether.

[0036] In the embodiment of the present application, in the step of drying the glass-based electronic substrate, the temperature is 80-100°C, the air knife pressure is 300-1000 pa, and the line speed is 2-4 M / min. The main function of this drying process is to fix the conductive layer formed by the surface treatment and deposition of the two-dimensional nanomaterial and remove moisture.

[0037] Furthermore, when an excess conductive layer that does not require a circuit pattern is deposited on a glass-based electronic substrate, the excess conductive layer needs to be removed. Therefore, the surface treatment method of the glass-based electronic substrate also includes: using plasma or ultrasound to remove the excess conductive layer on the surface of the glass-based electronic substrate that does not require a circuit pattern; and performing a five-stage countercurrent DI water washing treatment and a drying treatment on the glass-based electronic substrate with the excess conductive layer removed.

[0038] Among them, the equipment used to remove the excess conductive layer can be the TGM-GPCB-V-000 horizontal ultrasonic cleaning equipment manufactured by Symene Gold, Julong, Dongwei, and Universe, or the vacuum plasma cleaning equipment of brands such as Chengfengzhi model CRF-VP0-8L-M and Jinbolilai VP120L.

[0039] In the embodiment of the present application, in the step of using plasma to remove the excess conductive layer on the surface of the glass-based electronic substrate that does not require the circuit pattern, the equipment power is 600-1000W, the vacuum degree is -75--30KPa, the temperature is 80-200°C, and the time is 60-120s. In the step of using ultrasound to remove the excess conductive layer on the surface of the glass-based electronic substrate, the equipment power is 300-1000W, the frequency is 20-60 Hz, the concentration of the solution is 2-10%, the temperature is 25-45°C, the pH value is 9-15, and the line speed is 2-4M / min (the operation time of the workpiece is about 3-6min). This process replaces the flash etching process in the traditional process.

[0040] In the ultrasonic treatment process, the liquid medicine used can be the TGM-GPCB-003 product purchased from Symene Gold.

[0041] Among them, the process parameters for the five-stage countercurrent DI water washing and drying treatment of the glass-based electronic substrate to remove the excess conductive layer of the unnecessary circuit pattern are consistent with the above, specifically: the glass-based electronic substrate is subjected to a five-stage countercurrent DI water washing treatment, the temperature is 10-40°C, the water change frequency conductivity is 1-10S / m, the water flow rate is 5-30L / min, and the line speed is 2-4M / min (the working time of the workpiece is about 3-6min). The glass-based electronic substrate is dried at a temperature of 80-100°C, the wind knife pressure is 300-1000pa, and the line speed is 2-4M / min (the working time of the workpiece is about 2-4min). This process is to clean the surface of the glass-based carrier and ensure that the carrier will not be oxidized due to moisture.

[0042] The following is a detailed description of the surface treatment method of the glass-based electronic substrate of the present application with specific examples, as shown below. The experimental methods used in the following examples are conventional methods unless otherwise specified; the materials, reagents, etc. used are all commercially available unless otherwise specified.

[0043] Equipment used: TGM-GPCB-V-000 horizontal two-dimensional nano new material surface treatment processing equipment, TGM-GPCB-V-000 horizontal ultrasonic cleaning equipment, Jinbo Lilai VP120L vacuum plasma cleaning equipment

[0044] Reagents used: degreasing and charge adjusting agent (model: TGM-GPCB-001), ultrasonic agent (model: TGM-GPCB-003).

[0045] Example 1: Conductive treatment method for the surface and holes of glass-based electronic substrate

[0046] Preparation of two-dimensional nanomaterial solvent: weigh the raw materials according to the following mass percentages and mix them evenly to obtain a two-dimensional nanomaterial solvent: 0.01% nanographene sheet, 0.01% ANP dispersant, 1% ammonia water, 5% polyvinyl acetate, and 93.98% DMF.

[0047] The selected workpiece has a size of 510*410mm, a thickness of 0.7mm, a pore size of 80um, and a total of 20,000 holes evenly distributed on the flat glass material.

[0048] Process 1: Degreasing and charge adjusting agent is used to degrease and charge adjust the glass-based electronic substrate at a temperature of 40°C, a line speed of 3M / min, and a time of 1min; the concentration of the degreasing and charge adjusting agent is 3%, the pH value is 11, the alkali equivalent is 0.06N, and the service life is 20mg / L of copper content.

[0049] Step 2: The glass-based electronic substrate is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 25° C., a water change frequency of 3S / m, a water flow rate of 10 L / min, a line speed of 3 M / min, and a time of 2 min.

[0050] Step 3: Depositing a conductive layer on the glass-based electronic substrate using a two-dimensional nanomaterial solvent at a temperature of 30° C., a water jet pressure of 10 kg, a line speed of 3 M / min, and a time of 6 min. The pH value of the two-dimensional nanomaterial solvent is 7, and the solid content is 0.05%.

[0051] Step 4: drying the glass-based electronic substrate at a temperature of 90° C., a wind knife pressure of 500 Pa, a line speed of 3 M / min, and a time of 2 min.

[0052] Example 2: Conductive treatment method for the surface and holes of glass-based electronic substrate

[0053] Preparation of two-dimensional nanomaterial solvent: weigh the raw materials according to the following mass percentages and mix them evenly, graphene quantum dots 0.05%, PVL dispersant 0.02%, sodium hydroxide 2%, polyacrylate emulsion 4%, methylformamide 94.93%.

[0054] The selected workpiece has a size of 510*410mm, a thickness of 0.7mm, a pore size of 80um, and a total of 20,000 holes evenly distributed on the flat glass material.

[0055] Process 1: Degreasing and charge adjusting agent is used to degrease and charge adjust the glass-based electronic substrate at a temperature of 30°C, a line speed of 2M / min, and a time of 2min; the concentration of the degreasing and charge adjusting agent is 2%, the pH value is 10, the alkali equivalent is 0.04N, and the service life is 15mg / L of copper content.

[0056] Step 2: The glass-based electronic substrate is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 30° C., a water change frequency of 4S / m, a water flow rate of 15L / min, a line speed of 2M / min, and a time of 4min.

[0057] Step 3: Depositing a conductive layer on the glass-based electronic substrate using a two-dimensional nanomaterial solvent at a temperature of 30° C., a water jet pressure of 20 kg, a line speed of 2 M / min, and a time of 8 min. The two-dimensional nanomaterial solvent has a pH value of 6 and a solid content of 0.03%.

[0058] Step 4: drying the glass-based electronic substrate at a temperature of 100° C., a wind knife pressure of 600 Pa, a line speed of 2 M / min, and a time of 4 min.

[0059] Example 3: Conductive treatment method for the surface and holes of glass-based electronic substrate

[0060] Preparation of two-dimensional nanomaterial solvent: weigh the raw materials according to the following mass percentages and mix them evenly: 0.1% carbon nanotubes, 0.03% CMC dispersant, 3% potassium hydroxide, 3% hyaluronic acid, and 94.87% ethanol.

[0061] The selected workpiece has a size of 510*410mm, a thickness of 0.7mm, a pore size of 50um, and a total of 20,000 holes evenly distributed on the flat glass material.

[0062] Process 1: Degreasing and charge adjusting agent is used to degrease and charge adjust the glass-based electronic substrate at a temperature of 50°C, a line speed of 4M / min, and a time of 1min; the concentration of the degreasing and charge adjusting agent is 1%, the pH value is 10, the alkali equivalent is 0.02N, and the service life is 15mg / L of copper content.

[0063] Step 2: The glass-based electronic substrate is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 30° C., a water change frequency of 3S / m, a water flow rate of 10 L / min, a line speed of 4 M / min, and a time of 2 min.

[0064] Step 3: Depositing a conductive layer on the glass-based electronic substrate using a two-dimensional nanomaterial solvent at a temperature of 30° C., a water jet pressure of 20 kg, a line speed of 4 M / min, and a time of 4 min. The two-dimensional nanomaterial solvent has a pH value of 7 and a solid content of 0.08%.

[0065] Step 4: drying the glass-based electronic substrate at a temperature of 100° C., a wind knife pressure of 900 pa, a line speed of 4 M / min, and a time of 2 min.

[0066] Example 4: Conductive treatment method for the surface and holes of glass-based electronic substrate

[0067] Preparation of two-dimensional nanomaterial solvent: weigh the raw materials according to the following mass percentages and mix them evenly: 0.2% nanocarbon particles, 0.04% PVP dispersant, 4% quaternary ammonium salt surfactant, 2% polyvinyl alcohol, and 94.76% water.

[0068] The selected workpiece has a specification size of 510*410mm, a thickness of 0.3mm, a pore size of 50um, and a total of 20,000 holes evenly distributed on the flat glass material.

[0069] Process 1: Degreasing and charge adjusting agent is used to degrease and charge adjust the glass-based electronic substrate at a temperature of 40°C, a line speed of 3M / min, and a time of 1.5min; the concentration of the degreasing and charge adjusting agent is 3%, the pH value is 12, the alkali equivalent is 0.02N, and the service life is 15mg / L of copper content.

[0070] Step 2: The glass-based electronic substrate is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 30° C., a water change frequency of 4S / m, a water flow rate of 8L / min, a line speed of 3M / min, and a time of 3min.

[0071] Step 3: Depositing a conductive layer on the glass-based electronic substrate using a two-dimensional nanomaterial solvent at a temperature of 30° C., a water jet pressure of 15 kg, a line speed of 3 M / min, and a time of 6 min. The two-dimensional nanomaterial solvent has a pH value of 8 and a solid content of 0.06%.

[0072] Step 4: drying the glass-based electronic substrate at a temperature of 90° C., a wind knife pressure of 500 Pa, a line speed of 3 M / min, and a time of 2 min.

[0073] Example 5: Conductive treatment method for the surface and holes of glass-based electronic substrate

[0074] Preparation of two-dimensional nanomaterial solvent: weigh the raw materials according to the following mass percentages and mix them evenly: 0.4% of nanographene sheets, 0.05% of ANP dispersant, 5% of potassium hydroxide, 2% of polyvinyl acetate, and 93.55% of ethanol.

[0075] The selected workpiece has a size of 510*410mm, a thickness of 0.3mm, a pore size of 30um, and a total of 20,000 holes evenly distributed on the flat glass material.

[0076] Process 1: Degreasing and charge adjusting agent is used to degrease and charge adjust the glass-based electronic substrate at a temperature of 50°C, a line speed of 2.5 M / min, and a time of 1 min; the concentration of the degreasing and charge adjusting agent is 6%, the pH value is 13, the alkali equivalent is 0.022N, and the service life is 15 mg / L of copper content.

[0077] Step 2: The glass-based electronic substrate is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 30° C., a water change frequency of 6S / m, a water flow rate of 6L / min, a line speed of 2.5M / min, and a time of 2.5min.

[0078] Step 3: Depositing a conductive layer on the glass-based electronic substrate using a two-dimensional nanomaterial solvent at a temperature of 25° C., a water jet pressure of 25 kg, a line speed of 2.5 M / min, and a time of 6 min. The two-dimensional nanomaterial solvent has a pH value of 6 and a solid content of 0.04%.

[0079] Step 4: drying the glass-based electronic substrate at a temperature of 90° C., a wind knife pressure of 900 pa, a line speed of 2.5 M / min, and a time of 2 min.

[0080] Using test pieces (the test pieces are 60*100mm FR-4 insulating board materials), the two-dimensional nanomaterial surface treatment layer was deposited according to the process of the above Examples 1-5. The resistance values ​​of the long sides of 100mm of the produced test pieces were measured to be between 100Ω and 1000Ω, indicating that the surface treatment deposition effect of the two-dimensional nanomaterial in Examples 1-5 is good.

[0081] Furthermore, the glass-based electronic substrates obtained by processing in Examples 1-5 were subjected to acid resistance, alkali resistance, carbonic acid solution resistance, oxidation resistance and tensile test, and the test results are shown in Table 1 below:

[0082] Table 1

[0083]

[0084] Embodiment 6: Method for removing unnecessary conductive layer on the surface of glass-based electronic substrate

[0085] Step 1: using plasma to remove the unnecessary conductive layer on the surface of the glass-based electronic substrate obtained by the treatment in Example 1, the equipment power is 600W, the vacuum degree is -75KPa, the temperature is 90°C, and the time is 120s;

[0086] Step 2: The glass-based electronic substrate with the excess conductive layer removed was subjected to a five-stage countercurrent DI water washing treatment at a temperature of 20°C, a water change frequency of 5S / m, a water flow rate of 10L / min, a line speed of 2M / min, and a time of 4min;

[0087] Step 3: Dry the glass-based electronic substrate after water washing at a temperature of 90° C., a wind knife pressure of 600 pa, a line speed of 2 M / min, and a time of 2 min.

[0088] Example 7

[0089] Step 1: using ultrasonic waves to remove the unnecessary conductive layer on the surface of the glass-based electronic substrate obtained in Example 2, the power of the equipment is 500 W, the frequency is 40 Hz, the concentration of the solution is 5%, the temperature is 30° C., the pH value is 11, the line speed is 3 M / min, and the time is 3 min;

[0090] Step 2: The glass-based electronic substrate with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing treatment, the temperature is 25°C, the water change frequency conductivity is 2S / m, the water flow rate is 5L / min, the line speed is 3M / min, and the time is 3min;

[0091] Process 3: Drying the glass-based electronic substrate after water washing at a temperature of 100° C., a wind knife pressure of 700 pa, a line speed of 3 M / min, and a time of 2 min.

[0092] Example 8

[0093] Step 1: using plasma to remove the unnecessary conductive layer on the surface of the glass-based electronic substrate obtained by the treatment in Example 3, the equipment power is 800W, the vacuum degree is -60KPa, the temperature is 120°C, and the time is 100s;

[0094] Step 2: The glass-based electronic substrate with the excess conductive layer removed was subjected to a five-stage countercurrent DI water washing treatment at a temperature of 30°C, a water change frequency of 3S / m, a water flow rate of 10L / min, a line speed of 2.5M / min, and a time of 4min;

[0095] Step 3: Dry the glass-based electronic substrate after water washing at a temperature of 100° C., a wind knife pressure of 500 pa, a line speed of 2.5 M / min, and a time of 2.5 min.

[0096] Example 9

[0097] Step 1: using ultrasonic waves to remove the unnecessary conductive layer on the surface of the glass-based electronic substrate obtained by the treatment in Example 4, the equipment power is 900 W, the frequency is 50 Hz, the concentration of the solution is 6%, the temperature is 40° C., the pH value is 11, the line speed is 3 M / min, and the time is 3 min;

[0098] Step 2: The glass-based electronic substrate with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 30°C, a water change frequency of 2S / m, a water flow rate of 8L / min, a line speed of 3M / min, and a time of 3min;

[0099] Step 3: Dry the glass-based electronic substrate after water washing at a temperature of 95° C., a wind knife pressure of 700 pa, a line speed of 3 M / min, and a time of 1.5 min.

[0100] Example 10

[0101] Step 1: using plasma to remove the unnecessary conductive layer on the surface of the glass-based electronic substrate obtained by the treatment in Example 5, the equipment power is 700W, the vacuum degree is -60KPa, the temperature is 150°C, and the time is 80s;

[0102] Step 2: The glass-based electronic substrate with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 35°C, a water change frequency of 5S / m, a water flow rate of 10L / min, a line speed of 4M / min, and a time of 2min;

[0103] Process 3: Drying the glass-based electronic substrate after water washing at a temperature of 100° C., a wind knife pressure of 900 pa, a line speed of 4 M / min, and a time of 1 min.

[0104] A qualified deposition test piece for detecting the surface treatment effect of the new two-dimensional nanomaterial (the test piece is a 60*100mm FR-4 insulating board material) was used to remove the excess two-dimensional nanomaterial layer that did not require the pattern according to the process of the above Examples 6-10. The resistance values ​​of the long sides of 100mm produced by the test pieces were all infinite, indicating that Examples 6-10 had completely removed the excess conductive layer.

[0105] In summary, the two-dimensional nanomaterial surface treatment technology provided in the embodiments of the present application abandons the flash plating and flash etching processes, effectively reduces environmental pollution and simplifies the process, while saving copper and water resources and improving product reliability and quality.

[0106] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

[0107] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for treating the surface of a glass-based electronic substrate, characterized in that: include: The glass-based electronic substrate is degreased and charged by using a degreasing and charge adjusting agent, the temperature is 30-60°C, and the line speed is 2-4M / min; The glass-based electronic substrate is subjected to a five-stage countercurrent DI water washing treatment at a temperature of 10 to 40° C., a water change frequency conductivity of 1 to 10 S / m, a water flow rate of 5 to 30 L / min, and a line speed of 2 to 4 M / min; The conductive layer is deposited on the glass-based electronic substrate using a two-dimensional nanomaterial solvent at a temperature of 20 to 30° C., a water jet pressure of 5 to 30 kg, and a line speed of 2 to 4 m / min; The glass-based electronic substrate is dried at a temperature of 80 to 100° C. and a line speed of 2 to 4 M / min.

2. The surface treatment method of a glass-based electronic substrate according to claim 1, characterized in that: The two-dimensional nanomaterial solvent is prepared by compounding the two-dimensional nanomaterial, a dispersant, a stabilizer, a film-forming agent, an organic solvent or water.

3. The surface treatment method of a glass-based electronic substrate according to claim 2, characterized in that: The pH value of the two-dimensional nano material solvent is 2-9, and the solid content is 0.01-1%.

4. The method for treating the surface of a glass-based electronic substrate according to claim 2 or 3, characterized in that: The two-dimensional nanomaterial solvent includes the following components in percentage by mass: Two-dimensional nanomaterial 0.01-0.5%, dispersant 0.001-0.05%, stabilizer 1-5%, film-forming agent 1-5%, organic solvent or water 90-95%.

5. The method for treating the surface of a glass-based electronic substrate according to claim 2 or 3, characterized in that: The two-dimensional nanomaterial is a sheet structure with a thickness of 10 to 100 nm.

6. The method for treating the surface of a glass-based electronic substrate according to claim 2 or 3, characterized in that: The two-dimensional nanomaterial is one or more of nanometal materials, nanocarbon particles, nanographene sheets, graphene quantum dots, and carbon nanotubes; The dispersant is one or more of ANP, PVL, PVP and CMC; The stabilizer is one or more of organic amine, ammonia water, sodium hydroxide, potassium hydroxide, sulfuric acid, quaternary ammonium salt surfactant, and phosphate surfactant; The film-forming agent is one or more of polyvinyl acetate, polyacrylate emulsion, hyaluronic acid, acrylate / octyl ammonium acrylate copolymer, polyvinyl pyrrolidone, polyvinyl alcohol, and acrylic acid copolymer; The organic solvent is one or more of DMF, methylformamide, ethanol, methanol, methyl ether, ethyl ether, and methyl ethyl ether.

7. The method for treating the surface of a glass-based electronic substrate according to claim 1, characterized in that: The concentration of the degreasing and charge adjusting agent is 1-10%, the pH value is 10-14, the alkali equivalent is 0.01-0.25N, and the service life is 15-25mg / L of copper content.

8. The method for treating the surface of a glass-based electronic substrate according to claim 1, characterized in that: In the step of drying the glass-based electronic substrate, the air knife pressure is 300-1000 Pa.

9. The method for treating the surface of a glass-based electronic substrate according to claim 1, characterized in that: Also includes: Using plasma or ultrasonic waves to remove the redundant conductive layer on the surface of the glass-based electronic substrate where no circuit pattern is needed; The glass-based electronic substrate with the excess conductive layer removed is subjected to a five-stage countercurrent DI water washing treatment and a drying treatment.

10. The method for treating the surface of a glass-based electronic substrate according to claim 8, characterized in that: In the step of removing the excess conductive layer on the surface of the glass-based electronic substrate by plasma, the equipment power is 600 to 1000 W, the vacuum degree is -75 to -30 KPa, the temperature is 80 to 200 ° C, and the time is 60 to 120 seconds; In the step of using ultrasound to remove the excess conductive layer on the surface of the glass-based electronic substrate, the equipment power is 300-1000W, the frequency is 20-60 Hz, the concentration of the solution is 2-10%, the temperature is 25-45°C, the pH value is 9-15, and the line speed is 2-4M / min.

Images