Thin-wall ceramic bearing disc machining method

Abstract

The invention discloses a thin-wall ceramic bearing disc machining method which comprises the following steps: S1, performing compression molding on ceramic granulation powder to form a molded part; s2, rough machining is conducted on the formed part, the annular segment difference is increased in the area where the thin wall needs to be formed, and a rough machined part is formed; s3, the rough machining part is sintered, and a sintered part is formed; s4, the sintered part is ground, the annular segment difference is removed, and a machined part is formed; and S5, the bottom of the machined part is ground, a thin wall is machined, and a finished part is formed. According to the thin-wall ceramic bearing disc machining method, the structural strength of the thin-wall ceramic bearing disc can be improved, the production qualification rate of products can be increased, the risks of cracking, deformation and edge breakage are reduced, and the machining cost is saved.

Description

Technical Field

[0001] The present invention relates to the field of ceramic technology, and in particular to a method for processing a thin-walled ceramic carrier plate. Background Art

[0002] Ceramic carrier plates are mostly thin-walled discs due to their thermal conductivity. The traditional production process reserves a lot of margin during the rough processing of the green body, and the ceramic carrier plate characteristics are refined after sintering. The ceramic carrier plate has thin walls and is prone to cracks during sintering and processing. This processing method takes a long time to process, has low production efficiency, and has high production costs.

[0003] For example, the publication number "TW202002002A" discloses "a showerhead structure and a manufacturing method of a porous ceramic disc thereof", wherein the showerhead structure comprises: a base and a porous ceramic disc; the manufacturing method of the porous ceramic disc comprises a material preparation step, a mixing step, a granulation step, a pressing step, a degreasing step, a sintering step and a grinding step. However, in actual applications, when it is necessary to manufacture a thin-walled ceramic disc with a small thickness, due to the thin wall thickness, during sintering shrinkage and processing, due to the low structural strength, cracks or deformation will occur and the disc will be scrapped. Summary of the invention

[0004] In view of the problem of low structural strength when producing thin-walled ceramic disks in the prior art mentioned in the background technology, the present invention provides a thin-walled ceramic carrier disk processing method, which can improve the structural strength of thin-walled ceramic disks, improve the production qualification rate of products, reduce the risks of cracking and deformation and edge collapse, and save processing costs.

[0005] To achieve the above objectives, the present invention adopts the following technical solutions.

[0006] A method for processing a thin-walled ceramic carrier plate comprises the following steps: S1, pressing the ceramic granulated powder into a molded part; S2, rough machining the molded part, and increasing the ring step difference in the area where a thin wall needs to be formed to form a rough machined part; S3, sintering the rough-machined part to form a sintered part; S4, grinding the sintered part and removing the ring step difference to form a processed part; S5. Grind the bottom of the workpiece to produce a thin wall to form a finished product.

[0007] In the present application, after the ceramic granulation powder is pressed and formed, a circular ring segment difference is processed on the molded part. The circular ring segment difference is a circular ring structure arranged on the thin-walled area where processing is required. The circular ring structure can improve the structural strength of the thin-walled area, prevent sintering cracking or deformation in the middle part due to thin walls, reduce the subsequent fine processing time, and save processing costs; in the subsequent sintering process, since the molded part will shrink during the sintering process, the circular ring segment difference can ensure that the thin-walled area will not produce a high probability of cracks and deformation during the shrinkage process. At the same time, since it is set as a circular ring structure, during the shrinkage process, the circular ring segment difference can be guaranteed to evenly resist shrinkage, thereby avoiding the occurrence of local uneven force and ensuring stability during the processing.

[0008] Preferably, in step S5, the workpiece is turned upside down on a processing jig plate, and the bottom surface of the workpiece is flat-ground, and the processing jig plate includes an engaging groove adapted to the workpiece. The processing jig plate is provided with an engaging groove that can correspond to the workpiece, so that the engaging groove can engage with the workpiece, thereby forming a supporting effect on each docking surface of the workpiece, so that the workpiece can be fully supported in the process of grinding a thin wall at the bottom, thereby avoiding cracking caused by the inability to support the material, and improving the stability during the processing.

[0009] Preferably, an adhesive is applied between the workpiece and the fitting groove, and after the workpiece is processed, the workpiece is separated from the processing jig plate by heating. Applying an adhesive between the workpiece and the fitting groove can stabilize the fixing effect of the workpiece relative to the processing jig plate, reduce the movement error of the workpiece on the fitting groove, and at the same time, because the adhesive is between the workpiece and the fitting groove, the adhesive can produce a buffering effect on the workpiece during the force application process, thereby further reducing the risk of cracks in the workpiece during the processing; it can provide a buffering effect during the docking process between the workpiece and the fitting groove and the subsequent grinding process of the workpiece.

[0010] Preferably, a filling gap is left on each abutting surface of the workpiece and the fitting groove. By providing the filling gap, a buffer material can be placed on the filling gap to avoid direct contact between the workpiece and the fitting groove, thereby improving the protection effect of the workpiece and the fitting groove.

[0011] Preferably, the workpiece is provided with an opening, and the processing jig plate is provided with a protrusion that is snap-fitted and connected to the opening. The workpiece is provided with an opening, and the workpiece can be positioned through the snap-fit ​​connection between the opening and the protrusion.

[0012] Preferably, when the workpiece is connected to the processing jig plate, the surface of the protrusion does not exceed the bottom surface of the thin wall formed after the workpiece is processed. The surface of the protrusion is set not to exceed the bottom surface of the thin wall, so that it can be ensured that the protrusion position will not be ground during the processing, thereby improving the smoothness of grinding and avoiding interference during the grinding of the thin wall.

[0013] Preferably, the protrusion is threadedly connected to the processing jig plate, and the protrusion can adjust its height relative to the processing jig plate. The protrusion is threadedly connected to the processing jig plate, and the height of the protrusion can be adjusted through the threaded connection, so that the protrusion can be raised and lowered according to actual processing requirements. By raising the protrusion, it is convenient to dock, so as to confirm the position of the workpiece in advance. After the workpiece and the processing jig plate are docked, the height of the protrusion is lowered through bolt connection, so that the protrusion can be placed below the thin wall to be processed.

[0014] Preferably, after the workpiece and the processing jig plate are processed, the workpiece and the processing jig plate are placed in hot water for separation. Since the workpiece forms a finished product after processing, a thin-walled structure will be formed. Therefore, in the process of separating the workpiece from the processing jig, if the method of directly separating the finished product is adopted, the finished product will break at the thin wall due to uneven force. Therefore, an adhesive is set in the above steps to ensure that the thin wall can be supported and buffered during the processing. At the same time, in the process of moving the finished product and the processing jig plate after the processing is completed, the force can be evenly transmitted while the buffering effect continues. The two are placed in hot water to eliminate the adhesion effect of the adhesive. At this time, since the finished product and the processing jig plate are both in the water, they can be affected by the blocking effect and buoyancy of the water, thereby avoiding the finished product from being subjected to a more concentrated force. After losing the buffering of the adhesive, effective buffering is obtained through water, thereby ensuring the yield rate.

[0015] Preferably, in step S3, the rough-machined workpiece is placed on a sintering platen for sintering, and sintering sand is placed between the sintering platen and the rough-machined workpiece. The sintering sand is arranged between the sintering platen and the rough-machined workpiece, so that the rough-machined workpiece can obtain a smooth shrinkage displacement effect through the sintering sand during the sintering shrinkage process, thereby preventing cracking caused by non-smooth shrinkage during the sintering process of the material.

[0016] Preferably, in step S4, the front and back surfaces of the sintered part are first ground, and then the inner and outer contours of the sintered part are ground. By grinding the front and back surfaces, a flat placement surface can be obtained, and then a standard placement reference can be obtained during the grinding of the inner and outer contours to ensure the grinding accuracy.

[0017] The beneficial effects of the present invention are as follows: (1) By adding a circular ring step support in the middle, sintering cracking or deformation caused by thin wall in the middle can be prevented, the subsequent finishing time can be reduced, and processing costs can be saved; (2) Design the sintering method and lay sintering sand to prevent cracking caused by uneven shrinkage during sintering; (3) By supporting the thin-walled material with a machining jig plate during machining, the material can be prevented from cracking due to the thin bottom wall and lack of support during machining. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is an axonometric view of the rough-machined part of the present invention.

[0019] Figure 2 It is an axonometric view of the finished product of the present invention.

[0020] Figure 3 It is an axonometric view of the processing jig plate of the present invention.

[0021] Figure 4 It is a processing flow chart of the present invention.

[0022] Figure 5 It is a processing schematic diagram of grinding thin walls in the present invention.

[0023] Figure 6 It is a processing schematic diagram of the sintered rough-machined part in the present invention.

[0024] Figure 7 It is a structural schematic diagram of Example 3.

[0025] In the figure: 1. Circular ring step difference, 2. Rough machined part, 3. Sintered part, 4. Machined part, 4. Opening, 5. Finished part, 5. Thin wall, 6. Processing jig plate, 6. Fitting groove, 6. Protrusion, 7. Filling gap, 8. Sintered sand. DETAILED DESCRIPTION

[0026] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0027] Embodiment 1: RTP (Rapid Thermal Processing) rapid annealing furnace is a kind of equipment used for semiconductor device manufacturing and material research. It uses halogen infrared lamp as heat source, and heats wafers or materials to 300℃-1200℃ quickly through extremely fast heating rate, so as to improve some electrical properties and crystal structure defects inside wafers or materials, and improve the performance and reliability of semiconductor devices. RTP rapid annealing furnace is mainly composed of vacuum chamber, heating chamber, air intake system, vacuum system, temperature control system, air cooling system, water cooling system and other parts. The vacuum chamber is the working space of RTP rapid annealing furnace, and the internal 0.4mm wall thickness carrier plate is used to carry wafers or materials. As an important part of rapid annealing furnace, the carrier plate is in direct contact with wafers or materials, so strict requirements are placed on its material. 99.7% high-purity alumina ceramics have high purity, high strength, heat resistance, corrosion resistance, wear resistance, good thermal conductivity and thermal shock resistance, and low production cost, and are widely used in semiconductor equipment components.

[0028] In recent years, with the rapid development of the semiconductor industry, the market demand for semiconductor RTP rapid thermal annealing furnaces has also continued to grow. It is mainly used in semiconductor manufacturing, compound semiconductor materials, wafer manufacturing and other fields. Compared with traditional annealing furnaces, RTP rapid annealing furnaces have higher heating speeds, shorter processing time and more precise temperature control, which can meet the semiconductor industry's demand for efficient and high-quality annealing treatments. RTP rapid thermal annealing furnaces are widely used, providing strong support for the rapid growth of the market.

[0029] Since thermal conductivity of ceramic carrier plates must be considered, most of them are thin-walled discs. In the traditional production process, a large amount of margin is reserved during the rough processing of the green body, and the characteristics of the ceramic carrier plate are finely processed after sintering. In addition, the wall of the ceramic carrier plate is thin, and it is easy to break the edge during the processing and lead to scrap. This processing method takes a long time to process, has low production efficiency, and high production cost. In order to save more manpower and material resources and improve the production efficiency and qualified rate of such products, this embodiment discloses a 0.4mm thin-walled alumina ceramic carrier plate processing method for RTB rapid annealing furnace.

[0030] like Figure 1 , 2 , 3, and 4, including the following steps: S1, pressing the ceramic granulated powder into a molded part; S2, rough-machining the molded part, and adding a circular ring step 11 in the area where a thin wall 51 is required to be formed, to form a rough-machining part 42; S3, sintering the rough-machined part 42 to form a sintered part 3; S4, grinding the sintered part 3 and removing the circular ring step 11 to form a processed part 4; S5 , grinding the bottom of the workpiece 4 to form a thin wall 51 , thereby forming a finished product 5 .

[0031] In the present application, after the ceramic granulation powder is pressed and formed, a circular ring segment 11 is processed on the molded part. The circular ring segment 11 is a circular ring structure arranged on the area where the thin wall 51 needs to be processed. The circular ring structure can improve the structural strength of the thin wall 51 area, prevent sintering cracking or deformation in the middle due to thin walls, reduce the subsequent fine processing time, and save processing costs; in the subsequent sintering process, since the molded part will shrink during the sintering process, the circular ring segment 11 can ensure that the thin wall 51 area will not produce a high probability of cracks and deformation during the shrinkage process. At the same time, since it is set as a circular ring structure, during the shrinkage process, the circular ring segment 11 can be guaranteed to evenly resist shrinkage, thereby avoiding the occurrence of local uneven force and ensuring stability during the processing.

[0032] like Figure 3 , 5 As shown, in step S5, the workpiece 4 is turned upside down on the processing jig plate 6, and the bottom surface of the workpiece 4 is flat-ground. The processing jig plate 6 includes an engaging groove 61 adapted to the workpiece 4. The processing jig plate 6 is provided with an engaging groove 61 that can correspond to the workpiece 4, so that the engaging groove 61 can be engaged with the workpiece 4, thereby forming a supporting effect on each docking surface of the workpiece 4, so that the workpiece 4 can be fully supported in the process of grinding the thin wall 51 at the bottom of the workpiece 4, thereby avoiding the cracking phenomenon caused by the inability to support the material, and improving the stability during the processing.

[0033] like Figure 1 , 3 As shown in FIG. 5 , the workpiece 4 is provided with an opening 41, and the processing jig plate 6 is provided with a protrusion 62 that engages with the opening 41. The opening 41 is provided on the workpiece 4, and the workpiece 4 can be positioned by engaging the opening 41 with the protrusion 62.

[0034] like Figure 5 As shown, when the workpiece 4 is connected to the processing jig plate 6, the surface of the protrusion 62 does not exceed the bottom surface of the thin wall 51 formed after the workpiece 4 is processed. The surface of the protrusion 62 is set not to exceed the bottom surface of the thin wall 51, so that it can be ensured that the position of the protrusion 62 will not be ground during the processing, thereby improving the smoothness of grinding and avoiding interference during the grinding of the thin wall 51.

[0035] like Figure 6As shown, in step S3, the rough-machined part 42 is placed on a sintering platen for sintering, and sintering sand 8 is placed between the sintering platen and the rough-machined part 42. The sintering sand 8 is arranged between the sintering platen and the rough-machined part 42, so that the rough-machined part 42 can obtain a smooth shrinkage displacement effect through the sintering sand 8 during the sintering shrinkage process, thereby preventing cracking caused by non-smooth shrinkage during the sintering process of the material.

[0036] like Figure 4 As shown, in step S4, the front and back surfaces of the sintered part 3 are first ground, and then the inner and outer contours of the sintered part 3 are ground. By grinding the front and back surfaces, a flat placement surface can be obtained, and then a standard placement reference can be obtained in the process of grinding the inner and outer contours to ensure the grinding accuracy.

[0037] The specific processing method in this embodiment is as follows, including: 1) Rough processing of raw materials Ceramic granulated powder is cold isostatically pressed into a molded part with a diameter of 400 mm and a thickness of 25 mm, and then roughly processed.

[0038] Preferably, an alumina ceramic granulation powder having a purity greater than 99.7% is selected; Preferably, a granulation powder with a bulk density of 1.2±0.1 g / ml and a particle size D50 of 90±um are selected. The ceramic granulation powder within this range has good fluidity, is easy to fill the inside of the mold during molding, has a high green density after molding, and has a high density after sintering into porcelain. Preferably, according to the attached Figure 1 The rough machining diagram is used for machining, and a circular ring segment difference 11 is added in the middle of the thin wall 51 to prevent the green body from cracking after being sintered into porcelain, reduce the subsequent fine machining time, and improve the machining efficiency.

[0039] 2) Sintering The molded part is placed on a sintering table, separated by sintering sand 8 in the middle, and pushed into a sintering gas furnace for sintering.

[0040] According to the attached Figure 6 Sintering diagram for placement sintering; Preferably, the flatness of the table is less than 1 mm to prevent the table surface from being uneven, which may cause cracking due to uneven force during sintering; preferably, the sintering sand 8 uses diamond sintering sand 8 with a purity higher than 99% and a particle size range of 90-140 um; Preferably, the sintering temperature is 1610°C and the temperature is kept for 3 hours.

[0041] 3) Product processing ① Use a surface grinder to grind the front and back sides of the material; Figure 4The front and back processing diagram is used for processing. The front size is 5.6mm and the target size is 5.6±0.05mm. The back size is 0.4mm and the target size is 2mm. A safety distance is reserved to prevent the tool from hitting the tool during processing and the bottom edge from collapsing during hole processing, resulting in scrap. The flatness is 0.02mm, the parallelism is 0.02mm, and the roughness is Ra1.6mm. ② The outer contour of the material is processed by a lathe. According to Figure 4 The outer contour processing diagram is processed, and the target size of the outer contour is Φ297mm; ③ Use machining center to process the inner contour, step difference and through hole of the material; Figure 4 The outer contour processing diagram is used for processing, the inner contour is Φ292mm, the target size is Φ292mm, the target size is 5.6mm; the step difference is Φ164mm, the target size is Φ164mm, the target size is Φ162mm, the target size is Φ162mm, the target size is 1.6mm, the target size is 1.6, the target size of 120° is 120°, the target size of R6.4mm is 6.4mm, the target size of 5.6mm; the hole is Φ11.4mm, the target size is 11.4mm, through; the hole is 111.1mm, the target size is 111.1mm, the target size of 41mm, the target size of 8mm, the target size of R2mm, the target size of R2mm, and the target size of 120° is 120° through.

[0042] ④ The product is fixed on a 0.4mm thin-walled 51 processing jig plate 6, and the bottom surface of the material is processed by flat grinding, with a target size of 0.4mm.

[0043] Since the bottom of the material is only 0.4mm, there is no support during bottom processing, which can easily cause stress concentration and lead to cracking and scrap. A special jig is made to fix the material on the jig for processing.

[0044] Embodiment 2: Different from the first embodiment, the method for processing a thin-walled ceramic carrier plate in the present embodiment includes the following steps: S1, pressing the ceramic granulated powder into a molded part; S2, rough-machining the molded part, and adding a circular ring step 11 in the area where a thin wall 51 is required to be formed, to form a rough-machining part 42; S3, sintering the rough-machined part 42 to form a sintered part 3; S4, grinding the sintered part 3 and removing the circular ring step 11 to form a processed part 4; S5 , grinding the bottom of the workpiece 4 to form a thin wall 51 , thereby forming a finished product 5 .

[0045] In the present application, after the ceramic granulation powder is pressed and formed, a circular ring segment 11 is processed on the molded part. The circular ring segment 11 is a circular ring structure arranged on the area where the thin wall 51 needs to be processed. The circular ring structure can improve the structural strength of the thin wall 51 area, prevent sintering cracking or deformation in the middle due to thin walls, reduce the subsequent fine processing time, and save processing costs; in the subsequent sintering process, since the molded part will shrink during the sintering process, the circular ring segment 11 can ensure that the thin wall 51 area will not produce a high probability of cracks and deformation during the shrinkage process. At the same time, since it is set as a circular ring structure, during the shrinkage process, the circular ring segment 11 can be guaranteed to evenly resist shrinkage, thereby avoiding the occurrence of local uneven force and ensuring stability during the processing.

[0046] In step S5, the workpiece 4 is placed upside down on the processing jig plate 6, and the bottom surface of the workpiece 4 is flat-ground. The processing jig plate 6 includes an engaging groove 61 adapted to the workpiece 4. The processing jig plate 6 is provided with an engaging groove 61 that can correspond to the workpiece 4, so that the engaging groove 61 can be engaged with the workpiece 4, thereby forming a supporting effect on each docking surface of the workpiece 4, so that the workpiece 4 can be fully supported in the process of grinding the thin wall 51 at the bottom, thereby avoiding cracking caused by the inability to support the material, and improving the stability during the processing.

[0047] Adhesive is applied between the workpiece 4 and the fitting groove 61. After the workpiece 4 is processed, the workpiece 4 is separated from the processing jig plate 6 by heating. Adhesive is applied between the workpiece 4 and the fitting groove 61, so that the fixing effect of the workpiece 4 relative to the processing jig plate 6 is stable, and the movement error of the workpiece 4 on the fitting groove 61 is reduced. At the same time, since the adhesive is between the workpiece 4 and the fitting groove 61, the adhesive can produce a buffering effect on the workpiece 4 during the force application process, thereby further reducing the risk of cracks in the workpiece 4 during the processing; it can provide a buffering effect during the docking process between the workpiece 4 and the fitting groove 61 and the subsequent grinding process of the workpiece 4.

[0048] Filling gaps 7 are left on each of the mating surfaces of the workpiece 4 and the fitting groove 61. By providing the filling gaps 7, a buffer material can be placed on the filling gaps 7 to avoid direct contact between the workpiece 4 and the fitting groove 61, thereby improving the protection effect of the workpiece 4 and the fitting groove 61.

[0049] The workpiece 4 is provided with an opening 41, and the processing jig plate 6 is provided with a protrusion 62 that is engaged with the opening 41. The opening 41 is provided on the workpiece 4, and the workpiece 4 can be positioned by the engagement between the opening 41 and the protrusion 62.

[0050] When the workpiece 4 is connected to the processing jig plate 6, the surface of the protrusion 62 does not exceed the bottom surface of the thin wall 51 formed after the workpiece 4 is processed. The surface of the protrusion 62 is set not to exceed the bottom surface of the thin wall 51, so that the protrusion 62 position will not be ground during the processing, thereby improving the smoothness of grinding and avoiding interference during the grinding of the thin wall 51.

[0051] After the workpiece 4 and the processing jig plate 6 are processed, the workpiece 4 and the processing jig plate 6 are placed in hot water for separation. Since the workpiece 4 forms a finished product 5 after processing, a thin wall 51 structure will be formed. Therefore, in the process of separating the workpiece 4 from the processing jig, if the method of directly separating the finished product 5 is adopted, the finished product 5 will be broken at the thin wall 51 due to uneven force. Therefore, an adhesive is set in the above steps to ensure that the thin wall 51 can be supported and buffered during the processing. At the same time, in the process of moving the finished product 5 and the processing jig plate 6 after the processing is completed, the force can be evenly transmitted while the buffering effect is continuously maintained. The two are placed in hot water to eliminate the adhesion effect of the adhesive. At this time, since the finished product 5 and the processing jig plate 6 are both in the water, they can be affected by the blocking effect and buoyancy of the water, thereby avoiding the finished product 5 from being subjected to a relatively concentrated force. After losing the buffering of the adhesive, effective buffering is obtained through water, thereby ensuring the yield rate.

[0052] In step S3, the rough-machined part 42 is placed on a sintering platen for sintering, and sintering sand 8 is placed between the sintering platen and the rough-machined part 42. The sintering sand 8 is arranged between the sintering platen and the rough-machined part 42, so that the rough-machined part 42 can obtain a smooth shrinkage displacement effect through the sintering sand 8 during the sintering shrinkage process, thereby preventing cracking caused by non-smooth shrinkage during the sintering process of the material.

[0053] In step S4, the front and back surfaces of the sintered part 3 are first ground, and then the inner and outer contours of the sintered part 3 are ground. By grinding the front and back surfaces, a flat placement surface can be obtained, and then a standard placement reference can be obtained during the grinding of the inner and outer contours to ensure the grinding accuracy.

[0054] Embodiment 3: like Figure 1 As shown, Figure 7 As shown, different from Example 1, a method for processing a thin-walled ceramic carrier plate in this embodiment includes the following steps: S1, pressing the ceramic granulated powder into a molded part; S2, rough-machining the molded part, and adding a circular ring step 11 in the area where a thin wall 51 is required to be formed, to form a rough-machining part 42; S3, sintering the rough-machined part 42 to form a sintered part 3; S4, grinding the sintered part 3 and removing the circular ring step 11 to form a processed part 4; S5 , grinding the bottom of the workpiece 4 to form a thin wall 51 , thereby forming a finished product 5 .

[0055] In step S5, the workpiece 4 is placed upside down on the processing jig plate 6, and the bottom surface of the workpiece 4 is flat-ground. The processing jig plate 6 includes an engaging groove 61 adapted to the workpiece 4; The workpiece 4 is provided with an opening 41, and the processing jig plate 6 is provided with a protrusion 62 that is engaged with the opening 41; The protrusion 62 is threadedly connected to the processing jig plate 6 , and the protrusion 62 can adjust its height relative to the processing jig plate 6 .

[0056] In the present application, after the ceramic granulation powder is pressed and formed, a circular ring segment 11 is processed on the molded part. The circular ring segment 11 is a circular ring structure arranged on the area where the thin wall 51 needs to be processed. The circular ring structure can improve the structural strength of the thin wall 51 area, prevent sintering cracking or deformation in the middle due to thin walls, reduce the subsequent fine processing time, and save processing costs; in the subsequent sintering process, since the molded part will shrink during the sintering process, the circular ring segment 11 can ensure that the thin wall 51 area will not produce a high probability of cracks and deformation during the shrinkage process. At the same time, since it is set as a circular ring structure, during the shrinkage process, the circular ring segment 11 can be guaranteed to evenly resist shrinkage, thereby avoiding the occurrence of local uneven force and ensuring stability during the processing.

[0057] The machining jig plate 6 is provided with an interlocking groove 61 corresponding to the machining workpiece 4, so that the interlocking groove 61 can be interlocked with the machining workpiece 4, thereby forming a supporting effect on each mating surface of the machining workpiece 4, so that in the process of grinding a thin wall 51 at the bottom of the machining workpiece 4, it can be fully supported, thereby avoiding cracking caused by the inability to support the material and improving the stability during the machining process.

[0058] The workpiece 4 is provided with an opening 41 , and the workpiece 4 can be positioned by the engagement connection between the opening 41 and the protrusion 62 .

[0059] When the workpiece 4 is connected to the processing jig plate 6, the surface of the protrusion 62 does not exceed the bottom surface of the thin wall 51 formed after the workpiece 4 is processed. The surface of the protrusion 62 is set not to exceed the bottom surface of the thin wall 51, so that it can be ensured that the position of the protrusion 62 will not be ground during the processing process, thereby improving the smoothness of grinding and avoiding interference in the process of grinding the thin wall 51. The protrusion 62 is threadedly connected to the processing jig plate 6, and the height of the protrusion 62 can be adjusted through the threaded connection, so that the protrusion 62 can be raised and lowered according to the actual processing requirements. By raising the protrusion 62, it is convenient to dock, so as to pre-confirm the position of placing the workpiece 4. After the workpiece 4 is docked with the processing jig plate 6, the height of the protrusion 62 is lowered through bolt connection, so that the protrusion 62 can be placed below the thin wall 51 to be processed.

Claims

1. A method for processing a thin-walled ceramic carrier plate, characterized in that: The following steps are included: S1, pressing the ceramic granulated powder into a molded part; S2, rough machining the molded part, and increasing the ring step difference in the area where a thin wall needs to be formed to form a rough machined part; S3, sintering the rough-machined part to form a sintered part; S4, grinding the sintered part and removing the ring step difference to form a processed part; S5. Grind the bottom of the workpiece to produce a thin wall to form a finished product.

2. A method for processing a thin-walled ceramic carrier according to claim 1, characterized in that: In step S5, the workpiece is turned upside down on a processing jig plate to grind the bottom surface of the workpiece flat, and the processing jig plate includes an engaging groove adapted to the workpiece.

3. A method for processing a thin-walled ceramic carrier according to claim 2, characterized in that: Adhesive is applied between the workpiece and the fitting groove, and after the workpiece is processed, the workpiece and the processing jig plate are heated and separated.

4. A method for processing a thin-walled ceramic carrier according to claim 2, characterized in that: A filling gap is reserved on each butting surface between the processing part and the engaging groove.

5. A method for processing a thin-walled ceramic carrier according to claim 2, characterized in that: The processing piece is provided with an opening, and the processing jig plate is provided with a protrusion which is engaged and connected with the opening.

6. A method for processing a thin-walled ceramic carrier according to claim 5, characterized in that: When the workpiece is connected to the processing jig plate, the surface of the protrusion does not exceed the bottom surface of the thin wall formed after the workpiece is processed.

7. A method for processing a thin-walled ceramic carrier according to claim 5, characterized in that: The protrusion is threadedly connected to the processing jig plate, and the protrusion can adjust its height relative to the processing jig plate.

8. A method for processing a thin-walled ceramic carrier according to claim 3, characterized in that: After the workpiece and the processing jig plate are processed, the workpiece and the processing jig plate are placed in hot water for separation.

9. A method for processing a thin-walled ceramic carrier according to any one of claims 1 to 8, characterized in that: In step S3 , the rough-machined workpiece is placed on a sintering platen for sintering, and sintering sand is placed between the sintering platen and the rough-machined workpiece.

10. A method for processing a thin-walled ceramic carrier according to any one of claims 1 to 8, characterized in that: In step S4, the front and back surfaces of the sintered part are ground first, and then the inner and outer contours of the sintered part are ground.

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