Heat dissipation module and electronic device

Abstract

The invention provides a heat dissipation module and an electronic device. The heat dissipation module comprises a first fan, a first heat dissipation fin group, a second fan, a second heat dissipation fin group, a uniform temperature plate and a heat dissipation fin. The first fan is provided with a first air inlet and a first air outlet. The first air inlet and the first air outlet are communicated with each other and located on the different sides of the first fan respectively. The second fan is provided with a second air inlet, a second air outlet and a side air outlet. The second air outlet and the side air outlet are communicated with the second air inlet. The second air inlet, the second air outlet and the side air outlet are located on the different sides of the second fan respectively. One opening direction of the side air outlet faces the first fan. The cooling fin is in thermal contact with one side of the vapor chamber and is arranged between the first fan and the second fan.

Description

Technical Field

[0001] The invention relates to a heat dissipation module and an electronic device, and in particular to a heat dissipation module comprising a fan and an electronic device comprising the heat dissipation module. Background Art

[0002] Thanks to its flat shape and ability to effectively transfer heat in two dimensions, vapor chambers have been widely used as heat transfer media. For example, in order to improve the efficiency of cooling heat sources such as CPUs or GPUs, some manufacturers will install vapor chambers in laptops to evenly and quickly transfer the heat generated by the heat source.

[0003] However, the fans in conventional laptops cannot effectively direct the cold air to the vapor chamber, and cannot effectively cool the heat source through the vapor chamber. If additional holes are drilled in the case in order to effectively direct the cold air to the vapor chamber, the number of I / O openings on the case for the input and output (I / O) ports will be sacrificed. In other words, it is difficult for conventional laptops to effectively cool the heat source through the vapor chamber without sacrificing the number of I / O openings. Summary of the invention

[0004] The object of the present invention is to provide a heat dissipation module and an electronic device, so as to effectively cool a heat source through a temperature vapor chamber without sacrificing the number of I / O openings.

[0005] A heat dissipation module disclosed in an embodiment of the present invention comprises a first fan, at least one first heat dissipation fin group, a second fan, at least one second heat dissipation fin group, a temperature averaging plate and a heat sink. The first fan has a first air inlet and at least one first air outlet. The first air inlet and the at least one first air outlet are connected to each other and are respectively located on different sides of the first fan. The at least one first heat dissipation fin group is adjacent to the at least one first air outlet. The second fan has a second air inlet, at least one second air outlet and a side air outlet. The at least one second air outlet and the side air outlet are connected to the second air inlet. The second air inlet, at least one second air outlet and the side air outlet are respectively located on different sides of the second fan. An opening direction of the side air outlet faces the first fan. The at least one second heat dissipation fin group is adjacent to the at least one second air outlet. The temperature averaging plate is thermally coupled to the at least one first heat dissipation fin group and the at least one second heat dissipation fin group. The heat sink is in thermal contact with one side of the temperature averaging plate and is between the first fan and the second fan.

[0006] The electronic device disclosed in another embodiment of the present invention comprises a housing, a motherboard, at least one heat source and a heat dissipation module. The motherboard is arranged in the housing. The at least one heat source is arranged on the motherboard. The heat dissipation module is arranged in the housing and comprises a first fan, at least one first heat dissipation fin group, a second fan, at least one second heat dissipation fin group, a temperature equalizing plate and a heat sink. The first fan has a first air inlet and at least one first air outlet. The first air inlet and the at least one first air outlet are connected to each other and are respectively located on different sides of the first fan. The at least one first heat dissipation fin group is adjacent to the at least one first air outlet. The second fan has a second air inlet, at least one second air outlet and a side air outlet. The at least one second air outlet and the side air outlet are connected to the second air inlet. The second air inlet, at least one second air outlet and the side air outlet are respectively located on different sides of the second fan. An opening direction of the side air outlet faces the first fan. The at least one second heat dissipation fin group is adjacent to the at least one second air outlet. The temperature averaging plate is thermally coupled to at least one first heat dissipation fin group and at least one second heat dissipation fin group, and is thermally coupled to at least one heat source. The heat sink is thermally in contact with a side of the temperature averaging plate away from at least one heat source, and is between the first fan and the second fan.

[0007] According to the heat dissipation module and electronic device disclosed in the above embodiments, an opening direction of the side air outlet faces the first fan. Therefore, the cold air guided by the second fan can be effectively guided to the temperature equalizer through the side air outlet. In this way, even if there is no hole in the shell accommodating the heat dissipation module, the cold air can be effectively guided to the temperature equalizer. In view of this, the heat dissipation module according to the present invention can effectively cool the heat source through the temperature equalizer without sacrificing the number of I / O openings.

[0008] In addition, since the number of I / O openings on the housing accommodating the heat dissipation module will not be sacrificed, the degree of freedom in designing the I / O openings will be increased, thereby reducing the overall manufacturing cost of the electronic device including the heat dissipation module.

[0009] Furthermore, since the heat dissipation module according to the present invention can effectively cool the heat source through the temperature vapor chamber, the heat dissipation module only needs to include two fans (a first fan and a second fan) to effectively cool the heat source. In this way, the heat dissipation module does not need to include more fans, which can reduce the difficulty of repairing the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 FIG. 4 is a schematic side cross-sectional view of an electronic device according to an embodiment of the present invention.

[0011] Figure 2 for Figure 1 A three-dimensional diagram of a heat source and a heat dissipation module of an electronic device.

[0012] Figure 3 for Figure 2A stereoscopic image of the heat dissipation module in another perspective.

[0013] Figure 4 For heat source and Figure 3 Exploded view of the heat sink module in the .

[0014] Figure 5 for Figure 1 A cross-sectional schematic diagram of the electronic device at another viewing angle.

[0015] The reference numerals are as follows:

[0016] 10: Electronic devices

[0017] 100: Shell

[0018] 110: Shell base

[0019] 111: Shell bottom plate

[0020] 112: Shell side panel

[0021] 113: Covering part

[0022] 114: Hole

[0023] 1140: External air inlet

[0024] 120: Shell cover

[0025] 150: Accommodation space

[0026] 200: Motherboard

[0027] 300: Heat source

[0028] 400: Cooling module

[0029] 410: First Fan

[0030] 411: First air inlet

[0031] 412: First air outlet

[0032] 420: first heat sink fin group

[0033] 430: Second Fan

[0034] 431: Bottom plate

[0035] 432: Ring side panel

[0036] 433: Cover

[0037] 434: Fan blade

[0038] 435: Second air inlet

[0039] 436: Second air outlet

[0040] 437: Side air outlet

[0041] 438: Outer surface

[0042] 440: Second heat sink fin group

[0043] 450: Temperature plate

[0044] 455: Heat pipe group

[0045] 460:Heat sink

[0046] 461:convex part

[0047] 465:Assembly board

[0048] 470: Wind guide structure

[0049] 471: Wind guide strip

[0050] 472: Wind guide pad

[0051] A: Opening direction

[0052] F1, F2, F3, F4, F5: Cooling airflow

[0053] C: Heat dissipation channel DETAILED DESCRIPTION

[0054] The detailed features and advantages of the embodiments of the present invention are described in detail in the following embodiments, and the contents are sufficient to enable those skilled in the art to understand the technical contents of the embodiments of the present invention and implement them accordingly. According to the contents disclosed in this specification, the claims and the drawings, those skilled in the art can easily understand the relevant purposes and advantages of the present invention. The following embodiments further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention in any viewpoint.

[0055] See also Figure 1 , Figure 1 1 is a schematic side cross-sectional view of an electronic device according to an embodiment of the present invention. In this embodiment, the electronic device 10 is, for example, a main body of a laptop computer (not shown), and includes a housing 100, a mainboard 200, two heat sources 300, and a heat dissipation module 400. A display (not shown) may also be pivotally connected to the electronic device 10. In this embodiment, the housing 100 includes a housing base 110 and a housing cover 120. The housing base 110 is, for example, a so-called D-piece, and includes a housing bottom plate 111 and a housing side plate 112. The housing side plate 112 stands on the housing bottom plate 111. The housing cover 120 is, for example, a so-called C-piece, and is stacked on a side of the housing side plate 112 away from the housing bottom plate 111. The housing bottom plate 111, the housing side plate 112, and the housing cover 120 together form a accommodating space 150.

[0056] In this embodiment, the housing bottom plate 111 includes a cover portion 113 and two perforated portions 114. The two perforated portions 114 are respectively connected to opposite sides of the cover portion 113. The two perforated portions 114 each have a plurality of external air inlets 1140. The cover portion 113 shields the accommodation space 150. In other words, the cover portion 113 is a portion of the housing bottom plate 111 that does not have an opening or a hole.

[0057] The motherboard 200 is disposed in the accommodation space 150 of the housing 100. The two heat sources 300 are, for example, a central processing unit (CPU) or a graphics processing unit (GPU). The heat source 300 is disposed and electrically connected to the motherboard 200. It should be noted that in other embodiments, the electronic device may also include only one heat source.

[0058] See also Figures 2 to 4 . Figure 2 for Figure 1 A three-dimensional diagram of a heat source and a heat dissipation module of an electronic device. Figure 3 for Figure 2 A stereoscopic image of the heat dissipation module in another perspective. Figure 4 For heat source and Figure 3 Exploded view of the heat sink module in the .

[0059] In this embodiment, the heat dissipation module 400 is disposed in the accommodating space 150 of the shell 100, and includes a first fan 410, two first heat dissipation fin groups 420, a second fan 430, two second heat dissipation fin groups 440, a temperature equalizing plate 450, a heat sink 460 and two air guide structures 470.

[0060] The first fan 410 has a first air inlet 411 and two first air outlets 412. The first air inlet 411 is connected to the two first air outlets 412. The first air inlet 411 and the two first air outlets 412 are located at different sides of the first fan 410. The two first heat dissipation fin groups 420 are respectively disposed adjacent to the two first air outlets 412.

[0061] In this embodiment, the second fan 430 includes a bottom plate 431, an annular side plate 432, a cover plate 433 and a fan blade 434, and has a second air inlet 435, two second air outlets 436 and a side air outlet 437. The annular side plate 432 stands on the bottom plate 431. The cover plate 433 is stacked on a side of the annular side plate 432 away from the bottom plate 431. The fan blade 434 is rotatably disposed on the bottom plate 431. The second air inlet 435 is located on the cover plate 433. The two second air outlets 436 and part of the side air outlet 437 are respectively located on different sides of the annular side plate 432. The two second air outlets 436 and the side air outlet 437 are connected to the second air inlet 435. An opening direction A of the side air outlet 437 is toward the first fan 410. That is, an outer surface 438 of the annular side plate 432 having the side air outlet 437 faces the first fan 410 .

[0062] In addition, in this embodiment, the side air outlet 437 is located at the connection between the annular side plate 432 and the cover plate 433. However, the present invention is not limited thereto. In other embodiments, the side air outlet can also be completely located on the annular side plate and separated from the cover plate.

[0063] The two second heat dissipation fin groups 440 are respectively disposed adjacent to the two second air outlets 436 .

[0064] See also Figure 1 and Figure 2 .like Figure 1 As shown, the first air inlet 411 and the second air inlet 435 are connected to the outer air inlets 1140 of the two hole portions 114 through the accommodation space 150. Figure 2 As shown, the first fan 410 is used to guide the heat dissipation airflows F1 and F2 to flow to the two first heat dissipation fin groups 420 through the two first air outlets 412. The second fan 430 is used to guide the heat dissipation airflows F3 and F4 to flow to the two second heat dissipation fin groups 440 through the two second air outlets 436. In other embodiments, the first fan may also have only one first air outlet, and the second fan may also have only one second air outlet. In such an embodiment, the heat dissipation module may also include only one first heat dissipation fin group and one second heat dissipation fin group.

[0065] See also Figures 2 to 4 The temperature plate 450 is thermally coupled to the two first heat dissipation fin groups 420 and the two second heat dissipation fin groups 440, and is thermally coupled to the two heat sources 300. In this embodiment, the heat dissipation module 400 may also include a heat pipe group 455. The temperature plate 450 is thermally coupled to the two first heat dissipation fin groups 420 and the two second heat dissipation fin groups 440 through the heat pipe group 455. It should be noted that the temperature plate 450, for example, has a cavity (not shown) for accommodating a capillary structure (not shown).

[0066] The heat sink 460 is in thermal contact with the side of the heat spreader 450 away from the heat source 300 and is located between the first fan 410 and the second fan 430. In this embodiment, the heat sink 460 has a plurality of protrusions 461 on the side away from the heat spreader 450. The protrusions 461 are in a grid shape and arranged in an array to increase the surface area of ​​the heat sink 460 and the heat exchange efficiency.

[0067] In this embodiment, the heat dissipation module 400 may further include an assembly plate 465 . The heat sink 460 is fixed to the temperature equalizing plate 450 via the assembly plate 465 .

[0068] See also Figures 3 to 5 , Figure 5 for Figure 1 It should be noted that in order to more clearly present the details of the present invention, Figure 5 Only two air guide structures 470, the heat sink 460 and the housing bottom plate 111 are shown. The two air guide structures 470 are separated from each other, and each includes an air guide bar 471 and an air guide pad 472. In each air guide structure 470, the air guide bar 471 protrudes from the side of the heat sink 460 away from the temperature plate 450. The air guide pad 472 is sandwiched between the air guide bar 471 and the housing bottom plate 111. Figure 3 and Figure 5 As shown, the two air guide structures 470, the heat sink 460 and the cover portion 113 of the housing bottom plate 111 together form a heat dissipation channel C, and the side air outlet 437 is connected to the heat dissipation channel C. Figure 3 As shown, with the assistance of the two air guide structures 470, a heat dissipation airflow F5 guided by the blades 434 of the second fan 430 will flow more effectively from the side air outlet 437 to the heat dissipation channel C, and then blow to the heat sink 460 thermally coupled to the temperature plate 450. In addition, the air guide strip 471 and the air guide pad 472 are made of a rigid material and a flexible material, respectively. Therefore, not only can the heat dissipation airflow F5 be prevented from leaking from the heat dissipation channel C by the rigidity of the air guide strip 471, but also the assembly difference between the air guide structure 470 and the bottom plate 111 of the housing can be absorbed by the flexible characteristics of the air guide pad 472. The air guide pad 472 is made of sponge, for example.

[0069] In this embodiment, the two air guide bars 471 and the heat sink 460 are, for example, integrally formed, which can save the cost of independently manufacturing the air guide bars 471. In other embodiments, the two air guide bars and the heat sink can also be independently manufactured components that are assembled with each other.

[0070] In other embodiments, the air guide structure may also be made entirely of rigid material or entirely of flexible material. In addition, in other embodiments, the heat dissipation module may not include an air guide structure.

[0071] According to the heat dissipation module and electronic device disclosed in the above embodiments, an opening direction of the side air outlet faces the first fan. Therefore, the cold air guided by the second fan can be effectively guided to the temperature equalizer through the side air outlet. In this way, even if there is no hole in the shell accommodating the heat dissipation module, the cold air can be effectively guided to the temperature equalizer. In view of this, the heat dissipation module according to the present invention can effectively cool the heat source through the temperature equalizer without sacrificing the number of I / O openings.

[0072] Furthermore, according to experimental data, compared with a comparative example in which the second fan does not have a side air outlet and the heat dissipation module does not include a heat sink, the temperature of the heat source according to the present invention is reduced by approximately 5 to 6 degrees Celsius, and the temperature of the shell base is reduced by approximately 3 degrees Celsius.

[0073] In addition, since the number of I / O openings on the housing accommodating the heat dissipation module will not be sacrificed, the degree of freedom in designing the I / O openings will be increased, thereby reducing the overall manufacturing cost of the electronic device including the heat dissipation module.

[0074] Furthermore, since the heat dissipation module according to the present invention can effectively cool the heat source through the temperature vapor chamber, the heat dissipation module only needs to include two fans (a first fan and a second fan) to effectively cool the heat source. In this way, the heat dissipation module does not need to include more fans, which can reduce the difficulty of repairing the heat dissipation module.

[0075] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Those skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be determined by the claims attached to this specification.

Claims

1. A heat dissipation module, comprising: A first fan having a first air inlet and at least one first air outlet, wherein the first air inlet and the at least one first air outlet are connected to each other and are located at different sides of the first fan; At least one first heat dissipation fin group is disposed adjacent to the at least one first air outlet; a second fan having a second air inlet, at least one second air outlet and a side air outlet, wherein the at least one second air outlet and the side air outlet are connected to the second air inlet, the second air inlet, the at least one second air outlet and the side air outlet are respectively located on different sides of the second fan, and an opening direction of the side air outlet faces the first fan; At least one second heat dissipation fin group is disposed adjacent to the at least one second air outlet; a temperature homogenizing plate, thermally coupled to the at least one first heat dissipation fin set and the at least one second heat dissipation fin set; and A heat sink is in thermal contact with one side of the temperature equalizing plate and is located between the first fan and the second fan.

2. The heat dissipation module as described in claim 1 further comprises two air guide structures, which protrude from a side of the heat sink away from the temperature homogenizing plate and are separated from each other, and the two air guide structures together form a heat dissipation channel, and the side air outlet is connected to the heat dissipation channel.

3. The heat dissipation module as described in claim 2, wherein the two air guide structures each include an air guide strip and an air guide pad, in each of the air guide structures, the air guide strip protrudes from a side of the heat sink away from the temperature vapor chamber, the air guide pad is stacked on a side of the air guide strip away from the heat sink, and the air guide strip and the air guide pad are made of a rigid material and a flexible material, respectively. 4 . The heat dissipation module as claimed in claim 3 , wherein the two air guide strips and the heat dissipation fin are integrally formed. 5 . The heat dissipation module according to claim 1 , wherein a side of the heat sink away from the temperature vapor chamber has a plurality of protrusions, and the plurality of protrusions are in a grid shape and arranged in an array.

6. The heat dissipation module as described in claim 1, wherein the second fan comprises a base plate, an annular side plate, a cover plate and a fan blade, the annular side plate stands on the base plate, the cover plate is stacked on a side of the annular side plate away from the base plate, the fan blade is rotatably disposed on the base plate, the second air inlet is located on the cover plate, the at least one second air outlet and part of the side air outlet are respectively located on different sides of the annular side plate, and the side air outlet is located at the connection between the annular side plate and the cover plate.

7. An electronic device comprising: a housing; A mainboard is disposed in the housing; At least one heat source is disposed on the motherboard; and A heat dissipation module is disposed in the housing and comprises: A first fan having a first air inlet and at least one first air outlet, wherein the first air inlet and the at least one first air outlet are connected to each other and are located at different sides of the first fan; At least one first heat dissipation fin group is disposed adjacent to the at least one first air outlet; a second fan having a second air inlet, at least one second air outlet and a side air outlet, wherein the at least one second air outlet and the side air outlet are connected to the second air inlet, the second air inlet, the at least one second air outlet and the side air outlet are respectively located on different sides of the second fan, and an opening direction of the side air outlet faces the first fan; At least one second heat dissipation fin group is disposed adjacent to the at least one second air outlet; a temperature vapor chamber thermally coupled to the at least one first heat dissipation fin set and the at least one second heat dissipation fin set, and thermally coupled to the at least one heat source; and A heat sink is in thermal contact with a side of the temperature homogenizing plate away from the at least one heat source and is located between the first fan and the second fan.

8. An electronic device as described in claim 7, wherein the shell includes a shell base and a shell cover, the shell cover is stacked on one side of the shell base and forms a accommodating space together with the shell base, the main board and the heat dissipation module are located in the accommodating space, the heat dissipation module further includes two air guide structures, the two air guide structures protrude from a side of the heat sink away from the temperature uniform plate and are separated from each other, the two air guide structures are between the heat sink and the shell base, the two air guide structures, the heat sink and the shell base together form a heat dissipation channel, and the side air outlet is connected to the heat dissipation channel.

9. An electronic device as described in claim 8, wherein the two air guide structures each include an air guide strip and an air guide pad, in each of the air guide structures, the air guide strip protrudes from a side of the heat sink away from the temperature vapor chamber, the air guide pad is clamped between the air guide strip and the shell base, and the air guide strip and the air guide pad are made of a rigid material and a flexible material, respectively.

10. An electronic device as described in claim 9, wherein the shell base includes a shell bottom plate and a shell side plate, the shell side plate is upright on the shell bottom plate, the shell cover plate is stacked on a side of the shell side plate away from the shell bottom plate, the shell bottom plate, the shell side plate and the shell cover plate together form the accommodating space, the shell bottom plate includes a covering portion and two broken hole portions, the two broken hole portions are respectively connected to opposite sides of the covering portion, the two broken hole portions each have a plurality of external air inlets, the first air inlet and the second air inlet are respectively connected to the plurality of external air inlets of the two broken hole portions through the accommodating space, and the covering portion shields the accommodating space.

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