A semicircular semiconductor part detection tool

Abstract

This invention discloses a semi-circular semiconductor component inspection fixture, aiming to solve the problem of low inspection efficiency for semi-circular semiconductor components. The invention includes a base with a loading groove. A reference surface is set at one end of the loading groove, and a movable push plate is installed at the other end. A positioning balance rod is rotatably connected to the base, and a contoured semi-circular plate is rotatably mounted on the positioning balance rod. At least one pair of support rollers are installed at the bottom of the loading groove. The semiconductor component is loaded in the loading groove and supported on the support rollers. The positioning balance rod presses against the open end of the semiconductor component, and the push plate abuts against the end of the semiconductor component. This semi-circular semiconductor component inspection fixture can quickly inspect the dimensions of semi-circular semiconductor components, with high efficiency and accurate and reliable inspection.

Description

Technical Field

[0001] This invention relates to semiconductor component inspection technology, and more specifically, to a semi-circular semiconductor component inspection fixture. Background Technology

[0002] Currently, there is a type of commonly used tile-shaped part (hereinafter referred to as tile) in semiconductor equipment components. Its structure is a thick-walled round tube divided into two, with mounting holes on the side wall facing the axis. Its inner diameter, outer diameter, mounting holes on the side wall, and length are all critical part dimensions. In production, the number of these parts is very large, and customers require all part features to be inspected. Using coordinate measuring machines is very uneconomical. During routine inspection, each part needs to be positioned and measured repeatedly, which is very inefficient. Summary of the Invention

[0003] To overcome the above shortcomings, the present invention provides a semi-circular semiconductor component inspection fixture, which can quickly inspect the dimensions of semi-circular semiconductor components, with high working efficiency and accurate and reliable inspection.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a semi-circular semiconductor component inspection fixture, including a base, a loading groove on the base, a reference surface at one end of the loading groove, a movable push plate installed at the other end of the loading groove, a positioning balance rod rotatably connected to the base, a contoured semi-circular plate rotatably installed on the positioning balance rod, at least a pair of support rollers installed at the bottom of the loading groove, a semiconductor component loaded in the loading groove, the semiconductor component supported on the support rollers, the positioning balance rod pressing on the open end of the semiconductor component, and the push plate pressing against the end of the semiconductor component.

[0005] During the inspection of a semi-circular semiconductor component, the component is placed with its opening facing upwards into a loading slot on the base. Support rollers at the bottom of the loading slot support the component, reducing the contact area on its outer surface and minimizing the risk of scratches. Then, a push plate is pushed, bringing one end of the component against a reference surface and the other end against the push plate. The length of the component can be indirectly measured by the distance the push plate moves. Next, a positioning balance rod is flipped downwards and pressed against the upper opening of the component, ensuring it contacts the two edges of the opening. This ensures the semi-circular plate is coaxial with the component. The semi-circular plate is then flipped downwards, its radius slightly larger than the inner wall radius of the component. It stops rotating after touching the inner wall of the component. The angle of rotation of the semi-circular plate is observed to determine if the inner diameter of the component meets the requirements. If the angle is within the set range, the inner diameter of the component is considered to meet the inspection requirements. This semi-circular semiconductor component inspection fixture can quickly inspect the dimensions of semi-circular semiconductor components, with high working efficiency and accurate and reliable inspection.

[0006] Preferably, the push plate is connected to the push rod, which has length scale lines and is movably inserted into the base.

[0007] The pusher moves the push plate by pushing the push rod, thereby pushing the semiconductor component. The push rod is equipped with length scale lines to facilitate the measurement of the length of the semiconductor component.

[0008] Preferably, a hole position detection element is installed on the base, the hole position detection element is provided with a sliding detection block, and a detection pin is provided on the detection block, the detection pin being aligned with the mounting hole on the semiconductor component.

[0009] After the semiconductor component is loaded into place, the positioning balance bar contacts the two sides of the opening of the semiconductor component. At this time, the positioning balance bar is in a horizontal position, and the two sides of the opening of the semiconductor component are on the same horizontal plane. In other words, the semiconductor component is upright. If the positioning pin can pass through the mounting hole during the inspection process, it means that the positioning accuracy of the mounting hole meets the requirements.

[0010] Preferably, a rotatable support shaft is installed on the base, and a connecting rod is rotatably connected to the support shaft. The connecting rod is fastened to the positioning balance bar.

[0011] The rotational connection of the positioning balance bar is achieved through the setting of the support shaft and connecting rod, resulting in a smooth and reliable connection.

[0012] Preferably, a limiting block that slides laterally is installed on the base. The limiting block has two limiting parts, which are respectively placed on both sides of the rotation center of the support shaft. The limiting parts are provided with a guide surface and a limiting surface. The guide surface is inclined, and the two limiting surfaces support and limit the support shaft on both sides of the rotation center.

[0013] The limiting block allows the support shaft to rotate and lock in position. When the limiting block moves away from the support shaft, the limiting surface separates from the support shaft, and the limiting block loses its limiting effect on the support shaft, allowing the support shaft to rotate. When the limiting block moves closer to the support shaft, the guide surface slides over the outer wall of the support shaft and supports the support shaft on the limiting surface. At this time, the support shaft is in a horizontal state and cannot rotate, facilitating the inspection of the mounting holes.

[0014] Preferably, an angle measuring rod is installed at the bottom of the loading slot, and the distance between the outer wall of the loading slot and the circumferential contour line of the semiconductor part is a, where a is the maximum allowable roundness error value.

[0015] When inspecting the roundness of the outer wall of a semiconductor component, the support shaft rotates, which in turn drives the semiconductor component to rotate. If the roundness error of the outer wall of the semiconductor component exceeds the maximum error value, the angle measuring rod comes into contact with the outer wall of the semiconductor component. At this time, the angle measuring rod is pushed and deflected by the frictional force. Therefore, the roundness of the outer wall of the semiconductor component can be judged by observing the deflection angle of the angle measuring rod.

[0016] Preferably, a recessed clearance groove is provided on the base surface corresponding to the support shaft.

[0017] The clearance groove provides space for the support shaft to rotate, avoiding interference and jamming.

[0018] Preferably, a rotating shaft is provided on the support shaft, and the rotating shaft is rotatably mounted on the base, with the axis of rotation of the rotating shaft being parallel to the axis of the semiconductor component.

[0019] The axis of the rotating shaft is parallel to the axis of the semiconductor component, ensuring that the axis of the positioning balance bar intersects perpendicularly with the axis of the semiconductor component, thus guaranteeing the accuracy of the detection.

[0020] Preferably, both ends of the positioning balance bar are equipped with spring blocks, and a buffer spring is installed between the spring blocks and the positioning balance bar. The lower part of the opposite surface of the two spring blocks is provided with a pushing surface, and the two pushing surfaces are inclined from top to bottom in a direction away from each other. The outer diameter scale line is provided on the positioning balance bar along the length direction.

[0021] During the process of the positioning balance bar being pressed down to the open end of the semiconductor component, the outer edge of the open end of the semiconductor component comes into contact with the pushing surface, thereby pushing the spring block to move. The outer diameter of the semiconductor component is indirectly measured by the distance the spring block moves.

[0022] Preferably, a piston cylinder is installed on the contoured semicircular plate, a large piston is installed inside the piston cylinder, the large piston is connected to a contact rod, and the contact rod extends radially out of the outer edge of the contoured semicircular plate by a length of b, where b is the maximum allowable error value of the inner diameter; the piston cylinder is connected to a small flow channel, a small piston is installed inside the small flow channel, the small piston is connected to a stroke amplification rod, a conductive contact is installed inside the small flow channel, and the conductive contact is connected to the indicator light circuit; when the stroke amplification rod moves and touches the conductive contact, the indicator light illuminates.

[0023] When inspecting the inner diameter of a semiconductor component, the contoured semicircular plate is flipped downwards. If the semicircular plate cannot rotate past the inner bottom surface of the semiconductor component, the inner diameter of the component does not meet the requirements. If the semicircular plate can rotate past the inner bottom surface of the semiconductor component, and the contact rod can touch the inner bottom surface, the contact rod pushes the large piston to move. The medium in the piston cylinder flows into the small flow channel and drives the small piston to move. Since the area of ​​the large piston is much larger than that of the small piston, the distance the small piston moves is amplified. When the stroke amplification rod moves and touches the conductive contact, the indicator light illuminates, indicating that the inner diameter of the semiconductor component meets the requirements.

[0024] Compared with the prior art, the beneficial effects of the present invention are: (1) The semi-circular semiconductor part inspection fixture can quickly detect the size of the semi-circular semiconductor part, with high working efficiency and accurate and reliable detection; (2) The roundness of the outer wall of the semiconductor part is determined by observing the angle and measuring the deflection angle of the roller, which is convenient for detection; (3) The outer diameter of the semiconductor part is indirectly measured by the distance the spring block moves, which is convenient for detection. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the detection state in Embodiment 1 of the present invention.

[0026] Figure 2 This is a schematic diagram of the structure of Embodiment 1 of the present invention.

[0027] Figure 3 This is a schematic diagram of the structure of Embodiment 2 of the present invention.

[0028] Figure 4 This is a schematic diagram of the positioning balance bar of Embodiment 3 of the present invention.

[0029] Figure 5 This is a schematic diagram of the positioning balance bar of Embodiment 4 of the present invention.

[0030] Figure 6 This is a partial enlarged view of the contact rod position in Embodiment 4 of the present invention.

[0031] In the diagram: 1. Base, 2. Loading groove, 3. Reference surface, 4. Push plate, 5. Push rod, 6. Length scale line, 7. Positioning balance bar, 8. Contouring semicircular plate, 9. Support roller, 10. Semiconductor component, 11. Support shaft, 12. Connecting rod, 13. Rotating shaft, 14. Clearance groove, 15. Support, 16. Limiting block, 17. Limiting part, 18. Guide surface, 19. Limiting surface, 20. Deflection scale line, 21. Pointer, 22. Angle measuring rod, 2 3. Angle scale line; 24. Hole position detection piece; 25. Detection block; 26. Detection pin; 27. Mounting hole; 28. Spring block; 29. ​​Buffer spring; 30. Connecting groove; 31. Positioning plug; 32. Pushing surface; 33. Piston cylinder; 34. Large piston; 35. Return spring; 36. Contact rod; 37. Small flow channel; 38. Small piston; 39. Return spring; 40. Stroke amplification rod; 41. Conductive contact piece; 42. Wiring ring; 43. Conductive ring. Detailed Implementation

[0032] The technical solution of the present invention will be further described in detail below through specific embodiments and in conjunction with the accompanying drawings:

[0033] Example 1: A semi-circular semiconductor component inspection fixture (see...) Figure 1 , Figure 2The device includes a base 1, which is elongated and has a loading groove 2 on its upper surface. The loading groove 2 is semi-circular and has a reference surface 3 at one end. A movable push plate 4, also semi-circular, is mounted on the other end of the loading groove 2. The push plate 4 is connected to a push rod 5, which has length graduations 6 and is movably inserted into the base 1. The push rod 5 pushes the push plate 4, thereby pushing the semiconductor component 10. The length graduations 6 on the push rod 5 facilitate the measurement of the length of the semiconductor component 10. An insertion hole is provided on the side of the loading groove 2 opposite to the reference surface 3. The push rod 5 is fitted into the insertion hole and connected. A flange is provided at the end of the push rod 5 to limit its movement and prevent it from going too far.

[0034] The base 1 is rotatably connected to the positioning balance bar 7, and the contour semi-circular plate 8 is rotatably mounted on the positioning balance bar 7. At least one pair of support rollers 9 are installed at the bottom of the loading groove 2. In this embodiment, two support rollers 9 are provided, and both ends of the two support rollers 9 are rotatably connected to the base 1. The outer wall of the support roller 9 protrudes from the side wall of the loading groove 2. The semiconductor part 10 is loaded in the loading groove 2. The semiconductor part 10 is supported on the support rollers 9. The positioning balance bar 7 presses on the open end of the semiconductor part 10, and the push plate 4 pushes against the end of the semiconductor part 10.

[0035] A rotatable support shaft 11 is mounted on the base 1. Two connecting rods 12 are rotatably connected to the support shaft 11, and the two connecting rods 12 are respectively connected to the two ends of the support shaft. The two connecting rods 12 are respectively fastened to the two positioning balance rods 7. A contoured semicircular plate 8 is rotatably mounted in the middle position of the positioning balance rods 7. A rotating shaft 13 is provided on the support shaft 11 and is rotatably mounted on the base 1. The rotation axis of the rotating shaft 13 is parallel to the axis of the semiconductor component 10. The rotating shaft 13 is located in the middle position of the support shaft, and the axis of the rotating shaft 13 intersects the axis of the support shaft perpendicularly. The rotation axis of the contoured semicircular plate 8 intersects the axis of the semiconductor component 10 perpendicularly.

[0036] A recessed clearance groove 14 is provided on the surface of the base 1 corresponding to the support shaft 11. Two supports 15 are provided on the base 1 corresponding to the rotating shaft 13. Both supports 15 are provided with connecting holes. The two ends of the rotating shaft 13 are rotatably connected to the two connecting holes respectively. The clearance groove 14 is placed between the two supports 15. The depth of the clearance groove 14 gradually increases from the middle to both ends.

[0037] The radius of the contoured semicircular plate 8 is slightly larger than the radius of the inner wall of the semiconductor part 10. A deflection scale line 20 is set on the outer wall of the positioning balance rod 7. The deflection scale line 20 is arranged circumferentially. A pointer 21 is set on the contoured semicircular plate 8. The pointer 21 points to the deflection scale line 20.

[0038] An angle measuring rod 22 is installed at the bottom of the loading slot 2. The angle measuring rod 22 is rotated. The distance 'a' between the outer wall of the loading slot 2 and the circumferential outline of the semiconductor part 10 is 'a', where 'a' is the maximum allowable roundness error of the outer wall of the semiconductor part 10. An angle scale line 23 is set between the base 1 and the angle measuring rod 22. The angle scale line 23 is circumferentially set on the side wall of the base 1. An alignment line is set on the angle measuring rod 22, and the alignment line is aligned with the angle scale line 23.

[0039] A hole position detection element 24 is mounted on the base 1. A sliding detection block 25 is provided on the hole position detection element 24. An isosceles trapezoidal guide rail is provided at the bottom of the detection block 25. A guide groove adapted to the guide rail is provided on the hole position detection element 24, and the guide rail and guide groove are movably inserted and connected. A detection pin 26 is provided on the detection block 25, and the detection pin 26 is aligned with the mounting hole 27 on the semiconductor component 10.

[0040] During the inspection of the semi-circular semiconductor component 10, the semiconductor component 10 is placed with its opening facing upwards into the loading groove 2 on the base 1. The support roller 9 at the bottom of the loading groove 2 supports the semiconductor component 10, reducing the contact area of ​​the outer surface of the semiconductor component 10 and thus reducing the risk of scratches. Then, the push plate 4 is pushed so that one end of the semiconductor component 10 is against the reference surface 3, and the other end of the semiconductor component 10 is against the push plate 4. The length of the semiconductor component 10 can be indirectly measured by the distance the push plate 4 moves. After the semiconductor component 10 is loaded into place, the positioning balance rod 7 contacts the two sides of the opening of the semiconductor component 10. At this time, the positioning balance rod 7 is in a horizontal position, and the two sides of the opening of the semiconductor component 10 are on the same horizontal plane, which means that the semiconductor component 10 is in a correct posture. If the positioning pin can pass through the mounting hole 27 during the inspection process, it means that the positional accuracy of the mounting hole 27 meets the requirements.

[0041] The positioning balance rod 7 is flipped downwards and pressed against the upper opening of the semiconductor part 10, ensuring that the positioning balance rod 7 contacts both sides of the opening of the semiconductor part 10. This ensures that the contour semicircular plate 8 is coaxial with the semiconductor part 10. Then, the contour semicircular plate 8 is flipped downwards, with its radius slightly larger than the radius of the inner wall of the semiconductor part 10. The contour semicircular plate 8 stops rotating after touching the inner wall of the semiconductor part 10. The inner diameter of the semiconductor part 10 is determined by observing the angle through which the contour semicircular plate 8 has rotated. If the angle of rotation of the contour semicircular plate 8 is within the set angle range, the inner diameter of the semiconductor part 10 is determined to meet the inspection requirements.

[0042] When the roundness of the outer wall of semiconductor component 10 is detected, the support shaft 11 rotates, thereby driving the semiconductor component 10 to rotate. If the roundness error of the outer wall of semiconductor component 10 exceeds the maximum error value, the angle measuring rod 22 contacts the outer wall of semiconductor component 10. At this time, the angle measuring rod 22 is pushed and deflected by the frictional force. Therefore, the roundness of the outer wall of semiconductor component 10 can be judged by observing the deflection angle of the angle measuring rod 22.

[0043] Example 2: A semi-circular semiconductor component inspection fixture (see...) Figure 3 The device includes a base 1, which is elongated and has a loading groove 2 on its upper surface. The loading groove 2 is semi-circular and has a reference surface 3 at one end. A movable push plate 4, also semi-circular, is mounted on the other end of the loading groove 2. The push plate 4 is connected to a push rod 5, which has length graduations 6 and is movably inserted into the base 1. The push rod 5 pushes the push plate 4, thereby pushing the semiconductor component 10. The length graduations 6 on the push rod 5 facilitate the measurement of the length of the semiconductor component 10. An insertion hole is provided on the side of the loading groove 2 opposite to the reference surface 3. The push rod 5 is fitted into the insertion hole and connected. A flange is provided at the end of the push rod 5 to limit its movement and prevent it from going too far.

[0044] The base 1 is rotatably connected to the positioning balance bar 7, and the contour semi-circular plate 8 is rotatably mounted on the positioning balance bar 7. At least one pair of support rollers 9 are installed at the bottom of the loading groove 2. In this embodiment, two support rollers 9 are provided, and both ends of the two support rollers 9 are rotatably connected to the base 1. The outer wall of the support roller 9 protrudes from the side wall of the loading groove 2. The semiconductor part 10 is loaded in the loading groove 2. The semiconductor part 10 is supported on the support rollers 9. The positioning balance bar 7 presses on the open end of the semiconductor part 10, and the push plate 4 pushes against the end of the semiconductor part 10.

[0045] A rotatable support shaft 11 is mounted on the base 1. Two connecting rods 12 are rotatably connected to the support shaft 11, and the two connecting rods 12 are respectively connected to the two ends of the support shaft. The two connecting rods 12 are respectively fastened to the two positioning balance rods 7. A contoured semicircular plate 8 is rotatably mounted in the middle position of the positioning balance rods 7. A rotating shaft 13 is provided on the support shaft 11 and is rotatably mounted on the base 1. The rotation axis of the rotating shaft 13 is parallel to the axis of the semiconductor component 10. The rotating shaft 13 is located in the middle position of the support shaft, and the axis of the rotating shaft 13 intersects the axis of the support shaft perpendicularly. The rotation axis of the contoured semicircular plate 8 intersects the axis of the semiconductor component 10 perpendicularly.

[0046] A recessed clearance groove 14 is provided on the surface of the base 1 corresponding to the support shaft 11. Two supports 15 are provided on the base 1 corresponding to the rotating shaft 13. Both supports 15 are provided with connecting holes. The two ends of the rotating shaft 13 are rotatably connected to the two connecting holes respectively. The clearance groove 14 is placed between the two supports 15. The depth of the clearance groove 14 gradually increases from the middle to both ends.

[0047] A limiting block 16 is installed on the base 1 and is slidably mounted thereon. A sliding block is provided on the base 1 and corresponding to the limiting block 16. A sliding groove is provided on the sliding block. A slider is provided at the bottom of the limiting block 16. The slider is slidably connected to the sliding groove. Both the slider and the sliding groove are isosceles trapezoidal structures. Two limiting parts 17 are provided on the limiting block 16. The two limiting parts 17 are respectively placed on both sides of the rotation center of the support shaft 11. A guide surface 18 and a limiting surface 19 are provided on the limiting parts 17. The guide surface 18 is inclined. The two limiting surfaces 19 support and limit the support shaft 11 on both sides of the rotation center.

[0048] The limiting block 16 allows the support shaft 11 to rotate and lock in position. When the limiting block 16 moves away from the support shaft 11, the limiting surface 19 separates from the support shaft 11, and the limiting block 16 loses its limiting effect on the support shaft 11, at which point the support shaft 11 can rotate. When the limiting block 16 moves closer to the support shaft 11, the guide surface 18 slides over the outer wall of the support shaft 11 and supports the support shaft 11 on the limiting surface 19. At this point, the support shaft 11 is in a horizontal state and cannot rotate, facilitating the inspection of the mounting hole 27.

[0049] The radius of the contoured semicircular plate 8 is slightly larger than the radius of the inner wall of the semiconductor part 10. A deflection scale line 20 is set on the outer wall of the positioning balance rod 7. The deflection scale line 20 is arranged circumferentially. A pointer 21 is set on the contoured semicircular plate 8. The pointer 21 points to the deflection scale line 20.

[0050] An angle measuring rod 22 is installed at the bottom of the loading slot 2. The angle measuring rod 22 is rotated. The distance 'a' between the outer wall of the loading slot 2 and the circumferential outline of the semiconductor part 10 is 'a', where 'a' is the maximum allowable roundness error of the outer wall of the semiconductor part 10. An angle scale line 23 is set between the base 1 and the angle measuring rod 22. The angle scale line 23 is circumferentially set on the side wall of the base 1. An alignment line is set on the angle measuring rod 22, and the alignment line is aligned with the angle scale line 23.

[0051] A hole position detection element 24 is mounted on the base 1. A sliding detection block 25 is provided on the hole position detection element 24. An isosceles trapezoidal guide rail is provided at the bottom of the detection block 25. A guide groove adapted to the guide rail is provided on the hole position detection element 24, and the guide rail and guide groove are movably inserted and connected. A detection pin 26 is provided on the detection block 25, and the detection pin 26 is aligned with the mounting hole 27 on the semiconductor component 10.

[0052] During the inspection of the semi-circular semiconductor component 10, the semiconductor component 10 is placed with its opening facing upwards into the loading groove 2 on the base 1. The support roller 9 at the bottom of the loading groove 2 supports the semiconductor component 10, reducing the contact area of ​​the outer surface of the semiconductor component 10 and thus reducing the risk of scratches. Then, the push plate 4 is pushed so that one end of the semiconductor component 10 is against the reference surface 3, and the other end of the semiconductor component 10 is against the push plate 4. The length of the semiconductor component 10 can be indirectly measured by the distance the push plate 4 moves. After the semiconductor component 10 is loaded into place, the positioning balance rod 7 contacts the two sides of the opening of the semiconductor component 10. At this time, the positioning balance rod 7 is in a horizontal position, and the two sides of the opening of the semiconductor component 10 are on the same horizontal plane, which means that the semiconductor component 10 is in a correct posture. If the positioning pin can pass through the mounting hole 27 during the inspection process, it means that the positional accuracy of the mounting hole 27 meets the requirements.

[0053] The positioning balance rod 7 is flipped downwards and pressed against the upper opening of the semiconductor part 10, ensuring that the positioning balance rod 7 contacts both sides of the opening of the semiconductor part 10. This ensures that the contour semicircular plate 8 is coaxial with the semiconductor part 10. Then, the contour semicircular plate 8 is flipped downwards, with its radius slightly larger than the radius of the inner wall of the semiconductor part 10. The contour semicircular plate 8 stops rotating after touching the inner wall of the semiconductor part 10. The inner diameter of the semiconductor part 10 is determined by observing the angle through which the contour semicircular plate 8 has rotated. If the angle of rotation of the contour semicircular plate 8 is within the set angle range, the inner diameter of the semiconductor part 10 is determined to meet the inspection requirements.

[0054] When the roundness of the outer wall of semiconductor component 10 is detected, the support shaft 11 rotates, thereby driving the semiconductor component 10 to rotate. If the roundness error of the outer wall of semiconductor component 10 exceeds the maximum error value, the angle measuring rod 22 contacts the outer wall of semiconductor component 10. At this time, the angle measuring rod 22 is pushed and deflected by the frictional force. Therefore, the roundness of the outer wall of semiconductor component 10 can be judged by observing the deflection angle of the angle measuring rod 22.

[0055] Example 3: A semi-circular semiconductor component inspection fixture (see...) Figure 4The device includes a base 1, which is elongated and has a loading groove 2 on its upper surface. The loading groove 2 is semi-circular and has a reference surface 3 at one end. A movable push plate 4, also semi-circular, is mounted on the other end of the loading groove 2. The push plate 4 is connected to a push rod 5, which has length graduations 6 and is movably inserted into the base 1. The push rod 5 pushes the push plate 4, thereby pushing the semiconductor component 10. The length graduations 6 on the push rod 5 facilitate the measurement of the length of the semiconductor component 10. An insertion hole is provided on the side of the loading groove 2 opposite to the reference surface 3. The push rod 5 is fitted into the insertion hole and connected. A flange is provided at the end of the push rod 5 to limit its movement and prevent it from going too far.

[0056] The base 1 is rotatably connected to the positioning balance bar 7, and the contour semi-circular plate 8 is rotatably mounted on the positioning balance bar 7. At least one pair of support rollers 9 are installed at the bottom of the loading groove 2. In this embodiment, two support rollers 9 are provided, and both ends of the two support rollers 9 are rotatably connected to the base 1. The outer wall of the support roller 9 protrudes from the side wall of the loading groove 2. The semiconductor part 10 is loaded in the loading groove 2. The semiconductor part 10 is supported on the support rollers 9. The positioning balance bar 7 presses on the open end of the semiconductor part 10, and the push plate 4 pushes against the end of the semiconductor part 10.

[0057] A rotatable support shaft 11 is mounted on the base 1. Two connecting rods 12 are rotatably connected to the support shaft 11, and the two connecting rods 12 are respectively connected to the two ends of the support shaft. The two connecting rods 12 are respectively fastened to the two positioning balance rods 7. A contoured semicircular plate 8 is rotatably mounted in the middle position of the positioning balance rods 7. A rotating shaft 13 is provided on the support shaft 11 and is rotatably mounted on the base 1. The rotation axis of the rotating shaft 13 is parallel to the axis of the semiconductor component 10. The rotating shaft 13 is located in the middle position of the support shaft, and the axis of the rotating shaft 13 intersects the axis of the support shaft perpendicularly. The rotation axis of the contoured semicircular plate 8 intersects the axis of the semiconductor component 10 perpendicularly.

[0058] A recessed clearance groove 14 is provided on the surface of the base 1 corresponding to the support shaft 11. Two supports 15 are provided on the base 1 corresponding to the rotating shaft 13. Both supports 15 are provided with connecting holes. The two ends of the rotating shaft 13 are rotatably connected to the two connecting holes respectively. The clearance groove 14 is placed between the two supports 15. The depth of the clearance groove 14 gradually increases from the middle to both ends.

[0059] A limiting block 16 is installed on the base 1 and is slidably mounted thereon. A sliding block is provided on the base 1 and corresponding to the limiting block 16. A sliding groove is provided on the sliding block. A slider is provided at the bottom of the limiting block 16. The slider is slidably connected to the sliding groove. Both the slider and the sliding groove are isosceles trapezoidal structures. Two limiting parts 17 are provided on the limiting block 16. The two limiting parts 17 are respectively placed on both sides of the rotation center of the support shaft 11. A guide surface 18 and a limiting surface 19 are provided on the limiting parts 17. The guide surface 18 is inclined. The two limiting surfaces 19 support and limit the support shaft 11 on both sides of the rotation center.

[0060] The limiting block 16 allows the support shaft 11 to rotate and lock in position. When the limiting block 16 moves away from the support shaft 11, the limiting surface 19 separates from the support shaft 11, and the limiting block 16 loses its limiting effect on the support shaft 11, at which point the support shaft 11 can rotate. When the limiting block 16 moves closer to the support shaft 11, the guide surface 18 slides over the outer wall of the support shaft 11 and supports the support shaft 11 on the limiting surface 19. At this point, the support shaft 11 is in a horizontal state and cannot rotate, facilitating the inspection of the mounting hole 27.

[0061] The radius of the contoured semicircular plate 8 is slightly larger than the radius of the inner wall of the semiconductor part 10. A deflection scale line 20 is set on the outer wall of the positioning balance rod 7. The deflection scale line 20 is arranged circumferentially. A pointer 21 is set on the contoured semicircular plate 8. The pointer 21 points to the deflection scale line 20.

[0062] An angle measuring rod 22 is installed at the bottom of the loading slot 2. The angle measuring rod 22 is rotated. The distance 'a' between the outer wall of the loading slot 2 and the circumferential outline of the semiconductor part 10 is 'a', where 'a' is the maximum allowable roundness error of the outer wall of the semiconductor part 10. An angle scale line 23 is set between the base 1 and the angle measuring rod 22. The angle scale line 23 is circumferentially set on the side wall of the base 1. An alignment line is set on the angle measuring rod 22, and the alignment line is aligned with the angle scale line 23.

[0063] A hole position detection element 24 is mounted on the base 1. A sliding detection block 25 is provided on the hole position detection element 24. An isosceles trapezoidal guide rail is provided at the bottom of the detection block 25. A guide groove adapted to the guide rail is provided on the hole position detection element 24, and the guide rail and guide groove are movably inserted and connected. A detection pin 26 is provided on the detection block 25, and the detection pin 26 is aligned with the mounting hole 27 on the semiconductor component 10.

[0064] Both ends of the positioning balance rod 7 are equipped with spring blocks 28, and a buffer spring 29 is installed between the spring blocks 28 and the positioning balance rod 7. Both ends of the positioning balance rod 7 are provided with connecting grooves 30. The upper part of the spring blocks 28 and the buffer spring 29 are installed in the connecting grooves 30. The end of the positioning balance rod 7 is connected to a positioning plug 31, and the buffer spring 29 abuts against the positioning plug 31 and the spring blocks 28. The lower part of the opposite surfaces of the two spring blocks 28 is provided with a pushing surface 32. The two pushing surfaces 32 are inclined from top to bottom in a direction away from each other. The positioning balance rod 7 is provided with an outer diameter scale line along its length.

[0065] During the process of the positioning balance bar 7 being pressed down to the open end of the semiconductor component 10, the outer edge of the open end of the semiconductor component 10 comes into contact with the pushing surface 32, thereby pushing the spring block 28 to move. The outer diameter of the semiconductor component 10 is indirectly measured by the distance the spring block 28 moves.

[0066] During the inspection of the semi-circular semiconductor component 10, the semiconductor component 10 is placed with its opening facing upwards into the loading groove 2 on the base 1. The support roller 9 at the bottom of the loading groove 2 supports the semiconductor component 10, reducing the contact area of ​​the outer surface of the semiconductor component 10 and thus reducing the risk of scratches. Then, the push plate 4 is pushed so that one end of the semiconductor component 10 is against the reference surface 3, and the other end of the semiconductor component 10 is against the push plate 4. The length of the semiconductor component 10 can be indirectly measured by the distance the push plate 4 moves. After the semiconductor component 10 is loaded into place, the positioning balance rod 7 contacts the two sides of the opening of the semiconductor component 10. At this time, the positioning balance rod 7 is in a horizontal position, and the two sides of the opening of the semiconductor component 10 are on the same horizontal plane, which means that the semiconductor component 10 is in a correct posture. If the positioning pin can pass through the mounting hole 27 during the inspection process, it means that the positional accuracy of the mounting hole 27 meets the requirements.

[0067] The positioning balance rod 7 is flipped downwards and pressed against the upper opening of the semiconductor part 10, ensuring that the positioning balance rod 7 contacts both sides of the opening of the semiconductor part 10. This ensures that the contour semicircular plate 8 is coaxial with the semiconductor part 10. Then, the contour semicircular plate 8 is flipped downwards, with its radius slightly larger than the radius of the inner wall of the semiconductor part 10. The contour semicircular plate 8 stops rotating after touching the inner wall of the semiconductor part 10. The inner diameter of the semiconductor part 10 is determined by observing the angle through which the contour semicircular plate 8 has rotated. If the angle of rotation of the contour semicircular plate 8 is within the set angle range, the inner diameter of the semiconductor part 10 is determined to meet the inspection requirements.

[0068] When the roundness of the outer wall of semiconductor component 10 is detected, the support shaft 11 rotates, thereby driving the semiconductor component 10 to rotate. If the roundness error of the outer wall of semiconductor component 10 exceeds the maximum error value, the angle measuring rod 22 contacts the outer wall of semiconductor component 10. At this time, the angle measuring rod 22 is pushed and deflected by the frictional force. Therefore, the roundness of the outer wall of semiconductor component 10 can be judged by observing the deflection angle of the angle measuring rod 22.

[0069] Example 4: A semi-circular semiconductor component inspection fixture (see...) Figure 5 , Figure 6The device includes a base 1, which is elongated and has a loading groove 2 on its upper surface. The loading groove 2 is semi-circular and has a reference surface 3 at one end. A movable push plate 4, also semi-circular, is mounted on the other end of the loading groove 2. The push plate 4 is connected to a push rod 5, which has length graduations 6 and is movably inserted into the base 1. The push rod 5 pushes the push plate 4, thereby pushing the semiconductor component 10. The length graduations 6 on the push rod 5 facilitate the measurement of the length of the semiconductor component 10. An insertion hole is provided on the side of the loading groove 2 opposite to the reference surface 3. The push rod 5 is fitted into the insertion hole and connected. A flange is provided at the end of the push rod 5 to limit its movement and prevent it from going too far.

[0070] The base 1 is rotatably connected to the positioning balance bar 7, and the contour semi-circular plate 8 is rotatably mounted on the positioning balance bar 7. At least one pair of support rollers 9 are installed at the bottom of the loading groove 2. In this embodiment, two support rollers 9 are provided, and both ends of the two support rollers 9 are rotatably connected to the base 1. The outer wall of the support roller 9 protrudes from the side wall of the loading groove 2. The semiconductor part 10 is loaded in the loading groove 2. The semiconductor part 10 is supported on the support rollers 9. The positioning balance bar 7 presses on the open end of the semiconductor part 10, and the push plate 4 pushes against the end of the semiconductor part 10.

[0071] A rotatable support shaft 11 is mounted on the base 1. Two connecting rods 12 are rotatably connected to the support shaft 11, and the two connecting rods 12 are respectively connected to the two ends of the support shaft. The two connecting rods 12 are respectively fastened to the two positioning balance rods 7. A contoured semicircular plate 8 is rotatably mounted in the middle position of the positioning balance rods 7. A rotating shaft 13 is provided on the support shaft 11 and is rotatably mounted on the base 1. The rotation axis of the rotating shaft 13 is parallel to the axis of the semiconductor component 10. The rotating shaft 13 is located in the middle position of the support shaft, and the axis of the rotating shaft 13 intersects the axis of the support shaft perpendicularly. The rotation axis of the contoured semicircular plate 8 intersects the axis of the semiconductor component 10 perpendicularly.

[0072] A recessed clearance groove 14 is provided on the surface of the base 1 corresponding to the support shaft 11. Two supports 15 are provided on the base 1 corresponding to the rotating shaft 13. Both supports 15 are provided with connecting holes. The two ends of the rotating shaft 13 are rotatably connected to the two connecting holes respectively. The clearance groove 14 is placed between the two supports 15. The depth of the clearance groove 14 gradually increases from the middle to both ends.

[0073] A limiting block 16 is installed on the base 1 and is slidably mounted thereon. A sliding block is provided on the base 1 and corresponding to the limiting block 16. A sliding groove is provided on the sliding block. A slider is provided at the bottom of the limiting block 16. The slider is slidably connected to the sliding groove. Both the slider and the sliding groove are isosceles trapezoidal structures. Two limiting parts 17 are provided on the limiting block 16. The two limiting parts 17 are respectively placed on both sides of the rotation center of the support shaft 11. A guide surface 18 and a limiting surface 19 are provided on the limiting parts 17. The guide surface 18 is inclined. The two limiting surfaces 19 support and limit the support shaft 11 on both sides of the rotation center.

[0074] The limiting block 16 allows the support shaft 11 to rotate and lock in position. When the limiting block 16 moves away from the support shaft 11, the limiting surface 19 separates from the support shaft 11, and the limiting block 16 loses its limiting effect on the support shaft 11, at which point the support shaft 11 can rotate. When the limiting block 16 moves closer to the support shaft 11, the guide surface 18 slides over the outer wall of the support shaft 11 and supports the support shaft 11 on the limiting surface 19. At this point, the support shaft 11 is in a horizontal state and cannot rotate, facilitating the inspection of the mounting hole 27.

[0075] An angle measuring rod 22 is installed at the bottom of the loading slot 2. The angle measuring rod 22 is rotated. The distance 'a' between the outer wall of the loading slot 2 and the circumferential outline of the semiconductor part 10 is 'a', where 'a' is the maximum allowable roundness error of the outer wall of the semiconductor part 10. An angle scale line 23 is set between the base 1 and the angle measuring rod 22. The angle scale line 23 is circumferentially set on the side wall of the base 1. An alignment line is set on the angle measuring rod 22, and the alignment line is aligned with the angle scale line 23.

[0076] A hole position detection element 24 is mounted on the base 1. A sliding detection block 25 is provided on the hole position detection element 24. An isosceles trapezoidal guide rail is provided at the bottom of the detection block 25. A guide groove adapted to the guide rail is provided on the hole position detection element 24, and the guide rail and guide groove are movably inserted and connected. A detection pin 26 is provided on the detection block 25, and the detection pin 26 is aligned with the mounting hole 27 on the semiconductor component 10.

[0077] Both ends of the positioning balance rod 7 are equipped with spring blocks 28, and a buffer spring 29 is installed between the spring blocks 28 and the positioning balance rod 7. Both ends of the positioning balance rod 7 are provided with connecting grooves 30. The upper part of the spring blocks 28 and the buffer spring 29 are installed in the connecting grooves 30. The end of the positioning balance rod 7 is connected to a positioning plug 31, and the buffer spring 29 abuts against the positioning plug 31 and the spring blocks 28. The lower part of the opposite surfaces of the two spring blocks 28 is provided with a pushing surface 32. The two pushing surfaces 32 are inclined from top to bottom in a direction away from each other. The positioning balance rod 7 is provided with an outer diameter scale line along its length.

[0078] During the process of the positioning balance bar 7 being pressed down to the open end of the semiconductor component 10, the outer edge of the open end of the semiconductor component 10 comes into contact with the pushing surface 32, thereby pushing the spring block 28 to move. The outer diameter of the semiconductor component 10 is indirectly measured by the distance the spring block 28 moves.

[0079] The outer edge of the contoured semicircular plate 8 is adapted to the inner wall of the semiconductor component 10. A piston cylinder 33 is installed on the contoured semicircular plate 8. A large piston 34 and a return spring 35 are installed inside the piston cylinder 33. The large piston 34 is connected to a contact rod 36. The return spring 35 abuts against the large piston 34. The contact rod 36 extends radially out of the outer edge of the contoured semicircular plate 8 by a length of b, where b is the maximum allowable error value of the inner diameter of the semiconductor component 10. The piston cylinder 33 is connected to a small flow channel 37. A small piston 38 and a return spring 39 are installed inside the small flow channel 37. The diameter of the small piston 38 is much smaller than the diameter of the large piston 34. Hydraulic oil is filled into the piston cylinder 33. The small piston 38 is connected to a stroke amplification rod 40. The return spring 39 abuts against the small piston 38. A conductive contact 41 is installed inside the small flow channel 37. The conductive contact 41 is connected to the indicator light circuit. When the stroke amplification rod 40 moves and touches the conductive contact 41, the indicator light illuminates. A wiring ring 42 is provided at the end of the small flow channel 37, and two conductive contacts 41 are installed on the inner wall of the wiring ring 42. A conductive ring 43 is provided on the outer wall of the end of the stroke amplification rod 40, and the conductive ring 43 is located close to the conductive contacts 41.

[0080] During the inspection of the semi-circular semiconductor component 10, the semiconductor component 10 is placed with its opening facing upwards into the loading groove 2 on the base 1. The support roller 9 at the bottom of the loading groove 2 supports the semiconductor component 10, reducing the contact area of ​​the outer surface of the semiconductor component 10 and thus reducing the risk of scratches. Then, the push plate 4 is pushed so that one end of the semiconductor component 10 is against the reference surface 3, and the other end of the semiconductor component 10 is against the push plate 4. The length of the semiconductor component 10 can be indirectly measured by the distance the push plate 4 moves. After the semiconductor component 10 is loaded into place, the positioning balance rod 7 contacts the two sides of the opening of the semiconductor component 10. At this time, the positioning balance rod 7 is in a horizontal position, and the two sides of the opening of the semiconductor component 10 are on the same horizontal plane, which means that the semiconductor component 10 is in a correct posture. If the positioning pin can pass through the mounting hole 27 during the inspection process, it means that the positional accuracy of the mounting hole 27 meets the requirements.

[0081] During the inner diameter detection of semiconductor component 10, the positioning balance rod 7 is flipped downwards and pressed against the upper opening of semiconductor component 10. The positioning balance rod 7 contacts the two side edges of the opening of semiconductor component 10, ensuring that the contour semicircular plate 8 is coaxial with semiconductor component 10. Then, the contour semicircular plate 8 is flipped downwards. If the contour semicircular plate 8 cannot rotate past the inner bottom surface of semiconductor component 10, it indicates that the inner diameter of semiconductor component 10 does not meet the requirements. If the contour semicircular plate 8 can rotate past the inner bottom surface of semiconductor component 10, and the contact rod 36 can touch the inner bottom surface of semiconductor component 10, the contact rod 36 pushes the large piston 34 to move. The medium in the piston cylinder 33 flows into the small flow channel 37 and drives the small piston 38 to move. Since the area of ​​the large piston 34 is much larger than the area of ​​the small piston 38, the distance that the small piston 38 moves is amplified. The stroke amplification rod 40 moves and touches the conductive contact plate 41, causing the indicator light to light up, indicating that the inner diameter of semiconductor component 10 meets the requirements.

[0082] When the roundness of the outer wall of semiconductor component 10 is detected, the support shaft 11 rotates, thereby driving the semiconductor component 10 to rotate. If the roundness error of the outer wall of semiconductor component 10 exceeds the maximum error value, the angle measuring rod 22 contacts the outer wall of semiconductor component 10. At this time, the angle measuring rod 22 is pushed and deflected by the frictional force. Therefore, the roundness of the outer wall of semiconductor component 10 can be judged by observing the deflection angle of the angle measuring rod 22.

[0083] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any way. Other variations and modifications may be made without departing from the technical solutions described in the claims.

Claims

1. A semi-circular semiconductor component inspection fixture, characterized in that, The system includes a base with a loading groove. A reference surface is set at one end of the loading groove, and a movable push plate is installed at the other end. A positioning balance rod is rotatably connected to the base, and a contoured semicircular plate is rotatably mounted on the positioning balance rod. At least one pair of support rollers are installed at the bottom of the loading groove. Semiconductor components are loaded in the loading groove and supported on the support rollers. The positioning balance rod presses against the open end of the semiconductor component, and the push plate presses against the end of the semiconductor component. A support shaft is installed on the base, and a connecting rod is rotatably connected to the support shaft. The connecting rod is fastened to the positioning balance rod. A rotating shaft is installed on the support shaft and is rotatably mounted on the base. The rotation axis of the rotating shaft is parallel to the axis of the semiconductor component and perpendicularly intersects the axis of the support shaft. The rotation axis of the contoured semicircular plate is perpendicularly intersecting the axis of the semiconductor component. The radius of the contoured semicircular plate is slightly larger than the radius of the inner wall of the semiconductor component. The contoured semicircular plate flips downward and stops rotating after touching the inner wall of the semiconductor component. The inner diameter of the semiconductor component is judged by observing the angle through which the contoured semicircular plate has rotated.

2. The semi-circular semiconductor component inspection fixture according to claim 1, characterized in that, The push plate is connected to the push rod, which has length scale lines. The push rod is movably inserted into the base.

3. The semi-circular semiconductor component inspection fixture according to claim 1, characterized in that, A hole position detection element is installed on the base. The hole position detection element is equipped with a sliding detection block. The detection block is equipped with a detection pin, which is aligned with the mounting hole on the semiconductor component.

4. The semi-circular semiconductor component inspection fixture according to claim 1, characterized in that, A lateral sliding limit block is installed on the base. The limit block has two limiting parts, which are respectively placed on both sides of the rotation center of the support shaft. The limiting parts are provided with guide surfaces and limiting surfaces. The guide surfaces are inclined, and the two limiting surfaces support and limit the support shaft on both sides of the rotation center.

5. The semi-circular semiconductor component inspection fixture according to claim 1, characterized in that, An angle measuring rod is installed at the bottom of the loading tank. The distance between the outer wall of the loading tank and the circumferential outline of the semiconductor part is 'a', where 'a' is the maximum allowable roundness error.

6. The semi-circular semiconductor component inspection fixture according to claim 1, characterized in that, A recessed clearance groove is provided on the base surface corresponding to the support shaft.

7. The semi-circular semiconductor component inspection fixture according to claim 1, characterized in that, Both ends of the positioning balance bar are equipped with spring blocks, and a buffer spring is installed between the spring blocks and the positioning balance bar. The lower part of the opposite surface of the two spring blocks is provided with a pushing surface. The two pushing surfaces are inclined from top to bottom in a direction away from each other. The outer diameter scale line is provided on the positioning balance bar along the length direction.

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