A rapid teaching device, teaching method and application for a wafer loading port

Abstract

The present application discloses a rapid teaching device, a teaching method and an application for a wafer loading port. The teaching device can be applied to the teaching activity of semiconductor dry etching, and includes a mounting base. A moving groove is formed on the surface of the mounting base. A moving slide plate is slidably mounted in the moving groove. A limiting mechanism for limiting the movement of the auxiliary moving manipulator and a releasing mechanism for releasing the limiting effect of the limiting mechanism are provided on the moving slide plate. When in use, after the moving manipulator is inserted into the gap between the mounting base and the teaching wafer simulation block, when the moving manipulator is in pressing contact with the trigger slider in the releasing mechanism, the trigger slider will drive the plugging block in the limiting mechanism to move, releasing the limiting effect of the limiting mechanism. The moving manipulator can push the moving slide plate to move along the length direction of the moving groove, avoiding the problems of shaking and offset of the moving manipulator caused by the hand-held mode during the movement, thereby improving the teaching effect when the teaching device is used.

Description

Technical Field

[0001] The present application specifically relates to a rapid teaching device and teaching method for a wafer loading port, which can be applied to teaching activities of semiconductor dry etching and other processes, and belongs to the field of semiconductor technology. Background Art

[0002] In the semiconductor manufacturing process, for example, when performing dry etching on the wafer, the wafer generally needs to be placed on the wafer loading port, and then the wafer is picked up and placed by a mobile robot equipped with an end effector. Since the wafer is fragile as a whole, the mobile robot needs to avoid shaking and swaying during the wafer picking up and operation to ensure the stability of the mobile robot's docking and movement, and prevent the wafer from being damaged or contaminated due to shaking. In order to make the operators understand that the mobile robot needs to maintain high precision and stability during the movement, a teaching device is needed to assist the operators in practicing during the teaching practice.

[0003] The existing teaching device includes a mounting base and a teaching wafer simulation block located on the mounting base. When practicing, the operator holds a mobile manipulator and inserts it between the mounting base and the teaching wafer simulation block to master the key points of the smooth movement of the mobile manipulator, so that the operator can become familiar with and master the final positioning and movement process of the mobile manipulator through repeated practice.

[0004] When operators use the existing rapid teaching device to practice, the operators hold the mobile manipulator and drive the mobile manipulator to move. However, holding the mobile manipulator is prone to shaking, offset and other problems, which causes the mobile manipulator to be unstable during the movement process, affecting the overall teaching effect of the teaching device. Summary of the invention

[0005] The purpose of this section is to summarize some aspects of the embodiments of the present application and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and invention title of the present application to avoid blurring the purpose of this section, specification abstract and invention title, and such simplifications or omissions cannot be used to limit the scope of the present application.

[0006] In order to solve the problems raised in the above background technology, the present application adopts the following technical solutions.

[0007] The first aspect of the present application provides a rapid teaching device for a wafer loading port, including a mounting base and a teaching wafer simulation block. The teaching wafer simulation block is loaded above the mounting base, and there is a gap between the teaching wafer simulation block and the mounting base. The device further includes a moving manipulator. During practice, an operator holds the moving manipulator and moves the moving manipulator into the gap between the teaching wafer simulation block and the mounting base. A moving groove is formed on the surface of the mounting base, and a moving slide plate is slidably installed in the moving groove. An auxiliary mechanism for limiting and releasing the limit of the moving manipulator for movement is provided on the moving slide plate. The auxiliary mechanism consists of a limiting mechanism and a releasing mechanism. The limiting mechanism is used to limit the moving slide plate, and the releasing mechanism is used to release the limiting effect of the limiting mechanism. After the moving manipulator enters the gap between the teaching wafer simulation block and the mounting base, it contacts the releasing mechanism. After the releasing mechanism releases the limiting effect of the limiting mechanism on the moving slide plate, the moving slide plate is pushed to move in the moving groove by the moving manipulator.

[0008] As a preferred technical solution of the present application, the limiting mechanism includes a mating chute, a dividing cross plate, a plugging block, and a second spring. Mating chutes are formed at both ends of the moving slide plate, a dividing cross plate is installed inside the mating chutes, and plugging blocks are connected to the ends of the mating chutes. A plurality of groups of the plugging blocks are provided, and card slots for engaging with the plugging blocks are symmetrically formed inside the moving groove. A second spring is connected to the plugging block, and the end of the second spring is connected to the dividing cross plate.

[0009] As a preferred technical solution of the present application, the limiting mechanism further includes a third spring. One end of the third spring is connected to the moving slide plate, and the other end is connected to the inner wall of the moving groove. When the moving slide plate slides in the moving groove, the third spring is compressed and in a state of storing energy.

[0010] As a preferred technical solution of the present application, the releasing mechanism includes a docking top plate, a blocking partition, a touch slider, a first spring, and a traction component. A docking top plate is provided on the surface of the moving slide plate. A sliding groove is formed inside the docking top plate, a blocking partition is installed in the sliding groove, and a touch slider is slidably connected to the side wall of the sliding groove. The end of the touch slider penetrates the side wall of the sliding groove, and a first spring is connected to the touch slider. The end of the first spring is connected to the blocking partition, and a traction component is installed on the side wall of the blocking partition.

[0011] As a preferred technical solution of the present application, a plurality of groups of the touch sliders are provided, and each group of touch sliders corresponds to the plugging block in the limiting mechanism for releasing the limiting effect of the plugging block.

[0012] As a preferred technical solution of the present application, the traction assembly includes a meshing tooth plate, a mounting bracket, a winding roller, a meshing gear and a connecting rope. A plurality of mounting brackets are installed on the blocking partition, and the mounting brackets are connected by a rotating shaft. A winding roller is installed on the rotating shaft, and a connecting rope is connected to the winding roller. The end of the connecting rope bypasses a guide wheel and is connected to the plug-in block. Each set of trigger sliders corresponds to a set of winding rollers, and a meshing tooth plate is also connected to the end of the trigger slider. The meshing tooth plate passes through the blocking partition and extends to one side of the mounting bracket, and a meshing gear is also connected to the end of the rotating shaft. The meshing gear meshes with the meshing tooth plate. By moving the trigger slider, the meshing tooth plate is driven to move, thereby driving the meshing gear to rotate, and the winding roller is driven by the rotating shaft to wind the connecting rope, so as to pull the plug-in block out of the card slot to release the limiting effect of the plug-in block on the moving slide plate.

[0013] As a preferred technical solution of the present application, the teaching wafer simulation block includes a simulation block body, a horizontal alignment mark and a vertical alignment mark. The simulation block body is arranged on the upper surface of the mounting base, and a horizontal alignment mark and a vertical alignment mark are arranged on the surface of the simulation block body. The horizontal alignment mark and the vertical alignment mark are vertically intersecting, and the intersection point of the horizontal alignment mark and the vertical alignment mark is located at the center of the circle of the simulation block body.

[0014] As a preferred technical solution of the present application, the teaching wafer simulation block further includes a wafer support, a wafer coupling pin seat and a sensor trigger seat. The wafer supports are symmetrically installed on the upper surface of the mounting base. A jack matching with the wafer support is provided on the teaching wafer simulation block. The wafer coupling pin seat is installed on the surface of the mounting base. There are three groups of wafer coupling pin seats in total. The sensor trigger seat is electrically connected to the wafer coupling pin seat. After the teaching wafer simulation block is inserted on the wafer support, the lower surface of the teaching wafer simulation block fits on the surface of the wafer coupling pin seat.

[0015] As a preferred technical solution of the present application, a plurality of side support frames for auxiliary support are installed on the side of the mounting base, and a clamping groove is installed at the bottom end of the mounting base.

[0016] The second aspect of the present application provides a teaching method for a quick teaching device of a wafer loading port, including the following steps:

[0017] S1. Fix the quick teaching device through the side support frame and the clamping groove;

[0018] S2, the operator holds the mobile manipulator and makes the mobile manipulator enter the gap between the teaching wafer simulation block and the mounting base, the end of the mobile manipulator fits with the touch slider and the mobile manipulator causes multiple groups of touch sliders to be squeezed and moved at the same time, so that the plug-in card block and the card slot are released by the touch slider, and when the release mechanism releases the limiting effect of the limiting mechanism, the mobile manipulator drives the moving slide to slide in the moving slot;

[0019] S3, the longitudinal alignment mark on the teaching wafer simulation block assists the operator to observe whether the position of the mobile manipulator is deviated, and the transverse alignment mark assists the operator to observe the position of the end of the mobile manipulator when the mobile manipulator moves in the moving slot;

[0020] S4. When the mobile manipulator touches the teaching wafer simulation block during movement, causing the teaching wafer simulation block to detach from the wafer coupling pin seat, the sensor on the sensor trigger seat will alarm, reminding the operator to adjust the position of the mobile manipulator in time.

[0021] The third aspect of the present application provides a semiconductor wafer dry etching teaching method, which is implemented based on the rapid teaching device of the wafer loading port and the semiconductor dry etching equipment, and includes:

[0022] A teaching method for executing the rapid teaching device of the wafer loading port;

[0023] The rapid teaching device carrying the wafer is placed in semiconductor dry etching equipment, and semiconductor wafer dry etching teaching is performed.

[0024] Compared with the prior art, the beneficial effects of this application are:

[0025] First, the present application cooperates with the mobile manipulator with the limiting mechanism and the releasing mechanism, so that the end of the mobile manipulator fits with the touch slider and the mobile manipulator causes multiple groups of touch sliders to be squeezed and moved at the same time, thereby releasing the engagement between the plug-in card block and the card slot through the touch slider, thereby realizing the limiting effect of the releasing mechanism releasing the limiting mechanism, so that the operator can realize the importance of the accurate position of the mobile manipulator when moving, and avoids the problem of the mobile manipulator shaking and deflecting due to unstable handholding when the operator holds the mobile manipulator. When the mobile slide plate slides in the moving slot, the third spring is compressed and is in a power storage state. Until the third spring cannot contract, the mobile slide plate cannot continue to slide along the length direction of the moving slot, and the moving spacing of the mobile slide plate is controlled to ensure the working quality and teaching effect of the teaching device itself.

[0026] Second, through the setting and installation of the teaching wafer simulation block in this application, after the moving manipulator enters the gap between the teaching wafer simulation block and the installation base, the operator uses the longitudinal alignment mark to judge whether the position of the moving manipulator is accurate. And when the end of the moving manipulator moves to the transverse alignment mark, the movement stops, so as to assist the operator in calibrating the position of the moving manipulator and showing the operator the concept that the moving manipulator needs to maintain an accurate position, so as to achieve the teaching purpose. Brief Description of the Drawings

[0027] Figure 1 It is a schematic diagram of the overall structure of this application.

[0028] Figure 2 It is a schematic diagram of the disassembled structure of the installation base and the teaching wafer simulation block of this application.

[0029] Figure 3 It is a schematic diagram of the structure of the installation base of this application.

[0030] Figure 4 It is a schematic diagram of the assembly structure of the moving slide, the limiting mechanism and the releasing mechanism in this application.

[0031] Figure 5 It is a schematic diagram of the structure of the limiting mechanism and the releasing structure in this application.

[0032] Figure 6 It is a schematic diagram of the structure of the traction component in this application.

[0033] Figure 7 It is a schematic diagram of the assembly of the teaching wafer simulation block and the installation base in this application.

[0034] Figure 8 It is a bottom view of the quick teaching device in this application.

[0035] The corresponding relationship between the reference numerals and the component names in the drawings is as follows:

[0036] 1. Installation base; 2. Moving manipulator; 3. Teaching wafer simulation block; 31. Simulation block body; 32. Transverse alignment mark; 33. Longitudinal alignment mark; 34. Wafer support; 35. Wafer coupling pin seat; 36. Sensor trigger seat; 4. Moving slide; 5. Limiting mechanism; 51. Matching chute; 52. Dividing cross plate; 53. Inserting card block; 54. Second spring; 55. Third spring; 6. Releasing mechanism; 61. Docking top plate; 62. Blocking partition; 63. Touching slider; 64. First spring; 65. Traction component; 651. Meshing tooth plate; 652. Installation bracket; 653. Winding roller; 654. Meshing gear; 655. Connecting rope; 7. Side support frame; 8. Clamping groove. Detailed Description of the Invention

[0037] To make the above objects, features, and advantages of the present application more obvious and understandable, the following provides a detailed description of the specific implementation manners of the present application in conjunction with the accompanying drawings of the specification.

[0038] In the following description, many specific details are set forth to facilitate a thorough understanding of the present application. However, the present application may also be implemented in other ways different from those described herein. Persons skilled in the art can make similar generalizations without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0039] Secondly, as used herein, an "embodiment" or "embodiments" refers to specific features, structures, or characteristics that may be included in at least one implementation manner of the present application. The phrase "in an embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that excludes other embodiments. The present application provides the following embodiments.

[0040] As shown by Figure 1 and Figure 2 This is a schematic structural diagram of a quick teaching device for a wafer loading port in this embodiment. The device includes a mounting base 1 and a teaching wafer simulation block 3. The teaching wafer simulation block 3 is loaded above the mounting base 1, and there is a gap between the teaching wafer simulation block 3 and the mounting base 1. The device further includes a moving manipulator 2. During practice, an operator holds the moving manipulator 2 and moves the moving manipulator 2 into the gap between the teaching wafer simulation block 3 and the mounting base 1 for the operator to observe the entry position and entry distance of the moving manipulator 2 to achieve the teaching purpose.

[0041] In this embodiment, a moving groove is formed on the surface of the mounting base 1, and a moving slide plate 4 is slidably mounted in the moving groove. An auxiliary mechanism for limiting and releasing the limit of the moving manipulator 2 to allow the moving manipulator 2 to move is provided on the moving slide plate 4. In this embodiment, the auxiliary mechanism is composed of a limiting mechanism 5 and a releasing mechanism 6. When in use, after the moving manipulator 2 is inserted into the gap between the mounting base 1 and the teaching wafer simulation block 3, the limiting effect of the limiting mechanism 5 is released by the releasing mechanism 6 in the auxiliary mechanism, and then the moving manipulator 2 can push the moving slide plate 4 to move along the length direction of the moving groove, and the problems of shaking and deviation of the moving manipulator 2 caused by the holding method are avoided during the moving process.

[0042] As shown in Figures 3 to 6 In this embodiment, clamping grooves are formed on both sides of the moving groove, and limiting mechanisms 5 are installed at both ends of the moving slide plate 4. The moving slide plate 4 is limited by inserting the limiting mechanisms 5 into the clamping grooves to prevent the moving slide plate 4 from moving in the moving groove. As shown in Figure 3 , Figure 4 and Figure 5As shown, the limiting mechanism 5 in this embodiment includes a matching slide 51, a dividing transverse plate 52, a plug-in card block 53, a second spring 54 and a third spring 55. Matching slides 51 are provided at both ends of the mobile slide 4. The dividing transverse plate 52 is installed inside the matching slide 51, and the plug-in card block 53 is connected to the end of the matching slide 51. There are multiple groups of the plug-in card blocks 53. When multiple groups of plug-in card blocks 53 are plugged into the card slots on both sides of the mobile slot, the mobile slide 4 can be limited to prevent the mobile slide 4 from moving. In the present embodiment, a second spring 54 is connected to the plug-in card block 53, and the end of the second spring 54 is connected to the dividing cross plate 52. When the limiting mechanism 5 releases the limit, the moving slide 4 slides in the moving groove. At this time, the plug-in card block 53 abuts against the inner wall of the moving groove, and the second spring 54 is in a compressed and force-accumulated state. The plug-in card block 53 is inserted into the slot position on both sides of the moving groove. The second spring 54 drives the plug-in card block 53 into the slot due to the reset, thereby limiting the moving slide 4.

[0043] In addition, if Figures 3 to 6 As shown, in this embodiment, a release mechanism 6 is also connected to the movable slide 4, and the release mechanism 6 is used to release the limiting effect of the limiting mechanism 5. The release mechanism 6 in this embodiment includes a docking top plate 61, a blocking baffle 62, a touch slider 63, a first spring 64 and a traction assembly 65. The surface of the movable slide 4 is provided with a docking top plate 61, and the docking top plate 61 is provided with a sliding groove, in which a blocking baffle 62 is installed, and a touch slider 63 is slidably connected to the side wall of the sliding groove. There are a plurality of groups of touch sliders 63, and each group of touch sliders 63 corresponds to the plug-in card block 53 in the limiting mechanism 5, which is used to release the limiting effect of the plug-in card block 53. In this embodiment, the end of the touch slider 63 passes through the side wall of the sliding groove, and the touch slider 63 is connected to the first spring 64, and the end of the first spring 64 is connected to the blocking baffle 62. When the touch slider 63 moves in the direction of the blocking baffle 62, the first spring 64 is compressed and is in a force storage state.

[0044] In this embodiment, Figure 5 as well as Figure 6 As shown, a traction assembly 65 is also connected to the side wall of the blocking baffle 62, and the traction assembly 65 includes a meshing gear plate 651, a mounting bracket 652, a winding roller 653, a meshing gear 654 and a connecting rope 655. In this embodiment, multiple groups of mounting brackets 652 are installed on the blocking baffle 62, and the mounting brackets 652 are connected by a rotating shaft, and a winding roller 653 is installed on the rotating shaft. The winding roller 653 is connected to the connecting rope 655, and the end of the connecting rope 655 passes around the guide wheel and is connected to the plug-in block 53. It is worth noting that each group of touch sliders 63 corresponds to a group of winding rollers 653, so that each group of touch sliders 63 can release the limiting effect of the corresponding plug-in block 53.

[0045] As Figure 6 shown, in this embodiment, the end of the trigger slider 63 is further connected with a meshing tooth plate 651. The meshing tooth plate 651 passes through the blocking partition 62 and extends to one side of the mounting bracket 652. And the end of the rotating shaft is further connected with a meshing gear 654. The meshing gear 654 meshes with the meshing tooth plate 651. By moving the trigger slider 63, the meshing tooth plate 651 is driven to move, thereby driving the meshing gear 654 to rotate. And the winding roller 653 is driven by the rotating shaft to wind the connecting rope 655, so as to pull out the plug-in block 53 from the card slot, so as to release the limiting effect of the plug-in block 53 on the moving slide plate 4.

[0046] It should be noted that each group of trigger sliders 63 in this embodiment is used to release the limiting effect on the corresponding plug-in block 53. When all the trigger sliders 63 move simultaneously, the limiting effect on all the plug-in blocks 53 can be released, so that the moving slide plate 4 can be driven to slide in the moving slot.

[0047] When the operator practices operating the moving manipulator 2, after the end of the moving manipulator 2 enters the gap between the teaching wafer simulation block 3 and the mounting base 1, the end of the moving manipulator 2 abuts against the trigger slider 63, thus avoiding the problems of shaking and deviation of the moving manipulator 2 due to being held by the operator. By driving the moving manipulator 2 to move by the operator, the trigger slider 63 can be driven to move. After the limiting effect of the plug-in block 53 is released, the moving slide plate 4 can be driven to move in the moving slot. It should be noted that there are multiple groups of trigger sliders 63 and plug-in blocks 53 in this embodiment. When the position where the moving manipulator 2 enters is offset, all the trigger sliders 63 cannot be driven by the moving manipulator 2, that is, some trigger sliders 63 do not move, resulting in some plug-in blocks 53 not releasing the limiting effect, and the moving slide plate 4 cannot slide. At this time, the operator needs to adjust the position of the moving manipulator 2 so that the moving manipulator 2 can trigger all the trigger sliders 63 to move, so as to enable the operator to realize that the moving manipulator 2 needs to accurately enter the rapid teaching device to achieve the teaching purpose.

[0048] In addition, as Figure 3 shown, in this embodiment, a third spring 55 is further installed in the moving slot. One end of the third spring 55 is connected to the moving slide plate 4, and the other end is connected to the inner wall of the moving slot. When the moving slide plate 4 slides in the moving slot, the third spring 55 is compressed and in a state of storing energy. Until the third spring 55 cannot contract anymore, the moving slide plate 4 cannot continue to slide along the length direction of the moving slot.

[0049] By the attached Figure 7As shown in the figure, the teaching wafer simulation block 3 in this embodiment includes a simulation block body 31, and the simulation block body 31 is made of a transparent material for an operator to observe the position of the moving manipulator 2 entering the gap between the teaching wafer simulation block 3 and the mounting base 1. In addition, a horizontal alignment mark 32 and a vertical alignment mark 33 are provided on the surface of the simulation block body 31 in this embodiment. The horizontal alignment mark 32 and the vertical alignment mark 33 are perpendicularly intersecting, and the intersection point of the horizontal alignment mark 32 and the vertical alignment mark 33 is located at the center of the circle of the simulation block body 31. After the moving manipulator 2 enters the gap between the teaching wafer simulation block 3 and the mounting base 1, the operator uses the vertical alignment mark 33 to judge whether the position of the moving manipulator 2 is accurate. And when the end of the moving manipulator 2 moves to the horizontal alignment mark 32, the movement stops, so as to assist the operator to calibrate the position of the moving manipulator 2 and show the operator the concept that the moving manipulator 2 needs to maintain a precise position, so as to achieve the teaching purpose.

[0050] As shown in the attached Figure 7 and Figure 8 As shown in the figure, the teaching wafer simulation block 3 further includes a wafer support 34, a wafer coupling pin seat 35 and a sensor trigger seat 36. The wafer support 34 is symmetrically installed on the upper surface of the mounting base 1. A jack matching the wafer support 34 is provided on the teaching wafer simulation block 3. The wafer coupling pin seat 35 is installed on the surface of the mounting base 1. There are three groups of wafer coupling pin seats 35 in total, and the sensor trigger seat 36 is electrically connected to the wafer coupling pin seat 35. After the teaching wafer simulation block 3 is inserted on the wafer support 34, the lower surface of the teaching wafer simulation block 3 fits on the surface of the wafer coupling pin seat 35.

[0051] In this embodiment, the position of the whole teaching wafer simulation block 3 is positioned by the wafer support 34 to ensure the preliminary calibration of the positions of the horizontal alignment mark 32 and the vertical alignment mark 33, and prevent the problem of tilting of both the horizontal alignment mark 32 and the vertical alignment mark 33. When the moving manipulator 2 enters the gap between the teaching wafer simulation block 3 and the mounting base 1 and touches the teaching wafer simulation block 3, the teaching wafer simulation block 3 lifts up and moves along the height direction of the wafer support 34, resulting in the teaching wafer simulation block 3 separating from the wafer coupling pin seat 35. At this time, the sensor connected to the sensor trigger seat 36 responds to remind the operator that the position of the moving manipulator 2 has shifted in the height direction, so as to facilitate timely adjustment of the position of the moving manipulator 2. In this embodiment, the above-mentioned quick teaching device is used to assist the operator to practice the use of the moving manipulator 2, and it can also let the operator realize the purpose that the moving manipulator 2 needs to maintain a precise position during the movement, so that the operator understands the important role of the accuracy and stability of the moving manipulator 2 during the movement, thus achieving a good teaching effect.

[0052] In addition, if Figure 8 As shown, in this embodiment, a plurality of sets of auxiliary supporting side support frames 7 are installed on the side of the mounting base 1, and a snap-in groove 8 is installed at the bottom end of the mounting base 1, so as to facilitate the installation of the quick teaching device in this embodiment at the target position, complete the locking of the position of the mounting base 1, and prevent the mounting base 1 from sliding due to external push during the teaching process, thereby causing problems that are unfavorable to teaching.

[0053] On the one hand, this embodiment provides a technical solution of the above-mentioned rapid teaching device, and on the other hand, this embodiment also provides a teaching method of the above-mentioned rapid teaching device, including the following steps:

[0054] First, the quick teaching device is fixed by the side support frame 7 and the clamping groove 8 to avoid the whole device moving during the teaching process;

[0055] Secondly, the operator holds the mobile manipulator 2 and makes the mobile manipulator 2 enter the gap between the teaching wafer simulation block 3 and the mounting base 1. The end of the mobile manipulator 2 fits with the touch slider 63 and the mobile manipulator 2 makes multiple groups of touch sliders 63 be squeezed and moved at the same time, so that the plug-in card block 53 and the card slot are released by the touch slider 63, thereby realizing the release mechanism 6 to release the limiting effect of the limiting mechanism 5, so that the operator realizes the importance of the accurate position of the mobile manipulator 2 when moving. After the release mechanism 6 releases the limiting effect of the limiting mechanism 5, the mobile manipulator 2 drives the moving slide 4 to slide in the moving groove; when the moving slide 4 slides in the moving groove, the third spring 55 is compressed, and the teaching wafer simulation The longitudinal alignment mark 33 on the block 3 assists the operator to observe whether the position of the mobile manipulator 2 deviates, and the lateral alignment mark 32 assists the operator to observe the position of the end of the mobile manipulator 2 when the mobile manipulator 2 moves in the moving slot, so that the operator can accurately grasp the position of the mobile manipulator 2; in addition, when the mobile manipulator 2 touches the teaching wafer simulation block 3 during movement, causing the teaching wafer simulation block 3 to detach from the wafer coupling pin seat 35, the sensor on the sensor trigger seat 36 will alarm to remind the operator to adjust the position of the mobile manipulator 2 in time. Through repeated practice by the operators, the operators will realize that the accuracy of the position of the mobile manipulator 2 needs to be guaranteed when moving, so as to achieve the teaching purpose.

[0056] The teaching device of this embodiment can be applied to the teaching activities of semiconductor dry etching.

[0057] The above content is a further detailed description of the present application in combination with specific embodiments. It cannot be determined that the specific implementation of the present application is only limited to these descriptions. For those of ordinary skill in the technical field to which the present application belongs, without departing from the concept of the present application, several simple deductions or substitutions can still be made, and all should be regarded as belonging to the protection scope determined by the claims submitted for the present application.

Claims

1. A rapid teaching device for a wafer loading port, comprising a mounting base (1) and a teaching wafer simulation block (3), wherein the teaching wafer simulation block (3) is loaded above the mounting base (1), and there is a gap between the teaching wafer simulation block (3) and the mounting base (1), and the device also comprises a mobile manipulator (2), during training, an operator holds the mobile manipulator (2) and moves the mobile manipulator (2) to the gap between the teaching wafer simulation block (3) and the mounting base (1), characterized in that: The surface of the mounting base (1) is provided with a moving groove, in which a moving slide (4) is slidably mounted, and the moving slide (4) is provided with an auxiliary mechanism for assisting the mobile manipulator (2) in limiting and releasing the limiting so that the mobile manipulator (2) can move, the auxiliary mechanism consisting of a limiting mechanism (5) and a releasing mechanism (6), and slots are provided on both sides of the moving groove, and the limiting mechanisms (5) are installed at both ends of the moving slide (4), and the limiting mechanisms (5) are inserted into the slots to limit the moving slide (4), and the moving slide (4) is also connected to a releasing mechanism (6) corresponding to the limiting mechanism (5), and the releasing mechanism (6) is used to release the limiting effect of the limiting mechanism (5), and the mobile manipulator (2) contacts the releasing mechanism (6) after the mobile manipulator (2) enters the gap between the teaching wafer simulation block (3) and the mounting base (1), and the limiting effect of the limiting mechanism (5) on the moving slide (4) is released by the releasing mechanism (6), and then the moving slide (4) is pushed by the mobile manipulator (2) to move in the moving groove.

2. The rapid teaching device for a wafer loading port according to claim 1, characterized in that: The limiting mechanism (5) comprises a matching slide groove (51), a dividing transverse plate (52), a plug-in card block (53) and a second spring (54). Matching slide grooves (51) are provided at both ends of the movable slide plate (4). The dividing transverse plate (52) is installed inside the matching slide groove (51), and the plug-in card block (53) is connected to the end of the matching slide groove (51). A plurality of groups of the plug-in card blocks (53) are provided. Card slots for matching the plug-in card blocks (53) are symmetrically provided inside the movable groove. The plug-in card block (53) is connected to the second spring (54), and the end of the second spring (54) is connected to the dividing transverse plate (52).

3. The rapid teaching device for a wafer loading port according to claim 2, characterized in that: The limiting mechanism (5) further comprises a third spring (55), one end of the third spring (55) being connected to the movable slide plate (4) and the other end being connected to the inner wall of the movable groove; when the movable slide plate (4) slides in the movable groove, the third spring (55) is compressed and in a force storage state.

4. The rapid teaching device for a wafer loading port according to claim 1, characterized in that: The release mechanism (6) comprises a docking top plate (61), a blocking baffle (62), a touch slider (63), a first spring (64) and a traction assembly (65); the surface of the movable slide plate (4) is provided with a docking top plate (61); a sliding groove is provided inside the docking top plate (61); a blocking baffle (62) is installed in the sliding groove; a touch slider (63) is slidably connected to a side wall of the sliding groove; an end of the touch slider (63) passes through the side wall of the sliding groove; a first spring (64) is connected to the touch slider (63); a terminal end of the first spring (64) is connected to the blocking baffle (62); and a traction assembly (65) is installed on the side wall of the blocking baffle (62).

5. The rapid teaching device for a wafer loading port according to claim 4, characterized in that: A total of multiple groups of the touch sliders (63) are provided, and each group of the touch sliders (63) corresponds to a plug-in card block (53) in the limiting mechanism (5) and is used to release the limiting effect of the plug-in card block (53).

6. The rapid teaching device for a wafer loading port according to claim 5, characterized in that: The traction assembly (65) comprises a meshing tooth plate (651), a mounting bracket (652), a winding roller (653), a meshing gear (654) and a connecting rope (655). A plurality of groups of mounting brackets (652) are mounted on the blocking baffle (62), and the mounting brackets (652) are connected via a rotating shaft. A winding roller (653) is mounted on the rotating shaft. The winding roller (653) is connected to a connecting rope (655). The end of the connecting rope (655) passes around the guide wheel and is connected to the plug-in card block (53). Each group of touch sliders (63) corresponds to a group of winding rollers (653). The end of the touch slider (63) is also connected to a connecting rope (655). A meshing tooth plate (651) is connected, the meshing tooth plate (651) passes through the blocking baffle (62) and extends to one side of the mounting bracket (652), and the end of the rotating shaft is also connected to a meshing gear (654), the meshing gear (654) meshes with the meshing tooth plate (651), and the meshing tooth plate (651) is driven to move by the movement of the trigger slider (63), thereby driving the meshing gear (654) to rotate, and the winding roller (653) is driven to wind up the connecting rope (655) through the rotating shaft, thereby pulling the plug-in card block (53) out of the card slot, so as to release the limiting effect of the plug-in card block (53) on the movable slide plate (4).

7. The rapid teaching device for a wafer loading port according to claim 6, characterized in that: The teaching wafer simulation block (3) comprises a simulation block body (31), a lateral alignment mark (32) and a longitudinal alignment mark (33); the simulation block body (31) is arranged on the upper surface of the mounting base (1); the surface of the simulation block body (31) is provided with a lateral alignment mark (32) and a longitudinal alignment mark (33); the lateral alignment mark (32) and the longitudinal alignment mark (33) intersect vertically; and the intersection of the lateral alignment mark (32) and the longitudinal alignment mark (33) is located at the center of the circle of the simulation block body (31).

8. The rapid teaching device for a wafer loading port according to claim 7, characterized in that: The teaching wafer simulation block (3) further comprises a wafer support (34), a wafer coupling pin seat (35) and a sensor trigger seat (36); the wafer support (34) is symmetrically mounted on the upper surface of the mounting base (1); a socket for matching with the wafer support (34) is provided on the teaching wafer simulation block (3); the wafer coupling pin seat (35) is mounted on the surface of the mounting base (1); three groups of wafer coupling pin seats (35) are provided in total; the sensor trigger seat (36) is electrically connected to the wafer coupling pin seat (35); and when the teaching wafer simulation block (3) is inserted on the wafer support (34), the lower surface of the teaching wafer simulation block (3) is attached to the surface of the wafer coupling pin seat (35).

9. The rapid teaching device for a wafer loading port according to claim 8, characterized in that: The side surfaces of the installation base (1) are provided with a plurality of sets of auxiliary supporting side support frames (7), and the bottom end of the installation base (1) is provided with a clamping groove (8).

10. A teaching method of the rapid teaching device for a wafer loading port as claimed in claim 9, comprising the following steps: S1, fixing the quick teaching device through the side support frame (7) and the clamping groove (8); S2, the operator holds the mobile manipulator (2) so that the mobile manipulator (2) enters the gap between the teaching wafer simulation block (3) and the mounting base (1), the end of the mobile manipulator (2) fits with the touch slider (63) and the mobile manipulator (2) causes multiple groups of touch sliders (63) to be squeezed and moved at the same time, and the touch sliders (63) release the connection between the plug-in card block (53) and the card slot. After the release mechanism (6) releases the limiting effect of the limiting mechanism (5), the mobile manipulator (2) drives the moving slide plate (4) to slide in the moving slot; S3, the longitudinal alignment mark (33) on the teaching wafer simulation block (3) assists the operator to observe whether the position of the mobile manipulator (2) is deviated, and the transverse alignment mark (32) assists the operator to observe the position of the end of the mobile manipulator (2) when the mobile manipulator (2) moves in the moving slot; S4. When the mobile manipulator (2) touches the teaching wafer simulation block (3) during movement, causing the teaching wafer simulation block (3) to detach from the wafer coupling pin seat (35), the sensor on the sensor trigger seat (36) will sound an alarm, reminding the operator to adjust the position of the mobile manipulator (2) in time.

11. Use of the rapid teaching device of a wafer loading port according to any one of claims 1 to 9 in semiconductor dry etching teaching activities.

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