Camera adjustment method and device, equipment and storage medium

Abstract

The embodiment of the invention provides a camera adjusting method and device, equipment and a storage medium. The method comprises the following steps: moving a calibration element to a detection position corresponding to a to-be-detected camera; performing first alignment adjustment on the posture of the to-be-detected camera based on the light intensity distribution of the light corresponding to the calibration element shot by the to-be-detected camera, moving the calibration element to a position outside the detection range of the to-be-detected camera, and performing second alignment adjustment on the posture of the to-be-detected camera based on the detection result of the grid pattern on the wafer. And performing secondary alignment adjustment on the posture of the to-be-detected camera. According to the technical scheme provided by the embodiment of the invention, the problem that the attitude calibration of the TDI camera cannot accurately reflect all deviations of the TDI camera relative to the original mounting position in the related technology is solved, and the automatic regular alignment adjustment of the to-be-detected camera is conveniently realized, so that the reliability of the to-be-detected camera in the long-time processing process is ensured; and the accuracy and the quality of wafer processing are improved.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor processing technology, and in particular to a camera adjustment method, device, equipment and storage medium. Background Art

[0002] In the field of semiconductor processing technology, during the processing of wafers, a high-precision time-delay integrated camera (also known as a TDI camera) is required to capture the processing status of the wafer in real time to ensure accurate monitoring of the processing process. Therefore, the TDI camera needs to ensure that its own position is fixed and its relative position to the machine where the wafer is located is stable. However, the machine will drive the wafer to move continuously during the processing process. During a long processing process, the entire system including the TDI camera will shake slightly, causing the posture of the TDI camera to shift, which will lead to inaccurate monitoring of the wafer processing process, affecting the processing accuracy and reliability.

[0003] In the related art, the posture calibration of the TDI camera can usually only be performed at the beginning of the operation, and only the installation angle and eccentricity of the TDI camera relative to the original installation position can be obtained. The detection results are not comprehensive enough and cannot accurately reflect the full deviation of the TDI camera relative to the original installation position, resulting in poor accuracy in position adjustment of the TDI camera, which seriously affects the reliability of the wafer processing process. Summary of the invention

[0004] The embodiments of the present disclosure provide a camera adjustment method, device, equipment and storage medium to solve the problem in the related art that the posture calibration of the TDI camera cannot accurately reflect all deviations of the TDI camera relative to the original installation position.

[0005] In a first aspect, an embodiment of the present disclosure provides a camera adjustment method, the camera adjustment method comprising:

[0006] Move the calibration component to the detection position corresponding to the camera to be detected;

[0007] Based on the light intensity distribution of the light corresponding to the calibration element photographed by the camera to be detected, the posture of the camera to be detected is first aligned and adjusted;

[0008] Move the calibration component to a position outside the detection range of the camera to be detected;

[0009] Based on the detection result of the grid pattern on the wafer, the posture of the camera to be inspected is aligned and adjusted for the second time.

[0010] Optionally, the calibration element is an aperture including a cross pattern, or a calibration plate including a cross pattern; moving the calibration element to a detection position corresponding to the camera to be detected comprises: if the calibration element is an aperture including a cross pattern, moving the aperture until the center of the aperture coincides with the optical axis of the camera to be detected under the target posture; if the calibration element is a calibration plate including a cross pattern, moving the calibration plate until the center of the cross pattern in the calibration plate coincides with the optical axis of the camera to be detected under the target posture.

[0011] Optionally, based on the light intensity distribution of the light corresponding to the calibration element photographed by the camera to be detected, the posture of the camera to be detected is aligned and adjusted for the first time, including: adjusting the grayscale value of the camera to be detected to a set value; obtaining a first calibration image corresponding to the calibration element photographed by the camera to be detected; determining the actual light intensity distribution in the first calibration image; determining the rotation angle and eccentricity of the camera to be detected based on the theoretical light intensity distribution and the actual light intensity distribution under the target posture of the camera to be detected; and adjusting the posture of the camera to be detected based on the rotation angle and the eccentricity so that the rotation angle and the eccentricity return to zero.

[0012] Optionally, based on the detection results of the grid pattern on the wafer, a second alignment adjustment is performed on the posture of the camera to be detected, including: obtaining a second calibration image of the grid pattern on the wafer captured by the camera to be detected; determining the deviation data of the camera to be detected based on the actual position coordinates of the grid pattern in the second calibration image and the theoretical position coordinates of the grid pattern corresponding to the target posture of the camera to be detected; based on the deviation data, a second alignment adjustment is performed on the posture of the camera to be detected to return the value in the deviation data to zero.

[0013] Optionally, based on the actual position coordinates of the grid pattern in the second calibration image and the theoretical position coordinates of the grid pattern corresponding to the target posture of the camera to be detected, the deviation data of the camera to be detected is determined, including: determining the deflection angle of the grid pattern in the second calibration image relative to the corresponding grid pattern under the target posture based on the difference between the actual position coordinates and the theoretical position coordinates; determining the deflection angle of the camera to be detected relative to the horizontal axis based on the vertical coordinate difference between the actual position coordinates and the theoretical coordinates, and the size of the grid pattern along the vertical axis, wherein the vertical coordinate difference is used to represent the difference between the vertical coordinate extreme value in the actual position coordinates and the corresponding vertical coordinate extreme value in the theoretical position coordinates; determining the deflection angle of the camera to be detected relative to the vertical axis based on the horizontal coordinate difference between the actual position coordinates and the theoretical position coordinates, and the size of the grid pattern along the horizontal axis, wherein the horizontal coordinate difference is used to represent the difference between the horizontal coordinate extreme value in the actual position coordinates and the corresponding horizontal coordinate extreme value in the theoretical position coordinates.

[0014] Optionally, before obtaining the second calibration image of the grid pattern on the wafer captured by the camera to be inspected, at least one of the following items is also included: calibrating the set magnification of the camera to be inspected; calibrating the offset of the camera to be inspected along the horizontal axis and the vertical axis; obtaining stray light noise data when the camera to be inspected takes the image, so as to filter the second calibration image based on the stray light noise data.

[0015] Optionally, filtering out stray light noise when the camera to be inspected takes an image includes: obtaining a third calibration image of a blank area on a wafer, and calculating light intensity distribution data in the third calibration image; and obtaining stray light noise data corresponding to the camera to be inspected based on the light intensity distribution data and a reference light intensity corresponding to the blank area on the wafer.

[0016] Optionally, there are at least two cameras to be detected, and the optical axes of the cameras to be detected are parallel to each other; if the calibration element includes a cross pattern, the center of the cross pattern is located between the two cameras to be detected, and the light corresponding to the calibration element captured by the two cameras to be detected both include the longitudinal lines of the cross pattern.

[0017] Optionally, based on the detection result of the grid pattern on the wafer, the posture of the camera to be detected is aligned and adjusted for the second time, and also includes: based on the second calibration images of the grid pattern on the wafer captured by the two cameras to be detected, calculating the ratio of the sizes of the grid patterns along the longitudinal axis in the two second calibration images, and taking the ratio as the optical path difference between the two cameras to be detected; based on the optical path difference, the posture of the camera to be detected is aligned and adjusted for the second time until the optical path difference returns to zero.

[0018] Optionally, each camera to be detected includes three sensor modules, and the optical axes of each sensor module are parallel to each other; the three sensor modules in each camera to be detected are arranged along the longitudinal direction, or the three sensor modules in each camera to be detected are arranged crosswise with each other, and the cross arrangement is used to indicate that one of the three sensor modules arranged along the longitudinal direction does not belong to the same camera to be detected as the other two sensor modules.

[0019] In a second aspect, an embodiment of the present disclosure provides a camera adjustment device, the camera adjustment device comprising:

[0020] A preparation module, used for moving the calibration element to a detection position corresponding to the camera to be detected;

[0021] A first alignment module, used for performing a first alignment adjustment on the posture of the camera to be detected based on the light intensity distribution of the light corresponding to the calibration element photographed by the camera to be detected;

[0022] A processing module, used for moving the calibration element to a position outside the detection range of the camera to be detected;

[0023] The second alignment module is used to perform a second alignment adjustment on the posture of the camera to be detected based on the detection result of the grid pattern on the wafer.

[0024] Optionally, the preparation module is specifically used to, if the calibration element is an iris including a cross pattern, or a calibration plate including a cross pattern; if the calibration element is an iris including a cross pattern, move the iris until the center of the iris coincides with the optical axis of the camera to be detected under the target posture; if the calibration element is a calibration plate including a cross pattern, move the calibration plate until the center of the cross pattern in the calibration plate coincides with the optical axis of the camera to be detected under the target posture.

[0025] Optionally, the first alignment module is specifically used to adjust the grayscale value of the camera to be detected to a set value; obtain a first calibration image corresponding to the calibration element photographed by the camera to be detected; determine the actual light intensity distribution in the first calibration image; determine the rotation angle and eccentricity of the camera to be detected based on the theoretical light intensity distribution and the actual light intensity distribution under the target posture of the camera to be detected; based on the rotation angle and the eccentricity, adjust the posture of the camera to be detected so that the rotation angle and the eccentricity are returned to zero.

[0026] Optionally, the second alignment module is specifically used to obtain a second calibration image of the grid pattern on the wafer captured by the camera to be detected; determine the deviation data of the camera to be detected based on the actual position coordinates of the grid pattern in the second calibration image and the theoretical position coordinates of the grid pattern corresponding to the target posture of the camera to be detected; based on the deviation data, perform a second alignment adjustment on the posture of the camera to be detected to return the value in the deviation data to zero.

[0027] Optionally, the second alignment module is specifically used to determine, based on the difference between the actual position coordinates and the theoretical position coordinates, the deflection angle of the grid pattern in the second calibration image relative to the corresponding grid pattern in the target posture; based on the difference between the ordinates of the actual position coordinates and the theoretical coordinates, and the size of the grid pattern along the longitudinal axis, determine the deflection angle of the camera to be detected relative to the horizontal axis, wherein the ordinate difference is used to represent the difference between the ordinate extreme value in the actual position coordinates and the ordinate extreme value in the corresponding theoretical position coordinates; based on the difference between the ordinates of the actual position coordinates and the theoretical position coordinates, and the size of the grid pattern along the horizontal axis, determine the deflection angle of the camera to be detected relative to the vertical axis, wherein the ordinate difference is used to represent the difference between the ordinate extreme value in the actual position coordinates and the corresponding ordinate extreme value in the theoretical position coordinates.

[0028] Optionally, the second alignment module is also used to, before obtaining a second calibration image of the grid pattern on the wafer captured by the camera to be inspected, include at least one of the following: calibrating the set magnification of the camera to be inspected; calibrating the offset of the camera to be inspected along the horizontal and vertical axes; obtaining stray light noise data when the camera to be inspected takes the image, so as to filter the second calibration image based on the stray light noise data.

[0029] Optionally, the second alignment module is specifically used to obtain a third calibration image of the blank area on the wafer, and calculate the light intensity distribution data in the third calibration image; based on the light intensity distribution data and the reference light intensity corresponding to the blank area on the wafer, obtain the stray light noise data corresponding to the camera to be detected.

[0030] Optionally, the first alignment module specifically includes: there are at least two cameras to be detected, and the optical axes of the cameras to be detected are parallel to each other; if the calibration element includes a cross pattern, the center of the cross pattern is located between the two cameras to be detected, and the light corresponding to the calibration element captured by the two cameras to be detected both include the longitudinal lines of the cross pattern.

[0031] Optionally, the second alignment module is also used to calculate the ratio of the sizes of the grid patterns along the longitudinal axis in the two second calibration images based on the second calibration images of the grid patterns on the wafer captured by the two cameras to be inspected, and use the ratio as the optical path difference between the two cameras to be inspected; based on the optical path difference, perform a second alignment adjustment on the posture of the camera to be inspected until the optical path difference returns to zero.

[0032] Optionally, the second alignment module specifically includes: each camera to be detected includes three sensor modules, and the optical axes of each sensor module are parallel to each other; the three sensor modules in each camera to be detected are arranged along the longitudinal direction, or the three sensor modules in each camera to be detected are arranged crosswise with each other, and the cross arrangement is used to indicate that one of the three sensor modules arranged along the longitudinal direction does not belong to the same camera to be detected as the other two sensor modules.

[0033] In a third aspect, an embodiment of the present disclosure further provides a control device, the control device comprising:

[0034] at least one processor;

[0035] and a memory communicatively coupled to the at least one processor;

[0036] The memory stores instructions that can be executed by at least one processor, and the instructions are executed by at least one processor to enable the control device to perform the camera adjustment method as described in the first aspect of the present disclosure.

[0037] In a fourth aspect, an embodiment of the present disclosure further provides a computer-readable storage medium, in which computer-executable instructions are stored. When the computer-executable instructions are executed by a processor, they are used to implement the camera adjustment method of the first aspect of the present disclosure.

[0038] In a fifth aspect, an embodiment of the present disclosure further provides a computer program product, which includes computer execution instructions, and when the computer execution instructions are executed by a processor, they are used to implement the camera adjustment method as in the first aspect of the present disclosure.

[0039] The camera adjustment method, device, equipment and storage medium provided by the embodiments of the present disclosure move the calibration element to the detection position corresponding to the camera to be detected; and based on the light intensity distribution of the light corresponding to the calibration element captured by the camera to be detected, the posture of the camera to be detected is first aligned and adjusted, and then the calibration element is moved to a position outside the detection range of the camera to be detected, and then based on the detection result of the grid pattern on the wafer, the posture of the camera to be detected is secondly aligned and adjusted. As a result, the deviations in multiple dimensions of the posture of the camera to be detected can be measured and adjusted, which significantly improves the comprehensiveness of the detection and ensures the accuracy of the detection of the camera to be detected compared to the prior art that can only detect the eccentricity and deflection angle; and the entire detection process only needs to control the movement of the calibration element and collect two images to make adjustments, which is simple to operate and can conveniently realize automatic regular alignment and adjustment of the camera to be detected, thereby ensuring the reliability of the camera to be detected during long-term processing, thereby improving the accuracy and quality of wafer processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0041] Figure 1 A diagram of an application scenario of the camera adjustment method provided in an embodiment of the present disclosure;

[0042] Figure 2 A flowchart of a camera adjustment method provided by an embodiment of the present disclosure;

[0043] Figure 3a A flowchart of a camera adjustment method provided by yet another embodiment of the present disclosure;

[0044] Figure 3b for Figure 3a A flow chart of a method for filtering stray light noise provided by the illustrated embodiment;

[0045] Figure 3c for Figure 3a A flow chart of a method for determining deviation data provided by the illustrated embodiment;

[0046] Figure 4a A flowchart of a camera adjustment method provided by yet another embodiment of the present disclosure;

[0047] Figure 4b for Figure 4a A location distribution diagram of the sensor modules provided by the illustrated embodiment;

[0048] Figure 4c for Figure 4a A flow chart of an alignment adjustment method based on optical path difference provided by the illustrated embodiment;

[0049] Figure 5 A schematic structural diagram of a camera adjustment device provided in yet another embodiment of the present disclosure;

[0050] Figure 6 A schematic diagram of the structure of a control device provided in one embodiment of the present disclosure.

[0051] The above drawings show clear embodiments of the present disclosure, which will be described in more detail below. These drawings and text descriptions are not intended to limit the scope of the present disclosure in any way, but to illustrate the concepts of the present disclosure to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0052] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0053] The technical solution of the present invention and how the technical solution of the present invention solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0054] In the field of semiconductor processing technology, during the processing of wafers, a high-precision time-delay integrated camera (TDI stands for Time Delay Integration in English, so a time-delay integrated camera is also a TDI camera) is used to capture the processing status of the wafer in real time, so as to determine whether the processing of the wafer meets the requirements based on the captured data, and monitor in real time whether there are defects on the wafer, etc., so as to ensure accurate monitoring of the processing process. To ensure the accuracy of monitoring, the position of the TDI camera itself needs to be fixed during the processing. However, the machine will drive the wafer to move continuously during the processing, such as rotating and moving along the horizontal and vertical axes, and slight vibrations will occur during the movement. During a long processing process, the entire system including the TDI camera will shake slightly, causing the posture of the TDI camera to shift, which will lead to inaccurate monitoring of the wafer processing process, affecting the processing accuracy and reliability.

[0055] In the related art, posture detection and calibration of the TDI camera can usually only be performed at the beginning of processing, and only the installation angle and eccentricity of the TDI camera relative to the original installation position can be detected. The detection results are not comprehensive enough and cannot accurately reflect all deviations of the TDI camera relative to the original installation position. Therefore, the accuracy of the calibration based on the detection results is poor, which seriously affects the reliability of the wafer processing process.

[0056] In order to solve this problem, an embodiment of the present disclosure provides a camera adjustment method, which effectively ensures the comprehensiveness of camera posture detection through a first alignment adjustment of the camera posture based on a calibration element and a second alignment adjustment of the camera posture without the need for a calibration element, thereby improving the reliability of calibration based on the detection results and significantly improving the reliability of wafer processing.

[0057] The application scenarios of the embodiments of the present disclosure are explained below:

[0058] Figure 1 FIG. 1 is an application scenario diagram of the camera adjustment method provided in the embodiment of the present disclosure. Figure 1 As shown, during camera adjustment, the camera can be adjusted by controlling the TDI camera 100 to capture images of the calibration element 110 and the wafer 130 on the platform 120 (wherein the hollow arrows indicate that capturing the calibration element 110 and capturing the wafer 130 are two actions that are completed separately), and calculating the deviation between the TDI camera 100 and the reference data.

[0059] It should be noted that Figure 1 In the scenario shown, only one TDI camera, calibration element, machine, plug-in program, and wafer are used as examples for illustration, but the present disclosure is not limited to this. In other words, the number of development terminals, low-code platforms, program configuration files, plug-ins, and robot systems can be arbitrary.

[0060] The camera adjustment method provided by the present disclosure is described in detail below through specific embodiments.

[0061] Figure 2 Flow chart of a camera adjustment method provided by one embodiment of the present disclosure. Figure 2 As shown, the camera adjustment method provided in this embodiment includes the following steps:

[0062] Step S201, moving the calibration element to a detection position corresponding to the camera to be detected.

[0063] Specifically, the camera to be detected is usually a TDI camera. The posture adjustment of the point detection camera can be controlled by a computer (or a processor or a server), so the computer is used as the execution subject in this embodiment.

[0064] The computer pre-stores the target posture of the camera to be detected and various reference data corresponding to the target posture. The target posture includes the position of the camera to be detected relative to the wafer in the horizontal, longitudinal and vertical directions, as well as the rotation angle along these three axes. Since the camera to be detected itself cannot detect its own target posture, it is necessary to judge it through the image captured by the camera to be detected.

[0065] The reference data includes the image parameters corresponding to the calibration components and wafers captured by the camera to be inspected in the target posture, so as to determine the deviation of the actual posture of the camera to be inspected relative to the target posture based on the comparison between the image parameters and the images captured by the camera to be inspected during the inspection process.

[0066] The goal of camera adjustment is to restore the camera to be detected to a target posture by adjusting the adjustment element on the device that fixes the camera to be detected.

[0067] The first alignment adjustment is used to compare the captured image of the calibration element with the corresponding image of the calibration element in the reference data. By adjusting the offset of the camera to be detected along the horizontal and vertical axes and the rotation of the vertical axis, the image captured by the camera to be detected is made to coincide with the central axis of the image in the reference data, thereby achieving the adjustment of the offset of the camera to be detected in the horizontal and vertical axes, as well as the adjustment of the deflection angle around the vertical axis.

[0068] The horizontal axis of the camera to be detected is the horizontal direction of the image taken by the camera to be detected, the vertical axis of the camera to be detected is the vertical direction of the image taken by the camera to be detected, and the vertical axis of the camera to be detected is the direction along the optical axis of the camera to be detected.

[0069] Therefore, the calibration element needs to be moved to the set detection position first. The set detection position can be a position where the center of the pattern in the calibration element coincides with the center of the optical axis of the camera to be detected in the target posture, and the horizontal axis and vertical axis of the calibration element coincide with the horizontal and vertical axes of the camera to be detected.

[0070] The horizontal axis and vertical axis of the calibration element are also the horizontal axis and vertical axis of the camera to be detected in the target posture.

[0071] The calibration element can be moved by a mechanical device, such as an electric push rod, a robotic arm, etc., or it can be any other device, which is not limited here.

[0072] Step S202 : performing a first alignment adjustment on the posture of the camera to be detected based on the light intensity distribution of the light corresponding to the calibration element photographed by the camera to be detected.

[0073] Specifically, after the calibration element moves to the set detection position, the camera to be detected will capture an image corresponding to the calibration element. Based on the captured image, the light intensity distribution at the position corresponding to the calibration element in the image or the light intensity distribution corresponding to the pattern on the calibration element can be calculated.

[0074] The computer's reference data stores the light intensity distribution data of the image corresponding to the calibration element photographed under the target posture. Therefore, it is only necessary to compare two light intensity distribution data (such as the light intensity of each pixel point) to calculate the center position of the pattern on the calibration element and the corner coordinates of the pattern in the two images (i.e., the image actually photographed and the image stored in the reference data). Then, the center position deviation of the two patterns is compared to determine the horizontal and vertical axis offset of the actual posture of the camera to be detected relative to the target posture. According to the angle between the corresponding corner point coordinates and the center position in the two patterns, the vertical axis deflection angle of the actual posture of the camera to be detected relative to the target posture is determined.

[0075] Then, according to the calculated offset and deflection angle, the device fixing the camera to be detected is adjusted so that the camera to be detected is translated and rotated with the offset and deflection angle returning to zero, thus completing the first alignment adjustment.

[0076] Step S203, moving the calibration component to a position outside the detection range of the camera to be detected.

[0077] Specifically, after the first alignment adjustment is completed (or after the image corresponding to the calibration element is captured), the calibration element can be moved to a position outside the detection position of the camera to be detected or outside the movable range of the machine, so as to perform a second alignment adjustment.

[0078] Since the movement of the calibration element can be automatically completed by a mechanical device, and the posture adjustment of the camera to be detected and the image shooting can be automatically controlled and realized, the position of the camera to be detected can be automatically detected regularly.

[0079] Step S204 , based on the detection result of the grid pattern on the wafer, a second alignment adjustment is performed on the posture of the camera to be detected.

[0080] Specifically, the second alignment adjustment is to use the camera to be inspected after the first alignment adjustment to capture the grid pattern on the wafer, and then compare the grid distribution in the captured image with the grid distribution in the corresponding image in the reference data to determine the deflection of the camera to be inspected relative to the horizontal and vertical axes, and can more accurately determine the deflection of the camera to be inspected relative to the vertical axis.

[0081] The first alignment adjustment is calculated through the light intensity distribution. It is convenient to determine the center position of the pattern of the calibration element photographed by the camera to be tested, but there is a problem of insufficient accuracy when determining the boundary of the captured image. Therefore, the first alignment adjustment is mainly used for the deflection angle and eccentricity based on the pattern center of the calibration element and the center of the optical axis of the camera to be tested. The second alignment adjustment is based on the comparison of the captured grid pattern. By comparing the captured grids, various deflection angles of the camera to be tested can be accurately calculated.

[0082] If only the second alignment adjustment is used, the deflection and eccentricity of the camera to be inspected will exist simultaneously, making it difficult to achieve accurate adjustment.

[0083] By combining the two methods, the accuracy and comprehensiveness of the posture adjustment of the camera to be tested can be better improved.

[0084] The camera adjustment method provided by the embodiment of the present disclosure moves the calibration element to the detection position corresponding to the camera to be detected; and based on the light intensity distribution of the light corresponding to the calibration element captured by the camera to be detected, performs the first alignment adjustment on the posture of the camera to be detected, then moves the calibration element to a position outside the detection range of the camera to be detected, and then performs the second alignment adjustment on the posture of the camera to be detected based on the detection result of the grid pattern on the wafer. In this way, the deviations in multiple dimensions of the posture of the camera to be detected can be measured and adjusted, which significantly improves the comprehensiveness of the detection and ensures the accuracy of the detection of the camera to be detected compared to the prior art that can only detect the eccentricity and deflection angle; and the entire detection process only needs to control the movement of the calibration element and collect two images to make adjustments, which is simple to operate and can conveniently realize automatic regular alignment adjustment of the camera to be detected, thereby ensuring the reliability of the camera to be detected during long-term processing, thereby improving the accuracy and quality of wafer processing.

[0085] Figure 3aFlow chart of a camera adjustment method provided by one embodiment of the present disclosure. Figure 3a As shown, the camera adjustment method provided in this embodiment includes the following steps:

[0086] Step S301, moving the calibration element to a detection position corresponding to the camera to be detected.

[0087] Specifically, this embodiment is used to further illustrate the specific process of the adjustment method based on the camera to be detected.

[0088] In some embodiments, the calibration element is an aperture including a cross pattern, or a calibration plate including a cross pattern. An aperture including a cross pattern means that the gap in the middle of the aperture is a cross pattern, and the aperture is fixed to a mechanical structure that drives the calibration element to move through a corresponding tooling; a calibration plate including a cross pattern means that there is a cross pattern in the middle of the calibration plate, and in this case, the calibration plate is directly fixed to the mechanical structure that drives the calibration element to move.

[0089] Furthermore, according to the specific type of the calibration element, the action of moving the calibration element to the set detection position is specifically:

[0090] If the calibration element is an aperture containing a cross pattern, move the aperture until the center of the aperture coincides with the optical axis of the camera to be detected in the target posture; or, if the calibration element is a calibration plate containing a cross pattern, move the calibration plate until the center of the cross pattern in the calibration plate coincides with the optical axis of the camera to be detected in the target posture.

[0091] Specifically, the position where the center of the aperture coincides with the optical axis of the target posture is the predetermined detection position. In practical applications, customizing the aperture, determining its corresponding detection position, and determining the distance between the aperture and the camera to be detected are all completed in advance before adjustment. Determining the distance between the aperture and the camera to be detected can be achieved through an existing optical simulation algorithm, which is a prior art in the field and is beyond the scope of discussion in this solution, so it will not be elaborated on.

[0092] Similar to the aperture, the calibration plate also needs to be customized in advance and the corresponding detection position needs to be determined. The principle is similar to the configuration of the aperture and will not be repeated here.

[0093] Step S302, adjusting the grayscale value of the camera to be detected to a set value.

[0094] Specifically, to facilitate the calculation of light intensity, it is necessary to adjust the grayscale value of the camera to be tested to a fixed value (i.e., a set value), such as 200 or other values, before the first alignment adjustment. The set value is the same as the grayscale value when the corresponding image of the calibration element is collected in the reference data in the computer to ensure the effectiveness of the comparison between the two.

[0095] Step S303: obtaining a first calibration image corresponding to the calibration component photographed by the camera to be detected.

[0096] Specifically, after completing the above adjustments, the camera to be detected will take an image once. At this time, the image will contain the calibration element (if the calibration element is an aperture, then the image actually captured is an image containing the cross light passing through the aperture; if the calibration element is a calibration plate, then the image actually captured is an image containing the cross pattern in the calibration plate), which is the first calibration image.

[0097] Step S304: determining the actual light intensity distribution in the first calibration image.

[0098] Specifically, after obtaining the first calibration image, it is necessary to calculate the light intensity distribution data in the first calibration image, that is, the actual light intensity distribution. Calculating the light intensity distribution according to the captured image is a prior art in the art and will not be described in detail here.

[0099] Step S305 , determining the rotation angle and eccentricity of the camera to be detected based on the theoretical light intensity distribution and the actual light intensity distribution under the target posture of the camera to be detected.

[0100] Specifically, the computer's reference data includes the light intensity distribution data of the camera to be detected under the target posture (that is, the theoretical light intensity distribution). By comparing the actual light intensity distribution (including the center point of the actual light intensity and the distribution along the horizontal and vertical axes) with the theoretical light intensity distribution (including the center point of the theoretical light intensity and the distribution along the horizontal and vertical axes), the eccentricity (which can be obtained by the horizontal and vertical axis difference of the coordinates of the two center points mentioned above) and the rotation angle (which can be obtained by selecting a point with the same light intensity from the two distributions mentioned above and the angle difference between the lines connecting the point and the center point, or by other calculation methods, which will not be repeated here) of the actual position of the camera to be detected relative to the target posture can be determined.

[0101] Step S306: Based on the rotation angle and the eccentricity, the posture of the camera to be detected is adjusted so that the rotation angle and the eccentricity return to zero.

[0102] Specifically, the first alignment adjustment is completed by adjusting the device for fixing the camera to be detected to adjust the posture of the camera to be detected so that the rotation angle and eccentricity calculated in the above steps are zeroed. For example, if the rotation angle calculated in the above steps is 1 degree, the camera to be detected is rotated minus 1 degree relative to the optical axis to complete the rotation angle adjustment.

[0103] Step S307, moving the calibration component to a position outside the detection range of the camera to be detected.

[0104] Specifically, this step is Figure 2 The corresponding steps in the illustrated embodiment are the same in content and will not be described again here.

[0105] Step S308, obtaining a second calibration image of the grid pattern on the wafer captured by the camera to be inspected.

[0106] Specifically, in the second alignment adjustment, it is necessary to obtain a second calibration image containing a grid pattern on the wafer on the platform.

[0107] When the second calibration image is captured, the position of the machine is the same as the position of the machine when the image corresponding to the second calibration image is captured in the reference data of the computer, so as to facilitate comparison and adjustment based on the two images.

[0108] In some embodiments, before acquiring the second calibration image, it is necessary to perform additional calibration operations on the function of the image to be detected, including at least one of the following:

[0109] Calibrate the set magnification of the camera to be inspected; and / or,

[0110] Calibrate the offset of the camera to be detected along the horizontal axis and the vertical axis; and / or,

[0111] Obtain stray light noise data when the camera to be detected captures an image, so as to perform filtering processing on the second calibration image based on the stray light noise data.

[0112] Specifically, all of the above three calibration operations may be performed, or at least one of them may be selected to further ensure the accuracy of the captured second calibration image, thereby ensuring the accuracy and reliability of the second alignment adjustment.

[0113] The actual size of the grid pattern on the wafer is relatively small (usually in the range of nanometers to micrometers). Therefore, before shooting the grid pattern, the camera to be inspected needs to be set to a certain magnification (i.e., set the magnification, such as 100 times) for shooting. Therefore, the magnification of the camera to be inspected needs to be calibrated. The calibration of the magnification can also directly use the existing calibration algorithm, which will not be repeated here.

[0114] The calibration of the offset in the horizontal and vertical axis directions of the camera to be detected, that is, the calibration of the eccentricity, can be achieved directly through the aforementioned first alignment adjustment, or it can be performed through an additional adjustment algorithm. The specific adjustment algorithm can adopt the existing eccentricity calibration algorithm in the field, which will not be repeated here.

[0115] Since stray light noise may exist when the camera to be inspected captures an image, it is necessary to determine the stray light noise data so that the second calibration image can be subjected to noise filtering when the second calibration image is subsequently acquired. The stray light noise data can be acquired by an existing noise filtering algorithm or by photographing a blank area on the wafer.

[0116] Furthermore, if Figure 3b As shown, it is a flow chart of a method for filtering stray light noise, and its specific steps include:

[0117] Step A1: acquiring a third calibration image of a blank area on a wafer, and calculating light intensity distribution data in the third calibration image.

[0118] Specifically, before taking the second calibration image, the machine can be moved to align the optical axis of the camera to be inspected with a blank area on the wafer to take the third calibration image, and the stray light noise data is calculated based on the light intensity distribution in the third calibration image. After taking the third calibration image, the machine can be moved again to align the optical axis of the camera to be inspected with a predetermined grid pattern on the wafer.

[0119] Step A2: based on the light intensity distribution data and the reference light intensity corresponding to the blank area on the wafer, obtain the stray light noise data corresponding to the camera to be detected.

[0120] Specifically, after obtaining the light intensity distribution data, the reference light intensity of the blank area on the wafer can be determined from the light intensity distribution data (the light intensity value with the highest proportion in the light intensity distribution data can be used as the reference light intensity, or the reference light intensity value predetermined in the reference data can be used), and then the light intensity distribution data obtained in the previous steps is subtracted from the reference light intensity to obtain the stray light noise data corresponding to the camera to be detected.

[0121] By superimposing the stray light noise data on the second calibration image for calculation, the second calibration image with the stray light noise filtered out can be obtained.

[0122] Step S309 , determining the deviation data of the camera to be detected based on the actual position coordinates of the grid pattern in the second calibration image and the theoretical position coordinates of the grid pattern corresponding to the target posture of the camera to be detected.

[0123] Specifically, after obtaining the second calibration image, the coordinates of the grid pattern therein, that is, the century position coordinates, can be calculated, and then compared with the theoretical position coordinates recorded in the reference data (that is, the coordinates of the grid pattern corresponding to the target posture of the camera to be detected), so as to determine the various deviation data of the camera to be detected.

[0124] Furthermore, if Figure 3c As shown, it is a flow chart of a method for determining deviation data, which includes the following steps:

[0125] Step B1: Based on the difference between the actual position coordinates and the theoretical position coordinates, determine the deflection angle of the grid pattern in the second calibration image relative to the corresponding grid pattern in the target posture.

[0126] Specifically, the center coordinates of the grid pattern can be calculated through the actual position coordinates, and then the coordinate edge for comparison can be obtained by connecting the center coordinates and the actual first-century position coordinates. The angle difference between the calculated coordinate edge and the corresponding coordinate edge obtained by the theoretical position coordinates can be used to obtain the deflection angle of the grid pattern in the second calibration image relative to the corresponding grid pattern in the target posture, that is, the deflection angle between the camera to be detected and the target posture relative to the optical axis.

[0127] By calculating the angle again after the first alignment adjustment and making adjustments based on the calculation results, the accuracy of the posture of the camera to be detected after adjustment can be guaranteed to the maximum extent.

[0128] Step B2: based on the difference between the actual position coordinates and the theoretical coordinates in the longitudinal direction and the size of the grid pattern along the longitudinal axis, determine the deflection angle of the camera to be detected relative to the horizontal axis.

[0129] The ordinate difference is used to represent the difference between the ordinate extreme value in the actual position coordinates and the ordinate extreme value in the corresponding theoretical position coordinates.

[0130] Specifically, by comparing the ordinate difference between the actual position coordinate and the theoretical coordinate, and comparing it with the size of the grid pattern along the longitudinal axis, the ratio is the deflection angle of the camera to be detected relative to the horizontal axis.

[0131] Step B3: Determine the deflection angle of the camera to be detected relative to the longitudinal axis based on the horizontal coordinate difference between the actual position coordinate and the theoretical position coordinate and the size of the grid pattern along the horizontal axis.

[0132] The horizontal coordinate difference is used to represent the difference between the horizontal coordinate extreme value in the actual position coordinate and the corresponding horizontal coordinate extreme value in the theoretical position coordinate.

[0133] Specifically, by comparing the horizontal coordinate difference between the actual position coordinate and the theoretical coordinate, and comparing it with the size of the grid pattern along the horizontal axis, the ratio is the deflection angle of the camera to be detected relative to the vertical axis.

[0134] Step S310: Based on the deviation data, a second alignment adjustment is performed on the posture of the camera to be detected so that the value in the deviation data returns to zero.

[0135] Specifically, by returning the above deviation data to zero, the second alignment adjustment of the camera posture to be detected can be completed. The specific zeroing adjustment principle is the same as the first alignment adjustment principle mentioned above, and will not be repeated here.

[0136] The camera adjustment method provided by the embodiment of the present disclosure calibrates the camera to be detected after the first alignment adjustment based on the calibration element, and performs the second alignment adjustment based on the grid pattern. As a result, the deviation between the actual posture of the camera to be detected and the target posture can be measured and adjusted in more dimensions, thereby maximizing the similarity between the posture of the camera to be detected after adjustment and the target posture, ensuring the accuracy and reliability of wafer monitoring based on the camera to be detected after adjustment, and further ensuring the accuracy and reliability of wafer processing.

[0137] Figure 4a Flow chart of a camera adjustment method provided by one embodiment of the present disclosure. Figure 4a As shown, the camera adjustment method provided in this embodiment includes the following steps:

[0138] Step S401, moving the calibration element to a detection position corresponding to the camera to be detected.

[0139] Specifically, in some embodiments, there are at least two cameras to be detected, and the optical axes of the cameras to be detected are parallel to each other; if the calibration element includes a cross pattern, the center of the cross pattern is located between the two cameras to be detected, and the light corresponding to the calibration element captured by the two cameras to be detected both include the longitudinal lines of the cross pattern.

[0140] The camera adjustment method provided in the embodiment of the present disclosure can be used not only for adjusting a single camera, but also for adjusting a pair of two cameras to be detected. This embodiment is used to illustrate the situation when there are two cameras to be detected.

[0141] When there are two cameras to be detected, the center of the cross pattern of the calibration element is located at the midpoint of the perpendicular line between the optical axes of the two cameras to be detected, and it is usually ensured that the longitudinal axis of each camera to be detected is parallel to the longitudinal axis of the cross pattern, and the transverse axis of each camera to be detected is parallel to the transverse axis of the cross pattern.

[0142] In some embodiments, each camera to be detected includes three sensor modules, and the optical axes of each sensor module are parallel to each other; the three sensor modules in each camera to be detected are arranged along the longitudinal direction, or the three sensor modules in each camera to be detected are arranged crosswise with each other, and the cross arrangement is used to indicate that one of the three sensor modules arranged along the longitudinal direction does not belong to the same camera to be detected as the other two sensor modules.

[0143] Specifically, each camera to be detected may have only a single sensor module, or may include multiple sensor modules at the same time, such as three sensor modules, and the optical axes of each sensor module are parallel to each other.

[0144] The arrangement of the sensor modules of different cameras to be detected can be the same, such as all arranged vertically, or different, such as staggered and cross-arranged. Figure 4b As shown, it is a position distribution diagram of the sensor modules, wherein A and B respectively represent sensor modules corresponding to two different cameras to be detected, each camera to be detected has three sensor modules, and the arrangement methods are different.

[0145] Step S402 : performing a first alignment adjustment on the posture of the camera to be detected based on the light intensity distribution of the light corresponding to the calibration element photographed by the camera to be detected.

[0146] Specifically, the principle of the first alignment adjustment of the dual cameras to be detected based on the calibration element is the same as the principle of the first alignment adjustment of the single camera, which will not be repeated here.

[0147] Step S403: Move the calibration element to a position outside the detection range of the camera to be detected.

[0148] Specifically, step S403 and Figure 2 The corresponding steps in the illustrated embodiment are the same in content and will not be described again here.

[0149] Step S404 , based on the detection result of the grid pattern on the wafer, a second alignment adjustment is performed on the posture of the camera to be detected.

[0150] Specifically, most of the second alignment adjustment of the dual-to-be-detected camera is the same as the second alignment adjustment of the single camera, and the relevant content can refer to the description in the above embodiment. Here, only the differences between the second alignment adjustment of the dual-to-be-detected camera and the single camera are described.

[0151] Optional, such as Figure 4c As shown, it is a flow chart of an alignment adjustment method based on optical path difference, which includes the following steps:

[0152] Step S4041: based on the second calibration images of the grid pattern on the wafer captured by the two cameras to be inspected, calculate the ratio of the sizes of the grid pattern along the longitudinal axis in the two second calibration images, and use the ratio as the optical path difference between the two cameras to be inspected.

[0153] Specifically, in addition to the deflection angle in the aforementioned embodiment, when there are two cameras to be detected, the optical path difference between the two cameras to be detected can also be calculated (theoretically, this value should be 1, that is, there is no optical path difference). The specific algorithm can be calculated using the size ratio of the grid patterns captured by the two cameras to be detected.

[0154] Step S4042: Based on the optical path difference, perform a second alignment adjustment on the posture of the camera to be detected until the optical path difference returns to zero.

[0155] Specifically, when the optical path difference is not 1, one of the cameras to be detected can be selected as the standard and the posture of the other camera to be detected can be adjusted (specifically, the selection of the camera to be detected as the standard can be performed by preferentially adjusting one of the cameras to be detected based on the aforementioned deflection angle, and then using the camera as the standard and adjusting the other camera to be detected in combination with the optical path difference).

[0156] Furthermore, the deviation data such as the deflection angle of a single camera calculated in the aforementioned embodiment can also be applied between two cameras to be detected, that is, to calculate the deviation data between the two cameras to be detected (it is also possible not to calculate, because after the two cameras to be detected are adjusted according to the target posture, theoretically the deviation data should be zero, and the purpose of the calculation is to maximize the accuracy of the camera posture adjustment).

[0157] The camera adjustment method provided by the embodiment of the present disclosure effectively ensures the accuracy of the dual cameras to be detected by combining the first alignment adjustment performed by the calibration element and the second alignment adjustment based on the grid pattern when there are dual cameras to be detected. Therefore, it can be applied to occasions where there are different situations of the cameras to be detected, enrich the application scenarios and scope of application of the camera adjustment method, and ensure the accuracy of the posture adjustment of the cameras to be detected.

[0158] Figure 5 The structure diagram of the camera adjustment device provided by one embodiment of the present disclosure is shown in FIG. Figure 5 As shown, the camera adjustment device 500 includes: a preparation module 510, a first alignment module 520, a processing module 530 and a second alignment module 540.

[0159] in:

[0160] A preparation module 510 is used to move the calibration element to a detection position corresponding to the camera to be detected;

[0161] A first alignment module 520, configured to perform a first alignment adjustment on the posture of the camera to be detected based on the light intensity distribution of the light corresponding to the calibration element photographed by the camera to be detected;

[0162] A processing module 530 is used to move the calibration element to a position outside the detection range of the camera to be detected;

[0163] The second alignment module 540 is used to perform a second alignment adjustment on the posture of the camera to be inspected based on the inspection result of the grid pattern on the wafer.

[0164] Optionally, the preparation module 510 is specifically used to, if the calibration element is an aperture including a cross pattern, or a calibration plate including a cross pattern; if the calibration element is an aperture including a cross pattern, move the aperture until the center of the aperture coincides with the optical axis of the target posture of the camera to be detected; if the calibration element is a calibration plate including a cross pattern, move the calibration plate until the center of the cross pattern in the calibration plate coincides with the optical axis of the target posture of the camera to be detected.

[0165] Optionally, the first alignment module 520 is specifically used to adjust the grayscale value of the camera to be detected to a set value; obtain a first calibration image corresponding to the calibration element photographed by the camera to be detected; determine the actual light intensity distribution in the first calibration image; determine the rotation angle and eccentricity of the camera to be detected based on the theoretical light intensity distribution and the actual light intensity distribution under the target posture of the camera to be detected; based on the rotation angle and the eccentricity, adjust the posture of the camera to be detected so that the rotation angle and the eccentricity are returned to zero.

[0166] Optionally, the second alignment module 540 is specifically used to obtain a second calibration image of the grid pattern on the wafer captured by the camera to be detected; determine the deviation data of the camera to be detected based on the actual position coordinates of the grid pattern in the second calibration image and the theoretical position coordinates of the grid pattern corresponding to the target posture of the camera to be detected; based on the deviation data, perform a second alignment adjustment on the posture of the camera to be detected to return the value in the deviation data to zero.

[0167] Optionally, the second alignment module 540 is specifically used to determine the deflection angle of the grid pattern in the second calibration image relative to the corresponding grid pattern in the target posture based on the difference between the actual position coordinates and the theoretical position coordinates; determine the deflection angle of the camera to be detected relative to the horizontal axis based on the difference between the vertical coordinates of the actual position coordinates and the theoretical coordinates, and the size of the grid pattern along the vertical axis, wherein the vertical coordinate difference is used to represent the difference between the vertical coordinate extreme value in the actual position coordinates and the vertical coordinate extreme value in the corresponding theoretical position coordinates; determine the deflection angle of the camera to be detected relative to the vertical axis based on the difference between the horizontal coordinates of the actual position coordinates and the theoretical position coordinates, and the size of the grid pattern along the horizontal axis, wherein the horizontal coordinate difference is used to represent the difference between the horizontal coordinate extreme value in the actual position coordinates and the corresponding horizontal coordinate extreme value in the theoretical position coordinates.

[0168] Optionally, the second alignment module 540 is also used to, before obtaining a second calibration image of the grid pattern on the wafer captured by the camera to be inspected, include at least one of the following: calibrating the set magnification of the camera to be inspected; calibrating the offset of the camera to be inspected along the horizontal and vertical axes; obtaining stray light noise data when the camera to be inspected captures the image, so as to filter the second calibration image based on the stray light noise data.

[0169] Optionally, the second alignment module 540 is specifically used to obtain a third calibration image of the blank area on the wafer, and calculate the light intensity distribution data in the third calibration image; based on the light intensity distribution data and the reference light intensity corresponding to the blank area on the wafer, obtain the stray light noise data corresponding to the camera to be detected.

[0170] Optionally, the first alignment module 520 specifically includes: there are at least two cameras to be detected, and the optical axes of the cameras to be detected are parallel to each other; if the calibration element includes a cross pattern, the center of the cross pattern is located between the two cameras to be detected, and the light corresponding to the calibration element captured by the two cameras to be detected both include the longitudinal lines of the cross pattern.

[0171] Optionally, the second alignment module 540 is also used to calculate the ratio of the sizes of the grid patterns along the longitudinal axis in the two second calibration images based on the second calibration images of the grid patterns on the wafer captured by the two cameras to be inspected, and use the ratio as the optical path difference between the two cameras to be inspected; based on the optical path difference, perform a second alignment adjustment on the posture of the camera to be inspected until the optical path difference returns to zero.

[0172] Optionally, the second alignment module 540 specifically includes: each camera to be detected includes three sensor modules, and the optical axes of each sensor module are parallel to each other; the three sensor modules in each camera to be detected are arranged along the longitudinal direction, or the three sensor modules in each camera to be detected are arranged crosswise with each other, and the cross arrangement is used to indicate that one of the three sensor modules arranged along the longitudinal direction does not belong to the same camera to be detected as the other two sensor modules.

[0173] In this embodiment, the camera adjustment device solves the problem in the related art that the posture calibration of the TDI camera cannot accurately reflect all deviations of the TDI camera relative to the original installation position through the combination of various modules, and realizes convenient automatic regular alignment and adjustment of the camera to be inspected, thereby ensuring the reliability of the camera to be inspected during long-term processing, thereby improving the accuracy and quality of wafer processing.

[0174] Figure 6 A schematic diagram of the structure of a control device provided by an embodiment of the present disclosure, such as Figure 6 As shown, the control device 600 includes: a memory 610 and a processor 620 .

[0175] The memory 610 stores a computer program that can be executed by at least one processor 620. The computer program is executed by at least one processor 620 to enable the control device to implement the material removal method provided in any of the above embodiments or the camera adjustment method provided in any of the above embodiments.

[0176] The memory 610 and the processor 620 may be connected via a bus 630 .

[0177] The relevant instructions can be understood by referring to the relevant descriptions and effects corresponding to the method embodiments, which will not be repeated here.

[0178] The relevant instructions can be understood by referring to the relevant descriptions and effects corresponding to the method embodiments, which will not be repeated here.

[0179] An embodiment of the present disclosure provides a computer-readable storage medium having a computer program stored thereon, and the computer program is executed by a processor to implement a material removal method provided in any of the above method embodiments or a camera adjustment method provided in any of the above embodiments.

[0180] Among them, the computer-readable storage medium may be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.

[0181] An embodiment of the present disclosure provides a computer program product, which includes computer-executable instructions. When the computer-executable instructions are executed by a processor, they are used to implement the material removal method in the above method embodiment or the camera adjustment method provided in any of the above embodiments.

[0182] In the several embodiments provided in the present disclosure, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of modules is only a logical function division, and there may be other division methods in actual implementation, such as multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.

[0183] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the disclosure disclosed herein. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0184] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A camera adjustment method, characterized in that: The camera adjustment method comprises: Move the calibration component to the detection position corresponding to the camera to be detected; Based on the light intensity distribution of the light corresponding to the calibration element photographed by the camera to be detected, performing a first alignment adjustment on the posture of the camera to be detected; Moving the calibration element to a position outside the detection range of the camera to be detected; Based on the detection result of the grid pattern on the wafer, a second alignment adjustment is performed on the posture of the camera to be detected.

2. The method according to claim 1, characterized in that The calibration element is an aperture including a cross pattern, or a calibration plate including a cross pattern; The step of moving the calibration element to a detection position corresponding to the camera to be detected includes: If the calibration element is an aperture including a cross pattern, moving the aperture until the center of the aperture coincides with the optical axis of the camera to be detected in the target posture; If the calibration element is a calibration plate including a cross pattern, the calibration plate is moved until the center of the cross pattern in the calibration plate coincides with the optical axis of the camera to be detected in the target posture.

3. The method according to claim 1, characterized in that The first alignment adjustment of the posture of the camera to be detected based on the light intensity distribution of the light corresponding to the calibration element photographed by the camera to be detected includes: Adjusting the grayscale value of the camera to be detected to a set value; Acquire a first calibration image corresponding to the calibration element photographed by the camera to be detected; determining an actual light intensity distribution in the first calibration image; Determining a rotation angle and an eccentricity of the camera to be detected based on a theoretical light intensity distribution under a target posture of the camera to be detected and the actual light intensity distribution; Based on the rotation angle and the eccentricity, the posture of the camera to be detected is adjusted so that the rotation angle and the eccentricity return to zero.

4. The method according to claim 1, characterized in that: The second alignment adjustment of the posture of the camera to be detected based on the detection result of the grid pattern on the wafer includes: Acquire a second calibration image of the grid pattern on the wafer captured by the camera to be inspected; Determine the deviation data of the camera to be detected based on the actual position coordinates of the grid pattern in the second calibration image and the theoretical position coordinates of the grid pattern corresponding to the target posture of the camera to be detected; Based on the deviation data, a second alignment adjustment is performed on the posture of the camera to be detected so that the value in the deviation data is reset to zero.

5. The method according to claim 4, characterized in that The determining the deviation data of the camera to be detected based on the actual position coordinates of the grid pattern in the second calibration image and the theoretical position coordinates of the grid pattern corresponding to the target posture of the camera to be detected includes: Determine, based on a difference between the actual position coordinates and the theoretical position coordinates, a deflection angle of the grid pattern in the second calibration image relative to a corresponding grid pattern in the target posture; Determine the deflection angle of the camera to be detected relative to the horizontal axis based on the difference between the ordinates of the actual position coordinates and the theoretical position coordinates and the size of the grid pattern along the ordinate direction, wherein the difference between the ordinates is used to represent the difference between the extreme ordinate value in the actual position coordinates and the extreme ordinate value in the corresponding theoretical position coordinates; Based on the horizontal coordinate difference between the actual position coordinate and the theoretical position coordinate and the size of the grid pattern along the horizontal axis, the deflection angle of the camera to be detected relative to the vertical axis is determined.

6. The method according to claim 4, characterized in that Before acquiring the second calibration image of the grid pattern on the wafer captured by the camera to be inspected, at least one of the following items is also included: Calibrate the set magnification of the camera to be detected; Calibrate the offset of the camera to be detected along the horizontal axis and the vertical axis; Obtain stray light noise data when the camera to be detected captures an image, so as to filter the second calibration image based on the stray light noise data.

7. The method according to claim 6, characterized in that The filtering of stray light noise when the camera to be detected takes an image comprises: Acquire a third calibration image of the blank area on the wafer, and calculate light intensity distribution data in the third calibration image; Based on the light intensity distribution data and the reference light intensity corresponding to the blank area on the wafer, stray light noise data corresponding to the camera to be detected is obtained.

8. The method according to any one of claims 1 to 7, characterized in that There are at least two cameras to be detected, and the optical axes of the cameras to be detected are parallel to each other; If the calibration element includes a cross pattern, the center of the cross pattern is located between two cameras to be detected, and the light corresponding to the calibration element photographed by the two cameras to be detected both include the longitudinal line of the cross pattern.

9. The method according to claim 8, characterized in that The method of performing a second alignment adjustment on the posture of the camera to be detected based on the detection result of the grid pattern on the wafer also includes: Based on the second calibration images of the grid pattern on the wafer captured by the two cameras to be inspected, calculating the ratio of the sizes of the grid pattern along the longitudinal axis in the two second calibration images, and using the ratio as the optical path difference between the two cameras to be inspected; Based on the optical path difference, a second alignment adjustment is performed on the posture of the camera to be detected until the optical path difference returns to zero.

10. The method according to claim 8, characterized in that Each camera to be inspected contains three sensor modules, and the optical axes of each sensor module are parallel to each other; The three sensor modules in each camera to be detected are arranged in the longitudinal direction, or the three sensor modules in each camera to be detected are arranged crosswise with each other, wherein the crosswise arrangement indicates that one of the three sensor modules arranged in the longitudinal direction does not belong to the same camera to be detected as the other two sensor modules.

11. A camera adjustment device, characterized in that: The camera adjustment device comprises: A preparation module, used for moving the calibration element to a detection position corresponding to the camera to be detected; A first alignment module, used for performing a first alignment adjustment on the posture of the camera to be detected based on the light intensity distribution of the light corresponding to the calibration element photographed by the camera to be detected; A processing module, used for moving the calibration element to a position outside the detection range of the camera to be detected; The second alignment module is used to perform a second alignment adjustment on the posture of the camera to be detected based on the detection result of the grid pattern on the wafer.

12. A control device, characterized in that: include: at least one processor; and a memory communicatively coupled to the at least one processor; The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the control device to perform the camera adjustment method as described in any one of claims 1 to 10.

13. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are executed by a processor, they are used to implement the camera adjustment method according to any one of claims 1 to 10.

14. A computer program product, characterized in that The computer program product comprises computer-executable instructions, which are used to implement the camera adjustment method according to any one of claims 1 to 10 when executed by a processor.

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