Optoelectronic chip packaging structure and packaging method thereof

Abstract

The present invention provides an optoelectronic chip packaging structure and a packaging method thereof. The optoelectronic chip packaging method includes the following steps: providing an initial structure, the initial structure including a substrate, an optical chip arranged on the surface of the substrate, and an electrical chip arranged on the surface of the optical chip, the surface of one side of the optical chip having an optical port; providing a heat dissipation cover and packaging the heat dissipation cover onto the surface of the initial structure, wherein the heat dissipation cover includes a first body and a first bent portion surrounding the edge of the first body, the first body is provided with a notch corresponding to the top of the optical port, the first bent portion is provided with an opening corresponding to the side of the optical port, the notch is connected to the opening, and a protective structure covering the notch and the opening is also formed on the surface of the heat dissipation cover. The above technical solution protects the optical port during the process and transportation before shipment by providing a protective structure covering the optical port in the optoelectronic packaging structure, thereby preventing the optical port from being contaminated or damaged during the process and ensuring the cleanliness and yield of the product.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging, and in particular to a photoelectric chip packaging structure and a packaging method thereof. Background Art

[0002] With the development of information technology, increasingly higher requirements are being placed on the transmission rate, latency, energy efficiency, and other aspects of optical modules. Co-packaged optoelectronic (CPO) structures, which encapsulate optical chips and electronic chips in the same package, have become increasingly widely used. In optoelectronic chip packaging structures, through-silicon vias are made on the optical chip or electronic chip, which is then vertically stacked with a matching electronic chip / optical chip. The resulting three-dimensional optoelectronic integrated package has the advantages of high interconnect density and low parasitic parameters, making it an important development direction for high-speed optical interconnects. However, during the packaging process, the optical port of the optical chip is easily contaminated or damaged during the plastic encapsulation process. Photosensitive devices have extremely high requirements for optical port cleanliness. Therefore, how to protect the optical port of the optical chip and prevent it from being contaminated or damaged during the process is a problem that needs to be solved. Summary of the Invention

[0003] The technical problem to be solved by the present invention is how to protect the optical port of an optical chip and prevent the optical port from being contaminated or damaged during the process, and provides a photoelectric chip packaging structure and a packaging method thereof.

[0004] In order to solve the above problems, the present invention provides an optoelectronic chip packaging method, comprising the following steps: providing an initial structure, the initial structure comprising a substrate, an optical chip arranged on the surface of the substrate, and an electrical chip arranged on the surface of the optical chip, wherein the surface of one side of the optical chip has an optical port; providing a heat dissipation cover and packaging the heat dissipation cover onto the surface of the initial structure, wherein the heat dissipation cover comprises a first body and a first bent portion surrounding the edge of the first body, the first body correspondingly providing a notch above the optical port, the first bent portion correspondingly providing an opening on the side of the optical port, the notch being connected to the opening, and a protective structure covering the notch and the opening being formed on the surface of the heat dissipation cover facing away from the substrate.

[0005] In order to solve the above problems, the present invention provides an optoelectronic chip packaging structure, including: an initial structure, the initial structure including a substrate, an optical chip arranged on the surface of the substrate, and an electrical chip arranged on the surface of the optical chip, the surface of one side of the optical chip having an optical port; a heat dissipation cover plate, the heat dissipation cover plate including a first body and a first bent portion surrounding the edge of the first body, the first body correspondingly providing a notch above the optical port, the first bent portion correspondingly providing an opening on the side of the optical port, the notch being connected to the opening, and a protective structure covering the notch and the opening being formed on the surface of the heat dissipation cover plate facing away from the substrate.

[0006] The above technical solution sets a protective structure covering the notches and openings on the surface of the heat dissipation cover plate, forming a closed cavity to protect the light port during the packaging process, and protects the light port during transportation before shipment, thereby preventing the light port from being contaminated or damaged during the process and ensuring the cleanliness and yield of the product.

[0007] It should be understood that the above general description and the following detailed description are exemplary and explanatory only and do not limit the present invention. Technologies, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be considered part of the specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] To more clearly illustrate the technical solutions in the specific embodiments of the present invention, the following briefly introduces the drawings required for describing the specific embodiments. Obviously, the drawings described below are only some specific embodiments of the present invention. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0009] Figure 1 This is a top view of an optoelectronic chip packaging structure in the prior art.

[0010] Figure 2 for Figure 1 Cross-sectional view along AA' direction.

[0011] Figure 3 This is a flow chart of the steps of the first embodiment of the optoelectronic chip packaging method of the present invention.

[0012] Figure 4 The present invention provides a schematic structural diagram of an initial structure of the first embodiment of the optoelectronic chip packaging method.

[0013] Figure 5 The present invention provides a schematic structural diagram of a heat dissipation cover plate according to a first embodiment of the optoelectronic chip packaging method.

[0014] Figure 6 This is a structural schematic diagram of packaging the heat dissipation cover plate onto the surface of the initial structure according to the first embodiment of the optoelectronic chip packaging method of the present invention.

[0015] Figure 7 This is a structural schematic diagram of removing the protective structure of the first embodiment of the optoelectronic chip packaging method of the present invention.

[0016] Figure 8 This is a schematic structural diagram of an optoelectronic chip packaging structure formed by the second embodiment of the optoelectronic chip packaging method of the present invention. DETAILED DESCRIPTION

[0017] The following is a clear and complete description of the technical solutions in the embodiments of the present invention, with reference to the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present invention.

[0018] See also Figures 1 and 2 ,in, Figure 1 This is a top view of an optoelectronic chip packaging structure in the prior art. Figure 2 for Figure 1 The cross-sectional view along the AA' direction. Figures 1 and 2 As shown, the optoelectronic chip packaging structure includes a substrate 11, an optical chip 12, an electrical chip 13, and a heat dissipation cover 14. Among them, an optical port 120 is provided on the surface of one side of the optical chip 12, and a notch 140 is provided on the surface of the heat dissipation cover 14, and the notch 140 exposes the optical port 120. The optoelectronic chip packaging structure is used in photosensitive devices. The optical port 120 needs to remain exposed to align and connect with the external optical fiber to achieve optical coupling. Therefore, since photosensitive devices have extremely high requirements for the cleanliness of the chip surface, and the surface of such chips (especially the optical port 120) is extremely fragile, the chip that needs to be protected is exposed throughout, and the optical port 120 is at the edge, which is difficult to protect. Conventional packaging will have problems with poor cleanliness and low quality.

[0019] In order to protect the optical port of the optical chip and prevent it from being contaminated or damaged during the process, the present invention provides a method for packaging an optoelectronic chip. Figure 3 as well as Figures 4 to 6 ,in, Figure 3 This is a flowchart of the steps of the first embodiment of the optoelectronic chip packaging method of the present invention; Figures 4 to 6 This is a process flow chart of the first embodiment of the optoelectronic chip packaging method of the present invention; wherein, Figures 4 to 6 Part (b) is a top view of the structure, and part (a) is a cross-sectional view along the BB' direction of part (b). Figure 3As shown, the optoelectronic chip packaging method includes the following steps: step S31, providing an initial structure, the initial structure including a substrate, an optical chip arranged on the surface of the substrate, and an electrical chip arranged on the surface of the optical chip, and the surface of one side of the optical chip has an optical port; step S32, providing a heat dissipation cover and packaging the heat dissipation cover to the surface of the initial structure, wherein the heat dissipation cover includes a first body and a first bending portion surrounding the edge of the first body, the first body has a notch correspondingly arranged above the optical port, the first bending portion has an opening correspondingly arranged on the side of the optical port, the notch is connected to the opening, and a protective structure covering the notch and the opening is also formed on the surface of the heat dissipation cover.

[0020] See also Figure 4 And step S31, providing an initial structure 40, the initial structure 40 includes a substrate 41, an optical chip 42 arranged on the surface of the substrate 41, and an electrical chip 43 arranged on the surface of the optical chip 42, and a surface of one side of the optical chip 42 has an optical port 420.

[0021] In some embodiments, the substrate 41 is a substrate for electrically connecting the semiconductor chip to other external devices. The substrate 41 may include circuit traces in a substrate body of a dielectric material layer. The substrate 41 may include a package substrate, an interposer, or a printed circuit board (PCB).

[0022] In some embodiments, the optical chip 42 can be an active optoelectronic chip such as a laser, modulator, or detector, or an optoelectronic integrated chip with multiple structures. The optical chip 42 can be made of a silicon optical chip or a semiconductor material such as indium, gallium, arsenic, or phosphorus, or silicon carbide or silicon nitride. The optical port 420 of the optical chip 42 is used to align and connect with an external optical fiber to achieve optical coupling.

[0023] In some embodiments, the functional circuit (not shown) on the surface of the optical chip 42 is electrically connected to the substrate 41 via bonding wires 421. In other embodiments, a through-silicon via (TSV) penetrating the optical chip 42 may be provided in the optical chip 42 to electrically connect the functional circuit on the surface of the optical chip 42 to the substrate 41.

[0024] In some embodiments, the electrical chip 43 is a chip related to the optical chip 42 and needs to be interconnected, including a driver chip, an amplifier chip, a signal processing chip, an ASIC chip, a power supply chip, etc. The electrical chip 43 is assembled on the upper surface of the optical chip 42 by flip-chip bonding or wire bonding.

[0025] See also Figures 5 and 6 And step S32, providing a heat dissipation cover 44 and encapsulating the heat dissipation cover 44 to the surface of the initial structure 40, wherein the heat dissipation cover 44 includes a first body 441 and a first bending portion 442 surrounding the edge of the first body 441, the first body 441 correspondingly sets a notch 443 above the light port 420, the first bending portion 442 correspondingly sets an opening 444 on the side of the light port 420, the notch 443 is connected to the opening 444, and the surface of the heat dissipation cover 44 away from the substrate 41 is also formed with a protective structure 45 covering the notch 443 and the opening 444.

[0026] In some embodiments, the protective structure 45 is a UV-sensitive film 451. The UV-sensitive film 451 is formed outside the notch 443 and the opening 444, forming a sealed protective cavity 490 between the heat dissipation cover plate 44, the protective structure 45, and the initial structure 40. The UV-sensitive film 451 is a special film whose viscosity changes significantly upon exposure to ultraviolet light. Before exposure to ultraviolet light, the UV-sensitive film 451 has an extremely high viscosity, firmly adhering to the surface of the heat dissipation cover plate 44, forming the protective structure 45 and covering the notch 443 and the opening 444. During the packaging of the heat dissipation cover plate 44, the optical port 420 is located within the sealed protective cavity 490. This sealed protective cavity 490 prevents contamination of the optical port 420 during the manufacturing process, ensuring stability during processing. The heat dissipation cover plate 44 with the protective structure 45 effectively protects the optical port 420 on the surface of the optical chip 42 during both pre-shipment processing and transportation.

[0027] After completing the above steps, the optoelectronic chip packaging structure of the first embodiment of the optoelectronic chip packaging method of the present invention can be obtained. Figure 6 shown.

[0028] See also Figure 7 , which is a structural diagram of removing the protective structure of the first embodiment of the optoelectronic chip packaging method of the present invention; wherein, Figure 7 Part (b) is a top view of the structure, and part (a) is a cross-sectional view along the BB' direction of part (b). Figure 7 As shown, after completing the packaging process and before shipment, the optoelectronic chip packaging method further includes the step of removing the protective structure. In this embodiment, the step of removing the protective structure includes irradiating the UV-sensitive film with UV light. Once irradiated with UV light, the viscosity of the UV-sensitive film decreases significantly, facilitating demolding of the protective structure.

[0029] See also Figure 8, which is a schematic structural diagram of the optoelectronic chip packaging structure formed by the second embodiment of the optoelectronic chip packaging method of the present invention. Figure 8 As shown, in this embodiment, the protective structure is a protective cover 86, which includes a second body 861 and a second bending portion 862. The second body 861 is magnetically fixed to the surface of the first body 841 of the heat dissipation cover 84 and covers the notch 843. The second bending portion 862 is arranged on the side of the second body 861 close to the notch 843 and covers the opening 844.

[0030] This embodiment adds a removable protective cover 86 to the surface of the heat dissipation cover 84. The second body 861 of the protective cover 86 is fixed to the first body 841 of the heat dissipation cover 84 by magnetic attraction. The second body 861 of the protective cover 86 covers the notch 843 of the heat dissipation cover 84, protecting the optical port 820 from above. The second bent portion 862 covers the opening 844 and covers the optical port 820 from the side of the optical port 820. The protective cover 86 relatively isolates the optical port 820 from the external environment, reducing the dust-free cleanliness requirements of subsequent processes, preventing contaminants from contaminating the optical port 820 of the product in subsequent processes, and improving product yield. In addition, the optoelectronic chip packaging structure of this embodiment is relatively simple, and the disassembly and assembly of the protective cover 86 can be automated, improving production efficiency. The disassembled protective cover 86 can be reused, greatly reducing usage costs.

[0031] In some embodiments, at least one first magnetic member 840 is disposed in the first body 841 of the heat dissipation cover 84 , and at least one second magnetic member 860 corresponding to the first magnetic member 840 is disposed in the second body 861 of the protective cover 86 .

[0032] In this embodiment, the protective cover 86 is a glass cover.

[0033] In other embodiments, the heat dissipation cover plate 84 and the protective cover plate 86 may also be made of magnetic materials, without providing magnetic parts in the heat dissipation cover plate 84 and the protective cover plate 86 .

[0034] In this embodiment, the steps of encapsulating the heat dissipation cover 84 to the surface of the initial structure and forming a protective structure covering the optical port 820 are as follows: (1) the protective cover 86 is set on the surface of the heat dissipation cover 84, the second body 861 is set on the surface of the first body 841 of the heat dissipation cover 84 and covers the notch 843, and the second bending portion 862 is set on the side of the second body 861 close to the notch 843 and covers the opening 844; (2) the heat dissipation cover 84 is encapsulated to the surface of the initial structure, and the notch 843, the opening 844 and the optical port 820 are set correspondingly.

[0035] In this embodiment, before shipment after the packaging process is completed, the optoelectronic chip packaging method further includes the step of removing the protective structure. The step of removing the protective structure includes: demagnetizing the first magnetic member 840 and the second magnetic member 860, removing the protective cover 86, and obtaining Figure 7 The structure shown.

[0036] Based on the same inventive concept, some embodiments of the present invention further provide an optoelectronic chip packaging structure.

[0037] See also Figure 6 , which is a structural diagram of the first embodiment of the optoelectronic chip packaging structure of the present invention. Figure 6 As shown, the optoelectronic chip packaging structure includes: an initial structure 40, a heat dissipation cover plate 44, and a protective structure 45. The initial structure 40 includes a substrate 41, an optical chip 42 disposed on the surface of the substrate 41, and an electrical chip 43 disposed on the surface of the optical chip 42. The optical chip 42 has an optical port 420 on one side of the surface. The heat dissipation cover plate 44 includes a first body 441 and a first bent portion 442 surrounding the edge of the first body 441. The first body 441 has a notch 443 corresponding to the optical port 420, and the first bent portion 442 has an opening 444 corresponding to the side of the optical port 420. The notch 443 communicates with the opening 444. A protective structure 45 covering the notch 443 and the opening 444 is also formed on the surface of the heat dissipation cover plate 44 facing away from the substrate 41.

[0038] In some embodiments, the protective structure 45 is a UV-sensitive film 451 . The UV-sensitive film 451 is formed outside the notch 443 and the opening 444 , and a sealed protective cavity 490 is formed between the heat dissipation cover 44 , the protective structure 45 , and the initial structure 40 .

[0039] The heat dissipation cover plate 44 with the protective structure 45 can effectively protect the optical port 420 on the surface of the optical chip 42 during the pre-shipment process and transportation, thereby ensuring the cleanliness and yield rate of the product.

[0040] See also Figure 8 , which is a structural diagram of the second embodiment of the optoelectronic chip packaging structure of the present invention. Figure 8 As shown, this embodiment is Figure 6 The difference between the shown embodiment is that the protective structure is a protective cover 86, which includes a second body 861 and a second bending portion 862. The second body 861 is magnetically fixed to the surface of the first body 841 of the heat dissipation cover 84 and covers the notch 843. The second bending portion 862 is arranged on the side of the second body 861 close to the notch 843 and covers the opening 844.

[0041] In some embodiments, at least one first magnetic member 840 is disposed in the first body 841 of the heat dissipation cover 84 , and at least one second magnetic member 860 corresponding to the first magnetic member 840 is disposed in the second body 861 of the protective cover 86 .

[0042] In this embodiment, the protective cover 86 is a glass cover.

[0043] In other embodiments, the heat dissipation cover plate 84 and the protective cover plate 86 may also be made of magnetic materials, without providing magnetic parts in the heat dissipation cover plate 84 and the protective cover plate 86 .

[0044] This embodiment adds a removable protective cover 86 to the surface of the heat dissipation cover 84 facing away from the substrate 41. The second body 861 of the protective cover 86 is fixed to the first body 841 of the heat dissipation cover 84 by magnetic attraction. The second body 861 of the protective cover 86 covers the notch 843 of the heat dissipation cover 84, protecting the optical port 820 from above. The second bent portion 862 covers the opening 844 and covers the optical port 820 from the side. The protective cover 86 relatively isolates the optical port 820 from the external environment, reducing the dust-free cleanliness requirements of subsequent processes, preventing contaminants from contaminating the optical port 820 in subsequent processes, and improving product yield. In addition, the optoelectronic chip packaging structure of this embodiment is relatively simple. The assembly and disassembly of the protective cover 86 can be automated, improving production efficiency. The disassembled protective cover 86 can be reused, greatly reducing usage costs.

[0045] It should be noted that references in the specification to "one embodiment," "an embodiment," "an exemplary embodiment," "some embodiments," etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, it is within the knowledge of those skilled in the relevant art to implement such feature, structure, or characteristic in conjunction with other embodiments, whether or not explicitly described.

[0046] Typically, a term can be understood at least in part from its usage in the context. For example, the term "one or more" as used herein depends at least in part on the context and can be used to describe any feature, structure or characteristic in a singular sense, or can be used to describe a feature, structure or combination of features in a plural sense. Similarly, depending at least in part on the context, terms such as "one", "a" or "the" can also be understood to express singular usage or to express plural usage. In addition, the term "based on" can be understood as not necessarily intended to express an exclusive set of factors, but can alternatively, also depending at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connected / coupled" refers not only to the direct coupling of one component to another component, but also to the indirect coupling of one component to another component through an intermediate component.

[0047] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present invention are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Unless the context clearly indicates otherwise, it should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other unless there is a conflict. In addition, in the above description, the description of well-known components and technologies has been omitted to avoid unnecessary confusion of the concepts of the present invention. In the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0048] The above description is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for packaging an optoelectronic chip, characterized in that: The steps include: An initial structure is provided, which includes a substrate, an optical chip arranged on the surface of the substrate, and an electrical chip arranged on the surface of the optical chip, wherein the surface of one side of the optical chip has an optical port; a heat dissipation cover is provided and the heat dissipation cover is packaged to the surface of the initial structure, wherein the heat dissipation cover includes a first body and a first bent portion surrounding the edge of the first body, the first body has a notch correspondingly arranged above the optical port, the first bent portion has an opening correspondingly arranged on the side of the optical port, the notch is connected to the opening, and a protective structure covering the notch and the opening is also formed on the surface of the heat dissipation cover facing away from the substrate.

2. The method according to claim 1, characterized in that The method further comprises the steps of: The protective structure is removed.

3. The method according to claim 2, characterized in that The protective structure is an ultraviolet sensitive film, which is formed outside the notch and the opening. A closed protective cavity is formed between the heat dissipation cover plate, the protective structure and the initial structure.

4. The method according to claim 3, characterized in that The step of removing the protective structure includes: irradiating the ultraviolet sensitive film with ultraviolet light.

5. The method according to claim 2, characterized in that The protective structure is a protective cover, including a second body and a second bending portion. The second body is magnetically fixed to the first body surface of the heat dissipation cover and covers the notch. The second bending portion is arranged on a side of the second body close to the notch and covers the opening.

6. The method according to claim 5, characterized in that At least one first magnetic component is disposed in the first body of the heat dissipation cover, and at least one second magnetic component is disposed corresponding to the first magnetic component in the second body of the protection cover.

7. The method according to claim 6, characterized in that The step of removing the protective structure includes: demagnetizing the first magnetic component and the second magnetic component, and removing the protective cover.

8. An optoelectronic chip packaging structure, characterized in that: include: An initial structure comprising a substrate, an optical chip disposed on a surface of the substrate, and an electrical chip disposed on a surface of the optical chip, wherein a surface on one side of the optical chip has an optical port; The heat dissipation cover plate includes a first body and a first bent portion surrounding the edge of the first body. The first body is provided with a notch corresponding to the top of the light port, and the first bent portion is provided with an opening corresponding to the side of the light port. The notch is connected to the opening. A protective structure covering the notch and the opening is also formed on the surface of the heat dissipation cover plate facing away from the substrate.

9. The optoelectronic chip packaging structure according to claim 8, characterized in that: The protective structure is an ultraviolet sensitive film, and the ultraviolet sensitive film is formed outside the notch and the opening. A protective cavity is formed between the heat dissipation cover plate, the protective structure and the initial structure.

10. The optoelectronic chip packaging structure according to claim 8, characterized in that: The protective structure is a protective cover, including a second body and a second bending portion. The second body is magnetically fixed to the first body surface of the heat dissipation cover and covers the notch. The second bending portion is arranged on a side of the second body close to the notch and covers the opening.

11. The optoelectronic chip packaging structure according to claim 10, characterized in that: At least one first magnetic component is disposed in the first body of the heat dissipation cover, and at least one second magnetic component is disposed corresponding to the first magnetic component in the second body of the protection cover.

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