Packaging equipment, packaging process and flattening device
By using a flattening device to press the warped packaging substrate in the glue marking area of the packaging equipment, the surface of which is flattened is solved, and the problem of warping of the thin substrate after heating is achieved, the precise and stable setting of the semiconductor chip is achieved, and the yield of the packaging process is significantly improved.
Patent Information
- Application Number
- CN202311368220.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-10-17
- Filing Date
- 2023-10-20
- Publication Date
- 2025-04-18
AI Technical Summary
In the existing packaging process, packaging substrates with a thickness of less than 0.3 cm are easily warped due to uneven stress distribution after heating, resulting in the inability to effectively adsorption of the vacuum platform, affecting the accurate and stable setting of the semiconductor chip, and reducing the process yield.
A packaging device is designed, including a load bearing device, a flattening device and a pick-up device. After heating the substrate structure in the feed preheating zone, it is transported to the glued zone, and the warped surface of the substrate structure is pressed using a flattened device to make it in a flat state, and then the electronic components are accurately placed in the upper area by the pick-and-place device.
Through the configuration of the flattening device, the substrate structure has a flat surface state before the upper sheet operation, ensuring that the electronic components can be accurately placed on each crystal area of the substrate structure and set smoothly, thereby greatly improving the yield of the packaging process.
Smart Images
Figure CN119852201A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a semiconductor packaging process and equipment, in particular to a packaging equipment, packaging process and flattening device capable of improving process yield. Background Art
[0002] With the rapid development of the electronics industry, electronic products tend to be thinner, lighter, shorter and smaller in shape, and their functions are developing towards high performance, high functionality and high speed. Therefore, in order to meet the needs of high integration and miniaturization of semiconductor devices, packaging substrates with high-density and fine-pitch circuits are often used in the packaging process.
[0003] A flip-chip semiconductor package is a packaging structure that uses a flip-chip method for electrical connection. It electrically connects the active surface of at least one semiconductor chip to the surface of a substrate through a plurality of solder bumps, and plants a plurality of solder balls that can serve as input / output (I / O) terminals on the other surface of the substrate. This design can not only significantly reduce the size of the package to make the ratio of the chip to the substrate closer, but also eliminate the existing wire design, thereby reducing impedance and improving electrical properties, and avoiding signal distortion during transmission. Therefore, it has become the mainstream packaging technology for the next generation of chips.
[0004] In the existing packaging process, Figure 1 As shown, the package substrate 1 is preheated first, and then the semiconductor chip 10 is placed on the package substrate 1 by a robot arm 1 b.
[0005] However, in the existing packaging process, if the thickness t of the packaging substrate 1 is too small, such as less than 0.3 mm, when the packaging substrate 1 undergoes a heating operation, it is easy to be warped due to uneven stress distribution, resulting in the vacuum mechanism of the vacuum platform 1a used to support the packaging substrate 1 being unable to effectively adsorb the packaging substrate 1. Therefore, in the subsequent chip loading operation, the semiconductor chip 10 cannot be accurately placed in the die placement area of the packaging substrate 1, or cannot be stably placed on the packaging substrate 1, resulting in the inability to complete the chip loading operation, resulting in poor process yield.
[0006] Therefore, how to overcome the various problems of the above-mentioned prior art has become a topic that needs to be solved urgently. Summary of the invention
[0007] In view of the various deficiencies of the above-mentioned prior art, the present invention provides a packaging device, including: a carrying device, which is used to carry a substrate structure as a target object, wherein the carrying device includes a track structure to set up the substrate structure; a flattening device, which is arranged above the carrying device, and includes a device body and a bracket, the device body has a pressing portion for contacting and pressing the substrate structure, the substrate structure is set on the track structure, and the bracket is connected to the device body in a detachable manner and set up on the track structure; and a pick-and-place device, which is arranged above the carrying device to place electronic components on the substrate structure.
[0008] In the aforementioned packaging device, the carrying device further comprises a base platform for carrying the substrate structure. For example, the base platform fixes the substrate structure in a vacuum adsorption manner.
[0009] In the aforementioned packaging device, the substrate structure is displaced along the track structure.
[0010] In the aforementioned packaging equipment, the packaging equipment defines a material preheating zone for disposing the carrier device, and the substrate structure is in a warped state in the material preheating zone.
[0011] In the aforementioned packaging device, the packaging device defines a glue-cutting area for configuring the glue-forming device and the flattening device, and the substrate structure is in a surface-flattened state in the glue-cutting area.
[0012] The aforementioned packaging device also includes a glue forming device disposed above the carrying device, which is used to form glue on the substrate structure.
[0013] The present invention further provides a packaging process, comprising: providing the aforementioned packaging equipment, which is defined with a feed preheating zone, a glue drawing zone, a top plate zone and a discharge zone; in the feed preheating zone, placing the substrate structure on the carrier device to heat the substrate structure; moving the substrate structure to the glue drawing zone to press the flattening device onto the substrate structure and form glue on the substrate structure; and moving the substrate structure together with the flattening device to the top plate zone to place at least one electronic component on the substrate structure through the pick-and-place device.
[0014] In the aforementioned packaging process, the carrying device further comprises a base platform for carrying the substrate structure. For example, the base platform fixes the substrate structure by vacuum adsorption.
[0015] In the aforementioned packaging process, the substrate structure is displaced along the track structure.
[0016] In the aforementioned packaging process, the track structure connects the material preheating area, the glue scribing area, the sheet loading area and the material discharging area.
[0017] In the aforementioned packaging process, the electronic component is pasted on the adhesive material.
[0018] The aforementioned packaging process also includes moving the substrate structure provided with the electronic component together with the flattening device to the discharge area, and separating the flattening device from the substrate structure.
[0019] The present invention also provides a flattening device, comprising: a device body having a pressing portion for contacting and pressing a target object, wherein the target object is mounted on a track structure; and a bracket, which is detachably connected to the device body and mounted on the track structure.
[0020] In the above-mentioned flattening device, the device body is a frame structure.
[0021] In the aforementioned flattening device, the pressing portion is in the shape of a plate.
[0022] In the above flattening device, the disassembly mode is an adsorption mode. In addition, the bracket is connected to the device body through a magnet.
[0023] In the aforementioned flattening device, the bracket positions the device body through a latch.
[0024] From the above, it can be seen that in the packaging equipment, packaging process and flattening device of the present invention, the flattening device is mainly configured to press the warped surface of the substrate structure through the flattening device before the electronic component is set on the substrate structure, so that the substrate structure presents a surface flat state. Therefore, compared with the prior art, the electronic component can be accurately placed on each chip placement area of the substrate structure, and can be stably placed on the substrate structure to successfully complete the chip loading operation, thereby greatly improving the yield of the packaging process. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 It is a cross-sectional schematic diagram of the existing packaging process.
[0026] FIG. 2A to FIG. 2D It is a cross-sectional schematic diagram of the packaging process of the present invention.
[0027] Figure 2A-1 to Figure 2D-1 For the corresponding FIG. 2A to FIG. 2D Schematic side view of .
[0028] Figure 2B-2 for Figure 2B-1 A partial enlarged side view schematic diagram of .
[0029] Figure 3 It is a three-dimensional schematic diagram of the flattening device of the present invention.
[0030] Main component symbols
[0031] 1 Package substrate
[0032] 1a Vacuum platform
[0033] 1b Robotic Arm
[0034] 10. Semiconductor Chip
[0035] 2 Packaging equipment
[0036] 20 Carrying device
[0037] 200 Base Platform
[0038] 201 Track structure
[0039] 21. Gel forming device
[0040] 22 Pick and place device
[0041] 3 Flattening device
[0042] 3a Device body
[0043] 3b Bracket
[0044] 30 Pressing part
[0045] 31 Magnet
[0046] 32 Latch
[0047] 9 Substrate structure
[0048] 90 Electronic components
[0049] 91 Rubber
[0050] A Feed preheating zone
[0051] B Glue stripping area
[0052] C Upper Area
[0053] D Discharging Area
[0054] F Vacuum adsorption force
[0055] H Thermal stress
[0056] t Thickness
[0057] X Direction of linear movement. DETAILED DESCRIPTION
[0058] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and technical effects of the present invention from the contents disclosed in this specification.
[0059] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment of size, without affecting the technical effects and objectives that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention. At the same time, the terms such as "on", "one", etc. cited in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship, without substantially changing the technical contents, should also be regarded as the scope of the implementation of the present invention.
[0060] FIG. 2A to FIG. 2D is a top view schematically showing the packaging process of the present invention, and Figure 2A-1 to Figure 2D-1 For the corresponding FIG. 2A to FIG. 2D Schematic side view of .
[0061] like Figure 2A and Figure 2A-1 As shown, a substrate structure 9 as a target object is placed on a carrier device 20, and then the substrate structure 9 is transported (in a linear moving direction X as shown in the figure) to a material inlet preheating zone A of a packaging device 2 for heating.
[0062] In this embodiment, the substrate structure 9 is a package substrate, a silicon interposer or other carrier for carrying semiconductor chips. For example, the substrate structure 9 includes at least one dielectric layer and a circuit layer formed on the dielectric layer, wherein the material forming the dielectric layer is Ajinomoto build-up film (ABF), polybenzoxazole (PBO), polyimide (PI), glass fiber prepreg (PP) or other dielectric materials.
[0063] Furthermore, the carrying device 20 includes a base platform 200 for carrying the substrate structure 9 and a track structure 201 for moving the substrate structure 9. For example, the track structure 201 is a double-track track, so that the substrate structure 9 (target object) is first mounted on the track structure 201, and then the base platform 200 fixes the substrate structure 9 by vacuum adsorption, so that the substrate structure 9 will move along the track structure 201.
[0064] In addition, the substrate structure 9 has at least one or more die-placement areas, and the thickness of the substrate structure 9 is relatively thin, so it will be in a warped state after the heating operation, making the surfaces of the die-placement areas prone to present non-planar surfaces.
[0065] like Figure 2B and Figure 2B-1 As shown, the substrate structure 9 is transported (in the linear moving direction X shown in the figure) to the glue scribing area B of the packaging device 2 by the track structure 201, so that a flattening device 3 is pressed onto the substrate structure 9, and then a glue forming device 21 is used to form glue material 91 on the substrate structure 9. The glue forming device 21 can be a glue dispensing type or a glue film type.
[0066] In this embodiment, the flattening device 3 has a pressing part 30 for contacting and pressing the target object, which is in the shape of a plate as shown in the figure. For example, the flattening device 3 has a plurality of pressing parts 30 arranged in parallel to contact and press the two opposite sides of the die-laying region of the substrate structure 9, so that the substrate structure 9 presents a flat surface. Therefore, the flattening device 3 can suppress the thermal stress H (heating operation) and the vacuum adsorption force F (base platform 200) on the substrate structure 9, such as Figure 2B-2 As shown, the substrate structure 9 will not have the problem of uneven internal stress distribution due to the influence of external environment or force (such as thermal stress H and vacuum adsorption force F), so the glue forming device 21 can accurately form the glue material 91 on the predetermined position (such as the crystal placement area) of the substrate structure 9.
[0067] Furthermore, the adhesive material 91 can be epoxy or other materials used to adhere the electronic components 90 in subsequent operations.
[0068] like Figure 2C and Figure 2C-1 As shown, the substrate structure 9 is transported together with the flattening device 3 through the rail structure 201 (in the linear moving direction X as shown in the figure) to the upper area C of the packaging equipment 2 so as to arrange at least one electronic component 90 (the accompanying drawings of this embodiment show two electronic components 90) on the substrate structure 9.
[0069] In this embodiment, the electronic component 90 is an active component, a passive component or a combination of the two. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor.
[0070] Furthermore, in this embodiment, the electronic component 90 is pasted on the adhesive material 91 by a pick-and-place device 22 to be combined with the die-placement region of the substrate structure 9. For example, the pick-and-place device 22 is a vacuum adsorption type.
[0071] like Figure 2D and Figure 2D-1As shown, the substrate structure 9 with the electronic components 90 is transported to the unloading area D of the packaging device 2 together with the flattening device 3 by the track structure 201, so that the flattening device 3 is separated from the substrate structure 9. Afterwards, the substrate structure 9 with the electronic components 90 is separated from the base platform 200, and then the substrate structure 9 with the electronic components 90 is transported (in the linear moving direction X shown in the figure) to the next working area by the track structure 201.
[0072] In this embodiment, the track structure 201 connects the material preheating zone A, the glue scribing zone B, the film loading zone C and the material discharging zone D to facilitate the completion of the packaging process.
[0073] Therefore, the packaging process of the present invention mainly involves pressing the warped surface of the substrate structure 9 by the flattening device 3 in the glue drawing area B before setting the electronic component 90 on the substrate structure 9, so that the substrate structure 9 presents a surface flat state. Therefore, compared with the prior art, the electronic component 90 can be accurately placed on the die placement area of the substrate structure 9, thereby greatly improving the yield of the packaging process.
[0074] It should be understood that there are many embodiments of the flattening device 3, and there is no particular limitation. Figure 3 As shown, the flattening device 3 includes a device body 3a and a bracket 3b connected to the device body 3a in a detachable manner.
[0075] The device body 3a is a frame structure, and the pressing part 30 is in the shape of a plate.
[0076] In this embodiment, the detachable manner is an adsorption manner. For example, the bracket 3b is combined with the device body 3a through a magnet 31.
[0077] The bracket 3b is positioned on the track structure 201 by a pin 32 to position the device body 3a. Therefore, the device body 3a and the bracket 3b can be positioned by a positioning structure such as the pin 32, and the bracket 3b is magnetically attached to the device body 3a through the strong magnet 31.
[0078] The present invention also provides a packaging device 2 , comprising: a carrying device 20 , a gluing device 21 , a flattening device 3 , and a placing device 22 .
[0079] The carrying device 20 is used to carry at least one substrate structure 9 as a target object, wherein the carrying device 20 includes a track structure 201 to set up the substrate structure 9 .
[0080] The glue forming device 21 is disposed above the carrying device 20 to form glue material 91 on the substrate structure 9 .
[0081] The flattening device 3 is disposed above the carrying device 20 to contact and press the substrate structure 9 via the pressing portion 30 .
[0082] The pick-and-place device 22 is disposed above the carrying device 20 to place the electronic component 90 on the substrate structure 9 .
[0083] In one embodiment, the carrying device 20 further includes a base platform 200 for carrying the substrate structure 9. For example, the base platform 200 fixes the substrate structure 9 by vacuum adsorption.
[0084] In one embodiment, the substrate structure 9 moves along the track structure 201 .
[0085] In one embodiment, the packaging equipment 2 defines a preheating zone A for disposing the carrier device 20 , and the substrate structure 9 is in a warped state in the preheating zone A.
[0086] In one embodiment, the packaging device 2 defines a glue-cutting area B for disposing the glue-forming device 21 and the flattening device 3 , and the substrate structure 9 is in a surface-flattened state in the glue-cutting area B.
[0087] In summary, the packaging equipment, packaging process and flattening device of the present invention, through the configuration of the flattening device, can press the warped surface of the substrate structure through the flattening device before setting the electronic component on the substrate structure, so that the substrate structure presents a surface flat state. Therefore, the packaging process of the present invention can accurately place the electronic component on each chip placement area of the substrate structure, and can stably set it on the substrate structure to successfully complete the chip loading operation, thereby greatly improving the yield of the packaging process.
[0088] The above embodiments are only used to illustrate the principles and technical effects of the present invention, and are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the inventive concept and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.
Claims
1. A packaging device, comprising: A carrying device, which is used to carry a substrate structure as a target object, wherein the carrying device includes a track structure to set up the substrate structure; A flattening device, which is disposed above the carrying device, and includes a device body and a bracket, wherein the device body has a pressing portion for contacting and pressing the substrate structure, the substrate structure is mounted on the track structure, and the bracket is detachably connected to the device body and mounted on the track structure; and The pick-and-place device is arranged above the carrying device to place the electronic components on the substrate structure.
2. The packaging device according to claim 1, wherein: The carrying device also includes a base platform for carrying the substrate structure.
3. The packaging device according to claim 2, wherein: The base platform fixes the substrate structure in a vacuum adsorption manner.
4. The packaging device according to claim 1, wherein: The substrate structure is displaced along the track structure.
5. The packaging device according to claim 1, wherein: The packaging equipment defines a material preheating zone for disposing the carrier device, and the substrate structure is in a warped state in the material preheating zone.
6. The packaging device according to claim 1, wherein: The packaging equipment also includes a glue forming device arranged above the carrying device, which is used for forming glue on the substrate structure.
7. The packaging device according to claim 6, wherein: The packaging equipment defines a glue-cutting area for configuring the glue-forming device and the flattening device, and the substrate structure is in a surface-flattening state in the glue-cutting area.
8. A packaging process comprising: A packaging device as claimed in claim 1 is provided, wherein the packaging device is defined with a material preheating zone, a glue stripping zone, a sheet loading zone and a material discharging zone; In the feed preheating zone, placing the substrate structure on the carrier device to heat the substrate structure; Moving the substrate structure to the glue scribing area to press the flattening device onto the substrate structure and forming glue on the substrate structure; as well as The substrate structure and the flattening device are moved to the upper region together, so that the electronic components are placed on the substrate structure by the pick-and-place device.
9. The packaging process according to claim 8, wherein: The carrying device also includes a base platform for carrying the substrate structure.
10. The packaging process according to claim 9, wherein: The base platform fixes the substrate structure in a vacuum adsorption manner.
11. The packaging process according to claim 8, wherein: The substrate structure is displaced along the track structure.
12. The packaging process according to claim 8, wherein: The track structure connects the feeding preheating area, the glue drawing area, the loading area and the discharging area.
13. The packaging process according to claim 8, wherein: The electronic component is pasted on the adhesive material.
14. The packaging process according to claim 8, wherein: The manufacturing process also includes moving the substrate structure provided with the electronic component together with the flattening device to the material discharging area, and separating the flattening device from the substrate structure.
15. A flattening device, comprising: A device body having a pressing portion for contacting and pressing a target object, wherein the target object is mounted on a track structure; and The bracket is connected to the device body in a detachable manner and is mounted on the track structure.
16. The applanation device according to claim 15, wherein: The device body is a frame structure.
17. The applanation device according to claim 15, wherein: The pressing part is in the shape of a plate.
18. The applanation device according to claim 15, wherein: The detachable assembly method is an adsorption method.
19. The applanation device according to claim 18, wherein: The bracket is combined with the device body through a magnet.
20. The applanation device of claim 15, wherein: The bracket positions the device body through a latch.